CN115932539A - Impedance test interface module, device and system of FPC high-speed interface circuit - Google Patents
Impedance test interface module, device and system of FPC high-speed interface circuit Download PDFInfo
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- CN115932539A CN115932539A CN202211481349.2A CN202211481349A CN115932539A CN 115932539 A CN115932539 A CN 115932539A CN 202211481349 A CN202211481349 A CN 202211481349A CN 115932539 A CN115932539 A CN 115932539A
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The application relates to an impedance test interface module, an impedance test device and an impedance test system of an FPC high-speed interface circuit. The test interface module comprises a plurality of plugs of different types, a plurality of extension flat cables and corresponding pad test points; a plurality of different types of plugs for mounting corresponding types of connectors; the connector is used for connecting the PFC high-speed interface circuit to be tested; one side of each extension flat cable is correspondingly connected with a plug, the other side of each extension flat cable is fanned out to form a corresponding pad test point, and the pad test points are used for being connected with a test probe of the impedance test equipment. Therefore, the test interface module can be adapted to different connectors, so that the impedance test equipment can detect the impedance value of the PFC high-speed interface circuit, the convenience of detection work is obviously improved, the normal promotion of the design work of the high-speed interface circuit is facilitated, and the work efficiency is improved.
Description
Technical Field
The present invention relates to the field of electronic device detection technologies, and in particular, to an impedance test interface module, an impedance test apparatus, and an impedance test system for an FPC high-speed interface circuit.
Background
In the initial stage of the design of the high-speed interface circuit, in order to ensure that the high-speed interface circuit can work stably in special occasions, the impedance value parameters of the high-speed interface circuit are often required to be touched, and the circuit can be ensured to be normally transmitted in the sensitive stress environment.
However, the impedance test equipment has a high requirement for the matching performance of different interface circuits, and particularly when a high-speed interface Circuit made of a Flexible Printed Circuit (FPC) material is tested, the impedance value of the FPC high-speed interface Circuit cannot be measured due to the problem that a connector of the high-speed interface Circuit is not matched with a test probe of the impedance test equipment, which brings great inconvenience to the test work and affects the normal progress of the Circuit design work.
Disclosure of Invention
In view of the above, it is desirable to provide an impedance test interface module, an impedance test apparatus, and an impedance test system for an FPC high-speed interface circuit, which can improve convenience of an impedance test of the FPC high-speed interface circuit.
An impedance test interface module of an FPC high-speed interface circuit, comprising:
a plurality of different types of plugs for mounting corresponding types of connectors; the connector is a connector of a PFC high-speed interface circuit to be tested;
and one side of each extension flat cable is correspondingly connected with one plug, the other side of each extension flat cable is fanned out to form a corresponding pad test point, and the pad test points are used for being connected with a test probe of the impedance test equipment.
In one embodiment, the pad test point includes a single-ended signal test point and/or a differential signal test point.
In one embodiment, the pad test point comprises a plurality of test points, and the distance between the test points is 0.5mm-2.54mm.
The impedance testing device of the FPC high-speed interface circuit comprises a testing platform and the impedance testing interface module, wherein the impedance testing interface module is arranged on the testing platform, and the testing platform is also provided with a fixing module used for fixing a testing probe of impedance testing equipment so as to connect the testing probe with a corresponding pad testing point.
In one embodiment, the test station includes a movable test platform on which the impedance testing interface module is disposed.
In one embodiment, the impedance testing apparatus further comprises a driving unit for driving the movable testing platform to move.
The impedance test interface module is used for connecting a connector of a PFC high-speed interface circuit to be tested and a test probe of the impedance test equipment so as to detect the impedance value of the PFC high-speed interface circuit to be tested through the impedance test equipment.
In one embodiment, the impedance testing system further comprises a control module, wherein the control module is connected with the driving part in the impedance testing device; the control module is used for controlling the driving part to drive the movable test platform to move according to the type information of the connector of the PFC high-speed interface circuit to be tested.
In one embodiment, the impedance testing system further comprises a reliability testing device, wherein the reliability testing device is used for providing a testing environment and sensitive stress for the PFC high-speed interface circuit to be tested; the impedance testing equipment is also used for detecting the impedance value of the PFC high-speed interface circuit to be tested under the testing environment and sensitive stress.
In one embodiment, the impedance testing device is a network analyzer.
The testing interface module comprises a plurality of plugs of different types, a plurality of extension flat cables and corresponding pad testing points; a plurality of different types of plugs for mounting corresponding types of connectors; the connector is used for connecting a PFC high-speed interface circuit to be tested; one side of each extension flat cable is correspondingly connected with a plug, the other side of each extension flat cable is fanned out to form a corresponding pad test point, and the pad test points are used for being connected with a test probe of the impedance test equipment. Therefore, the test interface module can be adapted to different connectors, so that the impedance test equipment can detect the impedance value of the PFC high-speed interface circuit, the convenience of detection work is obviously improved, the normal promotion of the design work of the high-speed interface circuit is facilitated, and the work efficiency is improved.
Drawings
FIG. 1 is a block diagram of an interface module for testing impedance of an FPC high-speed interface circuit according to an embodiment;
FIG. 2 is a schematic diagram of an impedance testing apparatus for an FPC high-speed interface circuit according to an embodiment;
FIG. 3 is a block diagram of an impedance testing system of the FPC high-speed interface circuit according to an embodiment;
FIG. 4 is a block diagram of an impedance testing system of the FPC high-speed interface circuit in another embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
FPC is a flexible printed circuit made by etching a wiring on a copper foil using a mylar or polyimide as a base material. The high-speed interface circuit is an interface which needs to transmit an electric signal with the rise time less than 5 times of signal transmission delay, and common high-speed circuit interfaces comprise a 1553B interface, a memory interface and the like. The high-speed interface circuit can design and manufacture the impedance value as required through reasonable impedance matching layout at the initial stage of design, and ensures that the impedance value is stable and the condition of signal reflection or crosstalk does not occur in the process of electric signal transmission. However, in practical engineering use, in some special applications, such as high and low temperature, high humidity, etc., the impedance value of the transmission line may change, resulting in signal distortion. In order to ensure that the high-speed interface circuit can stably work under the use condition, the impedance value parameters of the high-speed interface circuit are required to be subjected to model selection in the product design stage, so that the circuit can normally transmit in the sensitive stress environment.
Currently, a commonly used method for testing the impedance value of the transmission line is to use an impedance testing device to perform an evaluation test on the impedance value of the high-speed interface circuit. Specifically, a rapid rising edge is sent on the transmission line to be tested, when impedance change occurs in the transmission path, part of energy is emitted, and the rest energy is transmitted continuously. The reflected voltage generated by the impedance discontinuity is used to represent the change of the impedance, and the reflected voltage is used to calculate the characteristic impedance of the whole line.
However, the impedance testing device has a high requirement for the matching performance of different interface circuits, and when the interface circuit is applied to an interface circuit made of an FPC material, the impedance value of the interface circuit cannot be measured due to the problem that a connector of the circuit is not matched with a testing probe of the impedance testing device. For example, the circuit interface is a BTB (Board-to-Board Connectors) connector, and the test probe cannot be aligned with each connection pin of the BTB connector accurately, so that the impedance value of the interface circuit cannot be measured. Only circuit related simulation results can be used for replacement, certain errors exist between the simulation results and actual measurement results, the simulation process is complex, and great inconvenience is brought to design work.
Based on the above phenomenon, there is provided an impedance test interface module of an FPC high-speed interface circuit, which in one embodiment, as shown in fig. 1, includes a plurality of different types of plugs 10, a plurality of extension bars 20, and a plurality of pad test points 30. The plug 10 is used for mounting a corresponding type of connector; the connector is a connector of the PFC high-speed interface circuit to be tested; one side of each extension flat cable 20 is correspondingly connected with a plug 10, the other side of the extension flat cable is fanned out to form a corresponding pad test point 30, and the pad test points 30 are used for connecting test probes of impedance test equipment.
It will be appreciated that the impedance testing interface module may be provided with a variety of types of plugs 10 to accommodate different types of connectors, such as SMT (Surface mount Technology) type connectors, crimp type connectors, solder type connectors, pin type connectors, and the like. For better adaptation to the respective connector, the plug 10 can be either a female plug or a male plug. The number of the extension lines 20 corresponds to the number of the plugs 10 and the pad test points 30, respectively.
During testing, the connector of the PFC high-speed interface circuit to be tested is installed through the corresponding plug 10, and the pad test point 30 is connected with a test probe of the impedance test equipment, so that signals are transmitted between the PFC high-speed interface circuit to be tested and the impedance test equipment through the plug 10, the extension flat cable 20, the pad test point 30 and the test probe, and the impedance value of the PFC high-speed interface circuit to be tested is detected by the impedance test equipment.
The impedance test interface module of the FPC high-speed interface circuit comprises a plurality of plugs 10 of different types, a plurality of extension flat cables 20 and corresponding pad test points 30; a plurality of different types of plugs 10 for mounting corresponding types of connectors; the connector is used for connecting the PFC high-speed interface circuit to be tested; one side of each extension flat cable 20 is correspondingly connected with a plug 10, the other side of the extension flat cable is fanned out to form a corresponding pad test point 30, and the pad test points 30 are used for connecting test probes of impedance test equipment. Therefore, the test interface module can be adapted to different connectors, so that the impedance test equipment can detect the impedance value of the PFC high-speed interface circuit, the convenience of detection work is obviously improved, the normal promotion of the design work of the high-speed interface circuit is facilitated, and the work efficiency is improved.
In one embodiment, the pad test point 30 includes a single-ended signal test point and/or a differential signal test point.
Since the impedance test interface module can be connected to a plurality of PFC high-speed interface circuits to be tested, and the signal types of the PFC high-speed interface circuits to be tested are different, such as differential signals and single-ended signals, the pad test point 30 corresponding to each plug 10 can be set as a single-ended signal test point or a differential signal test point, or fan out a single-ended signal test point and a differential signal test point at the same time, thereby facilitating the test.
In one embodiment, the pad test point 30 includes a plurality of test points with a spacing between each test point of 0.5mm to 2.54mm.
It will be appreciated that each of the extended rows 20 fans out a set of pad test points 30, and that each set of pad test points 30 may include multiple test points, e.g., one test point for each pin of the plug 10, or only corresponding differential signal test points and single-ended signal test points. The distance between the test points can be set to be 0.5mm-2.54mm, such as 1.0mm, 1.50mm, 2.00mm and the like, so that the test probes are convenient to connect during measurement, and the test efficiency is improved.
Therefore, the impedance test interface module can be adapted to different connectors, so that the impedance test equipment can detect the impedance value of the PFC high-speed interface circuit, and the convenience and the efficiency of detection work are obviously improved. The impedance value of the FPC is convenient to be found during the design process of the FPC high-speed interface circuit, so that the design of the FPC high-speed interface circuit is perfected.
In one embodiment, as shown in fig. 2, an impedance testing apparatus for an FPC high-speed interface circuit is provided, which includes a testing table 1 and an impedance testing interface module, and the impedance testing interface module may be configured according to the above embodiments. The impedance test interface module is arranged on the test board 1, the test board 1 is further provided with a fixing module 2, and the fixing module 2 is used for fixing a test probe 3 of the impedance test device so that the test probe 3 is connected with the corresponding pad test point.
During measurement, the fixing module 2 is used for fixing the test probe 3 of the impedance test equipment, so that the connection between the test probe 3 and the pad test point 30 is more stable in the test process, manual operation is not needed, and the labor cost is reduced.
When the plug 10 is switched, the impedance testing interface module needs to be moved to a corresponding position so that the testing probe 3 is connected to the corresponding pad testing point 30.
In one embodiment, the fixed module 2 is horizontally movable, such as translational or rotational, in the plane of the test bench 1, and when the plug 10 needs to be switched, the fixed module 2 is controlled to move according to the position of the switched plug 10, so that the test probe 3 can be connected to the corresponding pad test point 30.
In another embodiment, the fixed module 2 may also be vertically movable, so that the position of the test probe 3 is adjusted to connect the test probe 3 with the corresponding pad test point 30 during testing.
In one embodiment, the test platform 1 comprises a movable test platform 4, and the impedance test interface module is disposed on the movable test platform 4.
The movable testing platform 4 is used for adjusting the position of the impedance testing interface module, and the movable testing platform 4 can translate or rotate on the testing platform 1. For example, the movable testing platform 4 can be rotated, and after the plug 10 is switched, the whole impedance testing interface module can not be moved, but the relative position of the corresponding pad testing point 30 and the fixed module 2 can be adjusted by rotating the movable testing platform 4, so that the testing probe 3 can be connected to the corresponding pad testing point 30. Compared with the mode of adjusting the impedance test interface module, the movable test platform 4 is more convenient to adjust and higher in use convenience.
In one embodiment, the impedance testing apparatus further comprises a driving means for driving the movable testing platform to move 4.
The driving component can be connected with the movable testing platform 4 to drive the movable testing platform to move 4, and the impedance testing interface module is adjusted. The mode of driving the movable testing platform to move 4 by the driving part is not limited, the driving part can be controlled by a tester to move manually, and the driving part can also be used for electrically controlling the movable testing platform 4 to move according to a control signal after receiving the control signal. Thereby moving the test pad 30 corresponding to the plug 10 to a corresponding position (which may be a pre-designated position or a position corresponding to the fixed module 2) so that the test probe 3 can connect the corresponding pad test point 30. Therefore, the driving part is arranged, and the operation is more convenient when the position of the impedance interface module is adjusted.
In one embodiment, the driving component may be used to drive the fixed module 2 to move, and adjust the position of the test probe 3 so that it can be connected to the corresponding pad test point 30, further improving the convenience of operation.
Further, the driving means may be used to drive the movable test platform movement 4 and the stationary module 2.
In one embodiment, the test bench 1 is further provided with a lifting table 5, and the PFC high-speed interface circuit to be tested can be placed on the lifting table 5. The lifting platform 5 can be higher than the movable testing platform 4, and during testing, the lifting platform 5 is controlled to descend, so that the connector for testing the PFC high-speed interface circuit is connected with the plug 10 on the movable testing platform 4. For example, the connector is a BTB female interface, and the lifting platform 5 is pressed downward, the BTB female interface is correspondingly connected with the male plug 10 on the movable test platform 4, and the BTB female interface is buckled with the male plug 10. Thereby realizing the automatic connection of the connector and the plug 10 and further improving the intellectualization degree of the impedance testing device.
The impedance testing device can be matched with various types of probes of high-speed interface circuits and impedance testing equipment, and the impedance testing equipment detects the impedance value of the high-speed interface circuits in the design stage, so that the potential design or other defects of the interface circuits are exposed in advance in the design and model selection stage, and the reliability of interface circuit products is improved.
In one embodiment, as shown in fig. 3, an impedance testing system of an FPC high-speed interface circuit is provided, which includes an impedance testing apparatus 100 and an impedance testing device 200, where the structure of the impedance testing apparatus 100 may be set up as described in the above embodiments, and the impedance testing interface module 100 is used to connect a connector of a PFC high-speed interface circuit to be tested and a testing probe of the impedance testing device 200, so as to detect an impedance value of the PFC high-speed interface circuit to be tested through the impedance testing device 200.
The type of the impedance testing device 200 may be selected according to actual needs, and in one embodiment, the impedance testing device 200 is a network analyzer. The network analyzer is embedded with interconnection test analysis method software and is provided with a handheld differential probe, signals with fast rising edges can be stably output, the rising edges of the output signals can reach 30ps, the minimum physical interval between any two discontinuous points in a circuit can be identified to be 3mm, and the impedance value of the PFC high-speed interface circuit to be tested can be accurately measured. In another embodiment, the impedance testing device 200 may also be an oscilloscope module, such as the tek 80E04 module.
Specifically, the plug 10 in the impedance test interface module is used for mounting the connector, and the pad test point 30 is used for connecting the resistance test probe. Thereby realizing the detection of the impedance value of various FPC high-speed interface circuits by the impedance test equipment 200.
In one embodiment, as shown in fig. 4, the impedance testing system further includes a control module 300, the control module 300 being connected to the driving part in the impedance testing apparatus 100; the control module 300 is used for controlling the driving part to drive the movable testing platform to move according to the type information of the connector of the PFC high-speed interface circuit to be tested.
The structure of the control module may be set according to actual needs, and in an embodiment, the control module 300 may include a control unit and an interaction unit connected to each other, the control unit is connected to the driving part, the interaction unit is configured to receive type information of a connector of the PFC high-speed interface circuit to be tested, the control unit outputs a control signal according to the type information, and the control unit controls the driving part to drive the movable testing platform 4 to move to a corresponding position, so that the testing probe 3 can be connected to the corresponding pad testing point 30.
Further, the control module 300 may further include an image collecting unit connected to the control unit, the image collecting unit collects image information of the connector and sends the image information of the connector to the control unit, and the control unit identifies type information of the connector according to the image information and controls the driving part to drive the movable testing platform 4 to move to a corresponding position according to the type information. Therefore, the intelligent degree of the impedance testing device is improved, and the labor cost is further reduced.
In one embodiment, the control unit root can control the driving part to drive the fixed module 2 to move according to the type information of the connector of the PFC high-speed interface circuit to be tested, so as to enable the test probe 3 to be connected with the corresponding pad test point 30 more accurately.
Further, the control module 300 may also be connected to the impedance testing device 200, and after detecting the impedance value, the impedance testing device 200 outputs the detection result to the control module 300, and the control module 300 performs analysis, archiving and the like on the detection result.
In one embodiment, the impedance testing system further comprises a reliability testing device 400, wherein the reliability testing device 400 is used for providing a testing environment and sensitive stress for the PFC high-speed interface circuit to be tested; the impedance testing device 200 is also used for detecting the impedance value of the PFC high-speed interface circuit to be tested under the testing environment and sensitive stress.
In the initial stage of the design of the high-speed interface circuit, in order to avoid the condition that the quality of a transmission signal is incomplete due to distortion of the transmission signal when the high-speed interface circuit operates in a sensitive environment, so as to ensure normal transmission of the circuit, the impedance value of the high-speed interface circuit in the sensitive environment needs to be tested.
In this embodiment, the reliability testing apparatus 400 is used to provide a testing environment and sensitive stress; the test environment comprises a temperature environment and a humidity environment, and the sensitive stress is mechanical stress. Alternative temperature ranges include: -75 ℃ to 150 ℃, humidity range: 20% -98% of R.H. Therefore, the reliability test device 400 provides a sensitive environment for the FPC high-speed interface circuit, and the impedance test equipment 200 tests to obtain the impedance value of the PFC high-speed interface circuit to be tested in the test environment and under the sensitive stress, so that the PFC high-speed interface circuit is obtained at the initial design stage, and the design work of the high-speed interface circuit is normally promoted.
Further, the reliability testing device 400 can be further connected to the control module 300, and the control module 300 controls the reliability testing device 400 to switch different testing environments and sensitive stress, so as to improve the intelligent degree of the impedance testing system.
In other embodiments, the control module 300 may not be connected to the driving member, only connected to the reliability testing apparatus 400, and those skilled in the art may combine the actual requirements to set up the reliability testing apparatus.
Therefore, the impedance test system can test the impedance values of various high-speed interface circuits in a sensitive environment, so that the reliability risk of the impedance value of the FPC high-speed signal circuit is evaluated, the circuit design is further perfected, and the finally designed high-speed interface circuit is higher in stability and reliability.
In one embodiment, the step of identifying the risk of reliability of the impedance value of the FPC high-speed signal circuit may include (1) - (5) based on the impedance testing system.
(1) And editing test parameters of the network analyzer, including test intervals, transmission line types (single-ended and differential), impedance requirements and the like.
(2) According to different types of FPC connector interfaces, corresponding plugs 10 are installed, interface matching is well done, and connection between the impedance test probe and the pad test point 30 is well fixed.
(3) And monitoring the impedance value of the FPC high-speed interface transmission link to be tested by using impedance test software of the network analyzer and an impedance test probe, repeatedly testing to ensure the consistency and the repeatability of the test result, and outputting the test result of the impedance value so as to facilitate analysis.
(4) And controlling the reliability testing device 400 to apply the sensitive environmental stress to the FPC high-speed signal circuit to be tested according to the sensitive temperature, humidity and mechanical stress of the FPC high-speed signal circuit to be tested.
(5) After the reliability test is finished, the impedance value of the transmission link of the FPC high-speed interface to be tested is monitored again by using the impedance test software of the network analyzer and the impedance test probe, and a detection result is output.
And (5) comparing and analyzing the test results in the step (3) and the step (5) to identify potential reliability risks so as to improve the reliability of the product.
The impedance test system can be matched with various types of high-speed interface circuits and probes of the impedance test equipment, and the impedance test equipment can detect the impedance value of the high-speed interface circuits in the design stage. The reliability test is carried out by combining the reliability test device 400, the impedance value of the high-speed interface circuit under the sensitive temperature, humidity and mechanical stress is obtained through the test, and different data before and after the test are compared and analyzed, so that the potential design or other defects of the interface circuit can be exposed in advance in the design and model selection stage, the reliability of the interface circuit product is improved, and the defect that the high-speed interface circuit is lack of reliability evaluation is overcome.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An impedance test interface module of an FPC high-speed interface circuit, comprising:
a plurality of different types of plugs for mounting corresponding types of connectors; the connector is a connector of a PFC high-speed interface circuit to be tested;
and one side of each extension flat cable is correspondingly connected with one plug, the other side of each extension flat cable is fanned out to form a corresponding pad test point, and the pad test points are used for being connected with a test probe of the impedance test equipment.
2. An impedance test interface module of an FPC high-speed interface circuit according to claim 1, wherein said pad test points include single-ended signal test points and/or differential signal test points.
3. The impedance test interface module of an FPC high speed interface circuit of claim 2 wherein the pad test point comprises a plurality of test points, the spacing between each of the test points being 0.5mm-2.54mm.
4. An impedance testing device of an FPC high-speed interface circuit, comprising a testing table and an impedance testing interface module as claimed in any one of claims 1-3, the impedance testing interface module being disposed at the testing table; the test board is also provided with a fixing module for fixing the test probe of the impedance test equipment so as to connect the test probe with the corresponding pad test point.
5. The device for testing the impedance of the FPC high-speed interface circuit according to claim 4, wherein the testing platform is provided with a movable testing platform, and the impedance testing interface module is arranged on the movable testing platform.
6. The apparatus for testing the impedance of an FPC high-speed interface circuit according to claim 5, further comprising a driving member for driving the movable testing platform to move.
7. An impedance testing system of an FPC high-speed interface circuit, comprising an impedance testing device and an impedance testing apparatus as claimed in any one of claims 4 to 6, wherein the impedance testing interface module is used for connecting a connector of a PFC high-speed interface circuit to be tested and a testing probe of the impedance testing device so as to detect the impedance value of the PFC high-speed interface circuit to be tested through the impedance testing device.
8. The impedance testing system of an FPC high-speed interface circuit according to claim 7, further comprising a control module, the control module being connected to a driving part in the impedance testing device; the control module is used for controlling the driving part to drive the movable test platform to move according to the type information of the connector of the PFC high-speed interface circuit to be tested.
9. The impedance testing system of the FPC high speed interface circuit according to claim 7, further comprising a reliability testing means for providing a testing environment and sensitive stress to the PFC high speed interface circuit to be tested; the impedance testing equipment is also used for detecting the impedance value of the PFC high-speed interface circuit to be tested under the testing environment and sensitive stress.
10. The impedance testing system of an FPC high speed interface circuit of claim 9, wherein the impedance testing device is a network analyzer.
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| CN202211481349.2A CN115932539A (en) | 2022-11-24 | 2022-11-24 | Impedance test interface module, device and system of FPC high-speed interface circuit |
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| CN202211481349.2A CN115932539A (en) | 2022-11-24 | 2022-11-24 | Impedance test interface module, device and system of FPC high-speed interface circuit |
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