CN115867408A - 用于借助激光束加工工件的激光加工装置 - Google Patents
用于借助激光束加工工件的激光加工装置 Download PDFInfo
- Publication number
- CN115867408A CN115867408A CN202180048525.0A CN202180048525A CN115867408A CN 115867408 A CN115867408 A CN 115867408A CN 202180048525 A CN202180048525 A CN 202180048525A CN 115867408 A CN115867408 A CN 115867408A
- Authority
- CN
- China
- Prior art keywords
- optical element
- laser
- optical
- laser processing
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
- B23K26/128—Laser beam path enclosures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0064—Anti-reflection devices, e.g. optical isolaters
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102020112403.1A DE102020112403B4 (de) | 2020-05-07 | 2020-05-07 | Laserbearbeitungsvorrichtung zum Bearbeiten von Werkstücken mittels eines Laserstrahls |
DE102020112403.1 | 2020-05-07 | ||
PCT/EP2021/061946 WO2021224367A1 (de) | 2020-05-07 | 2021-05-06 | Laserbearbeitungsvorrichtung zum bearbeiten von werkstücken mittels eines laserstrahls |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115867408A true CN115867408A (zh) | 2023-03-28 |
Family
ID=75914510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180048525.0A Pending CN115867408A (zh) | 2020-05-07 | 2021-05-06 | 用于借助激光束加工工件的激光加工装置 |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN115867408A (de) |
DE (1) | DE102020112403B4 (de) |
WO (1) | WO2021224367A1 (de) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8187481B1 (en) | 2005-05-05 | 2012-05-29 | Coho Holdings, Llc | Random texture anti-reflection optical surface treatment |
FR2935916B1 (fr) | 2008-09-12 | 2011-08-26 | Air Liquide | Procede et installation de coupage laser avec modification du facteur de qualite du faisceau laser |
JP2010281876A (ja) | 2009-06-02 | 2010-12-16 | Canon Inc | 光学素子及びそれを有する光学系 |
JP2011048081A (ja) * | 2009-08-26 | 2011-03-10 | Sony Corp | 光学素子、反射低減加工装置及び反射低減加工方法 |
DE102009046485A1 (de) | 2009-11-06 | 2011-05-12 | Robert Bosch Gmbh | Verfahren und Vorrichtung zum Laserschweißen |
EP3045258B1 (de) | 2014-03-13 | 2018-09-12 | Panasonic Intellectual Property Management Co., Ltd. | Laserbearbeitungskopf |
DE102016211811B4 (de) | 2016-06-30 | 2022-02-24 | Trumpf Laser Gmbh | F-Theta-Objektiv und Scannervorrichtung damit |
JP2018003109A (ja) * | 2016-07-05 | 2018-01-11 | セイコーエプソン株式会社 | 三次元造形装置 |
DE102017214249A1 (de) * | 2017-08-16 | 2019-02-21 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laserbearbeitungskopf mit einem optischen Element zum Herausfiltern von UV-Prozessstrahlung und zugehöriges Laserbearbeitungsverfahren |
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2020
- 2020-05-07 DE DE102020112403.1A patent/DE102020112403B4/de active Active
-
2021
- 2021-05-06 WO PCT/EP2021/061946 patent/WO2021224367A1/de active Application Filing
- 2021-05-06 CN CN202180048525.0A patent/CN115867408A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
DE102020112403A1 (de) | 2021-11-11 |
DE102020112403B4 (de) | 2022-03-31 |
WO2021224367A1 (de) | 2021-11-11 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |