CN115851164A - Water-resistant and moisture-proof conductive adhesive film for microelectronic packaging and preparation method thereof - Google Patents
Water-resistant and moisture-proof conductive adhesive film for microelectronic packaging and preparation method thereof Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 21
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- 239000010439 graphite Substances 0.000 claims description 15
- 229910002804 graphite Inorganic materials 0.000 claims description 15
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 229920000459 Nitrile rubber Polymers 0.000 claims description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 12
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 12
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical group C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 claims description 12
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- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 5
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- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 claims description 4
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 4
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Abstract
The invention discloses a waterproof and moistureproof conductive adhesive film for microelectronic packaging and a preparation method thereof. The epoxy resin is modified, the toughness of the epoxy resin is increased, and the epoxy resin is uniformly dispersed in the epoxy resin in a proper particle size and an ideal form, so that the curing effect in subsequent use can be facilitated, cracks are prevented, the service performance can be improved, and the water-resistant and moisture-proof performance can be improved.
Description
Technical Field
The invention relates to the technical field of conductive adhesive films, in particular to a waterproof and moistureproof conductive adhesive film for microelectronic packaging and a preparation method thereof.
Background
The conductive adhesive, referred to as conductive adhesive for short, is an adhesive which can be effectively bonded to various materials and has conductive performance. The conductive adhesive is a composite material composed of a conductive filler such as metal powder or graphite and synthetic resin. An adhesive with certain electric conductivity after solidification or drying is prepared from matrix resin and conductive filler, i.e. conductive particles through binding matrix resin to combine them together to form electric path for electrically connecting the materials to be adhered. Can be applied to the fields of microelectronic packaging and the like.
The retrieved Chinese patent publication No. CN110564327A discloses an epoxy resin conductive adhesive film, which comprises the following components in parts by mass: 100 parts of modified epoxy resin colloid, 50-70 parts of conductive filler, 10-20 parts of diluent, 2-8 parts of curing agent, 0.2-0.6 part of antioxidant and 0.2-0.4 part of ultraviolet absorbent; according to the invention, the carbon nano tube is used as the conductive filler, the conductive filler forms a conductive interconnection network in the epoxy resin colloid, when the addition amount is 60 parts, the conductive effect of the conductive adhesive film is optimal, and the carbon nano tube is used as the conductive filler, so that the mechanical property of an epoxy conductive adhesive system can be improved, and the friction resistance, the acid and alkali resistance, the corrosion resistance and the like of the epoxy conductive adhesive system can be improved; according to the invention, the viscosity of the epoxy resin is effectively diluted by adding the diluent, so that the conductivity of the epoxy resin is improved; according to the invention, the modified epoxy resin is adopted as the conductive colloid, so that the humidity resistance of the epoxy resin colloid is improved, the humidity resistance of the component is improved, and the service life of the component is prolonged.
However, due to the material of the epoxy resin, cracks are easily generated during curing, so that the cured substance is brittle and has poor impact resistance, normal use of the conductive adhesive film is affected, the water-resistant and moisture-proof performance of the conductive adhesive film is also affected, moisture is easily introduced into the electronic element through the cracks, and the service life of the device is affected.
Disclosure of Invention
The invention aims to provide a waterproof and moistureproof conductive adhesive film for microelectronic packaging and a preparation method thereof, so as to solve the problems in the background technology.
The technical scheme of the invention is realized as follows:
according to one aspect of the invention, the waterproof and moistureproof conductive adhesive film for microelectronic packaging comprises a release layer, wherein a conductive film is arranged on the release layer, grooves are formed in the release layer at equal intervals, and protrusions matched with the grooves are arranged under the conductive film at equal intervals.
Preferably, the release layer is one of a PET fluoroplastic release film, a PET silicone-containing release film, a PET matte release film or a PE release film.
Preferably, the conductive adhesive comprises the following raw materials in parts by mass:
60-80 parts of modified epoxy resin, 6-10 parts of graphite, 25-35 parts of conductive metal powder, 1.6-4.2 parts of curing agent, 8-12 parts of diluent, 1.2-1.8 parts of ultraviolet light stabilizer, 0.6-0.8 part of antioxidant, 0.4-1.6 parts of silane coupling agent and 0.4-0.8 part of cross-linking agent.
Preferably, the conductive metal powder comprises the following raw materials in parts by mass: 10-14 parts of silver powder and 15-21 parts of copper powder.
Preferably, the conductive metal powder can be one or a mixture of several of flaky, dendritic or spheroidal shapes.
Preferably, the curing agent is one or more of ethylenediamine, hexamethylenediamine or isophthalic acid hydrazide; the diluent is one or more of butyl glycidyl ether, ethylene glycol diglycidyl ether or polypropylene glycol diglycidyl ether.
Preferably, the antioxidant is a triphenyl phosphite antioxidant; the cross-linking agent is glycidyl methacrylate.
Preferably, the preparation method of the modified epoxy resin comprises the following steps:
step S01: weighing epoxy resin and carboxyl-terminated nitrile rubber according to a mass ratio of 6;
step S02: heating while stirring, and reacting under the protection of nitrogen for 2-3h;
step S03: the product was analyzed by infrared and determined to be 1763cm -1 The characteristic peak of carboxyl group disappears, which shows that all carboxyl groups participate in the reaction, and the modified epoxy resin can be obtained.
Preferably, the stirring speed in the step S02 is 100-200rpm, the heating mode adopts oil bath heating, and the heating temperature is 130-150 ℃.
The inventor of the invention finds that cracks are easily generated in the subsequent curing process by not modifying the epoxy resin, so that the cured substance is brittle, and the impact resistance and the heat resistance are poor, thereby influencing the normal use of the conductive adhesive film.
In addition, the inventor of the invention finds that the epoxy resin is modified, the toughness of the epoxy resin is increased, the epoxy resin is uniformly dispersed in the epoxy resin in a proper particle size and an ideal form, the carboxyl-terminated butadiene-acrylonitrile rubber contains nitrile groups (-CN) with high polarity and good molecular flexibility, and a sea-island state micro-phase separation structure which is beneficial to improving the toughness of the composite material is formed in a toughened epoxy resin system, so that the subsequent curing effect in use can be facilitated, cracks can be prevented, the service performance can be improved, and the water-resistant and moisture-proof performance can be improved.
The invention also provides a waterproof and moistureproof conductive adhesive film for microelectronic packaging and a preparation method thereof, and the waterproof and moistureproof conductive adhesive film comprises the following steps:
step S201: weighing all raw materials required by the conductive adhesive film according to the mass parts;
step S202: sequentially adding the modified epoxy resin, the graphite and the conductive metal powder into a mixing kettle, stirring and mixing for 15-20min, sequentially adding the curing agent, the diluent, the ultraviolet light stabilizer, the antioxidant, the silane coupling agent and the crosslinking agent, stirring and mixing for 20-30min, and obtaining the conductive adhesive;
step S203: and (3) after the release layer coated on the substrate is cured, coating the conductive adhesive obtained in the step (S202) on the release layer, and curing at the normal temperature for 24 hours or heating for 5 hours (50 ℃) to obtain the conductive adhesive film.
Compared with the prior art, the invention has the beneficial effects that:
the technical points of the invention are as follows: the epoxy resin is modified, the toughness of the epoxy resin is increased, the epoxy resin is uniformly dispersed in the epoxy resin in a proper particle size and an ideal form, the carboxyl-terminated nitrile rubber contains nitrile groups with high polarity (-CN) and good molecular flexibility, a sea-island micro-phase separation structure which is beneficial to improving the toughness of the composite material is formed in a toughened epoxy resin system, the subsequent curing effect in use can be facilitated, cracks are prevented, the service performance can be improved on one hand, and the water-resistant and moisture-proof performance can be improved on the other hand.
Drawings
FIG. 1 is a schematic structural diagram of a waterproof and moisture-proof conductive adhesive film for microelectronic packaging according to the present invention;
FIG. 2 is a schematic structural diagram of a release layer in a waterproof and moisture-proof conductive adhesive film for microelectronic packaging according to the present invention;
fig. 3 is a schematic structural diagram of a conductive film in a waterproof and moisture-proof conductive adhesive film for microelectronic packaging according to the present invention.
In the figure: 1. a release layer; 2. a conductive film; 3. a groove; 4. and (4) protruding.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, a waterproof and moisture-proof conductive adhesive film for microelectronic packaging in this embodiment includes a release layer 1, a conductive film 2 is disposed on the release layer 1, grooves 3 are equidistantly formed in the release layer 1, and protrusions 4 matched with the grooves 3 are equidistantly formed below the conductive film 2;
and for the recess 3 on the release layer 1, its shape can also be the cockscomb structure, can conveniently peel off with the conducting film 2 in the follow-up, and when the conducting film 2 was applied to the laminating process and was hot-pressed simultaneously, because the space between the arch 4 has certain ability of accumulating the colloid, can reduce the discharge amount of colloid to avoid appearing the excessive phenomenon of gluing, promote the laminating effect.
Furthermore, the release layer 1 is one of a PET fluoroplastic release film, a PET silicone oil-containing release film, a PET matte release film or a PE release film, and can facilitate subsequent peeling.
When the microelectronic package is used, the microelectronic package can be quickly attached to a PI film or a reinforcing plate at normal temperature, the PI film of a circuit board is processed by laminating or rolling at 180 ℃, and finally the substrate with the release layer 1 is removed.
The waterproof and moistureproof conductive adhesive film for microelectronic packaging and the preparation method thereof of the embodiment comprise the following raw materials in parts by mass:
60-80 parts of modified epoxy resin, 6-10 parts of graphite, 25-35 parts of conductive metal powder, 1.6-4.2 parts of curing agent, 8-12 parts of diluent, 1.2-1.8 parts of ultraviolet light stabilizer, 0.6-0.8 part of antioxidant, 0.4-1.6 parts of silane coupling agent and 0.4-0.8 part of cross-linking agent.
Further, the conductive metal powder comprises the following raw materials in parts by mass: 10-14 parts of silver powder and 15-21 parts of copper powder.
Further, the conductive metal powder can be one or a mixture of several of flaky, dendritic or spheroidal shapes.
Further, the curing agent is one or more of ethylenediamine, hexamethylenediamine or isophthalic acid hydrazide; the diluent is one or more of butyl glycidyl ether, ethylene glycol diglycidyl ether or polypropylene glycol diglycidyl ether.
Further, the ultraviolet light stabilizer is benzimidazole; the antioxidant is a triphenyl phosphite antioxidant; the cross-linking agent is glycidyl methacrylate.
The preparation method of the modified epoxy resin of the embodiment comprises the following steps:
step S01: weighing epoxy resin and carboxyl-terminated nitrile rubber according to a mass ratio of 6;
step S02: heating while stirring, and reacting under the protection of nitrogen for 2-3h;
step S03: the product was analyzed by infrared and determined to be 1763cm -1 The characteristic peak of carboxyl group disappears, which shows that all carboxyl groups participate in the reaction, and the modified epoxy resin can be obtained.
Preferably, the stirring speed in the step S02 is 100-200rpm, the heating mode adopts oil bath heating, and the heating temperature is 130-150 ℃.
The waterproof and moistureproof conductive adhesive film for microelectronic packaging and the preparation method thereof are characterized by comprising the following steps:
step S201: weighing all raw materials required by the conductive adhesive film according to the parts by mass;
step S202: sequentially adding the modified epoxy resin, the graphite and the conductive metal powder into a mixing kettle, stirring and mixing for 15-20min, sequentially adding the curing agent, the diluent, the ultraviolet light stabilizer, the antioxidant, the silane coupling agent and the crosslinking agent, stirring and mixing for 20-30min, and obtaining the conductive adhesive;
step S203: and (3) after the release layer coated on the substrate is cured, coating the conductive adhesive obtained in the step (S202) on the release layer, and curing at the normal temperature for 24 hours or heating for 5 hours (50 ℃) to obtain the conductive adhesive film.
Example 1
The waterproof and moistureproof conductive adhesive film for microelectronic packaging and the preparation method thereof of the embodiment comprise the following raw materials in parts by mass:
60 parts of modified epoxy resin, 6 parts of graphite, 25 parts of conductive metal powder, 1.6 parts of curing agent, 8 parts of diluent, 1.2 parts of ultraviolet stabilizer, 0.6 part of antioxidant, 0.4 part of silane coupling agent and 0.4 part of crosslinking agent.
Further, the conductive metal powder comprises the following raw materials in parts by mass: 10 parts of silver powder and 15 parts of copper powder.
Further, the conductive metal powder may be in the shape of a sheet.
Further, the curing agent is ethylenediamine; the diluent is butyl glycidyl ether.
Further, the ultraviolet light stabilizer is benzimidazole; the antioxidant is a triphenyl phosphite antioxidant; the cross-linking agent is glycidyl methacrylate.
The preparation method of the modified epoxy resin of the embodiment comprises the following steps:
step S01: weighing epoxy resin and carboxyl-terminated nitrile rubber according to a mass ratio of 6;
step S02: heating while stirring, and reacting under the protection of nitrogen for 2h;
step S03: the product was analyzed by infrared and determined to be 1763cm -1 The characteristic peak of carboxyl group disappears, which shows that all carboxyl groups participate in the reaction, and the modified epoxy resin can be obtained.
Preferably, the stirring speed in the step S02 is 100rpm, the heating mode adopts oil bath heating, and the heating temperature is 130 ℃.
The waterproof and moistureproof conductive adhesive film for microelectronic packaging and the preparation method thereof are characterized by comprising the following steps of:
step S201: weighing all raw materials required by the conductive adhesive film according to the mass parts;
step S202: sequentially adding the modified epoxy resin, the graphite and the conductive metal powder into a mixing kettle, stirring and mixing for 15min, sequentially adding the curing agent, the diluent, the ultraviolet light stabilizer, the antioxidant, the silane coupling agent and the crosslinking agent, stirring and mixing for 20min, and obtaining the conductive adhesive;
step S203: and (3) after the release layer coated on the substrate is cured, coating the conductive adhesive obtained in the step (S202) on the release layer, and curing at the normal temperature for 24 hours or heating for 5 hours (50 ℃) to obtain the conductive adhesive film.
Example 2
The waterproof and moistureproof conductive adhesive film for microelectronic packaging and the preparation method thereof of the embodiment comprise the following raw materials in parts by mass:
70 parts of modified epoxy resin, 8 parts of graphite, 30 parts of conductive metal powder, 2.9 parts of curing agent, 10 parts of diluent, 1.5 parts of ultraviolet light stabilizer, 0.7 part of antioxidant, 1.0 part of silane coupling agent and 0.6 part of crosslinking agent.
Further, the conductive metal powder comprises the following raw materials in parts by mass: 12 parts of silver powder and 18 parts of copper powder.
Further, the conductive metal powder may be a mixture of flake and dendrite shapes.
Further, the curing agent is a mixture of ethylenediamine and hexamethylenediamine; the diluent is a mixture of butyl glycidyl ether and ethylene glycol diglycidyl ether.
Further, the ultraviolet light stabilizer is benzimidazole; the antioxidant is a triphenyl phosphite antioxidant; the cross-linking agent is glycidyl methacrylate.
The preparation method of the modified epoxy resin of the embodiment comprises the following steps:
step S01: weighing epoxy resin and carboxyl-terminated nitrile rubber according to a mass ratio of 6;
step S02: heating while stirring, and reacting under the protection of nitrogen for 2.5h;
step S03: the product was analyzed by infrared and determined to be 1763cm -1 The characteristic peak of carboxyl group disappears, which shows that all carboxyl groups participate in the reaction, and the modified epoxy resin can be obtained.
Preferably, the stirring speed in the step S02 is 150rpm, the heating mode adopts oil bath heating, and the heating temperature is 140 ℃.
The waterproof and moistureproof conductive adhesive film for microelectronic packaging and the preparation method thereof are characterized by comprising the following steps:
step S201: weighing all raw materials required by the conductive adhesive film according to the mass parts;
step S202: sequentially adding the modified epoxy resin, the graphite and the conductive metal powder into a mixing kettle, stirring and mixing for 18min, sequentially adding the curing agent, the diluent, the ultraviolet light stabilizer, the antioxidant, the silane coupling agent and the crosslinking agent, stirring and mixing for 25min to obtain the conductive adhesive;
step S203: and (3) after the release layer coated on the substrate is cured, coating the conductive adhesive obtained in the step (S202) on the release layer, and curing at the normal temperature for 24 hours or heating for 5 hours (50 ℃) to obtain the conductive adhesive film.
Example 3
The waterproof and moistureproof conductive adhesive film for microelectronic packaging and the preparation method thereof of the embodiment comprise the following raw materials in parts by mass:
80 parts of modified epoxy resin, 10 parts of graphite, 35 parts of conductive metal powder, 4.2 parts of curing agent, 12 parts of diluent, 1.8 parts of ultraviolet stabilizer, 0.8 part of antioxidant, 1.6 parts of silane coupling agent and 0.8 part of crosslinking agent.
Further, the conductive metal powder comprises the following raw materials in parts by mass: 14 parts of silver powder and 21 parts of copper powder.
Further, the conductive metal powder may be spherical in shape.
Further, the curing agent is isophthalic acid hydrazide; the diluent is polypropylene glycol diglycidyl ether.
Further, the ultraviolet light stabilizer is benzimidazole; the antioxidant is a triphenyl phosphite antioxidant; the cross-linking agent is glycidyl methacrylate.
The preparation method of the modified epoxy resin of the embodiment comprises the following steps:
step S01: weighing epoxy resin and carboxyl-terminated nitrile rubber according to a mass ratio of 6;
step S02: heating while stirring, and reacting under the protection of nitrogen for 3h;
step S03: the product was analyzed by infrared and determined at 1763cm -1 The characteristic peak of carboxyl group disappears, which shows that all carboxyl groups participate in the reaction, and the modified epoxy resin can be obtained.
Preferably, the stirring speed in the step S02 is 200rpm, the heating mode adopts oil bath heating, and the heating temperature is 150 ℃.
The waterproof and moistureproof conductive adhesive film for microelectronic packaging and the preparation method thereof are characterized by comprising the following steps of:
step S201: weighing all raw materials required by the conductive adhesive film according to the mass parts;
step S202: sequentially adding the modified epoxy resin, the graphite and the conductive metal powder into a mixing kettle, stirring and mixing for 20min, sequentially adding the curing agent, the diluent, the ultraviolet light stabilizer, the antioxidant, the silane coupling agent and the crosslinking agent, stirring and mixing for 30min to obtain the conductive adhesive;
step S203: and (3) after the release layer coated on the substrate is cured, coating the conductive adhesive obtained in the step (S202) on the release layer, and curing at the normal temperature for 24 hours or heating for 5 hours (50 ℃) to obtain the conductive adhesive film.
Comparative example 1
Unlike example 1, the epoxy resin was not modified.
Comparative example 2
Unlike example 1, no graphite was added.
Comparative example 3
The difference from the embodiment 1 is that the carboxyl-terminated butadiene-acrylonitrile rubber is replaced by hydroxyl-terminated butadiene-acrylonitrile rubber for modification in the preparation of the modified epoxy resin.
The products of examples 1-3 and comparative examples 1-3 were subjected to performance tests;
by comparing the performance of the products of examples 1 to 3 and comparative examples 1 to 5, the results are shown in Table 1 below.
TABLE 1
From comparative examples 1-3 it can be seen that:
the inventor of the invention finds that the moisture absorption of the epoxy resin is improved to some extent by not modifying the epoxy resin, so that the performance of the conductive adhesive film is influenced when the conductive adhesive film is used, the overall toughness can be improved by adopting the carboxyl-terminated butadiene-acrylonitrile rubber, so that cracks can be avoided when the conductive adhesive film is cured, the overall water resistance and moisture resistance can be improved, and the overall conductivity can be improved, the resistance can be reduced and the service performance can be improved by adding graphite and matching with conductive particles.
In conclusion, the epoxy resin is modified, the toughness of the epoxy resin is increased, the epoxy resin is uniformly dispersed in the epoxy resin in a proper particle size and an ideal form, the carboxyl-terminated nitrile rubber contains nitrile groups (-CN) with high polarity and good molecular flexibility, a sea-island state micro-phase separation structure which is beneficial to improving the toughness of the composite material is formed in a toughened epoxy resin system, the subsequent curing effect in use can be facilitated, cracks are prevented, the service performance can be improved, and the water resistance and the moisture resistance can be improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. The waterproof and moistureproof conductive adhesive film for microelectronic packaging is characterized by comprising a release layer 1, wherein a conductive film (2) is arranged on the release layer (1), grooves (3) are formed in the release layer (1) at equal intervals, and protrusions (4) matched with the grooves (3) are arranged under the conductive film (2) at equal intervals.
2. The waterproof and moisture-proof conductive adhesive film for microelectronic packaging according to claim 1, wherein the release layer (1) is one of a PET fluoroplastic release film, a PET silicone-containing release film, a PET matte release film or a PE release film.
3. The waterproof and moistureproof conductive adhesive film for microelectronic packaging according to claim 1, wherein the conductive adhesive comprises the following raw materials in parts by mass:
60-80 parts of modified epoxy resin, 6-10 parts of graphite, 25-35 parts of conductive metal powder, 1.6-4.2 parts of curing agent, 8-12 parts of diluent, 1.2-1.8 parts of ultraviolet light stabilizer, 0.6-0.8 part of antioxidant, 0.4-1.6 parts of silane coupling agent and 0.4-0.8 part of cross-linking agent.
4. The conductive adhesive according to claim 3, wherein the conductive metal powder comprises the following raw materials in parts by mass: 10-14 parts of silver powder and 15-21 parts of copper powder.
5. The conductive adhesive according to claim 3, wherein the conductive metal powder is in the form of one or more of a flake, a dendrite, or a sphere.
6. The conductive adhesive according to claim 3, wherein the curing agent is one or more of ethylenediamine, hexamethylenediamine or isophthalic acid hydrazide; the diluent is one or more of butyl glycidyl ether, ethylene glycol diglycidyl ether or polypropylene glycol diglycidyl ether.
7. The conductive adhesive according to claim 3, wherein the ultraviolet light stabilizer is benzimidazole; the antioxidant is a triphenyl phosphite antioxidant; the cross-linking agent is glycidyl methacrylate.
8. The modified epoxy resin as claimed in claim 3, wherein the preparation method comprises the following steps:
step S01: weighing epoxy resin and carboxyl-terminated nitrile rubber according to the mass ratio of 6;
step S02: heating while stirring, and reacting under the protection of nitrogen for 2-3h;
step S03: the product was analyzed by infrared and determined to be 1763cm -1 The characteristic peak of carboxyl group disappears, which shows that all carboxyl groups participate in the reaction, and the modified epoxy resin can be obtained.
9. The modified epoxy resin as claimed in claim 8, wherein the stirring speed in step S02 is 100-200rpm, the heating is carried out by oil bath heating at 130-150 ℃.
10. A method for preparing a water-resistant and moisture-proof conductive adhesive film for microelectronic packaging according to any one of claims 1 to 9, comprising the steps of:
step S201: weighing all raw materials required by the conductive adhesive film according to the mass parts;
step S202: sequentially adding the modified epoxy resin, the graphite and the conductive metal powder into a mixing kettle, stirring and mixing for 15-20min, sequentially adding the curing agent, the diluent, the ultraviolet light stabilizer, the antioxidant, the silane coupling agent and the crosslinking agent, stirring and mixing for 20-30min, and obtaining the conductive adhesive;
step S203: and (3) after the release layer coated on the substrate is cured, coating the conductive adhesive obtained in the step (S202) on the release layer, and curing at the normal temperature for 24 hours or heating for 5 hours (50 ℃) to obtain the conductive adhesive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211726110.7A CN115851164A (en) | 2022-12-29 | 2022-12-29 | Water-resistant and moisture-proof conductive adhesive film for microelectronic packaging and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211726110.7A CN115851164A (en) | 2022-12-29 | 2022-12-29 | Water-resistant and moisture-proof conductive adhesive film for microelectronic packaging and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115851164A true CN115851164A (en) | 2023-03-28 |
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ID=85656401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211726110.7A Withdrawn CN115851164A (en) | 2022-12-29 | 2022-12-29 | Water-resistant and moisture-proof conductive adhesive film for microelectronic packaging and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115851164A (en) |
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2022
- 2022-12-29 CN CN202211726110.7A patent/CN115851164A/en not_active Withdrawn
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