JPS62208918A - Device for adjusting mold temperature - Google Patents

Abstract

PURPOSE:To enable the titled device to perform quick heating, quick cooling and slow cooling processes by a system, by a method wherein a high-temperature and low-temperature heating medium tanks are provided independently and medium circuits among the heating medium tank and molds are put into exclusive uses for a high- temperature heating medium and low-temperature heating medium excepting a part of the circuits. CONSTITUTION:To begin with, a mold temperature of a rest 2 is preset to a predeter mined temperature by a heating medium of an intermediate-temperature tank 1a. Then as high-temperature medium control cylinder valves S1, S3, S5, S7 are released, openings of high-temperature medium control flow control valves V1, V3, V5 V7 are controlled through adjusting and each of insertion pieces 6a-6d performs heat exchange with a high-temperature medium by an instruction signal from a controller 5 in a heating process, a mold is heated up to a preset temperature. The mold tempera ture is kept at a fixed one in an injection process and a cavity is filled with resin. A cooling process is performed by making use of a low-temperature medium of a low-temperature tank 1c. A slow cooling process is performed by a fine adjusting unit 10 and the low-temperature medium does not return to the low-temperature tank 1c. Quick heating, quick cooling and slow cooling processes are performed by a system link this and shortening of a molding cycle can be attained.

Description

Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a mold 1111 g adjustment device for plastic molding, and in particular a mold temperature suitable for uneven and thick products such as plastic lenses. Relating to an adjustment device.

(Prior Art) As general parts become more precise, plastic parts are also required to have higher molding precision. Particularly for plastic parts such as lenses, which are thick and have a large wall thickness deviation ratio, it is necessary to actively control the temperature and pressure after the parts are filled into the mold to improve the molding precision 1'. As a temperature control method for improving accuracy, a heat cycle method has been proposed in which a mold, particularly a cavity, is heated and cooled.

This heat cycle method heats the mold over a wide range of temperatures of 11 fvA.
This method repeatedly heats and cools the filled resin over a range of regions, and because it can control the temperature of the filled resin from the melting region to the solidifying region, it is effective in improving the precision of molding.

In the jlfU section of a mold formed by the heat cycle method, heating is generally performed using a heater and cooling is performed using water, oil, or the like. This method requires a separate heater storage part for storing the heater in the mold and a medium passage for circulating cooling water, etc. Therefore, the heating and cooling locations located in the mold are shared. That was impossible. For this reason, the heat cycle method as described above is inappropriate as a temperature control method for rapid heating and rapid cooling.

In addition, especially in the case of small products such as plastic lenses, since the cavity is small, there is a problem in separately arranging the heater location and the cooling location as described above.

Therefore, conventional methods have been attempted in which the mold temperature is controlled by heating and cooling a heat medium within a single tank. However, such a method of heating and cooling a heat medium in a single tank has poor responsiveness and is unsuitable as a heat cycle method that requires rapid heating and rapid cooling.

Furthermore, in Japanese Patent Application Laid-Open No. 58-215309, a high-temperature tank and a low-temperature tank are used, and the heat medium of each tank is
JL' is strictly managed. In order to obtain a predetermined set overall mold temperature If, a method has been proposed in which the temperature fv4 is adjusted by flowing the heat medium in the two medium tanks directly through the metal hood. According to this method, the temperature of the two types of media embedded in the temperature tube is directly flowed into the mold, so it is known to be effective in controlling the mold temperature to a constant level. However, it is not suitable when the mold temperature needs to be rapidly heated and rapidly cooled by the heat cycle method.

In addition, in order to alleviate the molecular orientation and internal strain of the resin filled into the cavity, and to make the temperature 1 distribution uniform in the thermal deformation region during the resin cooling process, it is necessary to gradually cool the resin. Although a slow cooling step is necessary, the one-mold control method described in the above-mentioned publication lacks consideration of this point.

By the way, as a temperature control method using a heating medium having a configuration that enables the above-mentioned gradual heating, there is a method disclosed in Japanese Patent Application Laid-Open No.
Those described in JP-A No. 7108 and JP-A-59-49915 are known.

In these, the heat medium @ path is made into a closed circuit during slow cooling,
Slow cooling is achieved by incorporating a heater into the circuit and combining it with cooling water circulating within one circuit.

Note that Japanese Patent Laid-Open No. 56-55219 proposes a configuration in which a heater and a cooler are combined in a heat medium circuit to adjust the mold temperature.

(Problems to be Solved by the Invention) The above-mentioned conventional technology does not fully control the temperature including the rapid heating, rapid cooling, slow cooling steps, etc. that are essential when molding plastic lenses etc. by the heat cycle method. No consideration was given to ensuring consistency throughout the process. That is, the only efforts were made to control the mold temperature to a substantially constant level.

Specifically, in the method described in Japanese Patent Application Laid-open No. 58-215309, as mentioned above, no consideration is given to slow cooling, and rapid heating in a high-temperature tank and rapid cooling in a low-temperature tank are not performed. To do this, a large amount of electricity was required. This is because a common manifold is provided between the temperature control device and the mold, and when heating and cooling are performed, the manifold must be heated and cooled in addition to the mold.

Also, JP-A-56-37108, JP-A-59-4
The methods described in Japanese Patent Laid-open No. 9915 and Japanese Patent Application Laid-Open No. 56-55219 do not take into account rapid heating and rapid cooling.

In addition, in the above-mentioned conventional technology, each cavity is formed independently, like a multi-cavity mold. When adjusting the degree,
The structure inevitably accompanies an increase in the number of valves, which leads to an increase in heat capacity, but no consideration has been given to this point.

Here, the problems of the above-mentioned conventional technology are summarized as follows.

The first problem is essential for molding high-precision products such as lenses. The device is not capable of consistent control of each process such as rapid heating, rapid cooling, and slow cooling.

The second problem is that when performing rapid heating and cooling, in addition to the metal valves whose temperature must be controlled, valves such as flow rate control valves and the common manifold must also be heated and cooled at the same time. In particular, in the heat cycle method, since the warm adjustment range of the mold is large, the heat loss due to heating and cooling of parts other than the mold is large. This is because the number of valves to be controlled increases with the multi-cavity Venus.

This issue cannot be ignored.

The third problem is that, as mentioned above, the temperature of molds other than the mold that should be temperature-controlled ends up being controlled, which not only deteriorates the responsiveness of temperature control, but also The reliability of accuracy also deteriorates.

The purpose of the present invention is to eliminate the drawbacks of the prior art described above, to enable rapid heating, rapid cooling, slow cooling, etc. to be performed in one system, and to perform rapid heating and rapid cooling of molds with high efficiency. Mold with excellent warm control accuracy @ degree v! 4ii+ equipment.

(Means for solving the problem) The above purpose is to provide independently a heat medium tank for storing a high temperature heat medium kept at a high temperature and a heat medium tank for storing a low temperature heat medium kept at a low temperature. At the same time, a means for heating and/or cooling the heat medium is provided in the medium circuit between the heat medium tank and the mold.

In addition, by separating and dedicating the valves for controlling the high-temperature heat medium and the valves for controlling the low-temperature heat medium, the medium circuit can be used for high-temperature heat medium and low-l heat medium, except for a part of it. It is maintained at a predetermined temperature in a dedicated body tank.

In the case of rapid heating, the high-temperature heat medium is supplied to the mold through a dedicated valve and a medium circuit that is partially dedicated. As a result, the amount of heat of the heating medium effectively acts only on raising the temperature of the mold. This allows rapid heating. on the other hand.

Similarly, when rapid cooling is performed using a low-temperature heat medium, the low-temperature heat medium is supplied to the metal plate through a dedicated valve and a medium circuit that is dedicated except for a part.

As a result, rapid cooling becomes possible. As described above, the present invention provides specialized valves and medium circuits for high-temperature heat medium and low-temperature heat medium. (manifold) configuration has been abolished, the instability factor for a opening control is reduced, and mold temperature control ff
1f will also be improved. Furthermore, since a means for heating and/or cooling the heat medium is provided in the medium circuit, cooling (slow cooling) from the high temperature part of the mold can be performed as desired, that is, at a planned speed. .

(Example) Hereinafter, the present invention will be explained in detail using the drawings.

FIG. 1 is a block diagram of a metal-deaf-temperature If 191 m apparatus for plastic molding, showing an example of the fs1 system of the present invention.

In the figure, l is a group of heat medium tanks that maintains a heat medium for adjusting the temperature f of the mold at a predetermined temperature.

1a is a medium-temperature tank in which the temperature can be arbitrarily set in the range of 50° C. to 120° C., which mainly contains a heating medium for controlling the temperature eA of the frame 2 of the mold. The heat medium in the medium-temperature tank 1m is pumped to the frame 2 by the pressure pump Ml, and is passed through the frame medium passage 384! The water then returns to the medium temperature tank 1a. 4
is a frame temperature sensor, and the temperature sensor 4 is connected to a control device 5.

1b has a group of 68 input pieces @ 100 pieces of heat medium for temperature adjustment.
This is a high-temperature tank that can be set at any temperature between °C and 200 °C. The heat medium in the high-temperature tank lb is force-fed to each input piece group 6 via a part of the cylinder valve group S by a pressure-feeding pump M2.

The heat medium that has passed through the medium passage F of each input piece group 6 returns to the high temperature tank lb via a part of the flow rate control valve group V.

1c is a heating medium for controlling the temperature of the input piece group 6 at 10°C.
This is a low-temperature tank that can be set at any temperature within the range of ~80°C. The heat medium in the low-temperature tank 1c is force-fed to each input piece group 6 via a part of the cylinder valve group S by a pressure-feeding pump M3. The heat medium passing through the medium passage 7 of each input piece #6 is I5! It returns to the cryogenic tank lc via part of the quantity control valve nv. In the low temperature tank 1e (1) fi body circuit, there are 3 cylinders between the pressure pump M3 and the cylinder valve group S.
A bypass circuit 8 is configured via the direction valve 9a.

The bypass circuit 8 is provided with a fine adjustment unit 10 for finely adjusting the medium temperature.

The cylinder valve group S is connected to the heat medium (
Cylinder valves 81, 83, which control only the high temperature medium)
85, 87, and cylinder valves 82, 84, 86, and 88 that control only the heat medium (low temperature medium) of the low temperature tank 1c. Similarly, the flow rate control valve group V also includes valves Vt, V3, V5, which control the flow rate of only the high temperature medium.
V7 and a valve v2. which controls the flow rate of only the low temperature medium. V4
．． Separated into V6 and V8.

The above-described group of pieces 6 are formed on the same frame 2 as a so-called four-cavity mold, and a temperature sensor 11 is disposed in each piece. The temperature sensor 11 is wired to the control device 5.

The control device 5 includes temperature sensors 11 . It receives signals from the frame temperature sensor 4 and the medium tank group temperature sensor (not shown), etc., and sends command signals to the cylinder valve, flow rate control valve, three-way valve, fine adjustment unit 10, etc. in accordance with these signals. .

Others 1 Although not shown in FIG. 1, the heating medium tank group 1 of this embodiment includes elements for adjusting the temperature of the heating medium such as a heater, a cooler, and a temperature sensor in relation to the control device 5. , or provided as an independent control mechanism. Further, the heat medium tank group 1 is provided with a reserve tank for adjusting the liquid amount of the medium.

The operation of the mold temperature control device of this embodiment having the above configuration will be explained. FIG. 2 is a pattern/diagram of the mold temperature (temperature of each piece inserted) versus time that is to be realized by this embodiment. First, the mold temperature pattern shown in FIG. 2 will be explained.

The so-called heat cycle method, in which the mold temperature is raised and lowered as shown in FIG. 2, is used to mold Pukustick, which is thick and has uneven thickness, such as lenses.

FIG. 2 shows an example of a mold temperature pattern when molding a Pukustic lens using, for example, acrylic resin, in which the mold is heated from 80° C. to 120° C. in the primary heating step. In the injection process, resin is filled into the mold while the mold riL degree is maintained at 120°C. The primary cooling step is a step for quickly cooling down to the center of the thick interior, and is cooled to around 80° C. to 90° C.

The secondary heating step is a reheating step for improving the shape (surface) accuracy of the molded product in the holding step (shaping step) and slow cooling step. In the secondary heating step, it is heated to 150°C.

The temperature is set at Temperature 1, which is higher than the heat deformation temperature range of the acrylic resin. In the shaping step, the temperature distribution of the entire molded product is maintained at a predetermined temperature distribution, and in the slow cooling step, the molded product is slowly cooled from this temperature at a predetermined speed. After slow cooling to below the heat distortion temperature range of the resin, the molded product moves to a secondary cooling step and is cooled to a removable temperature H<100° C. or below), and the entire process is completed.

