CN115895495A - Etching high-temperature bearing film of flexible printed circuit board and preparation method thereof - Google Patents
Etching high-temperature bearing film of flexible printed circuit board and preparation method thereof Download PDFInfo
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- CN115895495A CN115895495A CN202211512649.2A CN202211512649A CN115895495A CN 115895495 A CN115895495 A CN 115895495A CN 202211512649 A CN202211512649 A CN 202211512649A CN 115895495 A CN115895495 A CN 115895495A
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- 238000005530 etching Methods 0.000 title claims abstract description 12
- 238000002360 preparation method Methods 0.000 title abstract description 15
- 239000000178 monomer Substances 0.000 claims abstract description 68
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 claims abstract description 29
- 239000002904 solvent Substances 0.000 claims abstract description 28
- 229920002545 silicone oil Polymers 0.000 claims abstract description 26
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 19
- 239000003999 initiator Substances 0.000 claims abstract description 18
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000001257 hydrogen Substances 0.000 claims abstract description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 13
- 229920002050 silicone resin Polymers 0.000 claims abstract description 13
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 13
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 10
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 49
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 33
- 239000000203 mixture Substances 0.000 claims description 33
- 239000003522 acrylic cement Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 26
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 21
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 12
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 11
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 11
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 11
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 11
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 8
- QTKPMCIBUROOGY-UHFFFAOYSA-N 2,2,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)F QTKPMCIBUROOGY-UHFFFAOYSA-N 0.000 claims description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 4
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 claims description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 3
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 claims description 3
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 claims description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 3
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 claims description 3
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 3
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 claims description 3
- 239000012856 weighed raw material Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 18
- 238000006116 polymerization reaction Methods 0.000 description 18
- 238000003756 stirring Methods 0.000 description 18
- 238000001816 cooling Methods 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- 239000012467 final product Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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Abstract
The invention provides a flexible printed circuit board etching high-temperature bearing film, which comprises a substrate layer, an acrylic acid glue layer and a release film layer; the acrylic glue layer comprises: acrylic acid monomer, wherein, the hard monomer accounts for 70 to 90 weight parts; 10-20 parts of soft monomer; 1-5 parts of functional monomer; 30-45 parts of silicone resin; 5-10 parts of vinyl silicone oil; 0.8-10 parts of hydrogen-containing silicone oil; 90-110 parts of solvent; 0.1-0.6 part by weight of initiator. The invention also relates to a preparation method of the etched high-temperature bearing film of the flexible printed circuit board, and the high-temperature bearing film prepared by the method has no adhesive residue and is not easy to seep.
Description
Technical Field
The invention relates to the field of high-temperature bearing films, in particular to a flexible printed circuit board etching high-temperature bearing film and a preparation method thereof.
Background
The flexible printed circuit board FPC is a flexible printed circuit board which is made of polyimide or polyester film as a base material, has high reliability and excellent flexibility, has the advantages of safe performance, small volume, light weight, flexible process and the like, and is widely applied to the fields of mobile phones, computers and consumer electronics. The FPC high-temperature bearing film is also called as an FPC process protective film, is mainly used for manufacturing ultrathin single-layer RTR ultrathin flexible circuit boards, improves the product non-deformation in the production operation process, and improves the convenience and yield of operation.
The existing high-temperature bearing film is attached to a PFC plate after high-temperature pressing (180-200 ℃), the peeling force climbs, and the residual glue on the PFC plate is easy to generate; and the bearing film and the FPC are layered at high temperature to generate bubbles, so that liquid seepage is easy to occur.
Therefore, the existing high-temperature bearing film needs to be improved, and a novel high-temperature bearing film is designed.
Disclosure of Invention
In order to overcome the defects of the prior art, the first object of the invention is to provide an etching high-temperature carrier film for a flexible printed circuit board, which comprises a substrate layer, an acrylic adhesive layer and a release film layer; the acrylic glue layer comprises:
acrylic acid monomer, wherein, the hard monomer accounts for 70 to 90 weight parts; 10-20 parts of soft monomer; 1-5 parts of functional monomer;
30-45 parts of silicone resin;
5-10 parts of vinyl silicone oil;
0.8-10 parts of hydrogen-containing silicone oil;
90-110 parts of solvent;
0.1 to 0.6 weight portion of initiator.
Preferably, the hard monomer is at least one of methyl methacrylate, ethyl methacrylate, styrene and acrylonitrile.
Preferably, the soft monomer is at least one of ethyl acrylate, n-butyl acrylate, lauryl acrylate, 2-ethylhexyl acrylate, lauryl methacrylate and n-octyl methacrylate.
Preferably, the functional monomer is at least one of 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, trifluoroethyl methacrylate and glycidyl methacrylate.
Preferably, the thickness of the acrylic glue layer is 10-20um.
Preferably, the solvent is a mixture of ethyl acetate and toluene.
Preferably, the initiator is at least one of azobisisobutyronitrile and dibenzoyl peroxide.
Preferably, the substrate layer has a thickness of 50-75um.
Preferably, the thickness of the release film layer is 25-50um.
The second purpose of the present invention is to provide a method for preparing a high temperature etching carrier film for a flexible printed circuit board, comprising the following steps:
the weighed raw materials are uniformly mixed according to a certain proportion to prepare the acrylic adhesive layer adhesive, the acrylic adhesive layer adhesive is coated on a substrate, the solvent is dried through baking in a baking oven at high temperature, and the acrylic adhesive layer adhesive is placed into the baking oven for curing after being adhered with a release film.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a flexible printed circuit board etching high-temperature bearing film, which comprises a substrate layer, an acrylic acid glue layer and a release film layer; the acrylic glue layer comprises: acrylic acid monomer, wherein, the hard monomer accounts for 70 to 90 weight parts; 10-20 parts of soft monomer; 1-5 parts of functional monomer; 30-45 parts of silicone resin; 5-10 parts of vinyl silicone oil; 0.8-10 parts of hydrogen-containing silicone oil; 90-110 parts of solvent; 0.1 to 0.6 weight portion of initiator. The invention also relates to a preparation method of the etched high-temperature bearing film of the flexible printed circuit board, and the high-temperature bearing film prepared by the invention has no adhesive residue and is not easy to seep.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood and to be implemented in accordance with the content of the description, the following detailed description of the preferred embodiments of the present invention is given. Specific embodiments of the present invention are given in detail by the following examples.
Detailed Description
The present invention is further described below with reference to specific embodiments, and it should be noted that, without conflict, various embodiments or technical features described below may be arbitrarily combined to form a new embodiment.
The invention relates to an etching high-temperature carrier film of a flexible printed circuit board, which comprises a substrate layer, an acrylic acid adhesive layer and a release film layer; the acrylic glue layer comprises:
acrylic acid monomer, wherein, the hard monomer accounts for 70 to 90 weight parts; 10-20 parts of soft monomer; 1-5 parts of functional monomer;
30-45 parts of silicone resin;
5-10 parts of vinyl silicone oil;
0.8-10 parts of hydrogen-containing silicone oil;
90-110 parts of solvent;
0.1-0.6 weight part of initiator; the high-temperature bearing film formed by the method is not easy to deform, does not generate bubbles at high temperature and is not easy to seep.
The hard monomer can be acrylic hard monomer commonly used in the prior art; in some embodiments, to ensure the quality of the final product, the hard monomer is at least one of methyl methacrylate, ethyl methacrylate, styrene, acrylonitrile.
The soft monomer can be acrylic acid soft monomer commonly used in the prior art; in some embodiments, to ensure the quality of the final product, the soft monomer is at least one of ethyl acrylate, n-butyl acrylate, lauryl acrylate, 2-ethylhexyl acrylate, lauryl methacrylate, and n-octyl methacrylate.
The functional monomer can be acrylic acid functional monomer commonly used in the prior art; in some embodiments, in order to ensure the quality of the final product, the functional monomer is at least one of 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, trifluoroethyl methacrylate, and glycidyl methacrylate.
In some embodiments, the acrylic bondline has a thickness of 10-20um.
In some embodiments, the solvent is a mixture of ethyl acetate and toluene to enhance the overall performance of the product.
In some embodiments, the initiator is at least one of azobisisobutyronitrile and dibenzoyl peroxide to enhance the overall performance of the final product.
In some embodiments, the substrate layer has a thickness of 50-75um.
In some embodiments, the release film layer is 25-50um thick.
The invention also relates to a preparation method of the etching high-temperature bearing film of the flexible printed circuit board, which comprises the following steps:
the weighed raw materials are uniformly mixed according to a certain proportion to prepare the acrylic adhesive layer adhesive, the acrylic adhesive layer adhesive is coated on a substrate, the solvent is dried through baking in a baking oven at high temperature, and the acrylic adhesive layer adhesive is placed into the baking oven for curing after being adhered with a release film.
The preparation method of the acrylic adhesive layer adhesive comprises the following steps: the polymerization temperature of all raw materials during polymerization is 60-80 ℃, all solvents are added into a reaction kettle, water bath heating is carried out, nitrogen is introduced to discharge air, and the reaction is kept to be carried out in an oxygen-free environment; mixing a monomer and an initiator, dropwise adding the mixture to the bottom of a kettle, continuously stirring the mixture by using a stirring paddle to enable the mixture to fully react, finishing dropwise adding for 2 to 3 hours, keeping the temperature for reacting for 4 to 6 hours, cooling the mixture to room temperature, and collecting glue to form the adhesive.
Example one
The preparation method of the acrylic adhesive layer adhesive comprises the following steps: 70 parts by weight of hard monomer methyl methacrylate; 10 parts by weight of soft monomer ethyl acrylate; 1 part by weight of functional monomer acrylic acid-2-hydroxyethyl ester; 30 parts by weight of silicone resin; 5 parts of vinyl silicone oil; 0.8 part by weight of hydrogen-containing silicone oil; the polymerization temperature during polymerization is 60 ℃, 90 parts by weight of ethyl acetate solvent is added into a reaction kettle, the mixture is heated in a water bath, nitrogen is introduced to discharge air, and the reaction is kept under an oxygen-free environment; mixing a monomer and 0.1 part by weight of initiator azobisisobutyronitrile, dropwise adding the mixture to the bottom of a kettle, continuously stirring the mixture by using a stirring paddle to fully react, finishing dropping for 2 hours, keeping the temperature for reaction for 4 hours, cooling the mixture to room temperature, and collecting glue to form the adhesive.
Coating the acrylic adhesive layer on a base material, baking the base material in an oven at high temperature to dry the solvent, attaching the release film, and then putting the base material into the oven for curing.
Example two
The preparation method of the acrylic adhesive layer adhesive comprises the following steps: 90 parts by weight of hard monomer methyl methacrylate; 20 parts by weight of soft monomer ethyl acrylate; 5 parts of functional monomer acrylic acid-2-hydroxyethyl ester; 45 parts by weight of silicone resin; 10 parts of vinyl silicone oil; 10 parts of hydrogen-containing silicone oil; the polymerization temperature is 60 ℃ during polymerization, 110 parts by weight of ethyl acetate solvent is added into a reaction kettle, water bath heating is carried out, nitrogen is introduced to discharge air, and the reaction is kept under an oxygen-free environment; mixing a monomer and 0.6 part by weight of initiator azobisisobutyronitrile, dropwise adding the mixture to the bottom of a kettle, continuously stirring the mixture by using a stirring paddle to fully react, finishing dropping for 2 hours, keeping the temperature for reaction for 4 hours, cooling the mixture to room temperature, and collecting glue to form the adhesive.
Coating the acrylic adhesive layer on a base material, baking the base material in an oven at high temperature to dry the solvent, attaching the release film, and then putting the base material into the oven for curing.
EXAMPLE III
The preparation method of the acrylic adhesive layer adhesive comprises the following steps: 30 parts by weight of hard monomer methyl methacrylate and 40 parts by weight of styrene; 5 parts of soft monomer ethyl acrylate and 5 parts of lauryl acrylate; 0.5 part of functional monomer acrylic acid-2-hydroxyethyl ester and 0.5 part of trifluoroethyl methacrylate; 30 parts by weight of silicone resin; 5 parts of vinyl silicone oil; 0.8 part by weight of hydrogen-containing silicone oil; the polymerization temperature during polymerization is 60 ℃, 90 parts by weight of ethyl acetate solvent is added into a reaction kettle, the mixture is heated in a water bath, nitrogen is introduced to discharge air, and the reaction is kept to be carried out in an oxygen-free environment; mixing a monomer and 0.1 part by weight of initiator azobisisobutyronitrile, dropwise adding to the bottom of a kettle, continuously stirring by using a stirring paddle to fully react, after 2 hours of dropwise adding, keeping the temperature for reaction for 4 hours, cooling to room temperature, and collecting glue to form the adhesive.
Coating the acrylic adhesive layer on a base material, baking the base material in an oven at high temperature to dry the solvent, attaching the release film, and then putting the base material into the oven for curing.
Example four
The preparation method of the acrylic adhesive layer adhesive comprises the following steps: 70 parts by weight of hard monomer methyl methacrylate; 10 parts of soft monomer ethyl acrylate; 1 part by weight of functional monomer acrylic acid-2-hydroxyethyl ester; 30 parts by weight of silicone resin; 5 parts of vinyl silicone oil; 0.8 part by weight of hydrogen-containing silicone oil; the polymerization temperature during polymerization is 60 ℃, 50 weight parts of ethyl acetate and 40 weight parts of toluene serving as solvents are added into a reaction kettle, water bath heating is carried out, nitrogen is introduced to discharge air, and the reaction is kept to be carried out in an oxygen-free environment; mixing a monomer and 0.1 part by weight of initiator azobisisobutyronitrile, dropwise adding the mixture to the bottom of a kettle, continuously stirring the mixture by using a stirring paddle to fully react, finishing dropping for 2 hours, keeping the temperature for reaction for 4 hours, cooling the mixture to room temperature, and collecting glue to form the adhesive.
Coating the acrylic adhesive layer on a base material, baking the base material in an oven at high temperature to dry the solvent, attaching the release film, and then putting the base material into the oven for curing.
EXAMPLE five
The preparation method of the acrylic adhesive layer adhesive comprises the following steps: 70 parts by weight of hard monomer methyl methacrylate; 10 parts by weight of soft monomer ethyl acrylate; 1 part by weight of functional monomer acrylic acid-2-hydroxyethyl ester; 30 parts by weight of silicone resin; 5 parts of vinyl silicone oil; 0.8 part by weight of hydrogen-containing silicone oil; the polymerization temperature during polymerization is 60 ℃, 90 parts by weight of ethyl acetate solvent is added into a reaction kettle, the mixture is heated in a water bath, nitrogen is introduced to discharge air, and the reaction is kept to be carried out in an oxygen-free environment; mixing a monomer, 0.05 part by weight of azodiisobutyronitrile as an initiator and 0.05 part by weight of dibenzoyl peroxide as an initiator, dropwise adding the mixture to the bottom of a kettle, continuously stirring the mixture by using a stirring paddle to enable the mixture to fully react, keeping the temperature for 4 hours after the mixture is completely dripped, cooling the mixture to room temperature, and collecting glue to form the adhesive.
Coating the acrylic adhesive layer on a base material, baking the base material in an oven at high temperature to dry the solvent, attaching the release film, and then putting the base material into the oven for curing.
EXAMPLE six
The preparation method of the acrylic adhesive layer adhesive comprises the following steps: 80 parts by weight of hard monomer methyl methacrylate; 15 parts by weight of soft monomer ethyl acrylate; 3 parts of functional monomer acrylic acid-2-hydroxyethyl ester; 35 parts by weight of a silicone resin; 8 parts of vinyl silicone oil; 5 parts of hydrogen-containing silicone oil; the polymerization temperature during polymerization is 60 ℃, 100 parts by weight of ethyl acetate solvent is added into a reaction kettle, water bath heating is carried out, nitrogen is introduced to discharge air, and the reaction is kept to be carried out in an oxygen-free environment; mixing a monomer and 0.4 part by weight of initiator azobisisobutyronitrile, dropwise adding the mixture to the bottom of a kettle, continuously stirring the mixture by using a stirring paddle to fully react, finishing dropping for 2 hours, keeping the temperature for reacting for 4 hours, cooling the mixture to room temperature, and collecting glue to form the adhesive.
Coating the acrylic adhesive layer on a base material, baking the base material in an oven at high temperature to dry the solvent, attaching the release film, and then putting the base material into the oven for curing.
Comparative example 1
The preparation method of the acrylic adhesive layer adhesive comprises the following steps: 60 parts by weight of hard monomer methyl methacrylate; 5 parts by weight of soft monomer ethyl acrylate; 0.5 part by weight of functional monomer acrylic acid-2-hydroxyethyl ester; 20 parts by weight of silicone resin; 2 parts of vinyl silicone oil; 0.4 part by weight of hydrogen-containing silicone oil; the polymerization temperature is 60 ℃ during polymerization, 50 parts by weight of ethyl acetate solvent is added into a reaction kettle, water bath heating is carried out, nitrogen is introduced to discharge air, and the reaction is kept under an oxygen-free environment; mixing a monomer and 0.03 part by weight of initiator azobisisobutyronitrile, dropwise adding the mixture to the bottom of a kettle, continuously stirring the mixture by using a stirring paddle to fully react, finishing dropping for 2 hours, keeping the temperature for reaction for 4 hours, cooling the mixture to room temperature, and collecting glue to form the adhesive.
Coating the acrylic adhesive layer on a base material, baking the base material in an oven at high temperature to dry the solvent, attaching the release film, and then putting the base material into the oven for curing.
Comparative example No. two
The preparation method of the acrylic adhesive layer adhesive comprises the following steps: 100 parts by weight of hard monomer methyl methacrylate; 30 parts of soft monomer ethyl acrylate; 6 parts of functional monomer acrylic acid-2-hydroxyethyl ester; 50 parts by weight of a silicone resin; 15 parts of vinyl silicone oil; 15 parts of hydrogen-containing silicone oil; the polymerization temperature during polymerization is 60 ℃, 150 parts by weight of ethyl acetate solvent is added into a reaction kettle, water bath heating is carried out, nitrogen is introduced to discharge air, and the reaction is kept to be carried out in an oxygen-free environment; mixing a monomer and 0.8 part by weight of initiator azobisisobutyronitrile, dropwise adding the mixture to the bottom of a kettle, continuously stirring the mixture by using a stirring paddle to fully react, finishing dropping for 2 hours, keeping the temperature for reaction for 4 hours, cooling the mixture to room temperature, and collecting glue to form the adhesive.
Coating the acrylic adhesive layer on a base material, baking the base material in an oven at high temperature to dry the solvent, attaching the release film, and then putting the base material into the oven for curing.
The printed circuit board etching high temperature carrier films prepared in the first to sixth examples and the first to second comparative examples were tested, respectively, to obtain the test results shown in table 1 below.
Table 1 table of test results of different embodiments
While embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in all kinds of fields of adaptation of the invention, and further modifications can be easily implemented by those skilled in the art, so that the invention is not limited to the specific details and the examples shown herein, without departing from the general concept defined by the claims and the scope of equivalents.
Claims (10)
1. A high-temperature etching carrier film for a flexible printed circuit board comprises a substrate layer, an acrylic adhesive layer and a release film layer; characterized in that, the acrylic glue layer includes:
acrylic acid monomer, wherein, the hard monomer accounts for 70 to 90 weight parts; 10-20 parts of soft monomer; 1-5 parts of functional monomer;
30-45 parts of silicone resin;
5-10 parts of vinyl silicone oil;
0.8-10 parts of hydrogen-containing silicone oil;
90-110 parts of solvent;
0.1 to 0.6 weight portion of initiator.
2. The etched high temperature carrier film according to claim 1, wherein the hard monomer is at least one of methyl methacrylate, ethyl methacrylate, styrene, and acrylonitrile.
3. The etched high temperature carrier film according to claim 1, wherein the soft monomer is at least one of ethyl acrylate, n-butyl acrylate, lauryl acrylate, 2-ethylhexyl acrylate, lauryl methacrylate, and n-octyl methacrylate.
4. The etched high temperature carrier film according to claim 1, wherein the functional monomer is at least one of 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, trifluoroethyl methacrylate and glycidyl methacrylate.
5. The etched high temperature carrier film according to claim 1, wherein the thickness of the acrylic glue layer is 10-20um.
6. The etched high temperature carrier film according to claim 1, wherein the solvent is a mixture of ethyl acetate and toluene.
7. The etched high temperature carrier film according to claim 1, wherein the initiator is at least one of azobisisobutyronitrile and dibenzoyl peroxide.
8. The etched high temperature carrier film according to claim 1, wherein the thickness of the substrate layer is 50-75um.
9. The etched high-temperature carrier film of claim 1, wherein the thickness of the release film layer is 25-50um.
10. The method for preparing a high temperature etching carrier film for a flexible printed circuit board according to claim 1, comprising the steps of:
the weighed raw materials are uniformly mixed according to a certain proportion to prepare an acrylic adhesive layer adhesive, the acrylic adhesive layer adhesive is coated on a base material, a solvent is dried through high-temperature baking in an oven, and the acrylic adhesive layer adhesive is placed in the oven for curing after being adhered with a release film.
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| CN102816538A (en) * | 2012-08-03 | 2012-12-12 | 深圳市摩码科技有限公司 | Heavy-release force release film having surface microviscosity and preparation method thereof |
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| CN115386306A (en) * | 2022-08-15 | 2022-11-25 | 江苏皇冠新材料科技有限公司 | Optical cement, preparation method thereof and related product |
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| CN112143423A (en) * | 2020-09-11 | 2020-12-29 | 陈会杰 | Organic silicon modified acrylic pressure-sensitive adhesive and preparation method thereof |
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