CN115877047B - Microwave chip test fixture device - Google Patents
Microwave chip test fixture device Download PDFInfo
- Publication number
- CN115877047B CN115877047B CN202310060216.6A CN202310060216A CN115877047B CN 115877047 B CN115877047 B CN 115877047B CN 202310060216 A CN202310060216 A CN 202310060216A CN 115877047 B CN115877047 B CN 115877047B
- Authority
- CN
- China
- Prior art keywords
- microwave chip
- jointed
- hole
- boards
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The embodiment of the invention discloses a microwave chip test fixture device, which comprises: the support plate is used for bearing the printed boards and comprises a plurality of jointed boards, and the quantity of the jointed boards is the same as that of the printed boards; the box frame is used for bearing the supporting plate, is of a semi-closed box structure, and is provided with first through holes at the bottom, wherein the number of the first through holes is the same as that of the jointed boards; the pressure sensor is arranged in the first through hole and is attached to the jointed board; and the pressure adjusting device is used for adjusting the contact pressure between the pressure sensor and the jointed board through the first through hole. The integral supporting plate is changed into a plurality of jointed boards, so that the detection device is greatly suitable for the detection of the application of the multi-section printed board to the microwave chip; meanwhile, the mode that the existing microwave chip pins are contacted with the printed board through spring pins, special-shaped pins or conductive paper is changed, so that the microwave chip pins are in direct good contact with the printed board, and reliable repetition and reliable service life of chip testing are better ensured.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a microwave chip testing fixture device.
Background
The conventional microwave chip test socket (socket) usually adopts a spring needle, a special-shaped reed, conductive paper and the like, the conventional working frequency is not more than 6GHz, the power is less than 1W, and if a microwave chip with higher frequency (such as an X wave band, a KU wave band) or higher power is required to be tested, specific design and manufacture are required. Each pin (pin) of the microwave chip test seat is in point contact with and communicated with the printed board and the chip pin at two independent sides, and the problems of poor contact, limited service life and the like exist after multiple tests, so that the microwave chip is high in test cost, short in service life and low in reliability of repeated tests.
How to solve the technical problems is a technical problem to be solved in the industry.
When the printed board is in a multi-section type, the printed board is in contact with the single surface and the periphery of the chip pins in a row, so that the pin pins of the socket are simplified, but proper pressure equalization distribution is needed, and the good contact between the printed board on four sides and the chip pins is ensured, and the service life is long. The method is more beneficial to accurately testing the high-frequency and high-power performance of the microwave.
Disclosure of Invention
In order to at least solve the above technical problems, an object of the embodiments of the present invention is to provide a microwave chip testing fixture device, which is formed by changing the existing integral supporting plate and testing seat (socket) into a plurality of jointed boards, so as to greatly adapt to the application of the multi-section printed board to the detection of the microwave chip.
In order to achieve the above object, a microwave chip test fixture device provided by an embodiment of the present invention includes:
the support plate is used for bearing the printed boards and comprises a plurality of jointed boards, and the quantity of the jointed boards is the same as that of the printed boards;
the box frame is used for bearing the supporting plate, is of a semi-closed box structure, and is provided with first through holes at the bottom, wherein the number of the first through holes is the same as that of the jointed boards;
the pressure sensor is arranged in the through hole and is attached to the jointed board;
and the pressure adjusting device is used for adjusting the contact pressure between the pressure sensor and the jointed board through the first through hole.
Further, it also includes; and the pressure buffer device is arranged between the pressure sensor and the pressure regulating device.
Further, the pressure buffer device comprises a spring piece, and the size of the spring piece is matched with that of the pressure sensor.
Further, the bottom of box frame still is equipped with the second through-hole, and the second through-hole is used for the connecting wire through pressure sensor.
Further, the pressure adjusting means comprises a screw, the size of which is adapted to the first through hole.
Further, the pressure adjusting device also comprises a nut, and the nut is matched with the screw.
Further, the method further comprises the following steps: the third through hole is arranged on the side surface of the box frame;
and the positioning device passes through the third through hole to fix the jointed board and is used for limiting the horizontal movement of the jointed board.
Further, the positioning device comprises a positioning screw, and the positioning screw comprises a screw body, a spring and a positioning bead;
the spring is arranged in the screw body, the positioning bead is arranged at the front end of the screw body, and the positioning bead can press the spring to perform telescopic movement in the screw body.
Further, the box frame also comprises a notch which is matched with the microwave connector seat of the printed board to be tested.
