CN115968106A - Connection structure of nickel sheet and flexible circuit board and manufacturing method thereof - Google Patents
Connection structure of nickel sheet and flexible circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN115968106A CN115968106A CN202111183938.8A CN202111183938A CN115968106A CN 115968106 A CN115968106 A CN 115968106A CN 202111183938 A CN202111183938 A CN 202111183938A CN 115968106 A CN115968106 A CN 115968106A
- Authority
- CN
- China
- Prior art keywords
- hole
- circuit board
- nickel sheet
- flexible circuit
- boss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The application provides a manufacturing method of a connection structure of a nickel sheet and a flexible circuit board, which comprises the following steps: providing a circuit substrate, wherein the circuit substrate comprises a first covering film and a copper layer arranged on the first covering film; forming at least one boss on the copper layer; forming a second covering film on the copper layer, wherein a through hole is formed in the second covering film, and the boss is located in the through hole to obtain a flexible circuit board; providing a nickel sheet, wherein a connecting hole is formed in the nickel sheet; and connecting the nickel sheet with the flexible circuit board through solder paste, positioning the nickel sheet in the through hole, and positioning the boss in the connecting hole, thereby obtaining the connecting structure. The application can improve the nickel sheet with the cohesion between the flexible circuit board. The application also provides a connection structure of the nickel sheet and the flexible circuit board manufactured by the method.
Description
Technical Field
The application relates to the field of circuit boards, in particular to a connection structure of a nickel sheet and a flexible circuit board and a manufacturing method thereof.
Background
Under the current premise of advocating global environmental protection, the new energy automobile industry becomes the development guide and the target of the future automobile industry. At present, because a Flexible Printed Circuit (FPC) has the characteristics of high energy, high power and high energy density, a power battery for providing a power source for a new energy automobile generally uses the FPC instead of the conventional wiring harness design. At present, three devices, namely a nickel sheet, a temperature sensor (NTC) and a connector, are generally designed on the FPC to realize the function of collecting voltage and temperature. Wherein, one end of nickel piece is connected with FPC usually, and the other end is connected with the panel electrode to gather electrode voltage signal.
However, the bonding force between the nickel sheet and the FPC is weak due to the influence of the environment such as vibration during the use of the automobile. Therefore, currently, a polyimide film (PI film) is laminated at the joint of the nickel sheet and the FPC to improve the bonding force between the nickel sheet and the FPC. However, this method has the following problems: the production cost is increased and the yield is low; part of the nickel sheets are three-dimensional nickel sheets which can deform after being pressed; NTC below the nickel sheet needs viscose, the viscose is easy to crack after lamination, and the NTC resistance is abnormal, so that the reliability of the NTC is reduced; the connector portion may also deform after being press-fitted.
Disclosure of Invention
In view of this, the present application provides a connection structure of a nickel sheet and a flexible circuit board, which can improve the bonding force between the nickel sheet and the flexible circuit board.
An embodiment of the application provides a method for manufacturing a connection structure of a nickel sheet and a flexible circuit board, which comprises the following steps:
providing a circuit substrate, wherein the circuit substrate comprises a first covering film and a copper layer arranged on the first covering film;
forming at least one boss on the copper layer;
forming a second covering film on the copper layer, wherein a through hole is formed in the second covering film, and the boss is located in the through hole to obtain a flexible circuit board;
providing a nickel sheet, wherein a connecting hole is formed in the nickel sheet; and
and connecting the nickel sheet with the flexible circuit board through solder paste, positioning the nickel sheet in the through hole, and positioning the boss in the connecting hole to obtain the connecting structure.
Another embodiment of the present application provides a method for manufacturing a connection structure between a nickel plate and a flexible circuit board, including the following steps:
providing a circuit substrate, wherein the circuit substrate comprises a first covering film and a copper layer arranged on the first covering film;
forming at least one opening in the copper layer;
forming a second cover film on the copper layer, wherein a through hole is formed in the second cover film, and the projection of the opening on the first cover film is positioned in the projection range of the through hole on the first cover film, so as to obtain a flexible circuit board;
providing a nickel sheet, wherein one surface part of the nickel sheet protrudes outwards to form at least one boss; and
and connecting the nickel sheet with the flexible circuit board through solder paste, positioning the nickel sheet in the through hole, and positioning the boss in the opening to obtain the connecting structure.
An embodiment of the present application further provides a connection structure of a nickel plate and a flexible circuit board, including:
the flexible circuit board comprises a first covering film, a copper layer and a second covering film which are sequentially stacked, wherein at least one boss is arranged on the copper layer, a through hole is formed in the second covering film, and the boss is located in the through hole;
the nickel sheet is provided with a connecting hole, the nickel sheet is positioned in the through hole, and the boss is positioned in the connecting hole; and
and the solder paste is positioned between the flexible circuit board and the nickel sheet.
Another embodiment of the present application further provides a connection structure of a nickel plate and a flexible circuit board, including:
the flexible circuit board comprises a first covering film, a copper layer and a second covering film which are sequentially stacked, wherein at least one opening is formed in the copper layer, a through hole is formed in the second covering film, and the projection of the opening on the first covering film is located in the projection range of the through hole on the first covering film;
the surface part of the nickel sheet protrudes outwards to form at least one boss, the nickel sheet is positioned in the through hole, and the boss is positioned in the opening; and
and the solder paste is positioned between the flexible circuit board and the nickel sheet.
This application is formed on the copper layer the boss open the connecting hole in the nickel strap, make the boss imbeds in the connecting hole, and pass through the tin cream is fixed, thereby has improved the nickel strap with cohesion between the flexible circuit board. Or this application sets up in the copper layer the opening design on the nickel piece the boss makes the boss is located in the opening, and pass through the tin cream is fixed, thereby has improved the nickel piece with cohesion between the flexible circuit board.
Drawings
Fig. 1 is a schematic cross-sectional view of a first cover film according to a first embodiment of the present disclosure.
Fig. 2 is a schematic cross-sectional view of the first adhesive layer shown in fig. 1 after a copper layer is formed thereon.
Fig. 3 is a schematic cross-sectional view of the copper layer shown in fig. 2 after forming a bump thereon.
Fig. 4 is a schematic cross-sectional view of the copper layer shown in fig. 3 after a second capping film is formed thereon.
Fig. 5 is a schematic cross-sectional view of a nickel sheet according to a first embodiment of the present application.
Fig. 6 is a schematic cross-sectional view of a connection structure obtained by connecting the flexible circuit board shown in fig. 4 and the nickel plate shown in fig. 5 by solder paste.
Fig. 7 is a schematic cross-sectional view of a nickel plate provided in a second embodiment of the present application.
Fig. 8 is a schematic cross-sectional view of a connection structure obtained by connecting the flexible circuit board shown in fig. 4 and the nickel plate shown in fig. 7 by solder paste.
Fig. 9 is a cross-sectional view of the copper layer of fig. 2 after opening an opening therein.
Fig. 10 is a schematic cross-sectional view of the copper layer shown in fig. 9 after a second cap film is formed thereon.
Fig. 11 is a schematic cross-sectional view of a nickel plate according to a third embodiment of the present application.
Fig. 12 is a schematic cross-sectional view of a connection structure obtained by connecting the flexible circuit board shown in fig. 10 and the nickel plate shown in fig. 11 by solder paste.
Fig. 13 is a schematic cross-sectional view of a connection structure according to a fourth embodiment of the present application.
Fig. 14 is a schematic cross-sectional view of a connection structure provided in a fifth embodiment of the present application.
Description of the main elements
First protective layer 101
First adhesive layer 102
Bosses 22, 71
Second adhesive layer 301
Second protective layer 302
Through hole 31
Connection holes 501, 502
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
To further explain the technical means and effects of the present application for achieving the intended purpose, the following detailed description is given to the present application in conjunction with the accompanying drawings and preferred embodiments.
The first embodiment of the present application provides a method for manufacturing a connection structure between a nickel plate and a flexible circuit board, comprising the following steps:
in step S11, please refer to fig. 1, a first cover film 10 is provided.
In this embodiment, the first cover film 10 includes a first protective layer 101 and a first adhesive layer 102 disposed on the first protective layer 101.
The material of the first protection layer 101 may be one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene Oxide (PPO), polyimide (PI), polyethylene Terephthalate (PET), polyethylene Naphthalate (PEN), and the like. In this embodiment, the first protection layer 101 is made of polyimide.
In this embodiment, the first adhesive layer 102 may be an acrylic hot melt adhesive (AD adhesive).
Step S12, referring to fig. 2, a copper layer 20 is formed on the first adhesive layer 102 to obtain a circuit substrate 21.
In step S13, referring to fig. 3, at least one bump 22 is formed on the copper layer 20.
Specifically, copper is electroplated on the copper layer 20 to form the lands 22.
As shown in fig. 3, only two of the bosses 22 are shown. In fact, the number, shape and position of the bosses 22 are not limited in the present application, and may be modified accordingly as needed.
In step S14, referring to fig. 4, a second cover film 30 is formed on the copper layer 20 to obtain a flexible circuit board 40.
In this embodiment, the second cover film 30 includes a second adhesive layer 301 disposed on the copper layer 20 and a second protective layer 302 disposed on the second adhesive layer 301.
In this embodiment, the second adhesive layer 301 may be an acrylic hot melt adhesive (AD adhesive).
The material of the second protective layer 302 may be one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene Oxide (PPO), polyimide (PI), polyethylene Terephthalate (PET), polyethylene Naphthalate (PEN), and the like. In this embodiment, the second passivation layer 302 is made of polyimide.
The second cover film 30 is provided with a through hole 31 therein, and the through hole 31 sequentially penetrates through the second protective layer 302 and the second adhesive layer 301. Wherein the boss 22 is located in the through hole 31. In this embodiment, one end of the boss 22 away from the copper layer 20 protrudes from the surface of the second protective layer 302 away from the second adhesive layer 301.
In step S15, please refer to fig. 5, a nickel plate 50 is provided.
Wherein, at least one connection hole 501 is arranged in the nickel sheet 50. In this embodiment, the connection hole 501 is a through hole, and the through hole penetrates through the nickel plate 50.
Step S16, referring to fig. 6, the nickel sheet 50 is connected to the flexible circuit board 40 through solder paste 60, and the nickel sheet 50 is located in the through hole 31, and the boss 22 is located in the connection hole 501, so as to obtain the connection structure 100.
In this embodiment, the distance between the outer wall of the boss 22 and the inner wall of the connection hole 501 is greater than or equal to 0.05mm, so that the solder paste 60 is still located in the connection hole 501 to improve the bonding force between the nickel sheet 50 and the flexible circuit board 40.
The solder paste 60 is also used to electrically connect the nickel plate 50 and the flexible circuit board 40.
A second embodiment of the present application provides a method for manufacturing a connection structure between a nickel plate and a flexible circuit board, where the difference between the manufacturing method provided by the second embodiment and the manufacturing method provided by the first embodiment is: referring to fig. 7, in step S15, a nickel sheet 51 is provided, and at least one connection hole 502 is formed in the nickel sheet 51. Wherein, the connection hole 502 is a groove, and the bottom of the groove is the nickel sheet 51. Referring to fig. 8, in step S16, the nickel sheet 51 is connected to the flexible circuit board 40, so as to obtain the connection structure 200.
The third embodiment of the present application provides a method for manufacturing a connection structure between a nickel plate and a flexible circuit board, including the following steps:
steps S31 to S32 are the same as steps S11 to S12, respectively, so as to obtain the circuit substrate 21, which can refer to steps S11 to S12, and are not described in detail herein.
In step S33, referring to fig. 9, at least one opening 201 is formed in the copper layer 20.
In the present embodiment, each of the openings 201 penetrates through the copper layer 20. In this embodiment, the cross-sectional shape of the opening 201 is substantially rectangular.
In step S34, referring to fig. 10, a second cover film 30 is formed on the copper layer 20 to obtain a flexible circuit board 41.
In this embodiment, the second cover film 30 includes a second adhesive layer 301 disposed on the copper layer 20 and a second protective layer 302 disposed on the second adhesive layer 301.
In this embodiment, the second adhesive layer 301 may be an acrylic hot melt adhesive (AD adhesive).
The material of the second protective layer 302 may be one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene Oxide (PPO), polyimide (PI), polyethylene Terephthalate (PET), polyethylene Naphthalate (PEN), and the like. In this embodiment, the second passivation layer 302 is made of polyimide.
The second cover film 30 is provided with a through hole 31, and the projection of the opening 201 on the first cover film 10 is located within the projection range of the through hole 31 on the first cover film 10.
In step S35, please refer to fig. 11, a nickel plate 70 is provided.
Wherein one surface portion of the nickel sheet 70 protrudes outward to form at least one boss 71.
In the present embodiment, the boss 71 has a substantially rectangular cross-sectional shape.
As shown in fig. 11, only two of the bosses 71 are shown. In fact, the number, shape and position of the bosses 71 are not limited in the present application, and may be modified accordingly as needed.
In step S36, referring to fig. 12, the nickel sheet 70 is connected to the flexible circuit board 41 by solder paste 60, and the nickel sheet 70 is located in the through hole 31 and the boss 71 is located in the opening 201, so as to obtain the connection structure 300.
In this embodiment, the distance between the outer wall of the boss 71 and the inner wall of the opening 201 is greater than or equal to 0.05mm, so that the solder paste 60 is still located in the opening 201 to improve the bonding force between the nickel sheet 70 and the flexible circuit board 41.
Referring to fig. 13, a fourth embodiment of the present application provides a method for manufacturing a connection structure 400 between a nickel plate and a flexible circuit board, where the manufacturing method provided by the fourth embodiment is different from the manufacturing method provided by the third embodiment in that: in step S33, the opening 201 does not penetrate through the copper layer 20.
Referring to fig. 14, a fifth embodiment of the present application provides a method for manufacturing a connection structure 500 between a nickel plate and a flexible circuit board, where the manufacturing method provided by the fifth embodiment is different from the manufacturing method provided by the third embodiment in that: in step S33, the cross-sectional shape of the opening 201 is substantially an inverted trapezoid. Correspondingly, in step S35, the cross-sectional shape of the boss 71 at the end away from the nickel sheet 70 is substantially trapezoidal.
Referring to fig. 6, a connection structure 100 of a nickel plate and a flexible circuit board is further provided in the first embodiment of the present application, where the connection structure 100 includes a flexible circuit board 40, a nickel plate 50, and a solder paste 60.
In the present embodiment, the flexible circuit board 40 includes a first cover film 10, a copper layer 20, and a second cover film 30, which are sequentially stacked.
In this embodiment, the first cover film 10 includes a first protective layer 101 and a first adhesive layer 102 disposed on the first protective layer 101.
The material of the first protection layer 101 may be one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene Oxide (PPO), polyimide (PI), polyethylene Terephthalate (PET), polyethylene Naphthalate (PEN), and the like. In this embodiment, the first protection layer 101 is made of polyimide.
In this embodiment, the first adhesive layer 102 may be an acrylic hot melt adhesive (AD adhesive).
At least one boss 22 is disposed on the copper layer 20. In this embodiment, the boss 22 is made of copper. As shown in fig. 6, only two of the bosses 22 are shown. In fact, the number, shape and position of the bosses 22 are not limited in the present application, and may be modified accordingly as needed.
In this embodiment, the second cover film 30 includes a second adhesive layer 301 disposed on the copper layer 20 and a second protective layer 302 disposed on the second adhesive layer 301.
In this embodiment, the second adhesive layer 301 may be an acrylic hot melt adhesive (AD adhesive).
The material of the second protection layer 302 may be one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene Oxide (PPO), polyimide (PI), polyethylene Terephthalate (PET), polyethylene Naphthalate (PEN), and the like. In this embodiment, the second passivation layer 302 is made of polyimide.
The second cover film 30 is provided with a through hole 31 therein, and the through hole 31 sequentially penetrates through the second protective layer 302 and the second adhesive layer 301. Wherein the boss 22 is located in the through hole 31. In this embodiment, one end of the boss 22 away from the copper layer 20 protrudes from the surface of the second protective layer 302 away from the second adhesive layer 301.
The nickel plate 50 is located in the through hole 31. Wherein, at least one connection hole 501 is arranged in the nickel sheet 50. In this embodiment, the connection hole 501 is a through hole, and the through hole penetrates through the nickel plate 50. Wherein the boss 22 is located in the connection hole 501.
The solder paste 60 is located between the flexible circuit board 40 and the nickel plate 50. In this embodiment, the distance between the outer wall of the boss 22 and the inner wall of the connection hole 501 is greater than or equal to 0.05mm, so that the solder paste 60 is still located in the connection hole 501 to improve the bonding force between the nickel sheet 50 and the flexible circuit board 40. The solder paste 60 is also used to electrically connect the nickel plate 50 and the flexible circuit board 40.
Referring to fig. 8, a second embodiment of the present application provides a connection structure 200 of a nickel plate and a flexible circuit board, and the connection structure 200 provided by the second embodiment is different from the connection structure 100 provided by the first embodiment in that: at least one connection hole 502 is formed in the nickel plate 51. Wherein, the connection hole 502 is a groove, and the bottom of the groove is the nickel sheet 51. The nickel plate 51 is connected to the flexible circuit board 40.
Referring to fig. 12, a connection structure 300 of a nickel plate and a flexible circuit board is further provided in the third embodiment of the present application, where the connection structure 300 includes a flexible circuit board 41, a nickel plate 70, and a solder paste 60.
The flexible circuit board 41 includes a first cover film 10, a copper layer 20, and a second cover film 30, which are sequentially stacked.
In this embodiment, the first cover film 10 includes a first protective layer 101 and a first adhesive layer 102 disposed on the first protective layer 101.
The material of the first protection layer 101 may be one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene Oxide (PPO), polyimide (PI), polyethylene Terephthalate (PET), polyethylene Naphthalate (PEN), and the like. In this embodiment, the first protection layer 101 is made of polyimide.
In this embodiment, the first adhesive layer 102 may be an acrylic hot melt adhesive (AD adhesive).
The copper layer 20 has at least one opening 201 therein. In the present embodiment, each of the openings 201 penetrates through the copper layer 20. In this embodiment, the cross-sectional shape of the opening 201 is substantially rectangular.
In this embodiment, the second cover film 30 includes a second adhesive layer 301 disposed on the copper layer 20 and a second protective layer 302 disposed on the second adhesive layer 301.
In this embodiment, the second adhesive layer 301 may be an acrylic hot melt adhesive (AD adhesive).
The material of the second protective layer 302 may be one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene Oxide (PPO), polyimide (PI), polyethylene Terephthalate (PET), polyethylene Naphthalate (PEN), and the like. In this embodiment, the second passivation layer 302 is made of polyimide.
The second cover film 30 is provided with a through hole 31, and the projection of the opening 201 on the first cover film 10 is located within the projection range of the through hole 31 on the first cover film 10.
The nickel plate 70 is located in the through hole 31. Wherein one surface portion of the nickel sheet 70 protrudes outward to form at least one boss 71. In the present embodiment, the boss 71 has a substantially rectangular cross-sectional shape. Wherein the boss 71 is located in the opening 201.
As shown in fig. 12, only two of the bosses 71 are shown. In fact, the number, shape and position of the bosses 71 are not limited in the present application, and may be modified accordingly as needed.
The solder paste 60 is located between the flexible circuit board 41 and the nickel sheet 70. In this embodiment, the distance between the outer wall of the boss 71 and the inner wall of the opening 201 is greater than or equal to 0.05mm, so that the solder paste 60 is still located in the opening 201 to improve the bonding force between the nickel sheet 70 and the flexible circuit board 41. The solder paste 60 is also used for electrically connecting the nickel sheet 70 and the flexible circuit board 41.
Referring to fig. 13, a connection structure 400 of a nickel plate and a flexible circuit board is provided in a fourth embodiment of the present application, and the difference between the connection structure 400 provided in the fourth embodiment and the connection structure 300 provided in the third embodiment is: the opening 201 does not extend through the copper layer 20.
Referring to fig. 14, a connection structure 500 for a nickel plate and a flexible circuit board is provided in a fifth embodiment of the present application, and the difference between the connection structure 500 provided in the fifth embodiment and the connection structure 300 provided in the third embodiment is: the cross-sectional shape of the opening 201 is substantially inverted trapezoidal. Correspondingly, the cross section of the boss 71 at the end far away from the nickel sheet 70 is approximately trapezoidal.
This application is formed on copper layer 20 boss 22 open connecting hole 501 in nickel piece 50, make boss 22 imbeds in the connecting hole 501, and pass through tin cream 60 is fixed, thereby has improved nickel piece 50 with cohesion between the flexible circuit board 40. Or the application is in the opening 201 is opened in the copper layer 20, the boss 71 is designed on the nickel sheet 70, so that the boss 71 is positioned in the opening 201 and is fixed by the solder paste 60, thereby improving the binding force between the nickel sheet 70 and the flexible circuit board 41.
In addition, the PI film is not laminated at the joint of the nickel sheet and the FPC, so that the problem in the background art is solved.
The above description is only an embodiment optimized for the present application, but in practical application, the present invention is not limited to this embodiment.
Claims (10)
1. A manufacturing method of a connection structure of a nickel sheet and a flexible circuit board is characterized by comprising the following steps:
providing a circuit substrate, wherein the circuit substrate comprises a first covering film and a copper layer arranged on the first covering film;
forming at least one boss on the copper layer;
forming a second covering film on the copper layer, wherein a through hole is formed in the second covering film, and the boss is located in the through hole to obtain a flexible circuit board;
providing a nickel sheet, wherein a connecting hole is formed in the nickel sheet; and
and connecting the nickel sheet with the flexible circuit board through solder paste, positioning the nickel sheet in the through hole, and positioning the boss in the connecting hole to obtain the connecting structure.
2. The method for manufacturing a connection structure according to claim 1, wherein a distance between an outer wall of the boss and an inner wall of the connection hole is greater than or equal to 0.05mm, and the solder paste is also located in the connection hole.
3. The method for manufacturing the connection structure according to claim 2, wherein the connection hole is a through hole, and the through hole penetrates through the nickel sheet.
4. The method for manufacturing a connection structure according to claim 2, wherein the connection hole is a groove, and the bottom of the groove is the nickel plate.
5. A manufacturing method of a connection structure of a nickel sheet and a flexible circuit board is characterized by comprising the following steps:
providing a circuit substrate, wherein the circuit substrate comprises a first covering film and a copper layer arranged on the first covering film;
forming at least one opening in the copper layer;
forming a second cover film on the copper layer, wherein a through hole is formed in the second cover film, and the projection of the opening on the first cover film is positioned in the projection range of the through hole on the first cover film, so as to obtain a flexible circuit board;
providing a nickel sheet, wherein one surface part of the nickel sheet protrudes outwards to form at least one boss; and
and connecting the nickel sheet with the flexible circuit board through solder paste, positioning the nickel sheet in the through hole, and positioning the boss in the opening to obtain the connecting structure.
