CN115872094B - Silicon wafer caching device and method for correcting initial position of support of silicon wafer caching device - Google Patents
Silicon wafer caching device and method for correcting initial position of support of silicon wafer caching device Download PDFInfo
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- CN115872094B CN115872094B CN202310154315.0A CN202310154315A CN115872094B CN 115872094 B CN115872094 B CN 115872094B CN 202310154315 A CN202310154315 A CN 202310154315A CN 115872094 B CN115872094 B CN 115872094B
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Abstract
The invention relates to a silicon wafer buffer device and a correction method for the initial position of a bracket of the silicon wafer buffer device, wherein the silicon wafer buffer device comprises an n-shaped buffer frame, a plurality of strip-shaped partition boards, two groups of synchronous pulley assemblies and a first motor for driving the synchronous transmission of the two groups of synchronous pulley assemblies, each synchronous pulley assembly comprises two parallel synchronous belts, the two synchronous belts vertically transmit along the H-shaped bracket, the strip-shaped partition boards are uniformly and alternately arranged on the synchronous belts, the same-layer strip-shaped partition boards on the four synchronous belts are distributed in a rectangular shape to form a horizontal bracket, the bracket is used for supporting and buffering silicon wafers, the correction device comprises an optical fiber sensor, and the correction device and the correction method are adopted for correcting the initial position of a current layer bracket in the buffer device, so that the height difference between the upper surface of the current layer bracket and the surface of a conveyor belt is within a height difference threshold range.
Description
Technical Field
The invention relates to the field of silicon wafer processing, in particular to a silicon wafer caching device, a support initial position correction device and a correction method.
Background
When the automatic equipment is adopted to process the silicon wafer, the silicon wafer is generally conveyed to the next procedure by adopting a conveying device from the previous procedure, the buffer devices are generally arranged on the two sides of the conveying device, and the silicon wafer in the conveying process is prepared by the buffer devices, so that the silicon wafer on the buffer devices is conveniently grabbed to the next procedure by a mechanical arm, but the buffer devices commonly used at present have the problem of low buffer efficiency and the like.
Fig. 1 provides a traditional buffer device, it mainly includes lift mobile module 101, be fixed in the n shape buffer rack 1 of the slider of lift mobile module 101, install a plurality of layers interval in proper order in n shape buffer rack 1, parallel, baffle 2 of vertical arrangement, conveyer belt in the transmission device passes the vertical clearance between the baffle 2, during the buffer, with layer baffle 2 slightly lower than the conveyer belt, the silicon chip is in the buffer device department under the conveyer belt drive effect when conveying, the conveyer belt stops, at this moment, silicon chip width direction both sides bottom corresponds with both sides baffle 2 top respectively, slider in the lift mobile module 101 drives buffer rack 1, baffle 2 and silicon chip lift, realize the layer by layer buffer of silicon chip, but after adopting this kind of buffer device to buffer a certain amount of silicon chip, the manipulator is got the silicon chip of buffering back of buffering, lift mobile module 101 drive buffer rack 1 descends to original position, just can carry out the operation of next time, buffer device can't realize incessant continuous operation, and this buffer operation includes two operation processes that rise and decline reset, make buffer time increase, transmission efficiency has been reduced.
The prior art discloses a silicon chip buffer memory, and the patent application number is: 201920621143.2 the buffer mechanism structure and principle in this buffer machine are similar with above-mentioned traditional buffer device, and although it has set up the buffer rack that the multiunit was arranged along the horizontal direction to improve machining efficiency, still need take away the silicon chip on the buffer rack, buffer rack descends to the initial position after can carry out next buffer operation, buffer operation is comparatively complicated to be unfavorable for further promotion of transmission efficiency.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a synchronous belt type silicon wafer caching device which can realize continuous caching of silicon wafers, simplify caching operation, save caching time and improve caching and transmission efficiency of the silicon wafers.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the silicon wafer buffer device is used for buffering silicon wafers transmitted by a transmission device and comprises an n-shaped buffer frame, wherein the n-shaped buffer frame comprises a transverse plate and H-shaped brackets vertically fixed at the bottom ends of two sides of the transverse plate, and the silicon wafer buffer device is characterized by further comprising a plurality of strip-shaped partition plates, two groups of synchronous pulley assemblies and a driving device for driving the two groups of synchronous pulley assemblies to synchronously drive;
the strip-shaped partition plates are uniformly arranged on the synchronous belts at intervals, and one end of each strip-shaped partition plate is vertically fixed with the outer surface of each synchronous belt; when the strip-shaped partition plates move to the inner side end of the n-shaped buffer frame under the action of the synchronous pulley assembly, the same-layer strip-shaped partition plates on the four synchronous belts are distributed in a rectangular shape to form a horizontal bracket, and the bracket is used for supporting and buffering silicon wafers; the conveyor belt in the transmission device vertically passes through a vertical gap in the middle of the n-shaped buffer frame, and before the conveyor belt transmits the silicon wafers to the vertical gap, the driving device drives the synchronous belt pulley assembly to drive the strip-shaped partition plate to synchronously move upwards or downwards, so that the upper surface of one layer of support is lower than the upper surface of the conveyor belt, and the height difference between the upper surface of the layer of support and the upper surface of the conveyor belt is within a certain height difference threshold range; the buffer device further comprises a first photoelectric sensor, a second photoelectric sensor and a first controller, wherein the first photoelectric sensor is arranged on one H-shaped support, the sensing end of the first photoelectric sensor faces towards one side where the strip-shaped partition plate is arranged, the sensing end of the second photoelectric sensor faces towards the side end of the silicon wafer to be buffered, which is conveyed to the vertical gap, and the first motor in the first photoelectric sensor, the second photoelectric sensor and the driving device is electrically connected with the first controller.
It is further characterized in that,
one side of the buffer device is provided with a manipulator, a second controller is arranged in the manipulator, the first controller is in communication connection with the second controller, the manipulator is used for grabbing and transferring buffered silicon chips during feeding buffer, and the manipulator is used for placing the silicon chips into a bracket of the buffer device during discharging buffer;
further, the synchronous pulleys comprise first synchronous pulleys to eighth synchronous pulleys, the synchronous belts comprise first synchronous belts to fourth synchronous belts, the rotary shafts comprise first rotary shafts and second rotary shafts, the first rotary shafts and the second rotary shafts are respectively rotatably arranged in bearing seats at the top ends of the H-shaped brackets on two sides, the first synchronous pulleys and the second synchronous pulleys are symmetrically fixed on two sides of the middle part of the first rotary shafts, the fifth synchronous pulleys and the sixth synchronous pulleys are symmetrically fixed on two sides of the middle part of the second rotary shafts, the third synchronous pulleys and the fourth synchronous pulleys are correspondingly rotatably arranged at the bottom ends of one H-shaped bracket, the seventh synchronous pulleys and the eighth synchronous pulleys are correspondingly rotatably arranged at the bottom ends of the other H-shaped bracket, the first synchronous pulleys and the fourth synchronous pulleys are wound on the first synchronous pulleys, the second synchronous pulleys and the third synchronous pulleys are wound on the fifth synchronous pulleys and the seventh synchronous pulleys, and the fourth synchronous pulleys are wound on the sixth synchronous pulleys and the eighth synchronous pulleys;
further, the driving device comprises a transmission mechanism, a power shaft of the first motor drives synchronous pulleys in the two groups of synchronous pulley assemblies to rotate through the transmission mechanism, and a shell of the first motor is fixed at the top end of the transverse plate;
further, the transmission mechanism comprises a driving wheel, a first linkage wheel, a fifth linkage wheel, a first gear, a second gear meshed with the first gear, a first belt, a third belt, a fifth rotating shaft and a sixth rotating shaft, wherein the driving wheel is fixedly connected with a power shaft of the first motor, the first belt is wound on the driving wheel and the first linkage wheel, the second belt is wound on the second linkage wheel and the third linkage wheel, the third belt is wound on the fourth linkage wheel and the fifth linkage wheel, the first linkage wheel and the second linkage wheel are symmetrically fixed at two ends of the first rotating shaft, the fifth rotating shaft and the sixth rotating shaft are rotatably arranged in bearing seats at the top end of the transverse plate, the first gear and the third linkage wheel are symmetrically fixed at two ends of the fifth rotating shaft, the second gear and the fourth linkage wheel are symmetrically fixed at two ends of the sixth rotating shaft, and the fifth linkage wheel is fixed at one end of the second rotating shaft;
further, the distance between two adjacent strip-shaped clapboards on the same synchronous belt ranges from 13mm to 15mm;
further, the thickness of a single silicon wafer is 0.2mm;
further, the thickness of the single strip-shaped partition plate is 2mm;
further, the height difference threshold range is 4 mm-7 mm;
further, the sensing ends of the first photoelectric sensor and the second photoelectric sensor comprise photoelectric transmitting ends and photoelectric receiving ends corresponding to the photoelectric transmitting ends, the photoelectric transmitting ends and the photoelectric receiving ends of the first photoelectric sensor are correspondingly arranged in the middle of two side ends of the same H-shaped bracket, and the photoelectric transmitting ends and the photoelectric receiving ends of the second photoelectric sensor are correspondingly arranged on two sides of the conveyor belt in the vertical gap;
further, the manipulator is a six-axis manipulator.
The correction device is used for correcting the initial position of the support in the buffer device so that the height difference between the upper surface of the adjacent support of the conveyor belt and the upper surface of the conveyor belt is within a height difference threshold range, and is characterized by comprising an optical fiber sensor, wherein the optical fiber sensor is arranged at the top end of one H-shaped support, the sensing end of the optical fiber sensor faces to one side provided with a strip-shaped partition plate, the optical fiber sensor is electrically connected with a first controller, and when the height difference between the upper surface of the adjacent support of the conveyor belt and the upper surface of the conveyor belt is within the height difference threshold range, the sensing end of the optical fiber sensor corresponds to the side end of the adjacent support.
It is further characterized in that,
the sensing end of the optical fiber sensor comprises an optical fiber transmitting end and an optical fiber receiving end corresponding to the optical fiber transmitting end, and the optical fiber transmitting end and the optical fiber receiving end of the optical fiber sensor are correspondingly arranged on two sides of the top end of the same H-shaped bracket.
The method for correcting the initial position of the support, which is used for realizing the correction of the initial position of the support of the buffer device, is characterized in that when the adjacent support of the conveyor belt waits for supporting the silicon wafer, whether the initial position of the support of the current layer needs to be corrected is judged, and the judgment mode is as follows: sensing position information of a strip-shaped partition plate adjacent to the optical fiber sensor through the optical fiber sensor, if the optical fiber sensor does not detect a trigger signal, the optical fiber sensor indicates that the support moves in place, if the optical fiber sensor detects the trigger signal, the optical fiber sensor indicates that the support does not move in place, and the initial position of the support needs to be corrected, wherein the correcting step comprises the following steps: s1, stopping conveying the silicon wafer by a conveyor belt;
s2, the first controller controls the first motor to drive the synchronous belt to continuously move along the current direction, and simultaneously controls the optical fiber sensor to monitor the movement condition of the strip-shaped partition plate in real time until the optical fiber sensor does not detect a trigger signal;
s3, the optical fiber sensor sends an electric signal without detecting a trigger signal to the first controller, the first controller controls the synchronous belt to stop driving, the strip-shaped partition board stops moving, and the position of the support which is adjacent to the conveyor belt and lower than the conveyor belt at present is used as a new initial position, so that the original initial position of the support of the current layer is corrected to be the new initial position. The original initial position of the current layer of bracket is as follows: and when the adjacent support of the conveyor belt is not moved in place, the adjacent support of the conveyor belt is positioned.
The structure and the method can achieve the following beneficial effects: (1) When the feeding buffer storage is needed, the driving device drives the synchronous belt pulley assembly to drive the strip-shaped partition plate to synchronously move upwards, so that one layer of support is moved to the position of the conveyor belt, then the conveyor belt conveys the silicon wafers to the position right above the adjacent support of the conveyor belt, then the driving device drives the adjacent support of the conveyor belt to continuously move upwards, the adjacent support of the conveyor belt supports the silicon wafers to lift, the buffer storage is realized, an external manipulator grabs and transfers the buffered silicon wafers to the next process, and after the transplantation is finished, the driving device drives the synchronous belt pulley assembly to drive the strip-shaped partition plate to continuously and synchronously move upwards, so that the continuous conveying and the buffer storage of the silicon wafers are realized; when the blanking buffer is needed, the external manipulator places the silicon wafer on the support, the driving device drives the synchronous belt pulley assembly to drive the strip-shaped partition plate to continuously and synchronously move downwards, so that the silicon wafer on the support is placed on the conveyor belt, and the conveyor belt conveys the silicon wafer to the next working procedure, and buffer and continuous blanking are realized.
In the above feeding buffer, the time for stopping the operation of the buffer device includes: the time for the support to wait for lifting the silicon wafer and/or the pause time for the manipulator to grasp the silicon wafer from the support, and the time for the buffer device to stop running in the process of blanking buffer comprises the following steps: the time for stopping when the silicon chip is placed to the conveyor belt through the support and/or the time for placing the silicon chip to the support through the manipulator does not exist in the process of loading and unloading buffering, and the driving device drives the synchronous pulley assembly to drive the support to reversely move to the original position, namely, the operation process of reverse reset does not exist, so that the buffering operation is simplified, the buffering time is saved, and the buffering and transmission efficiency of the silicon chip is effectively improved.
(2) When the correction device is used for correcting the initial position of the support in the buffer device, whether the height difference between the upper surface of the adjacent support of the conveyor belt and the upper surface of the conveyor belt is within a height difference threshold range is judged according to whether the optical fiber sensor detects a trigger signal or not, namely whether the initial position of the support needs to be corrected is judged, the judgment operation is simple and quick, the current-layer support can be automatically adjusted to a new initial position which accords with the height difference threshold range through the comprehensive action of the controller, the optical fiber sensor and the synchronous pulley assembly, the correction of the initial position avoids the problem that the support is damaged due to the fact that the support is overlooked or the silicon wafer collides with the bar-shaped separator, and meanwhile avoids the problem that the normal buffer is affected due to the fact that the silicon wafer collides with the bar-shaped separator in the previous-layer support.
Drawings
FIG. 1 is a schematic diagram of a conventional silicon wafer cache apparatus;
FIG. 2 is a schematic diagram of a three-dimensional structure of a silicon wafer buffer device and a transfer device according to the present invention;
FIG. 3 is a schematic diagram of a three-dimensional structure of a silicon wafer buffer device according to the present invention;
FIG. 4 is a top view of a silicon wafer buffer device of the present invention;
FIG. 5 is a side view of a silicon wafer cache apparatus of the present invention;
FIG. 6 is a rear view of a silicon wafer cache apparatus of the present invention;
FIG. 7 is a front view of a wafer cache apparatus loaded with a silicon wafer according to the present invention;
FIG. 8 is a block diagram showing the control system of the silicon wafer buffer device and the correction device according to the present invention.
Reference numerals: the device comprises an n-shaped buffer frame 1, a strip-shaped partition plate 2, two groups of synchronous pulley assemblies 3, a first synchronous belt 311-a fourth synchronous belt 314, a first synchronous pulley 321-an eighth synchronous pulley 328, a first rotating shaft 331, a second rotating shaft 332, a first motor 41, a driving wheel 42, a first connecting wheel 431-a fifth connecting wheel 435, a first gear 441, a second gear 442, a first belt 451-a third belt 453, a fifth rotating shaft 455, a sixth rotating shaft 456, a silicon wafer 5, a first controller 7, a second controller 8, a first photoelectric sensor 61, a second photoelectric sensor 62, a transmission device 9, a conveyor belt 91, a second motor 92, an optical fiber sensor 10 and a lifting mobile module 101.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It is noted that the terms "comprises" and "comprising," and any variations thereof, in the description and claims of the present invention and in the foregoing figures, are intended to cover a non-exclusive inclusion, such that a process, method, apparatus, article, or device that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or device.
The buffer operation of the buffer device comprises two operation processes of lifting and descending reset, so that buffer time is increased, buffer operation is complex, and transmission efficiency is low.
The two groups of synchronous pulley assemblies 3 are respectively arranged on the H-shaped brackets on two sides and are distributed in a mirror image mode by taking the vertical center line of the n-shaped buffer frame 1 as an axis, each synchronous pulley assembly 3 comprises two parallel synchronous belts and two pairs of synchronous pulleys, the two pairs of synchronous pulleys are respectively arranged on the top end and the bottom end of the same H-shaped bracket in a rotating mode through a rotating shaft, and the two synchronous belts are respectively wound on the synchronous pulleys on two sides. In this embodiment, the specific structure of the synchronous belt of the two groups of synchronous pulley assemblies 3 mounted on the synchronous pulleys is as follows: the synchronous pulleys comprise a first synchronous pulley 321-an eighth synchronous pulley 328, the synchronous belt 31 comprises a first synchronous pulley 311-a fourth synchronous pulley 314, the rotating shafts comprise a first rotating shaft 331 and a second rotating shaft 332, the first rotating shaft 331 and the second rotating shaft 332 are respectively and rotatably arranged in bearing seats at the top ends of two H-shaped brackets, the first synchronous pulley 321 and the second synchronous pulley 322 are symmetrically fixed on two sides of the middle part of the first rotating shaft 331, the fifth synchronous pulley 325 and the sixth synchronous pulley 326 are symmetrically fixed on two sides of the middle part of the second rotating shaft 332, the third synchronous pulley 323 and the fourth synchronous pulley 324 are symmetrically and rotatably arranged on two sides of the bottom of one H-shaped bracket, the seventh synchronous pulley 327 and the eighth synchronous pulley 328 are symmetrically and rotatably arranged on two sides of the bottom of the other H-shaped bracket, the first synchronous pulley 311 is wound on the first synchronous pulley 321 and the fourth synchronous pulley 324, the second synchronous pulley 312 is wound on the second synchronous pulley 322 and the third synchronous pulley 323, the third synchronous pulley 313 is wound on the fifth synchronous pulley 325 and the seventh synchronous pulley 327, and the fourth synchronous pulley 314 is wound on the sixth synchronous pulley 326 and the eighth synchronous pulley 328; two synchronous belts 31 are vertically driven along the H-shaped bracket.
The strip-shaped partition boards 2 are uniformly arranged at intervals on each synchronous belt, in the embodiment, the thickness of a single silicon wafer is 0.2mm, the distance between two adjacent strip-shaped partition boards 2 on the same synchronous belt is 13.5mm, and the thickness of the single strip-shaped partition board is 2mm. When the strip-shaped partition plates 2 move to the inner side end of the n-shaped buffer frame 1 under the action of the synchronous pulley assembly 3, the same-layer strip-shaped partition plates 2 on the four synchronous belts are distributed in a rectangular mode to form a horizontal support, and the support is used for supporting and buffering the silicon wafers 5.
The driving device comprises a first motor 41 and a transmission mechanism, wherein a power shaft of the first motor 41 drives synchronous pulleys in the two groups of synchronous pulley assemblies 3 to rotate through the transmission mechanism, and a shell of the first motor 41 is fixed at the top end of a transverse plate of the n-shaped buffer storage frame 1. The transmission mechanism comprises a driving wheel 42, a first linkage wheel 431-fifth linkage wheel 435, a first gear 441, a second gear 442 meshed with the first gear 441, a first belt 451-third belt 453, a fifth rotating shaft 455 and a sixth rotating shaft 456, wherein the driving wheel 42 is fixedly connected with a power shaft of the first motor 41, the first belt 451 is wound on the driving wheel 42 and the first linkage wheel 431, the second belt 452 is wound on the second linkage wheel 432 and the third linkage wheel 433, the third belt 453 is wound on the fourth linkage wheel 434 and the fifth linkage wheel 435, the first linkage wheel 431 and the second linkage wheel 432 are symmetrically fixed on two ends of the first rotating shaft 331, the fifth rotating shaft 455 and the sixth rotating shaft 456 are rotatably installed in bearing seats on the top end of the transverse plate, the first gear 441 and the third linkage wheel 433 are symmetrically fixed on two ends of the fifth rotating shaft 455, the second gear 442 and the fourth linkage wheel 434 are symmetrically fixed on two ends of the sixth rotating shaft 456, and the fifth linkage wheel 435 is fixed on one end of the second rotating shaft 332.
The specific steps of the first motor driving the synchronous belt to move up or down through the transmission mechanism and the synchronous belt wheel assembly include: the first motor 41 drives the driving wheel 42 to rotate, the driving wheel 42 drives the first linkage wheel 431 to rotate through the first belt 451, the first linkage wheel drives the first rotating shaft 331, the first synchronous pulley 321, the second synchronous pulley 322 and the second linkage wheel 432 to synchronously rotate, the second linkage wheel 432 drives the third linkage wheel 433, the fifth rotating shaft 455 and the first gear 441 to rotate through the second belt 452, the first gear 441 is meshed with the second gear 442 to drive the second gear 442, the sixth rotating shaft 456 and the fourth linkage wheel 434 to rotate, and the fourth linkage wheel 434 drives the fifth linkage wheel 435, the second rotating shaft 332, the fifth synchronous pulley 325 and the sixth synchronous pulley 326 to rotate through the third belt 453; the first synchronous pulley 321 drives the fourth synchronous pulley 324 to rotate through the first synchronous belt 311, the second synchronous pulley 322 drives the third synchronous pulley 323 to synchronously rotate through the second synchronous belt 312, the fifth synchronous pulley 325 drives the seventh synchronous pulley 327 to rotate through the third synchronous belt 323, and the sixth synchronous pulley 326 drives the eighth synchronous pulley to synchronously rotate through the fourth synchronous belt 314, so that synchronous transmission of the first synchronous belt 311-the fourth synchronous belt 314 is realized.
One side of the buffer device is provided with a manipulator (not shown in the figure), in this embodiment, the manipulator is a six-axis manipulator, a second controller 8 is arranged in the manipulator, a first controller 7 is in communication connection with the second controller 8, the manipulator is used for grabbing and transferring buffered silicon chips during feeding buffer, and the manipulator is used for placing the silicon chips into a support of the buffer device during discharging buffer.
In this embodiment, the buffer device further includes a first photoelectric sensor 61, a second photoelectric sensor 62, and a first controller, where a sensing end of the first photoelectric sensor 61 faces a side where the strip-shaped partition board 2 is installed, a sensing end of the second photoelectric sensor faces a silicon wafer side end that is transferred to the vertical gap, and the first photoelectric sensor 61, the second photoelectric sensor, a first motor 41 in the driving device, and a second motor 92 in the transmission device 9 that is used for driving the transmission belt are all electrically connected with the first controller 7, see fig. 8. The photoelectric transmitting end and the photoelectric receiving end of the first photoelectric sensor 61 are correspondingly arranged in the middle of the two side ends of the same H-shaped bracket, and the photoelectric transmitting end and the photoelectric receiving end of the second photoelectric sensor are correspondingly arranged on two sides of the conveyor belt in the vertical gap.
The conveyor belt 91 in the transmission device 9 vertically passes through the vertical gap in the middle of the n-shaped buffer frame 1, before the conveyor belt 91 transmits silicon wafers, the driving device drives the transmission mechanism and the synchronous pulley assembly to drive the strip-shaped partition plates to synchronously move upwards or downwards, so that the upper surface of one layer of support is lower than the upper surface of the conveyor belt 91, and the height difference threshold range between the upper surface of the layer of support (i.e. the adjacent support of the conveyor belt) and the upper surface of the conveyor belt 91 is 4 mm-7 mm.
The step of realizing the silicon chip feeding buffer memory by matching the transmission device with the buffer memory device comprises the following steps: a1, a first motor drives a synchronous belt to synchronously move through a transmission mechanism and a synchronous belt wheel assembly, the first synchronous belt and the second synchronous belt rotate anticlockwise, a third synchronous belt and a fourth synchronous belt rotate clockwise, when a strip-shaped partition plate in one layer of support passes through a first photoelectric sensor, the first photoelectric sensor triggers and sends a first trigger signal to a first controller, the current layer support for bearing a silicon wafer is indicated to move to a position lower than the transmission belt, at the moment, the first controller controls the first motor to stop, the synchronous belt stops driving, and the current layer support (namely the adjacent support of the transmission belt) waits for supporting the silicon wafer;
a2, then, the conveyor belt conveys the silicon wafer to a vertical gap of the buffer device, two sides of the silicon wafer are positioned right above adjacent brackets of the conveyor belt, a second photoelectric sensor is arranged at the vertical gap, and at the moment, the second photoelectric sensor triggers and sends a second trigger signal to the first controller;
a3, after the first controller receives a second trigger signal sent by the second photoelectric sensor, the first motor is controlled to start, the first motor drives the current layer of support to continue to move upwards through the transmission mechanism and the synchronous pulley assembly, and the support supports the silicon wafer to ascend, so that automatic feeding and buffering of the silicon wafer are realized.
In the step A1, while the current layer of support waits for supporting the silicon wafer, the external manipulator grabs and transfers the buffered silicon wafer to the next process, and the steps A1-A3 are circulated to realize continuous transmission and buffering of the silicon wafer.
Similarly, when the blanking buffering is needed, the external manipulator is matched with the transmission device and the buffering device, the external manipulator places the silicon wafer on the support, the driving device drives the synchronous belt pulley assembly to drive the strip-shaped partition plate to synchronously move downwards, namely the first synchronous belt and the second synchronous belt rotate clockwise, the third synchronous belt and the fourth synchronous belt rotate anticlockwise, the silicon wafer on the support is placed on the conveying belt, and the conveying belt conveys the silicon wafer to the next process, so that the buffering and continuous blanking are realized.
In the process of feeding buffer storage or discharging buffer storage, when the next silicon wafer is fed into buffer storage or discharged from buffer storage, the driving device drives the synchronous belt pulley assembly to drive the strip-shaped partition plate to continuously move upwards or downwards synchronously.
In order to facilitate silicon wafer buffering, the distance that the synchronous belt drives the strip-shaped partition plate to move up or down once is the distance S, but in the silicon wafer batch automatic production process, the buffer device is in frequent use or long-term use condition, synchronous transmission of the synchronous belt in the buffer device is mainly realized through power shaft rotation of the first motor, the power shaft rotation is usually calculated by an angle, in the embodiment, the angle of each rotation of the power shaft of the first motor is S/pi, the value of pi is approximate, therefore, error accumulation is very easy to occur under the long-term operation condition, when the accumulated error is large, the problem that the support is too high or the support is not lifted in place is very easy to occur, for example, the support lifting distance is slightly higher than the conveyor belt, the front end of the silicon wafer conveyed by the conveyor belt is likely to collide with the side end of the current layer support to fall or be damaged, the support lifting distance is greatly higher than the conveyor belt, the current layer support is likely to support and miss load, so that the buffer quantity is reduced, and grabbing of a subsequent mechanical arm is even affected.
Aiming at the problems that the initial position of a support is wrong and the normal cache of a silicon wafer is influenced due to error accumulation easily generated in the operation process of the cache device, the application also provides a support initial position correction device for the cache device, and the correction device is used for correcting the initial position of the support in the cache device so as to ensure that the height difference between the upper surface of the adjacent support of a conveyor belt and the upper surface of the conveyor belt is within a height difference threshold range.
The correction device includes an optical fiber sensor 10, in this embodiment, the optical fiber sensor 10 is an optical fiber sensor manufactured by OMRON (ohmmeter) company and having a model number E32-ZT14L-2M, the optical fiber sensor 10 is mounted on the top end of one of the H-shaped brackets, the sensing end of the optical fiber sensor 10 faces the side where the strip-shaped partition board is mounted, and the optical fiber sensor 10 is electrically connected with the first controller. The sensing end of the optical fiber sensor comprises an optical fiber transmitting end and an optical fiber receiving end corresponding to the optical fiber transmitting end, and the optical fiber transmitting end and the optical fiber receiving end of the optical fiber sensor are correspondingly arranged on two sides of the top end of the same H-shaped bracket.
In the step A1, when the adjacent support of the conveyor belt waits for supporting the silicon wafer, whether the initial position of the support needs to be corrected is judged by the following steps: the controller controls the synchronous belt to stop moving and simultaneously controls the optical fiber sensor to start, the optical fiber sensor senses the position information of the adjacent strip-shaped partition plates (namely the optical fiber sensor), if the optical fiber sensor does not detect a trigger signal (at this time, the adjacent strip-shaped partition plates shield the optical fiber signal sent by the optical fiber transmitting end of the optical fiber sensor, so that the optical fiber receiving end does not receive the optical fiber signal, namely the optical fiber sensor does not detect the trigger signal), the bracket moves in place, then the controller controls the optical fiber sensor to stop and simultaneously controls the synchronous belt to cooperate with the conveyor belt to support and buffer the silicon wafer, and if the optical fiber sensor detects the trigger signal (at this time, the adjacent strip-shaped partition plates do not shield the optical fiber of the optical fiber sensor), the adjacent bracket of the conveyor belt does not move in place, the initial position of the bracket needs to be corrected, and the specific steps of correction comprise:
s1, a first controller controls a second motor to stop, and a conveyor belt stops conveying silicon wafers;
s2, the first controller controls the first motor to drive the synchronous belt to continuously move along the current direction, and simultaneously controls the optical fiber sensor to monitor the movement condition of the strip-shaped partition plate in real time until the optical fiber sensor does not detect a trigger signal;
and S3, the optical fiber sensor sends an electric signal without detecting a trigger signal to the first controller, the first controller controls the synchronous belt to stop driving, the strip-shaped partition board stops moving, and the position of the support which is adjacent to the conveyor belt and slightly lower than the conveyor belt at present is used as a new initial position, so that the original initial position of the support of the current layer is corrected to be the new initial position. The original initial position of the current layer of bracket is as follows: and when the adjacent support of the conveyor belt is not moved in place, the adjacent support of the conveyor belt is positioned.
Because the distances between the two adjacent strip-shaped clapboards are equal, the original initial positions of the supports in the current layer are determined, so that the original initial positions of the other supports in the synchronous belt are determined, the original initial positions of the supports in the current layer are corrected to be new initial positions, and the initial positions of the other supports in the synchronous belt are synchronously corrected, namely, the original initial positions of the other supports in the synchronous belt and the original initial positions of the supports in the current layer are updated to be new initial positions.
According to the correction method, the bracket can be automatically adjusted to a new initial position which accords with the height difference threshold range through the comprehensive actions of the first controller, the optical fiber sensor, the synchronous pulley assembly and the like, and the initial position is corrected, so that the problem that the normal cache is affected due to the fact that the lifting height of the strip-shaped partition plate is too high or insufficient, and the bracket is missed in load or the silicon chip collides with the strip-shaped partition plate is avoided.
It is to be understood that the foregoing detailed description of the invention is merely illustrative of the invention and is not limited to the embodiments of the invention. It will be understood by those of ordinary skill in the art that the present invention may be modified or substituted for elements thereof to achieve the same technical effects; as long as the use requirement is met, the invention is within the protection scope of the invention.
Claims (8)
1. The silicon wafer buffer device is used for buffering silicon wafers transmitted by a transmission device and comprises n-shaped buffer frames (1), wherein each n-shaped buffer frame (1) comprises a transverse plate and H-shaped brackets vertically fixed at the bottom ends of two sides of the transverse plate, and the silicon wafer buffer device is characterized by further comprising a plurality of strip-shaped partition plates (2), two groups of synchronous pulley assemblies (3) and a driving device for driving the two groups of synchronous pulley assemblies (3) to synchronously drive, the driving device comprises a first motor (41), the two groups of synchronous pulley assemblies (3) are respectively arranged on the two sides of the H-shaped brackets, the vertical center lines of the n-shaped buffer frames (1) are used as shaft mirror images, each synchronous pulley assembly (3) comprises two parallel synchronous belts and two pairs of synchronous pulleys, the two pairs of synchronous pulleys are respectively rotatably arranged at the top ends and the bottom ends of the same H-shaped bracket through rotating shafts, the two synchronous belts are respectively wound on the synchronous pulleys at two sides, and the two synchronous belts are vertically driven along the H-shaped brackets;
the strip-shaped partition plates (2) are uniformly arranged on each synchronous belt at intervals, and one end of each strip-shaped partition plate (2) is vertically fixed with the outer surface of each synchronous belt; when the strip-shaped partition plates (2) move to the inner side end of the n-shaped buffer frame (1) under the action of the synchronous pulley assembly (3), the same-layer strip-shaped partition plates (2) on the four synchronous belts are distributed in a rectangular shape to form a horizontal bracket, and the bracket is used for supporting and buffering silicon wafers (5);
a conveyor belt (91) in a transmission device (9) vertically passes through a vertical gap in the middle of the n-shaped buffer frame (1), before the conveyor belt (91) transmits silicon wafers to the vertical gap, a driving device drives a synchronous belt pulley assembly (3) to drive a strip-shaped partition board (2) to synchronously move upwards or downwards, so that the upper surface of one layer of support is lower than the upper surface of the conveyor belt (91), and the height difference between the upper surface of the support and the upper surface of the conveyor belt is within a height difference threshold range;
the buffer device further comprises a first photoelectric sensor (61), a second photoelectric sensor (62) and a first controller (7), wherein the first photoelectric sensor (61) is installed on one H-shaped support, the sensing end of the first photoelectric sensor (61) faces towards one side where the strip-shaped partition plate (2) is installed, the sensing end of the second photoelectric sensor (62) faces towards the side end of a silicon wafer to be buffered, which is conveyed to a vertical gap, and the first photoelectric sensor (61), the second photoelectric sensor (62) and a first motor (41) in the driving device are electrically connected with the first controller (7).
2. The silicon wafer buffer device according to claim 1, wherein a manipulator is arranged on one side of the buffer device, a second controller (8) is arranged in the manipulator, the first controller (7) is in communication connection with the second controller (8), the manipulator is used for grabbing and transferring the buffered silicon wafer (5) during loading buffer, and the manipulator is used for placing the silicon wafer (5) into a support of the buffer device during unloading buffer.
3. The silicon wafer buffer device according to claim 2, wherein the synchronous pulleys comprise a first synchronous pulley (321) to an eighth synchronous pulley (328), the synchronous belts comprise a first synchronous belt (311) to a fourth synchronous belt (314), the rotating shafts comprise a first rotating shaft (331) and a second rotating shaft (332), the first rotating shaft (331) and the second rotating shaft (332) are respectively rotatably installed in bearing seats at the top ends of two H-shaped brackets, the first synchronous pulley (321) and the second synchronous pulley (322) are symmetrically fixed on two sides of the middle part of the first rotating shaft (331), a fifth synchronous pulley (325) and a sixth synchronous pulley (326) are symmetrically fixed on two sides of the middle part of the second rotating shaft (332), a third synchronous pulley (323) and a fourth synchronous pulley (324) are correspondingly rotatably installed at the bottom end of one H-shaped bracket, a seventh synchronous pulley (327) and an eighth synchronous pulley (328) are correspondingly rotatably installed at the bottom end of the other H-shaped bracket, the first synchronous belt (311) is wound on the first synchronous pulley (321) and the fourth synchronous pulley (324) and the fourth synchronous pulley (322) are wound on the second synchronous pulley (322) and the fifth synchronous pulley (323), the fourth timing belt (314) is wound around the sixth timing pulley (326) and the eighth timing pulley (328).
4. A silicon wafer buffer device according to claim 3, wherein the driving device comprises a transmission mechanism, the power shaft of the first motor (41) drives synchronous pulleys in the two groups of synchronous pulley assemblies (3) to rotate through the transmission mechanism, and the shell of the first motor (41) is fixed at the top end of the transverse plate.
5. The silicon wafer buffer device according to claim 4, wherein the transmission mechanism comprises a driving wheel (42), a first linkage wheel (431) -a fifth linkage wheel (435), a first gear (441), a second gear (442) meshed with the first gear (441), a first belt (451) -a third belt (453), a fifth rotating shaft (455), and a sixth rotating shaft (456), the driving wheel (42) is fixedly connected to a power shaft of the first motor (41), the first belt (451) is wound around the driving wheel (42) and the first linkage wheel (431), the second belt (452) is wound around a second linkage wheel (432) and a third linkage wheel (433), the third belt (453) is wound around a fourth linkage wheel (434) and the fifth linkage wheel (435), the first linkage wheel (431) and the third linkage wheel (432) are symmetrically fixed at two ends of the first rotating shaft (331), the fifth rotating shaft (455) and the sixth rotating shaft (456) are rotatably mounted at top ends of the first plate (434), the second linkage wheel (434) and the fifth rotating shaft (435) are symmetrically fixed at two ends of the fourth rotating shaft (456), the fifth linkage wheel (435) is fixed at one end of the second rotating shaft (332).
6. The silicon wafer buffer device according to claim 5, wherein the distance between two adjacent strip-shaped partition boards (2) on the same synchronous belt is 13 mm-15 mm, and the height difference threshold value range is 4 mm-7 mm.
7. A support initial position correction device for correcting the support initial position of the silicon wafer buffer device according to claim 1 so that the height difference between the upper surface of the adjacent support of the conveyor belt and the upper surface of the conveyor belt is within a height difference threshold range, wherein the correction device comprises an optical fiber sensor (10), the optical fiber sensor (10) is arranged at the top end of one of the H-shaped supports, the sensing end of the optical fiber sensor (10) faces to one side provided with a strip-shaped partition plate, and the optical fiber sensor (10) is electrically connected with a first controller (7); when the height difference between the upper surface of the adjacent support of the conveyor belt and the upper surface of the conveyor belt is within a height difference threshold range, the sensing end of the optical fiber sensor (10) corresponds to the side end of the adjacent support.
8. The method for correcting the initial position of the support, which is applied to the device for correcting the initial position of the support according to claim 7 and is used for realizing the correction of the initial position of the support of the silicon wafer buffer device according to claim 1, is characterized in that when the adjacent support of the conveyor belt waits for supporting the silicon wafer (5), whether the initial position of the support of the layer needs to be corrected is judged by the following judging method: sensing position information of the strip-shaped partition plates (2) in the adjacent brackets through the optical fiber sensor (10), if the optical fiber sensor (10) does not detect a trigger signal, indicating that the bracket at the current layer is moved in place, and if the optical fiber sensor (10) detects the trigger signal, indicating that the bracket at the current layer is not moved in place, and correcting the initial position of the bracket at the current layer, wherein the correcting step comprises the following steps: s1, stopping conveying the silicon wafer by a conveyor belt;
s2, the first controller (7) controls the driving device to drive the synchronous belt to continuously move along the current direction, and meanwhile, the first controller (7) controls the optical fiber sensor to monitor the movement condition of the strip-shaped partition plate in real time until the optical fiber sensor (10) does not detect a trigger signal;
s3, the optical fiber sensor sends an electric signal without detecting a trigger signal to the first controller (7), the first controller (7) controls the synchronous belt to stop driving, the position of the support adjacent to and lower than the conveying belt at present is used as a new initial position, the correction of the original initial position is realized, and the original initial position of the support of the current layer is: and when the adjacent support of the conveyor belt is not moved in place, the adjacent support of the conveyor belt is positioned.
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| CN202310154315.0A CN115872094B (en) | 2023-02-23 | 2023-02-23 | Silicon wafer caching device and method for correcting initial position of support of silicon wafer caching device |
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| CN202310154315.0A CN115872094B (en) | 2023-02-23 | 2023-02-23 | Silicon wafer caching device and method for correcting initial position of support of silicon wafer caching device |
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| CN115872094B true CN115872094B (en) | 2023-05-16 |
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| CN116692211B (en) * | 2023-08-01 | 2023-10-20 | 江苏晶道新能源科技有限公司 | Solar photovoltaic panel transfer device |
| CN116901046B (en) * | 2023-09-13 | 2023-12-08 | 宁波晶昭科技有限公司 | Manipulator for photovoltaic module configuration, photovoltaic module installation method and maintenance method |
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| DE202019101792U1 (en) * | 2018-07-04 | 2019-10-14 | Murata Machinery, Ltd. | opening device |
| CN209747486U (en) * | 2019-04-10 | 2019-12-06 | 苏州晟成光伏设备有限公司 | Battery string buffer memory device |
| CN110239877A (en) * | 2019-04-30 | 2019-09-17 | 罗博特科智能科技股份有限公司 | Silicon wafer caches machine |
| CN210122328U (en) * | 2019-04-30 | 2020-03-03 | 罗博特科智能科技南通有限公司 | Silicon wafer caching machine |
| CN217050480U (en) * | 2021-12-30 | 2022-07-26 | 江苏立讯机器人有限公司 | Support plate caching and releasing equipment |
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