CN115872353A - Chip mounting device and method for quartz resonant beam - Google Patents
Chip mounting device and method for quartz resonant beam Download PDFInfo
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- CN115872353A CN115872353A CN202211579024.8A CN202211579024A CN115872353A CN 115872353 A CN115872353 A CN 115872353A CN 202211579024 A CN202211579024 A CN 202211579024A CN 115872353 A CN115872353 A CN 115872353A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a quartz resonance beam chip paster device which comprises a bonding balancing weight, a supporting frame, a TO base picking module, a resonance beam chip placing module, a visual alignment module and a heating glue fixing module, wherein the TO base picking module, the resonance beam chip placing module, the visual alignment module and the heating glue fixing module are arranged on the supporting frame. The invention greatly simplifies the visual system, provides accurate and constant adhesive force by using the dead weight of the adhesive balancing weight, ensures the adhesive effect and can effectively protect the quartz resonant beam chip, avoids the dislocation caused by moving the chip by adopting the in-situ heating and glue fixing mode, improves the reliability of the quartz resonant beam chip, reduces the complexity of a chip mounting system and reduces the cost of chip mounting.
Description
Technical Field
The invention relates to the technical field of micro-electro-mechanical system inertial sensor packaging, in particular to a quartz resonant beam chip mounting technology.
Background
The quartz vibration beam accelerometer is an acceleration measuring device which works by utilizing the piezoelectric effect of quartz crystal and the force frequency effect of a resonance beam, has the advantages of high precision, small volume, low power consumption, digital output and the like, is widely applied to the fields of inertial navigation, gravity measurement, resource exploration and the like, and has important military and civil values.
The integrated quartz vibration beam accelerometer completes the manufacture of the resonance beam, the mass block and the vibration isolation frame on one quartz substrate, avoids the problem of thermal matching caused by different materials, and has more excellent temperature characteristic. The quartz resonance beam chip is a core sensitive element of the integrated quartz vibration beam accelerometer, and the pasting (pasting) of the quartz resonance beam chip is the first link of the accelerometer assembly packaging, and has important influence on the performance of the accelerometer.
In the prior art, chip mounting is mainly completed by a chip mounter. Chip mounting machines generally adopt a mode of firstly sucking a chip and then adhering the chip to a substrate, and because the middle structure of the chip is hollow, a suction nozzle with a special structure needs to be customized, the price is high, and the risk of falling the chip is caused when the chip is not operated properly; in addition, two cameras are needed in the chip mounting process or a beam splitter prism is used for simultaneously observing the chip and the substrate, so that a visual system is complex; and the force and heating control used for the patch requires the use of precise force sensors and heating stages, which increases the complexity of the whole system and causes high patch cost. Therefore, it is urgently needed to develop a simple and reliable chip mounting device specially for the attachment of the resonant beam chip.
Disclosure of Invention
The invention mainly aims to provide a quartz resonance beam chip mounting device and a quartz resonance beam chip mounting method, which can simply and efficiently realize mounting of a quartz resonance beam chip in an integrated quartz vibration beam accelerometer.
