CN115841953A

CN115841953A - Manufacturing device and manufacturing method for power electronic component packaging substrate

Info

Publication number: CN115841953A
Application number: CN202211515903.4A
Authority: CN
Inventors: 卢亚鹏
Original assignee: Nanjing Tongfu Micro Technology Co ltd
Current assignee: Nanjing Tongfu Micro Technology Co ltd
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-03-24

Abstract

The invention relates to the technical field of electronic elements, in particular to a manufacturing device and a manufacturing method of a power electronic component packaging substrate. Through the arrangement of the supporting mechanism and the processing mechanism, the purpose of polishing nickel layers with different depths can be achieved while automatic clamping and unloading of the packaging substrate can be achieved without a pneumatic clamp.

Description

Manufacturing device and manufacturing method for power electronic component packaging substrate

Technical Field

The invention relates to the technical field of electronic components, in particular to a manufacturing device and a manufacturing method of a power electronic component packaging substrate.

Background

The packaging substrate can provide the effects of electric connection, protection, support, heat dissipation, assembly and the like for the chip so as to realize the purposes of multi-pin, reduction of the volume of a packaging product, improvement of electric performance and heat dissipation, ultrahigh density or multi-chip modularization, and the packaging substrate is generally subjected to a nickel plating process so as to improve the wear resistance and corrosion resistance of the surface of the packaging substrate, so that the packaging substrate needs to be put into nickel plating equipment for a surface treatment process.

At present, nickel plating equipment on the market is when carrying out the nickel plating to packaging substrate, because packaging substrate need start pneumatic fixture when location or take, just can be with packaging substrate centre gripping, but pneumatic fixture easily appears internals fatigue damage when opening and close many times in the short time, and current nickel plating equipment will be attached to and polish the clearance at the unnecessary nickel metal in packaging substrate surface, consequently, accomplish the phenomenon of unevenness can appear in the packaging substrate surface of nickel plating technology, consequently need an equipment to improve it to above-mentioned problem.

Disclosure of Invention

The invention provides a manufacturing device and a manufacturing method of a power electronic component packaging substrate, aiming at the problems in the prior art.

The technical scheme adopted by the invention for solving the technical problems is as follows: a manufacturing device and a manufacturing method of a power electronic component packaging substrate comprise a supporting mechanism and a guide sliding plate, wherein a nickel plating device and a processing mechanism are fixedly mounted at the top end of the supporting mechanism, the nickel plating device is located at the front end of the processing mechanism, a first stop block is symmetrically and fixedly mounted at the top end of the front end of the supporting mechanism, a second stop block is symmetrically and fixedly mounted at the top end of the rear end of the supporting mechanism, the guide sliding plate is fixedly mounted at the rear end of the supporting mechanism, the supporting mechanism comprises a transmission device and a transmission device, the transmission device is slidably mounted at the top end of the transmission device, the transmission device comprises a rotating support plate, a reset spring, a clamping strip, a rack, a support side frame, a first connecting frame, a contact scraper plate, a cleaning brush barrel, a sliding key and a U-shaped sliding key, the cleaning brush barrel is fixedly installed at the center of the front end of the first connecting frame, the contact scraper is fixedly installed at the bottom end of the first connecting frame, the supporting side frames are symmetrically and fixedly installed at the rear end, deviating from the cleaning brush barrel, of the first connecting frame, the rotating support plate is installed between the two supporting side frames in a rotating mode close to the front end of the cleaning brush barrel, the reset spring is fixedly installed at the center of the inner side of each supporting side frame, the U-shaped sliding key is inserted into the supporting side frame in a sliding mode, the clamping strip is fixedly installed at the top end of the reset spring, the rack is fixedly installed at the top end of each supporting side frame, the U-shaped sliding key is fixedly installed on the outer side of the clamping strip, and the sliding key is fixedly installed at the bottom end of each supporting side frame.

Specifically, transmission includes output motor, threaded rod, chip groove, supporting pedestal and direction spout, output motor fixed mounting is at the front end center of supporting pedestal, the threaded rod rotates and runs through supporting pedestal fixed mounting at the rear end center of output motor, the chip groove is seted up on supporting pedestal's front and back bottom, the top both sides at supporting pedestal are seted up to the direction spout.

Specifically, the processing mechanism comprises a regulating device, an auxiliary cleaning device and a positioning device, wherein the regulating device is fixedly installed on the top end of the positioning device, and the auxiliary cleaning device is fixedly installed at the bottom of the rear end of the regulating device.

Specifically, the regulating device comprises a communicating pipe, an absorption cavity, a polishing wheel, a first gear, a T-shaped support, air cylinders, an extension base rod and a second connecting frame, wherein the extension base rod is fixedly arranged between the two air cylinders, the T-shaped support is fixedly arranged at the bottom end of the extension base rod, the polishing wheel is rotatably arranged inside two sides of the T-shaped support, the first gear is fixedly installed at the top end of the grinding wheel, the second connecting frame is fixedly installed at the top of the rear end of the T-shaped support, the absorption cavity is symmetrically and fixedly installed at the bottom end of the second connecting frame, and the communicating pipe is fixedly installed at the top of the rear end of the absorption cavity far away from the grinding wheel.

Specifically, supplementary cleaning device includes second gear, transmission cingulum, dwang, third gear and nylon brush, second gear and third gear mesh respectively at the inside both ends of transmission cingulum, dwang fixed mounting is at the top center of third gear, nylon brush fixed mounting is in the bottom center of third gear.

Specifically, positioner is including butt joint groove, spacing groove, U type support and fourth gear, the top both ends at U type support are seted up to the butt joint groove, the top center at U type support is seted up to the spacing groove, fourth gear symmetry rotates the inside top of installing at U type support.

Specifically, the front end central thread of first link cup joints on the threaded rod, the feather key slides and pegs graft in the inside of direction spout, the bottom fixed mounting of cylinder is on the top of U type support, just it slides and pegs graft in the inside of spacing groove to extend the base rod, the inboard meshing of first gear and fourth gear, the outside meshing of rack and fourth gear, second gear fixed mounting is on the outer lane of first gear, the dwang rotates the inside top of installing at the second link, just the nylon brush is located the inner circle of absorption cavity.

Specifically, the bottom both ends of U type feather key all are 45 slopes settings, the screw hole with threaded rod looks adaptation is seted up at the front end center of first link, rotate the extension board and be close to the front end rotation of first link and install on the front end that the support side frame is close to the contact scraper blade, the bottom of rotating the extension board and the top parallel and level of support base, the bottom of contact scraper blade and the inside bottom laminating of support base, U type feather key aligns with first dog and second dog respectively, the front and back surface mark of extension base pole has the scale mark, the inside of absorption cavity is the hollow state setting, just the intercommunication pipe and the absorption cavity intercommunication, the lower edge of absorption cavity is higher than the bottom of wheel of polishing and nylon brush, the bottom fixed mounting of card strip has the plastic strip, first gear aligns with the butt joint groove is perpendicular.

Specifically, the supporting base further comprises a cylindrical rod and a collecting cavity, the cylindrical rod is symmetrically and fixedly installed at the bottoms of the two ends of the supporting base, and the collecting cavity is inserted on the cylindrical rod in a sliding mode.

A manufacturing method of a manufacturing device of a power electronic component packaging substrate comprises the following steps:

s1, placing a packaging substrate to be processed on the surface of a rotating support plate, starting an output motor, driving a threaded rod to rotate, and enabling a first connecting frame and a supporting side frame to integrally move towards the rear end, so that a U-shaped sliding key can move downwards from a first stop block, and a clamping strip can clamp and fix the packaging substrate above the rotating support plate;

s2, when the supporting side frame drives the rotating support plate to move to the position below the nickel plating equipment, nickel plating on the basic surface of the package can be carried out, and when the package substrate enters the bottom end of the polishing wheel, the fourth gear and the first gear are driven to rotate through the rack, so that when the package substrate is in contact with the polishing wheel, the first gear can drive the polishing wheel to polish redundant nickel layers on the package substrate;

s3, when the grinding wheel rotates, the second gear, the third gear and the nylon brush can be driven to rotate simultaneously, so that when the packaging substrate enters the bottom end of the nylon brush, residual nickel metal residues on the packaging substrate can be swept away, and meanwhile, the absorption cavity is arranged on the outer rings of the grinding wheel and the nylon brush, so that the absorption cavity can absorb the dropped nickel metal residues;

and S4, when the support side frame moves to the limit position above the support base, the support side frame can drive the rotating support plate to move to the upper side of the guide sliding plate, at the moment, the rotating support plate can rotate downwards by an angle until the rotating support plate is attached to the surface of the guide sliding plate, so that the packaging substrate on the rotating support plate slides downwards from the surface of the guide sliding plate, and the packaging substrate is conveyed.

The invention has the beneficial effects that:

one, through reset spring, the card strip, the U type feather key, the combination setting of first dog and second dog, when the support side frame moves to when contacting with first dog in the top of support base, can drive the U type feather key and upwards remove along first dog surface, make U type feather key and card strip rebound, be convenient for place packaging substrate on the surface that rotates the extension board, and simultaneously, when the U type feather key passes through from the surface of first dog, elasticity through reset spring, can drive the quick lapse of card strip and U type feather key, make can be with packaging substrate restriction location on the surface that rotates the extension board, follow two-way downward movement respectively through the card strip, make can realize the location with packaging substrate's both ends, accomplish packaging substrate's restriction location work.

And through the combined arrangement of the regulating device, the auxiliary cleaning device and the positioning device, when the supporting side frame drives the rack to be meshed with the fourth gear, the first gear and the polishing wheel can be driven to rotate simultaneously, so that the polishing wheel can polish the surface of the packaging substrate, and meanwhile, when the polishing wheel rotates, the nylon brush can be driven to rotate simultaneously, so that the nylon brush can complete the cleaning work of the nickel metal residues remained on the surface of the packaging substrate, and the absorption cavity is arranged on the outer rings of the polishing wheel and the nylon brush, so that the cleaned residues can be timely recovered, and the nickel metal residues are prevented from scattering.

And thirdly, the collecting cavity can slide on the cylindrical rod, so that the collecting cavity can be supported to move and take, the collecting cavity can be moved to be aligned with the chip groove, and the metal residues falling from the inside of the chip groove can be conveniently received.

Drawings

The invention is further illustrated with reference to the following figures and examples.

FIG. 1 is a front perspective view of the main body of the present invention;

FIG. 2 is a front perspective view of the support mechanism of the present invention;

FIG. 3 is a perspective view of the front of the transmission device of the present invention;

FIG. 4 is a perspective view of the transmission of the present invention from a front perspective;

FIG. 5 is a perspective view of the front of the processing mechanism of the present invention;

FIG. 6 is a schematic view of a front perspective structure of the control device of the present invention;

FIG. 7 is a schematic bottom view perspective view of the control device of the present invention;

FIG. 8 is a front perspective view of the auxiliary cleaning device of the present invention;

FIG. 9 is a schematic bottom-view perspective view of the positioning device of the present invention;

FIG. 10 is a front perspective view of a supporting base according to a second embodiment of the present invention.

In the figure: 1-supporting mechanism, 2-processing mechanism, 3-first stopper, 4-nickel plating equipment, 5-second stopper, 6-guide sliding plate, 7-transmission device, 8-transmission device, 9-rotation support plate, 10-reset spring, 11-clamping strip, 12-rack, 13-support side frame, 14-first connecting frame, 15-contact scraper, 16-cleaning brush barrel, 17-sliding key, 18-U-shaped sliding key, 19-output motor, 20-threaded rod, 21-chip groove, 22-support base, 23-guide sliding groove, 24-regulating device, 25-auxiliary cleaning device, 26-positioning device, 27-communicating pipe, 28-absorption cavity, 29-polishing wheel, 30-first gear, 31-T-shaped bracket, 32-air cylinder, 33-extension base rod, 34-second connecting frame, 35-second gear, 36-transmission toothed belt, 37-rotating rod, 38-third gear, 39-nylon brush, 40-cleaning groove, 41-contact gear bracket, 43-second connecting frame, 44-cylindrical collecting cavity, and 40-nylon brush groove.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The invention is further described below with reference to the accompanying drawings.

Example 1

As shown in fig. 1, fig. 2 and fig. 3, the manufacturing apparatus and the manufacturing method for a power electronic component packaging substrate according to the present invention include a supporting mechanism 1 and a guiding slide plate 6, a nickel plating device 4 and a processing mechanism 2 are fixedly installed on a top end of the supporting mechanism 1, the nickel plating device 4 is located at a front end of the processing mechanism 2, a first stopper 3 is symmetrically and fixedly installed on a top portion of a front end of the supporting mechanism 1, a second stopper 5 is symmetrically and fixedly installed on a top portion of a rear end of the supporting mechanism 1, the guiding slide plate 6 is fixedly installed on a rear end of the supporting mechanism 1, the supporting mechanism 1 includes a transmission device 7 and a transmission device 8, the transmission device 7 is slidably installed on a top end of the transmission device 8, the transmission device 7 includes a rotating support plate 9, a return spring 10, a clamping bar 11, a rack 12, a support side frame 13, a first connection frame 14, a contact scraper 15, a cleaning brush 16, a sliding key 17 and a U-shaped sliding key 18, A cleaning brush barrel 16 is fixedly arranged at the center of the front end of a first connecting frame 14, a contact scraper 15 is fixedly arranged at the bottom end of the first connecting frame 14, supporting side frames 13 are symmetrically and fixedly arranged at the rear end of the first connecting frame 14, which is far away from the cleaning brush barrel 16, a rotating support plate 9 is rotatably arranged between the two supporting side frames 13 near the front end of the cleaning brush barrel 16, a return spring 10 is fixedly arranged at the center of the inner sides of the supporting side frames 13, a U-shaped sliding key 18 is slidably inserted into the supporting side frames 13, a clamping strip 11 is fixedly arranged at the top end of the return spring 10, a rack 12 is fixedly arranged at the top end of the supporting side frames 13, the U-shaped sliding key 18 is fixedly arranged on the outer side of the clamping strip 11, and a sliding key 17 is fixedly arranged at the bottom end of the supporting side frames 13.

As shown in fig. 4, the transmission device 8 includes an output motor 19, a threaded rod 20, a chip discharge groove 21, a support base 22 and a guide sliding groove 23, the output motor 19 is fixedly installed at the center of the front end of the support base 22, the threaded rod 20 is rotatably installed at the center of the rear end of the output motor 19 through the support base 22, the chip discharge groove 21 is formed at the front and rear bottom ends of the support base 22, the guide sliding grooves 23 are formed at both sides of the top of the support base 22, and the support side frame 13 can be ensured to move along a straight line by sliding the sliding key 17 inside the guide sliding groove 23.

As shown in fig. 5, the processing mechanism 2 includes a regulating device 24, an auxiliary cleaning device 25 and a positioning device 26, the regulating device 24 is fixedly installed on the top end of the positioning device 26, the auxiliary cleaning device 25 is fixedly installed at the bottom of the rear end of the regulating device 24, and the positioning device 26 is arranged to support the regulating device 24 to adjust the height up and down, and simultaneously perform polishing and cleaning operations of the surface of the package substrate by the auxiliary cleaning device 25.

As shown in fig. 6 and 7, the regulating device 24 includes a communicating pipe 27, an absorption cavity 28, a grinding wheel 29, a first gear 30, a T-shaped bracket 31, air cylinders 32, an extension base rod 33 and a second connecting frame 34, the extension base rod 33 is fixedly installed between the two air cylinders 32, the T-shaped bracket 31 is fixedly installed at the bottom end of the extension base rod 33, the grinding wheel 29 is rotatably installed inside two sides of the T-shaped bracket 31, the first gear 30 is fixedly installed on the top end of the grinding wheel 29, the second connecting frame 34 is fixedly installed at the top end of the rear end of the T-shaped bracket 31, the absorption cavity 28 is symmetrically and fixedly installed at the bottom end of the second connecting frame 34, the communicating pipe 27 is fixedly installed at the top end of the rear end of the absorption cavity 28 far away from the grinding wheel 29, and the first gear 30 is long in length, so that when the grinding wheel 29 is adjusted in height up and down, the first gear 30 can still maintain a meshed state with the fourth gear 43, and power transmission is facilitated.

As shown in fig. 8, the auxiliary cleaning device 25 includes a second gear 35, a transmission toothed belt 36, a rotating rod 37, a third gear 38 and a nylon wiper 39, the second gear 35 and the third gear 38 are respectively engaged at two ends of the interior of the transmission toothed belt 36, the rotating rod 37 is fixedly mounted at the top center of the third gear 38, the nylon wiper 39 is fixedly mounted at the bottom center of the third gear 38, and when the grinding wheel 29 rotates, the nylon wiper 39 can be driven to rotate simultaneously, so that the nylon wiper 39 can wipe the surface of the package substrate.

As shown in fig. 9, the positioning device 26 includes a docking groove 40, a limiting groove 41, a U-shaped bracket 42 and a fourth gear 43, the docking groove 40 is formed at two ends of the top of the U-shaped bracket 42, the limiting groove 41 is formed at the center of the top end of the U-shaped bracket 42, the fourth gear 43 is symmetrically and rotatably mounted at the top end of the U-shaped bracket 42, and when the grinding wheel 29 rises, the first gear 30 is driven to simultaneously penetrate through the docking groove 40 upwards, so as to prevent interference between the first gear 30 and the U-shaped bracket 42.