The operation of this embodiment will be explained below in the order of steps shown in FIG.

First, the frame 2, and thus the metal temperature of each inserted piece, is set to a predetermined temperature using a heat medium in a 1 m medium temperature tank.Next, for example, the mold clamping light 3 signal from a molding machine (not shown) is is received by the control circuit 5, and the command for the primary heating process shown in Fig.'@2 is started.That is, by the command signal from the control shaft r!t5, the high temperature medium control cylinder valves 81, 83.
S5 and S87 are opened, and the opening degrees of the high temperature medium control flow rate control valves Vl, V3, v5 and V7 are adjusted and controlled.

Since the pressure pump M2 is always activated regardless of the control status of the cylinder valve and flow control valve,
Simultaneously with the opening of the valve groups S and (2), the high-temperature medium is pumped into the medium passages 112I7 of each input piece 6m, 6b, 6c, and 6d. As a result, each input piece exchanges heat with the high temperature medium and is therefore heated to the set temperature. The temperature of each piece is! The high temperature medium is monitored by the control device 5 via the temperature sensor 11, and the flow rate of the high temperature medium is controlled by the flow rate control valve so that the temperature of each input piece increases simultaneously.

The high temperature medium that has passed through the flow rate control valve returns to the high temperature tank lb via the return circuit 12.

In the injection process, in order to maintain the metal temperature that has risen to the set temperature at a constant level, the cylinder valve and the flow rate control valve are controlled to open and close, and to adjust the degree of opening. In this injection process, after the set temperature is detected by the temperature control unit 11, a timer in the control device 5 is activated. Then, when the set time has elapsed, a command signal to start injection filling is output from the control device 5 to the molding machine. As a result, the cavities formed by the respective input pieces 6 are filled with resin. Note that, at the same time as the timer for the injection command is activated, a timer for instructing the start of the primary cooling process is also activated.

Therefore, when the set time of the timer has elapsed, the injection process ends and the primary cooling process starts at the same time.

The primary cooling step is performed using the low temperature medium in the low temperature tank IC. That is, when a command to start the primary cooling process is output from the control device 5, the high temperature medium cylinder valve 81. S3
．． S5, 37 and high temperature medium control flow rate control valve Vl
, V3, V5, and V7 are all closed, and the low temperature medium control cylinder valve 82, S4. S6. S8 is opened.

At the same time, flow rate control valve V2 for controlling low temperature medium. V4. V6
The opening of ゜v8 is controlled so that the temperature (one glue of each input piece) decreases equally based on the monitoring of the temperature sensor 11. After the low temperature medium passes through the flow rate control valve for controlling the low temperature medium,
The low temperature tank 1 cK returns through the feedback circuit 138. When the @ degree of each input piece reaches the lower limit setting value, the secondary heating step is then started.

The operation of each part of the a degree adjusting device in the secondary heating process is similar to that in the primary heating process. When the mold temperature reaches the shaping process temperature, it is maintained at the shaping process temperature by the temperature sensor 11, the high temperature medium cylinder valve S, and the high temperature medium control flow rate control valve V, similarly to the injection process. In this shaping process, the timer for slow cooling command is activated at the same time as the shaping process temperature is reached. Then, when the set time has elapsed, slow cooling is started.

In this example, the slow cooling in the slow cooling step is performed using a low temperature medium. The medium has a temperature f much lower than the shaping process temperature.
K is set. Therefore, in order to smoothly slowly cool the product from a high temperature, it is necessary to heat the low temperature medium. In addition, as an auxiliary means to lower the mold temperature at a scheduled speed,
A cooler may also be required. However, depending on the slow cooling rate, the cooler may not be necessary. In this embodiment, the slow cooling described above is performed by the fine adjustment unit 10. control! ! When a slow cooling start signal is output from 115, the signal closes the valve 14, and opens the three-way valves 9m and 9b, the low-temperature medium cylinder valve S, and the low-temperature medium control flow rate control (lube V). At this time, the cylinder valve for high temperature medium and the flow rate control valve for high temperature medium control are closed.As a result, the low temperature medium passing through each input piece flows through the three-way valve without returning to the low temperature tank IC. 9b → Pressure feed pop/pu M3 → Fine adjustment unit 1
0→3-way valve 9&→cylinder valve S2, 84.

86.88 → Input pieces 6a, 6b, 6c, 6d → Flow rate control valves V2, V4, V6, V8 → Feedback circuit 13 → 3
It circulates in the closed circuit of the direction valve 9b. Based on the monitoring of the temperature sensor 11, the low temperature medium circulating in this closed circuit is output from the control device 5 to the fine adjustment unit 10 (by the N number, slow cooling is performed at the planned speed at a gradient). Become.

When the set slow cooling completion temperature is sensed, the process moves to the secondary cooling process. The operation of the temperature control device in the secondary cooling step is as follows:
The operation is the same as the medical cooling process. However, the closed circuit of the low temperature medium in the slow cooling process is the same as the medical cooling process.

It is released at the same time as slow cooling is completed.

Upon completion of the secondary cooling process, a mold opening command signal is output from the control device 5 to the molding machine, and the first stage of plastic lens molding is started.
The cycle ends.

The above is the operation of the gold temperature regulating device of this embodiment. The above-mentioned fine adjustment unit IO will be further explained using FIGS. 3 and 4. In these figures, the same reference numerals are used to refer to the same parts as in FIG.

FIG. 3 is a configuration diagram showing an example of the fine adjustment unit 10 of FIG. 1.

In Fig. 3, 15 is a heater such as a heater, 16 is a cooler such as cooling water or a chiller, 17 and 18 are directional control valves,
19 is a flow control valve, 20 is a pressure pump, and 21 is a heat exchanger.

The 10 yen fine adjustment unit is designed to circulate an auxiliary heat medium. The path through which the heating auxiliary medium circulates is the heater 15
It is a closed circuit of one-way control valve 17 → pressure pump 20 → heat exchanger 21 → flow rate control valve 19 → direction control valve 18. The path through which the cooling auxiliary medium circulates is the cooler 16 → direction control valve 1
7→Pressure pump 20→Heat exchanger 21-Flow control valve 19 This is a closed circuit of one-way control valve 18.

By circulating the auxiliary heat medium, the main medium (low-temperature medium) pumped to each input piece 6 is heated or cooled by the heat exchanger 21, and the above-mentioned slow cooling is performed. The operation of heating or cooling the main medium is performed by the controller 5 appropriately controlling the direction control valves 17, 18 and the flow rate control valves 19 based on information from the temperature control valve 11 of each input piece 6. It is done. still,
The control of the fine adjustment unit 10 in the slow cooling process is performed based on the information from the first sensor 11 arranged in each input piece 6, and also detects the temperature of the main medium after passing through the heat exchanger 21. This can also be done based on nuclear detection information.

FIG. 4 is a configuration diagram showing another example of the fine adjustment unit (10) shown in FIG. 1.

In FIG. 4, the same or equivalent parts as in FIG. 1 described above are indicated by the same reference numerals.

This so-called unit 10 has a heat exchanger 21 configured as a closed circuit for a low-temperature medium, which is directly connected to a heat source such as a heater. The heat distortion temperature of plastics is considerably higher than room temperature depending on the resin. In other words, the excipient 1 honey shown in Figure 2 is
As mentioned above, for example, in the case of acrylic resin, the temperature is set at around 150°C.

Therefore, even if the circulation of the high-temperature medium is simply stopped, the temperature of the input piece group 6 immediately drops due to natural cooling. That is, when left alone, the mode is the same as rapid cooling. As is clear from this, when performing slow cooling of each input piece 6 using a low-temperature medium, the medium must be heated. The fine adjustment unit 10 of FIG. 4 is constructed for this purpose. The heater 22 is controlled by the control device 5 based on information from the temperature sensor 11 of each input piece 6. Note that the heater 22 is controlled by the heat exchanger 2.
It is also possible to detect the temperature of the medium after one passage and perform the process according to the detected information.

FIG. 5 is a block diagram showing still another example of the fine adjustment unit 10 shown in FIG. 1. Note that the same or equivalent parts as in FIG. 1 described above are indicated by the same reference numerals.

