CN115932555B - Method for obtaining probe position and probe station - Google Patents
Method for obtaining probe position and probe station Download PDFInfo
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- CN115932555B CN115932555B CN202310157002.0A CN202310157002A CN115932555B CN 115932555 B CN115932555 B CN 115932555B CN 202310157002 A CN202310157002 A CN 202310157002A CN 115932555 B CN115932555 B CN 115932555B
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Abstract
The application relates to the technical field of semiconductors, and provides a probe position obtaining method and a probe station. The method comprises the steps of firstly aligning a single probe on a calibration probe card with a probe camera to obtain a single-needle projection coordinate of the single probe on the preset horizontal plane. The condition of misplacement of the needle and limitation of the field of view is avoided. Because the position of the installed single probe on the needle card installation position corresponds to the reference center position on the installed target needle card, calculation is completed by utilizing the position relation (namely a plurality of preset relation parameter values) between the reference center position and the target probe, the needle is completed through calculation results and horizontal fine adjustment, and finally, the target projection coordinate of the target probe on a preset horizontal plane is obtained, so that damage to the needle card caused by misoperation is reduced.
Description
Technical Field
The present application relates to the field of semiconductor technologies, and in particular, to a method for obtaining a probe position and a probe station.
Background
The alignment before the wafer test is to move the center of the probe camera lens to the lower part of the probe through the platform, and to lift the moving mechanism for placing the probe camera to the focusing position of the target probe in the target probe card, so that the image of the target probe can be clearly obtained, the position of the target probe can be accurately calibrated, and the wafer to be tested can be positioned according to the calibrated position of the target probe in the wafer test. Thus, the needle is an essential step prior to wafer testing.
Usually, alignment before wafer testing is done manually. However, because the number of the probes in the probe card is large, the probe is easy to misplace; and when the motion mechanism rises to the height capable of clearly observing the probe, the manual visual field range is limited, and misoperation is easy to cause, so that the probe card and the wafer are damaged.
Accordingly, the present application provides a method for obtaining a probe position to solve one of the above-mentioned technical problems.
Disclosure of Invention
The present application aims to provide a method for obtaining a probe position and a probe station, which can solve at least one technical problem mentioned above. The specific scheme is as follows:
according to a first aspect of the specific embodiments of the present application, the present application provides a method for obtaining a probe position, including:
after a needle card installation position on a probe station is provided with a calibration needle card, determining estimated single-needle projection coordinates of only a single probe on the calibration needle card on a preset horizontal plane, wherein the preset horizontal plane is a horizontal plane formed by a first coordinate axis and a second coordinate axis on a coordinate system of a preset motion mechanism, the single probe is installed on a geometric center position of the needle card installation position, and a reference center position corresponding to the installation position of the single probe is arranged on the target needle card;
controlling a probe camera fixedly arranged on the motion mechanism to perform needle alignment on the single probe according to the estimated single-needle projection coordinate, so as to obtain the single-needle projection coordinate of the single probe on the preset horizontal plane;
obtaining measuring and calculating projection coordinates of the target probe on the preset horizontal plane based on the single-needle projection coordinates and a plurality of preset relation parameter values of the target probe and the reference center position on the target needle card;
and after the target needle card is used for replacing the calibration needle card arranged on the needle card installation position, controlling the probe camera to perform needle alignment on the target probe according to the measuring and calculating projection coordinates, and obtaining the target projection coordinates of the target probe on a preset horizontal plane.
According to a second aspect of a specific embodiment of the present application, there is provided a probe station comprising: the needle card mounting position, the movement mechanism, the probe camera, the height measurement sensor and the processor;
the probe card installation position is arranged at the top in the probe station and is configured to install a tested probe card;
a movement mechanism arranged at the lower part of the needle card mounting position in the probe station and configured as a mechanism capable of moving along the vertical direction and/or the horizontal plane;
a probe camera fixedly arranged on the motion mechanism and configured to move along with the motion mechanism and align with a probe of the probe card arranged on the probe card mounting position;
and the processor is respectively connected with the motion mechanism and the probe camera in a communication way and is configured to:
after the needle card is installed at the needle card installation position, determining the estimated single-needle projection coordinate of only a single probe on the calibrated needle card on a preset horizontal plane, wherein the preset horizontal plane is a horizontal plane formed by a first coordinate axis and a second coordinate axis on a preset movement mechanism coordinate system, the single probe is installed at the geometric center position of the needle card installation position, and the target needle card is provided with a reference center position corresponding to the installation position of the single probe;
controlling a probe camera fixedly arranged on the motion mechanism to perform needle alignment on the single probe according to the estimated single-needle projection coordinate, so as to obtain the single-needle projection coordinate of the single probe on the preset horizontal plane;
obtaining measuring and calculating projection coordinates of the target probe on the preset horizontal plane based on the single-needle projection coordinates and a plurality of preset relation parameter values of the target probe and the reference center position on the target needle card;
and after the target needle card is used for replacing the calibration needle card arranged on the needle card installation position, controlling the probe camera to perform needle alignment on the target probe according to the measuring and calculating projection coordinates, and obtaining the target projection coordinates of the target probe on a preset horizontal plane.
Compared with the prior art, the scheme provided by the embodiment of the application has at least the following beneficial effects:
the application provides a probe position obtaining method and a probe station. The method comprises the steps of firstly aligning a single probe on a calibration probe card with a probe camera to obtain a single-needle projection coordinate of the single probe on the preset horizontal plane. The condition of misplacement of the needle and limitation of the field of view is avoided. Because the position of the installed single probe on the needle card installation position corresponds to the reference center position on the installed target needle card, the reference center position of the target needle card is applied to the single-needle projection coordinate, the calculation is completed by utilizing the position relation (namely a plurality of preset relation parameter values) between the reference center position and the target probe, the needle alignment is completed through the calculation result and the horizontal fine adjustment, and finally the target projection coordinate of the target probe on the preset horizontal plane is obtained. The method avoids overlarge adjustment on a horizontal plane, ensures that the finally obtained target projection coordinates cannot deviate, and ensures the accuracy of final processing. When the wafer is tested, the wafer and the target needle card can be aligned by utilizing the obtained target projection coordinates, so that each probe of the target needle card corresponds to each welding spot on the tested wafer (namely, the target probe of the target needle card corresponds to the first welding spot on the first chip of the tested wafer), and the test of the probe to the welding spot can be realized only by vertically lifting the tested wafer, thereby reducing the damage of the needle card caused by misoperation.
Drawings
FIG. 1 shows a schematic structural view of a probe station according to an embodiment of the present application;
FIG. 2 shows a flow chart of a method of obtaining probe positions according to an embodiment of the present application;
FIG. 3 shows a schematic diagram of needle alignment within a probe station according to an embodiment of the present application;
FIG. 4 shows a schematic diagram of a target needle card according to an embodiment of the present application;
z1-motion, S01-first initial height, S02-second initial height, NC-probe card, N-probe, D-base, C1-probe camera, W-probe card installation site, A-target needle card occupation area, L1-preset first occupation length, L2-preset second occupation length, L3-preset occupation column spacing, L4-preset occupation row spacing, H0-preset space height value, ln 1-preset single needle length, T1-preset first base thickness, hc-preset camera working distance, H1-first elevation value, dr-arrangement direction of each row of occupation area, dc-arrangement direction of each column of occupation area.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail below with reference to the accompanying drawings, wherein it is apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
It should be understood that although the terms first, second, third, etc. may be used in embodiments of the present application to describe, these descriptions should not be limited to these terms. These terms are only used to distinguish one from another. For example, a first may also be referred to as a second, and similarly, a second may also be referred to as a first, without departing from the scope of embodiments of the present application.
The words "if", as used herein, may be interpreted as "at … …" or "at … …" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrase "if determined" or "if detected (stated condition or event)" may be interpreted as "when determined" or "in response to determination" or "when detected (stated condition or event)" or "in response to detection (stated condition or event), depending on the context.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a product or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such product or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a commodity or device comprising such element.
In particular, the symbols and/or numerals present in the description, if not marked in the description of the figures, are not numbered.
The embodiment provided in this application is one of a probe station.
Embodiments of the present application are described in detail below in conjunction with fig. 1-4.
As shown in fig. 1 and 3, the present application provides a probe station, comprising: the needle card mounting position W, the movement mechanism Z1, the probe camera C1 and the processor. The probe card installation position W is arranged at the top in the probe station and is configured to install a tested probe card NC; the probe card NC includes a base D and a plurality of probes N.
As shown in fig. 4, a plurality of occupation areas a arranged in an array are provided on a base D of the probe card NC, and each of the occupation areas a is provided with a plurality of probes in the same arrangement.
When the base of the probe card is not matched with the needle card mounting position, the base of the probe card can be mounted on a needle card mounting mechanism matched with the needle card mounting position, and then the needle card mounting mechanism is mounted on the needle card mounting position. Thus, the base of the calibration pin card may be different from the base of the target pin card. However, after the calibration needle card is mounted at the needle card mounting location, only a single probe on the calibration needle card is mounted at the geometric center position of the needle card mounting location, that is, the projection coordinates of the single probe coincide with the projection coordinates of the geometric center position. And the target needle card is provided with a reference center position corresponding to the installation position of the single probe, namely, after the target needle card is installed at the needle card installation position, the projection coordinates of the reference center position of the target needle card are overlapped with the projection coordinates of the geometric center position.
