CN115942777A - Packaging structure and display device - Google Patents
Packaging structure and display device Download PDFInfo
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- CN115942777A CN115942777A CN202310065943.1A CN202310065943A CN115942777A CN 115942777 A CN115942777 A CN 115942777A CN 202310065943 A CN202310065943 A CN 202310065943A CN 115942777 A CN115942777 A CN 115942777A
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- organic gas
- gas adsorbent
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Abstract
The invention provides a packaging structure and a display device, wherein the packaging structure comprises a substrate, a cover plate and a packaging body arranged between the substrate and the cover plate, the packaging body comprises a body and an organic gas adsorbent existing in the body, organic gas can be adsorbed by the organic gas adsorbent, holes in the packaging body are avoided, and the packaging effect is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a packaging structure and a display device.
Background
Organic Light Emitting Diodes (OLEDs) have the characteristics of self-luminescence, are widely used, and are necessary to package the devices in order to improve the performance such as the service life of the devices, however, holes are generated in the conventionally formed package body, which affects the packaging effect.
Disclosure of Invention
The invention provides a packaging structure and a display device, which can avoid the generation of holes in a packaging body and improve the packaging effect.
In one aspect of the present invention, a package structure is provided, which includes a substrate, a cover plate, and a package body disposed between the substrate and the cover plate, wherein the package body includes a body and an organic gas adsorbent present in the body.
In some embodiments of the invention, the mass ratio of the body to the organic gas adsorbent is 1: (0.25-0.55).
In some embodiments of the invention, the body comprises a glass body.
In some embodiments of the invention, the organic gas adsorbent comprises a carbon material.
In some embodiments of the invention, the organic gas adsorbent comprises biochar and/or activated carbon.
In some embodiments of the invention, the organic gas adsorbent is a porous structure.
In some embodiments of the invention, the organic gas adsorbent has a pore size of 0.35nm to 0.9nm.
In some embodiments of the present invention, the organic gas adsorbent is uniformly distributed in a direction from the substrate to the cover plate, or the mass percentage of the organic gas adsorbent is decreased in a direction from the substrate to the cover plate.
In some embodiments of the invention, the package includes a first region in contact with the substrate, the organic gas sorbent being present in the first region; the thickness of the packaging body in the direction from the substrate to the cover plate is H1, the thickness of the first area in the direction from the substrate to the cover plate is H2, and H2/H1 is more than or equal to 1/3 and less than or equal to 1.
In some embodiments of the present invention, the organic gas adsorbent is present in the body in a manner including the following manner 1 and/or manner 2: mode 1: the organic gas adsorbent is present independently in the body; mode 2: a support material is present in the body, and the organic gas adsorbent is present in the support material.
In some embodiments of the invention, a bearing material layer containing the bearing material is present in the body, the bearing material layer is in contact with the substrate, the thickness of the package body in the direction from the substrate to the cover plate is H1, the thickness of the bearing material layer in the direction from the substrate to the cover plate is H2, and 1/3 ≦ H2'/H1' ≦ 1.
In some embodiments of the invention, the carrier material comprises a resinous material, preferably the resinous material comprises an epoxy resin.
In some embodiments of the present invention, the substrate includes a non-organic layer and a planarization layer stacked in a direction from the substrate to the cover plate, the planarization layer includes a groove exposing the non-organic layer, and the package is connected to the non-organic layer exposed through the groove.
In another aspect of the present invention, a display device is provided, which includes the above package structure.
In the packaging structure provided by the invention, the organic gas adsorbent is arranged in the packaging body packaged between the cover plate and the substrate, so that organic gas generated due to the properties of materials and the like can be adsorbed in the packaging process of the packaging structure, thereby avoiding the formation of holes in the packaging body due to the generation of the organic gas, further improving the structural strength and stability of the packaging body and improving the packaging effect.
Drawings
Fig. 1 is a schematic diagram of a package structure according to an embodiment of the invention;
FIG. 2 is a diagram of a package structure according to another embodiment of the present invention;
FIG. 3 is a diagram of a package structure according to another embodiment of the present invention;
FIG. 4 is a schematic diagram of a structure for creating holes in a package.
Description of reference numerals:
1: a substrate;
2: a cover plate;
3: a package body;
31: a body;
32: an organic gas adsorbent;
33: a carrier material;
311: a first region;
312: a second region;
AA: a display area;
h1: a thickness of the package in a second direction;
h2': the thickness of the receiving material layer;
arrow x: a first direction;
arrow Y: a second direction.
Detailed Description
In order that those skilled in the art will better understand the aspects of the present invention, the following examples are provided for further details. The following detailed description is merely illustrative of the principles and features of the present invention, and the examples are intended to be illustrative of the invention and not limiting of the scope of the invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative effort belong to the protection scope of the present invention.
In order to improve the performance such as the service life of the device, it is necessary to package the device, however, holes are generated in the conventionally formed package body, which affects the packaging effect.
According to the long-term research of the inventor, during the process of encapsulating the cover plate and the substrate, it is generally required to etch away the outermost film layer on the side of the substrate facing the cover plate (Encap), so as to place the encapsulating material at the groove formed after etching, and then to perform molding to form an encapsulating body connecting the substrate and the cover plate.
However, due to the influence of factors such as an etching process, the outermost film layer on the side of the substrate facing the cover plate is usually not completely etched, and the organic material remains in the groove, and during a packaging process (such as a Frit sintering process described below), the organic material may form organic gas, which may cause a hole in the package, affect a packaging effect, for example, cause a strength deterioration of the package, and during production, transportation, a screen test, or the like, may also cause phenomena such as a rupture of the screen along the package, a dropping of the package (Frit), and the like, which may affect the lifetime and performance of the device.
For example, in a process of packaging a display screen (especially a hard screen) by using a Frit (Frit), it is generally required to etch away an outermost film layer on a side of a substrate facing a cover plate, so as to place the Frit in a groove formed after etching, and then sinter the Frit by using a laser or the like, so that the Frit forms a glass body packaged between the substrate and the cover plate, thereby completing the packaging of a light emitting device.
In the Frit sintering process, the organic material is vaporized into a gas state due to the heat generated by sintering, which further causes a large number of holes (as shown in fig. 4) to be generated inside the sintered and molded glass body, which affects the encapsulation effect of the glass body, for example, the strength of the glass body is deteriorated, and during the production, transportation, and screen testing, the phenomena of breaking along the glass body, falling off (Frit peeling) of the glass body, and the like are also generated, which affects the lifetime and performance of the device.
In view of the above problem, the embodiment of the present invention provides a package structure, which includes a substrate 1, a cover plate 2, and a package 3 disposed between the substrate 1 and the cover plate 2, wherein the package 3 includes a body 31 and an organic gas adsorbent 32 present in the body 31.
Like this, in packaging structure's packaging process, can adsorb the produced organic gas because reasons such as the nature of material to avoid leading to forming the hole in the packaging body 3 because of organic gas's production, and then improve packaging body 3's structural strength and stability, improve the encapsulation effect.
Generally, the content of the organic gas adsorbent 32 in the package 3 is too small, so that the adsorption capacity for the organic gas is limited, and if the content of the organic gas adsorbent 32 is too large, the strength of the body 31 is also affected to some extent, and in consideration of these factors, in some preferred embodiments, the mass ratio of the body 31 to the organic gas adsorbent 32 may be 1: (0.25 to 0.55), for example, 1.25, 1.3, 1.
Specifically, the body 31 may include a glass body, and specifically, may be a glass body sintered by Frit.
In specific implementation, the organic gas adsorbent 32 may be doped into the Frit, then the Frit containing the organic gas adsorbent 32 is placed in a preset region between the substrate 1 and the cover plate 2, and then the Frit containing the organic gas adsorbent 32 is sintered in a laser sintering manner, so that the Frit is sintered and molded to form a glass body, wherein in the sintering process, the organic gas formed by vaporizing the organic material in the structures of the substrate 1 and the like is adsorbed by the organic gas adsorbent 32, so that the generation of holes in the formed glass body can be reduced, the strength and stability of the glass body can be further improved, and the encapsulation effect can be improved.
The organic gas absorbent 32 is used for absorbing organic gas, and generally has a porous structure and a large specific surface area, and in some embodiments, the pore diameter of the organic gas absorbent 32 may be 0.35nm to 0.9nm, such as 0.35nm, 0.4nm, 0.5nm, 0.55nm, 0.6nm, 0.65nm, 0.7nm, 0.75nm, 0.8nm, 0.85nm, 0.9nm, or any combination thereof, so as to facilitate the doping of the organic gas absorbent 32 in the body 31 for absorbing organic gas.
Specifically, the organic gas adsorbent 32 may include a porous carbon material, including, for example, biochar and/or activated carbon.
The organic gas adsorbent 32 may be specifically in a granular form, and may be uniformly distributed in a direction from the substrate 1 to the cover plate 2 (a second direction indicated by an arrow Y in fig. 1 to fig. 3) (as shown in fig. 1 and fig. 2), or its content tends to decrease in the second direction (as shown in fig. 3), that is, the content of the organic gas adsorbent 32 in the region of the package 3 close to the substrate 1 is higher than the content of the organic gas adsorbent 32 in the region of the package 3 close to the cover plate 2, which is relatively more favorable for adsorbing organic gas generated due to organic matters in the substrate 1, and also reduces the content of the organic gas adsorbent 32 in the body 31, further improving the strength of the package 3, and improving the packaging effect.
The mass percentage of the organic gas adsorbent 32 in the second direction is decreased, and specifically may be decreased uniformly and gradually, or may be decreased in a gradient manner, or may be decreased uniformly and gradually in a partial region, decreased in a gradient manner in a partial region, or in other regular or irregular decreasing tendencies.
The mass percentage of the organic gas adsorbent 32 means that the mass ratio of the organic gas adsorbent 32 to the package is decreased in the second direction, and specifically, the mass percentage of the organic gas adsorbent 32 is decreased in the second direction, that is, the organic gas adsorbent 32 is decreased in the region closer to the cover plate 2 and the organic gas adsorbent 32 is increased in the region closer to the substrate 1 in the package. In some embodiments, the package 3 includes a first region 311 in contact with the substrate 1, the organic gas adsorbent 32 being present in the first region 311; the thickness of the package 3 along the second direction is H1 (i.e. the height of the package 3 is H1 based on the surface of the substrate 1 facing the cover 2), the thickness of the first region 311 along the second direction is H2 (i.e. the height of the first region 311 is H2 based on the surface of the substrate 1 facing the cover 2), and 1/3 is equal to or greater than H2/H1 is equal to or less than 1.
Illustratively, H2/H1 is, for example, 1/3, 1/2.5, 1/2, 1/1.5, 1, or a range of any two compositions therebetween.
Illustratively, as shown in fig. 1 and 2, the organic gas adsorbent 32 is uniformly distributed in the first region 311 along the second direction, H2/H1=1, so that the organic gas adsorbent 32 is uniformly distributed in the second direction.
Illustratively, as shown in FIG. 3, 1/3 ≦ H2/H1 < 1, the package 3 further includes a second region 312 between the first region 311 and the cover 2, the organic gas adsorbent 32 is entirely present in the first region 311, and the organic gas adsorbent 32 is absent in the second region 312.
Without being limited thereto, in other embodiments, the organic gas adsorbent 32 may also be present in the second region 312, i.e. a portion of the organic gas adsorbent 32 is present in the first region 311, and the remaining portion of the organic gas adsorbent 32 is present in the second region 312, and the content of the organic gas adsorbent 32 in the first region 311 and the second region 312 may be the same or different, and it is generally preferred that the content of the organic gas adsorbent 32 in the first region 311 is greater than the content of the organic gas adsorbent 32 in the second region 312.
Wherein, in the second direction, the organic gas adsorbent 32 may be uniformly distributed in the first region 311, or may have a decreasing content; when the organic gas adsorbent 32 is contained in the second region 312, the organic gas adsorbent 32 may be uniformly distributed in the second region 312, or may be contained in a decreasing tendency.
Specifically, the direction along the substrate 1 to the cover 2 is a second direction indicated by an arrow Y in fig. 1 to 3, which is parallel to the thickness direction of the cover 2, the thickness direction of the substrate 1, and the thickness direction of the package structure.
Further, the organic gas adsorbent 32 may be uniformly or non-uniformly distributed in a first direction (a first direction indicated by an arrow X in fig. 1 to 3) perpendicular to a second direction, which is, for example, a length direction or a width direction of the package structure.
Further, the manner in which the organic gas adsorbent 32 is present in the body 31 includes the following manner 1 and/or manner 2: mode 1: the organic gas adsorbent 32 is independently present in the body 31; mode 2: the support material 33 is present in the body 31, and the organic gas adsorbent 32 is present in the support material 33.
Specifically, in mode 2, the organic gas adsorbent 32 is supported on the support material 33, and the support material 33 on which the organic gas adsorbent 32 is supported is present in the body 31, thereby achieving the presence of the organic gas adsorbent 32 in the body 1.
In addition, in the mode 1, the organic gas adsorbent 32 is independently present in the body 31 means that the organic gas adsorbent 32 is directly distributed in the body 31 and directly contacts with the body 31, rather than being loaded on a carrier material and then distributed in the body, and in the specific implementation, the organic gas adsorbent may be mixed in the body material (such as Frit), and then placed in a predetermined region between the substrate and the cover plate, and the body 31 is formed after molding. Among them, the organic gas adsorbent 32 may be present in the body 31 in the manner 1 entirely (as shown in fig. 1), or in the body 31 in the manner 2 entirely (as shown in fig. 2 and 3), or in the body 31 in the manner 1 partially, and in the body 31 in the manner 2 partially.
In contrast, the carrier material 33 is more favorably dispersed in the body 31, and the organic gas adsorbent 32 is present in the carrier material 33, so that the organic gas adsorbent 32 is more favorably dispersed in the body 31, for example, the organic gas adsorbent 32 in the first region 311 is more uniformly dispersed.
Specifically, the organic gas is present in the support material 33, which is composited with the support material 33, the support material 33 is present on the surface of the organic gas adsorbent 32, and the support material 33 has pores, which may include a resin-like material, including, for example, an epoxy resin.
In specific implementation, the organic gas adsorbent 32 may be doped in the carrier material 33, and the two materials are combined to form a material in a block shape or a layer shape, and then the material is further mixed in the material (e.g., frit) of the body 31, and then the material of the body 31 is placed in a predetermined region between the substrate 1 and the cover plate 2, and is sintered and molded by a laser sintering method, so as to form the package 3.
The support material 33 may be formed as a layered support material layer, which is located in the body 31, or the support material 33 may be formed as a dispersed material having a size larger than that of the organic gas adsorbent 32 in a block or granular shape or the like, so as to be uniformly or non-uniformly dispersed in the body 31.
In some embodiments, a layer of carrier material containing a carrier material 33 is present in the body 31, the layer of carrier material being in contact with the substrate 1, the layer of carrier material having an organic gas adsorbent 32 present therein.
Specifically, the bearing material layer is located in the first region 311, and the thickness of the bearing material layer in the second direction is H2',1/3 ≦ H2'/H1 ≦ 1, wherein H2'/H1 is, for example, 1/3, 1/2.5, 1/2, 1/1.5, 1, or a range of any two combinations therebetween.
Specifically, the first regions 311 may all be a carrier material layer, and the organic gas adsorbent 32 in the body 31 is all present in the carrier material layer (as shown in fig. 2 and 3), accordingly, the thickness H2 'of the carrier material layer in the second direction is equal to the thickness H2 of the first regions 311 (i.e., H2' = H2); alternatively, a partial region of the first region 311 is a support material layer, a part of the organic gas adsorbent 32 is present in the remaining region of the first region 311 excluding the support material layer, and the organic material adsorbent in the remaining region of the first region 311 excluding the support material layer may be present independently (i.e., not complexed with the support material) or in a bulk or particulate dispersed material formed of the support material.
Specifically, the number of the support material layers may be one or more, for example, two (as shown in fig. 2 and 3), and when there are a plurality of support material layers, the plurality of support material layers are distributed along the first direction, specifically, are arranged at intervals in the first direction, and each support material layer has the organic gas adsorbent 32 distributed therein.
Specifically, the organic gas adsorbent 32 may be uniformly distributed in the bearing material layer, or the content of the organic gas adsorbent 32 in the bearing material layer is in a decreasing trend along the second direction, and when there are a plurality of bearing material layers, the distribution manner of the organic gas adsorbent 32 in the plurality of bearing material layers may be the same or different.
In particular, when there are a plurality of layers of the carrier material, the thickness H2' of these layers of carrier material in the second direction may be the same or different.
In addition, as shown in fig. 1 to 3, the substrate 1, the package body 3, and the cover plate 2 are enclosed to form a sealed cavity, and the package structure includes a display area AA located in the sealed cavity.
Specifically, in the first direction, the package bodies 3 are respectively disposed on two opposite sides of the package structure, and the organic gas adsorbent 32 is disposed in each package body 3, so that the substrate 1, the package body 3 on one side, the cover plate 2, the package body 3 on the other side, and the substrate 1 are sequentially connected to form a sealed cavity.
The display area AA may include a light emitting stack, which may specifically include an organic electroluminescent stack, that is, an OLED light emitting element, which may be a structure conventional in the art, and the present invention is not particularly limited thereto.
In some embodiments, the substrate 1 comprises a non-organic layer and a planarization layer stacked along the second direction (i.e. the non-organic layer is located on a side of the planarization layer facing away from the cover plate 2), the planarization layer comprises a groove exposing the non-organic layer, and the package body 3 is connected with the non-organic layer exposed through the groove.
Specifically, the planarization layer is an outermost film layer on a side of the substrate 1 facing the cover plate 2, and contains an organic material, when the substrate 1 and the cover plate 2 are packaged, the planarization layer may be etched to form a groove, a bottom surface of the groove is a non-organic layer, then a body 31 material (e.g., frit) doped with an organic gas adsorbent 32 is placed on the non-organic layer exposed by the groove, and is molded by laser sintering or the like to form the package body 3, one side of the package body 3 is connected to the substrate 1, and the other side is connected to the cover plate 2, so that the package of the substrate 1 and the cover plate 2 is realized.
The non-organic layer may be a metal layer or a metal Oxide layer, and may specifically be an electrode layer connected to the display area AA, such as an anode layer, which may include an electrode material such as titanium aluminum titanium (tiati), indium Tin Oxide (ITO), and the like, which are conventional in the art.
The substrate 1 may include a Low Temperature Polysilicon (LTPS) substrate 1.
The cover plate 2 may be a glass cover plate 2 or a metal cover plate 2.
In addition, the package structure may be a display panel.
The display device provided by the embodiment of the invention comprises the packaging structure. The display device can be a display device such as an OLED display, and any product or component with a display function such as a television, a digital camera, a mobile phone and a tablet computer comprising the display device. The advantages of the display device and the package structure are the same as those of the prior art, and are not described herein again.
In the description of the present invention, unless otherwise explicitly specified or limited, the terms "disposed on", "connected" and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; mechanical connection, electrical connection, and communication connection (network connection); the two elements may be directly connected, indirectly connected through an intermediate medium, or connected to each other through an internal communication. Those skilled in the art will understand what is specifically meant by the present invention.
Furthermore, the terms "first", "second", and the like are used for descriptive purposes only, such as to distinguish between various components for clarity of explanation/explanation of the technical solution, and are not to be construed as indicating or implying any number or order of essential features of the indicated technical solution.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. An encapsulation structure, comprising a substrate, a cover plate, and an encapsulation body disposed between the substrate and the cover plate, wherein the encapsulation body comprises a body and an organic gas adsorbent present in the body.
2. The package structure of claim 1, wherein a mass ratio of the body to the organic gas adsorbent is 1: (0.25-0.55).
3. The package structure of claim 1 or 2, wherein the body comprises a glass body.
4. The package structure of claim 1,
the organic gas adsorbent comprises a carbon material, optionally the organic gas adsorbent comprises biochar and/or activated carbon;
and/or the organic gas adsorbent is of a porous structure, and optionally the pore diameter of the organic gas adsorbent is 0.35 nm-0.9 nm.
5. The package structure according to claim 1 or 4, wherein the organic gas adsorbent is uniformly distributed in a direction from the substrate to the cover plate; alternatively, the mass percentage of the organic gas adsorbent decreases in a direction from the substrate to the cover plate.
6. The package structure according to claim 1 or 5, wherein the package body comprises a first region in contact with the substrate, the organic gas adsorbent being present in the first region; the thickness of the packaging body in the direction from the substrate to the cover plate is H1, the thickness of the first area in the direction from the substrate to the cover plate is H2, and H2/H1 is more than or equal to 1/3 and less than or equal to 1.
7. The encapsulation structure according to claim 1 or 4, wherein the organic gas adsorbent is present in the body in a manner including manner 1 and/or manner 2 as follows:
mode 1: the organic gas adsorbent is independently present in the body;
mode 2: a support material is present in the body, the organic gas adsorbent being present in the support material;
optionally, a carrier material layer containing the carrier material is present in the body, the carrier material layer is in contact with the substrate, the thickness of the package body in the direction from the substrate to the cover plate is H1, and the thickness of the carrier material layer in the direction from the substrate to the cover plate is H2',1/3 ≦ H2'/H1 ≦ 1.
8. The encapsulation structure of claim 7, wherein the carrier material comprises a resinous material, preferably wherein the resinous material comprises an epoxy resin.
9. The package structure according to claim 1, wherein the substrate comprises a non-organic layer and a planarization layer stacked in a direction from the substrate to the cover plate, the planarization layer comprises a groove exposing the non-organic layer, and the package body is connected to the non-organic layer exposed by the groove.
10. A display device comprising the encapsulation structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310065943.1A CN115942777A (en) | 2023-01-13 | 2023-01-13 | Packaging structure and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310065943.1A CN115942777A (en) | 2023-01-13 | 2023-01-13 | Packaging structure and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115942777A true CN115942777A (en) | 2023-04-07 |
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ID=86699302
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310065943.1A Pending CN115942777A (en) | 2023-01-13 | 2023-01-13 | Packaging structure and display device |
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| Country | Link |
|---|---|
| CN (1) | CN115942777A (en) |
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- 2023-01-13 CN CN202310065943.1A patent/CN115942777A/en active Pending
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