The present fine adjustment unit 10 includes a heat exchanger 21 configured as a closed circuit for a low-temperature medium, and a cooling coil 23m arranged therein. 23 is Chiku. The fine adjustment unit) 10 utilizes the heat generated by the pressure pump M3. Usually, the heat generated by a pressure pump is radiated into the atmosphere by a cooling fan integrally formed with a motor for driving the pump, heat radiating fins integrally formed with a pump casing, or the like. In this embodiment, the heat generation is used to heat a low-temperature medium,
The temperature of the medium in the closed circuit of the cold medium only increases. For this reason, each input piece 6 is slowly cooled by cooling the medium in the heat exchanger 21 and feeding the medium under pressure to each input piece 6. In this example, a chiller is used to cool the medium, but cooling water may be circulated without using the chiller. The control of the machine v4 10 is performed by the control device 5 based on information from the temperature sensor 11 of each input piece 6. Note that the control of the fine adjustment unit 10 may be performed by detecting the medium source after passing through the heat exchanger 21 and performing the control based on the detected information.

FIG. 6 shows the gold deaf temperature Iff! of the present invention. It is a block diagram which shows the 2nd Example of a 14-section device. This embodiment is configured as a single-cavity mold. Note that the same or equivalent parts as in FIG. 1 described above are indicated by the same reference numerals. The mold temperature control device of this embodiment is similar to the first embodiment described above (high temperature medium control cylinder valve S1 that controls only high temperature medium).
The high temperature medium control flow rate control valve v1 is separated and dedicated to a low temperature medium control cylinder valve S2 that controls only the low temperature medium, and a low temperature medium control flow rate control valve v2. Therefore, in this embodiment, the temperature of each medium in the high-temperature tank 1b and the low-temperature tank IC is adjusted exclusively for the wide and narrow 1. The medium temperature tank 1a exclusively controls the temperature of the frame 2. Temperature control of the mold temperature control device having the configuration of this embodiment is performed by the control device 5 based on information from the temperature sensor 11 in the input piece 6a, with the entire mold temperature shown in FIG. . That is, this is done by appropriately operating the cylinder valves 81, 82, flow rate control valves Vl, V2, etc. based on signals from the control device 5.

The feature of this embodiment is the fine adjustment unit) 10.

The fine adjustment unit 10 is arranged between the medium circuit of the pressure pump M2 on the high temperature medium side and the cylinder valve nS.

In the slow cooling process of this embodiment, the valve 25 is closed and the three-way valves 24m and 24b are opened in response to a signal from the control device 5, and the high temperature medium circulates in the input piece 6a via the fine adjustment unit 10 in a closed circuit. is configured. Therefore, in this embodiment, the medium source circulating in the closed circuit is controlled in accordance with the signal outputted from the control unit 5 to the fine adjustment unit 10 based on the information of the a-sensor/su 11 in the input piece 6a. and slow cooling begins. In this example, 00!1. v! 4 units)
It will be clear that 10 may have any of the configurations shown in FIGS. 3, 4, and 5 described above. Further, although the present embodiment deals with a single-cavity mold, it is obvious that the present invention can also be applied to a multi-cavity mold.

FIG. 7 is a configuration diagram showing a third embodiment of the mold temperature control device of the present invention. This embodiment is constructed as a single-cavity mold as in FIG. 6. still.

The same or similar parts as in FIG. 1 described above are designated by the same reference numerals. Also in the mold temperature control device of this embodiment,
Similar to the first embodiment, a high temperature medium control cylinder valve 81 and a flow rate control valve vl that control only the high temperature medium;
It is separated and dedicated to a low temperature medium control cylinder valve S2 and a flow rate control valve v2 that control only the low temperature medium. Therefore, in the two embodiments as well, the temperature of each medium in the high-temperature tank 1b and the low-temperature tank 1c is adjusted exclusively for the insert piece 6a. The medium temperature tank 1m exclusively controls the temperature of the frame 2. All control of the mold temperature control device having the configuration of this embodiment is controlled based on the information of the temperature sensor 11 in the input piece 6a according to the mold temperature pattern shown in FIG. This is done by setting 5. That is, the cylinder valves 81 and 82 and the flow rate control valve vl are activated by signals from the control device 5.

(2) This is done by operating the 2nd etc. properly.

The feature of this embodiment is the fine adjustment unit) 10.

(fine adjustment unit) 10 is a pressure pump M on the low temperature medium side.
3 and the cylinder valve group S between the medium circuits. In the slow cooling process of this embodiment, the valve 14 is closed and the three-way valve 9b is opened in response to a signal from the control device 5, forming a closed circuit for the low-temperature medium to circulate within the input piece 6a via the fine adjustment unit IO. be done.

Further, in this embodiment, the cylinder valve 26 is opened in response to a signal from the control device 5 during the slow cooling process. At the same time, the opening degree of the flow rate control valve 27 is adjusted and controlled by a command signal from the control device 5 based on information from the temperature sensor 11 in the input piece 6 . That is, the slow cooling in this embodiment is performed by controlling the flow rate of the high temperature medium based on the information from the temperature sensor 11, thereby adjusting the thermal potential of the high temperature medium relative to the low temperature medium.

Although this embodiment is a case of a single-cavity mold, it is obvious that the present invention can also be applied to a multi-cavity mold.

FIG. 8 is a block diagram showing the 40th embodiment of the full-type temperature Ifv4 node device of the present invention. This example is shown in Figures 6 and 7.
As shown in the figure, it is configured as a single-cavity mold. Incidentally, parts that are the same or equivalent to those of the temperature IftA section device shown in FIG. 7 described above are designated by the same reference numerals.

The valves S and (2) of the mold @f adjusting device of this embodiment are controlled by signals output from the control device 5 based on the information of the @degree sensor 11, as in the embodiment shown in FIG. Ru.

Money in this example! ! The feature of the 1@degree adjustment device is the fine adjustment unit 10. The fine adjustment unit IO is arranged between the pressure pump M2 on the high temperature medium side and the cylinder valve group S in the medium circuit. In the slow cooling process of this embodiment, the valve 25 is closed by a signal from the control device 5, and the three-way valve 24b is closed.
is opened, and a closed circuit for the high temperature medium circulating in the input piece 6a via the fine adjustment unit 10 is established.

Further, in this embodiment, in the slow cooling process, the control device f! L
The cylinder valve 26 is opened by the signal from 5. At the same time, a command signal from the control device 5 is sent to the flow rate control valve 2 based on the information from the temperature sensor 11 inside the input piece 6&.
The opening IJj of 7 is controlled by clause 1-A. That is, the slow cooling in this embodiment is performed by controlling the flow rate of the low temperature medium based on information from the temperature sensor 11, thereby adjusting the thermal potential of the low temperature medium relative to the high temperature medium.

Although the present embodiment deals with a single-cavity mold, it is obvious that the present invention can also be applied to a multi-cavity mold.

FIG. 9 is a configuration diagram showing a fifth embodiment of the mold temperature control device of the present invention. This embodiment is constructed as a single-cavity mold similarly to FIGS. 6 to 8.

In each of the first to fourth embodiments described above, the temperature control of the input piece was performed without separating the fixed side and the movable side. However, in order to control the temperature of the input piece more accurately, it is desirable to perform temperature control separately on the fixed side and the movable side. This embodiment has a unique configuration for this purpose. In FIG. 9, parts that are the same or equivalent to those in FIG. 1 described above are indicated by low symbols.

The medium-temperature tank 1m is used to exclusively temperature-regulate the frame 2. The temperature of the cough rack 2 is kept constant (controlled) as in the first to fourth embodiments.

In this embodiment, the movable inserting piece 28m and the fixed inserting piece 28b
Each is configured to be controlled exclusively by the high temperature medium of the high temperature tank lb or the low temperature medium of the low temperature tank le. That is, regarding the input piece 28aK, the high temperature medium is regulated and controlled by the cylinder valve S3 and the flow rate control valve v3, and the low temperature medium is regulated and controlled by the cylinder valve 84 and the flow rate control valve v4. Regarding the fixed input piece 28bK, the high temperature medium is adjusted and controlled by the cylinder valve 81 and the flow rate control valve Vl, and the low temperature medium is controlled by the cylinder valve S2.
and is adjusted and controlled by a flow rate control valve v2.

In addition, in this embodiment, the movable inserting piece 28m and the fixed inserting piece 28b
The slow cooling is carried out in the same manner as in FIG. 1 by a fine adjustment unit 10 configured in the circuit on the low temperature medium side. In addition,
Cylinder valve S3, 84 and flow spear control valve V3. V
4 is based on the observation of the @ba sensor 29m in the movable entering piece 28a, and also the cylinder valves Sl, 82 and the breeding control valve Vl.

v2 is appropriately controlled by a command signal from the control device d15 based on the observation of the temperature 1 sensor 29b in the fixed input piece 28b. This point is the same as in the cases of $1 to fourth embodiment' described in m.

(Effect of the invention) In the present invention, as is clear from one or more U-lights.

A high-temperature tank for storing a high@ medium and a low-temperature tank for storing a low-temperature medium are provided independently, and a 4ILrJ4 unit is provided in the medium circuit of either the valley tank or gold mB, and the high-1 medium is controlled. valves and
By separating and dedicating the valves for controlling the low-temperature medium, the medium circuit, except for a part, is dedicated to high-temperature medium and low-temperature medium.

In addition, in the present invention, the frame is separated from the high-temperature tank and the low-temperature tank! A medium-temperature tank was installed to specifically control the temperature.

As a result, according to the present invention, rapid heating, rapid cooling, slow cooling, etc. can be performed in one system, and rapid heating and rapid cooling can be performed with high efficiency, so that the molding cycle can be shortened. This shortening of the molding cycle results in a significant reduction in power consumption, which makes it possible to reduce the cost of the product.

In addition, as mentioned above, the precision of mold manufacturing control can be improved by separating and dedicating medium circuits for high-temperature media and low-temperature media, and by using a medium-temperature tank dedicated to frame temperature control.
Highly reliable gold! @ [Adjustment device! l! can be expressed.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram showing a first embodiment of the mold temperature control device of the present invention, FIG. 2 is a mold temperature pattern diagram, and FIG.
A configuration diagram showing an example of the fine adjustment unit in Fig. 1, and Fig. 4 are as follows.
FIG. 5 is a configuration diagram showing another example of the fine adjustment unit 1.
II A block diagram showing still another example of the so-called fine adjustment sat, FIG. 6 is a block diagram showing a second embodiment of the mold temperature control Sat of the present invention, and FIG. @gl! FIG. 8 is a block diagram showing the 41st embodiment of the mold temperature control device of the present invention; FIG.
It is a block diagram which shows the 5th Example of the whole mold temperature [control device] of this invention. 1a...medium temperature tank, lb...high temperature tank,
IC...low temperature tank, Ml~M3.20...pressure pump, 5l-88...cylinder valve,
Vl~v8...flow control valve, 2...frame,
6a~6d, 28m, 28b - Entering piece, 4.11・! 1 sensor, 5... control amount,
10...Fine adjustment unit

Claims (6)

[Claims] (1) In a mold temperature control device that controls the temperature of a mold by selectively supplying a high-temperature medium in a high-temperature tank and a low-temperature medium in a low-temperature tank to the mold, a medium circuit for the high-temperature medium is specially formed. a cylinder valve and a flow control valve for forming a dedicated medium circuit for the low temperature medium, and a cylinder valve and a flow control valve for forming a medium circuit exclusively for the low temperature medium, A fine adjustment unit is provided in the medium circuit, and means is provided for making the medium circuit including the fine adjustment unit a closed circuit in which the medium does not return to the tank in the slow cooling process, and the cylinder valve, the flow rate control valve, and the fine adjustment unit are connected to the metal circuit. A mold temperature control device that performs control based on information from a temperature sensor placed in a mold. (2) The mold temperature control device according to claim 1, further comprising a medium circuit that exclusively controls the temperature of the frame of the mold. (3) The fine adjustment unit is comprised of a heater, a cooler, a direction control valve, a flow rate control valve, a pressure pump, and a heat exchanger. Mold temperature control device as described in section. (4) The fine adjustment unit is comprised of a heater, a medium circulating in the closed circuit, and a heat exchanger for exchanging heat of the heater. The residual dust temperature control device according to item 2. (5) The medium circulating in the closed circuit is heated by the heat generated by the pressure pump, and the heated medium is cooled in a fine adjustment unit. Mold temperature control device as described in section. (6) The above-mentioned claim characterized in that the heat exchange in the fine adjustment unit of the medium circulating in the closed circuit is performed using either a high temperature medium or a low temperature medium that does not constitute the closed circuit. The mold temperature control device according to item 1 or 2.