CN115958761B - Hot runner device based on intelligent temperature control technology of Internet of things and temperature control method thereof - Google Patents
Hot runner device based on intelligent temperature control technology of Internet of things and temperature control method thereof Download PDFInfo
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- CN115958761B CN115958761B CN202211618763.3A CN202211618763A CN115958761B CN 115958761 B CN115958761 B CN 115958761B CN 202211618763 A CN202211618763 A CN 202211618763A CN 115958761 B CN115958761 B CN 115958761B
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000005516 engineering process Methods 0.000 title claims abstract description 21
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- 238000000429 assembly Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 67
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 24
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- 238000001514 detection method Methods 0.000 claims description 9
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- 238000009826 distribution Methods 0.000 claims description 4
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- 230000032258 transport Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 15
- 238000003860 storage Methods 0.000 description 8
- 208000014347 autosomal dominant hyaline body myopathy Diseases 0.000 description 6
- 239000012530 fluid Substances 0.000 description 6
- JITOKQVGRJSHHA-UHFFFAOYSA-M monosodium methyl arsenate Chemical group [Na+].C[As](O)([O-])=O JITOKQVGRJSHHA-UHFFFAOYSA-M 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229910001566 austenite Inorganic materials 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 229910000734 martensite Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- 229910018643 Mn—Si Inorganic materials 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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Abstract
The application discloses a hot runner device based on an intelligent temperature control technology of the Internet of things and a temperature control method thereof, comprising the following steps: the first temperature control component and the second temperature control component are symmetrically arranged at two sides of the glue feeding mechanism; electrifying the first temperature control assembly and the second temperature control assembly through the joint assembly, and heating the hot runner through a magnetic field formed by the electromagnetic coil assemblies on the first temperature control assembly and the second temperature control assembly; a plurality of metal particles are arranged at intervals on the outer side of the mixed flow mechanism; the bottom of the flow dividing mechanism is provided with a first flow dividing pipe and a second flow dividing pipe, the first flow dividing pipe and the second flow dividing pipe respectively comprise a first deformation part and a second deformation part, and the first deformation part and the second deformation part deform according to the temperature in the hot runner.
Description
Technical Field
The application relates to the field of hot runners, in particular to a hot runner device based on an intelligent temperature control technology of the Internet of things and a temperature control method thereof.
Background
Hot runner is a collection of heating elements used in injection molds to inject melted plastic into the cavity of the mold. The hot runner system is divided into an adiabatic runner and a miniature semi-hot runner system, the design of the adiabatic runner is complex, but the effect is good and the maintenance cost is very low, an injection mold commonly adopted in the injection industry at present is a hot runner injection mold, compared with a common mold, the quality of a plastic product injected through the hot runner system is higher, and the hot runner system has the advantages of saving raw materials, improving the production efficiency, being high in automation degree and the like.
The traditional hot runner system does not use memory alloy materials to change the hot runner path, cannot realize an intelligent temperature control system, causes the blockage of the hot runner, is inconvenient to use and has lower efficiency.
Disclosure of Invention
In order to solve at least one technical problem, the application provides a hot runner device based on an intelligent temperature control technology of the Internet of things and a temperature control method thereof.
The first aspect of the application provides a hot runner device based on an intelligent temperature control technology of the Internet of things, which comprises: the device comprises a device body, a glue feeding mechanism, a first temperature control assembly and a second temperature control assembly, wherein the glue feeding mechanism, the first temperature control assembly and the second temperature control assembly are arranged at the center of the top of the device body;
the first temperature control component and the second temperature control component are symmetrically arranged on two sides of the glue feeding mechanism; the first temperature control assembly and the second temperature control assembly comprise electromagnetic coil assemblies, the first temperature control assembly and the second temperature control assembly are electrically connected with joint assemblies, the first temperature control assembly and the second temperature control assembly are electrified through the joint assemblies, and a magnetic field is formed by the electromagnetic coil assemblies on the first temperature control assembly and the second temperature control assembly to heat the hot runner;
the bottom of the device body is symmetrically provided with a first nozzle and a second nozzle, a first valve needle and a second valve needle are respectively arranged in the first nozzle and the second nozzle, and the first valve needle and the second valve needle are respectively used for controlling the flow of the first nozzle and the second nozzle;
the device comprises a device body, wherein a flow distribution mechanism is arranged in the device body and connected to the bottom of the glue feeding mechanism, a mixed flow mechanism is arranged in the flow distribution mechanism, and a plurality of metal particles are arranged at intervals on the outer side of the mixed flow mechanism;
the bottom of the flow dividing mechanism is provided with a first flow dividing pipe and a second flow dividing pipe, the first flow dividing pipe is connected to one end of the first valve needle, and the second flow dividing pipe is connected to one end of the second valve needle;
the first shunt tube and the second shunt tube are both made of shape memory alloy, and respectively comprise a first deformation part and a second deformation part, and the first deformation part and the second deformation part deform according to the temperature inside the hot runner.
