CN115927864A - Lower nozzle evaporation device for metal evaporation and purification method thereof - Google Patents
Lower nozzle evaporation device for metal evaporation and purification method thereof Download PDFInfo
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- CN115927864A CN115927864A CN202211649737.7A CN202211649737A CN115927864A CN 115927864 A CN115927864 A CN 115927864A CN 202211649737 A CN202211649737 A CN 202211649737A CN 115927864 A CN115927864 A CN 115927864A
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- 238000001704 evaporation Methods 0.000 title claims abstract description 61
- 230000008020 evaporation Effects 0.000 title claims abstract description 60
- 238000001883 metal evaporation Methods 0.000 title claims abstract description 24
- 238000000746 purification Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 35
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 229910000746 Structural steel Inorganic materials 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 239000000047 product Substances 0.000 description 7
- 239000012535 impurity Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000010963 304 stainless steel Substances 0.000 description 1
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000011403 purification operation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Physical Vapour Deposition (AREA)
- Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
Abstract
The invention discloses a lower nozzle evaporation device for metal evaporation, which is characterized in that: the heating device comprises a base plate, the support column is installed to the both sides of bottom plate, the support column is by supreme collection board and the evaporation mechanism of installing in proper order down, be equipped with heating unit in the evaporation mechanism. The invention can effectively avoid the falling-off phenomenon of metal purification products and can achieve the purpose of improving the purity of the products through multi-zone temperature control evaporation.
Description
Technical Field
The invention belongs to the technical field of metal evaporation, and particularly relates to a lower nozzle evaporation device for metal evaporation and a purification method thereof.
Background
The evaporation and purification of metal in a vacuum environment is a common purification method at present, and the traditional evaporation and purification method adopts an upper nozzle evaporation mode. The upper nozzle mode can generate a product falling phenomenon in a long-time evaporation process, so that the product quality is influenced. And the lower nozzle mode can avoid the product falling phenomenon and can achieve the purpose of improving the product purity through multi-zone temperature control evaporation.
Through the above analysis, the problems and defects of the prior art are as follows: the evaporation plant commonly used adopts the spout evaporation mode, and the material of coating by vaporization can produce under the effect of gravity and drop on the long-time evaporation in-process collecting plate, causes the reduction of output. Meanwhile, a common evaporation device is lack of a beam structure, the divergence angle of atoms evaporated from an upper nozzle is large, and the atoms are easy to evaporate on structures except the collecting plate.
The significance of solving the technical problems is as follows: the nozzle of the evaporation device is changed into the lower nozzle, the collecting plate is arranged below the nozzle, the problem that the product on the collecting plate falls off under the action of gravity to cause material loss is avoided, the yield is greatly improved, and the stability of the long-time operation of the evaporation device is also improved. Meanwhile, beam structures such as a collimation nozzle and a slit plate are added in the evaporation structure, so that atom divergence can be reduced, and the reduction of evaporation utilization rate caused by evaporation of evaporated atom steam to structures except the collecting plate is prevented.
Disclosure of Invention
In light of the above-mentioned problems, the present invention provides a lower nozzle evaporation apparatus for metal evaporation and a purification method thereof.
The technical scheme of the invention is as follows:
the utility model provides a lower spout evaporation plant for metal evaporation, includes the bottom plate, the support column is installed to the both sides of bottom plate, the support column is equipped with heating unit by supreme collection board and the evaporation mechanism of installing in proper order down.
Preferably, the evaporation mechanism comprises a slit plate arranged on the supporting column, a crucible is arranged above the slit plate, a collimation spout is arranged at the bottom of the crucible, and a crucible cover is arranged at the top of the crucible; the crucible and the crucible cover are both of hollow structures, and a heating unit is arranged inside the crucible and the crucible cover.
Further preferably, the bottom of the crucible is formed by 2L-shaped parts which are opposite to each other, and a collimation spout is formed between the 2L-shaped parts.
Further preferably, a honeycomb plate is vertically installed at the lower end of the collimating nozzle.
Further preferably, the heating unit is composed of uniformly distributed resistance heating wires.
Further preferably, a wide slit is formed in the middle of the slit plate, and the wide slit and the collimating nozzle are parallel and correspond to each other.
Further preferably, the slit plate is mounted on the support column through a support angle iron.
Further preferably, the slit plate is provided with a plurality of layers from top to bottom along the support column.
Further preferably, a support platform is arranged on the bottom plate, and the collection plate is mounted on the support platform.
The second object of the present invention is:
a purification method for metal evaporation, which applies a lower nozzle evaporation device for metal evaporation, comprises the following steps:
s101: placing a target metal in a crucible;
s102: the lower nozzle evaporation plant is integrally placed in a vacuum cavity, air in the vacuum cavity is pumped out by a vacuum maintaining system, and when the vacuum degree reaches a preset process value, the crucible and the crucible cover are respectively heated, so that target metal in the crucible starts to evaporate;
s103: and the metal vapor generated after evaporation passes through a collimation spout heating area, a collimation spout beam-type area, a honeycomb plate and a slit plate on the collimation spout, and is finally condensed on a collecting plate below the collimation spout, so that the purification of the target metal is completed.
By combining all the technical schemes, the invention has the advantages and positive effects that:
1. use this device in vacuum environment, when can effectively avoiding the metal purification product phenomenon of droing, can also reach the purpose that improves product purity through multizone control by temperature change evaporation.
2. The target metal is condensed on the crucible collimating nozzle and slit plates at different positions through different heating temperatures and different physical characteristics due to different evaporation temperatures and impurities, and then further sinks to the collecting plate. Meanwhile, because the lower nozzle device is used for purification and separation under the vacuum condition, the metal oxide is correspondingly reduced, and the aim of improving the metal purity is finally fulfilled.
3. The beam type structures such as the collimation nozzle and the slit plate are added in the evaporation structure, so that the atom divergence is reduced, and the reduction of the evaporation utilization rate caused by the fact that atom vapor evaporated from the slit plate is evaporated to the structure outside the collecting plate is prevented.
Drawings
The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and examples, but it should be understood that these drawings are designed for illustrative purposes only and thus do not limit the scope of the present invention. Furthermore, unless otherwise indicated, the drawings are intended to be illustrative of the structural configurations described herein and are not necessarily drawn to scale.
FIG. 1 is a schematic plan view of the present invention enclosed in a vacuum chamber;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is a sectional view showing a plan structure of a crucible in the present invention.
In the figure:
1-crucible cover; 2-a crucible; 3-a slit plate; 4-support angle iron; 5-collecting plate; 6-crucible cover heating area; 7-crucible heating zone; 8-collimating nozzle; 9-collimating the jet beam pattern region; 10-a honeycomb panel; 11-a target metal; 12-a base plate; 13-a support column; 14-support table.
Detailed Description
First, it should be noted that the specific structures, features, advantages, etc. of the present invention will be specifically described below by way of example, but all the descriptions are for illustrative purposes only and should not be construed as limiting the present invention in any way. Furthermore, any single feature described or implicit in any embodiment or any single feature shown or implicit in any drawing may still be combined or subtracted between any of the features (or equivalents thereof) to obtain still further embodiments of the invention that may not be directly mentioned herein. In addition, for the sake of simplicity, the same or similar features may be indicated in only one place in the same drawing.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
The present invention will be described in detail with reference to FIGS. 1 to 3.
Example 1:
the utility model provides a lower spout evaporation plant for metal evaporation, includes bottom plate 12, support column 13 is installed to the both sides of bottom plate 12, support column 13 is by supreme collection plate 5 and the evaporation mechanism of installing in proper order down, be equipped with heating unit in the evaporation mechanism.
The working principle is as follows:
according to the technical scheme, the target metal 11 placed in the evaporation mechanism is heated, so that impurities generated by the target metal are left, generated steam is downwards precipitated and finally condensed on the collecting plate 5, and metal purification is realized. The heating temperature on each part of the evaporation mechanism is different, the physical characteristics of different target metals 11 are also different, and finally, the metal purification with different requirements can be completed.
Further, in an embodiment, the evaporation mechanism includes a slit plate 3 installed on the supporting column 13, a crucible 2 is installed above the slit plate 3, a collimating nozzle 8 is arranged at the bottom of the crucible 2, and a crucible cover 1 is installed at the top of the crucible 2; the crucible 2 and the crucible cover 1 are both of a hollow structure, and a heating unit is arranged inside the crucible cover.
A crucible heating region 7 is formed on the crucible 2, a crucible cover heating region 6 is formed on the crucible cover 1, and a heating region is also formed on the collimation spout 8.
The target metal 11 is placed in the crucible 2, the crucible 2 is heated, the target metal 11 starts to evaporate, metal vapor enters a heating area of the collimation nozzle 8, the metal vapor is evaporated from the lower part of the crucible 2 through the slit plate 3, and finally the metal vapor is condensed at the collecting plate 5 below the nozzle, so that the metal purification with different requirements is completed.
The arrangement of the collimating nozzle 8 and the slit plate 3 can reduce the divergence of atoms and prevent the evaporated atom vapor from evaporating to the structure outside the collecting plate 5, thereby reducing the evaporation utilization rate.
Furthermore, it is also contemplated in the embodiment that the bottom of the crucible 2 is formed by 2 "L" shaped portions, which are opposite to each other, and the collimating nozzle 8 is formed between the 2 "L" shaped portions. In the purification operation, the target metal 11 is placed on the lateral portion of the "L" shaped portion. The collimation nozzle 8 with the shape can form a collimation nozzle beam-shaped area 9, and a heating unit is also arranged in the collimation nozzle 8, so that the temperature and the steam beam shape can be controlled, impurities can be left, and purified steam can be precipitated downwards.
Further, it is also contemplated in embodiments that the lower end of the collimating nozzle 8 is vertically mounted with a honeycomb plate 10. The cellular board 10 can store energy and heat, so that steam cannot be condensed too early and can further sink to the slit board 3. Meanwhile, the honeycomb plate 10 can be regarded as an array consisting of a plurality of slender tubes, so that large-angle scattering of atomic steam can be reduced, and the steam beam type is further improved.
Furthermore, it is also conceivable in an embodiment that the heating unit is formed by uniformly distributed resistance heating wires. The resistance heating wire adopts a temperature control power supply to carry out heating and temperature control. The resistance heating wire has low energy consumption and low cost. In the embodiment, the resistance heating wire is only a preferred choice, and other heating materials are also suitable for the technical scheme.
Further, it is also considered in an embodiment that a wide slit is formed in the middle of the slit plate 3, and the wide slit and the collimating nozzle 8 correspond to each other in parallel. The wide slit of the slit plate 3 is provided with different sizes according to different process requirements. The formation of the wide slit further restricts the flow path of the steam and can reduce the heat loss of the steam, so that the steam can be precipitated downwards in the range of the wide slit and finally collected on the collecting plate 5. And part of the impurities evaporated at the same time remain on the slit plate 3, further purifying the vapor.
Furthermore, it is also contemplated in the exemplary embodiment that the slit plate 3 is mounted on the supporting column 13 via a supporting angle 4. The supporting angle iron 4 is convenient to install and replace, strong in supporting force and suitable for various pressure-bearing environments.
Further, it is also considered in the embodiment that the slit plate 3 is provided with a plurality of layers from top to bottom along the supporting columns 13. The slit plate 3 is matched with different assembly positions and different layer numbers through a supporting angle iron 4 arranged on a supporting column 13, the position of the slit plate 3 is adjusted, so that metal in a vacuum cavity is evaporated and bundled, and a final product is condensed on a collecting plate 5 below the vacuum cavity.
Furthermore, it is also considered in the embodiment that a support table 14 is provided on the bottom plate 12, and the collection plate 5 is mounted on the support table 14. The support platform 14 provides support for the collector plates 5, so that the collector plates 5 can be kept stable even after heavy metal objects are condensed thereon.
In the technical scheme, metal vapor generated by heating the crucible 2 is bundled through a collimating nozzle bundling area 9 and a honeycomb plate 10, further bundling is carried out by utilizing a plurality of layers of slit plates 3, and finally metal purification is finished on a collecting plate 5. The crucible 2, the slit plate 3, the supporting angle iron 4 and the collecting plate 5 are all made of 304 stainless steel materials. The stainless steel has the advantages of rust resistance, long service life, adaptability to vacuum environment, stable physical characteristics and no influence of high temperature change on the purification of the target metal 11.
Furthermore, it is also considered in the embodiment that the supporting column 13 is a T-shaped structure for stable support of the evaporation device.
Example 2:
a purification method for metal evaporation, applying the lower nozzle evaporation device for metal evaporation of embodiment 1, comprising the steps of:
s101: placing a target metal 11 in the crucible 2;
s102: the lower nozzle evaporation device is integrally placed in a vacuum cavity, air in the vacuum cavity is pumped out by a vacuum maintaining system, and when the vacuum degree reaches a process preset value, the crucible 2 and the crucible cover 1 are respectively heated, so that the target metal 11 in the crucible 2 starts to evaporate;
s103: the metal vapor generated after evaporation passes through a collimation spout 8 heating area on the collimation spout 8, a collimation spout beam type area 9, a honeycomb plate 10 and a slit plate 3, and is finally condensed on a collecting plate 5 below the collimation spout 8, and the purification of the target metal 11 is completed.
The operation steps are as follows:
the vacuum maintaining system is used for pumping air in the vacuum cavity, when the vacuum degree in the vacuum cavity reaches a process preset value, the crucible 2 and the crucible cover 1 are respectively heated, the resistance heating wires in the crucible 2 and the crucible cover 1 start to heat, the target metal 11 in the crucible 2 starts to evaporate, generated steam rises, a part of steam is stained on the crucible cover 1, a part of steam descends to enter the collimation spout 8 of the crucible 2, the collimation spout beam type area 9 carries out steam beam gathering, the honeycomb plate 10 on the collimation spout 8 can maintain the heat of the steam, so that the steam is maintained in a high-temperature state, and the steam further sinks. The sinking steam sequentially passes through the wide slits on the slit plates 3 with the set number of layers to be further bundled and finally condensed on the collecting plate 5 below, and the purification of the target metal 11 is completed.
Because of different physical properties of different metals and different evaporation curves, the vapor can condense impurities in a designated area when passing through areas with different temperatures, namely, the aim of primarily purifying the metal in the crucible 2 can be achieved by controlling the heating temperatures of 3 parts, namely the crucible 2, the crucible cover 1 and the collimation spout 8, in the crucible 2. The structure of the collimation spout 8 can evaporate the vapor at the lower part of the crucible 2, and finally the vapor is condensed at the collecting plate 5, so that the metal purification with different requirements is completed.
By adopting the scheme of the lower nozzle device, the metal materials on the collecting plate 5 can not fall off due to the gravity problem to influence the yield.
In conclusion, the invention provides a lower nozzle evaporation device for metal evaporation and a purification method thereof.
The present invention has been described in detail with reference to the above examples, but the description is only for the preferred examples of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (10)
1. The utility model provides a lower spout evaporation plant for metal evaporation which characterized in that: the heating device comprises a base plate, the support column is installed to the both sides of bottom plate, the support column is by supreme collection board and the evaporation mechanism of installing in proper order down, be equipped with heating unit in the evaporation mechanism.
2. A lower nozzle evaporation device for metal evaporation as claimed in claim 1, wherein: the evaporation mechanism comprises a slit plate arranged on the supporting column, a crucible is arranged above the slit plate, a collimation spout is arranged at the bottom of the crucible, and a crucible cover is arranged at the top of the crucible; the crucible and the crucible cover are both of hollow structures, and a heating unit is arranged inside the crucible and the crucible cover.
3. A lower nozzle evaporation device for metal evaporation according to claim 2, wherein: the bottom of the crucible is formed by 2L-shaped parts which are opposite, and a collimation spout is formed between the 2L-shaped parts.
4. A lower nozzle evaporation device for metal evaporation according to claim 3, wherein: and a honeycomb plate is vertically arranged at the lower end of the collimation nozzle.
5. A lower nozzle evaporation device for metal evaporation according to claim 4, wherein: the heating unit is composed of resistance heating wires which are uniformly distributed.
6. A lower nozzle evaporation device for metal evaporation according to claim 5, wherein: and a wide slit is formed in the middle of the slit plate and corresponds to the collimation nozzle in parallel.
7. A lower nozzle evaporation device for metal evaporation according to claim 6, wherein: the slit plate is installed on the supporting column through supporting angle iron.
8. A lower nozzle evaporation device for metal evaporation according to claim 7, wherein: the slit plate is provided with a plurality of layers along the support column from top to bottom.
9. A lower nozzle evaporation device for metal evaporation as claimed in any one of claims 1 to 8, wherein: the bottom plate is provided with a supporting platform, and the collecting plate is arranged on the supporting platform.
10. A purification method for metal evaporation, applying the lower nozzle evaporation device for metal evaporation of claim 9, characterized by comprising the following steps:
s101: placing a target metal in a crucible;
s102: the lower nozzle evaporation plant is integrally placed in a vacuum cavity, air in the vacuum cavity is pumped out by a vacuum maintaining system, and when the vacuum degree reaches a preset process value, the crucible and the crucible cover are respectively heated, so that target metal in the crucible starts to evaporate;
s103: and the metal vapor generated after evaporation passes through a collimation spout heating area, a collimation spout beam-type area, a honeycomb plate and a slit plate on the collimation spout, and is finally condensed on a collecting plate below the collimation spout, so that the purification of the target metal is completed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211649737.7A CN115927864A (en) | 2022-12-21 | 2022-12-21 | Lower nozzle evaporation device for metal evaporation and purification method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211649737.7A CN115927864A (en) | 2022-12-21 | 2022-12-21 | Lower nozzle evaporation device for metal evaporation and purification method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1058866A (en) * | 1975-07-08 | 1979-07-24 | Valentin I. Belsky | Apparatus for continuous vacuum-refining of metals |
| CN101886181A (en) * | 2010-06-17 | 2010-11-17 | 重庆昆瑜锂业有限公司 | Vacuum distillation purification furnace for metal lithium |
| CN102021517A (en) * | 2010-10-29 | 2011-04-20 | 陕西科技大学 | Screen mesh type evaporating source in OLED preparing process and evaporating method |
| CN204434697U (en) * | 2015-02-04 | 2015-07-01 | 昆明鼎邦科技有限公司 | A kind of vacuum distillation furnace processing non-ferrous metal alloy slag charge |
| CN111424239A (en) * | 2020-04-14 | 2020-07-17 | 杭州纤纳光电科技有限公司 | Evaporation furnace and double-sided coating device |
| CN215887189U (en) * | 2021-09-06 | 2022-02-22 | 华厦半导体(深圳)有限公司 | Extraction device of high-purity indium |
-
2022
- 2022-12-21 CN CN202211649737.7A patent/CN115927864A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1058866A (en) * | 1975-07-08 | 1979-07-24 | Valentin I. Belsky | Apparatus for continuous vacuum-refining of metals |
| CN101886181A (en) * | 2010-06-17 | 2010-11-17 | 重庆昆瑜锂业有限公司 | Vacuum distillation purification furnace for metal lithium |
| CN102021517A (en) * | 2010-10-29 | 2011-04-20 | 陕西科技大学 | Screen mesh type evaporating source in OLED preparing process and evaporating method |
| CN204434697U (en) * | 2015-02-04 | 2015-07-01 | 昆明鼎邦科技有限公司 | A kind of vacuum distillation furnace processing non-ferrous metal alloy slag charge |
| CN111424239A (en) * | 2020-04-14 | 2020-07-17 | 杭州纤纳光电科技有限公司 | Evaporation furnace and double-sided coating device |
| CN215887189U (en) * | 2021-09-06 | 2022-02-22 | 华厦半导体(深圳)有限公司 | Extraction device of high-purity indium |
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