Further, the method further comprises the following steps: the cover plate is used for fixing the printed board to be tested in the box frame and also comprises an upper big-end-up small bucket window which guides the chip to fall to the printed board to contact and keep limiting.
The microwave chip test fixture device provided by the embodiment of the invention is formed by changing the existing integral supporting plate into a plurality of jointed boards, and is greatly suitable for the detection of the application of the multi-section printed board to the microwave chip; the accuracy of up-and-down movement of the spliced matching chips and the stability of pressure are ensured by the matching of the pressure sensor and the pressure buffer device; the repeated reliability of the microwave chip test is realized; the adaptability to chip structures with different shapes is stronger.
Drawings
For a clearer description of one or more embodiments of the present description or of the solutions of the prior art, reference will be made below to the accompanying drawings which are used in the description of one or more embodiments or of the prior art, it being apparent that the drawings in the description below are only some of the embodiments described in the description, from which, without inventive faculty, other drawings can also be obtained for a person skilled in the art.
FIG. 1 is a schematic diagram of a microwave chip test fixture device according to an embodiment of the present invention;
FIG. 2 is a schematic view of a microwave chip test fixture apparatus according to another embodiment of the present invention;
FIG. 3 is a schematic view of a box frame structure according to an embodiment of the present invention;
FIG. 4 is a schematic view of a pressure buffering apparatus according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a positioning device according to an embodiment of the invention.
Reference numerals illustrate:
101-a cover plate; 102-a first panel; 103-a second panel; 104-a third jointed board; 105-fourth panel; 106-a box frame; 301-a third through hole; 302-a first via; 303-box frame steps; 401-pressure buffer means; 402-a boss; 501-a screw body; 502-counter bore; 503-a spring; 504-positioning beads.
Detailed Description
Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present application are shown in the drawings, it is to be understood that the present application may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and examples of the present application are for illustrative purposes only and are not intended to limit the scope of the present application.
It should be understood that the steps recited in the method embodiments of the present application may be performed in a different order and/or performed in parallel. Furthermore, method embodiments may include additional steps and/or omit performing the illustrated steps. The scope of the present application is not limited in this respect.
The term "including" and variations thereof as used herein are intended to be open-ended, i.e., including, but not limited to. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments. Related definitions of other terms will be given in the description below.
It should be noted that the terms "subject," "identifying," "ingestion," "bin," and the like herein are merely used to distinguish between different devices, modules, or units and are not intended to limit the order or interdependence of functions performed by such devices, modules, or units.
It should be noted that references to "one" or "a plurality" in this application are intended to be illustrative rather than limiting, and those of ordinary skill in the art will appreciate that "one or more" is intended to be interpreted as "one or more" unless the context clearly indicates otherwise. "plurality" is understood to mean two or more.
Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings.
The embodiment of the invention provides a microwave chip testing device, which comprises:
the support plate is used for bearing the printed boards and comprises a plurality of jointed boards, and the quantity of the jointed boards is the same as that of the printed boards;
the box frame is used for bearing the supporting plate, is of a semi-closed box structure, and is provided with first through holes at the bottom, wherein the number of the first through holes is the same as that of the jointed boards;
the pressure sensor is arranged in the through hole and is attached to the jointed board;
and the pressure adjusting device is used for adjusting the contact pressure between the pressure sensor and the jointed board through the first through hole.
Example 1
Fig. 1 is a schematic structural view of a microwave chip testing fixture device according to an embodiment of the present invention, fig. 2 is a schematic structural view of a further view of the microwave chip testing fixture device according to an embodiment of the present invention, and fig. 3 is a schematic structural view of a box frame according to an embodiment of the present invention; FIG. 4 is a schematic view of a pressure buffering apparatus according to an embodiment of the present invention; FIG. 5 is a schematic view of a positioning device according to an embodiment of the present invention; a microwave chip testing apparatus according to an embodiment of the present invention will be described in detail with reference to fig. 1.
The microwave chip test fixture device provided by the embodiment of the invention is suitable for detection of a microwave chip, such as KU wave band and X wave band in microwaves.
In an exemplary embodiment, microwaves (microwaves) refer to radio frequency electromagnetic waves having wavelengths between infrared and Ultra High Frequency (UHF). The wavelength of the microwaves ranges from about 1m to about 1mm, corresponding to a frequency range of 0.3 GHz to 300 GHz.