In a preferred embodiment of the application, the flow dividing mechanism is of a cylindrical structure with an opening at the top, the flow mixing mechanism is of a spherical structure, a hinge rod is arranged in the flow dividing mechanism, the hinge rod penetrates through the spherical center of the flow mixing mechanism, two ends of the hinge rod are propped against the inside of the flow dividing mechanism, and the hinge rod rotates to drive the flow mixing mechanism to rotate.
In a preferred embodiment of the present application, the apparatus further includes a third temperature control assembly, the third temperature control assembly is disposed at a bottom center of the apparatus body, the third temperature control assembly includes a bottom coil, a coupling magnetic field is formed between the bottom coil and the electromagnetic coil assembly on the first temperature control assembly and between the bottom coil assembly on the second temperature control assembly, and a temperature control base is disposed at a bottom of the apparatus body, and the temperature control base can drive the third temperature control assembly to rotate.
In a preferred embodiment of the present application, a first shunt valve is disposed on the first shunt tube, a second shunt valve is disposed on the second shunt tube, the first shunt tube and the second shunt tube are both connected to a shunt main pipe, and a shunt main valve is disposed on the shunt main pipe.
In a preferred embodiment of the present application, temperature detecting elements are respectively arranged on the first shunt tube, the second shunt tube and the shunt manifold, and the temperature detecting elements are temperature sensors.
In a preferred embodiment of the present application, the first valve needle and the second valve needle are both made of shape memory alloy, and the first valve needle and the second valve needle both include deformation areas, and the shape of the deformation areas is changed by the magnetic field generated by the electromagnetic coil assembly to control the expansion and contraction amounts of the first valve needle and the second valve needle in the first nozzle and the second nozzle.
In a preferred embodiment of the present application, the first temperature control component and the second temperature control component each include an adjusting component and an electromagnetic coil component;
the adjusting component comprises an X-direction guide rail, a Y-direction guide rail and a Z-direction connecting rod, wherein the Y-direction guide rail is fixedly arranged at the top of the Z-direction connecting rod, an X-direction sliding block is arranged at the bottom of the Z-direction connecting rod and is connected to the X-direction guide rail in a matched mode, the X-direction sliding block can slide along the Y-direction guide rail, the electromagnetic coil component is arranged on the Y-direction guide rail in a matched mode, the electromagnetic coil component can move along the Y-direction, the Z-direction connecting rod is an air cylinder mechanism, and the Z-direction connecting rod can vertically stretch to adjust the height of the electromagnetic coil component.
In a preferred embodiment of the application, a Y-direction slide plate is arranged at the bottom of the electromagnetic coil assembly, the Y-direction slide plate is fixedly arranged at the top of the Z-direction connecting rod, the electromagnetic coil assembly comprises a first coil, a second coil and a third coil, the first coil and the second coil are eddy current coils with different turns, and the third coil is of a spiral coil structure.
The second aspect of the application also provides a hot runner temperature control method based on the intelligent temperature control technology of the Internet of things, which is applied to a hot runner device based on the intelligent temperature control technology of the Internet of things, and comprises the following steps:
the material enters the glue feeding mechanism, the different electromagnetic coils on the first temperature control assembly and the second temperature control assembly are controlled through the joint assembly to adjust the magnetic field intensity, vortex is generated, and the material in the glue feeding mechanism is heated;
acquiring the temperature of materials in the glue feeding mechanism, and judging whether the temperature is equal to a preset threshold value;
if the flow is equal to the first flow dividing pipe, the material is divided into a first flow dividing pipe and a second flow dividing pipe through a flow dividing mechanism;
the material generates heat loss in the flowing process of the first shunt tube and the second shunt tube, when the heat loss is larger than preset loss, the temperature of the material is reduced to deformation temperature, at the moment, the deformation parts of the first shunt tube and the second shunt tube generate spiral deformation, the flowing paths of the first shunt tube and the second shunt tube are prolonged, and meanwhile, the material in the first shunt tube and the material in the second shunt tube are heated through the magnetic field generated by the electromagnetic coil;
when heated to a predetermined temperature, the deformation portion recovers, shortens the flow path, and transports the material to the first needle and the second needle, respectively, and out through the first nozzle and the second nozzle.
In a preferred embodiment of the present application, the joint assembly controls different electromagnetic coils on the first temperature control assembly and the second temperature control assembly to adjust the magnetic field intensity, generate eddy currents, and heat materials in the glue feeding mechanism, and specifically includes:
the electromagnetic coils on the first temperature control assembly and the second temperature control assembly generate a magnetic field, and metal particles on the mixing mechanism inside the glue feeding mechanism generate heat under the action of the magnetic field, so that materials inside the glue feeding mechanism are uniformly heated in the rotating process of the mixing mechanism.
Compared with the prior art, the application has the beneficial technical effects that:
(1) According to the application, the hot runner structure is matched with the memory alloy to realize that the hot runner always keeps accurate temperature control, the temperature control assembly not only can control the temperature of fluid in the hot runner, but also can control the shape memory alloy to be changed into a specific shape, thereby changing the path of the hot runner, preventing the generation of larger temperature difference in the fluid flowing process, and having higher fluid temperature control precision.
(2) The utility model discloses a material temperature that advances in the mechanism is glued to flexible control, in addition, advance the inside spherical mixed flow mechanism that is provided with of mechanism, when the material gets into the reposition of redundant personnel mechanism from advancing to glue the mechanism, can make the material evenly leave along spheroid mixed flow mechanism, make the material thinner, when through the metal particle on the spheroid mixed flow mechanism, when heating the material under the magnetic field effect, the heating effect is better.
(3) When the first shunt tube and the second shunt tube are along with the extension of the route, material temperature loss is gradually increased, material temperature is gradually reduced, when material temperature reaches the preset temperature, the shape memory alloy deforms to form a spiral channel, the transportation route is prolonged, meanwhile, the heating time is prolonged in the heating process of the magnetic field, the material inside the first shunt tube and the second shunt tube is ensured to reach the qualified temperature to flow out, the control mode is various, and the temperature control is accurate.
Drawings
FIG. 1 shows a schematic perspective view of a hot runner apparatus of the present application;
FIG. 2 shows a schematic view of the bottom structure of the hot runner apparatus of the present application;
FIG. 3 is a schematic perspective view of a temperature control assembly according to the present application;
FIG. 4 is a schematic view showing the internal structure of the hot runner of the present application;
FIG. 5 shows a schematic view of the bottom structure of the shunt mechanism of the present application;
fig. 6 shows a schematic view of the deformation state of the first nozzle of the present application.
In the figure, 1, a glue feeding mechanism, 101, a flow dividing mechanism, 1010, a main pipe temperature detecting member, 1011, a flow dividing main valve, 102, metal particles, 103, a mixed flow mechanism, 104, a hinge rod, 105, a first flow dividing pipe, 1051, a first flow dividing temperature detecting member, 1052, a first flow dividing valve, 106, a second flow dividing pipe, 1061, a second flow dividing temperature detecting member, 1062, a second flow dividing valve, 107, a first deformation part, 108, a second deformation part, 2, a first temperature control assembly, 3, a device body, 4, a first nozzle, 401, a first nozzle seat, 402, a first nozzle detecting head, 403, a first valve needle, 404, a first valve needle adjusting part, 5, a fixed seat, 6, a joint assembly, 7, a glue feeding detection head, 8, a second nozzle, 801, a second nozzle seat, 802, a second nozzle detection head, 803, a second valve needle, 804, a second valve needle adjusting part, 9, a second temperature control assembly, 901, an X-direction guide rail, 902, an X-direction control mechanism, 903, an X-direction connecting rod, 904, an X-direction sliding block, 905, a Z-direction connecting rod, 906, a Y-direction sliding plate, 907, a Y-direction guide rail, 908, a Y-direction control mechanism, 909, a first coil, 910, a second coil, 911, a third coil, 912, a position sensor, 10, a temperature control base, 11, a third temperature control assembly, 12 and a bottom coil.
Detailed Description
In order that the above-recited objects, features and advantages of the present application will be more clearly understood, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description. It should be noted that, without conflict, the embodiments of the present application and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, however, the present application may be practiced in other ways than those described herein, and therefore the scope of the present application is not limited to the specific embodiments disclosed below.
Example 1
As shown in fig. 1-6, a first aspect of the present application provides a hot runner apparatus based on an intelligent temperature control technology of the internet of things, including: the device comprises a device body 3, a glue feeding mechanism 1, a first temperature control assembly 2 and a second temperature control assembly 9, wherein the glue feeding mechanism 1, the first temperature control assembly 2 and the second temperature control assembly 9 are arranged at the center of the top of the device body 3; a fixed seat 5 is arranged at the bottom of the glue feeding mechanism 1; one side of the glue feeding mechanism is provided with a glue feeding detection head 7;
the first temperature control component 2 and the second temperature control component 9 are symmetrically arranged at two sides of the glue feeding mechanism 1; the first temperature control assembly 2 and the second temperature control assembly 9 comprise electromagnetic coil assemblies, the first temperature control assembly and the second temperature control assembly 9 are electrically connected with a joint assembly 6, the first temperature control assembly and the second temperature control assembly 9 are electrified through the joint assembly 6, and a magnetic field is formed by the electromagnetic coil assemblies on the first temperature control assembly and the second temperature control assembly 9 to heat the hot runner;
the bottom of the device body 3 is symmetrically provided with a first nozzle 4 and a second nozzle 8, a first valve needle 403 and a second valve needle are respectively arranged in the first nozzle 4 and the second nozzle 8, and the first valve needle 403 and the second valve needle are respectively used for controlling the flow of the first nozzle 4 and the second nozzle 8;
specifically, the free ends of the first valve needle 403 and the second valve needle are both made of a temperature-controlled shape memory alloy, if the temperature of the material inside the first valve needle 403 and the second valve needle reaches a preset temperature, the end parts of the first valve needle 403 and the second valve needle are of a boss structure, the material can flow freely to the nozzle to flow out, if the temperature of the material is smaller than the preset temperature, the end parts of the first valve needle 403 and the second valve needle are deformed into a spherical structure, after the deformation, the outlet of the end parts of the first valve needle 403 and the second valve needle is blocked, the material inside the first valve needle and the second valve needle cannot flow out, and the flow of the material is realized through the deformation memory alloy.
