CN221202859U

CN221202859U - Embedded multilayer circuit board

Info

Publication number: CN221202859U
Application number: CN202323232602.3U
Authority: CN
Inventors: 陈海兴; 唐健
Original assignee: Shenzhen Jieshun Science and Technology Industry Co Ltd
Current assignee: Shenzhen Jieshun Science and Technology Industry Co Ltd
Priority date: 2023-11-28
Filing date: 2023-11-28
Publication date: 2024-06-21
Anticipated expiration: 2033-11-28

Abstract

The utility model relates to the field of circuit board manufacturing, and provides an embedded type multilayer circuit board, which comprises a plurality of layers of laminated substrates, wherein conductive circuit layers are arranged between adjacent substrates, mounting grooves are formed in the inner substrates, electronic components are arranged in an embedded manner, the electronic components are electrically connected with the conductive circuit layers, and each conductive circuit layer is electrically connected; the utility model can embed electronic components, reduce the volume of the circuit board and improve the signal frequency.

Description

Embedded multilayer circuit board

Technical Field

The utility model relates to the field of circuit board manufacturing, in particular to an embedded multilayer circuit board.

Background

The conventional design method commonly used for the circuit board is to use the SMT (surface mount technology) to mount electronic components on the surface of the circuit board, and then to weld and assemble the electronic components by reflow soldering or dip soldering and other methods, so that the size of electronic equipment such as mobile phones is continuously reduced, the functions are continuously enhanced, the integrated volume requirement and the signal frequency requirement of the internal circuit board are continuously enhanced, and the circuit board produced by the SMT technology can only mount the electronic components on the surface, so that the volume of the circuit board cannot be reduced and the signal frequency can not be enhanced, and the novel circuit board is provided urgently.

Disclosure of utility model

The utility model solves the problem of how to provide an embedded multi-layer circuit board which can be embedded with electronic components and can improve the signal frequency while reducing the volume of the circuit board.

In order to solve the above problems, the present utility model provides an embedded multi-layer circuit board, which comprises a plurality of layers of laminated substrates, wherein conductive circuit layers are arranged between adjacent substrates, and mounting grooves are formed in the inner substrates for embedding electronic components, wherein the electronic components are electrically connected with the conductive circuit layers, and each conductive circuit layer is electrically connected.

Optionally, the conductive circuit layer is a copper foil layer, and the circuit pattern is etched on the copper foil layer for wiring.

Optionally, the two sides of at least one electronic component are provided with accommodating grooves for accommodating the insulating plates for insulating the same layer.

Optionally, at least one substrate located at the outer side is bent and arranged to form a containing space with the adjacent substrate, so as to contain the insulating plate for insulation treatment.

Optionally, the multi-layer circuit board further comprises an intermediate layer, wherein the intermediate layer is arranged between at least one group of two adjacent substrates in a cushioning mode, and after the two adjacent substrates are bonded by heating and melting, the intermediate layer is solidified to increase the thickness of the multi-layer circuit board.

Optionally, the middle layer is a prepreg-like material formed by heat treatment after the glass fiber cloth is soaked with resin glue solution.

Optionally, the substrate is made of glass fiber reinforced plastic or polyimide material.

Optionally, the conductive line layer is electrically connected through a via.

Optionally, the hole wall of the via hole is formed into a conductive column by metal electroplating so as to communicate with each conductive circuit layer.

Optionally, an electronic component is further disposed on the outer side surface of the outermost substrate, and the electronic component is electrically connected to the conductive circuit layer on the inner side through the via hole.

Compared with the prior art, the embedded type multi-layer circuit board comprises the multi-layer substrate which is arranged in a stacked mode, wherein the substrate is a basic material for manufacturing the circuit board, the conductive circuit layers are arranged between the substrates, the substrates can be laminated and bonded with adjacent conductive circuit layers, insulation treatment between the layers is carried out, normal operation of electronic components between different layers is guaranteed, the mounting grooves are formed in the substrate inside, the electronic components are arranged in an embedded mode, pins of the electronic components are electrically connected with the adjacent conductive circuit layers, the conductive circuit layers are electrically connected, therefore the electronic components on the multi-layer circuit board are integrated, it is understood that the size of the circuit board can be reduced by embedding the electronic components into the multi-layer substrate, the welding spots on the surface of the circuit board are reduced due to the fact that the embedded electronic components are embedded, the reliability of the circuit board can be increased, meanwhile, signal frequency can be enhanced, vibration can be effectively reduced, good signal transmission and interference can be reduced when the electronic components are passive components such as capacitors, and the like, and therefore higher electrical performance can be achieved.

Drawings

FIG. 1 is a schematic diagram of a plane structure of an embedded multi-layer circuit board according to an embodiment of the present utility model;

The reference numerals shown in the drawings: 1-a substrate; 2-a conductive line layer; 3-an insulating plate; 4-an intermediate layer; 5-electronic components.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the utility model described herein may be implemented in sequences other than those illustrated or otherwise described herein.

In the description of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the description of the present specification, the descriptions of the terms "embodiment," "one embodiment," and the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or embodiment is included in at least one embodiment or illustrated embodiment of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same examples or implementations. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or implementations.

The present utility model will be described in detail with reference to the accompanying drawings.

In order to solve the above technical problems, referring to fig. 1, an embodiment of the present utility model provides an embedded multi-layer circuit board, which includes a plurality of stacked substrates 1, a conductive circuit layer 2 disposed between adjacent substrates 1, and an installation groove formed on the inner substrate 1 for embedding an electronic component 5, wherein the electronic component 5 is electrically connected with the conductive circuit layer 2, and each conductive circuit layer 2 is electrically connected.

It should be noted that, the embedded multi-layer circuit board includes the multi-layer substrate 1 that is stacked, wherein, substrate 1 is the basic material of manufacturing the circuit board, be provided with conductive line layer 2 between each substrate 1, substrate 1 can laminate and bond adjacent conductive line layer 2, and carry out insulating treatment between the layer and the layer, guarantee the normal operating of electronic components 5 between the different layers, the mounting groove has been seted up on inside substrate 1, with embedded setting electronic components 5, namely after each substrate 1 stacks and sets up, set up the mounting groove on the substrate 1 of inlayer, the pin of electronic components 5 is connected with adjacent conductive line layer 2 electricity, each conductive line layer 2 electricity is connected, thereby electronic components 5 on the multi-layer circuit board are integrated, it can be understood that embedding electronic components 5 into multi-layer substrate 1 can reduce the volume of circuit board, and because embedded electronic components 5 makes the solder joint on circuit board surface reduce, can also increase the reliability of circuit board, can also strengthen signal frequency simultaneously, if embedded setting can effectively reduce and the vibration signal and reach the higher performance of electric interference and can reach to reach more effectively the transmission of signal when electronic components 5 are passive devices such as electric capacity.

In one embodiment of the present utility model, as shown in fig. 1, the conductive trace layer 2 is a copper foil layer, and is routed by etching to form a circuit pattern on the copper foil layer.

Alternatively, the conductive circuit layer 2 is a copper foil layer, and after etching the copper foil layer, a circuit pattern is formed to conduct signals, voltages and currents, and the copper foil layer is generally divided into three types of thicknesses of 1oz (35 μm), 2oz (70 μm) and 3oz (105 μm) for wiring the electronic component 5, and the copper foil layer is selected according to the use of the circuit board and the size of the signals, voltages and currents to be passed, and the thicker the over-wiring current is, the thicker the selected copper foil layer is.

In one embodiment of the present utility model, as shown in fig. 1, the two sides of at least one electronic component 5 are provided with accommodating grooves to accommodate the insulating board 3 for insulating the same layer.

It should be noted that, after the electronic component 5 is embedded in the mounting groove, a requirement of part of the electronic component 5 on the insulation of the peripheral side is relatively high, so that insulation treatment is required to prevent high-voltage conduction with the electronic component 5 embedded adjacently, at this time, an insulation groove is respectively opened at the left and right sides of the electronic component 5, the insulation plate 3 is accommodated in the insulation groove for insulation treatment, and the insulation plate 3 also covers the pin positions of the blocking electronic component 5 at the same time, so as to improve the reliability of the multilayer circuit board.

In one embodiment of the present utility model, as shown in fig. 1, at least one substrate 1 located on the outer side is bent to form a receiving space with the adjacent substrate 1, so as to receive the insulating board 3 for insulation treatment.

It should be noted that, when the electronic component 5 is embedded in the outer substrate 1, and the pins of the electronic component 5 penetrate the outer substrate 1 to extend to the outside of the multilayer circuit board, if the same-layer insulation treatment is required at this time, the accommodating groove accommodating insulating board 3 cannot be formed on the same side of the electronic component 5, and the outer substrate 1 is set to be bent in a step shape at this time, so that an accommodating space can be formed by enclosing between the outer substrate 1 and the adjacent copper foil layer, and the insulating board 3 is embedded in the accommodating space so as to perform insulation treatment, thereby ensuring the reliability of the multilayer circuit board.

In one embodiment of the present utility model, as shown in fig. 1, the multi-layer circuit board further includes an intermediate layer 4, where the intermediate layer 4 is disposed between at least one group of two adjacent substrates 1, and after the intermediate layer 4 is heated to melt and adhere the two adjacent substrates 1, the multi-layer circuit board is cured to increase the thickness of the multi-layer circuit board.

The board thickness of the circuit board directly affects the mechanical strength and stability of the circuit board, and particularly under high temperature and high pressure conditions, the greater the board thickness, the higher the stability of the circuit board, and therefore, at least one intermediate layer 4 is provided in the multilayer circuit board, preferably, the intermediate layer 4 is provided in a pad manner in the middle of each substrate 1, whereby the reliability and durability of the multilayer circuit board can be improved.

In one embodiment of the present utility model, as shown in fig. 1, the middle layer 4 is a prepreg-like material formed by impregnating glass fiber cloth with a resin glue solution and then performing heat treatment.

It should be noted that, the middle layer 4 uses glass fiber cloth as reinforcing material, the treated glass fiber cloth is impregnated with resin glue solution, then the resin glue solution enters into the gel stage to be made into sheet material through heat treatment, the middle layer 4 is softened under heating and pressurizing, and is reacted and solidified after cooling, therefore, when the multi-layer circuit board is produced in a combined way, the two adjacent substrates 1 are adhered by hot pressing and then cooled and solidified, the operation is simple and convenient, it can be understood that the conductive circuit layer 2 is also arranged between the middle layer 4 and the two adjacent substrates 1, and the middle layer 4 can also be used for flowing current voltage and signals through the arrangement of via holes.

In one embodiment of the present utility model, as shown in fig. 1, each of the conductive trace layers 2 is electrically connected by a via.

It should be noted that, each conductive circuit layer 2 integrates the electronic components 5 on the multilayer circuit board by providing the via holes, and the wiring is not required to be wound by providing the via holes, so that the overall structure is simplified.

In one embodiment of the present utility model, as shown in fig. 1, the substrate 1 is made of glass fiber reinforced plastic or polyimide material.

The substrate is usually made of a high-performance material such as glass fiber reinforced plastic or polyimide. Common glass fiber reinforced plastics include glass fiber epoxy resin materials (FR-4) and polyimide resins (PI), FR-4 is a common substrate with good insulation, mechanical strength and heat resistance, and is suitable for most application scenes, while PI substrates have higher heat resistance and chemical resistance and are suitable for severe application environments such as high temperature and chemical corrosion.

In one embodiment of the present utility model, as shown in fig. 1, the walls of the vias are formed by metal plating to form conductive pillars to communicate with each of the conductive trace layers 2.

It should be noted that, the via hole can be divided into three types, including a blind hole, a buried hole and a through hole, and needs to be selectively set according to the arrangement positions and the circuit patterns of the electronic components 5, where the blind hole is generally set on the surfaces of the top layer and the bottom layer of the multilayer circuit board, has a certain depth, is used for connecting the surface conductive circuit layer 2 and the underlying inner conductive circuit layer 2, the buried hole is generally used for connecting the inner layer of the multilayer circuit board, and cannot extend to the surface of the circuit board, the through hole enables to penetrate through the whole multilayer circuit board, and can be used for realizing internal interconnection, and the via hole matches with the conductive circuit layer 2 of each layer to perform arrangement, communication and integration of each electronic component 5.

In one embodiment of the present utility model, as shown in fig. 1, an electronic component 5 is further disposed on the outer side surface of the outermost substrate 1, and the electronic component 5 is electrically connected to the inner conductive trace layer 2 through the via hole.

It should be noted that, the electronic components 5 with higher layer height and difficult to be embedded can be directly attached to the substrate 1 at the outermost side of the multilayer circuit board, and the internal position and the external position of the multilayer circuit board can be reasonably utilized through the selective arrangement of the electronic components 5, so as to improve the integration effect of the multilayer circuit board.

The above-described features are continuously combined with each other to form various embodiments not listed above, and are regarded as the scope of the present utility model described in the specification; and, it will be apparent to those skilled in the art from this disclosure that modifications and variations can be made without departing from the scope of the utility model defined in the appended claims.

Claims

1. The utility model provides an embedded multilayer circuit board, its characterized in that includes multilayer base plate (1) of range upon range of setting, adjacent be provided with conductive line layer (2) between base plate (1), inside set up the mounting groove on base plate (1) to embedded setting electronic components (5), electronic components (5) with conductive line layer (2) electricity is connected, each conductive line layer (2) electricity is connected.

2. The embedded multi-layer circuit board according to claim 1, wherein the conductive wiring layer (2) is a copper foil layer, and wiring is performed by etching a circuit pattern formed on the copper foil layer.

3. The embedded multi-layer circuit board according to claim 1, wherein the accommodating grooves are formed on two sides of at least one electronic component (5) to accommodate the insulating board (3) for same-layer insulation.

4. An embedded multi-layer circuit board according to claim 3, wherein at least one substrate (1) located on the outer side is bent to form a containing space with the adjacent substrate (1) for containing the insulating board (3) for insulation treatment.

5. The embedded multi-layer circuit board according to claim 1, further comprising an intermediate layer (4), wherein the intermediate layer (4) is arranged between at least one group of two adjacent substrates (1) in a cushioning manner, and the intermediate layer (4) is solidified to increase the thickness of the multi-layer circuit board after being heated and melted to adhere the two adjacent substrates (1).

6. The embedded multi-layer circuit board according to claim 5, wherein the intermediate layer (4) is a prepreg-like material formed by heat treatment after impregnating glass fiber cloth with a resin glue solution.

7. The embedded multilayer circuit board according to claim 1, characterized in that the substrate (1) is made of glass fiber reinforced plastic or polyimide material.

8. The embedded multilayer circuit board according to claim 1, wherein each of the conductive trace layers (2) is electrically connected by a via.

9. The embedded multi-layer circuit board of claim 8, wherein the walls of the vias are formed by metal plating to form conductive pillars to communicate with each of the conductive trace layers (2).

10. The embedded multilayer circuit board according to claim 8, characterized in that an electronic component (5) is provided on the outer side of the substrate (1) located on the outside, the electronic component (5) being electrically connected to the conductive line layer (2) on the inside through the via.