6. A connection structure of a nickel sheet and a flexible circuit board is characterized by comprising:
the flexible circuit board comprises a first covering film, a copper layer and a second covering film which are sequentially stacked, wherein at least one boss is arranged on the copper layer, a through hole is formed in the second covering film, and the boss is located in the through hole;
the nickel sheet is provided with a connecting hole, the nickel sheet is positioned in the through hole, and the boss is positioned in the connecting hole; and
and the solder paste is positioned between the flexible circuit board and the nickel sheet.
7. The connecting structure according to claim 6, wherein a distance between an outer wall of the boss and an inner wall of the connecting hole is greater than or equal to 0.05mm, and the solder paste is also located in the connecting hole.
8. The connection structure according to claim 7, wherein the connection hole is a through hole, and the through hole penetrates the nickel plate.
9. The connecting structure according to claim 7, wherein the connecting hole is a groove, and the bottom of the groove is the nickel plate.
10. The utility model provides a connection structure of nickel piece and flexible circuit board which characterized in that includes:
the flexible circuit board comprises a first covering film, a copper layer and a second covering film which are sequentially stacked, wherein at least one opening is formed in the copper layer, a through hole is formed in the second covering film, and the projection of the opening on the first covering film is located in the projection range of the through hole on the first covering film;
the surface part of the nickel sheet protrudes outwards to form at least one boss, the nickel sheet is positioned in the through hole, and the boss is positioned in the opening; and
and the solder paste is positioned between the flexible circuit board and the nickel sheet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111183938.8A CN115968106A (en) | 2021-10-11 | 2021-10-11 | Connection structure of nickel sheet and flexible circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111183938.8A CN115968106A (en) | 2021-10-11 | 2021-10-11 | Connection structure of nickel sheet and flexible circuit board and manufacturing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115968106A true CN115968106A (en) | 2023-04-14 |
Family
ID=87360335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111183938.8A Pending CN115968106A (en) | 2021-10-11 | 2021-10-11 | Connection structure of nickel sheet and flexible circuit board and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115968106A (en) |
-
2021
- 2021-10-11 CN CN202111183938.8A patent/CN115968106A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9941502B2 (en) | Signal collection and power connection assembly, power battery module and vehicle | |
CN101599551A (en) | Battery pack | |
KR101977881B1 (en) | Method for manufacturing flexible circuit board and flexible circuit board manufactured by the method | |
KR101342603B1 (en) | Battery pack | |
JP2013534710A (en) | PCB tact switch | |
WO2014168363A1 (en) | Method for manufacturing battery protection apparatus and battery protection apparatus | |
JP2007266067A (en) | Flex rigid substrate, secondary battery protection module, battery pack, and process for manufacturing flex rigid substrate | |
CN113543476A (en) | Circuit board assembly, manufacturing method thereof and display device | |
JP5227009B2 (en) | Electrical energy supply system | |
CN102118674A (en) | MEMS microphone and encapsulation method thereof | |
KR101466605B1 (en) | Flexible printed circuit board a mobile terminal equipped with impedance cable | |
JP2019046791A (en) | Battery module | |
CN112492751B (en) | Connector and manufacturing method thereof | |
CN115968106A (en) | Connection structure of nickel sheet and flexible circuit board and manufacturing method thereof | |
CN214070509U (en) | Circuit board shielding structure, shielding film and electronic equipment | |
CN209882227U (en) | Insulating film assembly for flexible circuit board | |
CN210298194U (en) | Laminated circuit board, camera module and mobile terminal | |
CN207783281U (en) | Bury planar resistor polyimide multilayer wiring board | |
CN201590897U (en) | MEMS microphone | |
CN220457635U (en) | Flexible circuit board capable of being connected on two sides | |
JP4844714B2 (en) | Multilayer wiring board | |
CN205510539U (en) | Flexible circuit board and display thereof | |
CN220172320U (en) | Power battery coupling mechanism | |
CN221202859U (en) | Embedded multilayer circuit board | |
CN220422119U (en) | Single-sided FPC assembly structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |