CN115943527A

CN115943527A - Feed structure, antenna and communication equipment

Info

Publication number: CN115943527A
Application number: CN202080103372.0A
Authority: CN
Inventors: 陈亮; 曹菊鹏; 谢国庆; 邸允会; 余彦民
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-09-25
Filing date: 2020-09-25
Publication date: 2023-04-07
Also published as: WO2022061724A1

Abstract

The embodiment of the application discloses feed structure, antenna and communications facilities, this feed structure includes: a dielectric plate including opposing first and second surfaces; the first conductive film is arranged on the first surface of the dielectric plate; a feeding unit disposed on the first surface of the dielectric plate, the feeding unit being configured to feed electricity to the first conductive film; the first protection layer is arranged between the feeding unit and the first conductive film, the first protection layer is made of an insulating material, and the first protection layer is used for separating the feeding unit from the conductive film so that the feeding unit is coupled with the first conductive film. Therefore, the feeding unit and the first conductive film can be separated by the first protective layer, so that the feeding unit can be used for coupling feeding to the first conductive film circuit, and the performance is more stable.

Description

Feed structure, antenna and communication equipment

Technical Field

The embodiment of the application relates to the technical field of communication, in particular to a feed structure, an antenna and communication equipment.

Background

At present, the film antenna is widely applied to the fields of automobile electronics, wireless communication, internet of things and the like. The feeding structure of the film antenna includes: the dielectric device comprises a dielectric plate, a Conductive Film (CF) arranged on the dielectric plate, and a feeding unit used for feeding power to the conductive film.

In the prior art, a feeding unit of the film antenna is generally connected with other parts by adopting a welding mode, however, a conductive film of the film antenna is easily deformed and melted by heat in high-temperature welding, and the performance of the antenna is adversely affected.

Disclosure of Invention

The embodiment of the application provides a feed structure, an antenna and communication equipment, and solves the problem that a film antenna is easy to be subjected to thermal deformation during assembly.

In order to achieve the purpose, the technical scheme is as follows:

in an aspect of the embodiments of the present application, a feeding structure is provided, including: a dielectric plate including first and second opposing surfaces; the first conductive film is arranged on the first surface of the dielectric plate; a feeding unit arranged on the first surface of the dielectric plate and used for feeding electricity to the first conductive film; the first protective layer is arranged between the feeding unit and the first conductive film and used for separating the feeding unit and the first conductive film so that the feeding unit is coupled with the first conductive film. Therefore, the feed unit and the first conductive film can be separated through the first protective layer, so that the feed unit can transmit radio-frequency signals to the first conductive film circuit in a coupling feed mode, the first conductive film is prevented from being heated and deformed and melted when a direct feed mode of welding connection is adopted, and the stability of a feed structure is improved. In addition, the surface is smoother and the first conductive film can be prevented from being oxidized by arranging the first protective layer.

In an optional implementation, the feeding structure further includes: the second conductive film is coupled with the grounding unit, and the second conductive film is coupled with the first conductive film. Therefore, the unstable connection caused by the direct connection of the second conductive film and the second grounding unit is avoided, and the stability of the electric connection is improved.

In an optional implementation manner, the second conductive film is disposed on the second surface of the dielectric plate, and a surface of the second conductive film away from the dielectric plate is covered with a second protective layer. Therefore, the second protective layer can protect the second conductive film and prevent the first conductive film from being oxidized or scratched.

In an alternative implementation, the second conductive film is disposed between the first surface of the dielectric plate and the first conductive film, and a second protective layer is disposed between the second conductive film and the first conductive film. Thus, the second protective layer may separate the second conductive film and the first conductive film such that the second conductive film and the first conductive film are coupled. In addition, the second protective layer is also used for protecting the second conductive film and preventing the first conductive film from being oxidized or scratched.

In an optional implementation manner, a gap is provided on the second conductive film and the second protective layer, and the first conductive film and the first protective layer are disposed in the gap. Therefore, the first conductive film and the first protective layer are arranged in the gap between the second conductive film and the second protective layer, so that the space is saved, and the miniaturization of a product is facilitated. Meanwhile, the surface of the feed structure is more flat.

In an optional implementation manner, the first protection layer or the second protection layer employs: at least one of polyethylene terephthalate film PET, polyimide film PI, cycloolefin polymer film COP/COC, polycarbonate film PC, polyethylene film PE, polyvinyl chloride film PVC, and polyethylene naphthalate film PEN.

In an alternative implementation, the power feeding unit further includes a cable and a mount, the cable including a ground conductor, the mount including: a clamping portion disposed adjacent to the second surface of the dielectric plate; the clamping portion is electrically connected with the grounding conductor, and the second conductive film is coupled with the clamping portion. Thereby, the first conductive film can be coupled to the ground sequentially through the second conductive film, the clamping portion and the ground conductor.

In an alternative implementation manner, the feeding unit includes a feeding sheet, the cable further includes a feeding line electrically connected to the feeding sheet, and the feeding sheet is disposed on a surface of the first protective layer away from the first conductive film; the feeding unit for coupling feeding to the first conductive film includes: the feed line is used for feeding to the feed piece, and the feed piece is used for coupling feeding to the first conductive film. Thereby, the power supply line can couple and supply power to the first conductive film through the power supply tab.

