CN115874167B

CN115874167B - Automatic leveling method and device for spray assembly of multi-working-procedure PECVD (plasma enhanced chemical vapor deposition) equipment

Info

Publication number: CN115874167B
Application number: CN202310147056.9A
Authority: CN
Inventors: 孙文彬; 戴建波; 刘龙龙
Original assignee: Jiangsu Yiwen Microelectronics Technology Co Ltd; Advanced Materials Technology and Engineering Inc
Current assignee: Wuxi Yiwen Microelectronics Technology Co ltd; Jiangsu Yiwen Microelectronics Technology Co Ltd
Priority date: 2023-02-22
Filing date: 2023-02-22
Publication date: 2023-05-30
Anticipated expiration: 2043-02-22
Also published as: CN115874167A

Abstract

The application provides a spray assembly automatic leveling method and device of a multi-station PECVD device, which relate to the technical field of semiconductor processing, wherein the multi-station PECVD device comprises a spray assembly formed by a plurality of spray heads, a heating disc and a plurality of leveling assemblies which are in one-to-one correspondence with the plurality of spray heads, each leveling assembly comprises at least three adjusting pieces connected with the corresponding spray heads, and the heating disc comprises a plurality of wafer placement areas with the same number as the spray heads; the method comprises the following steps: determining a target wafer placement area to be leveled of a matched spray header and corresponding spray header leveling parameters based on levelness information corresponding to a preset measurement node; and determining whether the wafer placement areas matched with the target spray heads in different working procedures are target wafer placement areas or not based on real-time process progress, and if so, adjusting the adjusting piece corresponding to the target spray head based on the spray head leveling parameters corresponding to the wafer placement areas matched with the target spray head, so that the problem that the quality of the wafer film does not reach the standard can be avoided.

Description

Automatic leveling method and device for spray assembly of multi-working-procedure PECVD (plasma enhanced chemical vapor deposition) equipment

Technical Field

The application relates to the technical field of semiconductor processing, in particular to an automatic leveling method and device for a spray assembly of a multi-station PECVD device.

Background

PECVD (Plasma Enhanced Chemical Vapor Deposition) is referred to as plasma enhanced chemical vapor deposition. As shown in fig. 1, the existing multi-station PECVD apparatus comprises a spray assembly and a heating plate, wherein the spray assembly and the heating plate are arranged at intervals along the vertical direction, the spray assembly comprises a plurality of spray heads arranged in a circumferential array, the heating plate is used for placing a plurality of wafers, and the heating plate can rotate in the process to enable the wafers placed on the heating plate to be opposite to the spray heads in sequence. Each wafer on the heating plate is configured to perform multiple film depositions in batches through a plurality of spray heads in sequence, so that the film on the surface of the wafer reaches a preset thickness after the multiple depositions.

To ensure the quality of the deposited film, it is necessary to keep the level between the showerhead and the hotplate of the PECVD apparatus. In this regard, the prior art typically maintains the level between the showerhead and the hotplate during assembly of the PECVD apparatus by means of manual measurement and adjustment. However, due to the influence of factors such as high temperature environment in the process, the heating plate can be deformed gradually in the working process, so that the spray header and the heating plate can not be kept horizontal, and further the quality of the deposited film of the wafer is not up to standard.

Disclosure of Invention

The utility model aims at providing a spray assembly automatic leveling method and device of multi-station PECVD equipment, it can guarantee that a plurality of shower heads reliably, accurately level for the heating plate in the course of the technology under the condition that the heating plate warp, avoids the problem that the film quality of wafer deposit is not up to standard.

The utility model provides a spray assembly automatic leveling method of a multi-station PECVD device, which comprises a spray assembly composed of a plurality of spray heads, a heating disc and a plurality of leveling assemblies corresponding to the spray heads one by one, wherein each leveling assembly comprises at least three adjusting pieces connected with the corresponding spray heads, the heating disc comprises a plurality of wafer placement areas with the same number as the spray heads, and each wafer placement area is respectively matched with each spray head when the heating disc can rotate to enable different working procedures to be carried out; the method comprises the following steps:

determining a target wafer placement area, which is required to be leveled, of a matched spray header and corresponding spray header leveling parameters based on levelness information corresponding to a preset measurement node; the levelness information is obtained based on measurement of measurement components arranged in each wafer placement area;

And determining whether the wafer placement areas matched with the target spray heads in different working procedures are target wafer placement areas or not based on real-time process progress, and if so, adjusting parts corresponding to the target spray heads based on spray head leveling parameters corresponding to the target spray head matched wafer placement areas and the current state of the target spray heads so as to realize automatic leveling of the spray assembly.

According to the automatic leveling method for the spray assemblies of the multi-station PECVD equipment, the measuring assemblies comprise elastic sensors, the number of which is the same as that of adjusting parts of the leveling assemblies, and correspondingly, the obtaining step of levelness information corresponding to the preset measuring nodes specifically comprises the following steps:

controlling the leveling assemblies to synchronously drive the corresponding spray heads to vertically move upwards from the initial position by a first preset distance at a preset measuring node;

setting a measuring assembly in each wafer placement area of the heating plate; for any wafer placement area, the horizontal position of the elastic sensor in the corresponding measurement assembly is the same as the horizontal position of the adjusting piece in the leveling assembly corresponding to the shower head matched with the wafer placement area;

controlling the leveling assemblies to drive the corresponding spray heads to vertically move downwards until each spray head is contacted with all elastic sensors in the corresponding measuring assemblies;

Controlling the leveling assemblies to drive the corresponding spray heads to move to the initial positions, and taking out the measuring assemblies;

and determining levelness information corresponding to each wafer placement area based on feedback signals of the elastic sensors in each measurement assembly.

According to the spray assembly automatic leveling method of the multi-working-position PECVD device, the control of the plurality of leveling assemblies drives the corresponding spray heads to vertically move downwards until each spray head is contacted with all elastic sensors in the corresponding measuring assembly, and the method specifically comprises the following steps:

and for any spray header, controlling the leveling component corresponding to the spray header to drive the spray header to vertically move downwards at a preset speed, and acquiring feedback signals of the elastic sensors in the measuring component corresponding to the spray header until the number of the feedback signals is the same as the number of the elastic sensors in the measuring component.

According to the spray assembly automatic leveling method of the multi-station PECVD device, the control of the plurality of leveling assemblies drives the corresponding spray heads to move to the initial positions, and the method specifically comprises the following steps:

determining the distance of each spray header moving vertically downwards based on the preset speed and the time length of each spray header moving vertically downwards;

Determining a target moving direction and a target moving distance corresponding to the position where each spray head moves to an initial position based on the distance where each spray head moves vertically downwards and the first preset distance;

and controlling the leveling assemblies to drive the corresponding spray heads to move to the initial positions based on the target moving directions and the target moving distances, which correspond to the spray heads moving to the initial positions.

According to the spray assembly automatic leveling method of the multi-station PECVD device provided by the application, the levelness information corresponding to each wafer placement area is determined based on the feedback signals of the elastic sensors in each measurement assembly, and the method specifically comprises the following steps:

determining the deformation amount of the elastic sensor in each measuring assembly based on the feedback signal of the elastic sensor in each measuring assembly;

determining levelness information corresponding to each wafer placement area based on deformation of the elastic sensor in each measurement assembly; the levelness information comprises whether the levelness meets the standard or not and the corresponding level error amount.

According to the automatic leveling method for the spray assembly of the multi-station PECVD device, the target wafer placement area, which is matched with the spray header and needs leveling, and the corresponding spray header leveling parameters are determined based on the levelness information corresponding to the preset measurement node, and the method specifically comprises the following steps:

Determining a target wafer placement area with the levelness not reaching the standard and a corresponding horizontal error amount based on the levelness information corresponding to each wafer placement area;

and determining corresponding shower head leveling parameters based on the horizontal error amount corresponding to the target wafer placement area.

According to the spray assembly automatic leveling method of the multi-station PECVD device provided by the application, the spray head leveling parameters corresponding to the wafer placement area matched with the target spray head and the current state of the target spray head are based, and the adjusting piece corresponding to the target spray head is adjusted, and the method specifically comprises the following steps:

determining the adjusting direction and the adjusting distance of each adjusting piece corresponding to the target spray header based on the spray header leveling parameters corresponding to the wafer placing area matched with the target spray header and the current state of the target spray header;

and adjusting each adjusting piece based on the adjusting direction and the adjusting distance of each adjusting piece corresponding to the target spray header.

The application also provides a spray assembly automatic leveling device of the multi-station PECVD equipment, the multi-station PECVD equipment comprises a spray assembly formed by a plurality of spray heads, a heating disc and a plurality of leveling assemblies which are in one-to-one correspondence with the plurality of spray heads, each leveling assembly comprises at least three adjusting pieces connected with the corresponding spray heads, the heating disc comprises a plurality of wafer placement areas with the same number as the spray heads, and each wafer placement area is respectively matched with each spray head when the heating disc can rotate to enable different working procedures to be carried out; the device comprises:

The leveling parameter determining module is used for determining a target wafer placement area, which is required to be leveled, of the matched spray header and corresponding spray header leveling parameters based on levelness information corresponding to a preset measuring node; the levelness information is obtained based on measurement of measurement components arranged in each wafer placement area;

and the automatic leveling module is used for determining whether the wafer placement areas matched with the target spray heads in different working procedures are target wafer placement areas based on real-time process progress, and if so, adjusting the adjusting piece corresponding to the target spray head to realize automatic leveling of the spray assembly based on the spray head leveling parameters corresponding to the wafer placement areas matched with the target spray head and the current state of the target spray head.

The present application also provides a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of a spray assembly auto-leveling method of a multi-station PECVD apparatus as described in any one of the above.

The present application also provides a computer program product comprising a computer program which, when executed by a processor, implements the steps of a spray assembly auto-leveling method of a multi-station PECVD apparatus as described in any one of the above.

The spray assembly automatic leveling method and device of the multi-station PECVD equipment provided by the application, wherein the multi-station PECVD equipment comprises a spray assembly formed by a plurality of spray heads, a heating disc and a plurality of leveling assemblies which are in one-to-one correspondence with the plurality of spray heads, each leveling assembly comprises at least three adjusting pieces connected with the corresponding spray heads, the heating disc comprises a plurality of wafer placement areas with the same number as the spray heads, and each wafer placement area is respectively matched with each spray head when the heating disc can rotate to enable different working procedures to be carried out; the method comprises the following steps: determining a target wafer placement area, which is required to be leveled, of a matched spray header and corresponding spray header leveling parameters based on levelness information corresponding to a preset measurement node; the levelness information is obtained based on measurement of measurement components arranged in each wafer placement area; and determining whether the wafer placement areas matched with the target spray heads in different working procedures are target wafer placement areas or not based on real-time process progress, if so, adjusting the adjusting piece corresponding to the target spray head based on the spray head leveling parameters corresponding to the wafer placement areas matched with the target spray head and the current state of the target spray head so as to realize automatic leveling of the spray assembly, acquiring levelness information corresponding to the wafer placement areas at preset measuring nodes, determining the corresponding spray head leveling parameters so as to automatically level the spray assembly in the process, and further ensuring that a plurality of spray heads are reliably and accurately leveled relative to the heating disc in the process under the condition of deformation of the heating disc, so that the problem that the quality of a deposited film of the wafer does not reach standards is avoided.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a conventional multi-station PECVD apparatus;

FIG. 2 is a schematic diagram of a multi-station PECVD apparatus provided herein;

FIG. 3 is an enlarged view of the portion I of FIG. 2;

FIG. 4 is a schematic view of a wafer placement area in a hotplate provided herein;

FIG. 5 is a schematic view of a partial structure of a multi-station PECVD apparatus provided herein;

FIG. 6 is an enlarged view of the portion II of FIG. 5;

FIG. 7 is a schematic view of a partial structure of a support provided herein;

FIG. 8 is a flow chart of a method for automatically leveling spray assemblies of a multi-station PECVD apparatus provided by the present application;

fig. 9 is a schematic diagram of a process for acquiring levelness information provided in the present application;

FIG. 10 is a schematic diagram of a spray assembly auto leveling device of a multi-station PECVD apparatus provided herein;

Fig. 11 is a schematic structural diagram of an electronic device provided in the present application.

Icon: 100-spraying heads; 200-heating the disc; 210-a spray chamber; 300-leveling assembly; 310-adjusting piece; 400-measuring assembly; 410-an elastic sensor; 420-a support; 421-the receiving cavity; 422-connecting rod; 423-split ring; 424-elastic telescoping member; 425-holding the rod.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present application, it should be noted that, the terms "center," "horizontal," "inner," "outer," and the like indicate an orientation or a positional relationship based on the orientation or the positional relationship shown in the drawings, or an orientation or a positional relationship in which the inventive product is conventionally put in use, merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

As shown in fig. 1, the existing multi-station PECVD apparatus comprises a spray assembly and a heating plate, wherein the spray assembly and the heating plate are arranged at intervals along the vertical direction, the spray assembly comprises a plurality of spray heads arranged in a circumferential array, the heating plate is used for placing a plurality of wafers, and the heating plate can rotate in the process to enable the wafers placed on the heating plate to be opposite to the spray heads in sequence. Each wafer on the heating plate is configured to perform multiple film depositions in batches through a plurality of spray heads in sequence, so that the film on the surface of the wafer reaches a preset thickness after the multiple depositions. To ensure the quality of the deposited film, it is necessary to keep the level between the showerhead and the hotplate of the PECVD apparatus. In this regard, the prior art typically maintains the level between the showerhead and the hotplate during assembly of the PECVD apparatus by means of manual measurement and adjustment. However, due to the influence of factors such as high temperature environment in the process, the heating plate can be deformed gradually in the working process, so that the spray header and the heating plate can not be kept horizontal, and further the quality of the deposited film of the wafer is not up to standard. Based on the above, the application provides a spray assembly automatic leveling method and device of a multi-station PECVD device, which can ensure that a plurality of spray heads are reliably and accurately leveled relative to a heating plate in the process under the condition that the heating plate is deformed, so that the problem that the quality of a deposited film of a wafer does not reach the standard is avoided.

Fig. 2 is a schematic structural diagram of a multi-process PECVD apparatus provided in the present application, and fig. 3 is an enlarged view of a portion i in fig. 2, as shown in fig. 2-3, similar to the prior art, the multi-process PECVD apparatus provided in the present application includes a spray assembly formed by a plurality of spray heads 100 and a heating plate 200, wherein the heating plate 200 is disposed opposite to and spaced from the spray heads 100, and a spray chamber 210 is formed between the heating plate 200 and the spray heads 100.

The heating plate 200 includes a plurality of wafer placement areas with the same number as the shower heads 100, and fig. 4 is a schematic diagram of the wafer placement areas in the heating plate provided in the present application, as shown in fig. 4, in the actual production process, the heating plate may be divided into a plurality of fan-shaped areas with the same shape (i.e. wafer placement areas) based on the requirement. It is to be understood that the wafer placement areas are used for placing the wafers during the process, and the number of the wafer placement areas may be set according to actual needs, which is not specifically limited in the embodiments of the present application. Based on this, in the actual process, a single procedure can simultaneously perform thin film deposition on a plurality of wafers, and meanwhile, the corresponding relationship between the wafer placement area and the showerhead 100 can be switched by rotating the heating plate 200 by a fixed angle, so that each wafer placement area is sequentially opposite to (i.e. matched with) a plurality of showerheads 100, and multiple thin film depositions (i.e. multiple-procedure thin film depositions) of a plurality of wafers can be realized in one process, so that the thin film on the surface of the wafer reaches the preset thickness after multiple depositions.

It should be noted that, unlike the existing multi-station PECVD apparatus, the multi-station PECVD apparatus provided in the present application further includes a plurality of leveling assemblies 300 corresponding to the plurality of showerheads 100 one to one, wherein the leveling assemblies 300 are connected to the showerheads 100 for driving the showerheads 100 to approach or depart from the heating plate 200, and for adjusting the horizontal position of the showerheads 100 so that the showerheads 100 can be in a horizontal state with respect to the heating plate 200. The leveling assemblies 300 may be configured as desired, and in this embodiment, each leveling assembly 300 includes a driving member (not shown in the drawings), including but not limited to a cylinder, an oil cylinder, an electric push rod, etc., and the driving member is in driving connection with the showerhead 100, and is used for driving the showerhead 100 to approach or separate from the heating plate 200. Each leveling assembly 300 includes at least three adjustment members 310 coupled to the corresponding showerhead 100, and it is understood that accurate adjustment of the horizontal position of the showerhead 100 can be achieved using at least three adjustment members 310 based on the principle of determining a plane at three points. The adjusting member 310 may be a threaded adjusting member, and the threaded adjusting member 310 is in threaded connection with the showerhead 100, based on which the horizontal position of the showerhead 100 with respect to the heating plate 200 may be adjusted by rotating the threaded adjusting member 310 by a driving member. Of course, the adjusting member may also take any other possible structure, which is not specifically limited in this embodiment of the present application. The distribution manner of the adjusting members can be determined based on the number of the adjusting members, for example, the adjusting members can be distributed in a regular triangle if the number of the adjusting members is 3, the adjusting members can be distributed in a square if the number of the adjusting members is 4, and the like.

Meanwhile, as can be seen from fig. 3, the multi-station PECVD apparatus provided in the present application further includes a measurement assembly 400 detachably disposed in each wafer placement area, for detecting whether the showerhead 100 is horizontal with respect to the heating plate 200 at a preset measurement node. Since the gap between the showerhead 100 and the heating plate 200 is small and the showerhead 100 and the heating plate 200 each have a certain area, it is difficult to accurately measure the gap distance between each showerhead 100 and the heating plate 200 using a measuring tool such as a caliper. Based on this, the embodiment of the application detachably sets up in each wafer placement area through the measurement assembly 400, and through the detachably setting up measurement assembly 400 between the shower head 100 and the heating plate 200 in order to detect whether the shower head 100 is level-adjusted relative to the heating plate 200, the interval between the shower head 100 and the heating plate 200 is no longer required to be detected by using a measuring tool such as a caliper, and even in the case that the interval between the shower head 100 and the heating plate 200 is small, accurate and reliable detection can be realized. The plurality of measuring assemblies 400 are arranged in one-to-one correspondence with the wafer placement areas, and whether the plurality of showerheads 100 are horizontal relative to the heating plate 200 can be tested one by utilizing the plurality of measuring assemblies 400, so that the measuring efficiency is improved, and the reliability and the accuracy of the subsequent automatic leveling are ensured.

Fig. 5 is a schematic view of a partial structure of the multi-station PECVD apparatus provided in the present application, fig. 6 is an enlarged view of a portion ii in fig. 5, and it can be seen with reference to fig. 5-6 that the measuring assembly 400 includes the same number of elastic sensors 410 as the adjusting members 310 of the leveling assembly 300, and the elastic sensors 410 can generate feedback signals based on self-deformation, and the strength of the feedback signals is proportional to the deformation. The showerhead 100 can squeeze the spring sensor 410 when the leveling assembly 300 drives the showerhead 100 adjacent the hotplate 200. Based on this, the deformation amount of each elastic sensor 410 can be determined by the feedback signal of the elastic sensor 410, thereby judging whether the showerhead 100 is level with respect to the heating plate 200. The shape of the elastic sensor 410 is preferably spherical, although other suitable shapes may be used, and the embodiments of the present application are not limited in detail.

Fig. 7 is a schematic partial structure of the support provided in the present application, as shown in fig. 7, in order to stably set the elastic sensor 410 in the wafer placement area, the measurement assembly 400 further includes a support 420, the support 420 is detachably set in the wafer placement area, and the elastic sensor 410 is supported by the support 420. The support 420 is provided with a plurality of receiving chambers 421, and the plurality of elastic sensors 410 are disposed in one-to-one correspondence with the plurality of receiving chambers 421. Based on this, a plurality of positions of the corresponding showerhead 100 can be simultaneously detected by a plurality of elastic sensors 410, and thus it is possible to reliably detect whether the showerhead 100 is level with respect to the heating plate 200.

It should be noted that, as shown in fig. 6, during the detection, the plurality of elastic sensors 410 and the plurality of adjusting members 310 may be distributed in a one-to-one correspondence, so as to accurately detect whether the showerhead 100 is level with respect to the heating plate 200; wherein, the plurality of elastic sensors 410 are distributed with the plurality of adjusting members 310 in a one-to-one correspondence: the axes of the plurality of elastic sensors 410 are coincident with (i.e., horizontally positioned at the same as) the axes of the plurality of adjusting members 310, or the axes of the plurality of elastic sensors 410 are distributed parallel to the axes of the plurality of adjusting members 310, and the positional relationship between the plurality of elastic sensors 410 and the plurality of adjusting members 310 is identical, and the distances between the respective plurality of elastic sensors 410 and the adjusting members 310 are substantially the same.

The structure of the supporting member 420 may be set as required, referring to fig. 7, for the case when the number of the elastic sensors 410 is 3, the supporting member 420 in this embodiment of the present application includes three connection rods 422 and three split rings 423, the three split rings 423 are distributed in a triangle, and each split ring 423 is provided with a receiving cavity 421. Two ends of the opening of each split ring 423 are respectively connected with two connecting rods 422, and the other ends of the corresponding two connecting rods 422 are respectively connected with one of the other two split rings 423. Based on this, the elastic sensor 410 can be reliably disposed in the accommodation cavity 421 of the split ring 423, so as to ensure that the elastic sensor 410 is reliably disposed in the wafer placement area of the heating plate 200 through the supporting member 420, thereby ensuring the reliability and accuracy of the subsequent detection; meanwhile, when the elastic sensor 410 is pressed by the shower head 100 and the heating plate 200, the outer diameter of the elastic sensor 410 is increased, and by means of the arrangement of the split ring 423, it is ensured that the split ring 423 deforms synchronously with the deformation of the elastic sensor 410 when the elastic sensor 410 is pressed and deformed, so that the deformation of the elastic sensor 410 is prevented from being interfered by the supporting member 420, and further the reliability of whether the shower head 100 is horizontally checked relative to the heating plate 200 by the elastic sensor 410 is ensured. It is understood that the support 420 may further include a holding rod 425, and the holding rod 425 may stably position the support 420 between the heating plate 200 and the showerhead 100. An elastic expansion piece 424 is further connected between the two connecting rods 422 connected to the two ends of the opening of each split ring 423, and each elastic expansion piece 424 is adjacent to the opening of the corresponding split ring 423. Through the arrangement of the elastic telescopic piece 424, when the elastic sensor 410 is extruded and deformed, the elastic sensor 410 can be ensured to be reliably arranged in the accommodating cavity 421 of the split ring 423, the situation that the elastic sensor 410 is separated from the accommodating cavity 421 of the split ring 423 due to the fact that the opening of the split ring 423 is opened is avoided, and further the reliability and the accuracy of a detection result are ensured.

Based on the multi-station PECVD apparatus provided in the present application, the present application further provides a method for automatically leveling a spray assembly of the multi-station PECVD apparatus, and fig. 8 is a schematic flow diagram of the method for automatically leveling a spray assembly of the multi-station PECVD apparatus provided in the present application, as shown in fig. 8, the method includes:

step S101, determining a target wafer placement area, which is matched with a spray header and needs leveling, and corresponding spray header leveling parameters based on levelness information corresponding to preset measurement nodes; the levelness information is measured based on measuring components arranged in each wafer placement area.

In particular, based on the foregoing, the prior art generally maintains the level between the showerhead and the hotplate during assembly of the PECVD apparatus by means of manual measurement and adjustment. However, the application finds that the heating plate can be gradually deformed in the working process under the influence of factors such as high temperature environment in the process, so that the spray header and the heating plate can not be kept horizontal, and further the quality of the deposited film of the wafer is not up to standard. In the prior art, although the PECVD equipment can be overhauled during regular maintenance, because the gap between the spray header and the heating disc is very small and the spray header and the heating disc are provided with a certain area, the gap distance between the spray header and the heating disc is difficult to accurately measure by using measuring tools such as a caliper, and the like, and further the problem that the spray header and the heating disc cannot be kept horizontal due to deformation of the heating disc is also difficult to overcome. Meanwhile, for the multi-station PECVD equipment, the deformation conditions of different wafer placement areas of the heating plate can be different, so that the difficulty of leveling the spray header is further improved. Based on this, the application provides an automatic leveling method for a spray assembly of a multi-station PECVD device, which can realize the measurement of levelness information corresponding to each wafer placement area through the leveling assembly 300 and the measurement assembly 400, and level a plurality of spray heads 100 in the spray assembly according to the levelness information corresponding to each wafer placement area, so as to avoid the problem that the quality of a deposited film of a wafer does not reach the standard.

More specifically, in the embodiment of the present application, levelness information corresponding to each wafer placement area (i.e., levelness information corresponding to a preset measurement node) is obtained at a preset measurement node, and a target wafer placement area, which needs to be leveled, of the matched showerhead 100 and corresponding showerhead leveling parameters are determined based on the levelness information corresponding to the preset measurement node. It may be understood that the preset measurement node may be a time node determined based on a preset measurement period, or may be a time node specified by a user based on actual needs, which is not specifically limited in the embodiment of the present application. It should be noted that the preset measurement node should be in an idle period (i.e. a non-working period) of the multi-station PECVD apparatus. Based on the foregoing, it can be understood that the heating plate 200 is not deformed before the multi-process PECVD apparatus is put into use, and thus, the initial state of the heating plate 200 can be ensured to be a horizontal state after the manual measurement and adjustment at the time of the apparatus assembly, and the initial state of each showerhead 100 is also a horizontal state, based on which the level between each showerhead 100 and the heating plate 200 is maintained. However, with the use of the multi-process PECVD apparatus, the heating plate may be deformed gradually during the working process, and the deformation conditions of the different wafer placement areas may be different, so that at this time, each wafer placement area is changed to a non-horizontal state, and each showerhead 100 is still in a horizontal state, so that the space between each showerhead 100 and the heating plate 200 cannot be kept horizontal. Based on this, in the embodiment of the present application, it is necessary to obtain levelness information corresponding to each wafer placement area, and further determine a target wafer placement area with a changed levelness, and for the target wafer placement area, in order to ensure the quality of thin film deposition, it is necessary to adjust the horizontal position of the target showerhead matched with the target wafer placement area, so as to ensure that the target showerhead and the target wafer placement area remain horizontal. Based on the working principle of the multi-working-procedure PECVD device, for different working procedures, different target spray heads matched with the target wafer placement areas are determined, in order to reduce leveling workload, the embodiment of the application directly determines the target wafer placement areas, which are matched with the matched spray heads, to be leveled and corresponding spray head leveling parameters based on levelness information corresponding to preset measurement nodes, and for different working procedures, no matter which target spray head is currently matched with the target wafer placement areas, only the adjustment direction and the adjustment distance of an adjusting piece corresponding to the target spray head can be determined based on the spray head leveling parameters corresponding to the wafer placement areas and the current state of the target spray head, and then the target spray head is automatically leveled.

Step S102, determining whether a wafer placement area matched with a target spray header in different working procedures is a target wafer placement area or not based on real-time process progress, and if yes, adjusting an adjusting piece corresponding to the target spray header based on spray header leveling parameters corresponding to the target spray header matched wafer placement area and the current state of the target spray header so as to realize automatic leveling of a spray assembly.

Specifically, after the target wafer placement area and the corresponding shower head leveling parameters are determined, whether the wafer placement area matched with the target shower heads in different procedures is the target wafer placement area or not can be determined based on the real-time process progress. It can be appreciated that the background software of the multi-process PECVD device can monitor the process progress of the device in real time, so that the real-time process progress can be determined based on the monitoring information of the background software, and the corresponding relation between the different process spray heads and the wafer placement area can be determined based on the real-time process progress. Based on this, it can be determined whether the target showerhead-matched wafer placement area is a target wafer placement area. The target spray header is any spray header in the spray assembly. If the wafer placement area matched with the target spray header is determined to be the target wafer placement area, adjusting an adjusting piece corresponding to the target spray header based on the spray header leveling parameter corresponding to the wafer placement area matched with the target spray header and the current state of the target spray header so as to realize automatic leveling of a spray assembly.

It is noted that the showerhead leveling parameter specifically refers to a target offset direction and a target offset distance of a connection point of the showerhead and each corresponding adjusting member relative to an initial horizontal state. The current state of the target spray header specifically refers to the current offset direction and the current offset distance of the connection point of the target spray header and each corresponding adjusting piece relative to the initial horizontal state. Based on the foregoing, the wafer placement areas corresponding to different processes of the shower head are different, so that the position of the shower head may be adjusted when the previous process is performed, based on this, the current state of the shower head needs to be determined when the current process is performed, then the adjustment direction and the adjustment distance of each adjustment piece corresponding to the shower head are determined based on the shower head leveling parameters corresponding to the wafer placement areas matched with the shower head of the current process, and further each adjustment piece is adjusted based on the adjustment direction and the adjustment distance of each adjustment piece corresponding to the shower head, so as to realize accurate leveling of the shower assembly of different processes.

According to the method provided by the embodiment of the application, the multi-station PECVD device comprises a spray assembly formed by a plurality of spray heads, a heating disc and a plurality of leveling assemblies corresponding to the spray heads one by one, wherein each leveling assembly comprises at least three adjusting pieces connected with the corresponding spray heads, the heating disc comprises a plurality of wafer placement areas with the same number as the spray heads, and each wafer placement area is matched with each spray head when different working procedures are carried out through rotation of the heating disc; the method comprises the following steps: determining a target wafer placement area, which is required to be leveled, of a matched spray header and corresponding spray header leveling parameters based on levelness information corresponding to a preset measurement node; the levelness information is obtained based on measurement of measurement components arranged in each wafer placement area; and determining whether the wafer placement areas matched with the target spray heads in different working procedures are target wafer placement areas or not based on real-time process progress, if so, adjusting the adjusting piece corresponding to the target spray head based on the spray head leveling parameters corresponding to the wafer placement areas matched with the target spray head and the current state of the target spray head so as to realize automatic leveling of the spray assembly, acquiring levelness information corresponding to the wafer placement areas at preset measuring nodes, determining the corresponding spray head leveling parameters so as to automatically level the spray assembly in the process, and further ensuring that a plurality of spray heads are reliably and accurately leveled relative to the heating disc in the process under the condition of deformation of the heating disc, so that the problem that the quality of a deposited film of the wafer does not reach standards is avoided.

Based on the foregoing embodiments, fig. 9 is a schematic diagram of a flowchart of acquiring levelness information provided in the present application, based on the foregoing embodiments, it can be known that the measuring assembly includes elastic sensors having the same number as the adjusting members of the leveling assembly, and correspondingly, as shown in fig. 9, the steps of acquiring levelness information corresponding to the preset measuring node specifically include:

step S201, controlling the plurality of leveling assemblies to synchronously drive the corresponding shower heads to vertically move upwards from the initial position by a first preset distance at a preset measurement node.

Specifically, the automatic leveling device for the spray assemblies of the multi-station PECVD equipment firstly controls the plurality of leveling assemblies to synchronously drive the corresponding spray heads to vertically move upwards from the initial position for a first preset distance at a preset measuring node. Based on the foregoing embodiments, it can be seen that the gap between the showerhead and the heating plate is small, and for convenience in setting the measurement assembly, in this embodiment of the present application, the showerhead is first moved vertically upward by a first preset distance, so as to increase the gap between the showerhead and the heating plate. It can be understood that the initial position refers to the initial position of each spray header of the current measurement node in the vertical direction. The leveling assemblies are controlled to synchronously move upwards for a first preset distance, and the corresponding spray heads can vertically move upwards for the first preset distance from the initial positions.

Step S202, setting a measuring assembly in each wafer placement area of a heating plate; and for any wafer placement area, the horizontal position of the elastic sensor in the corresponding measurement assembly is the same as the horizontal position of the adjusting piece in the leveling assembly corresponding to the shower head matched with the wafer placement area.

Specifically, based on the foregoing embodiment, in the actual process, the correspondence between the wafer placement area and the shower heads may be switched by rotating the heating plate by a fixed angle, so that each wafer placement area is sequentially opposite to a plurality of shower heads, so it can be understood that each wafer placement area of the heating plate at the preset measurement node is necessarily opposite to each shower head, and the current correspondence between each wafer placement area and the shower head may be determined based on the monitoring information of the background software. Based on this, the embodiments of the present application may provide a measurement assembly directly at each wafer placement area of the hotplate for subsequent measurements. For the setting position of each elastic sensor in the measuring assembly, in the embodiment of the application, for any wafer placement area, the horizontal position of the elastic sensor in the corresponding measuring assembly is preferably the same as the horizontal position of the adjusting piece in the leveling assembly corresponding to the shower head matched with the wafer placement area. By adopting the arrangement mode, the position change of the connecting point of the spray header matched with each wafer placement area and each corresponding adjusting piece relative to the initial horizontal state can be rapidly determined based on the feedback signal of the elastic sensor, and further the levelness information corresponding to each wafer placement area can be rapidly and accurately determined.

And step S203, controlling the leveling assemblies to drive the corresponding spray heads to vertically move downwards until each spray head is contacted with all elastic sensors in the corresponding measuring assemblies.

Specifically, for any spray header, the leveling assembly corresponding to the spray header is controlled to drive the spray header to vertically move downwards at a preset speed, and feedback signals of the elastic sensors in the measuring assembly corresponding to the spray header are obtained until the number of the feedback signals is the same as the number of the elastic sensors in the measuring assembly. Based on the foregoing, the elastic sensor can generate a feedback signal based on self deformation, the strength of the feedback signal is proportional to the deformation amount, that is, as long as the shower head contacts with the elastic sensor, the elastic sensor can generate the feedback signal, and as the deformation amount increases, the strength of the feedback signal increases continuously. Based on the method, whether each spray header is in contact with all the elastic sensors in the corresponding measuring assembly can be determined according to the feedback signal quantity of the elastic sensors in the corresponding measuring assembly of each spray header, and then the deformation quantity of each elastic sensor can be determined based on the feedback signals of each elastic sensor, so that the levelness information corresponding to each wafer placement area is determined.

And S204, controlling the leveling assemblies to drive the corresponding spray heads to move to the initial positions, and taking out the measuring assemblies.

Specifically, in order to avoid that the levelness information measurement does not affect the subsequent process, after the measurement is finished, the embodiment of the application controls the plurality of leveling assemblies to drive the corresponding spray heads to move to the initial positions, and takes out each measuring assembly. The control of the plurality of leveling assemblies to drive the corresponding spray heads to move to the initial positions specifically comprises the following steps:

determining the distance of each spray header moving vertically downwards based on the preset speed and the time length of each spray header moving vertically downwards; it will be appreciated that the automatic leveling device for the spray assembly of the multi-station PECVD apparatus records the length of time each spray header moves vertically downward when controlling the spray headers to move vertically downward. Based on the above, the distance of each spray header moving vertically downwards can be determined according to the preset speed and the length of time that each spray header moves vertically downwards.

Determining a target moving direction and a target moving distance corresponding to the position of each spray header moving to the initial position based on the distance of the vertical downward movement of each spray header and the first preset distance;

And thirdly, controlling the leveling assemblies to drive the corresponding spray heads to move to the initial positions based on the target moving directions and the target moving distances, corresponding to the movement of the spray heads to the initial positions.

Based on the steps, each spray header can be quickly restored to the state before the levelness information measurement, and the influence of the levelness information measurement on the subsequent film deposition process is avoided.

Step S205, determining levelness information corresponding to each wafer placement area based on feedback signals of the elastic sensors in each measurement assembly.

Specifically, based on the foregoing, the deformation amount of the elastic sensor in each measuring module can be determined based on the feedback signal of the elastic sensor in each measuring module. Based on this, for any wafer placement area, the levelness information of the wafer placement area can be determined based on the current state of the matched showerhead (i.e., the current offset direction and the current offset distance of the connection point of the matched showerhead and the corresponding adjusting members with respect to the initial horizontal state) and the deformation amount of the elastic sensor in the corresponding measurement assembly. The levelness information comprises whether the levelness meets the standard or not and the corresponding level error amount. Taking the case that the measuring assembly corresponding to the shower head matched with the current wafer placement area comprises three elastic sensors as an example, if the deformation amount of the elastic sensor A is 2mm, the deformation amount of the elastic sensor B is 1mm, and the deformation amount of the elastic sensor C is 0, the situation means that the current wafer placement area and the matched shower head are kept horizontal, an adjusting piece A ' corresponding to the elastic sensor A needs to vertically move upwards by 2mm, an adjusting piece B ' corresponding to the elastic sensor B needs to vertically move upwards by 1mm, and an adjusting piece C ' corresponding to the elastic sensor C is kept motionless. And combining the current offset direction and the current offset distance of the connection point of the matched spray header and the corresponding adjusting piece relative to the initial horizontal state, so that the offset direction and the offset distance of the connection point of the matched spray header and the corresponding adjusting piece after leveling relative to the initial horizontal state can be determined. It can be understood that if the offset distance between the connection point of the matched spray header and each corresponding adjusting piece after leveling is 0 relative to the initial horizontal state, the levelness of the current wafer placement area is up to standard, otherwise, the levelness of the current wafer placement area is not up to standard. The horizontal error amount corresponding to the current wafer placement area is a vector corresponding to the offset direction and the offset distance, the absolute value of the horizontal error amount is equal to the offset distance, and when the offset direction is upward, the horizontal error amount is a positive value; when the offset direction is downward, the horizontal error amount is a negative value. It is also understood that the horizontal error amount corresponds to the adjustment member corresponding to the showerhead that is matched with the current wafer placement area.

According to the method provided by the embodiment of the application, the measuring assembly comprises elastic sensors, the number of which is the same as that of the adjusting parts of the leveling assembly, and correspondingly, the step of acquiring the levelness information corresponding to the preset measuring node specifically comprises the following steps: controlling the leveling assemblies to synchronously drive the corresponding spray heads to vertically move upwards from the initial position by a first preset distance at a preset measuring node; setting a measuring assembly in each wafer placement area of the heating plate; for any wafer placement area, the horizontal position of the elastic sensor in the corresponding measurement assembly is the same as the horizontal position of the adjusting piece in the leveling assembly corresponding to the shower head matched with the wafer placement area; controlling the leveling assemblies to drive the corresponding spray heads to vertically move downwards until each spray head is contacted with all elastic sensors in the corresponding measuring assemblies; controlling the leveling assemblies to drive the corresponding spray heads to move to the initial positions, and taking out the measuring assemblies; and based on feedback signals of the elastic sensors in the measuring assemblies, the levelness information corresponding to the wafer placement areas is determined, so that the levelness information corresponding to the wafer placement areas can be accurately determined under the condition that the subsequent process is not influenced, and the accuracy of automatic leveling of the subsequent spraying assemblies is ensured.

Based on the above embodiment, the controlling the leveling assemblies to drive the corresponding spray heads to vertically move downwards until each spray head contacts with all the elastic sensors in the corresponding measuring assemblies specifically includes:

Based on the above embodiment, the controlling the plurality of leveling assemblies to drive the corresponding shower heads to move to the initial positions specifically includes:

Based on the above embodiment, the determining levelness information corresponding to each wafer placement area based on the feedback signals of the elastic sensors in each measurement assembly specifically includes:

Specifically, the specific implementation principles and effects of the foregoing embodiments have been described in detail in the foregoing embodiments, and are not repeated herein.

Based on the above embodiment, the determining, based on the levelness information corresponding to the preset measurement node, the target wafer placement area where the matched shower head needs to be leveled, and the corresponding shower head leveling parameter specifically includes:

Specifically, based on the foregoing embodiments, it can be known that, according to the levelness information corresponding to each wafer placement area, a target wafer placement area and a corresponding level error amount, where the levelness does not reach the standard, may be quickly determined, and further based on the level error amount corresponding to the target wafer placement area, a target offset direction and a target offset distance (i.e., corresponding showerhead leveling parameters) of a connection point between the matched showerhead and each corresponding adjusting member relative to an initial level state may be determined.

According to the method provided by the embodiment of the application, the target wafer placement area, which is required to be leveled, of the matched spray header and the corresponding spray header leveling parameters are determined based on the levelness information corresponding to the preset measurement node, and the method specifically comprises the following steps: determining a target wafer placement area with the levelness not reaching the standard and a corresponding horizontal error amount based on the levelness information corresponding to each wafer placement area; based on the horizontal error amount corresponding to the target wafer placement area, corresponding spray header leveling parameters are determined, so that the spray header leveling parameters corresponding to the target wafer placement area can be rapidly and accurately determined, and the automatic leveling accuracy of the subsequent spray assembly is ensured.

Based on the above embodiment, the adjusting piece adjusting the target showerhead corresponds to the showerhead leveling parameter corresponding to the target showerhead matching wafer placement area and the current state of the target showerhead specifically includes:

Specifically, based on the foregoing embodiment, based on the showerhead leveling parameter corresponding to the wafer placement area and the current state of the target showerhead, the adjustment direction and the adjustment distance of each adjustment member corresponding to the target showerhead may be determined, and after the adjustment direction and the adjustment distance of each adjustment member corresponding to the target showerhead are determined, each adjustment member may be adjusted based on the adjustment direction and the adjustment distance of each adjustment member corresponding to the target showerhead. It can be understood that the current states of the different spray heads are different, so that the adjusting directions and the adjusting distances of the adjusting pieces corresponding to the different target spray heads are different. That is, in the process, the position of the same spray header is continuously changed for different working procedures, so that the spray headers of different working procedures are always kept horizontal with the wafer placement area, and the film deposition quality can be ensured to the greatest extent.

According to the method provided by the embodiment of the application, the adjusting piece corresponding to the target spray header is adjusted based on the spray header leveling parameter corresponding to the wafer placement area matched with the target spray header and the current state of the target spray header, and specifically comprises the following steps: determining the adjusting direction and the adjusting distance of each adjusting piece corresponding to the target spray header based on the spray header leveling parameters corresponding to the wafer placing area matched with the target spray header and the current state of the target spray header; and the adjusting mode of each adjusting piece corresponding to the target spray header can be rapidly and accurately determined and automatically leveled based on the adjusting direction and the adjusting distance of each adjusting piece corresponding to the target spray header, so that the quality and the efficiency of film deposition are ensured to the greatest extent.

The spray assembly automatic leveling device of the multi-station PECVD device provided by the application is described below, and the spray assembly automatic leveling device of the multi-station PECVD device described below and the spray assembly automatic leveling method of the multi-station PECVD device described above can be correspondingly referred to each other.

Based on any one of the above embodiments, fig. 10 is a schematic structural diagram of a spray assembly automatic leveling device of a multi-station PECVD apparatus provided by the present application, where the multi-station PECVD apparatus includes a spray assembly composed of a plurality of spray heads, a heating plate, and a plurality of leveling assemblies in one-to-one correspondence with the plurality of spray heads, each leveling assembly includes at least three adjusting members connected with the corresponding spray heads, the heating plate includes a plurality of wafer placement areas equal to the number of spray heads, and each wafer placement area is respectively matched with each spray head when the heating plate can be rotated to enable different processes to be performed; as shown in fig. 10, the apparatus includes:

the leveling parameter determining module 1001 is configured to determine, based on levelness information corresponding to a preset measurement node, a target wafer placement area where a matched showerhead needs leveling, and a corresponding showerhead leveling parameter; the levelness information is obtained based on measurement of measurement components arranged in each wafer placement area;

The automatic leveling module 1002 is configured to determine, based on a real-time process progress, whether a wafer placement area matched with a target showerhead in different processes is a target wafer placement area, and if yes, adjust an adjusting piece corresponding to the target showerhead based on a showerhead leveling parameter corresponding to the target showerhead matched wafer placement area and a current state of the target showerhead, so as to achieve automatic leveling of a spray assembly.

The device provided by the embodiment of the application, the multi-station PECVD device comprises a spray assembly formed by a plurality of spray heads, a heating disc and a plurality of leveling assemblies corresponding to the spray heads one by one, wherein each leveling assembly comprises at least three adjusting pieces connected with the corresponding spray heads, the heating disc comprises a plurality of wafer placement areas with the same number as the spray heads, and each wafer placement area is matched with each spray head when the heating disc can rotate to enable different working procedures to be carried out; the device comprises: the leveling parameter determining module 1001 is configured to determine, based on levelness information corresponding to a preset measurement node, a target wafer placement area where a matched showerhead needs leveling, and a corresponding showerhead leveling parameter; the levelness information is obtained based on measurement of measurement components arranged in each wafer placement area; the automatic leveling module 1002 is configured to determine whether a wafer placement area matched with a target showerhead in different procedures is a target wafer placement area based on real-time process progress, if yes, adjust an adjusting piece corresponding to the target showerhead based on a showerhead leveling parameter corresponding to the target showerhead and a current state of the target showerhead, so as to achieve automatic leveling of a spray assembly, obtain levelness information corresponding to the wafer placement area at a preset measurement node, and determine a corresponding showerhead leveling parameter so as to automatically level the spray assembly in a process, and further ensure that a plurality of showerheads are reliably and accurately leveled relative to a heating plate in the process under the condition that the heating plate is deformed, so that a problem that quality of a deposited film of the wafer does not reach standards is avoided.

Based on the above embodiment, the device further includes a levelness information obtaining module, where the levelness information obtaining module is specifically configured to perform the following steps:

Based on any of the above embodiments, the controlling the plurality of leveling assemblies to drive the corresponding shower heads to move vertically downward until each shower head contacts all the elastic sensors in the corresponding measuring assembly specifically includes:

Based on any one of the above embodiments, the controlling the plurality of leveling assemblies to drive the corresponding shower heads to move to the initial positions specifically includes:

Based on any one of the above embodiments, the determining levelness information corresponding to each wafer placement area based on the feedback signal of the elastic sensor in each measurement assembly specifically includes:

Based on any one of the above embodiments, determining a target wafer placement area where a matched showerhead needs to be leveled and a corresponding showerhead leveling parameter based on levelness information corresponding to a preset measurement node specifically includes:

Based on any one of the foregoing embodiments, the adjusting piece corresponding to the target showerhead is adjusted based on a showerhead leveling parameter corresponding to the target showerhead-matched wafer placement area and a current state of the target showerhead, and specifically includes:

Fig. 11 illustrates a physical structure diagram of an electronic device, as shown in fig. 11, which may include: a processor 1101, a communication interface (Communications Interface) 1102, a memory 1103 and a communication bus 1104, wherein the processor 1101, the communication interface 1102 and the memory 1103 communicate with each other via the communication bus 1104. The processor 1101 may invoke logic instructions in the memory 1103 to perform the method for auto-leveling a spray assembly of a multi-station PECVD apparatus provided by the methods described above, the method comprising: determining a target wafer placement area, which is required to be leveled, of a matched spray header and corresponding spray header leveling parameters based on levelness information corresponding to a preset measurement node; the levelness information is obtained based on measurement of measurement components arranged in each wafer placement area; and determining whether the wafer placement areas matched with the target spray heads in different working procedures are target wafer placement areas or not based on real-time process progress, and if so, adjusting parts corresponding to the target spray heads based on spray head leveling parameters corresponding to the target spray head matched wafer placement areas and the current state of the target spray heads so as to realize automatic leveling of the spray assembly.

Further, the logic instructions in the memory 1103 described above may be implemented in the form of software functional units and sold or used as a separate product, and may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.

In another aspect, the present application further provides a computer program product, where the computer program product includes a computer program, where the computer program can be stored on a non-transitory computer readable storage medium, where the computer program, when executed by a processor, can perform a method for automatically leveling a spray assembly of a multi-station PECVD apparatus provided by the above methods, where the method includes: determining a target wafer placement area, which is required to be leveled, of a matched spray header and corresponding spray header leveling parameters based on levelness information corresponding to a preset measurement node; the levelness information is obtained based on measurement of measurement components arranged in each wafer placement area; and determining whether the wafer placement areas matched with the target spray heads in different working procedures are target wafer placement areas or not based on real-time process progress, and if so, adjusting parts corresponding to the target spray heads based on spray head leveling parameters corresponding to the target spray head matched wafer placement areas and the current state of the target spray heads so as to realize automatic leveling of the spray assembly.

In yet another aspect, the present application further provides a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a method for automatically leveling a spray assembly of a multi-station PECVD apparatus provided by the above methods, the method comprising: determining a target wafer placement area, which is required to be leveled, of a matched spray header and corresponding spray header leveling parameters based on levelness information corresponding to a preset measurement node; the levelness information is obtained based on measurement of measurement components arranged in each wafer placement area; and determining whether the wafer placement areas matched with the target spray heads in different working procedures are target wafer placement areas or not based on real-time process progress, and if so, adjusting parts corresponding to the target spray heads based on spray head leveling parameters corresponding to the target spray head matched wafer placement areas and the current state of the target spray heads so as to realize automatic leveling of the spray assembly.

The apparatus embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purposes of the embodiments of the present application. Those of ordinary skill in the art will understand and implement the present invention without undue burden.

From the above description of the embodiments, it will be apparent to those skilled in the art that the embodiments may be implemented by means of software plus necessary general hardware platforms, or of course may be implemented by means of hardware. Based on this understanding, the foregoing technical solution may be embodied essentially or in a part contributing to the prior art in the form of a software product, which may be stored in a computer readable storage medium, such as ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method described in the respective embodiments or some parts of the embodiments.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims

1. The automatic leveling method for the spray assemblies of the multi-station PECVD equipment is characterized by comprising a spray assembly formed by a plurality of spray heads, a heating disc and a plurality of leveling assemblies in one-to-one correspondence with the spray heads, wherein each leveling assembly comprises at least three adjusting pieces connected with the corresponding spray heads, the heating disc comprises a plurality of wafer placement areas with the same number as the spray heads, and each wafer placement area is matched with each spray head when different processes are carried out by rotating the heating disc; the method comprises the following steps:

determining whether the wafer placement areas matched with the target spray heads in different working procedures are target wafer placement areas or not based on real-time process progress, and if yes, adjusting an adjusting piece corresponding to the target spray head based on spray head leveling parameters corresponding to the target spray head matched wafer placement areas and the current state of the target spray head so as to realize automatic leveling of a spray assembly;

The measuring assembly comprises elastic sensors, the number of which is the same as that of regulating parts of the leveling assembly, and correspondingly, the step of acquiring levelness information corresponding to the preset measuring nodes specifically comprises the following steps:

determining levelness information corresponding to each wafer placement area based on feedback signals of elastic sensors in each measurement assembly;

the adjusting piece corresponding to the target spray header is adjusted based on the spray header leveling parameter corresponding to the wafer placement area matched with the target spray header and the current state of the target spray header, and specifically comprises the following steps:

adjusting each adjusting piece based on the adjusting direction and the adjusting distance of each adjusting piece corresponding to the target spray header;

the spray header leveling parameters refer to a target offset direction and a target offset distance of the connection point of the spray header and each corresponding adjusting piece relative to an initial horizontal state, and the current state of the target spray header refers to a current offset direction and a current offset distance of the connection point of the target spray header and each corresponding adjusting piece relative to the initial horizontal state.

2. The method for automatically leveling the spray assembly of the multi-station PECVD apparatus according to claim 1, wherein the controlling the plurality of leveling assemblies drives the corresponding spray heads to move vertically downward until each spray head contacts all the elastic sensors in the corresponding measuring assembly, specifically comprising:

3. The method for automatically leveling the spray assembly of the multi-station PECVD apparatus according to claim 2, wherein the controlling the plurality of leveling assemblies to drive the corresponding spray heads to move to the initial position comprises:

4. The method for automatically leveling the spray assembly of the multi-station PECVD apparatus according to claim 3, wherein the determining the levelness information corresponding to each wafer placement area based on the feedback signal of the elastic sensor in each measurement assembly specifically comprises:

5. The method for automatically leveling a spray assembly of a multi-station PECVD apparatus according to claim 4, wherein the determining the target wafer placement area to be leveled for the matched spray header and the corresponding spray header leveling parameters based on the levelness information corresponding to the preset measurement node specifically comprises:

6. The automatic leveling device for the spray assemblies of the multi-station PECVD equipment is characterized by comprising a spray assembly formed by a plurality of spray heads, a heating disc and a plurality of leveling assemblies in one-to-one correspondence with the spray heads, wherein each leveling assembly comprises at least three adjusting pieces connected with the corresponding spray heads, the heating disc comprises a plurality of wafer placement areas with the same number as the spray heads, and each wafer placement area is matched with each spray head when different processes are performed by rotating the heating disc; the device comprises:

the automatic leveling module is used for determining whether the wafer placement area matched with the target spray header in different working procedures is a target wafer placement area or not based on real-time process progress, and if yes, adjusting an adjusting piece corresponding to the target spray header based on spray header leveling parameters corresponding to the target spray header matched wafer placement area and the current state of the target spray header so as to realize automatic leveling of a spray assembly;

the measuring assembly comprises elastic sensors the same as the adjusting parts of the leveling assembly in number, and the device further comprises a levelness information acquisition module for executing the following steps:

7. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor performs the steps of the method for automatically leveling a spray assembly of a multi-station PECVD apparatus as claimed in any one of claims 1 to 5 when the program is executed.

8. A non-transitory computer readable storage medium having stored thereon a computer program, wherein the computer program when executed by a processor performs the steps of the method for automatically leveling a spray assembly of a multi-station PECVD apparatus according to any one of claims 1 to 5.