CN115904418A - A system and method for burning PCIE cascade chip firmware - Google Patents
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Abstract
Description
技术领域technical field
本申请涉及数据处理领域,特别是涉及一种PCIE级联芯片固件烧录的系统和方法。The present application relates to the field of data processing, in particular to a system and method for programming firmware of PCIE cascaded chips.
背景技术Background technique
高算力需求场景例如自动驾驶、AI计算,有时可能单芯片算力不能满足需求,从而需要两个甚至多个芯片级联,而每个芯片都需要独立加载固件运行。为了方便电路布局、软件包管理以及生产工序,电路板预留接口与上位机通讯,用来下载所有芯片固件或其他操作。目前常用的做法是为每个芯片预留上位机接口来烧写各自的固件,每个芯片都有自己的存储器和固件,如果上位机都是通过每个芯片的上位机接口与芯片连接来烧写固件,那么会存在如下问题:增加芯片管脚的消耗,导致可用管脚减少,增加电路布线时复杂度,增加软件版本管理难度,增加了生产工序。Scenarios with high computing power requirements, such as autonomous driving and AI computing, sometimes the computing power of a single chip may not meet the demand, thus requiring two or more chips to be cascaded, and each chip needs to be independently loaded with firmware to run. In order to facilitate circuit layout, software package management and production process, the circuit board reserves an interface to communicate with the host computer to download all chip firmware or other operations. At present, the commonly used method is to reserve the host computer interface for each chip to program their own firmware. Each chip has its own memory and firmware. If the host computer is connected to the chip through the host computer interface of each chip to burn Writing firmware, there will be the following problems: increasing the consumption of chip pins, resulting in a decrease in available pins, increasing the complexity of circuit wiring, increasing the difficulty of software version management, and increasing the production process.
发明内容Contents of the invention
为了解决现有技术中存在的至少一个问题,本申请的目的在于提供一种PCIE级联芯片固件烧录的方法和系统,能够实现仅用一个上位机接口实现其余各个芯片固件的烧写,利用高速互联PCIE接口来通讯和接收上位机发送的固件,从而节省了上位机接口,减少了生产工序,并便于软件版本管理。In order to solve at least one problem existing in the prior art, the purpose of this application is to provide a method and system for programming PCIE cascaded chip firmware, which can realize the programming of other chip firmware with only one host computer interface. The high-speed interconnection PCIE interface communicates and receives the firmware sent by the upper computer, thus saving the upper computer interface, reducing the production process, and facilitating software version management.
为实现上述目的,本申请提供的PCIE级联芯片固件烧录的系统,所述PCIE级联芯片固件烧录的系统,包括通过PCIE级联的多个芯片和与每个所述芯片对应的存储器,其中第一级芯片配置有上位机接口,用于与上位机进行通信;In order to achieve the above object, the application provides a PCIE cascade chip firmware programming system, the PCIE cascade chip firmware programming system includes a plurality of chips cascaded through PCIE and a memory corresponding to each chip , wherein the first-level chip is configured with a host computer interface for communicating with the host computer;
所述第一级芯片,被配置为通过所述上位机接口依次接收所述上位机发送给每个所述芯片的第一数据包;The first-level chip is configured to sequentially receive the first data packet sent by the host computer to each of the chips through the host computer interface;
每个所述芯片,被配置为基于所述第一数据包中的芯片标识与自身的标识进行匹配,若匹配失败,则将所述第一数据包转发至下一级芯片,若匹配成功,则运行所述第一数据包中的下载代理程序,并向所述上位机返回第一响应;Each of the chips is configured to match the chip identification in the first data packet with its own identification, if the matching fails, forward the first data packet to the next-level chip, and if the matching is successful, Then run the download agent program in the first data packet, and return the first response to the host computer;
与所述第一响应对应的所述芯片被配置为获取所述上位机发送第二数据包,并将所述第二数据包中的固件烧录至对应的所述存储器。The chip corresponding to the first response is configured to obtain the second data packet sent by the host computer, and burn the firmware in the second data packet to the corresponding memory.
进一步地,与所述第一响应对应的所述芯片,还被配置为在烧录完成后向所述上位机返回第二响应;Further, the chip corresponding to the first response is further configured to return a second response to the host computer after the programming is completed;
所述上位机基于所述第二响应,发送下一级所述芯片的所述第二数据包。The host computer sends the second data packet of the chip at the next level based on the second response.
进一步地,所述第一级芯片,还被配置为通过所述上位机接口依次将每个芯片返回的所述第一响应发送至所述上位机,以及通过所述上位机接口依次将每个所述芯片返回的所述第二响应发送至所述上位机。Further, the first-level chip is also configured to sequentially send the first response returned by each chip to the host computer through the host computer interface, and sequentially send each response to the host computer through the host computer interface. The second response returned by the chip is sent to the host computer.
进一步地,所述第一级芯片被配置为上位机接口启动,其它各个芯片被配置为PCIE接口启动,所述第一级芯片的输出端PCIE接口被配置为根复合体模式,最后一级芯片的输入端PCIE接口被配置为端点模式,中间每一级芯片的输入端PCIE接口被配置为端点模式、输出端PCIE接口被配置为根复合体模式。Further, the first-level chip is configured to start the host computer interface, and other chips are configured to start the PCIE interface, the output PCIE interface of the first-level chip is configured as the root complex mode, and the last-level chip The input PCIE interface of the chip is configured as an endpoint mode, the input PCIE interface of each intermediate chip is configured as an endpoint mode, and the output PCIE interface is configured as a root complex mode.
进一步地,每个所述芯片分别包括随机存取存储器,所述随机存取存储器用于暂时存储与运行所述下载代理程序,以及暂时存储所述固件。Further, each of the chips includes a random access memory, and the random access memory is used for temporarily storing and running the download agent program, and temporarily storing the firmware.
进一步地,上电后,除所述第一级芯片外的其它芯片内的随机存取存储器被配置为映射至上一级芯片的输出端PCIE接口。Further, after power-on, random access memories in other chips except the first-level chip are configured to be mapped to the output PCIE interface of the upper-level chip.
进一步地,所述第一数据包包括所述芯片标识和所述下载代理程序,所述第二数据包包括所述芯片标识和所述固件。Further, the first data packet includes the chip identification and the download agent program, and the second data packet includes the chip identification and the firmware.
进一步地,所述第二数据包采用快速启动命令格式进行传输。Further, the second data packet is transmitted in a quick start command format.
进一步地,所述第一级芯片被配置为通过先进先出队列模式传输所述第二数据包。Further, the first-level chip is configured to transmit the second data packet in a first-in-first-out queue mode.
为实现上述目的,本申请还提供的一种PCIE级联芯片固件烧录的方法,包括:In order to achieve the above purpose, the present application also provides a method for burning PCIE cascade chip firmware, including:
所述第一级芯片通过所述上位机接口依次接收所述上位机发送给每个所述芯片的第一数据包;The first-level chips sequentially receive the first data packets sent by the host computer to each of the chips through the host computer interface;
每个所述芯片基于所述第一数据包中的芯片标识与自身的标识进行匹配,若匹配失败,则将所述第一数据包转发至下一级芯片,若匹配成功,则运行所述第一数据包中的下载代理程序,并向所述上位机返回第一响应;Each of the chips performs matching based on the chip identification in the first data packet and its own identification, if the matching fails, the first data packet is forwarded to the next-level chip, and if the matching is successful, the Download the agent program in the first data packet, and return the first response to the host computer;
与所述第一响应对应的所述芯片获取所述上位机发送第二数据包,并将所述第二数据包中的固件烧录至对应的存储器。The chip corresponding to the first response obtains the second data packet sent by the host computer, and burns the firmware in the second data packet into the corresponding memory.
进一步地,所述向所述上位机返回第一响应的步骤,包括:Further, the step of returning the first response to the host computer includes:
若发送所述第一响应的芯片是所述第一级芯片,则通过所述上位机接口向所述上位机发送所述第一响应;If the chip sending the first response is the first-level chip, sending the first response to the host computer through the host computer interface;
若发送所述第一响应的芯片不是所述第一级芯片,则向上一级芯片发送所述第一响应,直至所述第一级芯片收到所述第一响应后,通过所述上位机接口向所述上位机发送所述第一响应。If the chip that sends the first response is not the first-level chip, then send the first response to the upper-level chip until the first-level chip receives the first response, and through the host computer The interface sends the first response to the host computer.
进一步地,在所述将所述第二数据包中的固件烧录至对应的存储器的步骤之后,还包括:Further, after the step of burning the firmware in the second data package to the corresponding memory, it also includes:
在烧录完成后向所述上位机返回第二响应;Returning a second response to the host computer after the burning is completed;
所述上位机基于所述第二响应,发送下一级所述芯片的所述第二数据包。The host computer sends the second data packet of the chip at the next level based on the second response.
进一步地,所述向所述上位机返回第二响应的步骤,包括:Further, the step of returning the second response to the host computer includes:
若发送所述第二响应的芯片是所述第一级芯片,则通过所述上位机接口向所述上位机发送所述第二响应;If the chip sending the second response is the first-level chip, sending the second response to the host computer through the host computer interface;
若发送所述第二响应的芯片不是所述第一级芯片,则向上一级芯片发送所述第二响应,直至所述第一级芯片收到所述第二响应后,通过所述上位机接口向所述上位机发送所述第二响应。If the chip that sends the second response is not the first-level chip, then send the second response to the upper-level chip until the first-level chip receives the second response, and through the host computer The interface sends the second response to the host computer.
为实现上述目的,本申请还提供的芯片,其上集成有如上所述的PCIE级联芯片固件烧录的系统。To achieve the above purpose, the present application also provides a chip on which the above-mentioned PCIE cascade chip firmware programming system is integrated.
为实现上述目的,本申请还提供的电路板,包括如上所述的芯片。In order to achieve the above purpose, the present application also provides a circuit board, including the above-mentioned chip.
为实现上述目的,本申请还提供的车机,包括如上所述的芯片。In order to achieve the above purpose, the present application also provides a car machine, including the above-mentioned chip.
为实现上述目的,本申请还提供的电子设备,包括,存储器和处理器,其特征在于,所述存储器中存储有计算机指令,所述处理器被设置为运行所述指令以执行如上所述的PCIE级联芯片固件烧录的方法的步骤。To achieve the above object, the present application also provides electronic equipment, including a memory and a processor, wherein computer instructions are stored in the memory, and the processor is configured to run the instructions to perform the above-mentioned The steps of the method for burning PCIE cascade chip firmware.
为实现上述目的,本申请还提供的计算机可读存储介质,其上存储有计算机指令,当计算机指令运行时执行如上所述的PCIE级联芯片固件烧录的方法的步骤。To achieve the above object, the present application also provides a computer-readable storage medium, on which computer instructions are stored, and when the computer instructions are executed, the steps of the method for burning the firmware of the PCIE cascade chip as described above are executed.
本申请的一种PCIE级联芯片固件烧录的方法和系统,通过第一级芯片从上位机接收下载代理程序,每个芯片将与自身匹配的下载代理程序下载到芯片的内部RAM运行,再由下载代理程序接收与自己匹配的固件并烧写到对应的存储器,能够实现仅用一个上位机接口实现各个级联芯片固件的烧写,利用高速互联PCIE接口来通讯和接收上位机发送的固件,从而节省了上位机接口,减少了生产工序,并便于软件版本管理。A kind of PCIE cascading chip firmware burning method and system of the present application, receive download agent program from upper computer through first-level chip, each chip downloads the download agent program that matches itself to the internal RAM operation of chip, and then The download agent program receives the firmware that matches itself and writes it to the corresponding memory. It can realize the programming of each cascaded chip firmware with only one host computer interface, and use the high-speed interconnection PCIE interface to communicate and receive the firmware sent by the host computer. , thus saving the host computer interface, reducing the production process, and facilitating software version management.
本申请的其它特征和优点将在随后的说明书中阐述,并且,部分地从说明书中变得显而易见,或者通过实施本申请而了解。Additional features and advantages of the application will be set forth in the description which follows, and, in part, will be obvious from the description, or may be learned by practice of the application.
附图说明Description of drawings
附图用来提供对本申请的进一步理解,并且构成说明书的一部分,并与本申请的实施例一起,用于解释本申请,并不构成对本申请的限制。在附图中:The accompanying drawings are used to provide a further understanding of the present application, and constitute a part of the description, and together with the embodiments of the present application, are used to explain the present application, and do not constitute a limitation to the present application. In the attached picture:
图1为根据本申请另一个实施例的PCIE级联芯片固件烧录的系统结构框图;Fig. 1 is a system structure block diagram of PCIE cascade chip firmware burning according to another embodiment of the present application;
图2为根据本申请一个实施例的PCIE级联芯片固件烧录的方法流程图;Fig. 2 is a flow chart of a method for burning PCIE cascade chip firmware according to an embodiment of the present application;
图3为根据本申请另一个实施例的PCIE级联芯片固件烧录的方法流程图;Fig. 3 is a flow chart of a method for burning PCIE cascade chip firmware according to another embodiment of the present application;
图4为根据本申请实施例的芯片结构示意图;FIG. 4 is a schematic diagram of a chip structure according to an embodiment of the present application;
图5为根据本申请实施例的电路板结构示意图;FIG. 5 is a schematic structural diagram of a circuit board according to an embodiment of the present application;
图6为根据本申请实施例的车机结构示意图。Fig. 6 is a schematic structural diagram of a car machine according to an embodiment of the present application.
具体实施方式Detailed ways
下面将参照附图更详细地描述本申请的实施例。虽然附图中显示了本申请的某些实施例,然而应当理解的是,本申请可以通过各种形式来实现,而且不应该被解释为限于这里阐述的实施例,相反提供这些实施例是为了更加透彻和完整地理解本申请。应当理解的是,本申请的附图及实施例仅用于示例性作用,并非用于限制本申请的保护范围。Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the drawings, it should be understood that the application may be embodied in various forms and should not be construed as limited to the embodiments set forth herein; A more thorough and complete understanding of the application. It should be understood that the drawings and embodiments of the present application are for exemplary purposes only, and are not intended to limit the protection scope of the present application.
应当理解,本申请的方法实施方式中记载的各个步骤可以按照不同的顺序执行,和/或并行执行。此外,方法实施方式可以包括附加的步骤和/或省略执行示出的步骤。本申请的范围在此方面不受限制。It should be understood that the various steps described in the method implementations of the present application may be executed in different orders, and/or executed in parallel. Additionally, method embodiments may include additional steps and/or omit performing illustrated steps. The scope of the application is not limited in this respect.
本文使用的术语“包括”及其变形是开放性包括,即“包括但不限于”。术语“基于”是“至少部分地基于”。术语“一个实施例”表示“至少一个实施例”;术语“另一实施例”表示“至少一个另外的实施例”;术语“一些实施例”表示“至少一些实施例”。其他术语的相关定义将在下文描述中给出。As used herein, the term "comprise" and its variations are open-ended, ie "including but not limited to". The term "based on" is "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one further embodiment"; the term "some embodiments" means "at least some embodiments." Relevant definitions of other terms will be given in the description below.
需要注意,本申请中提及的“第一”、“第二”等仅用于对不同的装置、模块、单元或数据进行区分,并非用于限定这些装置、模块、单元或数据所执行的功能的顺序或者相互依存关系。It should be noted that the "first", "second", etc. mentioned in this application are only used to distinguish different devices, modules, units or data, and are not used to limit the implementation of these devices, modules, units or data. The sequence or interdependence of functions.
需要注意,本申请中提及的“一个”、“多个”的修饰是示意性而非限制性的,本领域技术人员应当理解,除非在上下文另有明确指出,否则应该理解为“一个或多个”。“多个”应理解为两个或以上。It should be noted that the modifications of "one" and "multiple" mentioned in this application are illustrative and not restrictive. Those skilled in the art should understand that unless the context clearly indicates otherwise, it should be understood as "one or more" multiple". "Plurality" should be understood as two or more.
下面,将参考附图详细地说明本申请的实施例。Hereinafter, embodiments of the present application will be described in detail with reference to the drawings.
固件:Firmware ,是指写入EROM( Erasable ROM,可擦写只读存储器)和EEPROM(Electrically Erasable Programmable ROM,电可擦可编程只读存储器)中的程序,也就是设备内部保存的设备“驱动程序”;Firmware: Firmware refers to the program written in EROM (Erasable ROM, erasable read-only memory) and EEPROM (Electrically Erasable Programmable ROM, electrically erasable programmable read-only memory), that is, the device "driver" stored inside the device program";
烧录:是将写好的程序编译好形成HEX或BIN文件后,将这个程序写入芯片的过程;Burning: It is the process of writing the program into the chip after compiling the written program to form a HEX or BIN file;
DA:Download Agent,下载代理;DA: Download Agent, download agent;
PCIE:Peripheral Component Interconnect express,是一种高速串行计算机扩展总线标准;PCIE: Peripheral Component Interconnect express, is a high-speed serial computer expansion bus standard;
RAM :Random Access Memory,随机存取存储器;RAM: Random Access Memory, random access memory;
RC:Root Complex,根复合体设备,PCIe 协议中一种组成元件;RC: Root Complex, a root complex device, a component in the PCIe protocol;
EP:Endpoint,端点,PCIe 协议中一种组成元件;EP: Endpoint, an endpoint, a component in the PCIe protocol;
USB:Universal Serial Bus,通用串行总线,是一个外部总线标准,用于规范电脑与外部设备的连接和通讯;USB: Universal Serial Bus, Universal Serial Bus, is an external bus standard used to regulate the connection and communication between computers and external devices;
Fastboot,快速启动,是一种电脑通过USB数据线对手机固件进行刷写、擦除/格式化、调试、传输各种指令的固件通信协议;Fastboot, fast boot, is a firmware communication protocol for a computer to flash, erase/format, debug, and transmit various instructions to the phone firmware through a USB data cable;
FIFO,First Input First Output,先进先出,先进入的命令先完成并引退,跟着才执行第二条命令。FIFO, First Input First Output, first in first out, the command entered first is completed and retired first, and then the second command is executed.
实施例1Example 1
图1为根据本申请一个实施例的PCIE级联芯片固件烧录的系统结构框图。参考图1所示,本申请实施例中PCIE级联芯片固件烧录的系统10,包括通过PCIE级联的多个芯片11和与每个所述芯片对应的存储器12,芯片11包括:第一级芯片、第二级芯片......第N级芯片,各个芯片之间通过PCIE进行级联,存储器12包括存储器1、存储器2......存储器N,其中,存储器1与对应的第一级芯片连接,存储器2与对应的第二级芯片连接......存储器N与对应的第N级芯片连接,其中仅第一级芯片配置有上位机接口,用于与所述上位机进行通信;Fig. 1 is a system structure diagram of PCIE cascade chip firmware programming according to an embodiment of the present application. Referring to Fig. 1, the
所述第一级芯片,被配置为通过所述上位机接口依次接收所述上位机发送给每个芯片11的第一数据包;The first-level chip is configured to sequentially receive the first data packet sent to each
每个所述芯片11,被配置为基于所述第一数据包中的芯片标识与自身的标识进行匹配,若匹配失败,则将所述第一数据包转发至下一级芯片,若匹配成功,则运行所述第一数据包中的下载代理程序,并向所述上位机返回第一响应;Each of the
与所述第一响应对应的所述芯片11被配置为获取所述上位机发送的第二数据包,并将所述第二数据包中的固件烧录至对应的所述存储器12。The
进一步地,本申请实施例中,与所述第一响应对应的所述芯片,还被配置为在烧录完成后向所述上位机返回第二响应;Further, in the embodiment of the present application, the chip corresponding to the first response is further configured to return a second response to the host computer after the programming is completed;
所述上位机基于所述第二响应,发送下一级芯片的所述第二数据包。The host computer sends the second data packet of the next-level chip based on the second response.
具体地,所述第一数据包由上位机构建并发送,所述第一数据包中包括芯片标识和下载代理程序,所述第一级芯片是指通过上位机接口直接与上位机相连的芯片,所述第一级芯片的上位机接口直接接收上位机发送的第一数据包,所上位机接口是指所述第一级芯片可以与上位机通信的接口,例如USB接口。Specifically, the first data packet is constructed and sent by the host computer, and the first data packet includes a chip identification and a download agent program, and the first-level chip refers to a chip directly connected to the host computer through an interface of the host computer , the host computer interface of the first-level chip directly receives the first data packet sent by the host computer, and the host computer interface refers to an interface through which the first-level chip can communicate with the host computer, such as a USB interface.
进一步地,本申请实施例中,所述第一级芯片,还被配置为通过所述上位机接口将所述第一响应发送至所述上位机,以及通过所述上位机接口将所述第二响应发送至所述上位机。Further, in the embodiment of the present application, the first-level chip is further configured to send the first response to the host computer through the host computer interface, and send the first response to the host computer through the host computer interface. The second response is sent to the upper computer.
也就是说,上位机需要依次发送每个芯片11的下载代理程序,例如上位机先通过上位机接口发送第一级芯片的下载代理程序,第一级芯片匹配成功后,通过上位机接口向上位机返回第一响应,上位机再通过上位机接口向第一级芯片发送第二级芯片的下载代理程序,第一级芯片收到下载代理程序并匹配失败后,转发给第二级芯片,第二级芯片收到下载代理程序匹配成功后,向第一级芯片发送给上位机的第一响应,第一级芯片收到第一响应后发送给上位机;上位机收到第二级芯片返回的第一响应后发送第三级芯片的下载代理程序......以此类推,当上位机发送完最后一个芯片的下载代理程序,并收到最后一个芯片也就是第N级芯片返回的第一响应之后,上位机开始依次发送每一个芯片11的固件,例如上位机先通过上位机接口发送第一级芯片的固件,第一级芯片匹配成功后,第一级芯片的DA接收并烧写固件到第一级芯片对应的存储器1,通过上位机接口向上位机返回第二响应,上位机再通过上位机接口给第一级芯片发送第二级芯片的固件,第一级芯片匹配失败后,转发给第二级芯片,第二级芯片收到固件匹配成功后,第二级芯片的DA接收并烧写固件到第二级芯片对应的存储器2,向第一级芯片发送给上位机的第二响应,第一级芯片收到第二响应后发送给上位机;上位机收到第二级芯片返回的第二响应后发送第三级芯片的固件......以此类推,直到上位机发送完最后一个芯片即第N级芯片的固件,并收到最后一个芯片即第N级芯片返回的第二响应之后结束。That is to say, the host computer needs to send the download agent program of each
进一步地,本申请实施例中,所述第一数据包包括所述芯片标识和所述下载代理程序,所述第二数据包包括所述芯片标识和所述固件。Further, in the embodiment of the present application, the first data packet includes the chip identification and the download agent program, and the second data packet includes the chip identification and the firmware.
具体地,所述芯片标识是芯片的编码,芯片的编码可以根据厂家、芯片类型、芯片名称、芯片次序、芯片校验等信息保证芯片的身份信息唯一性,进而保证不同芯片可以具有不同的芯片标识。Specifically, the chip identification is the code of the chip, and the code of the chip can ensure the uniqueness of the identity information of the chip according to information such as the manufacturer, chip type, chip name, chip sequence, and chip verification, thereby ensuring that different chips can have different chip codes. logo.
具体地,所述第一数据包中包含所述芯片标识,芯片对所述第一数据包进行解析,提取其中的芯片标识字段,获得芯片标识;Specifically, the first data packet includes the chip identification, and the chip parses the first data packet, extracts the chip identification field therein, and obtains the chip identification;
所述自身的标识,是指本级芯片的编码,在芯片出厂的时候以及烧写在芯片内部,芯片可以直接读取自身的标识;The self-identification refers to the code of the chip at this level. When the chip leaves the factory and is programmed inside the chip, the chip can directly read its own identification;
所述匹配成功是指在所述第一数据包中提取的芯片标识与芯片自身的标识完全相同;The successful matching means that the chip identification extracted in the first data packet is completely the same as the identification of the chip itself;
所述匹配失败是指在所述第一数据包中提取的芯片标识与芯片自身的标识不相同。The matching failure means that the chip identifier extracted in the first data packet is different from the chip's own identifier.
第一级芯片运行下载代理程序,作用是初始化上位机接口,以及初始化PCIE端口,经过初始化的上位机接口准备好接收上位机发送的数据和向上位机发送响应,经过初始化的PCIE端口准备好向下一级芯片发送数据;The first-level chip runs the download agent program, which is used to initialize the host computer interface and initialize the PCIE port. The initialized host computer interface is ready to receive the data sent by the host computer and send a response to the host computer. The initialized PCIE port is ready to send to the host computer. The next-level chip sends data;
其它各芯片运行下载代理程序,作用是初始化PCIE端口,经过初始化的PCIE端口准备好接收上一级芯片发送的数据,以及向下一级芯片发送数据。Other chips run the download agent program to initialize the PCIE port, and the initialized PCIE port is ready to receive the data sent by the upper level chip and send data to the lower level chip.
当各芯片收到发给自己的第二数据包后,下载代理程序的作用是接收固件,并将固件烧录到芯片对应的存储器12。After each chip receives the second data packet sent to itself, the function of the download agent program is to receive the firmware and burn the firmware into the
所述第二数据包由上位机构建并发送,所述第二数据包中包括芯片标识和固件,所述第一级芯片通过上位机接口依次接收所述上位机发送给每个芯片的第二数据包;The second data packet is constructed and sent by the host computer, the second data packet includes chip identification and firmware, and the first-level chip receives the second data sent to each chip by the host computer in turn through the interface of the host computer. data pack;
每个所述芯片基于所述第二数据包的芯片标识与自身的标识进行匹配,若匹配失败,则将所述第二数据包转发至下一级芯片;若匹配成功,则由所述下载代理程序接收所述第二数据包中的固件,将所述固件烧录到对应的存储器12,并在烧录完成后向所述上位机返回第二响应。Each of the chips matches the chip identification of the second data packet with its own identification. If the matching fails, the second data packet is forwarded to the next-level chip; The agent program receives the firmware in the second data packet, burns the firmware into the corresponding
进一步地,所述第二数据包采用快速启动Fastboot 命令格式进行传输。Further, the second data packet is transmitted in the Fastboot command format.
例如,第二数据包的命令格式可以为:chipid:FWx,chipid表示第几个芯片,FWx表示芯片的哪个固件,例如烧写第N个芯片,使用fastboot命令:fastboot flash N:system,表示烧写第N个芯片的system固件。For example, the command format of the second data packet can be: chipid:FWx, chipid indicates which chip, and FWx indicates which firmware of the chip. Write the system firmware of the Nth chip.
具体地,所述芯片标识是芯片的编码,芯片的编码可以根据厂家、芯片类型、芯片名称、芯片次序、芯片校验等信息保证芯片的身份信息唯一性,进而保证不同芯片可以具有不同的芯片标识。Specifically, the chip identification is the code of the chip, and the code of the chip can ensure the uniqueness of the identity information of the chip according to information such as the manufacturer, chip type, chip name, chip sequence, and chip verification, thereby ensuring that different chips can have different chip codes. logo.
具体地,所述第二数据包中包含所述芯片标识信息,对所述第二数据包进行解析,提取其中的芯片标识字段,获得芯片标识;Specifically, the second data packet includes the chip identification information, the second data packet is parsed, and the chip identification field is extracted to obtain the chip identification;
所述自身的标识,是指芯片的编码,在芯片出厂的时候以及烧写在芯片内部,芯片可以直接读取自身的标识;The self-identification refers to the code of the chip. When the chip leaves the factory and is programmed inside the chip, the chip can directly read its own identification;
所述匹配成功是指在所述第二数据包中提取的芯片标识信息与芯片自身的标识信息完全相同;The successful matching means that the chip identification information extracted in the second data packet is completely the same as the identification information of the chip itself;
所述匹配失败是指在所述第二数据包中提取的芯片标识信息与芯片自身的标识信息不相同。The matching failure means that the identification information of the chip extracted in the second data packet is different from the identification information of the chip itself.
具体地,各芯片之间通过PCIE进行逐级相连,具体来说也就是芯片的跟复合体RC直接与下一级芯片的端点EP相连的方式。Specifically, the chips are connected step by step through PCIE, specifically, the link complex RC of the chip is directly connected to the endpoint EP of the next-level chip.
具体地,所述第一级芯片被配置为上位机接口启动,其它各个芯片被配置为PCIE接口启动,所述第一级芯片的输出端PCIE接口被配置为RC模式,最后一级芯片的输入端PCIE接口被配置为EP模式,中间每一级芯片的输入端PCIE接口被配置为EP模式、输出端PCIE接口被配置为RC模式。Specifically, the first-level chip is configured to start the host computer interface, and other chips are configured to start the PCIE interface. The output PCIE interface of the first-level chip is configured as RC mode, and the input of the last-level chip The terminal PCIE interface is configured in EP mode, the input PCIE interface of each intermediate chip is configured in EP mode, and the output PCIE interface is configured in RC mode.
也就是说,芯片的输出端PCIE接口可以成为RC端,芯片的输入端PCIE接口可以称为EP端。芯片的RC端可以把数据发送至下一级芯片的EP端,进而实现与EP端设备之间的通信。That is to say, the PCIE interface at the output end of the chip can be called an RC end, and the PCIE interface at the input end of the chip can be called an EP end. The RC end of the chip can send data to the EP end of the next-level chip, and then realize the communication with the EP end device.
进一步地,本申请实施例中,每个芯片11内分别包括随机存取存储器RAM,所述RAM用于暂时存储与运行所述DA,以及暂时存储所述固件。Further, in the embodiment of the present application, each
每个芯片11收到DA时,都会将DA暂时存放在自身的RAM,基于所述第一数据包中的芯片标识与自身的标识进行匹配,若匹配成功,则在RAM中运行该DA,若匹配失败,从自身的RAM取出DA转发给下一级芯片,即暂时存到下一级芯片的RAM;When each
每个芯片11收到固件时,都会将固件暂时存放在自身的RAM中,若不是与本芯片匹配的固件,从自身的RAM取出固件转发给下一级芯片,即暂时存到下一级芯片的RAM;若是与本芯片匹配的固件,DA将固件从RAM中取出,并烧录到对应的存储器12。When each
进一步地,本申请实施例中,除所述第一级芯片外的其它芯片内的RAM被配置为映射至上一级芯片的输出端PCIE接口。Further, in the embodiment of the present application, the RAMs in other chips except the first-level chip are configured to be mapped to the output PCIE interface of the upper-level chip.
进一步地,本申请实施例中,所述上位机接口可以为USB接口。Further, in the embodiment of the present application, the host computer interface may be a USB interface.
进一步地,本申请实施例中,所述第一级芯片被配置为通过先进先出FIFO队列模式传输所述第二数据包,例如当第一级芯片通过USB接口接收完上位机发送的第二级芯片的固件,将该固件通过PCIE发送给第二级芯片的同时,第一级芯片的USB接口可以继续接收上位机发送的第三级芯片的固件,保证PCIE和上位机接口可以同时工作,提高效率,因此采用FIFO队列,则可以保持上位机接口上一直满负载传输。Further, in the embodiment of the present application, the first-level chip is configured to transmit the second data packet through the first-in-first-out FIFO queue mode, for example, when the first-level chip receives the second packet sent by the host computer through the USB interface. The firmware of the first-level chip, while sending the firmware to the second-level chip through PCIE, the USB interface of the first-level chip can continue to receive the firmware of the third-level chip sent by the host computer, ensuring that the PCIE and the host computer interface can work at the same time, Improve efficiency, so the use of FIFO queues can keep full load transmission on the host computer interface.
根据本申请的一种PCIE级联芯片固件烧录的系统,通过第一级芯片从上位机接收下载代理程序,每个芯片将与自身匹配的下载代理程序下载到芯片的内部RAM运行,再由下载代理程序接收与自己匹配的固件并烧写到对应的存储器,能够实现仅用一个上位机接口实现各个级联芯片固件的烧写,利用高速互联PCIE接口来通讯和接收上位机发送的固件,从而节省了上位机接口,减少了生产工序,并便于软件版本管理。According to the system of a kind of PCIE cascading chip firmware burning of the present application, the download agent program is received from the upper computer through the first-level chip, and each chip downloads the download agent program matched with itself to the internal RAM of the chip to run, and then the The download agent program receives the firmware that matches itself and writes it to the corresponding memory. It can realize the firmware programming of each cascaded chip with only one host computer interface, and use the high-speed interconnection PCIE interface to communicate and receive the firmware sent by the host computer. Thus saving the host computer interface, reducing the production process, and facilitating software version management.
实施例2Example 2
图2为根据本申请一个实施例的PCIE级联芯片固件烧录的方法流程图,下面将参考图2,对本申请的PCIE级联芯片固件烧录的方法进行详细描述。FIG. 2 is a flow chart of a method for burning PCIE cascade chip firmware according to an embodiment of the present application. The method for burning PCIE cascade chip firmware of the present application will be described in detail below with reference to FIG. 2 .
需要说明的是,本申请的PCIE级联芯片固件烧录的方法,应用于通过PCIE级联的多个芯片,其中第一级芯片配置有上位机接口,用于与上位机进行通信;It should be noted that the PCIE cascade chip firmware programming method of the present application is applied to multiple chips cascaded through PCIE, wherein the first-level chip is configured with a host computer interface for communicating with the host computer;
在步骤201,所述第一级芯片通过所述上位机接口依次接收所述上位机发送给每个所述芯片的第一数据包;In
在步骤202,每个所述芯片基于所述第一数据包中的芯片标识与自身的标识进行匹配,若匹配失败,则将所述第一数据包转发至下一级芯片,若匹配成功,则运行所述第一数据包中的下载代理程序,并向所述上位机返回第一响应;In
在步骤203,与所述第一响应对应的所述芯片获取第二数据包,并将所述第二数据包中的固件烧录至对应的存储器;In
具体地,所述向所述上位机返回第一响应的步骤,包括:Specifically, the step of returning the first response to the host computer includes:
若发送所述第一响应的芯片是所述第一级芯片,则通过所述上位机接口向所述上位机发送所述第一响应;If the chip sending the first response is the first-level chip, sending the first response to the host computer through the host computer interface;
若发送所述第一响应的芯片不是所述第一级芯片,则向上一级芯片发送所述第一响应,直至所述第一级芯片收到所述第一响应后,通过所述上位机接口向所述上位机发送所述第一响应。If the chip that sends the first response is not the first-level chip, then send the first response to the upper-level chip until the first-level chip receives the first response, and through the host computer The interface sends the first response to the host computer.
进一步地,在所述将所述第二数据包中的固件烧录至对应的存储器的步骤之后,还包括:Further, after the step of burning the firmware in the second data package to the corresponding memory, it also includes:
向所述上位机返回第二响应;returning a second response to the host computer;
所述上位机基于所述第二响应,发送下一级所述芯片的所述第二数据包。The host computer sends the second data packet of the next-level chip based on the second response.
具体地,所述向所述上位机返回第二响应的步骤,包括:Specifically, the step of returning the second response to the host computer includes:
若与所述第二响应对应的所述芯片是所述第一级芯片,则通过所述上位机接口向所述上位机发送所述第二响应;If the chip corresponding to the second response is the first-level chip, sending the second response to the host computer through the host computer interface;
若与所述第二响应对应的所述芯片不是所述第一级芯片,则向上一级芯片发送所述第二响应,直至所述第一级芯片收到所述第二响应后,通过所述上位机接口向所述上位机发送所述第二响应。If the chip corresponding to the second response is not the first-level chip, send the second response to the upper-level chip until the first-level chip receives the second response. The host computer interface sends the second response to the host computer.
所述第一级芯片,通过所述上位机接口依次将每个芯片返回的所述第一响应发送至所述上位机,以及通过所述上位机接口依次将每个芯片返回的所述第二响应发送至所述上位机。The first-level chips sequentially send the first responses returned by each chip to the host computer through the host computer interface, and sequentially send the second responses returned by each chip through the host computer interface. The response is sent to the host computer.
需要说明的是,上述实施例中对PCIE级联芯片固件烧录的系统的解释说明也适用于上述实施例中的PCIE级联芯片固件烧录的方法,此处不再赘述。It should be noted that, the explanations of the system for burning the firmware of the PCIE cascade chip in the above embodiment are also applicable to the method for burning the firmware of the PCIE cascade chip in the above embodiment, and will not be repeated here.
根据本申请的一种PCIE级联芯片固件烧录的方法,通过第一级芯片从上位机接收下载代理程序,每个芯片将与自身匹配的下载代理程序下载到芯片的内部RAM运行,再由下载代理程序接收与自己匹配的固件并烧写到对应的存储器,能够实现仅用一个上位机接口实现各个级联芯片固件的烧写,利用高速互联PCIE接口来通讯和接收上位机发送的固件,从而节省了上位机接口,减少了生产工序,并便于软件版本管理。According to a kind of PCIE cascade chip firmware burning method of the present application, receive download agent program from upper computer by first-level chip, each chip downloads the download agent program that matches itself to the internal RAM operation of chip, then by The download agent program receives the firmware that matches itself and writes it to the corresponding memory. It can realize the firmware programming of each cascaded chip with only one host computer interface, and use the high-speed interconnection PCIE interface to communicate and receive the firmware sent by the host computer. Thus saving the host computer interface, reducing the production process, and facilitating software version management.
实施例3Example 3
下面通过一个具体实施例对本申请作进一步解释和说明。The present application will be further explained and illustrated through a specific embodiment below.
图3为根据本申请一个实施例的PCIE级联芯片固件烧录的方法流程图,下面将参考图3,对本申请的PCIE级联芯片固件烧录的方法进行详细描述。FIG. 3 is a flowchart of a method for burning PCIE cascade chip firmware according to an embodiment of the present application. The method for burning PCIE cascade chip firmware of the present application will be described in detail below with reference to FIG. 3 .
本申请实施例的PCIE级联芯片固件烧录的方法,应用于通过PCIE级联的N个芯片,其中第一级芯片配置有上位机接口,用于与上位机进行通信,该方法包括以下步骤:The PCIE cascade chip firmware burning method of the embodiment of the present application is applied to N chips cascaded through PCIE, wherein the first-level chip is configured with a host computer interface for communicating with the host computer. The method includes the following steps :
在步骤301,上位机通过上位机接口给芯片1发送芯片1的下载代理程序DA;In step 301, the host computer sends the download agent program DA of chip 1 to chip 1 through the interface of the host computer;
在步骤302,芯片1收到DA后经匹配确认是发给自己的DA,运行DA,初始化上位机接口,初始化PCIE端口,并向上位机返回第一响应ACK;In step 302, chip 1 receives the DA and confirms that it is the DA sent to itself through matching, runs the DA, initializes the host computer interface, initializes the PCIE port, and returns the first response ACK to the host computer;
在步骤303,上位机通过上位机接口给芯片1发送芯片2的DA;In step 303, the host computer sends the DA of chip 2 to chip 1 through the interface of the host computer;
在步骤304,芯片1收到DA后经匹配确认不是发给自己的DA,将该DA转发给芯片2,芯片2收到DA经匹配确认是发给自己的DA,运行DA,初始化PCIE端口,并向上位机返回第一响应ACK;In step 304, chip 1 receives the DA and confirms that it is not the DA for itself through matching, and forwards the DA to chip 2. After receiving the DA, chip 2 confirms that it is the DA for itself after matching, runs the DA, and initializes the PCIE port. And return the first response ACK to the upper computer;
在步骤305,上位机通过上位机接口给芯片1陆续发送每个芯片的DA,从芯片1到芯片N,每个芯片收到发给自己的DA后,分别初始化PCIE端口,分别向上位机返回第一响应ACK。In step 305, the host computer sends the DA of each chip to chip 1 successively through the host computer interface, from chip 1 to chip N. After each chip receives the DA sent to itself, it initializes the PCIE port respectively and returns to the host computer respectively. First response ACK.
在步骤306,当上位机收到所有芯片返回的第一响应之后,通过上位机接口给芯片1发送芯片1的固件;In step 306, after the host computer receives the first responses returned by all chips, it sends the firmware of chip 1 to chip 1 through the interface of the host computer;
在步骤307,芯片1收到固件后经匹配确认是发给自己的固件,则由DA接收固件,将所述固件烧录到芯片1对应的存储器1,并在烧录完成后向上位机返回第二响应ACK;In step 307, after the chip 1 receives the firmware, it is confirmed by matching that it is the firmware sent to itself, then the DA receives the firmware, burns the firmware into the memory 1 corresponding to the chip 1, and returns it to the host computer after the burning is completed. The second response ACK;
在步骤308,上位机通过上位机接口给芯片1发送芯片2的固件;In step 308, the host computer sends the firmware of chip 2 to chip 1 through the interface of the host computer;
在步骤309,芯片1收到固件后经匹配确认不是发给自己的固件,将该固件转发给芯片2,芯片2收到固件经匹配确认是发给自己的固件,则由DA接收所述固件,将所述固件烧录到芯片2对应的存储器2,并向芯片1返回第二响应,再由芯片1向上位机发送该第二响应ACK;In step 309, after receiving the firmware, chip 1 confirms that it is not the firmware for itself through matching, and forwards the firmware to chip 2, and chip 2 receives the firmware and confirms that it is the firmware for itself after matching, then DA receives the firmware , burn the firmware into the memory 2 corresponding to the chip 2, and return a second response to the chip 1, and then the chip 1 sends the second response ACK to the upper computer;
在步骤310,上位机通过上位机接口给芯片1依次发送每个芯片的固件,从芯片1到芯片N,每个芯片收到发给自己的固件后,由其DA接收所述固件,将所述固件烧录到该芯片对应的存储器,并分别向上一级芯片发送第二响应直至芯片1收到第二响应ACK后发送给上位机。In step 310, the host computer sends the firmware of each chip to chip 1 in turn through the host computer interface, from chip 1 to chip N, after each chip receives the firmware sent to itself, its DA receives the firmware and transfers the Burn the above firmware into the memory corresponding to the chip, and send the second response to the upper-level chip respectively until the chip 1 receives the second response ACK and sends it to the host computer.
根据本申请的一种PCIE级联芯片固件烧录的方法,通过第一级芯片从上位机接收下载代理程序,每个芯片将与自身匹配的下载代理程序下载到芯片的内部RAM运行,再由下载代理程序接收与自己匹配的固件并烧写到对应的存储器,能够实现仅用一个上位机接口实现各个级联芯片固件的烧写,利用高速互联PCIE接口来通讯和接收上位机发送的固件,从而节省了上位机接口,减少了生产工序,并便于软件版本管理。According to a kind of PCIE cascade chip firmware burning method of the present application, receive download agent program from upper computer by first-level chip, each chip downloads the download agent program that matches itself to the internal RAM operation of chip, then by The download agent program receives the firmware that matches itself and writes it to the corresponding memory. It can realize the firmware programming of each cascaded chip with only one host computer interface, and use the high-speed interconnection PCIE interface to communicate and receive the firmware sent by the host computer. Thus saving the host computer interface, reducing the production process, and facilitating software version management.
实施例4Example 4
图4为根据本申请实施例的芯片结构示意图。参考图4所示,该芯片40上集成有如上所述的PCIE级联芯片固件烧录的系统30。FIG. 4 is a schematic diagram of a chip structure according to an embodiment of the present application. As shown in FIG. 4 , the
实施例5Example 5
图5为根据本申请实施例的电路板结构示意图。参考图5所示,该电路板50上包括如上所述的芯片40。FIG. 5 is a schematic structural diagram of a circuit board according to an embodiment of the present application. Referring to FIG. 5 , the
实施例6Example 6
图6为根据本申请实施例的车机结构示意图。参考图6所示,该车机60包括如上所述的芯片40。Fig. 6 is a schematic structural diagram of a car machine according to an embodiment of the present application. Referring to FIG. 6 , the
实施例7Example 7
本申请一个实施例中,还提供了一种计算机可读存储介质,该计算机可读存储介质可以是上述实施例中描述的系统中所包含的;也可以是单独存在,而未装配入该系统中。上述计算机可读存储介质承载有一个或者多个计算机指令,当上述一个或者多个计算机指令被执行时,实现上述实施例的FIFO缓存控制方法的步骤。In one embodiment of the present application, a computer-readable storage medium is also provided, and the computer-readable storage medium may be contained in the system described in the above-mentioned embodiments; or it may exist independently without being assembled into the system middle. The above-mentioned computer-readable storage medium carries one or more computer instructions, and when the one or more computer instructions are executed, the steps of the FIFO buffer control method of the above-mentioned embodiments are realized.
本申请的实施例,计算机可读存储介质可以是非易失性的计算机可读存储介质,例如可以包括但不限于:便携式计算机磁盘、硬盘、随机访问存储器(RAM)、只读存储器(ROM)、可擦式可编程只读存储器(EPROM或闪存)、便携式紧凑磁盘只读存储器(CD-ROM)、光存储器件、磁存储器件、或者上述的任意合适的组合。在本申请中,计算机可读存储介质可以是任何包含或存储程序的有形介质,该程序可以被指令执行系统、装置或者器件使用或者与其结合使用。In the embodiment of the present application, the computer-readable storage medium may be a non-volatile computer-readable storage medium, such as may include but not limited to: portable computer disk, hard disk, random access memory (RAM), read-only memory (ROM), Erasable programmable read-only memory (EPROM or flash memory), portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.
本领域普通技术人员可以理解:以上仅为本申请的优选实施例而已,并不用于限制本申请,尽管参照前述实施例对本申请进行了详细的说明,对于本领域的技术人员来说,其依然可以对前述各实施例记载的技术方案进行修改,或者对其中部分技术特征进行等同替换。凡在本申请的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本申请的保护范围之内。Those of ordinary skill in the art can understand that: the above is only a preferred embodiment of the application, and is not intended to limit the application. Although the application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it still The technical solutions described in the foregoing embodiments may be modified, or some technical features thereof may be equivalently replaced. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included within the protection scope of this application.
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