In an optional implementation, the feeding structure further includes: a connecting member; wherein, be equipped with the connecting hole with this connecting piece adaptation on this feed piece, this dielectric-slab, this installed part, this connecting piece wears to locate in the connecting hole of this feed piece, this dielectric-slab and this installed part in proper order, and this connecting piece can be dismantled with this feed piece, this dielectric-slab and this installed part and be connected. Thereby, the first conductive film and the first protective layer between the feeding tab and the dielectric plate are tightly fixed by the feeding tab and the dielectric plate, and the second conductive film and the second protective layer between the mounting member and the dielectric plate are tightly fixed by the mounting member and the dielectric plate. Meanwhile, a detachable connection mode is adopted, and the installation difficulty is reduced.

In an alternative implementation, the feeding sheet includes a third surface adjacent to the first protection layer, and a fourth surface opposite to the third surface; conductors are arranged on the third surface and the fourth surface, the feeder line is electrically connected with the conductors on the fourth surface, and the conductors on the third surface are electrically connected with the conductors on the fourth surface through metallized through holes; wherein the feeding tab for coupling feeding to the first conductive film comprises: the feeding piece is used for coupling feeding to the first conductive film through a conductor arranged on the third surface. Therefore, the feeder line can feed power to the conductor on the fourth surface of the feeder sheet, the feeder sheet can transmit signals to the conductor on the third surface through the metalized through hole and feed power to the first conductive film in a coupling mode through the conductor on the third surface, therefore, the feeder line only needs to be connected with the conductor on the fourth surface of the feeder sheet, and the installation difficulty of the feeder line is reduced.

In an alternative embodiment, the feed line and the ground conductor are arranged coaxially, and an insulating material is arranged between the ground conductor and the feed line. Thus, the feeder line and the ground conductor are coaxially arranged, and space can be saved.

In an alternative implementation, the first conductive film or the second conductive film includes: at least one of metal grids, metal nanowires, carbon nanotubes, graphene and metal oxides.

In a second aspect of the embodiments of the present application, there is provided an antenna, including: a radiating element and a feed structure as described above, the feed structure being electrically connected to the radiating element. Therefore, the antenna adopts the above feeding structure, and has the same technical effects as the feeding structure provided by the foregoing embodiment, and the details are not repeated here.

In a third aspect of the embodiments of the present application, there is provided a communication device, including a radio frequency module and the antenna unit as described above, wherein the radio frequency module and the antenna unit are electrically connected. Therefore, the communication device using the antenna unit has the same technical effect as the feeding structure provided by the foregoing embodiment, and details are not repeated here.

Drawings

Fig. 1 is a schematic structural diagram of a communication device according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of an antenna provided in an embodiment of the present application;

fig. 3 is a schematic disassembled structural diagram of a feed structure provided in the embodiment of the present application;

FIG. 3a is a schematic structural diagram of the feeding structure of FIG. 3;

FIG. 3b is a schematic view of the mounting member of FIG. 3;

FIG. 4 is a top view of the feed structure of FIG. 3;

fig. 5 is a disassembled structural schematic diagram of another feeding structure provided in the embodiment of the present application;

FIG. 5a is a schematic structural diagram of the feeding structure of FIG. 5;

FIG. 5b is a schematic view of the mounting member of FIG. 5;

fig. 6 is a top view of the feed structure of fig. 5.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.

In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

Further, in the present application, directional terms such as "upper" and "lower" are defined with respect to a schematically-disposed orientation of components in the drawings, and it is to be understood that these directional terms are relative concepts that are used for descriptive and clarity purposes and that will vary accordingly with respect to the orientation in which the components are disposed in the drawings.

The term "and/or" in this application is only one kind of association relationship describing the associated object, and means that there may be three kinds of relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

In this application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection or a releasable connection or may be integral; may be directly connected or indirectly connected through an intermediate. Furthermore, the term "coupled connection" may be a connection that enables signal transmission.

Hereinafter, terms that may appear in the embodiments of the present application are explained.

And (3) electrically connecting: it is understood that the conductors of the components are physically and electrically contacted, and the connection between different components in the circuit structure is also understood to be made through physical circuits such as Printed Circuit Board (PCB) copper foils or wires, which can transmit electrical signals.

Coupling: refers to the phenomenon that two or more circuit elements or inputs and outputs of an electrical network do not physically contact each other but affect each other and transfer energy from one side to the other side by interaction.

The embodiment of the application provides a communication device, and as shown in fig. 1, the communication device 0001 comprises an antenna 02, for example.

The communication device 0001 provided by the embodiment of the application can be applied to electronic devices with a wireless communication function, such as cellular base station devices, wireless Local Area Network (WLAN) devices, automotive electronic devices, internet of things (IOT) devices, and the like.

The communication device further includes, for example, a Radio Frequency module, AF module) 03. The rf module 03 is electrically connected to the antenna 02, and the rf module 03 is configured to transmit and receive electromagnetic signals to and from the antenna 02 through the feeding point 01. The antenna 02 radiates electromagnetic waves according to the received electromagnetic signals or transmits electromagnetic signals to the radio frequency module 03 according to the received electromagnetic waves, thereby realizing the transceiving of wireless signals. The radio frequency module (03 is a transceiver and/or receiver, T/R) and other circuits capable of transmitting and/or receiving radio frequency signals.

Referring to fig. 2, fig. 2 is a schematic structural diagram of an antenna according to an embodiment of the present disclosure. As shown in fig. 2, the antenna 02 includes: a feed structure 001 and a radiating element 002.

Wherein, the feeding structure 001 and the radiating element 002 are electrically connected, the feeding structure 001 is used for feeding electricity to the radiating element 002, so that the radiating element 002 radiates or receives electromagnetic waves.

Fig. 3 is a disassembled structural schematic diagram of a feeding structure provided in an embodiment of the present application, and fig. 3a is a structural schematic diagram of the feeding structure in fig. 3. Fig. 3b is a schematic view of the mounting member of fig. 3. Fig. 4 is a top view of the feed structure of fig. 3. As shown in fig. 3, 3a, 3b, and 4, the feeding structure 001 includes: a dielectric plate 10, a first conductive film 20, and a power feeding unit 40.

The dielectric plate 10 includes, for example, a first surface a1 and a second surface a2 opposite to each other. It should be noted that, in fig. 3, the first surface a1 is, for example, an upper surface of the dielectric plate 10, and the second surface a2 is, for example, a lower surface of the dielectric plate 10, wherein the first and second are relative concepts, which may be changed according to a change in the orientation in which the component drawing is placed in the drawing.

The first conductive film 20 is disposed on the first surface a1 of the dielectric plate 10, for example. The first conductive film 20 may be specifically a feeding strip line disposed on the first surface a1, and in combination with the structure of the antenna shown in fig. 2 and the feeding structure shown in fig. 3, the radiation element 002 is disposed on the first surface a1 of the dielectric plate 10 and connected to the first conductive film 20, and the first conductive film 20 may be used to feed power to the radiation element 002.

The material of the dielectric plate 10 is not limited in the embodiments of the present application, and in some embodiments of the present application, the dielectric plate 10 may be polymer, glass, or filled with gas.

The power feeding unit 40 is used for feeding power to the first conductive film 20.

The embodiment of the present application does not limit the material structure of the first conductive film 20, and the material structure of the first conductive film 20 includes: at least one of metal grids, metal nanowires, carbon nanotubes, graphene and metal oxides. When the material structure of the first conductive film 20 is a metal mesh, it may be specifically a copper mesh, a silver mesh, or a nickel alloy mesh, which have better conductivity than other material structures.

In some embodiments, a conductive adhesive or a conductive double-sided tape is used at a contact point between the power feeding unit 40 and the first conductive film 20 to connect and conduct the power feeding unit 40 and the first conductive film 20, but the connection at the contact point is unstable and deterioration of Passive Inter Modulation (PIM) characteristics is likely to occur.

The PIM is characterized in that passive components such as a connector, a feeder line and a filter work under the condition of high-power signals of multiple carrier frequencies, and intermodulation effect is caused by the fact that the components have nonlinearity, and the PIM can cause noise signals. Passive intermodulation arises from a number of factors including: mechanical contact failure, etc.

In other embodiments, the first conductive film 20 is pressed on the power feeding unit 40, and the conductive surface of the first conductive film 20 is electrically connected to the power feeding unit 40. The contact feed mode of direct crimping of the conductive surface is adopted, so that the first conductive film 20 is prevented from being melted due to the adoption of a welding connection mode, and the assembly difficulty of the film antenna is reduced.

However, the flatness of the surface of the feed structure 001 that is directly crimped is not easy to control, and the oxidation prevention effect is not good, so that the feed structure is not suitable for mass production and long-term use.

For this reason, the present embodiment further improves the feeding structure 001.

Referring next to fig. 3, the feeding structure 001 further includes: a first protection layer 201, wherein the first protection layer 201 is located between the power feeding unit 40 and the first conductive film 20, and the first protection layer 201 is made of an insulating material, for example. The first protective layer 201 is used to separate the power feeding unit 40 from the first conductive film 20, so that the power feeding unit 40 and the first conductive film 20 are coupled.

It should be noted that, the perpendicular projection of the feeding unit 40 on the dielectric board 10 intersects with the first conductive film 20, and in operation, the feeding unit 40 can couple and feed power to the first conductive film 20.

The embodiment of the application does not limit the material of the first protection layer 201, and the first protection layer 201 is made of an insulating material, for example. The first protection layer 201 may be made of at least one of polyethylene terephthalate film PET, polyimide film PI, cyclic olefin polymer film COP/COC, polycarbonate film PC, polyethylene film PE, polyvinyl chloride film PVC, and polyethylene naphthalate film PEN.

The first conductive film 20 may be connected to the dielectric sheet 10 by, for example, pressure bonding, and the first protective layer 201 may be connected to the first conductive film by, for example, pressure bonding. The first protective layer 201 may also be used to protect the first conductive film 20 from being oxidized or scratched by the first conductive film 20.

The crimping refers to connection that is generated by mechanically pressing the first conductive film 20 or the first protective layer 201 with a dedicated crimping tool that is manual or automatic.

Therefore, the feeding unit 40 and the first conductive film 20 can be separated by the first protection layer 201, so that the feeding unit 40 can transmit the radio frequency signal to the circuit of the first conductive film 20 in a coupling feeding manner, the performance is more stable, the first conductive film 20 is prevented from being thermally deformed and melted due to the adoption of a welding connection manner, the assembly difficulty of the feeding structure 001 is reduced, and the stability of the feeding structure 001 is improved. In addition, by providing the first protective layer 201, the surface is smoother, and the first conductive film 20 can be prevented from being oxidized.

Further, the feeding structure 001 further includes: a ground unit and a second conductive film 30, wherein the second conductive film 30 is coupled with the ground unit, and the second conductive film 30 is coupled with the first conductive film 20. The structure of the grounding unit is not limited in the embodiments of the present application. In some embodiments of the present application, as shown in fig. 3, the ground unit includes: mount 50 and ground conductor 4022.

The second conductive film 30 is a ground plate disposed on the surface of the dielectric plate 10, and is used for achieving a grounding function. In operation, the second conductive film 30 is coupled to the mounting member 50 of the grounding unit, and grounding can be achieved through the grounding unit.

In some embodiments of the present application, the second conductive film 30 and the first conductive film 20 have the same structure.

The embodiment of the present application does not limit the position of the second conductive film 30. In some embodiments of the present application, as shown in fig. 3, the second conductive film 30 is disposed on the second surface a2 of the dielectric plate 10, and a second protective layer 301 covers a surface of the second conductive film 30 away from the dielectric plate 10.

The second passivation layer 301 may be made of an insulating material, and the second passivation layer 301 is used to protect the second conductive film 30 from being oxidized or scratched by the second conductive film 30.

In the embodiment of the present disclosure, the material of the second passivation layer 301 is not limited, the second passivation layer 301 may be the same as the first passivation layer 201, and the material of the second passivation layer 301 may be at least one of the following materials: polyethylene terephthalate film PET, polyimide film PI, cycloolefin polymer film COP/COC, polycarbonate film PC, polyethylene film PE, polyvinyl chloride film PVC, and polyethylene naphthalate film PEN.

The second protective layer 301 may be connected to the second conductive film 30 by pressure bonding, for example.

In other embodiments of the present application, as shown in fig. 5, the second conductive film 30 is disposed between the first surface a1 of the dielectric plate 10 and the first conductive film 20, and a second protective layer 301 is disposed between the second conductive film 30 and the first conductive film 20.

In this embodiment, the second protection layer 301 is used to separate the second conductive film 30 and the first conductive film 20, so that the second conductive film 30 and the first conductive film 20 are coupled. In addition, the second protective layer 301 also protects the second conductive film 30 from being oxidized or scratched by the second conductive film 30.

In other embodiments of the present application, referring next to fig. 5, the second conductive film 30 is disposed between the first surface a1 of the dielectric board 10 and the first conductive film 20, a second passivation layer 301 is disposed between the second conductive film 30 and the first conductive film 20, a gap 3011 is disposed between the second conductive film 30 and the second passivation layer 301, and the first conductive film 20 and the first passivation layer 201 are disposed in the gap 3011.

Therefore, the first conductive film 20 and the first protective layer 201 are disposed in the gap 3011, which saves more space and improves the flatness of the surface of the feeding structure 001.

In this embodiment, the first conductive film 20 and the second conductive film 30 are both disposed on the first surface a1 of the dielectric plate 10, the gap 3011 is disposed on the second conductive film 30, the first conductive film 20 is disposed in the gap 3011, and the first conductive film 20 may not completely occupy the gap 3011, and the first conductive film 20 is coupled to the second conductive film 30.

The feed structure that this application embodiment provided, this ground connection unit and second conductive film 30 coupled connection avoid adopting welded connected mode to cause second conductive film 30 thermal deformation, melt, have reduced feed structure 001's the equipment degree of difficulty, have improved feed structure 001's stability. In addition, by providing the second protective layer 301, the surface is more flat, and oxidation of the second conductive film 30 can be avoided.

When the grounding unit comprises a mount 50, in some embodiments, the mount 50 comprises: clamping portions, for example, a first clamping portion 51 and a second clamping portion 52 in fig. 3b, are provided near the second surface a2 of the dielectric plate 10.

The specific structure of the mounting member 50 is not limited in the embodiments of the present application, and in some embodiments of the present application, as shown in fig. 3b, the mounting member 50 includes a base 504, and a first clamping portion 51 and a second clamping portion 52 disposed on the base 504.

Wherein, the first clamping portion 51 and the second clamping portion 52 are sequentially disposed along the Y axis, and a groove 505 is disposed between the first clamping portion 51 and the second clamping portion 52, and the second conductive film 30, the second protection layer 301, the feeding sheet 401, and the protrusion adapted to the groove 505 are disposed on the dielectric plate 10, when the second conductive film 30, the second protection layer 301, the feeding sheet 401, and the dielectric plate 10 are assembled with the mounting member 50, the second conductive film 30, the second protection layer 301, the feeding sheet 401, and the protrusion of the dielectric plate 10 are located in the groove 505 formed by the clamping portions, so as to prevent the second conductive film 30, the second protection layer 301, the feeding sheet 401, and the dielectric plate 10 from moving along the Y axis direction relative to the mounting member 50.

The longitudinal cross section (XZ plane) of the first clamping portion 51 and the second clamping portion 52 is an L-shaped structure, the "_" portion 502 of the L-shaped structure is parallel to the X axis for supporting the dielectric board 10, the "_" portion 503 of the L-shaped structure is parallel to the Z axis, and the "_" portion 502 of the L-shaped structure and the "| portion 503 of the L-shaped structure are both protrusions arranged on the base 504. Wherein, the height of the "-" part 503 of the L-shaped structure in the Z-axis direction is larger than that of the "-" part 502 of the L-shaped structure in the Z-axis direction.

The second conductive film 30, the second protection layer 301, the feeding tab 401, and the dielectric board 10 are provided with a recess adapted to the i part 503. After the dielectric board 10 is assembled with the mounting member 50, the i part 503 of the L-shaped structure is located in the second conductive film 30, the second protection layer 301, the feeding tab 401, and the recess of the dielectric board 10, so as to further prevent the dielectric board 10 from moving along the Y-axis direction relative to the mounting member 50.

Wherein, the _ "part 502 of the first and

second clamping parts

51 and 52 is provided with a connecting hole 501 matching with the connecting piece 60 in fig. 3 a.

The I-shaped part 503 of the first clamping part 51 is provided with a groove 506, and the groove 506 is used for fixing the cable 40.

In other embodiments of the present application, as shown in fig. 5 and 5a, the projection of the mounting member 50 on the YZ plane is an "i" shaped structure, and further, as shown in fig. 5b, the mounting member 50 includes a base 504, and a first clamping portion 51 and a second clamping portion 52 disposed on the base 504.

The mount 50 of figure 5b adds a first top plate 507 and a second top plate 508 to the mount 50 of figure 3b described above.

The first top plate 507 is disposed on top of the first clamping portion 51, and the second top plate 508 is disposed on top of the second clamping portion 52.

The first clamping portion 51 and the second clamping portion 52 are sequentially disposed along the Y axis, a groove 505 is disposed between the first clamping portion 51 and the second clamping portion 52, and the second conductive film 30, the second protection layer 301, the feeding sheet 401, and the protrusion adapted to the groove 505 are disposed on the dielectric plate 10, when the second conductive film 30, the second protection layer 301, the feeding sheet 401, and the dielectric plate 10 are assembled with the mounting member 50, the second conductive film 30, the second protection layer 301, the feeding sheet 401, and the protrusion of the dielectric plate 10 are located in the groove 505 formed by the clamping portions, so as to prevent the second conductive film 30, the second protection layer 301, the feeding sheet 401, and the dielectric plate 10 from moving along the Y axis direction relative to the mounting member 50.

The longitudinal cross section (XZ plane) of the first clamping portion 51 and the second clamping portion 52 is an L-shaped structure, the "_" portion of the L-shaped structure is parallel to the X axis for supporting the dielectric board 10, the "_" portion of the L-shaped structure is parallel to the Z axis, and the "_" portion of the L-shaped structure are both protrusions disposed on the base 504. Wherein, the height of the I part of the L-shaped structure in the Z-axis direction is larger than that of the I part of the L-shaped structure in the Z-axis direction.

The first top plate 507 is disposed on top of an "_" portion of the first clamping portion 51, and is parallel to the "_" portion of the first clamping portion 51. The second top plate 508 is disposed on top of an "_" portion of the second clamping portion 52 and is parallel to the "_" portion of the second clamping portion 52.

The first top plate 507 and the second top plate 508 are both provided with a connecting hole 5011, and the first clamping portion 51 and the second clamping portion 52 are provided with a connecting hole 501.

In addition, a groove 506 is formed on the first top plate 507, and the groove 506 is used for fixing the cable 40.

The ground conductor 4022 is electrically connected to the clamping portion, the clamping portion is coupled to the second conductive film 30, and the second conductive film 30 is coupled to the first conductive film 20 and the radiating element 002. The radiating element 002 may be coupled to ground through the second conductive film 30, the mount 50, and the ground conductor 4022.

The structure of the feeding unit 40 is not limited in the embodiments of the present application. In some embodiments of the present application, the feeding unit 40 includes: feed tab 401 and feed line 4021.

The power feed line 4021 is electrically connected to the power feed tab 401, the power feed tab 401 is disposed on a side of the first protective layer 201 away from the first conductive film 20, the power feed line 4021 is used for feeding power to the power feed tab 401, and the power feed tab 401 is used for coupling and feeding power to the first conductive film 20.

The present application does not limit the structures of the power feeding line 4021 and the ground conductor 4022, and the power feeding line 4021 and the ground conductor 4022 may be in the form of a coaxial line, a metal sheet, a strip line, a flat cable, or the like.

In some embodiments of the present application, the power feeding line 4021 and the ground conductor 4022 are coaxially disposed, in which the ground conductor 4022 is disposed outside the power feeding line 4021, and an insulating material is disposed between the ground conductor 4022 and the power feeding line 4021.

The embodiment of the present application does not limit the specific structure of the feeding sheet 401. In some embodiments of the present application, as shown in fig. 3, the feeding tab 401 is a Printed Circuit Board (PCB), and the feeding tab 401 includes a third surface a3 close to the first protection layer 201 and a fourth surface a4 opposite to the third surface a3 of the feeding tab 401.

For example, a conductor 4012 is disposed on each of the third surface a3 and the fourth surface a4 of the feed tab 401, the feed line 4021 is electrically connected to the conductor 4012 on the fourth surface a4 of the feed tab 401, and the conductor 4012 on the third surface a3 of the feed tab 401 is electrically connected to the conductor 4012 on the fourth surface a4 of the feed tab 401 through a metalized via.

The power supply line 4021 is configured to supply power to the power supply tab 401, and the power supply tab 401 is configured to couple and supply power to the first conductive film 20 through the conductor 4012 disposed on the third surface a3 of the power supply tab 401.

The shape of the conductor 4012 is not limited in the embodiment of the present application, and the shape of the surface of the conductor may be various patterns such as a circle, a square, and a ring.

The power feeding wire 4021 is connected to the power feeding tab 401 by welding, and the ground conductor 4022 is connected to the mounting device 50 by welding.

In some embodiments of the present application, the feeding structure 001 further comprises: a connecting member 60.

Wherein, be equipped with on this feed piece 401 with the first connecting hole 4011 of this connecting piece 60 adaptation, be equipped with on this medium plate 10 with the second connecting hole 101 of this connecting piece 60 adaptation, be equipped with on this installed part 50 with the third connecting hole 501 of this connecting piece 60 adaptation, this connecting piece 60 wears to locate in first connecting hole 4011, second connecting hole 101 and the third connecting hole 501 in proper order, this connecting piece 60 can dismantle with this feed piece 401, this medium plate 10 and this installed part 50 and be connected.

The connecting member 60 may be a screw for fastening the feed tab 401, the dielectric sheet 10 and the mounting member 50. The screws may be of metal, plastic or other form of compression fitting construction.

In the present embodiment, the mounting member 50 and the feeding tab 401 are fixed to the dielectric sheet 10 by the connecting member 60, the first conductive film 20 and the first protective layer 201 are sandwiched between the feeding tab 401 and the dielectric sheet 10, and the second conductive film 30 and the second protective layer 301 are sandwiched between the mounting member 50 and the dielectric sheet 10.

The following describes the feeding structure 001 provided in the present application in detail with reference to the first example and the second example.

Example one:

as shown in fig. 3, 3a, 3b, and 4, the feeding structure 001 includes: the feed sheet 401, the first protective layer 201, the first conductive film 20, the dielectric sheet 10, the second conductive film 30, and the second protective layer 301 are stacked in the Z-axis direction.

In one implementation, the first conductive film 20 is pressed against the first surface a1 of the dielectric sheet 10, and the first protective layer 201 is pressed against the first conductive film 20.

The first conductive film 20 is disposed at an intermediate position of the first surface a1, the length of the first conductive film 20 in the X direction is the same as the length of the dielectric plate 10, and the width of the first conductive film 20 in the Y direction is smaller than the width of the dielectric plate.

In one implementation, the second conductive film 30 is disposed on the second surface a2 of the dielectric plate 10, and the second protective layer 301 is pressed against the second conductive film 30.

The second conductive film 30 completely covers the second surface a2, the length of the second conductive film 30 in the X direction is equal to the length of the dielectric plate 10, and the width of the second conductive film 30 in the Y direction is equal to the width of the dielectric plate.

The first protection layer 201 is located between the power feeding unit 40 and the first conductive film 20, and the first protection layer 201 is made of an insulating material, for example. The first protective layer 201 is used to separate the power feeding unit 40 from the first conductive film 20, so that the power feeding unit 40 and the first conductive film 20 are coupled.

The second passivation layer 301 may be made of an insulating material, and the second passivation layer 301 is used to protect the second conductive film 30 from being oxidized or scratched by the first conductive film 20.

In one implementation, the feeding structure 001 further includes: the connecting members 60 and the mounting members 50 provided near the second surface a2 of the dielectric sheet 10 are 2 connecting members 60 as shown in fig. 3.

The feeding plate 401 is provided with a first connection hole 4011 adapted to the connection member 60, the dielectric plate 10 is provided with a second connection hole 101 adapted to the connection member 60, and the mounting member 50 is provided with a third connection hole 501 adapted to the connection member 60. In assembling, the connecting member 60 is sequentially inserted into the first connecting hole 4011, the second connecting hole 101, and the third connecting hole 501, so that the first conductive film 20 and the first protective layer 201 between the mounting member 50 and the dielectric plate 10 are tightly fixed by the feeding tab 401 and the dielectric plate 10, and the second conductive film 30 and the second protective layer 301 between the mounting member 50 and the dielectric plate 10 are tightly fixed by the mounting member 50 and the dielectric plate 10.

In one implementation, the connecting member 60 is a bolt, the first connecting hole 4011, the second connecting hole 101 and the third connecting hole 501 are bolt holes adapted to the bolt, and the connecting member 60 is detachably connected to the first connecting hole 4011, the second connecting hole 101 and the third connecting hole 501 through a thread.

Referring next to fig. 3, the feeding structure 001 further includes: cable 40, cable 40 includes: the method comprises the following steps: a power feeding line 4021 and a ground conductor 4022 which are coaxially provided, wherein the power feeding line 4021 is electrically connected to the power feeding tab 401, the power feeding line 4021 is used for feeding power to the power feeding tab 401, and the power feeding tab 401 is used for coupling power feeding to the first conductive film 20. The ground conductor 4022 is electrically connected to the mounting member 50, and the second conductive film 30 is coupled to the holding portion of the mounting member 50.

The feed tab 401 includes a third surface a3 adjacent to the first protective layer 201, and a fourth surface a4 opposite to the third surface a3 of the feed tab 401.

For example, each of the third surface a3 and the fourth surface a4 of the feed tab 401 is provided with a conductor 4012, the feed line 4021 is electrically connected to the conductor 4012 on the fourth surface a4 of the feed tab 401, and the conductor 4012 on the third surface a3 of the feed tab 401 is electrically connected to the conductor 4012 on the fourth surface a4 of the feed tab 401 through a metalized via.

In operation, the power feeding line 4021 may transmit a radio frequency signal to the power feeding pad 401, and since the first protection layer 201 is disposed between the power feeding pad 401 and the first conductive film 20 and the first protection layer 201 is insulated, the power feeding pad 401 may transmit the radio frequency signal to the circuit of the first conductive film 20 by coupling power feeding. In addition, the mounting member 50 is grounded through the ground conductor 4022, the second conductive film 30 is coupled to the mounting member 50, and the first conductive film 20 is coupled to the second conductive film 30, so that the first conductive film 20 can be coupled to the ground.

From this, feed structure 001 passes through the connecting piece and can dismantle each part structure and connect, has realized the feed mode of coupling and the ground connection mode of coupling, compares with connection modes such as adopting conducting resin, and connection performance is more stable, avoids adopting welded connection mode to cause first conducting film 20 thermal deformation, melt simultaneously. The equipment degree of difficulty of feed structure 001 has been reduced, the stability of feed structure 001 has been improved, in addition. By providing the first protective layer 201 with a smoother surface, oxidation of the first conductive film 20 can also be avoided.

Example two:

as shown in fig. 5, 5a, 5b, and 6, the feeding structure 001 includes: the feeding sheet 401, the second protective layer 301, the second conductive film 30, and the dielectric plate 10 are stacked in the Z-axis direction. A gap 3011 is formed between the second protection layer 301 and the second conductive film 30, the first conductive film 20 and the first protection layer 201 are located in the gap 3011, the first conductive film 20 does not completely occupy the gap 3011, and the first conductive film 20 is coupled to the second conductive film 30.

In one implementation, the second conductive film 30 is disposed on the first surface a1 of the dielectric plate 10, and the second protective layer 301 is pressed against the second conductive film 30.

The length of the second conductive film 30 in the X direction is equal to the length of the dielectric sheet 10, and the width of the second conductive film 30 in the Y direction is equal to the width of the dielectric sheet.

The second protective layer 301 and the second conductive film 30 are provided with a gap 3011 at an intermediate position in the Y direction, the first conductive film 20 and the first protective layer 201 are positioned in the gap 3011, the first conductive film 20 is pressed against the first surface a1 of the dielectric sheet 10, and the first protective layer 201 is pressed against the first conductive film 20. The widths of the first conductive film 20 and the first protective layer 201 in the Y direction are smaller than the width of the gap 3011.

The second protective layer 301 is used to separate the second conductive film 30 from the first conductive film 20, so that the second conductive film 30 and the first conductive film 20 are coupled. In addition, the second protective layer 301 also protects the second conductive film 30 from being oxidized or scratched by the first conductive film 20.

In one implementation, the feeding structure 001 further includes: the connecting members 60 and the mounting members 50 provided near the second surface a2 of the medium plate 10 are 2 connecting members 60 as shown in fig. 5.

The feeding plate 401 is provided with a first connection hole 4011 adapted to the connection member 60, the dielectric plate 10 is provided with a second connection hole 101 adapted to the connection member 60, and the mounting member 50 is provided with a third connection hole 501 adapted to the connection member 60. In assembling, the connecting member 60 is sequentially inserted into the first connecting hole 4011, the second connecting hole 101, and the third connecting hole 501, so that the first conductive film 20 and the first protective layer 201 between the feeding tab 401 and the dielectric plate 10 are tightly fixed by the feeding tab 401 and the dielectric plate 10, and the second conductive film 30 and the second protective layer 301 between the mounting member 50 and the dielectric plate 10 are tightly fixed by the mounting member 50 and the dielectric plate 10.

Referring next to fig. 5, the feeding structure 001 further includes: cable 40, cable 40 includes: the method comprises the following steps: a power feeding line 4021 and a ground conductor 4022 which are coaxially provided, wherein the power feeding line 4021 is electrically connected to the power feeding tab 401, the power feeding line 4021 is used for feeding power to the power feeding tab 401, and the power feeding tab 401 is used for coupling power feeding to the first conductive film 20. The ground conductor 4022 is electrically connected to the mounting member 50, and the second conductive film 30 is coupled to the holding portion of the mounting member 50.

The feeding tab 401 includes a third surface a3 adjacent to the first protection layer 201, and a fourth surface a4 opposite to the third surface a3 of the feeding tab 401.

In operation, the power feed line 4021 can transmit a radio frequency signal to the power feed tab 401, and since the first protective layer 201 is disposed between the power feed tab 401 and the first conductive film 20 and the first protective layer 201 is insulated, the power feed tab 401 can transmit the radio frequency signal to the circuit of the first conductive film 20 by coupling feeding. In addition, the mounting member 50 is grounded through the ground conductor 4022, the second conductive film 30 is coupled to the mounting member 50, and the first conductive film 20 is coupled to the second conductive film 30, so that the first conductive film 20 can be coupled to the ground through the second conductive film 30, the mounting member 50, and the ground conductor 4022.

In the feeding structure 001 of this example, the first conductive film 20 and the first protection layer 201 are disposed in the gap 3011 between the second conductive film 30 and the second protection layer 301, which is more space-saving and beneficial to miniaturization of the product. Meanwhile, the surface of the feed structure 001 is made smoother.

The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

A feed structure, comprising:

a dielectric plate comprising opposing first and second surfaces;

the first conductive film is arranged on the first surface;

a feeding unit provided on the first surface, the feeding unit being configured to feed electricity to the first conductive film;

a first protective layer provided between the feeding unit and the first conductive film, the first protective layer for separating the feeding unit and the first conductive film;

wherein the power feeding unit is coupled to the first conductive film.
The feed structure of claim 1, further comprising: the second conductive film is coupled with the grounding unit, and the second conductive film is coupled with the first conductive film.
The feeding structure of claim 2, wherein the second conductive film is disposed on the second surface of the dielectric plate, and a second protection layer covers a surface of the second conductive film away from the dielectric plate.
The feed structure according to claim 2, wherein the second conductive film is provided between the first surface and the first conductive film, and a second protective layer is provided between the second conductive film and the first conductive film.
The feed structure according to claim 4, wherein the second conductive film and the second protective layer are provided with a gap, and the first conductive film and the first protective layer are provided in the gap.
The feed structure of any of claims 3-5, wherein the first or second protective layer employs: at least one of polyethylene terephthalate film PET, polyimide film PI, cycloolefin polymer film COC, polycarbonate film PC, polyethylene film PE, polyvinyl chloride film PVC, and polyethylene naphthalate film PEN.
The feed structure of any of claims 2-6, wherein the ground element comprises a ground conductor and a mount, the mount comprising: a clamping portion disposed proximate to the second surface;

the grounding conductor is electrically connected with the clamping part, and the clamping part is coupled with the second conductive film.
The feed structure of claim 7, wherein the feed unit includes a feed line, the feed line and the ground conductor are coaxially disposed, and an insulating material is disposed between the ground conductor and the feed line.
The feeding structure according to claim 8, wherein the feeding unit further includes a feeding tab electrically connected to the feeding line, the feeding tab being provided on a surface of the first protective layer away from the first conductive film;

the feeding unit is configured to couple and feed the first conductive film, and includes: the feed line is used for feeding to the feed sheet, and the feed sheet is used for coupling feeding to the first conductive film.
The feed structure of claim 9, further comprising: a connecting member;

the feeding piece, the dielectric plate and the mounting piece are provided with connecting holes matched with the connecting pieces, the connecting pieces sequentially penetrate through the connecting holes of the feeding piece, the dielectric plate and the mounting piece, and the connecting pieces are detachably connected with the feeding piece, the dielectric plate and the mounting piece.
The feed structure of claim 9 or 10, wherein the feed tab comprises a third surface adjacent to the first protective layer, and a fourth surface opposite the third surface;

conductors are arranged on the third surface and the fourth surface, the feeder line is electrically connected with the conductors on the fourth surface, and the conductors on the third surface are electrically connected with the conductors on the fourth surface through metalized through holes;

wherein the feeding tab for coupling feeding to the first conductive film includes: the feeding piece is used for coupling feeding to the first conductive film through a conductor arranged on the third surface.
The feed structure according to any one of claims 2 to 11, wherein the first conductive film or the second conductive film employs: at least one of metal grids, metal nanowires, carbon nanotubes, graphene and metal oxides.
An antenna, characterized in that the antenna comprises: a radiating element and a feed structure as claimed in any one of claims 1 to 12.
A communication device comprising a radio frequency module and an antenna according to claim 13, wherein the radio frequency module and the antenna element are electrically connected.