CN115837764A - 使用了用于造形物的支架构件的造形装置和造形方法 - Google Patents
使用了用于造形物的支架构件的造形装置和造形方法 Download PDFInfo
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- CN115837764A CN115837764A CN202211492433.4A CN202211492433A CN115837764A CN 115837764 A CN115837764 A CN 115837764A CN 202211492433 A CN202211492433 A CN 202211492433A CN 115837764 A CN115837764 A CN 115837764A
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- 238000000034 method Methods 0.000 title claims description 29
- 238000000465 moulding Methods 0.000 title description 24
- 238000007493 shaping process Methods 0.000 claims abstract description 63
- 239000000463 material Substances 0.000 claims abstract description 42
- 239000012778 molding material Substances 0.000 claims abstract description 14
- 239000007791 liquid phase Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000000470 constituent Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 20
- 238000001723 curing Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
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- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211492433.4A CN115837764A (zh) | 2022-11-25 | 2022-11-25 | 使用了用于造形物的支架构件的造形装置和造形方法 |
JP2023004172U JP3245977U (ja) | 2022-11-25 | 2023-11-20 | 造形物のためのホルダー部材を用いた造形装置及び造形法 |
CN202323162439.8U CN221476244U (zh) | 2022-11-25 | 2023-11-22 | 使用了用于造形物的支架构件的造形装置 |
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CN202211492433.4A CN115837764A (zh) | 2022-11-25 | 2022-11-25 | 使用了用于造形物的支架构件的造形装置和造形方法 |
Publications (1)
Publication Number | Publication Date |
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CN115837764A true CN115837764A (zh) | 2023-03-24 |
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Family Applications (2)
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CN202211492433.4A Pending CN115837764A (zh) | 2022-11-25 | 2022-11-25 | 使用了用于造形物的支架构件的造形装置和造形方法 |
CN202323162439.8U Active CN221476244U (zh) | 2022-11-25 | 2023-11-22 | 使用了用于造形物的支架构件的造形装置 |
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CN202323162439.8U Active CN221476244U (zh) | 2022-11-25 | 2023-11-22 | 使用了用于造形物的支架构件的造形装置 |
Country Status (2)
Country | Link |
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JP (1) | JP3245977U (ja) |
CN (2) | CN115837764A (ja) |
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2022
- 2022-11-25 CN CN202211492433.4A patent/CN115837764A/zh active Pending
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2023
- 2023-11-20 JP JP2023004172U patent/JP3245977U/ja active Active
- 2023-11-22 CN CN202323162439.8U patent/CN221476244U/zh active Active
Also Published As
Publication number | Publication date |
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CN221476244U (zh) | 2024-08-06 |
JP3245977U (ja) | 2024-03-11 |
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