CN115847293A - Grinding and cleaning equipment - Google Patents
Grinding and cleaning equipment Download PDFInfo
- Publication number
- CN115847293A CN115847293A CN202211626121.8A CN202211626121A CN115847293A CN 115847293 A CN115847293 A CN 115847293A CN 202211626121 A CN202211626121 A CN 202211626121A CN 115847293 A CN115847293 A CN 115847293A
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- Prior art keywords
- grinding
- abrasive
- cleaning
- teeth
- base
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- 238000004140 cleaning Methods 0.000 title claims abstract description 105
- 206010006514 bruxism Diseases 0.000 claims abstract description 47
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 34
- 239000010703 silicon Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 14
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 41
- 239000012498 ultrapure water Substances 0.000 claims description 41
- 238000005507 spraying Methods 0.000 claims description 35
- 238000001035 drying Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 239000003344 environmental pollutant Substances 0.000 abstract description 6
- 231100000719 pollutant Toxicity 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- 238000011084 recovery Methods 0.000 description 7
- 239000002351 wastewater Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The invention relates to grinding and cleaning equipment, which comprises a silicon wafer grinding device and a grinding wheel cleaning device; the silicon wafer grinding device comprises a rotatable grinding workbench and a grinding wheel, wherein the grinding wheel comprises a rotatable base and a plurality of grinding teeth annularly distributed on the connecting surface of the base, the plurality of grinding teeth are arranged at intervals, and the grinding wheel partially covers the grinding workbench in the grinding process so that the plurality of grinding teeth are switched between a working state and a non-working state; the grinding wheel cleaning device is used for cleaning the grinding teeth in a non-working state in the grinding process. In the grinding process, the grinding teeth of the grinding wheel are cleaned through the grinding wheel cleaning device, so that the silicon wafer is prevented from being damaged by chips and pollutants attached to the grinding wheel.
Description
Technical Field
The invention relates to the technical field of grinding, in particular to grinding and cleaning equipment.
Background
In the semiconductor processing technology, firstly, a crystal bar is divided into sheet bare chips through a multi-wire cutting technology, in order to remove mechanical damage to the surfaces of silicon chips caused by steel wires and mortar in the cutting process and achieve the purposes of effectively thinning the silicon chips and controlling the surface flatness, a double-sided grinding processing technology is used, the surfaces of the silicon chips are ground in equal proportion through a diamond grinding wheel, a surface damage layer is removed, and the silicon chips are thinned.
At present, the known grinding device fixes a silicon wafer by a grinding workbench and enables the silicon wafer to rotate at a high speed, an annular and spaced tooth-shaped grinding wheel rotates on the surface of the silicon wafer in the opposite direction to achieve the purpose of grinding and thinning, the grinding device further comprises a water spray nozzle, and pure water cleaning debris is sprayed to the surface of the silicon wafer on the grinding workbench by the water spray nozzle.
Disclosure of Invention
In order to solve the technical problems, the invention provides grinding and cleaning equipment, which solves the problem that chips and pollutants attached to a grinding wheel damage a silicon wafer.
In order to achieve the purpose, the embodiment of the invention adopts the technical scheme that: a grinding and cleaning device comprises a silicon wafer grinding device and a grinding wheel cleaning device;
the silicon wafer grinding device comprises a rotatable grinding workbench and a grinding wheel, wherein the grinding wheel comprises a rotatable base and a plurality of grinding teeth annularly distributed on the connecting surface of the base, the plurality of grinding teeth are arranged at intervals, and the grinding wheel partially covers the grinding workbench in the grinding process so that the plurality of grinding teeth are switched between a working state and a non-working state;
the grinding wheel cleaning device is used for cleaning the grinding teeth in a non-working state in the grinding process;
the grinding wheel cleaning device comprises:
a first cleaning unit for cleaning an outer circumferential surface of the grinding tooth;
the second cleaning unit is used for cleaning the grinding surface of the grinding teeth;
and the drying unit is used for drying the cleaned ground teeth.
Optionally, the first cleaning unit comprises a first ultrasonic wave generating structure and a first ultrapure water spraying structure, wherein the first ultrapure water spraying structure comprises a first nozzle facing the outer peripheral surface of the ground tooth;
the second cleaning unit comprises a brush cleaning structure and a second ultrapure water spraying structure, and the second ultrapure water spraying structure comprises a second nozzle which is arranged in the brush cleaning structure in a penetrating mode and faces the grinding surface of the grinding teeth.
Optionally, the brush cleaning structure includes a base body and a brush arranged on the base body and facing the grinding surface, the second ultrapure water spraying structure includes a spraying pipe arranged inside the base body in a penetrating manner, and one end of the spraying pipe is provided with a second nozzle exposed on the base body.
Optionally, the base is provided with at least 2 bases, and orthographic projections of 2 adjacent bases on the grinding wheel are located on the grinding surfaces of the adjacent grinding teeth.
Optionally, all the bases are arranged at intervals along the arrangement direction of the grinding teeth, and an orthographic projection of each base on the grinding wheel covers at least one grinding tooth.
Optionally, the base is provided with 1, and an orthographic projection of at least part of the ground teeth on the base is positioned in the base.
Optionally, in a radial direction of the grinding wheel, a width of the base is greater than or equal to a width of the grinding tooth.
Optionally, the drying unit includes a compressed dry gas supply unit, a pressure pump, and an air knife, the air knife includes a knife body and an air duct disposed on the knife body, and an air outlet of the air duct is disposed toward the grinding teeth.
Optionally, the grinding wheel cleaning device further comprises a third cleaning unit for cleaning the inner circumferential surface of the grinding tooth.
Optionally, the third cleaning unit includes a second ultrasonic wave generating structure and a second ultrapure water spraying structure, and the second ultrapure water spraying structure includes a third nozzle facing the inner circumferential surface of the ground tooth.
The invention has the beneficial effects that: in the grinding process, the grinding teeth of the grinding wheel are cleaned through the grinding wheel cleaning device, so that chips and pollutants attached to the grinding wheel are prevented from damaging the silicon wafer.
Drawings
FIG. 1 shows a first schematic view of an abrasive cleaning apparatus in an embodiment of the invention;
FIG. 2 is a second schematic diagram of an abrasive cleaning apparatus according to an embodiment of the present invention;
FIG. 3 shows a third schematic view of an abrasive cleaning apparatus in an embodiment of the invention;
FIG. 4 shows a fourth schematic view of an abrasive cleaning apparatus in an embodiment of the invention;
FIG. 5 shows a fifth schematic view of an abrasive cleaning apparatus in an embodiment of the invention;
fig. 6 shows a sixth schematic view of the polishing and cleaning apparatus in an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Among the correlation technique, grinding device is including the grinding workstation that is used for fixed silicon chip, a grinding miller for grinding the silicon chip to and be used for carrying out abluent silicon chip belt cleaning device to the silicon chip surface, at the grinding in-process, rinses the piece on silicon chip surface through silicon chip belt cleaning device, but only carries out conventional washing to the silicon chip surface, and does not clean grinding miller, and adnexed piece and pollutant act on the silicon chip surface on the grinding miller, can make the silicon chip surface produce the damage equally.
With reference to fig. 1 to 6, in order to solve the above problems, the present embodiment provides a grinding and cleaning apparatus, which includes a silicon wafer grinding device and a grinding wheel cleaning device;
the silicon wafer grinding device comprises a rotatable grinding workbench 001 and a grinding wheel, wherein a silicon wafer 005 is fixed on the grinding workbench 001, the rotation direction of the grinding workbench 001 is opposite to that of the grinding wheel, the grinding wheel comprises a rotatable base 002 and a plurality of grinding teeth 003 annularly distributed on the connecting surface of the base 002, the grinding teeth 003 are arranged at intervals, and in the grinding process, the grinding wheel partially covers the grinding workbench 001 so that the grinding teeth 003 are switched between a working state and a non-working state;
the grinding wheel cleaning device is used for cleaning the grinding teeth 003 in a non-working state in the grinding process.
In this embodiment, the grinding wheel cleaning device is additionally provided to clean the grinding wheel, and the grinding wheel is cleaned during the grinding process, so that the damage to the surface of the silicon wafer 005 is effectively avoided.
The grinding wheel is partially covered on the grinding workbench 001, namely, in the grinding process, only part of the grinding teeth 003 are ground all the time, the rest grinding teeth 003 are in a non-working state, and the working state of the grinding teeth 003 is switched between the working state and the non-working state along with the rotation of the grinding wheel.
Illustratively, the grinding and cleaning equipment further comprises a silicon wafer cleaning device 004 for cleaning the surface of the silicon wafer 005, wherein the silicon wafer cleaning device 004 comprises an ultrapure water supply structure and an ultrapure water spraying structure (only a water spray pipe is illustrated in fig. 1-3, and the actual ultrapure water spraying structure is not limited), the ultrapure water spraying structure comprises a water spray pipe and a nozzle arranged at one end of the water spray pipe, and the ultrapure water spraying structure is used for spraying towards the surface of the silicon wafer 005 to clean the surface of the silicon wafer 005. By matching the silicon wafer cleaning device 004 with the grinding wheel cleaning device, the damage to the surface of the silicon wafer 005 is effectively avoided.
In an exemplary embodiment, the grinding wheel cleaning apparatus includes:
a first cleaning unit for cleaning the outer peripheral surface of the ground tooth 003;
a second cleaning unit for cleaning the grinding surface of the ground tooth 003;
and a drying unit for drying the washed ground teeth 003.
Carry out all-round washing to grinding tooth 003, especially wash the grinding face of grinding tooth 003, the damage of pollutant to silicon chip 005 on grinding tooth 003 is effectively avoided.
Referring to fig. 1-3, in an exemplary embodiment, the first cleaning unit includes a first ultrasonic wave generating structure 103 and a first ultrapure water spraying structure 102, the first ultrapure water spraying structure 102 including a first nozzle facing the outer circumferential surface of the milled tooth 003. The cleaning is carried out in a mode combining ultrasonic and spraying, and the cleaning efficiency is improved.
The first ultrasonic wave generating structure 103 comprises an ultrasonic wave chamber and an ultrasonic wave generator located in the ultrasonic wave chamber, the first ultrapure water spraying structure 102 comprises a pipeline, one end of the pipeline is communicated with the ultrasonic wave chamber, and the other end of the pipeline is provided with the first nozzle. The first cleaning unit further includes an ultrapure water supply structure (refer to a first ultrapure water supply structure 202 in fig. 2) which communicates with the ultrasonic chamber to supply ultrapure water.
In an exemplary embodiment, the second cleaning unit comprises a brush cleaning structure 101 and a second ultrapure water spraying structure 104, wherein the second ultrapure water spraying structure 104 comprises a second nozzle penetrating the brush cleaning structure 101 and facing the grinding surface of the grinding teeth 003.
The second nozzle and the brush work together to clean the grinding surface of the ground teeth 003, improving the cleaning efficiency.
In an exemplary embodiment, the brush cleaning structure 101 includes a base and a brush disposed on the base and facing the abrasive surface, the second ultrapure water spraying structure 104 includes a spraying pipe penetrating the inside of the base, and one end of the spraying pipe is provided with the second nozzle exposed on the base.
Referring to fig. 2, the second ultrapure water spraying structure further comprises a second ultrapure water supply structure 201 communicating with the shower pipe.
The specific structure of the brush cleaning structure 101 may be various, and the specific structure of the second ultrapure water spraying structure 104 is not limited to the above, and several structures in the present embodiment will be described below.
In some embodiments, the brush cleaning structure 101 includes at least one base and a brush disposed on the base and facing the abrasive surface, the base includes a first surface on which the brush is disposed, and a second surface opposite to the first surface, the second ultrapure water spraying structure includes at least one water inlet hole disposed on the second surface, at least one water outlet hole disposed on the first surface, and at least one channel disposed inside the base and disposed in one-to-one correspondence with the at least one water outlet hole, the at least one channel is communicated with the corresponding water inlet hole, and the water inlet hole is communicated with an ultrapure water supply structure (refer to the second ultrapure water supply structure 201 in fig. 2) through a pipeline.
In some embodiments, the brush cleaning structure 101 includes at least one base and a brush disposed on the base and facing the grinding surface, the base is hollow to form a containing cavity, the base includes a first surface on which the brush is disposed and a second surface opposite to the first surface, the ultrapure water spraying structure includes at least one water inlet hole disposed on the second surface and at least one water outlet hole disposed on the first surface, the at least one water inlet hole and the at least one water outlet hole are communicated with the containing cavity, and the at least one water inlet hole is communicated with the ultrapure water providing structure through a pipeline.
The number and shape of the substrates may be varied, and the specific configuration will be described in detail below.
Referring to fig. 4, in an exemplary embodiment, the brush cleaning structure 101 includes at least 2 bases, and orthographic projections of 2 adjacent bases on the grinding wheel are located on the grinding surfaces of adjacent grinding teeth 003.
In an exemplary embodiment, all of the bases are spaced along the arrangement direction of the grinding teeth 003, and an orthographic projection of each base on the grinding wheel covers at least one grinding tooth 003.
The gap between two adjacent bases may be aligned with the gap between two adjacent abrasive teeth 003, but not limited thereto.
Three such substrates are shown in fig. 4, but the number of substrates is not limited thereto.
Referring to fig. 5 and 6, in an exemplary embodiment, the brush cleaning structure 101 includes a base within which at least a portion of the abrasive teeth 003 are orthographically projected. That is, the orthogonal projection of the base body on the grinding wheel covers a part of the plurality of grinding teeth 003 or covers the whole of the grinding teeth 003.
Illustratively, the base is disposed in an arc. The shape of the base conforms to the shape of the plurality of teeth 003 after alignment, so that each of the teeth 003 is cleaned by the brush structure during rotation of the grinding wheel.
Referring to fig. 5 and 6, in an exemplary embodiment, the base has a width greater than or equal to the width of the grinding teeth 003 in the radial direction of the grinding wheel. Ensuring that the abrasive surface of the abrasive teeth 003 can be effectively cleaned.
When the width of the base is greater than the width of the grinding teeth 003, that is, in the radial direction of the grinding wheel, the area of the grinding surface is smaller than the sectional area of the base, the brush provided on the base can be divided into three parts along the radial direction of the grinding wheel, specifically, a middle part and a first part and a second part located on opposite sides of the middle part, and the height of the brush located in the middle part is smaller than the heights of the brushes located in the first part and the second part, so that the outer peripheral surface, the inner peripheral surface and the grinding surface of the grinding teeth 003 can be cleaned simultaneously. And in some embodiments, in order to effectively clean the outer circumferential surface, the inner circumferential surface, and the abrasive surface of the abrasive teeth 003, the first portion and the second portion are disposed obliquely with respect to the intermediate portion along a radial direction of the abrasive wheel such that a surface of the base facing the abrasive wheel forms a groove opening toward the abrasive wheel, the brush of the first portion is disposed perpendicularly to the first portion, the brush of the second portion is disposed perpendicularly to the second portion, and the brush of the intermediate portion is disposed perpendicularly to the intermediate portion.
In an exemplary embodiment, the drying unit includes a compressed drying gas supply component 204, a pressure pump 205, and an air knife 106, the air knife 106 includes a knife body and an air duct disposed on the knife body, and an air outlet of the air duct is disposed toward the ground teeth 003.
For example, an angle between the air outlet direction of the air duct and the grinding surface of the grinding tooth 003 is less than or equal to 90 degrees.
Illustratively, the angle between the extending direction of the air duct and the abrasive surface is less than 90 degrees.
Exemplarily, the air duct includes a first sub air duct and a second sub air duct, an air inlet is disposed at an end of the first sub air duct far away from the second sub air duct, an air outlet is disposed at an end of the second sub air duct far away from the first sub air duct, an extending direction of the first sub air duct is perpendicular to the grinding surface, and the second sub air duct is obliquely disposed relative to the first sub air duct, so that an air outlet direction of the air duct is oblique to the grinding surface.
It should be noted that fig. 1 to 6 are schematic views, and in fig. 1 to 6, the base and the brush are shown as a whole, but it should be understood that the brush cleaning structure includes a base and a brush provided on the base.
In an exemplary embodiment, the grinding wheel cleaning apparatus further includes a third cleaning unit for cleaning the inner circumferential surface of the grinding teeth 003.
Illustratively, the third cleaning unit includes a second ultrasonic wave generating structure and a second ultrapure water spraying structure including a third nozzle directed toward the inner peripheral surface of the ground tooth 003.
The third cleaning unit may be separately provided, or may be integrally provided with the first cleaning unit or the second cleaning unit.
In an exemplary embodiment, the grinding and cleaning apparatus further includes a control system 200 for controlling the grinding wheel cleaning device to automatically clean the grinding wheel, and referring to fig. 2, the control system 200 controls the first ultrapure water supply structure 202 to automatically supply ultrapure water, controls the first ultrasonic wave generation structure 103 to generate ultrasonic waves, controls the second ultrapure water supply structure 201 to automatically supply ultrapure water, and controls the compressed dry gas supply unit 204 to supply the compressed dry gas CDA.
For example, the control system may be a PLC (programmable logic controller), but is not limited thereto.
In an exemplary embodiment, the grinding and cleaning device further comprises a waste water recovery device, the waste water recovery device is arranged below the grinding wheel, and the waste water recovery device comprises a horn-shaped recovery opening communicated with a drainage pipeline so as to avoid overflow of waste water.
The water outlet of the horn-shaped recovery port is provided with a filter screen to prevent the drainage pipeline from being blocked.
Exemplarily, the water outlet of the recovery opening is composed of a plurality of drain holes 105 arranged at intervals, and if the water outlet is too large, large pollutants can easily enter the drain pipeline to block the drain pipeline. The arrangement of the plurality of drain holes 105 can increase the area of the entire water outlet communicating with the drain line and prevent the drain line from being clogged.
A filter screen is arranged in each water discharge hole 105, so that the blockage of a water discharge pipeline is further effectively prevented.
Illustratively, the pitch of the plurality of drainage holes 105 is 0.8mm to 1.2mm, the aperture of each drainage hole 105 is 10 mm to 20mm, the number of meshes of the filter screen arranged in the drainage hole 105 is #10 to 20 meshes, and the silica slag with a diameter of about 1mm (e.g. 0.8mm to 1.2 mm) can be filtered out, but not limited thereto.
It should be noted that fig. 3 to 6 are only schematic diagrams, and the drain hole 105 is illustrated to show the arrangement of the wastewater recovery device, but only the position relationship thereof is illustrated, and the actual structure thereof is not limited.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. The grinding and cleaning equipment is characterized by comprising a silicon wafer grinding device and a grinding wheel cleaning device;
the silicon wafer grinding device comprises a rotatable grinding workbench and a grinding wheel, wherein the grinding wheel comprises a rotatable base and a plurality of grinding teeth annularly distributed on the connecting surface of the base, the plurality of grinding teeth are arranged at intervals, and the grinding wheel partially covers the grinding workbench in the grinding process so that the plurality of grinding teeth are switched between a working state and a non-working state;
the grinding wheel cleaning device is used for cleaning the grinding teeth in a non-working state in the grinding process;
the grinding wheel cleaning device comprises:
a first cleaning unit for cleaning an outer circumferential surface of the grinding tooth;
the second cleaning unit is used for cleaning the grinding surface of the grinding teeth;
and the drying unit is used for drying the cleaned ground teeth.
2. The abrasive cleaning apparatus of claim 1, wherein the first cleaning unit comprises a first ultrasonic wave generating structure and a first ultrapure water spraying structure, the first ultrapure water spraying structure comprising a first nozzle facing an outer peripheral surface of the abrasive tooth;
the second cleaning unit comprises a brush cleaning structure and a second ultrapure water spraying structure, and the second ultrapure water spraying structure comprises a second nozzle which is arranged in the brush cleaning structure in a penetrating mode and faces the grinding surface of the grinding teeth.
3. The abrasive cleaning device according to claim 2, wherein the brush cleaning structure comprises a base and a brush disposed on the base and facing the abrasive surface, the second ultrapure water spraying structure comprises a spray pipe penetrating the inside of the base, and one end of the spray pipe is provided with the second nozzle exposed to the base.
4. The abrasive cleaning device of claim 3, wherein said base is provided with at least 2 bases, and the orthographic projection of 2 adjacent bases on said abrasive wheel is located on the abrasive surface of adjacent said abrasive tooth.
5. The abrasive cleaning device according to claim 4, wherein all of the bases are spaced along the arrangement direction of the abrasive teeth, and an orthographic projection of each of the bases on the abrasive wheel covers at least one of the abrasive teeth.
6. The abrasive cleaning device of claim 3 wherein said base is provided with 1, and wherein an orthographic projection of at least a portion of said abrasive tooth on said base is located within said base.
7. The abrasive cleaning device according to claim 3, characterized in that the width of the base body in the radial direction of the abrasive wheel is greater than or equal to the width of the abrasive tooth.
8. The abrasive cleaning device according to claim 1, wherein the drying unit includes a compressed dry gas supply unit, a pressure pump, and an air knife, the air knife includes a knife body and an air duct provided on the knife body, and an air outlet of the air duct is provided toward the abrasive teeth.
9. The abrasive cleaning device according to claim 1, wherein said abrasive wheel cleaning means further comprises a third cleaning unit for cleaning an inner peripheral surface of said abrasive tooth.
10. The abrasive cleaning apparatus of claim 9, wherein the third cleaning unit comprises a second ultrasonic wave generating structure and a second ultrapure water spraying structure, the second ultrapure water spraying structure comprising a third nozzle directed toward an inner peripheral surface of the abrasive tooth.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211626121.8A CN115847293B (en) | 2022-12-15 | 2022-12-15 | Grinding and cleaning equipment |
| TW112104914A TWI840120B (en) | 2022-12-15 | 2023-02-13 | Grinding and cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211626121.8A CN115847293B (en) | 2022-12-15 | 2022-12-15 | Grinding and cleaning equipment |
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| CN115847293A true CN115847293A (en) | 2023-03-28 |
| CN115847293B CN115847293B (en) | 2024-10-15 |
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| CN202211626121.8A Active CN115847293B (en) | 2022-12-15 | 2022-12-15 | Grinding and cleaning equipment |
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| TW (1) | TWI840120B (en) |
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| JP2015196226A (en) * | 2014-04-02 | 2015-11-09 | 株式会社ディスコ | grinding method |
| CN104999370A (en) * | 2014-04-16 | 2015-10-28 | 株式会社迪思科 | Grinding Machine |
| CN203887686U (en) * | 2014-05-27 | 2014-10-22 | 中芯国际集成电路制造(北京)有限公司 | Polishing head cleaning device and chemical mechanical polishing equipment |
| KR20170043897A (en) * | 2015-10-14 | 2017-04-24 | 삼성전자주식회사 | Chemical Mechanical Polishing Apparatus |
| CN106985060A (en) * | 2016-01-18 | 2017-07-28 | 三星电子株式会社 | Substrate attenuation device, the method that substrate is thinned and the method for manufacturing semiconductor packages |
| JP2019110176A (en) * | 2017-12-18 | 2019-07-04 | 株式会社東京精密 | Cleaning device |
| CN111451938A (en) * | 2020-04-08 | 2020-07-28 | 西安奕斯伟硅片技术有限公司 | Polishing carrier cleaning device and polishing carrier cleaning method |
| CN113618524A (en) * | 2020-05-07 | 2021-11-09 | 株式会社迪思科 | Grinding device |
| CN112518573A (en) * | 2020-11-06 | 2021-03-19 | 西安奕斯伟硅片技术有限公司 | Polishing apparatus, polishing machine, and polishing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115847293B (en) | 2024-10-15 |
| TWI840120B (en) | 2024-04-21 |
| TW202325478A (en) | 2023-07-01 |
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Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an Yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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