CN115847194A - Grinding method for hard and brittle material rod body and hard and brittle material rod body grinding machine - Google Patents
Grinding method for hard and brittle material rod body and hard and brittle material rod body grinding machine Download PDFInfo
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- CN115847194A CN115847194A CN202211494287.9A CN202211494287A CN115847194A CN 115847194 A CN115847194 A CN 115847194A CN 202211494287 A CN202211494287 A CN 202211494287A CN 115847194 A CN115847194 A CN 115847194A
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- 238000000227 grinding Methods 0.000 title claims abstract description 257
- 239000000463 material Substances 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 61
- 238000005520 cutting process Methods 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 21
- 229910052710 silicon Inorganic materials 0.000 description 20
- 239000010703 silicon Substances 0.000 description 20
- 238000003754 machining Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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Abstract
The invention relates to the technical field of cutting of high-hardness and crisp materials, and particularly provides a grinding method for a hard and crisp material rod body and a hard and crisp material rod body grinding machine, aiming at solving the technical problem that the edge breakage rate is high after the unilateral allowance is reduced. To this end, the grinding method of the present invention comprises: s01, performing rough grinding and chamfering on the edges and corners of the hard and brittle material rod body by using a rough grinding device to form a first chamfer, and performing rough grinding swing arc without using the rough grinding device; and S02, carrying out fine grinding and arc swinging on the first chamfer by using a fine grinding device to form a fillet. By the control method, only the fine grinding wheel is used in the whole grinding process aiming at the grinding of the swing arc, the coarse grinding wheel is not used, the hardness of the coarse grinding wheel is higher than that of the fine grinding wheel, the swing arc is ground only by the fine grinding wheel, the fine grinding wheel is soft, and the probability of edge breakage is correspondingly and greatly reduced.
Description
Technical Field
The invention relates to the technical field of cutting of high-hardness and brittle materials, and particularly provides a grinding method for a hard and brittle material rod body and a hard and brittle material rod body grinding machine.
Background
Due to the characteristics that high-hardness and brittle materials are easy to damage and difficult to process, in the prior art, cutting of the high-hardness and brittle materials is always a difficult point to overcome, especially, the photovoltaic industry is vigorously developed, the processing requirements for the high-hardness and brittle materials such as silicon rods are higher and higher, the price of silicon materials is continuously increased, the processing basis of all the photovoltaic industry is silicon wafers, and the problem of how to manufacture qualified and better silicon wafers is urgently solved in the industry is always urgent.
The method aims at improving the grinding mode of the silicon rod.
The whole silicon rod before grinding is a rod-shaped material with a rectangular cross section, and the silicon rod has the characteristics of high hardness and brittleness, edge breakage is difficult to avoid in the grinding process, along with the fact that the silicon material is more and more expensive, the size precision control after the cutting is better and better, the allowance after the cutting is smaller and smaller, the early unilateral machining allowance is more than 1mm, even if fine edge breakage is generated, the final machining part cannot be influenced, but the current unilateral allowance is smaller and smaller, the requirement of some customers is reduced to 0.35mm, once a larger edge breakage is generated in the coarse grinding process of the silicon rod of a rough blank, the silicon rod cannot be completely covered after fine grinding, the edge breakage rate of the edge of the ground silicon rod is high, the quality defect of the silicon rod is caused by edge breakage, the qualified rate of cut silicon wafers is reduced, and extra loss is caused to users.
Based on this, in order to reduce the edge breakage rate, the following two modes are common: the first is to reduce the moving speed of the rough grinding swing arc, and the second is to perform rough grinding without using the upper edge swing arc but using the middle part of the grinding wheel for swing grinding. However, the two modes prolong the overall grinding time, have great influence on the working efficiency of products, and have unsatisfactory effect when applied to practical use.
Accordingly, there is a need in the art for a new grinding method and a new grinding machine for a hard and brittle material rod to solve the problem of high breakage rate after the single-edge margin is reduced in the prior art.
Disclosure of Invention
The present invention is intended to solve the above-described technical problem, that is, the technical problem of the prior art that the edge breakage rate becomes high after the one-side margin is reduced.
In a first aspect, the present invention provides a grinding method for a bar body made of hard and brittle materials, the grinding method comprising:
s01, performing rough grinding and chamfering on the edges and corners of the hard and brittle material rod body by using a rough grinding device to form a first chamfer, and performing rough grinding swing arc without using the rough grinding device;
s02, carrying out fine grinding and arc swinging on the first chamfer by using a fine grinding device to form a fillet;
preferably, the rough grinding device is a rough grinding wheel, the fine grinding device is a fine grinding wheel, and more preferably, before the step of performing fine grinding swing arc on the first chamfer by using the fine grinding device in step S02, the control method further comprises: and carrying out fine grinding compensation swing arc on the first chamfer by using a fine grinding device.
After facing the above technical problem, the inventors started to gradually analyze the grinding method in the prior art, which is:
starting feeding, and calculating the coarse grinding amount;
starting rough grinding, wherein rough grinding is carried out at an angle of 45 degrees, rough grinding is carried out at an angle of 135 degrees, rough grinding is carried out at a swing arc of 45 degrees, rough grinding is carried out on a surface of 0 degree, rough grinding is carried out on a surface of 90 degrees, and rough grinding is finished;
calculating the accurate grinding amount required to be accurately ground after the coarse grinding;
and (4) starting accurate grinding, performing accurate grinding on 45-degree swing arc, performing accurate grinding on 135-degree swing arc, performing accurate grinding on 0-degree surface, performing accurate grinding on 90-degree surface and finishing accurate grinding.
After multiple verification, the inventor finds that edge breakage mostly occurs in the steps of 'rough grinding 135 swing arc and rough grinding 45 swing arc' in the rough grinding, if the edge breakage is small, the fine grinding can still completely cover, at this time, even if some edge breakage does not have problems, but as the customer requirements are higher and higher, the machining allowance of the rough blank is smaller and smaller, and correspondingly, the problems are more and more protruded, so that the edge breakage rate is more and more uncontrollable. Based on this, the inventors have creatively eliminated the step of rough grinding the swing arc and accordingly supplemented the grinding amount in the portion of the finish grinding swing arc, that is, the rough grinding swing arc is not provided in step S01 and the step of finish grinding swing arc is provided in step S02, and more preferably, the step of finish grinding the compensation swing arc may be separately provided to carry out the grinding of the compensation portion, and the number of times of grinding in the step of finish grinding the compensation swing arc may be 1 or more for compensating the grinding margin for canceling the rough grinding swing arc. Therefore, only the fine grinding wheel is used in the whole grinding process for the swing arc, the coarse grinding wheel is not used, the hardness of the coarse grinding wheel is higher than that of the fine grinding wheel, and the swing arc is ground only by using the fine grinding wheel.
In a preferred embodiment of the above-described grinding method, the method of the present invention further includes, between step S01 and step S02: s03, using a rough grinding wheel to perform rough grinding and chamfering on the edge angle between the side face of the hard and brittle material rod body and the first chamfer to form a second chamfer.
The first chamfer angle is a plane corresponding to 45 degrees and 135 degrees, and the second chamfer angle is a 42 degree angle, a 48 degree angle, a 132 degree angle and a 138 degree angle correspondingly, after the scheme is adjusted, if the second chamfer angle is not increased in the coarse grinding process, a sharp angle still remains, and at the moment, the sharp angle is still a part which is easy to break edges for grinding in the implementation process of the invention, so the second chamfer angle is designed in the coarse grinding and the fine grinding, the sharp angle is eliminated, the integral grinding is smoother, and the edge breakage rate is further reduced.
In a preferable embodiment of the above grinding method, the step S02 further includes:
s021, carrying out fine grinding and arc swinging on the first chamfer and the second chamfer together by using a fine grinding device to form a fillet.
After the second chamfer is added, the two convex sharp angles become four gentle sharp angles, and the step of fine grinding swing arc is jointly carried out on the four sharp angles generated by the first chamfer and the second chamfer so as to form a chamfer angle.
In a preferable embodiment of the above grinding method, the step S021 further includes:
s0211, controlling the hard and brittle material rod body to rotate in a reciprocating manner;
s0212, carrying out fine grinding and arc swinging on the positions of the first chamfer and the second chamfer of the hard and brittle material rod body by using the fine grinding device to form a fillet.
The round chamfering is realized by the reciprocating rotation of the silicon rod and the fine grinding device.
In a preferred embodiment of the grinding method, in step S0211, the swing angle of the reciprocating rotation ranges from-15 ° to 15 °, and more preferably, the swing angle of the reciprocating rotation ranges from-3 ° to 3 °.
The invention proposes that the oscillating angle of the reciprocating rotation has a value of-3 ° to 3 °, for example, an angle of 45 ° is between 42 ° and 48 °, in order to achieve rounding.
In a preferred embodiment of the above-described grinding method, before, simultaneously with, or after step S01, the method of the present invention further comprises:
and S04, roughly grinding the side surface of the hard and brittle material rod body.
In a preferred embodiment of the above-described grinding method, before, simultaneously with, or after step S02, the method of the present invention further comprises:
and S05, finely grinding the side surface of the bar body made of the hard and brittle materials.
And finally, carrying out fine grinding on the side surface and the fillet of the silicon rod, thereby obtaining a finished product after final grinding.
The invention also provides a hard and brittle material rod body grinding machine, wherein a processor is arranged in the hard and brittle material rod body grinding machine, and the hard and brittle material rod body grinding machine is arranged to execute the grinding method for the hard and brittle material rod body in any one of the technical schemes.
Drawings
A preferred embodiment of the invention will now be described with reference to a hard and brittle material bar grinder in conjunction with the accompanying drawings, in which:
FIG. 1 is a principal flow diagram of the grinding method of the present invention;
FIG. 2 is a detailed flow chart of the grinding method of the present invention;
FIG. 3 is a flowchart of one embodiment of step S021 in FIG. 2;
FIG. 4 is a schematic illustration of rough grinding chamfer in the grinding method of the present invention;
FIG. 5 is a schematic illustration of a rough ground side in the grinding method of the present invention;
FIG. 6 is a schematic view of a finish grinding swing arc in the grinding method of the present invention;
fig. 7 is a schematic view of a refined side surface in the grinding method of the invention;
FIG. 8 is a schematic illustration of the ground front and back profile of the bar of the present invention;
FIG. 9 is a first embodiment enlarged at A in FIG. 8;
fig. 10 is a second embodiment enlarged at a in fig. 8.
List of reference numerals:
1-a bar body made of hard and brittle materials; 11-outer profile of the rod; 12-final cut profile of the bar; 13-side surface of the rod body; 2-roughly grinding a grinding wheel; 3-first chamfering; 4-second chamfering; 5-fine grinding wheel;
Detailed Description
Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention. And can be adjusted as needed by those skilled in the art to suit particular applications.
Referring to fig. 1-10, a method for grinding a hard and brittle material bar 1 according to the present invention is described, as shown in fig. 1, in order to solve the technical problem of the prior art that the edge breakage rate becomes high after the single margin is reduced, in a possible embodiment, as shown in the figure, the method for grinding a hard and brittle material bar 1 according to the present invention specifically includes:
s01, performing rough grinding and chamfering on the edge angle of the hard and brittle material rod body 1 by using a rough grinding device to form a first chamfer, and performing rough grinding swing arc without using the rough grinding device;
s02, carrying out fine grinding and arc swinging on the first chamfer by using a fine grinding device to form a fillet;
preferably, the rough grinding device is a rough grinding wheel 2, the finish grinding device is a finish grinding wheel 5, and more preferably, before the step of performing finish grinding swing arc on the first chamfer 3 by using the finish grinding device in step S02, the control method further comprises: and carrying out fine grinding compensation swing arc on the first chamfer 3 by using a fine grinding device.
Through the arrangement, the step of carrying out rough grinding swing arc on the rough grinding wheel 2 is eliminated, then the step of carrying out fine grinding swing arc is arranged, only the fine grinding wheel 5 is used in the whole grinding process aiming at the swing arc grinding, the rough grinding wheel 2 is not used, the hardness of the rough grinding wheel 2 is higher than that of the fine grinding wheel 5, and the swing arc grinding is realized only by using the fine grinding wheel 5.
A specific preferred embodiment of the above-described fig. 1 is developed in detail below in conjunction with fig. 2-10.
In a particularly preferred embodiment of the invention, as shown in fig. 2, the grinding method comprises the steps of:
s01, performing rough grinding and chamfering on the edges and corners of the hard and brittle rod body by using a rough grinding device to form a first chamfer, and performing rough grinding on a swing arc without using the rough grinding device;
as shown in fig. 4 and fig. 8-10, the edge angle of the silicon rod can be roughly chamfered by using the rough grinding wheel 2 to form the first chamfer 3, and the step of rough grinding swing arc is not added in the rough grinding process, that is, the sharp angle between the first chamfer 3 and the rod body side surface 13 in fig. 9 is not rounded, so that the rough grinding wheel 2 is prevented from directly contacting the sharp angle, and the probability of edge breakage is reduced.
S03, using a coarse grinding device to perform coarse grinding and chamfering on the edge angle between the side face of the hard and brittle material rod body and the first chamfer angle so as to form a second chamfer angle;
in another embodiment, as shown in fig. 10, in the rough grinding stage, the first chamfer 3 and the sharp corner of the side face can be further ground to form a second chamfer 4, and at this time, the distance from the sharp corner on the outer profile 11 of the bar body in fig. 10 to the final cut profile 12 of the bar body is smaller than that in the scheme in fig. 9, the whole is more gradual, and the probability of edge breakage when the finish grinding wheel 5 is chamfered for the sharp corner with the second chamfer 4 is lower.
S04, roughly grinding the side face of the rod body made of the hard and brittle materials;
as shown in fig. 5, after rough grinding and chamfering, the side surface of the silicon rod is also ground, so that subsequent finish grinding is more accurate.
S021, carrying out fine grinding and arc swinging on the first chamfer and the second chamfer together by using a fine grinding device to form a fillet;
further, step S021 specifically includes:
s0211, controlling the bar body made of the hard and brittle materials to rotate in a reciprocating manner;
s0212, carrying out fine grinding swing arc on the positions of the first chamfer and the second chamfer of the hard and brittle material rod body by using a fine grinding device to form a fillet.
As shown in fig. 6, during the rounding process, the reciprocating rotation of the silicon rod needs to be controlled, and at this time, the finish grinding wheel 5 is controlled to grind, so as to form a gentle arc surface, and during the process, the oscillating angle of the reciprocating rotation of the silicon rod ranges from-15 ° to 15 °, and preferably from-3 ° to 3 °.
Particularly, the step of roughly grinding the swing arc is added into the step of accurately grinding the swing arc, so the reduction amount of roughly grinding can be supplemented by increasing the accurately grinding compensation swing arc, the accurately grinding swing arc can be directly repeated for two times or more, or reasonable feeding data is adjusted according to requirements, and the rationality and the timeliness of accurately grinding are realized.
And S05, finely grinding the side surface of the bar body made of the hard and brittle materials.
As shown in fig. 6, 7, 8 and 10, the blank of the silicon rod can be finally ground into a preset scheme, the whole grinding is smooth, and the edge breakage generated when the rough grinding wheel 2 and the sharp corner are ground is avoided, so that the technical problem mentioned in the invention is solved.
In particular, the grinding method further includes some other known steps, such as detecting the size before loading, calculating the rough grinding size after loading, rough grinding feed amount, rough grinding times, etc., and calculating the finish grinding feed amount, finish grinding times, etc., after rough grinding is completed, for avoiding redundancy, the inventor does not develop the conventional steps, and the skilled person can supplement the above steps as required to make the grinding scheme proposed by the present invention more complete, but the core point of the present invention is not here, and any scheme provided with the step of removing the rough grinding swing arc of the present invention and only using the finish grinding swing arc is still within the protection scope of the present invention even if the above known steps are added.
In summary, the step of rough grinding swing arc is eliminated, grinding amount is supplemented to the fine grinding swing arc part correspondingly, namely the rough grinding swing arc is not arranged in the step S01, the step of fine grinding swing arc is arranged in the step S02, only the fine grinding wheel 5 is used in the whole grinding process aiming at the swing arc grinding, the rough grinding wheel 2 is not used, the hardness of the rough grinding wheel 2 is higher than that of the fine grinding wheel 5, the swing arc is ground only by using the fine grinding wheel 5, compared with the scheme of using the rough grinding wheel 2 and then using the fine grinding wheel 5 in the prior art, the grinding allowance is very small, the machining time of the rough grinding wheel 2 and the fine grinding wheel 5 is the same in the actual use process by controlling the feeding amount, the probability of generating the edge is greatly reduced correspondingly, and experiments show that the edge breakage is basically avoided even if the machining allowance is reduced from 1mm to 0.35mm, the yield of the rod body 1 made of the hard material is improved, and the yield of silicon rods can be improved when silicon chips are cut.
It should be noted that the above-mentioned embodiments are only used for illustrating the principle of the present invention, and are not intended to limit the protection scope of the present invention, and those skilled in the art can modify the above-mentioned structure so that the present invention can be applied to more specific application scenarios without departing from the principle of the present invention.
For example, in an alternative embodiment, the hard and brittle material rod 1 is not limited to a silicon rod, but may be other hard and brittle material rods 1 that need to be cut, such as a carbon rod, without departing from the principle of the present invention, and therefore, all fall within the scope of the present invention.
For example, in another alternative embodiment, the rough grinding device and the finish grinding device are not limited to the rough grinding wheel 2 and the finish grinding wheel 5, and other grinding blocks, sand paper and the like do not depart from the principle of the invention, and therefore, the invention is within the protection scope of the invention.
In addition, the invention also provides a hard and brittle material rod grinding machine, wherein a processor is arranged in the hard and brittle material rod grinding machine, and the hard and brittle material rod grinding machine is arranged to execute the grinding method for the hard and brittle material rod in any one of the technical schemes.
Those skilled in the art will appreciate that the above-described hard and brittle material rod milling machine may also include other known structures, such as a controller, a memory, etc., wherein the memory includes, but is not limited to, a ram, a flash memory, a rom, a prom, a volatile memory, a non-volatile memory, a serial memory, a parallel memory or a register, etc., and the processor includes, but is not limited to, a CPLD/FPGA, a DSP, an ARM processor, a MIPS processor, etc. Such well-known structures are not shown in the drawings in order to not unnecessarily obscure embodiments of the present disclosure.
Although the foregoing embodiments describe the steps in the above sequential order, those skilled in the art will understand that, in order to achieve the effect of the present embodiment, the different steps are not necessarily performed in this order, and may be performed simultaneously (in parallel) or in an inverse order, for example, step S04 is a step for rough grinding the side surface, and may be performed in inverse or parallel with the step of rough grinding and chamfering in step S01, and these simple variations are within the protection scope of the present invention.
So far, the technical solutions of the present invention have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the invention, and the technical scheme after the changes or substitutions can fall into the protection scope of the invention.
Claims (10)
1. A grinding method for a bar body made of hard and brittle materials is characterized by comprising the following steps:
s01, performing rough grinding and chamfering on the edges and corners of the hard and brittle material rod body by using a rough grinding device to form a first chamfer, and performing rough grinding swing arc without using the rough grinding device;
and S02, carrying out fine grinding and arc swinging on the first chamfer by using a fine grinding device to form a fillet.
2. A grinding method for a hard and brittle material rod according to claim 1, characterized in that the method further comprises the following steps between step S01 and step S02:
s03, using a rough grinding device to perform rough grinding and chamfering on the edge angle between the side face of the hard and brittle material rod body and the first chamfer to form a second chamfer.
3. The grinding method for the hard and brittle material rod body according to claim 2, characterized in that the step S02 further comprises the following steps:
s021, carrying out fine grinding and arc swinging on the first chamfer and the second chamfer together by using a fine grinding device to form a fillet.
4. A grinding method for hard and brittle material rod according to claim 3, characterized in that step S021 further comprises:
s0211, controlling the hard and brittle material rod body to rotate in a reciprocating mode;
s0212, carrying out fine grinding swing arc on the positions of the first chamfer and the second chamfer of the hard and brittle material rod body by using the fine grinding device so as to form a fillet.
5. A grinding method for a hard and brittle material rod according to claim 4, characterized in that in step S0211, the oscillating angle of the reciprocating rotation ranges from-15 ° to 15 °.
6. A grinding method for hard and brittle material rod according to claim 5, characterized in that in step S0211, the oscillating angle of the reciprocating rotation ranges from-3 ° to 3 °.
7. A grinding method for a hard and brittle material rod body according to claim 1, characterized in that before or after step S01, the method further comprises:
and S04, roughly grinding the side surface of the rod body made of the hard and brittle materials.
8. A grinding method for a hard and brittle material rod according to claim 1, characterized in that before or after step S02, the method further comprises:
and S05, finely grinding the side surface of the bar body made of the hard and brittle materials.
9. A grinding method for a hard and brittle material rod body as claimed in claim 1, characterized in that, before the step of performing the fine grinding swing arc on the first chamfer by using the fine grinding device in step S02, the control method further comprises: carrying out fine grinding compensation swing arc on the first chamfer by using a fine grinding device; and/or the like and/or,
the rough grinding device is a rough grinding wheel, and the fine grinding device is a fine grinding wheel.
10. A hard and brittle material rod grinding machine, characterized in that a processor is arranged in the hard and brittle material rod grinding machine, and the hard and brittle material rod grinding machine is arranged to execute the grinding method for the hard and brittle material rod according to any one of claims 1 to 9.
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| CN214562085U (en) * | 2020-08-28 | 2021-11-02 | 天通日进精密技术有限公司 | Chamfering device and silicon rod processing equipment |
| CN113319669A (en) * | 2021-06-24 | 2021-08-31 | 福州天瑞线锯科技有限公司 | Polishing method and system for grinding surface of material rod |
| CN114714156A (en) * | 2022-03-14 | 2022-07-08 | 银川隆基光伏科技有限公司 | Processing method of silicon wafer, control system, silicon wafer, solar cell and assembly of solar cell |
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