CN115870627A - Laser marking equipment for wafer processing - Google Patents
Laser marking equipment for wafer processing Download PDFInfo
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- CN115870627A CN115870627A CN202211578325.9A CN202211578325A CN115870627A CN 115870627 A CN115870627 A CN 115870627A CN 202211578325 A CN202211578325 A CN 202211578325A CN 115870627 A CN115870627 A CN 115870627A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The invention relates to a laser marking device for wafer processing, which comprises a processing frame, wherein a feeding mechanism is arranged at the left end of the processing frame, a laser marking machine body is arranged on the inner wall of the front end of the processing frame, a collecting mechanism is arranged at the right end of the processing frame, and a transmission mechanism is arranged on the processing frame. The invention has the problems that the position of a wafer to be marked is required to be adjusted in the existing wafer laser marking operation process, if the uniformity of the marking position of the wafer cannot be ensured by adopting the mode of manually adjusting the wafer position, the problem that the marking positions on different wafers are different easily occurs, and the subsequent use of the wafer is influenced.
Description
Technical Field
The invention relates to the technical field of laser marking equipment, in particular to laser marking equipment for wafer processing.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, in the semiconductor industry, especially in the wafer manufacturing process, laser marking plays a crucial role all the time, the laser marking can be read all the time, and the same marking position on the wafer is one of the methods for ensuring that the laser marking can be read quickly and effectively in the operation;
however, there is the wafer that needs to beat the mark operation to preparing to carry out among the current wafer laser marking operation process and carries out the position adjustment, and if the uniformity of the mark position is beaten to the unable assurance wafer of mode that adopts the wafer position of artifical adjustment, the problem that beats the mark difference in position on the different wafers appears easily, influence the follow-up use of wafer, in addition, traditional wafer processing equipment is many to place the wafer earlier and beats the mark position, beat the mark operation and accomplish the wafer that beats the mark operation and take out through removing the mark position after accomplishing, complex operation is complicated, the mark operation of the unable mark operation of carrying out the continuity, influence the wafer and beat the efficiency scheduling problem of mark operation.
Disclosure of Invention
Technical problem to be solved
The invention aims to provide a laser marking device for wafer processing, which can solve the problems in the background technology.
(II) technical scheme
In order to achieve the purpose, the invention adopts the following technical scheme: a laser marking device for wafer processing comprises a processing frame, wherein a feeding mechanism is arranged at the left end of the processing frame, a laser marking machine body is arranged on the inner wall of the front end of the processing frame, a collecting mechanism is arranged at the right end of the processing frame, the processing frame is provided with a transmission mechanism, and the feeding mechanism and the collecting mechanism are identical in structure;
the feeding mechanism comprises a placing frame arranged on the processing frame, an operation groove is formed in the processing frame, a supporting spring rod is arranged on the inner wall of the lower end of the placing frame, a supporting placing plate is arranged on the supporting spring rod, a storing box is placed in the placing frame, partition plates are uniformly arranged in the storing box, and a control branch chain for controlling the storing box to perform height adjustment on the placing frame is arranged on the outer wall of the placing frame;
the transmission mechanism comprises a driving motor arranged on the inner wall of the lower end of the processing frame, a circular plate is arranged on an output shaft of the driving motor, an annular mounting plate is arranged on the circular plate, fetching and conveying locking branched chains are uniformly arranged on the annular mounting plate, and a working assembly is arranged in the processing frame;
get and send locking branch chain including seting up the standing groove has been seted up on the annular mounting panel, the removal slot has been seted up on the annular mounting panel, set up on the annular mounting panel with the removal hole of standing groove intercommunication, it is provided with the removal inserted bar to remove downthehole slip, it is provided with the circular arc frame to slide in the standing groove, the lower extreme of circular arc frame is provided with the removal picture peg, it slides and sets up to remove the picture peg in the removal slot, remove the inserted bar with the circular arc frame links to each other, install on the other end of removal inserted bar and get and send the riser, get send the riser with be provided with between the inner wall of annular mounting panel and get and send the spring beam, be located the standing groove both sides the mounting groove has been seted up to the symmetry on the annular mounting panel, be provided with locking Assembly in the mounting groove.
Preferably, the partition board is uniformly provided with insertion grooves.
Preferably, the control branch chain includes to be installed through the motor cabinet place the double-shaft motor on the frame lower extreme outer wall, be provided with the rotary rod through the shaft coupling symmetry on the double-shaft motor, the rotary rod passes through the bearing and installs on the control riser, just be provided with the worm on the rotary rod, the meshing has the worm wheel on the worm, the worm wheel is installed on the operation subassembly.
Preferably, the operation assembly comprises operation supports which are arranged on the side wall of the placing frame in an up-and-down symmetrical mode, operation shafts are mounted between the inner walls of the operation supports through bearings, connecting belts are arranged between the operation shafts, worm wheels are mounted on the operation shafts located on the lower side of the placing frame, operation grooves are formed in the placing frame, butt joint grooves are evenly formed in the outer wall of the storing box, inserting holes are evenly formed in the connecting belts, inserting rods are arranged in the inserting holes in a sliding mode, operation springs are arranged between the inserting rods and the connecting belts, guide frames are arranged on the outer wall of the placing frame, and the upper end and the lower end of each guide frame are of an inclined structure.
Preferably, the work assembly is including setting up fixed diaphragm on the processing frame inner wall, the shifting chute has been seted up on the fixed diaphragm, be fixed with the cylinder of fetching and delivering on the fixed diaphragm, it carries out the frame to install the fetching and delivering on the cylinder of fetching and delivering, it is located to fetch and deliver carry out the frame feed mechanism with between the collection mechanism.
Preferably, the locking assembly comprises mounting columns which are symmetrically arranged in the mounting groove through pin shafts, locking rods are mounted on the mounting columns through bearings, locking springs are arranged between the inner walls of the mounting groove and face towards the end faces of the placing groove, locking rubber blocks are arranged on the annular mounting plates, threading grooves are formed in the annular mounting plates, traction pull ropes are arranged in the threading grooves, locking pull ropes are connected to the locking rods and connected to the traction pull ropes, the traction pull ropes are connected to the locking blocks, the locking blocks are arranged on the locking movable insertion rods in a sliding mode, reset springs are arranged between the locking blocks and the annular mounting plates, guide slide rods are arranged at the lower ends of the locking blocks, displacement grooves are formed in the circular plates, the guide slide rods penetrate through the displacement grooves in a sliding mode, the lower ends of the guide slide rods are arranged in limiting sliding grooves in the sliding mode, and the limiting sliding grooves are fixed to the processing frame.
(III) advantageous effects
1. The invention solves the problems that the position of a wafer to be marked is required to be adjusted in the existing wafer laser marking operation process, and if the uniformity of the marking positions of the wafer cannot be ensured by adopting a mode of manually adjusting the wafer positions, the problem that the marking positions on different wafers are different easily occurs, and the subsequent use of the wafer is influenced.
2. The feeding mechanism and the collecting mechanism designed by the invention are matched with each other, so that the one-by-one feeding and collecting operation of the wafers can be automatically completed in the wafer marking operation, and the feeding and discharging of the wafers can be continuously and automatically completed in the marking operation.
3. The conveying mechanism designed in the invention can automatically take and deliver the wafer in operation, is simple and convenient to operate, improves the laser marking efficiency of the wafer, can adjust the position of the wafer in marking operation, and can ensure the uniformity of the marking position of the wafer.
Drawings
The invention is further illustrated by the following examples in conjunction with the drawings.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a longitudinal cross-sectional view of the feed mechanism of the present invention;
FIG. 3 is a transverse cross-sectional view of the loading mechanism of the present invention;
FIG. 4 is an enlarged view of the invention taken from the line A of FIG. 1;
FIG. 5 is a schematic view of the structure between the processing frame and the transfer mechanism of the present invention;
FIG. 6 is a first cross-sectional view of the invention of FIG. 5;
FIG. 7 is a second cross-sectional view of the invention of FIG. 5;
FIG. 8 is an enlarged view of the invention taken from the line B of FIG. 7;
FIG. 9 is an enlarged view of the invention taken along line C of FIG. 7;
fig. 10 is a schematic structural view between the processing frame and the limiting chute of the present invention.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
As shown in fig. 1 to 10, a laser marking device for wafer processing includes a processing frame 1, a feeding mechanism 2 is disposed at a left end of the processing frame 1, a laser marking machine body is disposed at an inner wall of a front end of the processing frame 1, a collecting mechanism 3 is disposed at a right end of the processing frame 1, the processing frame 1 is provided with a transmission mechanism 4, and the feeding mechanism 2 and the collecting mechanism 3 have the same structure;
through adopting above-mentioned technical scheme to take out the wafer of placing in feed mechanism 2 through transmission mechanism 4 at concrete operation in-process, and the wafer that drives to take out rotates the position department of adjusting to laser marking machine body work, transmission mechanism 4 carries out position adjustment and carries out the centre gripping location to the wafer of taking out in step at this in-process, ensure in the position department of laser marking machine body work, the wafer of taking out is in the state of adjustment back centre gripping location, then laser marking machine body work is executed marking operation to the wafer, mark operation is accomplished the back, along with transmission mechanism 4's continuation motion unblock to the wafer, and send the wafer through marking processing into collection mechanism in 3 through transmission mechanism 4, whole mark operation in-process of beating is through transmission mechanism 4, feed mechanism 2 and collect the cooperation of mutually between the mechanism 3 and carry out automatic continuous marking operation to the wafer.
The feeding mechanism 2 comprises a placing frame 21 arranged on the processing frame 1, an operation groove is formed in the processing frame 1, a supporting spring rod 22 is arranged on the inner wall of the lower end of the placing frame 21, a supporting placing plate 23 is arranged on the supporting spring rod 22, a storing box 24 is placed in the placing frame 21, partition plates 25 are uniformly arranged in the storing box 24, and a control branched chain 26 for controlling the storing box 24 to perform height adjustment on the placing frame 21 is arranged on the outer wall of the placing frame 21; the partition plate 25 is uniformly provided with insertion grooves.
Through adopting above-mentioned technical scheme, will prepare to beat orderly the placing of wafer of beating mark processing operation in the operation and store the baffle 25 in the box 24 to place the box 24 that stores of wafer insert place frame 21 in, through the height that control branch 26 adjustment stored box 24, guarantee to store every wafer that places in the box 24 all can adjust to the position department with operation groove cooperation operation.
Control branch 26 includes to be installed through the motor cabinet place double-shaft motor 261 on the outer wall of frame 21 lower extreme, double-shaft motor 261 is last to be provided with rotary rod 262 through the shaft coupling symmetry, rotary rod 262 passes through the bearing and installs on the control riser 263, just be provided with the worm on the rotary rod 262, the meshing has the worm wheel on the worm, the worm wheel is installed on operation subassembly 265.
The operation assembly 265 includes operation brackets 2651 symmetrically disposed on the side walls of the placement frame 21, operation shafts 2652 are mounted between the inner walls of the operation brackets 2651 through bearings, connection belts 2653 are disposed between the operation shafts 2652, worm gears are mounted on the operation shafts 2652 on the lower side of the placement frame 21, an operation groove is formed in the placement frame 21, butt-joint grooves are uniformly formed in the outer wall of the storage box 24, plug-in holes are uniformly formed in the connection belts 2653, plug-in rods 2654 are slidably disposed in the plug-in holes, operation springs are disposed between the plug-in rods 2654 and the connection belts 2653, a guide frame 2655 is disposed on the outer wall of the placement frame 21, and the upper end and the lower end of the guide frame 2655 are of an inclined structure.
By adopting the technical scheme, the double-shaft motor 261 is started in the specific operation process to drive the worm on the rotating rod 262 to rotate, the worm is matched with the worm wheel to drive the operation shaft 2652 to rotate in the rotating process, the operation shaft 2652 drives the connecting belt 2653 to rotate in the rotating process, the connecting belt 2653 drives the inserting rod 2654 to synchronously adjust in the rotating process, the inserting rod 2654 is inserted into the butt joint groove on the storage box 24 through the matching between the inserting rod 2654 and the guide frame 2655 in the process of moving along with the connecting belt 2653, the storage box 24 is controlled to carry out height adjustment through the reciprocating circular motion of the connecting belt 2653, therefore, wafers placed on different partition plates 25 can be controlled to move to the position corresponding to the operation groove, and the wafer to be marked can be smoothly taken out from the storage box 24 by the transmission mechanism 4.
The transmission mechanism 4 comprises a driving motor 41 arranged on the inner wall of the lower end of the processing frame 1, a circular plate is arranged on an output shaft of the driving motor 41, an annular mounting plate 42 is arranged on the circular plate, a fetching and delivering locking branched chain 43 is uniformly arranged on the annular mounting plate 42, and a working assembly 44 is arranged in the processing frame 1;
get and send locking branch 43 including seting up the standing groove has been seted up on the annular mounting panel 42, the removal slot has been seted up on the annular mounting panel 42, set up on the annular mounting panel 42 with the removal hole of standing groove intercommunication, it is provided with removal inserted bar 431 to remove downthehole slip, it is provided with circular arc frame 432 to slide in the standing groove, circular arc frame 432's lower extreme is provided with removal inserted bar 433, it slides and sets up to remove inserted bar 433 in the removal slot, remove inserted bar 431 with circular arc frame 432 links to each other, it gets and sends riser 434 to install on the other end of removal inserted bar 431, get send riser 434 with be provided with between the inner wall of annular mounting panel 42 and get and send spring beam 435, be located the standing groove both sides the symmetry mounting groove has been seted up on the annular mounting panel 42, be provided with locking Assembly 436 in the mounting groove.
The working assembly 44 includes a fixed horizontal plate 441 disposed on the inner wall of the processing frame 1, a moving slot is disposed on the fixed horizontal plate 441, a pick-and-place cylinder 442 is fixed on the fixed horizontal plate 441, a pick-and-place actuation rack 443 is mounted on the pick-and-place cylinder 442, and the pick-and-place actuation rack 443 is located between the feeding mechanism 2 and the collecting mechanism 3.
In the specific operation by adopting the above technical solution, firstly, the driving motor 41 is started to control the annular mounting plate 42 on the circular plate to rotate, the rotating annular mounting plate 42 drives the picking and delivering locking branched chain 43 to move to the position where the picking and delivering locking branched chain can be matched with the operation slot, at this time, the picking and delivering cylinder 442 is started to control the picking and delivering execution rack 443 to move towards the direction of the feeding mechanism 2, the picking and delivering vertical plate 434 is extruded by the picking and delivering execution rack 443, the extruded picking and delivering vertical plate 434 drives the arc rack 432 and the movable inserting plate 433 to move towards the operation slot by moving the inserting rod 431, in this process, the movable inserting plate 433 penetrates through the operation slot to be inserted into the inserting slot of the partition plate 25, at this time, the double-shaft motor 261 drives the rotating rod 262 to rotate reversely to drive the storage box 24 to perform fine adjustment towards the downward position, in this process, the lower end face of the movable inserting plate 433 is attached to the picking and delivering cylinder 442 in this state, the picking and delivering execution rack 443 is reset by moving the movable inserting plate 435 to reset step by the action of the picking and delivering spring rod, thereby driving the placing slot to move the inserting plate 433 to move slightly to the upper end of the high wafer to be placed in the high wafer slot.
The locking assembly 436 comprises mounting columns symmetrically arranged in the mounting groove through pin shafts, a locking rod 4361 is mounted on each mounting column through a bearing, a locking spring 4362 is arranged between each locking rod 4361 and the inner wall of the mounting groove, the locking rod 4361 faces the end face of the placement groove and is provided with a locking rubber block, a threading groove is formed in the annular mounting plate 42, a traction stay rope 4363 is arranged in the threading groove, the locking rod 4361 is connected with a locking stay rope 4364, the locking stay rope 4364 is connected to the traction stay rope 4363, the traction stay rope 4363 is connected to a locking block 4365, the locking block 4365 is slidably arranged on the locking movable insertion rod 431, a return spring 4366 is arranged between the locking block 4365 and the annular mounting plate 42, a guide slide rod is arranged at the lower end of the locking block 4365, a displacement groove is formed in the circular plate, the guide slide rod 4367 slidably penetrates through the displacement groove, the lower end of the guide slide rod 4367 is slidably arranged in a limiting slide groove 4368, and the limiting slide groove 4368 is fixed on the processing frame 1.
By adopting the technical scheme, in the specific operation process, the circular plate is controlled to rotate through the driving motor 41 so as to drive the taking and feeding locking branched chain 43 with the wafer to rotate, the guide sliding rod 4367 synchronously moves along the circular plate in the circumferential direction and simultaneously adjusts along the track of the limit sliding groove 4368, the structure of the limit sliding groove 4368 comprises a semicircular end and an extended end, the position of the vertex of the extended end of the limit sliding groove 4368 corresponds to the position of the laser marking machine body for working and marking, when the guide sliding rod 4367 moves from the semicircular end of the limit sliding groove 4368 to the extended end, the guide sliding rod 4367 drives the locking block 4365 to move towards the direction far away from the placing groove, in the process, the locking block 4365 pulls the pull rope 4363 to synchronously move, the pull rope 4363 drives the locking rod 4361 to rotate and adjust through the locking rope 4364, when the four locking rods 4361 synchronously rotate, the locking rubbers arranged on the surfaces of the four locking rods lock the locking rods abut against the 4367 of the positioning groove, and when the four locking rods 4367 synchronously rotate, the four locking rods 4367 are positioned at the positions of the locking ends of the locking groove in the four locking groove, so that the locking rods can be positioned at the four locking groove center of the wafer in the four points of the wafer can be positioned in the central position of the wafer, and the wafer can be ensured in the wafer, and the central position of the wafer, and the wafer can be positioned in the wafer, and the wafer can be positioned at the four locking groove, and the central positions of the locking rod 4368;
after the wafer marking operation is completed, the driving motor 41 controls the circular plate to continue rotating, the guide sliding rod 4367 moves towards the semicircular end along the extending end of the limiting sliding groove 4368, in the process, the four locking rods 4361 are in a gradual resetting state, when the marked wafer moves to the position corresponding to the operation groove on the collecting mechanism 3, the four locking rods 4361 are in a complete resetting state, the double-shaft motor 261 is synchronously started to drive the rotating rod 262 to rotate and adjust the position corresponding to the partition plate 25, the taking and delivering cylinder 442 controls the taking and delivering execution frame 443 to move towards the direction of the collecting mechanism 3, so that the movable inserting plate 433 can penetrate through the operation groove to be inserted into the inserting groove of the partition plate 25, and drive the wafer placed on the movable inserting plate 433 to move to the position above the partition plate 25, then the double-shaft motor 261 drives the rotating rod 262 to move and adjust the position of the partition plate 25, so that the partition plate 25 can support the marked wafer, then the marked wafer 442 resets and completes the collection of the marked wafer, and the laser marking operation can be circularly and continuously completed by adopting the steps.
The working steps of the invention are as follows;
a first step of placing the cassettes 24 to be marked one by one on the partition plates 25 in the cassette 24, and inserting the cassette 24 on which the wafers are placed into the placing frame 21 in the feed mechanism 2 while inserting the empty cassette 24 into the placing frame 21 in the collecting mechanism 3;
secondly, taking out the wafer to be marked on the partition plate 25 in operation through the transmission mechanism 4, and driving the taken-out wafer to move clockwise;
thirdly, adjusting the position of the wafer and positioning and locking the wafer in the process of taking out the wafer and driving the wafer to move, and then marking the upper end surface of the wafer through the laser marking machine body;
and fourthly, driving the wafer after marking to rotate to the position corresponding to the collecting mechanism 3 through the transmission mechanism 4, completing unlocking the wafer in the process, pushing the wafer into a storage box in the collecting mechanism 3, and completing wafer marking operation.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A laser marking device for wafer processing comprises a processing frame (1), and is characterized in that a feeding mechanism (2) is arranged at the left end of the processing frame (1), a laser marking machine body is arranged on the inner wall of the front end of the processing frame (1), a collecting mechanism (3) is arranged at the right end of the processing frame (1), a transmission mechanism (4) is arranged on the processing frame (1), and the feeding mechanism (2) and the collecting mechanism (3) are identical in structure;
the feeding mechanism (2) comprises a placing frame (21) arranged on the processing frame (1), an operation groove is formed in the processing frame (1), a supporting spring rod (22) is arranged on the inner wall of the lower end of the placing frame (21), a supporting placing plate (23) is arranged on the supporting spring rod (22), a storing box (24) is placed in the placing frame (21), partition plates (25) are uniformly arranged in the storing box (24), and a control branch chain (26) for controlling the storing box (24) to perform height adjustment on the placing frame (21) is arranged on the outer wall of the placing frame (21);
the transmission mechanism (4) comprises a driving motor (41) arranged on the inner wall of the lower end of the processing frame (1), a circular plate is arranged on an output shaft of the driving motor (41), an annular mounting plate (42) is arranged on the circular plate, fetching and conveying locking branched chains (43) are uniformly arranged on the annular mounting plate (42), and a working assembly (44) is arranged in the processing frame (1);
get and send locking branch chain (43) including seting up the standing groove has been seted up on annular mounting panel (42), the removal slot has been seted up on annular mounting panel (42), seted up on annular mounting panel (42) with the removal hole of standing groove intercommunication, it is provided with removal inserted bar (431) to remove downthehole slip, it is provided with circular arc frame (432) to slide in the standing groove, the lower extreme of circular arc frame (432) is provided with removal picture peg (433), it slides and sets up to remove picture peg (433) in the removal slot, remove inserted bar (431) with circular arc frame (432) link to each other, install on the other end of removal inserted bar (431) and get and send riser (434), get send riser (434) with be provided with between the inner wall of annular mounting panel (42) and get and send spring beam (435), be located the standing groove both sides annular mounting panel (42) are gone up the symmetry and have seted up the mounting groove, be provided with locking Assembly (436) in the mounting groove.
2. The laser marking device for wafer processing as claimed in claim 1, wherein the spacer (25) has a uniform insertion slot.
3. The laser marking device for wafer processing as claimed in claim 2, wherein the control branch chain (26) comprises a double-shaft motor (261) mounted on the outer wall of the lower end of the placing frame (21) through a motor base, a rotating rod (262) is symmetrically arranged on the double-shaft motor (261) through a shaft coupling, the rotating rod (262) is mounted on the control vertical plate (263) through a bearing, a worm is arranged on the rotating rod (262), a worm wheel is meshed on the worm, and the worm wheel is mounted on the working assembly (265).
4. The laser marking device as claimed in claim 3, wherein the working assembly (265) includes working brackets (2651) symmetrically disposed on the side walls of the placing frame (21), working shafts (2652) are mounted between the inner walls of the working brackets (2651) through bearings, connecting bands (2653) are disposed between the working shafts (2652), worm gears are mounted on the working shafts (2652) located on the lower side of the placing frame (21), working grooves are formed in the placing frame (21), butt-joint grooves are uniformly formed in the outer walls of the storing boxes (24), plug-in holes are uniformly formed in the connecting bands (2653), plug-in rods (2654) are slidably disposed in the plug-in holes, working springs are disposed between the plug-in rods (2654) and the connecting bands (2653), guide frames (2655) are disposed on the outer walls of the placing frame (21), and the upper and lower ends of the guide frames (2655) are in an inclined structure.
5. The laser marking device as claimed in claim 1, wherein the working assembly (44) includes a fixed cross plate (441) disposed on an inner wall of the processing frame (1), the fixed cross plate (441) has a moving slot, a pick-and-place cylinder (442) is fixed on the fixed cross plate (441), a pick-and-place actuating frame (443) is mounted on the pick-and-place cylinder (442), and the pick-and-place actuating frame (443) is located between the feeding mechanism (2) and the collecting mechanism (3).
6. The laser marking device for wafer processing as claimed in claim 5, wherein the locking assembly (436) includes a mounting post symmetrically disposed in the mounting groove through a pin, a locking rod (4361) is mounted on the mounting post through a bearing, a locking spring (4362) is disposed between the locking rod (4361) and an inner wall of the mounting groove, a locking rubber block is disposed on an end surface of the locking rod (4361) facing the mounting groove, a threading groove is disposed on the annular mounting plate (42), a pulling rope (4363) is disposed in the threading groove, a locking pulling rope (4364) is connected to the locking rod (4361), the locking pulling rope (4364) is connected to the pulling rope (4363), the pulling rope (4363) is connected to the locking block (4365), the locking block (4365) is slidably disposed on the locking moving insertion rod (431), a return spring (4366) is disposed between the locking block (4365) and the annular mounting plate (42), a guiding groove is disposed at a lower end of the locking block (4365), a displacement guiding sliding rod (4368) is disposed on the annular mounting plate, and a sliding limiting sliding groove (4368) is disposed on the sliding limiting groove (4368).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211578325.9A CN115870627A (en) | 2022-12-09 | 2022-12-09 | Laser marking equipment for wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211578325.9A CN115870627A (en) | 2022-12-09 | 2022-12-09 | Laser marking equipment for wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115870627A true CN115870627A (en) | 2023-03-31 |
Family
ID=85766762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211578325.9A Pending CN115870627A (en) | 2022-12-09 | 2022-12-09 | Laser marking equipment for wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115870627A (en) |
-
2022
- 2022-12-09 CN CN202211578325.9A patent/CN115870627A/en active Pending
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