The front end central thread of first link 14 cup joints on threaded rod 20, sliding key 17 slides and pegs graft in the inside of direction spout 23, the bottom fixed mounting of cylinder 32 is on the top of U type support 42, and extend the inside of base rod 33 slip grafting at spacing groove 41, the inboard meshing of first gear 30 and fourth gear 43, the outside meshing of rack 12 and fourth gear 43, second gear 35 fixed mounting is on the outer lane of first gear 30, dwang 37 rotates and installs the inside top at second link 34, and nylon brush 39 is located the inner circle of absorption cavity 28, can support nylon brush 39 and third gear 38 and rotate.

The two ends of the bottom of the U-shaped sliding key 18 are both arranged in a 45-degree slope, a threaded hole matched with the threaded rod 20 is formed in the center of the front end of the first connecting frame 14, the rotating support plate 9 is rotatably installed at the front end, close to the contact scraper 15, of the supporting side frame 13, the bottom end of the rotating support plate 9 is flush with the top end of the supporting base 22, the bottom end of the contact scraper 15 is attached to the bottom end of the inside of the supporting base 22, the U-shaped sliding key 18 is respectively aligned with the first stop block 3 and the second stop block 5, the front surface and the rear surface of the extending base rod 33 are marked with scale marks, the inside of the absorption cavity 28 is arranged in a hollow state, the communicating pipe 27 is communicated with the absorption cavity 28, the lower edge of the absorption cavity 28 is higher than the bottom ends of the polishing wheel 29 and the nylon sweeper 39, a plastic strip is fixedly installed at the bottom end of the clamping strip 11, the first gear 30 is vertically aligned with the butt joint groove 40, and the first gear 30 can penetrate through the U-shaped support 42 to move upwards.

s1, firstly, placing a packaging substrate to be processed on the surface of a rotating support plate 9, then starting an output motor 19 to drive a threaded rod 20 to rotate, so that a first connecting frame 14 and a supporting side frame 13 integrally move towards the rear end, and a U-shaped sliding key 18 can move below the first stop block 3, so that a clamping strip 11 can clamp and fix the packaging substrate above the rotating support plate 9;

s2, when the supporting side frame 13 drives the rotating support plate 9 to move to the position below the nickel plating equipment 4, the nickel plating operation of the basic surface of the package can be carried out, and when the package substrate enters the bottom end of the polishing wheel 29, the rack 12 drives the fourth gear 43 and the first gear 30 to rotate, so that when the package substrate is in contact with the polishing wheel 29, the first gear 30 can drive the polishing wheel 29 to polish redundant nickel layers on the package substrate;

s3, when the grinding wheel 29 rotates, the second gear 35, the third gear 38 and the nylon brush 39 can be driven to rotate simultaneously, so that when the packaging substrate enters the bottom end of the nylon brush 39, residual nickel metal residues on the packaging substrate can be swept away, and meanwhile, the absorption cavity 28 is arranged on outer rings of the grinding wheel 29 and the nylon brush 39, so that the absorption cavity 28 can absorb the dropped nickel metal residues;

and S4, when the support side frame 13 moves to the limit position above the support base 22, the rotating support plate 9 can be driven to move to the position above the guide sliding plate 6, at the moment, the rotating support plate 9 can rotate downwards by an angle until the rotating support plate 9 is attached to the surface of the guide sliding plate 6, so that the packaging substrate on the rotating support plate 9 slides downwards from the surface of the guide sliding plate 6, and the packaging substrate conveying work is completed.

The working principle of the embodiment 1 is as follows: when the packaging substrate packaging machine is used, the output motor 19 is started firstly, the threaded rod 20 is driven to rotate anticlockwise, when the threaded rod 20 rotates, the first connecting frame 14 and the supporting side frame 13 can be driven to slide towards the front end on the top end of the supporting base 22, at the moment, when the supporting side frame 13 moves forwards, the U-shaped sliding key 18 can be driven to be in contact with the first stop block 3, the surfaces of the first stop block 3 and the second stop block 5 are both arranged in a 45-degree slope mode, the U-shaped sliding key 18 can move upwards along the surface of the first stop block 3, when the first connecting frame 14 moves forwards to the limit position in the supporting base 22, the U-shaped sliding key 18 can be driven to move upwards to the limit position, meanwhile, when the U-shaped sliding key 18 rises, the clamping strip 11 can be driven to move upwards to the limit position, the external packaging substrate can be conveniently placed above the rotating support plate 9, at the moment, the output motor 19 can be started again, the threaded rod 20 is driven to rotate clockwise, so that the supporting side frame 13 moves towards the rear end on the supporting base 22, when the U-shaped sliding key 18 completely passes through the top end of the first stop block 3, the clamping strip 11 can be driven to move downwards to be fastened with the packaging substrate through the elasticity of the return spring 10, the plastic strip is fixedly arranged at the bottom end of the clamping strip 11, so that the clamping strip 11 can be prevented from extruding and damaging the packaging substrate, at the moment, when the threaded rod 20 continuously rotates, the first connecting frame 14 and the supporting side frame 13 can be driven to continuously move towards the rear end until the side frame enters the lower part of the nickel plating equipment 4, the nickel plating work on the surface of the packaging substrate can be carried out, when the supporting side frame 13 passes through the lower part of the nickel plating equipment 4, the supporting side frame can enter the bottom end of the polishing wheel 29, and can be in advance contacted with the fourth gear 43 through the rack 12, so that the first gear 30 can rotate when the polishing wheel 29 is not contacted with the packaging substrate, when the packaging substrate is contacted with the grinding wheel 29, the redundant uneven nickel layer on the packaging substrate can be ground, at the moment, when the packaging substrate enters the bottom end of the nylon brush 39, the grinding wheel 29 can drive the second gear 35 to rotate when rotating, and when the second gear 35 rotates, the transmission toothed belt 36 can drive the third gear 38 and the nylon brush 39 to rotate simultaneously, so that the nylon brush 39 can sweep away the metal debris remained on the surface of the packaging substrate, meanwhile, the communicating pipe 27 can be connected with an external absorption device, the absorption cavity 28 is positioned around the outer rings of the grinding wheel 29 and the nylon brush 39, when the external absorption device is started, the air in the communicating pipe 27 and the absorption cavity 28 can be absorbed, so that the absorption cavity 28 can respectively absorb the residues ground by the grinding wheel 29 and the residues swept away by the nylon brush 39, the probability of metal residues is reduced, at the moment, when the packaging substrate moves again, the U-shaped sliding key 18 can be driven to contact with the second stop block 5, so that the U-shaped sliding key 18 drives the clamping strip 11 to move upwards along the surface of the second stop block 5, when the first connecting frame 14 moves to a limit position in the supporting base 22, the rotating support plate 9 can be driven to align with the guide sliding plate 6, at the moment, the rotating support plate 9 can rotate downwards to be flush with the surface of the guide sliding plate 6, so that the packaging substrate can slide downwards along the rotating support plate 9, and the transmission work of the packaging substrate is completed, when the device is used, the contact scraper 15 can be driven to move at the bottom end in the supporting base 22 while the first connecting frame 14 moves, so that the metal residues falling from the bottom end in the supporting base 22 can be pushed to one direction, when the first connecting frame 14 moves to a front end or rear end limit position, the contact scraper 15 can push the metal residues to the inner part of the chip groove 21, the bottom end in the supporting base 22 can be prevented from accumulating metal residues, meanwhile, the nylon brush in the cleaning brush barrel 16 is attached to the surface of the threaded rod 20, the cleaning brush barrel 16 is respectively positioned at the front end and the rear end of the first connecting frame 14, the cleaning brush barrel 16 can clean the metal residues on the surface of the threaded rod 20, the phenomenon that the first connecting frame 14 is blocked when moving on the outer ring of the threaded rod 20 is avoided, when the depth of a polished nickel layer needs to be changed, the air cylinder 32 can be started to drive the extension base rod 33 to move up and down, the extension base rod 33 can drive the polishing wheel 29, the first gear 30, the T-shaped support 31, the second connecting frame 34, the absorption cavity 28 and the nylon brush 39 can be adjusted in height at the same time, the polishing depth of the polishing wheel 29 can be adjusted, meanwhile, the scale marks are marked on the front surface and the rear surface of the extension base rod 33, the extension base rod 33 slides in the limiting groove 41, the extension base rod 33 can drive the scale marks to correspond to the surface of the U-shaped support 42 when moving, the distance of the polishing wheel 29 can be accurately controlled, and the polishing depth can be adjusted.

Example 2

On the basis of embodiment 1, as shown in fig. 10, the supporting base 22 further includes a cylindrical rod 44 and a collecting cavity 45, the cylindrical rod 44 is symmetrically and fixedly installed at the bottom of the two ends of the supporting base 22, and the collecting cavity 45 is slidably inserted into the cylindrical rod 44.

In this embodiment, the collection cavity 45 can be slid onto the surface of the cylindrical rod 44 until the collection cavity 45 is moved to the position aligned with the chip discharge groove 21, so that the metal residues falling from the inside of the chip discharge groove 21 can be conveniently taken out, and meanwhile, when the metal residues accumulated in the collection cavity 45 reach a certain amount, the collection cavity 45 can be slid outwards from the cylindrical rod 44, so that the collection cavity 45 can be quickly taken out, and the metal residues in the collection cavity 45 can be conveniently poured out.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a power electronic components packaging substrate manufacturing installation, includes supporting mechanism (1) and direction slide (6), the top fixed mounting of supporting mechanism (1) has nickel plating equipment (4) and processing mechanism (2), just nickel plating equipment (4) are located the front end of processing mechanism (2), the front end top symmetry fixed mounting of supporting mechanism (1) has first dog (3), the rear end top symmetry fixed mounting of supporting mechanism (1) has second dog (5), direction slide (6) fixed mounting is on the rear end of supporting mechanism (1), its characterized in that: the supporting mechanism (1) comprises a transmission device (7) and a transmission device (8), the transmission device (7) is installed at the top end of the transmission device (8) in a sliding mode, the transmission device (7) comprises a rotating support plate (9), a return spring (10), a clamping strip (11), a rack (12), supporting side frames (13), a first connecting frame (14), a contact scraper (15), a cleaning brush cylinder (16), a sliding key (17) and a U-shaped sliding key (18), the cleaning brush cylinder (16) is fixedly installed at the center of the front end of the first connecting frame (14), the contact scraper (15) is fixedly installed at the bottom end of the first connecting frame (14), the supporting side frames (13) are symmetrically and fixedly installed at the rear end, departing from the cleaning brush cylinder (16), of the rotating support plate (9) is rotatably installed between the two supporting side frames (13) close to the front end of the cleaning brush cylinder (16), the return spring (10) is fixedly installed at the center of the inner side of the supporting side frames (13), the U-shaped sliding key (18) is installed at the top end of the clamping strip (11) and fixedly installed at the top end of the rack (11) and the sliding strip (18) is fixedly installed at the top end of the sliding support side frame (13), the sliding key (17) is fixedly arranged at the bottom end of the supporting side frame (13).

2. The manufacturing apparatus of the power electronic component package substrate according to claim 1, wherein: transmission (8) are including output motor (19), threaded rod (20), chip groove (21), support pedestal (22) and direction spout (23), output motor (19) fixed mounting is at the front end center of support pedestal (22), threaded rod (20) rotate and run through support pedestal (22) fixed mounting at the rear end center of output motor (19), chip groove (21) are seted up on the front and back bottom of support pedestal (22), the top both sides at support pedestal (22) are seted up in direction spout (23).

3. The manufacturing apparatus of a power electronic component package substrate according to claim 2, wherein: the treatment mechanism (2) comprises a regulating device (24), an auxiliary cleaning device (25) and a positioning device (26), wherein the regulating device (24) is fixedly arranged on the top end of the positioning device (26), and the auxiliary cleaning device (25) is fixedly arranged at the bottom of the rear end of the regulating device (24).

4. The manufacturing apparatus of a power electronic component package substrate according to claim 3, wherein: regulation and control device (24) are including communicating pipe (27), absorption cavity (28), the wheel of polishing (29), first gear (30), T type support (31), cylinder (32), extension basic pole (33) and second link (34), extend basic pole (33) fixed mounting two between cylinder (32), T type support (31) fixed mounting is in the bottom of extending basic pole (33), wheel of polishing (29) rotate and install inside the both sides of T type support (31), first gear (30) fixed mounting is on the top of wheel of polishing (29), second link (34) fixed mounting is in the rear end top of T type support (31), absorption cavity (28) symmetry fixed mounting is in the bottom of second link (34), communicating pipe (27) fixed mounting is kept away from the rear end top of wheel of polishing (29) at absorption cavity (28).

5. The manufacturing apparatus of a power electronic component package substrate according to claim 4, wherein: supplementary cleaning device (25) include second gear (35), transmission cingulum (36), dwang (37), third gear (38) and nylon brush (39), second gear (35) and third gear (38) mesh respectively at the inside both ends of transmission cingulum (36), dwang (37) fixed mounting is in the top center of third gear (38), nylon brush (39) fixed mounting is in the bottom center of third gear (38).

6. The manufacturing apparatus of a power electronic component package substrate according to claim 5, wherein: positioner (26) are including butt joint groove (40), spacing groove (41), U type support (42) and fourth gear (43), the top both ends at U type support (42) are seted up in butt joint groove (40), the top center at U type support (42) is seted up in spacing groove (41), fourth gear (43) symmetry is rotated and is installed on the inside top of U type support (42).

7. The manufacturing apparatus of a power electronic component package substrate according to claim 6, wherein: the front end central thread of the first connecting frame (14) is sleeved on the threaded rod (20), the sliding key (17) is inserted in the guide sliding groove (23) in a sliding mode, the bottom end of the air cylinder (32) is fixedly installed on the top end of the U-shaped support (42), the extension base rod (33) is inserted in the limiting groove (41) in a sliding mode, the first gear (30) is meshed with the inner side of the fourth gear (43), the rack (12) is meshed with the outer side of the fourth gear (43), the second gear (35) is fixedly installed on the outer ring of the first gear (30), the rotating rod (37) is rotatably installed on the top end of the inner portion of the second connecting frame (34), and the nylon sweeping brush (39) is located on the inner ring of the absorption cavity (28).

8. The manufacturing apparatus of a power electronic component package substrate according to claim 7, wherein: the utility model discloses a plastic brush, including U type feather key (18), rotation support plate (9), contact scraper blade (22), U type feather key (18), U type feather key (11), the bottom both ends of U type feather key (18) all are 45 slopes setting, the screw hole with threaded rod (20) looks adaptation is seted up at the front end center of first link (14), the front end rotation that rotation support plate (9) are close to first link (14) is installed on the front end that is close to contact scraper blade (15) is supported side frame (13), the bottom of rotation support plate (9) and the top parallel and level of support base (22), the bottom of contact scraper blade (15) and the laminating of the inside bottom of support base (22), U type feather key (18) align with first dog (3) and second dog (5) respectively, the front and back surface mark of extension base pole (33) has the scale mark, the inside of absorption cavity (28) is the hollow state setting, just communicating pipe (27) and absorption cavity (28) intercommunication, the lower edge of absorption cavity (28) is higher than the bottom of polishing sweepwheel (29) and nylon sweeper wheel (39), the bottom fixed mounting of brush strip (11), the plastic strip (30) is aligned with first plastic groove (40).

9. The manufacturing apparatus of a power electronic component package substrate according to claim 8, wherein: the supporting base (22) further comprises a cylindrical rod (44) and a collecting cavity (45), the cylindrical rod (44) is symmetrically and fixedly installed at the bottoms of the two ends of the supporting base (22), and the collecting cavity (45) is inserted on the cylindrical rod (44) in a sliding mode.

10. A manufacturing method of a power electronic component package substrate manufacturing apparatus, which uses the power electronic component package substrate manufacturing apparatus according to any one of claims 1 to 9, comprising the steps of:

s1, placing a packaging substrate to be processed on the surface of a rotating support plate (9), starting an output motor (19) to drive a threaded rod (20) to rotate, so that a first connecting frame (14) and a supporting side frame (13) integrally move towards the rear end, and a U-shaped sliding key (18) can move below the first stop block (3) so that a clamping strip (11) can clamp and fix the packaging substrate above the rotating support plate (9);

s2, when the supporting side frame (13) drives the rotating support plate (9) to move to the position below the nickel plating equipment (4), nickel plating on the basic surface of the package can be carried out, and when the package substrate enters the bottom end of the polishing wheel (29), the rack (12) drives the fourth gear (43) and the first gear (30) to rotate, so that when the package substrate is in contact with the polishing wheel (29), the first gear (30) drives the polishing wheel (29) to polish redundant nickel layers on the package substrate;

s3, when the grinding wheel (29) rotates, the second gear (35), the third gear (38) and the nylon sweeper (39) can be driven to rotate simultaneously, so that when the packaging substrate enters the bottom end of the nylon sweeper (39), the residual nickel metal residues on the packaging substrate can be swept away, and meanwhile, the absorption cavity (28) is arranged on the outer rings of the grinding wheel (29) and the nylon sweeper (39), so that the absorption cavity (28) can absorb the dropped nickel metal residues;

s4, when the support side frame (13) moves to the limit position above the support base (22), the rotating support plate (9) can be driven to move to the upper side of the guide sliding plate (6), at the moment, the rotating support plate (9) can rotate downwards by an angle until the rotating support plate (9) is attached to the surface of the guide sliding plate (6), so that the packaging substrate on the rotating support plate (9) slides downwards from the surface of the guide sliding plate (6), and the packaging substrate conveying work is completed.