The technical scheme adopted by the invention is as follows:
the quartz resonant beam chip mounting device comprises a bonding balancing weight, a TO base picking module, a resonant beam chip placing module, a visual alignment module, a heating glue fixing module and a supporting frame;
the bonding balancing weight is used for fixing the TO base when the chip is bonded and providing pressing force when the chip is bonded;
the TO base picking module comprises an XYZ three-axis translation table and a vacuum suction pen, the vacuum suction pen is fixed along the Z-axis direction of the XYZ three-axis translation table through a fixing clamp, and a vacuum sucker is arranged at the end part of the vacuum suction pen and used for sucking and placing a TO base assembled with a bonding balancing weight;
the resonant beam chip placing module comprises a chip placing platform, a placing platform supporting plate and a rotary workbench which are arranged in a centering manner, a rotary platform fixing plate and a leveling supporting base, wherein the chip placing platform is installed on the placing platform supporting plate, and the placing platform supporting plate, the rotary workbench, the rotary platform fixing plate and the leveling supporting base are all of hollow-shaped structures and are sequentially stacked and installed from top to bottom, so that the lower part of the chip placing platform is empty;
the visual alignment module comprises a pen-type camera, an adjusting bracket and an image display screen, wherein the pen-type camera is arranged below the chip placing table through the adjusting bracket, the optical axis of the pen-type camera is vertical to the working surface of the chip placing table, and the image display screen is connected with the pen-type camera and used for displaying images acquired by the pen-type camera;
the heating glue fixing module comprises a heating device, a temperature sensor, a temperature controller and a fixed support, wherein the temperature controller is respectively connected with the heating device and the temperature sensor, the temperature sensor is arranged near the working area of the chip placing table, the fixed support and the rotary working table are concentrically arranged, the heating device is arranged on the fixed support, and the center of a thermal field of the heating device covers the working area of the chip placing table;
support frame, including last backup pad and bottom suspension fagging, go up the backup pad and be the annular, through support bar and bottom suspension fagging parallel mount that circumference evenly distributed's length is adjustable, go up TO be provided with in the backup pad TO base picks up the module, go up the backup pad with set up between the bottom suspension fagging the module is placed TO the resonant beam chip the module is glued admittedly in the heating with the vision is counterpointed the module, just the Z axle direction of the XYZ triaxial translation platform of TO base pickup module with the optical axis of the pen test camera of vision counterpoint module is parallel.
Meet above-mentioned technical scheme, the bonding balancing weight is the loop configuration of adaptation TO base.
According to the technical scheme, the rotary worktable is a single-shaft rotary table, and the worktable surface is annular.
According to the technical scheme, the chip placing table is made of high-temperature-resistant and high-transparency materials.
According to the technical scheme, the heating device is an annular quartz lamp.
In the technical scheme, the temperature sensor is a PT100 thermocouple.
According to the technical scheme, the leveling support base is a three-point support leveling mechanism.
The invention also provides a quartz resonance beam chip mounting method, which specifically comprises the following steps:
s1, picking up a TO base: fixing the TO base on a bonding balancing weight and adsorbing the TO base on a vacuum chuck of a TO base pickup module;
s2, placing the platform with the TO base and the chip TO adjust the parallelism: adjusting the XYZ three-axis translation table and the leveling support base TO enable the electrode contact pins on the TO base TO be capable of simultaneously contacting with the working surface of the chip placing table;
s3, dispensing: taking down the TO base, coating conductive adhesive on the end surface of an electrode contact pin on the TO base, adsorbing the TO base with the adhesive balancing weight TO a vacuum chuck again, and enabling the TO base TO be positioned in the center of a pen-type camera view field;
s4, placing a quartz resonance beam chip: placing the quartz resonance beam chip with the anchor point electrode upwards in a working area of a chip placing table to enable the quartz resonance beam chip to be positioned in the center of a pen type camera view field;
s5, aligning the TO base with the quartz resonant beam chip: observing the electrode contact pins on the TO base and the anchor points of the quartz resonant beam chips through an image display screen, and simultaneously adjusting an XYZ three-axis translation table and a rotary worktable TO enable the electrode contact pins on the TO base and the anchor point electrodes of the quartz resonant beam chips TO be aligned one by one;
s6, chip pasting: after the alignment is finished, adjusting the Z axis of the XYZ three-axis translation table TO move the TO base downwards, releasing the TO base before the TO base is contacted with the quartz resonance beam chip, and finishing the adhesion of the electrode contact pin on the TO base and the anchor point electrode of the quartz resonance beam chip;
s7, heating and glue fixing: and adjusting the heating glue fixing module to enable the center of a thermal field of the heating glue fixing module to cover the quartz resonance beam chip, and adjusting the temperature and the heating time of the heating device to finish the curing of the conductive glue.
In the above technical solution, the conductive adhesive in step S3 is a silver-based conductive adhesive.
In connection with the above technical solution, the adjusting the temperature and the heating time of the heating device in step S7 means controlling the temperature at 80 ℃ and the heating time at 4h.
The invention has the following beneficial effects: the method comprises the steps of adhering the TO base with the adhered balancing weight TO the quartz resonance beam chip in an adsorbing mode, placing the transparent quartz resonance beam chip on a transparent workbench, observing the positions of an electrode contact pin on the TO base and an anchor point electrode of the quartz resonance beam chip from the lower side of the workbench by using a pen-type camera TO realize alignment adhesion, and curing and adhering in an in-situ heating glue fixing mode. The invention realizes the position observation when the chip is pasted by using a single vision camera, greatly simplifies a vision system, can effectively protect the quartz resonance beam chip and provide reliable pasting pressing force by adopting a mode of bonding the TO base of the bonding balancing weight TO the quartz resonance beam chip, and can avoid the dislocation caused by moving the chip by adopting an in-situ heating glue fixing mode, thereby greatly improving the reliability of the quartz resonance beam chip, reducing the complexity of a chip mounting system and reducing the cost of chip mounting.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a schematic diagram of an overall structure of a quartz resonant beam chip mounting device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a bonded weight according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a TO base pick-up module configuration according TO an embodiment of the invention;
fig. 4 is a schematic structural diagram of a resonant beam chip placement module according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a visual alignment module according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a thermosetting adhesive module according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a TO dock according TO an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a quartz resonant beam chip according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
According TO the invention, the TO base with the adhesive balancing weight is adhered TO the quartz resonance beam chip in a mode of adsorbing the TO base with the adhesive balancing weight, so that the TO base and the quartz resonance beam chip are adhered, reliable adhering pressure is provided, and the chip is prevented from falling and being damaged when a complex adsorption module and an adhering force control system are adopted and the quartz resonance beam chip is adsorbed; meanwhile, a transparent quartz resonance beam chip is placed on a transparent workbench, and a single vision camera is used for observing the positions of electrode contact pins on the TO base and anchor points of the quartz resonance beam chip from the lower part of the workbench TO realize alignment and adhesion, so that a vision system is simplified; and the dislocation caused by moving the chip can be avoided by curing and pasting in an in-situ heating and glue-fixing mode.
The invention provides a quartz resonance beam chip mounting device which comprises a bonding balancing weight 1, a TO base picking module 2, a resonance beam chip placing module 3, a visual alignment module 4, a heating glue fixing module 5 and a supporting frame 6 as shown in figure 1.
Bonding balancing weight 1 is used for fixed TO base 7 when the chip bonds TO the packing force when providing the chip and bonding, utilize bonding balancing weight 1 self gravity TO provide the packing force when the chip bonds, can guarantee the accuracy and the invariant of paster power, avoid adopting expensive, complicated accurate force control device.
The TO base pickup module 2, as shown in fig. 3, includes an XYZ three-axis translation stage 201 and a vacuum suction pen 202, the vacuum suction pen is fixed along the Z-axis direction of the XYZ three-axis translation stage 201 by a fixing jig 203, and a vacuum suction cup 204 is provided at an end of the vacuum suction pen 202 for sucking and placing the TO base 7 equipped with the adhesive balancing weight 1; the TO base 7 with the adhered balancing weight 1 is adhered TO the quartz resonance beam chip 8 in a mode of adsorbing the TO base 7 TO adhere TO the quartz resonance beam chip 8, reliable adhering pressure is provided, and chip falling damage caused by adopting a complex adsorption module, an adhering force control system and adsorbing the quartz resonance beam chip 8 is avoided.
The resonant beam chip placement module 3, as shown in fig. 4, includes a chip placement platform 301, a placement platform support plate 302, a rotary table 303, a rotary table fixing plate 304 and a leveling support base 305, which are arranged in a centered manner, the chip placement platform 301 is mounted on the placement platform support plate 302, and the placement platform support plate 302, the rotary table 303, the rotary table fixing plate 304 and the leveling support base 305 are all of a structure with a hollow center and are sequentially stacked from top to bottom, so as to ensure that the lower portion of the chip placement platform 301 is hollow.
The visual alignment module 4, as shown in fig. 5, includes a pen camera 401, an adjusting bracket 402 and an image display screen 403, wherein the pen camera 403 is disposed below the chip placing table 301 through the adjusting bracket 402, and an optical axis of the pen camera 401 is perpendicular to a working surface of the chip placing table 301, and the image display screen 403 is connected to the pen camera 401 and is used for displaying an image collected by the pen camera; the alignment of the TO base 7 and the quartz resonance beam chip 8 can be finished by only using one camera TO observe in combination with the transparent characteristic of the quartz resonance beam chip 8, and a visual system is simplified.
The heating glue-fixing module 5, as shown in fig. 6, includes a heating device 501, a temperature sensor 502, a temperature controller 503 and a fixing support 504, the temperature controller 503 is respectively connected with the heating device 501 and the temperature sensor 502, the temperature sensor 502 is installed near the working area of the chip placing table 301, the fixing support 504 and the rotating table 303 are concentrically arranged, the heating device 501 is installed on the fixing support 504, and the center of the thermal field of the heating device 501 covers the working area of the chip placing table 301; the mode can realize the curing and pasting in the in-situ heating glue fixing mode, and can avoid the dislocation caused by moving the chip.
The supporting frame 6, as shown in fig. 1, includes an upper supporting plate 601 and a lower supporting plate 602, the upper supporting plate 601 is ring-shaped, a supporting rod 603 which is adjustable in length and is uniformly distributed through a circumference is installed in parallel with the lower supporting plate 602, a TO base picking module 2 is arranged on the upper supporting plate 601, a resonant beam chip placing module 3, a heating glue fixing module 5 and a visual alignment module 4 are arranged between the upper supporting plate 601 and the lower supporting plate 602, and the Z-axis direction of the XYZ triaxial translation stage 201 of the TO base picking module 2 is parallel TO the optical axis of the pen test camera 401 of the visual alignment module 4.
As a preferred embodiment, the adhesive clump weight 1 is a ring-shaped structure that fits TO base, as shown in fig. 2.
In a preferred embodiment, the rotary table 303 is a single axis rotary table, with the table top being annular.
As a preferred embodiment, the chip placement stage 301 is a high temperature resistant, highly transparent material.
As a preferred embodiment, the heating device 501 is an annular quartz lamp.
The temperature sensor 502 is a PT100 thermocouple as a preferred embodiment.
As a preferred embodiment, the leveling support base 305 is a three-point support leveling mechanism.
The invention also provides a quartz resonance beam chip mounting method, which specifically comprises the following steps:
s1, picking up a TO base: fixing the TO base 7 on the bonding balancing weight 1 and adsorbing the TO base on a vacuum chuck of the TO base pickup module;
s2, the TO base and the chip placing table are parallel TO each other: adjusting the XYZ three-axis translation stage 201 and the leveling support base 305 so that the electrode pins 701 on the TO base 7 can simultaneously contact the working surface of the chip placement stage 301;
s3, dispensing: as shown in fig. 7, the TO base 7 is taken down, the end face of the electrode pin 701 on the TO base 7 is coated with conductive adhesive, the TO base 7 with the adhered balancing weight 1 is adsorbed on the vacuum chuck 204 again, and the TO base 7 is positioned at the center of the visual field of the pen-type camera 401;
s4, placing a quartz resonant beam chip: placing the quartz resonant beam chip 8 with the anchor point electrode 801 side up in the working area of the chip placing table 301, so that the quartz resonant beam chip 8 is positioned in the center of the view field of the pen-type camera 401;
s5, aligning the TO base with the quartz resonant beam chip: observing the electrode pins 701 on the TO base 7 and the anchor electrodes 801 of the quartz resonance beam chip 8 through the image display screen 403, and simultaneously adjusting the XYZ triaxial translation table 201 and the rotary worktable 303 TO enable the electrode pins 701 on the TO base 7 and the anchor electrodes 801 of the quartz resonance beam chip 8 TO be aligned one by one;
s6, chip pasting: after the alignment is finished, adjusting the Z axis of the XYZ triaxial translation table 201 TO move the TO base 7 downwards, releasing the TO base 7 before the TO base 7 is contacted with the quartz resonance beam chip 8, and finishing the adhesion of an electrode contact pin 701 on the TO base 7 and an anchor point electrode 801 of the quartz resonance beam chip 8;
s7, heating and glue fixing: and adjusting the heating glue fixing module 5 to enable the center of the thermal field of the heating glue fixing module to cover the quartz resonance beam chip 8, and adjusting the temperature and the heating time of the heating device 501 to finish the curing of the conductive glue.
As a preferred embodiment, the conductive adhesive in step S3 is a silver-based conductive adhesive.
As a preferred embodiment, adjusting the temperature and the heating time period of the heating device 501 in step S7 means controlling the temperature at 80 ℃ and the heating time period at 4h.
The invention realizes the position observation when the chip is pasted by using a single vision camera, greatly simplifies a vision system, can effectively protect the quartz resonance beam chip and provide reliable pasting pressing force by adopting a mode of bonding the TO base of the bonding balancing weight TO the quartz resonance beam chip, and can avoid the dislocation caused by moving the chip by adopting an in-situ heating glue fixing mode, thereby greatly improving the reliability of the quartz resonance beam chip, reducing the complexity of a chip mounting system and reducing the cost of chip mounting.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. A quartz resonance beam chip mounting device is characterized by comprising a bonding balancing weight, a TO base picking module, a resonance beam chip placing module, a visual alignment module, a heating glue fixing module and a supporting frame;
the bonding balancing weight is used for fixing the TO base when the chip is bonded and providing pressing force when the chip is bonded;
the TO base picking module comprises an XYZ three-axis translation table and a vacuum suction pen, the vacuum suction pen is fixed along the Z-axis direction of the XYZ three-axis translation table through a fixing clamp, and a vacuum sucker is arranged at the end part of the vacuum suction pen and used for sucking and placing the TO base assembled with the bonded balancing weight;
the resonant beam chip placing module comprises a chip placing table, a placing table supporting plate and a rotary workbench which are arranged in a centering manner, a rotary table fixing plate and a leveling supporting base, wherein the chip placing table is installed on the placing table supporting plate, the rotary workbench, the rotary table fixing plate and the leveling supporting base are all of central hollow structures and are sequentially stacked from top to bottom, and the lower part of the chip placing table is ensured to be hollow;
the visual alignment module comprises a pen-type camera, an adjusting bracket and an image display screen, the pen-type camera is arranged below the chip placing table through the adjusting bracket, the optical axis of the pen-type camera is vertical to the working surface of the chip placing table, and the image display screen is connected with the pen-type camera and used for displaying images acquired by the pen-type camera;
the heating glue fixing module comprises a heating device, a temperature sensor, a temperature controller and a fixed support, wherein the temperature controller is respectively connected with the heating device and the temperature sensor, the temperature sensor is arranged near the working area of the chip placing table, the fixed support and the rotary working table are concentrically arranged, the heating device is arranged on the fixed support, and the center of a thermal field of the heating device covers the working area of the chip placing table;
support frame, including last backup pad and bottom suspension fagging, go up the backup pad and be the annular, through support bar and bottom suspension fagging parallel mount that circumference evenly distributed's length is adjustable, go up TO be provided with in the backup pad TO base picks up the module, go up the backup pad with set up between the bottom suspension fagging the module is placed TO the resonant beam chip the module is glued admittedly in the heating with the vision is counterpointed the module, just the Z axle direction of the XYZ triaxial translation platform of TO base pickup module with the optical axis of the pen test camera of vision counterpoint module is parallel.
2. The quartz resonant beam chip mount device of claim 1, wherein the adhesive weight is a ring shaped structure that fits TO the base.
3. A quartz resonator beam chip mount device according to claim 1, wherein the rotary table is a single axis rotary table, the table top being ring-shaped.
4. The quartz resonant beam chip mount device of claim 1, wherein the chip mounting stage is a high temperature resistant, highly transparent material.
5. The quartz resonator beam chip mount device of claim 1, wherein the heating device is a ring quartz lamp.
6. The quartz resonant beam chip die attach device of claim 1, wherein the temperature sensor is a PT100 thermocouple.
7. The quartz resonant beam chip die attach device of claim 1, wherein the leveling support base is a three-point support leveling mechanism.
8. A quartz resonant beam chip mounting method is characterized in that the mounting method is based on the quartz resonant beam chip mounting device of any one of claims 1-7, and specifically comprises the following steps:
s1, picking up a TO base: fixing the TO base on a bonding balancing weight and adsorbing the TO base on a vacuum chuck of a TO base pickup module;
s2, the TO base and the chip placing table are parallel TO each other: adjusting the XYZ three-axis translation table and the leveling support base TO enable the electrode contact pins on the TO base TO be capable of simultaneously contacting with the working surface of the chip placing table;
s3, dispensing: taking down the TO base, coating conductive adhesive on the end surface of an electrode contact pin on the TO base, adsorbing the TO base with the adhesive balancing weight TO a vacuum chuck again, and enabling the TO base TO be positioned in the center of a pen-type camera view field;
s4, placing a quartz resonance beam chip: placing the quartz resonance beam chip with the anchor point electrode upwards in a working area of a chip placing table to enable the quartz resonance beam chip to be positioned in the center of a pen type camera view field;
s5, aligning the TO base with the quartz resonant beam chip: observing the electrode contact pins on the TO base and anchor points of the quartz resonance beam chip through an image display screen, and simultaneously adjusting an XYZ three-axis translation table and a rotary worktable TO enable the electrode contact pins on the TO base and the anchor points of the quartz resonance beam chip TO be aligned one by one;
s6, chip pasting: after the alignment is finished, adjusting the Z axis of the XYZ three-axis translation table TO move the TO base downwards, releasing the TO base before the TO base is contacted with the quartz resonance beam chip, and finishing the adhesion of the electrode contact pin on the TO base and the anchor point electrode of the quartz resonance beam chip;
s7, heating and glue fixing: and adjusting the heating glue fixing module to enable the center of a thermal field of the heating glue fixing module to cover the quartz resonance beam chip, and adjusting the temperature and the heating time of the heating device to finish the curing of the conductive glue.
9. The method for chip mounting on a quartz resonance beam according to claim 8, wherein the conductive adhesive in step S3 is a silver-based conductive adhesive.
10. The method for mounting the quartz resonant beam chip according to claim 8, wherein the step of adjusting the temperature and the heating time of the heating device in the step S7 is to control the temperature at 80 ℃ and the heating time at 4h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211579024.8A CN115872353A (en) | 2022-12-06 | 2022-12-06 | Chip mounting device and method for quartz resonant beam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211579024.8A CN115872353A (en) | 2022-12-06 | 2022-12-06 | Chip mounting device and method for quartz resonant beam |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115872353A true CN115872353A (en) | 2023-03-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211579024.8A Pending CN115872353A (en) | 2022-12-06 | 2022-12-06 | Chip mounting device and method for quartz resonant beam |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115872353A (en) |
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2022
- 2022-12-06 CN CN202211579024.8A patent/CN115872353A/en active Pending
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