CN115863218A - Device for monitoring wafer position and final polishing equipment - Google Patents
Device for monitoring wafer position and final polishing equipment Download PDFInfo
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- CN115863218A CN115863218A CN202211564251.3A CN202211564251A CN115863218A CN 115863218 A CN115863218 A CN 115863218A CN 202211564251 A CN202211564251 A CN 202211564251A CN 115863218 A CN115863218 A CN 115863218A
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The embodiment of the invention discloses a device for monitoring the position of a wafer and final polishing equipment; the device comprises: the storage module is provided with an opening and comprises a plurality of layers of support piece groups which are arranged at equal intervals and formed by strip-shaped support pieces which are vertically arranged in two rows; wherein each support group comprises two supports in the same horizontal plane, and the wafer is supported by abutting against the two supports in different rows; the monitoring modules are uniformly arranged on the periphery of the storage module along the radial direction of the storage module and used for monitoring whether the position of the wafer in the storage module is abnormal or not; the monitoring modules can transmit laser signals and receive the laser signals transmitted by the adjacent monitoring modules, and when the laser signals received by the monitoring modules are inconsistent, the wafer position is judged to be abnormal.
Description
Technical Field
The embodiment of the invention relates to the technical field of semiconductor manufacturing, in particular to a device for monitoring the position of a wafer and final polishing equipment.
Background
Semiconductor manufacturing processes are performed by semiconductor equipment, which typically includes various chambers, such as pre-load chambers, transfer chambers, process chambers, arranged in clusters, in-line, or a combination of clusters and in-line, to process a single wafer or a batch of wafers. It will be appreciated that each chamber typically has a wafer stage for holding and holding a wafer, and that the wafer to be processed is typically contained within a wafer cassette. When a certain process, such as a final polishing process, is performed, the wafer cassette is usually placed on a loading table of a final polishing apparatus, and then a robot arm takes out the wafer from the wafer cassette and transfers it to the final polishing process. However, in the process of clamping the wafer from the wafer box by the mechanical arm, if the position of the wafer in the wafer box is abnormal, the risk that the wafer drops or even fragments easily occurs in the process of clamping the wafer by the mechanical arm extending into the wafer box, and at present, no simple and effective means is provided for detecting whether the position of the wafer is abnormal.
Disclosure of Invention
In view of the above, embodiments of the present invention are directed to an apparatus for monitoring a position of a wafer and a final polishing apparatus; the wafer of abnormal position can in time be detected, the risk that the semiconductor equipment goes down is avoided, the production efficiency is improved, and the production cost is reduced.
The technical scheme of the embodiment of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides an apparatus for monitoring a wafer position, where the apparatus includes:
the storage module is provided with an opening and comprises a plurality of layers of support piece groups which are arranged at equal intervals and formed by strip-shaped support pieces which are vertically arranged in two rows; wherein each support group comprises two supports in the same horizontal plane, and the wafer is supported by abutting against the two supports in different rows;
the monitoring modules are uniformly distributed on the periphery of the storage module along the radial direction of the storage module and used for monitoring whether the positions of the wafers in the storage module are abnormal or not;
the monitoring modules can emit laser signals and receive the laser signals emitted by the adjacent monitoring modules, and when the laser signals received by the monitoring modules are inconsistent, the wafer position is judged to be abnormal.
In a second aspect, embodiments of the present invention provide a final polishing apparatus, comprising:
a polishing head;
an adsorption pad;
a polishing disk;
a polishing pad attached to the polishing disc;
apparatus for monitoring the position of a wafer as claimed in any one of claims 1 to 7;
a robot arm for gripping the wafer in the storage module of the apparatus for monitoring the position of the wafer according to any one of claims 1 to 7 for transferring to the adsorption pad.
The embodiment of the invention provides a device for monitoring the position of a wafer and final polishing equipment; the position of the wafer with the abnormal position can be improved before the wafer is transferred by monitoring the wafer with the abnormal position in real time, so that the risk of equipment downtime is greatly reduced, and the wafer is prevented from falling or even being broken.
Drawings
FIG. 1 is a schematic view of a final polishing apparatus according to a conventional embodiment;
FIG. 2 is a schematic diagram illustrating a wafer misplacement method in a wafer cassette according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an apparatus for monitoring a wafer position according to an embodiment of the present invention;
FIG. 4 is a schematic top view of an apparatus for monitoring wafer position according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a monitoring module according to an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating another exemplary apparatus for monitoring wafer position according to the present invention;
FIG. 7 is a schematic diagram illustrating a wafer monitoring process performed by the monitoring module according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a final polishing apparatus according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
In semiconductor manufacturing, wafers are generally transferred between chambers by a robot, or wafers in a wafer cassette are picked up and placed at a predetermined processing position by a robot for a certain process. By way of example of a final Polishing process, see fig. 1, which shows a composition of a Final Polishing (FP) device 100 in a conventional technical solution, the FP device 100 specifically includes: a polishing head 101, an adsorption pad 102, a polishing liquid supply line 103, a polishing disk 104, a polishing pad 105 attached to the polishing disk 104, a first drive shaft 106, and a second drive shaft 107. When the FP apparatus 100 is used to perform final polishing on a wafer W, under the condition that the adsorption pad 102 adsorbs the back surface of the wafer W, a certain supply flow rate of polishing liquid is supplied to the polishing pad 105 through the polishing liquid supply pipeline 103, after the polishing liquid is supplied onto the polishing pad 105 and contacts with the wafer W, the polishing disk 104 and the polishing head 101 are respectively driven by the first driving shaft 106 and the second driving shaft 107 to perform relative rotation motion, and the polishing head 101 applies pressure to the wafer W to complete the final polishing operation of the silicon wafer W. In the final polishing process, the wafer W is generally finally polished by clamping the wafer W placed in the wafer cassette 110 at the loading end 109 by the robot 108 and adsorbing the wafer W onto the polishing pad 102.
However, in the last process of the final polishing process, when the wafers W are loaded in the wafer cassette 110, there may be a phenomenon as shown in fig. 2 in which the wafers W are not positioned parallel to each other on the corresponding support member groups in the wafer cassette 110, but are erroneously positioned in fig. 2. When the wafer W is placed incorrectly, the robot arm 108 may cause the wafer W to fall and even break during the process of inserting and clamping the wafer W from the front of the wafer cassette 110.
Based on the above description, referring to fig. 3 and fig. 4, the components of an apparatus 300 for monitoring the wafer position according to an embodiment of the present invention are shown, where the apparatus 300 includes:
the storage module 301 with the opening is characterized in that the storage module 301 comprises a plurality of layers of support piece groups 3011 arranged at equal intervals and composed of strip-shaped support pieces arranged in two rows vertically; wherein fig. 3 exemplarily shows 9 support group 3011, each support group 3011 comprising two supports 3011-a and 3011-B in the same horizontal plane, the wafer W being supported by abutting two supports 3011-a and 3011-B of different columns; in more detail, the wafer W may be supported by two supports 3011-a and 3011-B (e.g., two supports 3011-A5 and 3011-B5 in the group of supports 3011) in the same horizontal plane, or correctly supported, such as the 3 rd wafer W in the middle of the storage module 301 in fig. 3 (from bottom to top), or by two supports 3011-a and 3011-B in different horizontal planes, or incorrectly supported, such as the 5 th wafer W in the storage module 301 in fig. 3 (from bottom to top), supported by two supports 3011-A7 and 3011-B9 vertically separated by 1 group of supports 3011;
at least four sets of monitoring modules 302 uniformly arranged on the periphery of the storage module 301 along the radial direction of the storage module 301, wherein the monitoring modules 302 are used for monitoring whether the position of the wafer W in the storage module 301 is abnormal;
the monitoring modules 302 can transmit laser signals and receive laser signals transmitted by adjacent monitoring modules 302, and when the laser signals received by the monitoring modules 302 are inconsistent, it is determined that the wafer W is abnormal in position.
It should be noted that only four sets of monitoring modules 302 are shown in the apparatus 300 in the embodiment of the present invention, but more than four sets of monitoring modules 302 may be provided according to specific requirements in a specific implementation process.
Further, as shown in fig. 4, the laser signals in monitoring modules 302 propagate in a straight line to enable adjacent monitoring modules 302 to receive the laser signals emitted from each other.
For the apparatus 300 shown in fig. 3, in some possible implementations, as shown in fig. 5, the monitoring module 302 includes:
the laser sensors 3021 are arranged at a set horizontal included angle, and the laser sensors 3021 are used for receiving laser signals;
the laser transmitters 3022 are respectively arranged at the front ends of the laser sensors 3021, and the laser transmitters 3022 are used for transmitting the laser signals;
a lifting unit 3023, wherein the lifting unit 3023 is used for driving the laser sensor 3021 and the laser generator 3022 to move up and down in the vertical direction.
It should be noted that, in a specific implementation process, for example, when four groups of monitoring modules are provided, in order to enable two laser sensors 3021 in each group of monitoring modules 302 to receive laser signals emitted by the laser generator 3022 in an adjacent monitoring module 302, a horizontal included angle between the two laser sensors 3021 in each group of monitoring modules 302 is set to 90 degrees. It is understood that when the number of monitoring modules 302 changes, the horizontal angle between the two laser sensors 3021 in each group of monitoring modules 302 also changes accordingly.
For the above implementation, in some examples, as shown in fig. 4, the laser generator 3022 is configured to emit a laser signal (shown by a dotted line in fig. 4) that can pass through the inside of the storage module 301 and can be shielded by the wafer W. It will be appreciated that, typically, the memory module 301 has a certain wall thickness, in order to ensure that the laser signal can accurately monitor the position of the wafer W without being affected by the body of the memory module 301, in embodiments of the present invention, the laser generator 3022 is configured to emit a laser signal that can pass through the interior of the memory module 301. Meanwhile, it should be noted that, because the monitoring modules 302 are uniformly arranged in the embodiment of the present invention, even when the wafer W is in an abnormal position, it can be ensured that the laser signal emitted by the laser generator 3022 in the monitoring modules 302 is shielded by the wafer W.
With respect to the apparatus 300 shown in fig. 3, in some possible implementations, as shown in fig. 6, the apparatus 300 further includes a control module 303, and the control module 303 is connected to the lifting unit 3023 in the monitoring module 302 and is used for controlling the monitoring module 302 to move up and down synchronously in the vertical direction so that the monitoring module 302 is always kept at the same horizontal position. It can be understood that, in the embodiment of the present invention, whether the positions of the wafers W are abnormal is determined by using whether the plurality of groups of monitoring modules 302 can receive the laser signals, so that it is first required to ensure that all the monitoring modules 302 are located at the same horizontal position in the specific implementation process.
For the above implementation, in some examples, the control module 303 controls the monitoring module 302 to be movable upward or downward in a vertical direction by a set first distance so that the monitoring module 302 is at a middle position of two vertically adjacent support piece groups 3011 after each movement.
For example, as shown in fig. 7, when the monitoring module 302 is located at a middle position of two vertically adjacent support member groups 3011 after each movement, for example, the monitoring module 302 after movement is located between the support member groups 3011 to 5 and 3011 to 6, if there is no abnormality in the position of two wafers W respectively abutted by the support member groups 3011 to 5 and the support member groups 3011 to 6 at this time, the laser signal emitted by each laser generator 3022 in the monitoring module 302 can pass through the gap between the two wafers W and be received by the corresponding laser sensor 3021, that is, all the laser sensors 3021 receive the laser signal at this time, and the laser signal received by the monitoring module at this time is consistent.
Conversely, for example, if the moved monitoring module 302 is located between the support member groups 3011-2 and 3011-3, and if the position where the supported member group 3011-2 abuts against the wafer W is abnormal as shown in fig. 7, at this time, the monitoring module 302-1 and the monitoring module 302-2 arranged on the left side cannot receive the laser signals emitted by the monitoring module 302-3 and the monitoring module 302-4 arranged on the right side due to the shielding of the inclined wafer W as shown in fig. 4, but the monitoring module 302-1 and the monitoring module 302-2 arranged on the left side can receive the laser signals emitted between each other, and the monitoring module 302-3 and the monitoring module 302-4 arranged on the right side can also receive the laser signals emitted between each other, that is, at this time, there is a phenomenon that the laser signals received by the monitoring module 302 are not consistent.
For the above implementation, in some examples, the control module 303 controls the monitoring module 302 to be able to move up or down in the vertical direction by a set second distance such that the monitoring module 302 is aligned with the wafer W after each movement.
For example, as shown in fig. 7, when the monitoring module 302 is aligned with the wafer W to be monitored after each movement, for example, the monitoring module 302 is aligned with the wafer W placed on the support group 3011-5, if the position of the wafer W abutted by the support group 3011-5 is not abnormal, the laser signal emitted by each laser generator 3022 in the monitoring module 302 is blocked by the wafer W abutted by the support group 3011-5, so that the corresponding laser sensor 3021 cannot receive the laser signal, that is, the laser signals received by the monitoring module 302 are the same.
In contrast, when monitoring the position of the 2 nd wafer W (counted from bottom to top) in fig. 7, when the monitoring module 302 moves to the support set 3011-2, the laser generator 3022 emits a laser signal, and due to the above-mentioned position abnormality of the 2 nd wafer W, the laser sensors 3021-2 and 3021-3 in the monitoring module 302-1 and the monitoring module 302-2 arranged on the left side, the laser sensors 3021-6 and the laser sensors 3021-7 in the monitoring module 302-3 and the monitoring module 302-4 arranged on the right side as shown in fig. 4 can receive the laser signal, and the laser sensors 3021-1 and the laser sensors 3021-4 in the monitoring module 302-1 and the monitoring module 302-2 arranged on the left side, and the laser sensors 3021-5 and the laser sensors 3021-6 in the monitoring module 302-3 and the monitoring module 302-4 arranged on the right side cannot receive the laser signal mutually, that is, and the laser signals are inconsistent with each other phenomena of the monitoring module 302.
For the apparatus 300 shown in fig. 3, in some possible implementations, as shown in fig. 4, the apparatus 300 further includes an alarm module 304; the alarm module 304 is connected with the laser sensor 3021 in the monitoring module 302; wherein the content of the first and second substances,
the alarm module 304 is configured to send out an alarm signal when the position of the wafer W in the storage module 301 is monitored to be abnormal.
As can be understood, when the laser signals received by the laser sensors 3021 in all the monitoring modules 302 are inconsistent, the alarm module 304 is triggered to remind a process worker to inspect the wafer W in the storage module 301 and adjust the position of the wafer W with abnormal position; meanwhile, the alarm module 304 is triggered to generate early warning, so that equipment alarm caused by human factors is reduced, and the production efficiency is improved.
With the device 300 provided by the embodiment of the present invention, the wafer W with the abnormal position can be improved before the robot arm 108 clamps the wafer W by monitoring the wafer W with the abnormal position in real time, so that the risk of equipment downtime is greatly reduced, and the wafer W is prevented from dropping or even breaking; secondly, in the embodiment of the present invention, the apparatus 300 is disposed at the periphery of the storage module 301, so that the interior of the storage module 301 is not polluted during the specific implementation process, and the cleanliness of the surface of the wafer W is ensured; finally, in the specific implementation process, the device 300 may monitor the wafers W in the storage module 301 for multiple times, so as to minimize the risk of the wafers W generating fragments, thereby reducing the production cost and improving the production efficiency.
Referring to fig. 8, there is shown a final polishing apparatus 800 according to an embodiment of the present invention, the final polishing apparatus 800 including:
a polishing head 101;
an absorbent pad 102;
a polishing disk 104;
a polishing pad 105 attached to the polishing disk;
an apparatus 300 for monitoring a wafer position as claimed in any one of claims 1 to 7;
a robot 108, wherein the robot 108 is configured to pick up the wafer W stored in the storage module 301 of the apparatus 300 for monitoring wafer position according to any one of claims 1 to 7 for transferring to the suction pad 102.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and shall cover the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (8)
1. An apparatus for monitoring a position of a wafer, the apparatus comprising:
the storage module is provided with an opening and comprises a plurality of layers of support piece groups which are arranged at equal intervals and formed by strip-shaped support pieces which are vertically arranged in two rows; wherein each support group comprises two supports in the same horizontal plane, and the wafer is supported by abutting against the two supports in different rows;
the monitoring modules are uniformly arranged on the periphery of the storage module along the radial direction of the storage module and used for monitoring whether the position of the wafer in the storage module is abnormal or not;
the monitoring modules can transmit laser signals and receive the laser signals transmitted by the adjacent monitoring modules, and when the laser signals received by the monitoring modules are inconsistent, the wafer position is judged to be abnormal.
2. The apparatus of claim 1, wherein the monitoring module comprises:
the device comprises two laser sensors arranged according to a set horizontal included angle, wherein the laser sensors are used for receiving laser signals;
the laser transmitters are respectively arranged at the front ends of the laser sensors and are used for transmitting the laser signals;
and the lifting unit is used for driving the laser sensor and the laser generator to move up and down along the vertical direction.
3. The apparatus of claim 2, wherein the laser generators in each set of the monitoring modules are configured to emit laser signals that can pass through the interior of the storage module and can be obscured by a wafer.
4. The device of claim 1, further comprising a control module connected to the lifting unit in the monitoring module for controlling the monitoring module to move up and down synchronously in the vertical direction so that the monitoring module is always kept at the same horizontal position.
5. The apparatus of claim 4, wherein the control module controls the monitoring module to be movable vertically up or down a set first distance such that the monitoring module is at a position intermediate two vertically adjacent sets of supports after each movement.
6. The apparatus of claim 4, wherein the control module controls the monitoring module to be movable vertically up or down a set second distance such that the monitoring module is aligned with the wafer after each movement.
7. The device of claim 1, further comprising an alarm module; the alarm module is connected with a laser sensor in the monitoring module; wherein the content of the first and second substances,
the alarm module is configured to send out an alarm signal when the wafer position in the storage module is monitored to be abnormal.
8. A final polishing apparatus, characterized in that the final polishing apparatus comprises:
a polishing head;
an adsorption pad;
a polishing disk;
a polishing pad attached to the polishing disc;
apparatus for monitoring the position of a wafer as claimed in any one of claims 1 to 7;
a robot arm for gripping the wafer in the storage module of the apparatus for monitoring the position of the wafer according to any one of claims 1 to 7 for transferring to the adsorption pad.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211564251.3A CN115863218A (en) | 2022-12-07 | 2022-12-07 | Device for monitoring wafer position and final polishing equipment |
| TW112105135A TW202331900A (en) | 2022-12-07 | 2023-02-14 | Device for monitoring position of wafer and final polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211564251.3A CN115863218A (en) | 2022-12-07 | 2022-12-07 | Device for monitoring wafer position and final polishing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115863218A true CN115863218A (en) | 2023-03-28 |
Family
ID=85670734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211564251.3A Pending CN115863218A (en) | 2022-12-07 | 2022-12-07 | Device for monitoring wafer position and final polishing equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115863218A (en) |
| TW (1) | TW202331900A (en) |
-
2022
- 2022-12-07 CN CN202211564251.3A patent/CN115863218A/en active Pending
-
2023
- 2023-02-14 TW TW112105135A patent/TW202331900A/en unknown
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| Publication number | Publication date |
|---|---|
| TW202331900A (en) | 2023-08-01 |
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Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant after: Xi'an Yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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