Further, the top parts of the first nozzle 4 and the second nozzle 8 are respectively provided with a first nozzle seat 401 and a second nozzle seat 801, the first nozzle 4 and the second nozzle 8 are fixed at the bottom of the hot runner device through the first nozzle seat 401 and the second nozzle seat 801, and one side of the first nozzle 4 and one side of the second nozzle 8 are respectively provided with a first nozzle detection head 402 and a second nozzle detection head 802;
further, the first valve needle 403 and the second valve needle are respectively provided with the first valve needle adjusting part 404 and the second valve needle adjusting part 804, the first valve needle adjusting part 404 and the second valve needle adjusting part 804 are made of temperature control shape memory alloy, when the temperature of materials entering the first valve needle 403 and the second valve needle reaches a preset temperature, the first valve needle 403 and the second valve needle are in a straight structure, a hot runner path is shortened, the flow efficiency is improved, when the temperature of the materials is lower than the preset temperature, the temperature control shape memory alloy is deformed to form a spiral structure, the hot runner path is prolonged, the heating time is prolonged, and the materials inside the hot runner are always in a qualified temperature.
The device comprises a device body 3, a flow dividing mechanism 101, a mixing mechanism 103, a plurality of metal particles 102, a glue feeding mechanism 1, a glue mixing mechanism, a glue feeding mechanism and a glue feeding mechanism, wherein the flow dividing mechanism 101 is arranged in the device body 3;
the metal particles 102 are iron particles or aluminum particles, the resistivity of the iron particles is different from that of the aluminum particles, two types of particle interval arrangement can be arranged outside the mixed flow mechanism 103, the eddy currents of the metal particles 102 made of different materials under the same magnetic field are different, the heating temperature is also different, the temperature can be integrated through the metal particles 102 made of two different materials, the uniform heating of materials is realized, and the temperature change is prevented from being too fast or too slow.
The bottom of the shunt mechanism 101 is provided with a first shunt tube 105 and a second shunt tube 106, the first shunt tube 105 is connected to one end of the first valve needle 403, and the second shunt tube 106 is connected to one end of the second valve needle;
the first shunt tube 105 and the second shunt tube 106 are both made of temperature-controlled shape memory alloy, and the first shunt tube 105 and the second shunt tube 106 respectively comprise a first deformation portion 107 and a second deformation portion 108, and the first deformation portion 107 and the second deformation portion 108 deform according to the temperature inside the hot runner.
Specifically, the temperature-control shape memory alloy is Fe-Mn-Si alloy, and the shape memory alloy is an alloy material which can completely eliminate the deformation of the shape memory alloy at a lower temperature after heating and raising the temperature and restore the original shape of the shape memory alloy before the deformation.
Specifically, through the different coils on the first temperature control subassembly 2 and the second temperature control subassembly 9 can be selected to joint component 6, simultaneously can carry out nimble adjustment magnetic field strength through the position of adjustment first temperature control subassembly 2 and the second temperature control subassembly 9, thereby the inside material temperature of flexible control advance gluey mechanism 1, in addition, advance gluey mechanism 1 inside is provided with spherical mixed flow mechanism 103, when the material gets into reposition of redundant personnel mechanism 101 from advancing gluey mechanism 1, can make the material evenly leave along spheroid mixed flow mechanism 103, make the material thinner, when heating the material through metal particle 102 on the spheroid mixed flow mechanism 103 under the magnetic field effect, the heating effect is better.
According to the embodiment of the application, the flow dividing mechanism 101 is of a cylindrical structure with an opening at the top, the flow mixing mechanism 103 is of a spherical structure, the inside of the flow dividing mechanism 101 is provided with the hinge rod 104, the hinge rod 104 penetrates through the spherical center of the flow mixing mechanism 103, two ends of the hinge rod 104 are abutted to the inside of the flow dividing mechanism 101, and the hinge rod 104 rotates to drive the flow mixing mechanism 103 to rotate.
According to the embodiment of the application, a first shunt valve 1052 is arranged on the first shunt pipe 105, a second shunt valve 1062 is arranged on the second shunt pipe 106, the first shunt pipe 105 and the second shunt pipe 106 are connected to a shunt main pipe, and a shunt main valve 1011 is arranged on the shunt main pipe.
According to the embodiment of the application, the first shunt tube 105, the second shunt tube 106 and the shunt manifold are all provided with temperature detection pieces, and the temperature detection pieces are temperature sensors.
Specifically, a first shunt valve 1052 is arranged on the first shunt tube 105, a second shunt valve 1062 is arranged on the second shunt tube 106, the first shunt tube 105 is communicated with the end part of the second shunt tube 106 and is connected to a main pipe, a shunt main valve 1011 is arranged on the main pipe, a main pipe temperature detecting piece 1010 is arranged on the shunt main valve 1011, a first shunt temperature detecting piece 1051 and a second shunt temperature detecting piece 1061 are respectively arranged on the first shunt tube 105 and the second shunt tube 106, the main pipe temperature detecting piece 1010, the first shunt temperature detecting piece 1051 and the second shunt temperature detecting piece 1061 are all temperature sensors, when the temperature does not reach the requirement, the material circulation heating inside the glue feeding mechanism 1 is realized through the shunt main valve 1011, the first shunt valve 1052 and the second shunt valve 1062 until the material is heated to the qualified temperature, the shunt main valve 1011 is closed, and the first shunt valve 1052 and the second shunt valve 1062 are opened to enable the material to flow.
According to the embodiment of the application, the first temperature control component 2 and the second temperature control component 9 comprise an adjusting component and an electromagnetic coil component;
the adjusting part comprises an X-direction guide rail 901, a Y-direction guide rail 907 and a Z-direction connecting rod 905, wherein the Y-direction guide rail is fixedly arranged at the top of the Z-direction connecting rod 905, an X-direction sliding block 904 is arranged at the bottom of the Z-direction connecting rod 905, the X-direction sliding block 904 is connected to the X-direction guide rail 901 in a matched manner, the X-direction sliding block 904 can slide along the Y-direction guide rail, the electromagnetic coil component is arranged on the Y-direction guide rail in a matched manner, the electromagnetic coil component can move along the Y-direction, the Z-direction connecting rod 905 is a cylinder mechanism, and the Z-direction connecting rod 905 can vertically stretch out and draw back to adjust the height of the electromagnetic coil component.
Specifically, the space movement can be realized to X direction guide rail 901, Y direction guide rail and Z direction cylinder formula connecting rod, can carry out nimble location with the solenoid subassembly, and the solenoid subassembly coupling magnetic field intensity in accurate adjustment first temperature control subassembly 2 and the second temperature control subassembly 9 to realize accurate accuse temperature.
An X-direction guide rail 901 and a Y-direction guide rail are respectively provided with an X-direction control mechanism 902 and a Y-direction control mechanism 908, the X-direction control mechanism 902 is connected with an X-direction connecting rod 903, one end of the X-direction connecting rod 903 is connected with an X-direction sliding block 904, the top of the X-direction sliding block 904 is provided with a Z-direction connecting rod 905, one ends of the X-direction sliding rail and the Y-direction guide rail 906 are respectively provided with a position sensor 912, and the electromagnetic coil assembly is precisely positioned in space position coordinates through the position sensor 912, so that precise adjustment of electromagnetic coupling strength is realized.
According to the embodiment of the application, a Y-direction sliding plate 906 is arranged at the bottom of an electromagnetic coil assembly, the Y-direction sliding plate 906 is fixedly arranged at the top of a Z-direction connecting rod 905, the electromagnetic coil assembly comprises a first coil 909, a second coil 910 and a third coil 911, the first coil 909 and the second coil 910 are eddy current coils with different numbers of turns, and the third coil 911 is of a spiral coil structure.
When the first shunt tube 105 and the second shunt tube 106 are along with the extension of the route, the material temperature loss is gradually increased, the material temperature is gradually reduced, when the material temperature reaches the preset temperature, the temperature control shape memory alloy deforms to form a spiral channel, the transportation route is prolonged, meanwhile, the heating time is prolonged in the heating process of the magnetic field, the material inside the first shunt tube 105 and the second shunt tube 106 is ensured to reach the qualified temperature for outflow, the control mode is various, and the temperature control is accurate.
Example two
As shown in fig. 2, this embodiment is the same as the first embodiment in that the description is not repeated, except that:
according to the embodiment of the application, the device further comprises a third temperature control assembly 11, the third temperature control assembly 11 is arranged at the center of the bottom of the device body 3, the third temperature control assembly 11 comprises a bottom coil 12, a coupling magnetic field is formed between the bottom coil 12 and the electromagnetic coil assembly on the first temperature control assembly 2 and between the bottom coil 12 and the electromagnetic coil assembly on the second temperature control assembly 9, a temperature control base 10 is arranged at the bottom of the device body 3, and the temperature control base 10 can drive the third temperature control assembly 11 to rotate.
Specifically, the current change of one coil generates induced electromotive force in adjacent coils, and the induced electromotive force is independent from each other in terms of electricity, and the mutual influence between the adjacent coils is that the adjacent coils are related by magnetic fields, namely magnetic coupling.
Through the coupling magnetic field that the different coils in the first temperature control subassembly 2 of the selective structure of joint assembly 6 and the bottom coil 12 of the third temperature control subassembly 11 formed different intensity carries out the accurate accuse temperature of hot runner, control accuracy is higher.
Alternatively, the first coil 909 within the first temperature control element 2 is selected to form a first coupling magnetic field with the bottom coil 12;
selecting a second coil 910 in the first temperature control component 2 to be electrified with the bottom coil 12 to form a second coupling magnetic field;
selecting a third coil 911 and a bottom coil 12 in the first temperature control assembly 2 to be electrified to form a third coupling magnetic field;
different coupling magnetic fields are selected to form different magnetic field intensities, so that the material temperature is flexibly controlled.
Optionally, the first coil 909 and the bottom coil 12 in the second temperature control element 9 are selected to form a fourth coupling magnetic field;
selecting the second coil 910 of the second temperature control component 9 and the bottom coil 12 to form a fifth coupling magnetic field;
selecting the third coil 911 of the second temperature control component 9 and the bottom coil 12 to form a sixth coupling magnetic field;
the first temperature control assembly 2 is not turned on at the same time as the second temperature control assembly 9.
Example III
The embodiment is the same as the first embodiment in that the description is not repeated, and the difference is that: the first valve needle 403 and the second valve needle are both made of magnetic control shape memory alloy, the first valve needle 403 and the second valve needle both comprise deformation areas, and the shape of the deformation areas is changed through a magnetic field generated by the electromagnetic coil assembly to control the expansion and contraction amount of the first valve needle 403 and the second valve needle in the first nozzle 4 and the second nozzle 8.
Specifically, the magnetic control shape memory alloy is MSMA, which is a novel functional material with two-way shape memory and magnetic induced strain, and the generation mechanism of the magnetic induced strain is to generate a large shape memory effect through the movement of a twin crystal boundary and the reorientation of a martensite variant to the direction of a magnetic field. The austenite phase of MSMA generates martensite phase under the action of external magnetic field to change shape, or the martensite phase formed by phase transformation changes shape through normal deformation, and then returns to the original austenite phase through reverse phase transformation by changing magnetic field or removing magnetic field, and simultaneously generates larger restoring force.
Further, the MSMA element can generate 6% deformation under the action of a magnetic field, the deformation and the magnetic field strength form a good proportional relationship, the magnetic induction strength of the magnetic control shape memory alloy changes along with the stretching or compression of the alloy under the action of the magnetic field, the maximum magnetic flux can reach 0.7 tesla, and the MSMA generates stretching or compression along with the action of an external force or the magnetic field, so that the impedance measured on the magnetic control shape memory alloy also changes along with the stretching or compression.
Further, MSMA is a single crystal Ni-Mn-Ga alloy, and the composition components of the MSMA are Ni:49.6%, mn:29.28%, ga:21.12% with an austenite temperature of 50℃and a Curie temperature of 100 ℃.
Example IV
The application provides a hot runner temperature control method based on an intelligent temperature control technology of the Internet of things, which is applied to a hot runner device based on the intelligent temperature control technology of the Internet of things, and comprises the following steps:
the materials enter the glue feeding mechanism 1, the different electromagnetic coils on the first temperature control assembly 2 and the second temperature control assembly 9 are controlled through the joint assembly 6 to adjust the magnetic field intensity, eddy currents are generated, and the materials in the glue feeding mechanism 1 are heated;
acquiring the temperature of the materials in the glue feeding mechanism 1, and judging whether the temperature is equal to a preset threshold value or not;
if the flow is equal to the first flow dividing pipe 105, the material is divided into a first flow dividing pipe 106 by the flow dividing mechanism 101;
the material generates heat loss in the flowing process of the first shunt tube 105 and the second shunt tube 106, when the heat loss is larger than the preset loss, the temperature of the material is reduced to a deformation temperature, at the moment, the deformation parts of the first shunt tube 105 and the second shunt tube 106 generate spiral deformation, the flowing paths of the first shunt tube 105 and the second shunt tube 106 are prolonged, and meanwhile, the material in the first shunt tube 105 and the material in the second shunt tube 106 are heated through the magnetic field generated by the electromagnetic coil;
when heated to a predetermined temperature, the deformed portion recovers, shortens the flow path, and transports the material to the first needle 403 and the second needle, respectively, and out through the first nozzle 4 and the second nozzle 8.
The joint assembly 6 controls the different electromagnetic coils on the first temperature control assembly 2 and the second temperature control assembly 9 to adjust the magnetic field intensity, generate vortex and heat the materials in the glue feeding mechanism 1, and specifically comprises the following steps:
the electromagnetic coils on the first temperature control assembly 2 and the second temperature control assembly 9 generate a magnetic field, and the metal particles 102 on the mixed flow mechanism 103 in the glue feeding mechanism 1 generate heat under the action of the magnetic field, so that materials in the glue feeding mechanism 1 are uniformly heated in the rotating process of the mixed flow mechanism 103.
Further, temperature data of the first shunt tube 105, the second shunt tube 106 and the main pipe acquired by the temperature sensor are transmitted to a database for storage, the temperature data are analyzed and processed by the central processing unit, the temperature data in adjacent time periods are compared, data with larger temperature difference are provided, and temperature errors in the temperature data processing process are reduced.
In summary, the application realizes that the hot runner always keeps accurate temperature control according to the hot runner structure and the memory alloy, and the temperature control component not only can control the temperature of fluid in the hot runner, but also can control the shape memory alloy to be changed into a specific shape, thereby changing the path of the hot runner, preventing the generation of larger temperature difference in the fluid flowing process and having higher fluid temperature control precision.
In the several embodiments provided by the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above described device embodiments are only illustrative, e.g. the division of the units is only one logical function division, and there may be other divisions in practice, such as: multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed. In addition, the various components shown or discussed may be coupled or directly coupled or communicatively coupled to each other via some interface, whether indirectly coupled or communicatively coupled to devices or units, whether electrically, mechanically, or otherwise.
The units described above as separate components may or may not be physically separate, and components shown as units may or may not be physical units; can be located in one place or distributed to a plurality of network units; some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, or each unit may be separately used as one unit, or two or more units may be integrated in one unit; the integrated units may be implemented in hardware or in hardware plus software functional units.
Those of ordinary skill in the art will appreciate that: all or part of the steps for implementing the above method embodiments may be implemented by hardware related to program instructions, and the foregoing program may be stored in a computer readable storage medium, where the program, when executed, performs steps including the above method embodiments; and the aforementioned storage medium includes: a mobile storage device, a Read-only memory (ROM), a random access memory (RAM, randomAccessMemory), a magnetic disk or an optical disk, or the like, which can store program codes.
Alternatively, the above-described integrated units of the present application may be stored in a computer-readable storage medium if implemented in the form of software functional modules and sold or used as separate products. Based on such understanding, the technical solutions of the embodiments of the present application may be embodied in essence or a part contributing to the prior art in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a removable storage device, ROM, RAM, magnetic or optical disk, or other medium capable of storing program code.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (9)
1. A hot runner apparatus based on intelligent temperature control technology of the internet of things, comprising: the device comprises a device body, a glue feeding mechanism, a first temperature control assembly and a second temperature control assembly, wherein the glue feeding mechanism, the first temperature control assembly and the second temperature control assembly are arranged at the center of the top of the device body; it is characterized in that the method comprises the steps of,
the first temperature control component and the second temperature control component are symmetrically arranged on two sides of the glue feeding mechanism; the first temperature control assembly and the second temperature control assembly comprise electromagnetic coil assemblies, the first temperature control assembly and the second temperature control assembly are electrically connected with joint assemblies, the first temperature control assembly and the second temperature control assembly are electrified through the joint assemblies, and a magnetic field is formed by the electromagnetic coil assemblies on the first temperature control assembly and the second temperature control assembly to heat the hot runner;
the bottom of the device body is symmetrically provided with a first nozzle and a second nozzle, a first valve needle and a second valve needle are respectively arranged in the first nozzle and the second nozzle, and the first valve needle and the second valve needle are respectively used for controlling the flow of the first nozzle and the second nozzle;
the device comprises a device body, wherein a flow distribution mechanism is arranged in the device body and connected to the bottom of the glue feeding mechanism, a mixed flow mechanism is arranged in the flow distribution mechanism, and a plurality of metal particles are arranged at intervals on the outer side of the mixed flow mechanism;
the bottom of the flow dividing mechanism is provided with a first flow dividing pipe and a second flow dividing pipe, the first flow dividing pipe is connected to one end of the first valve needle, and the second flow dividing pipe is connected to one end of the second valve needle;
the first shunt tube and the second shunt tube are both made of shape memory alloy, and respectively comprise a first deformation part and a second deformation part which deform according to the temperature in the hot runner;
the first valve needle and the second valve needle are both made of shape memory alloy, the first valve needle and the second valve needle both comprise deformation areas, and the shape of the deformation areas is changed through a magnetic field generated by the electromagnetic coil assembly to control the expansion and contraction amount of the first valve needle and the second valve needle in the first nozzle and the second nozzle.
2. The hot runner device based on the intelligent temperature control technology of the internet of things according to claim 1, wherein the split-flow mechanism is of a cylindrical structure with an opening at the top, the mixed-flow mechanism is of a spherical structure, a hinge rod is arranged inside the split-flow mechanism and penetrates through the spherical center of the mixed-flow mechanism, two ends of the hinge rod are propped against the inside of the split-flow mechanism, and the hinge rod rotates to drive the mixed-flow mechanism to rotate.
3. The hot runner device based on the intelligent temperature control technology of the internet of things according to claim 1, further comprising a third temperature control assembly, wherein the third temperature control assembly is arranged at the center of the bottom of the device body and comprises a bottom coil, a coupling magnetic field is formed between the bottom coil and an electromagnetic coil assembly on the first temperature control assembly and an electromagnetic coil on the second temperature control assembly, and a temperature control base is arranged at the bottom of the device body and can drive the third temperature control assembly to rotate.
4. The hot runner device based on the intelligent temperature control technology of the internet of things according to claim 1, wherein a first shunt valve is arranged on the first shunt pipe, a second shunt valve is arranged on the second shunt pipe, the first shunt pipe and the second shunt pipe are connected to a shunt main pipe, and a shunt main valve is arranged on the shunt main pipe.
5. The hot runner device based on the intelligent temperature control technology of the internet of things according to claim 4, wherein the first shunt pipe, the second shunt pipe and the shunt main pipe are respectively provided with a temperature detection part, and the temperature detection parts are temperature sensors.
6. The hot runner apparatus based on the intelligent temperature control technology of the internet of things according to claim 1, wherein the first temperature control component and the second temperature control component both comprise an adjusting component and an electromagnetic coil component;
the adjusting component comprises an X-direction guide rail, a Y-direction guide rail and a Z-direction connecting rod, wherein the Y-direction guide rail is fixedly arranged at the top of the Z-direction connecting rod, an X-direction sliding block is arranged at the bottom of the Z-direction connecting rod and is connected to the X-direction guide rail in a matched mode, the X-direction sliding block can slide along the Y-direction guide rail, the electromagnetic coil component is arranged on the Y-direction guide rail in a matched mode, the electromagnetic coil component can move along the Y-direction, the Z-direction connecting rod is an air cylinder mechanism, and the Z-direction connecting rod can vertically stretch to adjust the height of the electromagnetic coil component.
7. The hot runner device based on the intelligent temperature control technology of the internet of things according to claim 6, wherein a Y-direction sliding plate is arranged at the bottom of the electromagnetic coil assembly and fixedly installed at the top of the Z-direction connecting rod, the electromagnetic coil assembly comprises a first coil, a second coil and a third coil, the first coil and the second coil are eddy current coils with different numbers of turns, and the third coil is of a spiral coil structure.
8. The hot runner temperature control method based on the intelligent temperature control technology of the internet of things is applied to the hot runner device based on the intelligent temperature control technology of the internet of things as set forth in any one of claims 1 to 7, and is characterized by comprising the following steps:
the material enters the glue feeding mechanism, the different electromagnetic coils on the first temperature control assembly and the second temperature control assembly are controlled through the joint assembly to adjust the magnetic field intensity, vortex is generated, and the material in the glue feeding mechanism is heated;
acquiring the temperature of materials in the glue feeding mechanism, and judging whether the temperature is equal to a preset threshold value;
if the flow is equal to the first flow dividing pipe, the material is divided into a first flow dividing pipe and a second flow dividing pipe through a flow dividing mechanism;
the material generates heat loss in the flowing process of the first shunt tube and the second shunt tube, when the heat loss is larger than preset loss, the temperature of the material is reduced to deformation temperature, at the moment, the deformation parts of the first shunt tube and the second shunt tube generate spiral deformation, the flowing paths of the first shunt tube and the second shunt tube are prolonged, and meanwhile, the material in the first shunt tube and the material in the second shunt tube are heated through the magnetic field generated by the electromagnetic coil;
when heated to a predetermined temperature, the deformation portion recovers, shortens the flow path, and transports the material to the first needle and the second needle, respectively, and out through the first nozzle and the second nozzle.
9. The hot runner temperature control method based on the intelligent temperature control technology of the internet of things of claim 8, which is characterized by comprising the following steps of;
the magnetic field intensity is adjusted through the different solenoid on the first control by temperature change subassembly of joint subassembly control and the second control by temperature change subassembly, produces the vortex to heat the material in the mechanism that advances glues, specifically include:
the electromagnetic coils on the first temperature control assembly and the second temperature control assembly generate a magnetic field, and metal particles on the mixing mechanism inside the glue feeding mechanism generate heat under the action of the magnetic field, so that materials inside the glue feeding mechanism are uniformly heated in the rotating process of the mixing mechanism.
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| CN202211618763.3A CN115958761B (en) | 2022-12-16 | 2022-12-16 | Hot runner device based on intelligent temperature control technology of Internet of things and temperature control method thereof |
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| CN202211618763.3A CN115958761B (en) | 2022-12-16 | 2022-12-16 | Hot runner device based on intelligent temperature control technology of Internet of things and temperature control method thereof |
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| CN115958761A (en) | 2023-04-14 |
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