As shown in fig. 1 and 3, the movement mechanism Z1 is provided at a lower portion of the needle card attachment position W in the probe station, and is configured as a mechanism capable of moving in a vertical direction and/or a horizontal plane. The probe camera C1 is fixedly arranged on the motion mechanism Z1, and is configured to move along with the motion mechanism Z1 and align with the probe N of the probe card NC mounted on the probe card mounting position W. The height of the probe camera C1 fixed on the motion mechanism Z1 in the embodiment of the application is equal to the first initial height S01 of the motion mechanism Z1. The first initial height S01 of the motion mechanism Z1 refers to that the height of the bottom of the motion mechanism Z1 from the preset horizontal plane is zero. The second initial height S02 of the probe camera C1 refers to a height between the bottom of the probe camera C1 and a preset horizontal plane when the motion mechanism Z1 is at the first initial height S01.
The preset horizontal plane is a horizontal plane formed by a first coordinate axis and a second coordinate axis on a coordinate system of the preset movement mechanism.
The preset motion mechanism coordinate system comprises: a first coordinate axis, a second coordinate axis, and a third coordinate axis, for example, the first coordinate axis is an x-axis, the second coordinate axis is a y-axis, and the third coordinate axis is a z-axis; of course, the present application is not limited thereto.
And the processor is respectively connected with the motion mechanism and the probe camera in a communication way and is configured to: after the needle card is installed at the needle card installation position, determining the estimated single-needle projection coordinate of only a single probe on the calibrated needle card on a preset horizontal plane, wherein the preset horizontal plane is a horizontal plane formed by a first coordinate axis and a second coordinate axis on a preset movement mechanism coordinate system, the single probe is installed at the geometric center position of the needle card installation position, and the target needle card is provided with a reference center position corresponding to the installation position of the single probe; controlling a probe camera fixedly arranged on the motion mechanism to perform needle alignment on the single probe according to the estimated single-needle projection coordinate, so as to obtain the single-needle projection coordinate of the single probe on the preset horizontal plane; obtaining measuring and calculating projection coordinates of the target probe on the preset horizontal plane based on the single-needle projection coordinates and a plurality of preset relation parameter values of the target probe and the reference center position on the target needle card; and after the target needle card is used for replacing the calibration needle card arranged on the needle card installation position, controlling the probe camera to perform needle alignment on the target probe according to the measuring and calculating projection coordinates, and obtaining the target projection coordinates of the target probe on a preset horizontal plane.
The calibration pin card and the target pin card both belong to a probe card.
According to the embodiment of the application, firstly, the single probe on the calibration probe card and the probe camera are used for aligning, and the single-needle projection coordinate of the single probe on the preset horizontal plane is obtained. The condition of misplacement of the needle and limitation of the field of view is avoided. Because the position of the installed single probe on the needle card installation position corresponds to the reference center position on the installed target needle card, the reference center position of the target needle card is applied to the single-needle projection coordinate, the calculation is completed by utilizing the position relation (namely a plurality of preset relation parameter values) between the reference center position and the target probe, the needle alignment is completed through the calculation result and the horizontal fine adjustment, and finally the target projection coordinate of the target probe on the preset horizontal plane is obtained. The method avoids overlarge adjustment on a horizontal plane, ensures that the finally obtained target projection coordinates cannot deviate, and ensures the accuracy of final processing. When testing the wafer, the wafer and the target needle card can be aligned by using the obtained target projection coordinates, so that the test of the probe to the welding spots can be realized by only vertically lifting the tested wafer on the condition that each probe of the target needle card corresponds to each welding spot on the tested wafer (namely, the target probe of the target needle card corresponds to the first welding spot on the first chip of the tested wafer). Thereby reducing needle card damage caused by misoperation.
On the basis of the above embodiments, the embodiments of the present application are further optimized, and explanations based on the same composition and meaning of the same names are the same as those of the above embodiments, and are not repeated here.
The embodiments provided in the present application, namely, embodiments of a method for obtaining a probe position, are applied to a processor of a probe station.
An embodiment of the present application is described in detail below with reference to fig. 2.
Step S201, after the calibration needle card is installed at the needle card installation position on the probe station, the estimated single-needle projection coordinates of the single probe on the calibration needle card on a preset horizontal plane are determined.
The single probe is arranged on the geometric center position of the needle card installation position, the position coincides with the structural center of the installation needle card, and the target needle card is provided with a reference center position corresponding to the installation position of the single probe.
It is understood that the projected coordinates of the individual probes coincide with the projected coordinates of the geometric center position of the needle card mounting location. The target needle card is provided with a reference center position corresponding to the installation position of the single probe, and the projection coordinates of the reference center position of the target needle card are overlapped with the projection coordinates of the geometric center position after the target needle card is installed at the needle card installation position.
The preset motion mechanism coordinate system is a coordinate system required for controlling the motion of the motion mechanism. For example, the preset motion mechanism coordinate system includes: the first coordinate axis, the second coordinate axis and the third coordinate axis; the first coordinate axis is an x-axis, the second coordinate axis is a y-axis, the third coordinate axis is a z-axis, and the preset horizontal plane is a horizontal plane formed by an xy-axis; of course, the present application is not limited thereto.
The purpose of the application is to obtain the target projection coordinates of the target probe, and then when the wafer is tested, the wafer and the target probe card are aligned by utilizing the target projection coordinates, so that the test of the probe to the welding spots can be realized only by vertically lifting the tested wafer on each probe of the target probe card corresponds to each welding spot on the tested wafer (namely, the target probe of the target probe card corresponds to the first welding spot on the first chip of the tested wafer). For this purpose, the present application provides a preset level, i.e. the projection coordinates of the target probe, i.e. the projection coordinates of the target probe on the preset level.
In order to prevent the condition that the number of probes in a target needle card is large, needle misalignment is easy to cause, and the view field range is limited, the embodiment of the application provides a needle card calibration and single-needle projection coordinate estimation. Only a single probe is provided in the calibration probe card and is mounted at the geometric center of the probe card mounting location. The conditions of misplacement of the needle and limitation of the visual field range are avoided, so that the damage to the needle card caused by misoperation is reduced. The method and the device take a single probe of the calibration probe card as a reference standard so as to obtain the target projection coordinates of the target probe on a preset horizontal plane. The estimated single-needle projection coordinates are not accurate coordinates, but the probe camera can obtain a rough coordinate position before needle alignment, so that the target is prevented from being lost during needle alignment.
Step S202, controlling a probe camera fixedly arranged on the motion mechanism to align the single probe according to the estimated single-probe projection coordinate, and obtaining the single-probe projection coordinate of the single probe on the preset horizontal plane.
Because the estimated single-needle projection coordinate is only one inaccurate coordinate, the single-needle projection coordinate of the single probe on the preset horizontal plane is determined through the probe camera and the single-needle probe pair.
In some embodiments, the single needle projection coordinates include a first single needle coordinate on the first coordinate axis and a second single needle coordinate on the second coordinate axis.
In other embodiments, the controlling and fixing the probe camera on the motion mechanism performs needle alignment on the single probe according to the estimated single-needle projection coordinate to obtain the single-needle projection coordinate of the single probe on the preset horizontal plane, and the method includes the following steps:
step S202-1, calculating a first elevation value of the probe camera from a second initial elevation to a needle elevation based on a preset space elevation value, a preset single needle length of the single probe, a preset first base thickness of the base of the calibration needle card and a preset camera working distance of the probe camera.
The first initial height of the motion mechanism refers to the height between the bottom of the motion mechanism and a preset horizontal plane, and the second initial height of the probe camera refers to the height between the bottom of the probe camera and the preset horizontal plane when the motion mechanism is at the first initial height.
The first initial height of the motion mechanism has a value equal to zero on the third coordinate axis.
The second initial height of the probe camera, the value on the third coordinate axis is equal to a preset fixed height difference between the bottom of the motion mechanism and the bottom of the probe camera.
The probe camera is raised from the second initial height to a first raised value for the needle height corresponding to the raised value of the motion mechanism from the first initial height.
As shown in fig. 1 and 3, the preset space height value H0 refers to a height value between the second initial height S02 and the top wall of the mounting needle card mounting position W. The preset spatial height value H0 is a fixed value.
As shown in fig. 3, the preset camera working distance Hc refers to the height values from the second initial height S02 to the probe camera C1 at the focusing position with the single probe. The preset camera working distance Hc is determined by the characteristics (e.g., camera height, focal length) of the probe camera C1, and is a fixed value. The preset single needle length Ln1 refers to the preset length of a single probe. The preset first base thickness T1 refers to the preset thickness of the base D.
As shown in fig. 3, the first elevation value H1 is calculated by the following formula:
H1= H0- Hc- Ln1- T1；
wherein, H1 represents a first elevation value, H0 represents a preset space height value, hc represents a preset camera working distance, ln1 represents a preset single needle length, and T1 represents a preset first base thickness.
Step S202-2, generating a first departure coordinate of the probe camera based on the second initial height of the probe camera and the estimated single-needle projection coordinate.
For example, the second initial height of the probe camera is equal to 10mm, and the estimated single needle projection coordinates (200 mm,180 mm) are the first departure coordinates (200 mm,180mm,10 mm).
Step S202-3, the probe camera is controlled to vertically raise a first raising value from the first starting coordinate, and then the probe camera and the single probe are horizontally fine-tuned to perform needle alignment, so that single-needle projection coordinates of the single probe on the preset horizontal plane after needle alignment are obtained.
The probe camera starts from the first starting coordinate and is vertically lifted, so that the probe camera can be ensured not to lose a single probe in the visual field range, and when the probe camera is lifted to a first lifting value, the probe camera is horizontally finely adjusted, and the probe card is ensured not to be damaged.
For example, continuing with the example above, the single needle projection coordinates after trimming (200 mm,180.06 mm).
In some embodiments, the horizontally fine-tuning the probe camera to align with the single probe comprises the steps of:
step S202-3a, horizontally fine-tuning the probe camera to enable the single probe to be clearly imaged in a preset area of an image.
According to the embodiment, the single probe is clearly imaged in the preset area of the image, such as the geometric center area of the image, the overlarge adjustment on the horizontal plane can be avoided through the limitation of the preset area, the deviation of the finally obtained single-needle projection coordinate is avoided, and the accuracy of final processing is ensured.
Step S203, obtaining the measured projection coordinates of the target probe on the preset horizontal plane based on the single-needle projection coordinates and a plurality of preset relation parameter values of the target probe and the reference center position on the target needle card.
In some specific embodiments, as shown in fig. 4, the plurality of preset relationship parameter values includes: the method comprises the steps of presetting a target row number of a target needle card, presetting a target column number of the target needle card, presetting a first occupation length L1 of an occupation area A of the target needle card in the direction of a first coordinate axis after installation, presetting a second occupation length L2 of the occupation area A of the target needle card in the direction of a second coordinate axis after installation, presetting a occupation row spacing L4 of the occupation area A, presetting a occupation column spacing L3 of the occupation area A, and presetting a first welding spot offset and a second welding spot offset of a puncture projection coordinate of a target welding spot on the first coordinate axis relative to a chip projection coordinate of a target chip where the target needle card is located.
The needle insertion projection coordinate refers to the projection coordinate of the needle insertion coordinate of the target probe on the target needle card arranged on the needle card installation position on the preset horizontal plane to the target welding spot during the test.
The chip projection coordinates refer to projection coordinates of a target chip on a target needle card mounted on a needle card mounting position on a preset horizontal plane during testing.
As shown in fig. 4, the target pin card includes a plurality of occupied areas a arranged in an array, each occupied area a is provided with a plurality of probes in the same arrangement mode, in the wafer test, each occupied area a corresponds to a chip on the wafer to be tested, each probe corresponds to a solder joint on the chip, the arrangement direction dr of each row of occupied areas a of the target pin card after installation is parallel to the first coordinate axis direction, and the arrangement direction dc of each row of occupied areas a of the target pin card after installation is parallel to the second coordinate axis direction.
Correspondingly, the calculating projection coordinates of the target probe on the preset horizontal plane are obtained based on the single-needle projection coordinates and a plurality of preset relation parameter values of the target probe and the reference position on the target needle card, and the method comprises the following steps:
step S203-1, obtaining a first chip coordinate of the target chip on the first coordinate axis based on the first single needle coordinate of the single needle projection coordinate and the preset target row number, the preset first space length and the preset space interval, and obtaining a second chip coordinate of the target chip on the second coordinate axis based on the second single needle coordinate of the single needle projection coordinate and the preset target row number, the preset second space length and the preset space interval.
The target needle card is provided with a reference center position corresponding to the setting position of the single probe, the reference center position is applied to the single-needle projection coordinate, and the calculated projection coordinate of the target chip can be obtained through a plurality of preset relation parameter values.
In some embodiments, the target probes are disposed in a target footprint of the target pin card arranged in a first row and a first column, and the target probes are located at a first probe of the target footprint.
For example, as shown in fig. 4, the target pin card includes 12 occupied areas a, the occupied area a of the first row and the first column in the target pin card is the target occupied area a, the preset target row number of the target occupied area a is 1, the preset target column number of the target occupied area a is 1, the preset first occupied length L1 of each occupied area a is 12mm, the preset occupied column spacing L3 is 36mm, the single-pin projection coordinates (200 mm,190 mm), and the first chip coordinates=200 mm- (12 mm, 4+36mm, 3)/2=44 mm of the target chip on the first coordinate axis; the preset second occupation length L2 of each occupation area A is 10mm, the preset occupation line spacing L4 is 30mm, and the second chip coordinates of the target chip on the second coordinate axis are 190mm- (10 mm gamma 3+30mm gamma 2)/2=100 mm; therefore, the chip projection coordinates (44 mm,100 mm) of the target chip.
Step S203-2, obtaining a first calculated projection coordinate of the target probe on a first coordinate axis based on the first chip coordinate and the preset first welding spot offset, and obtaining a second calculated projection coordinate of the target probe on a second coordinate axis based on the second chip coordinate and the preset second welding spot offset.
For example, as shown in fig. 4, continuing the above example, presetting the first welding spot offset to be 0.18 mm and presetting the second welding spot offset to be 0.12mm, and setting the chip projection coordinates (44 mm,100 mm) of the target chip, then the first calculated projection coordinates=44 mm+0.18 mm= 44.18mm of the target probe on the first coordinate axis; second measured projection coordinates of the target probe on the second coordinate axis=100mm+0.12mm=100.12 mm; the projected coordinates (44.18 mm,100.12 mm) of the target probe were calculated.
And S204, after the target needle card is used for replacing the calibration needle card arranged on the needle card installation position, controlling the probe camera to align the target probe according to the calculated projection coordinates, and obtaining the target projection coordinates of the target probe on a preset horizontal plane.
This step is similar to the previous step S202, by determining the exact target projection coordinates for the needle.
In some embodiments, the controlling the probe camera to needle the target probe according to the measured projection coordinates to obtain target projection coordinates of the target probe on a preset horizontal plane includes the following steps:
step S204-1, calculating a second elevation value of the probe camera from a second initial elevation to a needle elevation based on a preset space elevation value, a preset probe length of the target probe, a preset second base thickness of the base of the target needle card, and a preset camera working distance of the probe camera.
The first initial height of the motion mechanism refers to the height between the bottom of the motion mechanism and a preset horizontal plane, and the second initial height of the probe camera refers to the height between the bottom of the probe camera and the preset horizontal plane when the motion mechanism is at the first initial height.
Since the predetermined second base thickness and the predetermined probe length of the target pin card may be different from the predetermined first base thickness and the predetermined single pin length of the calibration pin card, it is necessary to accurately calculate the second elevation value here. The calculation formula of the second rise value is the same as that of the first rise value:
H2= H0- Hc- Ln2- T2；
wherein, H2 represents a second elevation value, H0 represents a preset spatial elevation value, hc represents a preset camera working distance, ln2 represents a preset probe length, and T2 represents a preset second base thickness.
Step S204-2, generating second departure coordinates of the probe camera based on the second initial height of the probe camera and the calculated projection coordinates.
For example, continuing with the example above, as shown in FIG. 4, the second initial height of the probe camera is equal to 10mm and the projected coordinates of the target probe are calculated (44.18 mm,100.12 mm), then the first departure coordinates are (44.18 mm,100.12mm,10 mm).
And step S204-3, controlling the probe camera to vertically raise a first rise value from the second starting coordinate, and then horizontally fine-adjusting the probe camera and the target probe to perform needle alignment to obtain target projection coordinates of the target probe on a preset horizontal plane.
The probe camera starts from the second starting coordinates and is vertically lifted, so that the probe camera can be ensured not to lose the target probe in the visual field range, and the probe camera is horizontally finely adjusted when lifted to a second lifting value, so that the target probe card is ensured not to be damaged.
For example, as shown in FIG. 4, continuing with the above example, the fine-tuned target projection coordinates (44.26 mm,100.10 mm).
In some embodiments, the horizontally fine-tuning the probe camera to align with the target probe comprises the steps of:
step S204-3a, horizontally fine-tuning the probe camera to enable the target probe to be clearly imaged in a preset area of the image.
According to the embodiment, the target probe is clearly imaged in the preset area of the image, such as the geometric center area of the image, the overlarge adjustment on the horizontal plane can be avoided through the limitation of the preset area, the deviation of the finally obtained target projection coordinate is avoided, and the accuracy of final processing is ensured.
According to the embodiment of the application, firstly, the single probe on the calibration probe card and the probe camera are used for aligning, and the single-needle projection coordinate of the single probe on the preset horizontal plane is obtained. The condition of misplacement of the needle and limitation of the field of view is avoided. Because the position of the installed single probe on the needle card installation position corresponds to the reference center position on the installed target needle card, the reference center position of the target needle card is applied to the single-needle projection coordinate, the calculation is completed by utilizing the position relation (namely a plurality of preset relation parameter values) between the reference center position and the target probe, the needle alignment is completed through the calculation result and the horizontal fine adjustment, and finally the target projection coordinate of the target probe on the preset horizontal plane is obtained. The method avoids overlarge adjustment on a horizontal plane, ensures that the finally obtained target projection coordinates cannot deviate, and ensures the accuracy of final processing. When testing the wafer, the wafer and the target needle card can be aligned by using the obtained target projection coordinates, so that the test of the probe to the welding spots can be realized by only vertically lifting the tested wafer on the condition that each probe of the target needle card corresponds to each welding spot on the tested wafer (namely, the target probe of the target needle card corresponds to the first welding spot on the first chip of the tested wafer). Thereby reducing needle card damage caused by misoperation.
Finally, it should be noted that: in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (8)
1. A method for obtaining a probe position, comprising:
after a needle card installation position on a probe station is provided with a calibration needle card, determining estimated single-needle projection coordinates of only a single probe on the calibration needle card on a preset horizontal plane, wherein the preset horizontal plane is a horizontal plane formed by a first coordinate axis and a second coordinate axis on a coordinate system of a preset motion mechanism, the single probe is installed on a geometric center position of the needle card installation position, and a reference center position corresponding to the installation position of the single probe is arranged on a target needle card;
controlling a probe camera fixedly arranged on the motion mechanism to perform needle alignment on the single probe according to the estimated single-needle projection coordinate, so as to obtain the single-needle projection coordinate of the single probe on the preset horizontal plane;
obtaining measuring and calculating projection coordinates of the target probe on the preset horizontal plane based on the single-needle projection coordinates and a plurality of preset relation parameter values of the target probe and the reference center position on the target needle card;
and after the target needle card is used for replacing the calibration needle card arranged on the needle card installation position, controlling the probe camera to perform needle alignment on the target probe according to the measuring and calculating projection coordinates, and obtaining the target projection coordinates of the target probe on a preset horizontal plane.
2. The method of claim 1, wherein the step of determining the position of the substrate comprises,
the single-needle projection coordinates comprise a first single-needle coordinate on the first coordinate axis and a second single-needle coordinate on the second coordinate axis;
the plurality of preset relationship parameter values includes: the method comprises the steps of presetting a target row number of a target space area, presetting a target column number of the target space area, presetting a first space length of the space area of the target needle card after installation in the direction of a first coordinate axis, presetting a second space length of the space area of the target needle card after installation in the direction of a second coordinate axis, presetting space intervals of space rows, presetting space intervals of space columns, presetting a first welding spot offset of the pin projection coordinates of a target welding spot on the first coordinate axis relative to the chip projection coordinates of a target chip on which the target needle card is positioned, and presetting a second welding spot offset of the target needle card on the second coordinate axis, wherein the target needle card comprises a plurality of space areas arranged in an array, each space area is provided with a plurality of probes in the same arrangement mode, each space area corresponds to one chip on a tested wafer in the wafer test, each probe corresponds to one welding spot on the chip, the arrangement direction of each space area of the target needle card after installation is parallel to the first coordinate axis, and each pin of the space area after installation is arranged in the direction of the second coordinate axis;
correspondingly, the obtaining the projection coordinate of the target probe on the preset horizontal plane based on the single-needle projection coordinate and a plurality of preset relation parameter values of the target probe and the reference position on the target needle card comprises the following steps:
obtaining a first chip coordinate of the target chip on a first coordinate axis based on a first single needle coordinate of the single needle projection coordinate, a preset target line number, a preset first occupation length and a preset occupation column interval, and,
obtaining a second chip coordinate of the target chip on a second coordinate axis based on a second single-needle coordinate of the single-needle projection coordinate, a preset target column number, a preset second occupation length and a preset occupation row spacing;
obtaining a first estimated projection coordinate of the target probe on a first coordinate axis based on the first chip coordinate and the preset first solder joint offset, and,
and obtaining a second measuring projection coordinate of the target probe on a second coordinate axis based on the second chip coordinate and the preset second welding spot offset.
3. The method of claim 2, wherein the target probes are disposed in a target footprint of the target card arranged in a first row and a first column, and the target probes are located in a first probe of the target footprint.
4. The method according to claim 1, wherein the controlling the probe camera fixedly arranged on the motion mechanism to needle the single probe according to the estimated single-needle projection coordinate to obtain the single-needle projection coordinate of the single probe on the preset horizontal plane comprises:
calculating a first lifting value of the probe camera from a second initial height to a first lifting value of the probe camera based on a preset space height value, a preset single-needle length of the single probe and a preset first base thickness of a base of the calibration needle card, and a preset camera working distance of the probe camera, wherein the first initial height of the movement mechanism is the height from the bottom of the movement mechanism to a preset horizontal plane, and the second initial height of the probe camera is the height from the bottom of the probe camera to the preset horizontal plane when the movement mechanism is at the first initial height;
generating a first departure coordinate of the probe camera based on the second initial height of the probe camera and the estimated single-needle projection coordinate;
and controlling the probe camera to vertically raise a first rise value from the first starting coordinate, and then horizontally fine-adjusting the probe camera and the single probe to perform needle alignment to obtain a single-probe projection coordinate of the single probe on the preset horizontal plane after needle alignment.
5. The method of claim 4, wherein the horizontally fine-tuning the probe camera to align with the single probe comprises:
and horizontally fine-adjusting the probe camera to enable the single probe to be clearly imaged in a preset area of the image.
6. The method of claim 4, wherein controlling the probe camera to needle the target probe according to the measured projection coordinates to obtain target projection coordinates of the target probe on a preset horizontal plane comprises:
calculating a second elevation value of the probe camera from a second initial elevation to a needle elevation based on a preset space elevation value, a preset probe length of the target probe, a preset second base thickness of a base of the target needle card and a preset camera working distance of the probe camera, wherein the first initial elevation of the moving mechanism is the elevation of the bottom of the moving mechanism from a preset horizontal plane, and the second initial elevation of the probe camera is the elevation between the bottom of the probe camera and the preset horizontal plane when the moving mechanism is at the first initial elevation;
generating a second departure coordinate of the probe camera based on the second initial height of the probe camera and the calculated projection coordinate;
and controlling the probe camera to vertically raise a first rise value from the second starting coordinate, and then horizontally fine-adjusting the probe camera and the target probe to perform needle alignment to obtain target projection coordinates of the target probe on a preset horizontal plane.
7. The method of claim 6, wherein the horizontally fine-tuning the probe camera to align with the target probe comprises:
and horizontally fine-adjusting the probe camera to enable the target probe to be clearly imaged in a preset area of the image.
8. A probe station, comprising: the needle card mounting position, the movement mechanism, the probe camera, the height measurement sensor and the processor;
the probe card installation position is arranged at the top in the probe station and is configured to install a tested probe card;
a movement mechanism arranged at the lower part of the needle card mounting position in the probe station and configured as a mechanism capable of moving along the vertical direction and/or the horizontal plane;
a probe camera fixedly arranged on the motion mechanism and configured to move along with the motion mechanism and align with a probe of the probe card arranged on the probe card mounting position;
and the processor is respectively connected with the motion mechanism and the probe camera in a communication way and is configured to:
after the needle card is installed at the needle card installation position, determining the estimated single-needle projection coordinate of only a single probe on the calibrated needle card on a preset horizontal plane, wherein the preset horizontal plane is a horizontal plane formed by a first coordinate axis and a second coordinate axis on a coordinate system of a preset movement mechanism, the single probe is installed at the geometric center position of the needle card installation position, and the target needle card is provided with a reference center position corresponding to the installation position of the single probe;
controlling a probe camera fixedly arranged on the motion mechanism to perform needle alignment on the single probe according to the estimated single-needle projection coordinate, so as to obtain the single-needle projection coordinate of the single probe on the preset horizontal plane;
obtaining measuring and calculating projection coordinates of the target probe on the preset horizontal plane based on the single-needle projection coordinates and a plurality of preset relation parameter values of the target probe and the reference center position on the target needle card;
and after the target needle card is used for replacing the calibration needle card arranged on the needle card installation position, controlling the probe camera to perform needle alignment on the target probe according to the measuring and calculating projection coordinates, and obtaining the target projection coordinates of the target probe on a preset horizontal plane.
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| CN117476529B (en) * | 2023-12-27 | 2024-04-09 | 深圳市森美协尔科技有限公司 | Probe calibration method, probe calibration device, electronic equipment and storage medium |
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| CN115407176A (en) * | 2022-10-31 | 2022-11-29 | 长春光华微电子设备工程中心有限公司 | Calibration method for needle cleaning height difference and probe station |
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| CN111128782A (en) * | 2019-12-27 | 2020-05-08 | 上海华虹宏力半导体制造有限公司 | Wafer testing method |
| CN112798933A (en) * | 2021-01-28 | 2021-05-14 | 长春光华微电子设备工程中心有限公司 | Automatic wafer needle aligning device and method |
| CN114494460A (en) * | 2022-01-25 | 2022-05-13 | 苏州格拉尼视觉科技有限公司 | Calibration method, multi-camera probe device and flying probe tester |
| CN114897851A (en) * | 2022-05-23 | 2022-08-12 | 成都飞机工业（集团）有限责任公司 | Coordinate compensation method, device, equipment and medium based on central projection |
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