In an exemplary embodiment, the KU band (K-under band) refers to a band of frequencies lower than the K band under the IEEE 521-2002 standard, with the KU band typically ranging down from 10.7 to 12.75GHz and up from 12.75 to 18.1GHz.
In an exemplary embodiment, the X frequency band is still a microwave in the electromagnetic spectrum, the frequency range is 7-12.4 GHz, and the corresponding wavelength is a frequency band in the range of 3.66-2.42 cm. The X frequency band is divided into two frequency bands, namely a downlink frequency band and an uplink frequency band, wherein the frequency of the downlink frequency band is 7.25-7.75 GHz, the uplink frequency band is 7.9-8.4 GHz, and the frequency band is overlapped with the Ku wave band to 10.7-12.5 GHz.
In an exemplary implementation manner, the microwave chip testing device of the embodiment of the present invention includes: a pallet, a cassette frame 106, a pressure sensor (not shown) and a pressure regulating device.
In an exemplary embodiment, the pallet is used to carry a printed board.
In an exemplary embodiment, the pallet comprises a plurality of panels (i.e., the pallet is comprised of a plurality of panels).
In an exemplary embodiment, the plurality of panels includes a first panel 102, a second panel 103, a third panel 104, and a fourth panel 105.
In an exemplary embodiment, the plurality of tiles are disconnected from one another, and the number of tiles is the same as the number of printed boards.
In an exemplary embodiment, printed boards (microwave chip printed boards) are carried simultaneously between a plurality of tiles.
In an exemplary embodiment, the number of the boards may be determined according to the number of the specific microwave chip printed boards to be tested, and the number of the boards in the embodiment of the present application is 4 (the 4 boards are only used for illustration, and are not used for limiting the number of the boards).
In an exemplary embodiment, the cassette frame 106 is configured to carry a pallet.
In an exemplary embodiment, the cassette frame 106 is a semi-closed cassette structure (an open-top cassette structure).
In an exemplary embodiment, the bottom of the box 106 is provided with a first through hole 302, and the number of the first through holes 302 is the same as the number of the tiles (i.e., one through hole corresponds to one tile).
In an exemplary embodiment, the first through hole 302 is optionally threaded as desired.
In an exemplary embodiment, a pressure sensor is disposed within the first throughbore 302, the pressure sensor being sized to match the first throughbore 302.
In an exemplary embodiment, the pressure sensor includes a button pressure sensor.
In an exemplary embodiment, a step may be provided in the first through hole 302, and the pressure sensor may be disposed on the step, if necessary.
In an exemplary embodiment, the depth of the step is adapted to the thickness of the pressure sensor, the step being configured to carry the pressure sensor (i.e., the step may act as a lowest position carrying platform for the pressure sensor).
In an exemplary embodiment, the pressure sensor is attached to the panel.
In an exemplary embodiment, the pressure sensor includes a button pressure sensor.
In an exemplary embodiment, the pressure adjustment device adjusts the contact pressure of the pressure sensor with the panel through the first through hole 302.
In an exemplary embodiment, the pressure adjusting device comprises an adjusting screw and a nut matched with the adjusting screw, wherein the nut and the adjusting screw are matched with each other to ensure that the contact pressure between the pressure sensor and the jointed board is stable.
In an exemplary embodiment, further comprising: the pressure buffer device 401, the pressure buffer device 401 is arranged between the pressure sensor and the pressure regulating device.
In an exemplary embodiment, the pressure buffer 401 comprises a spring plate, the size of which is adapted to the size of the pressure sensor.
In an exemplary embodiment, the spring plate is a metallic structure, such as made of spring steel.
In an exemplary embodiment, the spring plate comprises a carbon spring plate, an alloy spring plate, or the like.
In an exemplary embodiment, the spring plate includes a protrusion 402, where the protrusion 402 protrudes from the bottom of the spring plate, and may be a plurality of protruding corners or may be annular protrusions.
In an exemplary embodiment, where the boss 402 is a plurality of raised corners, the plurality of corners are evenly distributed over the edge of the leaf spring.
In an exemplary embodiment, the protrusion height of the protrusion 402 comprises 0.5mm-1.2mm.
In an exemplary embodiment, the protrusion height of the protrusion 402 is 0.75mm.
In an exemplary embodiment, the pressure buffer device 401 may also be other elastic devices equivalent to a spring plate.
In an exemplary embodiment, the adaptation of the dimensions of the spring plate to the dimensions of the pressure sensor includes: the contact surface of the bulge 402 of the spring piece and the pressure sensor is arranged on the bottom surface of the pressure sensor.
In an exemplary embodiment, the bottom of the cassette frame 106 is further provided with a second through hole for connecting wires through the pressure sensor.
In an exemplary embodiment, the diameter dimension of the second through hole is smaller than the diameter dimension of the first through hole 302.
In an exemplary embodiment, the first via 302 may optionally be disposed parallel to the second via.
In an exemplary embodiment, a second step may optionally be provided at the lower portion of the first step in the first through hole 302, as desired.
In an exemplary embodiment, the second through hole is disposed on the second step (the second through hole may also be disposed on the first step, if desired).
In an exemplary embodiment, when the pressure adjusting means comprises a screw, the size of the screw is adapted to the first through hole 302 (the first through hole 302 when the first step is provided).
In an exemplary embodiment, the screw may be sized to fit the second through hole (first through hole 302 when provided with a second step).
In an exemplary embodiment, the screw is a socket head cap screw (i.e., the screw is a counterbore configuration).
In an exemplary embodiment, the pressure regulating device further comprises a nut, which is adapted to be locked with a screw or the like.
In an exemplary embodiment, a nut is used to secure the screw, preventing the screw from moving.
In an exemplary embodiment, the screw may be a planar screw, i.e., the screw front end is planar, where the screw is in surface contact with the pressure sensor or spring plate (i.e., the contact surface of the screw with the pressure sensor or spring plate is planar), as desired.
In an exemplary embodiment, a box step 303 is optionally provided in the box 106, and the box step 303 is used to fix the microwave chip printed board to be tested.
In an exemplary embodiment, the printed board can be adapted to the detection of different sizes when the printed board is applied to the detection of the microwave chip by the design of a plurality of jointed boards and the adjustment of the up-down displacement of the combination of the jointed boards and the chip.
In an exemplary embodiment, the third through hole 301 is further included, and the third through hole 301 is disposed at a side of the box frame 106.
In an exemplary embodiment, the third through hole 301 is optionally provided in the box 106 at the side of the box step 303.
In an exemplary embodiment, the third through hole 301 is perpendicular to the first through hole 302.
In an exemplary embodiment, a positioning device is further included, and the positioning device fixes the tile through the third through hole 301, so as to limit the horizontal movement of the tile (because the printed board cannot be horizontally moved in order to ensure the accuracy of the inspection of the printed board when the printed board is applied to the microwave chip).
In an exemplary embodiment, the purpose of fixing the boards by the positioning device further includes ensuring that the printed boards can only move in a direction perpendicular to the box frame, so that the boards synchronously bear the printed boards, and the bearing of the boards is balanced, that is, the printed boards and pins around the chip are well contacted at the same time.
In an exemplary embodiment, the positioning device comprises a set screw.
In an exemplary embodiment, the set screw includes a screw body 501, a resilient device, and a set bead 504.
In an exemplary embodiment, the positioning bead 504 is disposed at the front end of the screw body 501.
In an exemplary embodiment, the interior of the set screw has a cavity with a resilient means therein, and the set bead 504, when compressed, compresses the resilient means into the cavity; when the positioning beads 504 are not extruded by the outside, the elastic device pushes the positioning beads 504 to the front end of the chamber; when the elastic device moves in the chamber in a telescopic way, the surface of the positioning bead 504 does not completely submerge into the positioning screw or separate from the chamber (i.e., when the positioning bead 504 is extruded from the outside, at least one point of the surface of the positioning bead 504 is exposed to the outside of the screw, and when the positioning bead 504 is not extruded from the outside, the positioning bead 504 is not pushed out of the chamber under the action of the elastic device).
In an exemplary embodiment, the resilient means within the chamber comprises a spring 503.
In an exemplary embodiment, the positioning beads 504 comprise steel balls.
In an exemplary embodiment, one end of the spring 503 is in contact with the bottom of the chamber and the other end of the spring 503 is in contact with the steel ball.
In an exemplary embodiment, the set screw comprises a socket head cap screw (i.e., the screw body 501 is provided with a counterbore 502 at its end).
In an exemplary embodiment, the counterbore 502 of the set screw is not in communication with the chamber.
In an exemplary embodiment, the positioning bead 504 may compress the spring 503 into the screw body 501 for telescoping movement.
In an exemplary embodiment, the pressure between the positioning device and the printed board is adjusted, and the pre-contact experiment can be performed through a transparent dummy chip.
In an exemplary embodiment, the sum of the length of the spring 503 in the naturally stretched state and the length of the positioning bead 504 is greater than the length of the cavity.
In an exemplary embodiment, a tightening nut is also included that is compatible with the screw body 501.
In an exemplary embodiment, the set screw is used for fixedly positioning the microwave chip to be tested; the fastening screw cap is used for fixing the positioning screw, and further fixes the microwave chip to be tested.
In an exemplary embodiment, the cassette frame 106 further includes a notch that accommodates the printed board microwave connector holder to be tested.
In an exemplary embodiment, the notch mates with a step on the cassette frame 106 for further securing the microwave chip location to be tested.
In an exemplary embodiment, further comprising: the cover plate 101, the cover plate 101 is used for fixing the printed board to be tested in the box frame 106.
In an exemplary embodiment, the cover plate 101 further includes an upper large and lower small bucket window for guiding the chip to drop to the contact of the printed board and keeping the limit, and the window is used for observing and detecting the microwave chip to be tested.
In an exemplary embodiment, the first through hole 302, the second through hole and the third through hole 301 are all plural.
Although the embodiments of the present invention are described above, the present invention is not limited to the embodiments which are used for understanding the present invention. Any person skilled in the art can make any modification and variation in form and detail without departing from the spirit and scope of the present disclosure, but the scope of the present disclosure is to be determined by the appended claims.
Claims (9)
1. A microwave chip testing jig device, comprising:
the support plate is used for bearing the printed boards and comprises a plurality of jointed boards, and the quantity of the jointed boards is the same as that of the printed boards;
the box frame is used for bearing the supporting plate, is of a semi-closed box structure, and is provided with first through holes at the bottom, wherein the number of the first through holes is the same as that of the jointed boards;
the pressure sensor is arranged in the first through hole and is attached to the jointed board;
the pressure adjusting device is used for adjusting the contact pressure between the pressure sensor and the jointed board through the first through hole;
the cover plate is used for fixing the printed board to be tested in the box frame and further comprises an upper big-end-up small bucket window which guides the chip to fall to the printed board to contact and keep limiting.
2. The microwave chip testing jig device according to claim 1, further comprising:
the pressure buffer device is arranged between the pressure sensor and the pressure regulating device.
3. The microwave chip testing jig device according to claim 2, wherein the pressure buffering means includes a spring piece having a size adapted to a size of the pressure sensor.
4. A microwave chip testing fixture device according to claim 3, wherein the bottom of the box frame is further provided with a second through hole for a connection wire passing through the pressure sensor.
5. The microwave chip testing jig device according to claim 4, wherein the pressure adjusting means includes a screw having a size corresponding to the first through hole.
6. The microwave chip testing fixture device according to claim 5, wherein the pressure adjusting device further comprises a nut, the nut being compatible with the screw.
7. The microwave chip testing jig device according to claim 1, further comprising:
the third through hole is arranged on the side face of the box frame;
and the positioning device passes through the third through hole to fix the jointed board and is used for limiting the horizontal movement of the jointed board.
8. The microwave chip testing jig device according to claim 7, wherein the positioning device comprises a positioning screw comprising a screw body, a spring, and a positioning bead;
the spring is arranged in the screw body, the positioning bead is arranged at the front end of the screw body, and the positioning bead can press the spring to stretch and retract in the screw body.
9. The microwave chip testing fixture device according to claim 1, wherein the box frame further comprises a notch, the notch being adapted to a printed board microwave connector holder to be tested.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310060216.6A CN115877047B (en) | 2023-01-18 | 2023-01-18 | Microwave chip test fixture device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310060216.6A CN115877047B (en) | 2023-01-18 | 2023-01-18 | Microwave chip test fixture device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115877047A CN115877047A (en) | 2023-03-31 |
| CN115877047B true CN115877047B (en) | 2023-06-16 |
Family
ID=85758713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310060216.6A Active CN115877047B (en) | 2023-01-18 | 2023-01-18 | Microwave chip test fixture device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115877047B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205861729U (en) * | 2016-07-27 | 2017-01-04 | 深圳市华讯方舟微电子科技有限公司 | Chip test fixture and chip test system |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2845025B2 (en) * | 1992-05-20 | 1999-01-13 | 日本電気株式会社 | Probe card |
| JPH07231017A (en) * | 1994-02-16 | 1995-08-29 | Tokyo Electron Ltd | Probe apparatus |
| TW200532837A (en) * | 2004-03-26 | 2005-10-01 | Renesas Tech Corp | Method for manufacturing semiconductor integrated circuit device |
| JP5138615B2 (en) * | 2008-02-15 | 2013-02-06 | シャープ株式会社 | Semiconductor function test electrical connection device |
| CN201335845Y (en) * | 2008-10-16 | 2009-10-28 | 环旭电子股份有限公司 | Test fixture |
| JP5530124B2 (en) * | 2009-07-03 | 2014-06-25 | 株式会社日本マイクロニクス | Integrated circuit testing equipment |
| US8535956B2 (en) * | 2012-02-14 | 2013-09-17 | International Business Machines Corporation | Chip attach frame |
| US20140340107A1 (en) * | 2013-05-17 | 2014-11-20 | Expert International Mercantile Corporation | Bga test socket |
| JP6333112B2 (en) * | 2014-08-20 | 2018-05-30 | 東京エレクトロン株式会社 | Wafer inspection equipment |
| CN106053895A (en) * | 2016-07-22 | 2016-10-26 | 苏州韬盛电子科技有限公司 | Detection device for 50GHz high frequency and detection method thereof |
| CN106093483B (en) * | 2016-07-27 | 2020-01-10 | 深圳市华讯方舟微电子科技有限公司 | Chip test fixture and chip test system |
| CN209044015U (en) * | 2018-08-22 | 2019-06-28 | 深圳市鑫尚宁科技有限公司 | A kind of high-precision quasi core piece design analytical equipment |
| CN113759230A (en) * | 2020-06-03 | 2021-12-07 | 格科微电子（上海）有限公司 | Chip test fixture, system, method, device and computer readable storage medium |
| CN112542405A (en) * | 2020-12-07 | 2021-03-23 | 合肥高地创意科技有限公司 | Self-destruction structure for integrated circuit chip |
| CN115561611A (en) * | 2021-07-01 | 2023-01-03 | 长鑫存储技术有限公司 | Fixing device and fixing method for chip test and test equipment |
| CN114660444B (en) * | 2022-05-25 | 2022-09-16 | 南京燧锐科技有限公司 | Test equipment for radio frequency chip |
| CN218003590U (en) * | 2022-06-16 | 2022-12-09 | 武汉奥特多电子科技有限公司 | Pressure sensor chip test fixture |
-
2023
- 2023-01-18 CN CN202310060216.6A patent/CN115877047B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205861729U (en) * | 2016-07-27 | 2017-01-04 | 深圳市华讯方舟微电子科技有限公司 | Chip test fixture and chip test system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115877047A (en) | 2023-03-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102599969B1 (en) | Test socket | |
| ITTO981117A1 (en) | WIRELESS TEST EQUIPMENT WITH FLOATING SPRING PROBES. | |
| CN1908678A (en) | Socket for inspection apparatus | |
| EP2189800A1 (en) | Test system and daughter unit | |
| KR20040093040A (en) | Ic socket | |
| US11573248B2 (en) | Test socket and test apparatus having the same | |
| JP2009156710A (en) | Inspection socket | |
| US11496227B2 (en) | Electronic component handling apparatus, electronic component testing apparatus, and socket | |
| US11287468B2 (en) | Electronic component handling apparatus, electronic component testing apparatus, and socket | |
| JPH11118885A (en) | Mounting device for test | |
| CN115877047B (en) | Microwave chip test fixture device | |
| US20240027519A1 (en) | Electronic component testing apparatus, sockets, and replacement parts for electronic component testing apparatus | |
| CN219392213U (en) | Mixed pin chip testing device | |
| CN1855617A (en) | Antenna device | |
| US20010050427A1 (en) | Test soket of semiconductor device | |
| EP1649550A1 (en) | Compression mount and zero insertion force socket for ic devices | |
| US10715262B2 (en) | Testing device for antenna-incorporated semiconductor device | |
| CN216595238U (en) | Radio frequency test shielding jig | |
| CN110690557A (en) | Broadband low-profile millimeter wave antenna | |
| CN216217697U (en) | Switching device | |
| KR101217823B1 (en) | Jig unit for testing LED chip | |
| US20050151550A1 (en) | Circuit board testing jig | |
| KR100786771B1 (en) | A probe card for electrical die sortingprocess | |
| CN211086401U (en) | Detachable high-frequency testing device and vertical probe head thereof | |
| CN215415762U (en) | Circuit board detection equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |