CN115835595A - Heat dissipation device and electronic device - Google Patents

Abstract

The application discloses heat abstractor and electron device. The heat dissipation device is used for dissipating heat of electronic devices arranged in the heat dissipation device and comprises a plurality of substrates, sealing elements and elastic elements. The plurality of substrates are arranged at intervals along a first direction, one of two adjacent substrates is a first substrate, the other substrate is a second substrate, and one side of the first substrate, which faces the second substrate, is provided with a groove for accommodating an electronic device; the sealing element is connected between two adjacent substrates and surrounds the two adjacent substrates to form an accommodating space which is used for accommodating a heat dissipation medium; the accommodating space is located to the elastic component, and elastic component one end is used for being connected with the electron device that is located the recess, and the other end is connected with the second base plate. According to the heat dissipation device and the electronic device, the heat dissipation efficiency can be improved.

Description

Heat dissipation device and electronic device

Technical Field

The application belongs to the technical field of radiators, and particularly relates to a heat dissipation device and an electronic device.

Background

The electronic device can produce a large amount of heat in the course of working, and the working performance of electronic device can be seriously influenced by the accumulation of heat, usually adopt heat abstractor to absorb the heat that electronic device during operation produced, then in dispelling the external environment with the heat. The connection between the electronic device and the heat dissipation device directly affects the efficiency of transferring heat of the electronic device to the heat dissipation device, the connection between the existing heat dissipation device and the electronic device is usually direct bonding, and the heat contact between the heat dissipation device and the electronic device is poor, so that the heat dissipation channel is not smooth, and the heat dissipation efficiency is affected.

Disclosure of Invention

The embodiment of the application provides a heat dissipation device and an electronic device, which can improve the heat dissipation efficiency.

The embodiment of the first aspect of the present application provides a heat dissipation device for dissipating heat of an electronic device disposed in the heat dissipation device, where the heat dissipation device includes a plurality of substrates, a sealing member, and an elastic member. The plurality of substrates are arranged at intervals along a first direction, one of two adjacent substrates is a first substrate, the other substrate is a second substrate, and one side of the first substrate, which faces the second substrate, is provided with a groove for accommodating an electronic device; the sealing element is connected between two adjacent substrates and surrounds the two adjacent substrates to form an accommodating space which is used for accommodating a heat dissipation medium; the accommodating space is located to the elastic component, and elastic component one end is used for being connected with the electron device that is located the recess, and the other end is connected with the second base plate.

According to an embodiment of the first aspect of the present application, the first substrate includes an inner surface facing the second substrate and a first surface on a side of the first substrate in the second direction, and the recess includes a first opening in the first surface and a second opening in the inner surface, and the first direction and the second direction intersect.

According to any of the embodiments of the first aspect of the present application, the heat dissipation device further includes a barrier layer for sealing the second opening, and the elastic member is connected to the electronic device through the barrier layer.

According to any one of the embodiments of the first aspect of the present application, the heat dissipation device further includes a heat conductive layer disposed on an inner wall of the recess.

According to any one of the foregoing embodiments of the first aspect of the present application, the heat dissipation device further includes a third substrate, the third substrate is located on a side of the first substrate away from the second substrate, a groove is disposed on a side of the third substrate facing the first substrate, and a projection of the groove of the first substrate and a projection of the groove of the third substrate along the first direction are dislocated.

According to any one of the embodiments of the first aspect of the present application, the first substrate is provided with a heat dissipation pillar, and the heat dissipation pillar is connected to a surface of the first substrate away from the groove.

According to any one of the preceding embodiments of the first aspect of the present application, at least one of the substrates comprises a through hole provided therethrough, the through hole communicating two of the accommodation spaces adjacent in the first direction.

According to any of the preceding embodiments of the first aspect of the present application, the heat sink further comprises a medium inlet and a medium outlet, both of which are in communication with the receiving space.

According to any of the preceding embodiments of the first aspect of the present application, the plurality of base plates comprises a first end plate and a second end plate, and the medium inlet and the medium outlet are both provided in the first end plate, or both provided in the second end plate, or both provided in the first end plate and the second end plate.

An embodiment of the second aspect of the present application provides an electronic device, comprising an electronic device and the heat dissipation device as in any one of the first aspect, wherein the electronic device is disposed in the groove.

The heat dissipation device comprises a plurality of substrates, wherein the plurality of substrates are arranged at intervals along a first direction, and a groove is formed in the first substrate and used for accommodating an electronic device; the two adjacent substrates and the sealing element arranged between the two substrates surround to form an accommodating space, and a cooling medium is injected into the accommodating space to take away heat generated by the electronic device; one end of the elastic piece is connected with the second substrate, and the other end of the elastic piece is used for being connected with an electronic device located in the groove. Through setting up recess and elastic component, arrange the recess in with electron device, the recess plays certain limiting displacement to electron device to utilize the elastic deformation of elastic component, the elastic component of compression tightly presses electron device in the recess, makes the inner wall of electron device and recess closely laminate, and then makes the better transmission of the heat that electron device work produced to first base plate, improves the radiating efficiency.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a top view of a heat dissipation device according to an embodiment of a first aspect of the present application;

FIG. 2 isbase:Sub>A schematic cross-sectional view taken along line A-A of FIG. 1;

FIG. 3 is a front view of a heat dissipation device according to an embodiment of the first aspect of the present application;

fig. 4 is a schematic cross-sectional view of B-B in fig. 3.

Reference numerals are as follows:

10. a heat sink; 1. a substrate; 11. a first substrate; 111. a first surface; 112. an inner surface; 113. a heat-dissipating post; 12. a second substrate; 13. a groove; 131. a first opening; 132. a second opening; 14. a third substrate; 15. a first end plate; 16. a second end plate; 17. a through hole; 2. a seal member; 3. an elastic member; 4. an accommodating space; 5. a bolt; 6. a media inlet; 7. a media outlet; 8. a barrier layer; x, a first direction; y, second direction.

Detailed Description

Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are intended to be illustrative only and are not intended to be limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide an understanding of the present application by illustrating examples thereof, and in the drawings and the following description, at least some well-known structures and techniques are not shown in order to avoid unnecessarily obscuring the present application; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

It is noted that, herein, unless otherwise specified, "a plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like, indicate an orientation or positional relationship that is merely for convenience in describing the application and to simplify the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application. Moreover, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of another like element in a process, method, article, or apparatus that comprises the element.

The directional terms appearing in the following description are directions shown in the drawings and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless expressly stated or limited otherwise, the terms "mounted" and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected. It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region. The specific meaning of the above terms in the present application can be understood as appropriate by one of ordinary skill in the art.

During the operation of the electronic device, a large amount of heat is generated, and the accumulation of heat can seriously affect the operating performance of the electronic device. For example, power semiconductor modules, which are semiconductor components used in power electronic circuits, are commonly used in vehicles, solar energy, and industrial fields, such as inverters and rectifiers. When the power semiconductor module is in operation, a chip of the power semiconductor generates a large amount of heat, and the accumulation of the heat can seriously affect the operating performance of the power semiconductor module. As chips are developed toward high power and high integration, the problem of heat generation is increasingly prominent, and the requirement for heat dissipation is higher.

The existing heat dissipation devices are various, for example, stacked heat dissipation devices can be provided with different numbers of heat dissipation units to expand or reduce heat dissipation areas so as to adapt to different electronic devices, or can simultaneously dissipate heat of a plurality of electronic devices, thereby realizing integration and miniaturization. However, the existing stacked heat dissipation device only considers the heat dissipation structure of the heat dissipation device itself, and does not consider the thermal path connection between the heat dissipation device and the electronic device. The connection between the electronic device and the heat dissipation device directly affects the efficiency of transferring heat of the electronic device to the heat dissipation device, the connection between the existing heat dissipation device and the electronic device is usually direct bonding, and the heat contact between the heat dissipation device and the electronic device is poor, which can cause the unsmooth heat dissipation passage and affect the heat dissipation efficiency.

In order to solve the above problems, embodiments of the present invention provide a heat dissipation device and an electronic device, which can improve heat dissipation efficiency, and embodiments of the heat dissipation device and the electronic device will be described below with reference to the accompanying drawings.

Referring to fig. 1 to 4, in a first aspect of the present disclosure, a heat dissipation device 10 is provided for dissipating heat of an electronic device disposed in the heat dissipation device 10, where the heat dissipation device 10 includes a plurality of substrates 1, a sealing member 2, and an elastic member 3. The plurality of substrates 1 are arranged at intervals along a first direction X, one of two adjacent substrates 1 is a first substrate 11, the other substrate is a second substrate 12, a groove 13 is arranged on one side of the first substrate 11 facing the second substrate 12, and the groove 13 is used for accommodating an electronic device; the sealing element 2 is connected between two adjacent substrates 1 and surrounds the two adjacent substrates 1 to form an accommodating space 4, and the accommodating space 4 is used for accommodating a heat dissipation medium; the elastic member 3 is disposed in the accommodating space 4, and one end of the elastic member 3 is used for connecting with the electronic device located in the groove 13, and the other end is connected with the second substrate 12.

A heat dissipation medium is communicated between the two adjacent substrates 1 to take away heat transferred to the substrates 1 by the electronic devices, the heat conduction performance of the substrates 1 is good, and optionally, the substrates 1 are made of copper. The heat dissipation medium can be water or a mixed solution of water and glycol. Exemplarily, a heat dissipation channel is further disposed between the two substrates 1, and the heat dissipation medium flows along the heat dissipation channel. The multiple substrates 1 are fastened and connected through bolts 5, optionally, the number of the bolts 5 is 4, the substrate 1 is rectangular, and the 4 bolts 5 are respectively arranged at four corners of the substrate 1.

One of the two adjacent substrates 1 is a first substrate 11, the other is a second substrate 12, and a side of the first substrate 11 facing the second substrate 12 is provided with a groove 13. It should be understood that the same substrate 1, the adjacent substrate 1 with respect to it, may be either the first substrate 11 or the second substrate 12. Specifically, two substrates 1 adjacent to the same substrate 1 are respectively located at two sides of the substrate 1, and one of the two substrates 1 adjacent to the substrate 1 is a first substrate 11, and the other substrate may be the first substrate 11 or the second substrate 12. That is, on the adjacent two surfaces of the adjacent two substrates 1, the substrate 1 having the groove 13 is the first substrate 11, and the other substrate 1 is the second substrate 12.

The sealing member 2 may be connected to the edge of the substrate 1 to form a closed accommodating space 4 with two adjacent substrates 1, so as to prevent the heat dissipation medium from leaking to damage an external circuit or other structures. One end of the elastic part 3 is connected with the second substrate 12, after the electronic device is arranged in the groove 13, one end of the elastic part 3, which is far away from the first substrate 11, is abutted to the electronic device, and the compressed elastic part 3 enables the electronic device to be tightly attached to the bottom wall of the groove 13, so that the thermal contact resistance is reduced, and the heat dissipation efficiency is improved. Alternatively, the elastic member 3 is a spring.

In the heat dissipation device 10 of the embodiment of the application, the heat dissipation device 10 includes a plurality of substrates 1, the plurality of substrates 1 are arranged at intervals along a first direction X, and a groove 13 is formed in a first substrate 11 and used for accommodating an electronic device; two adjacent substrates 1 and a sealing element 2 arranged between the two substrates 1 surround to form an accommodating space 4, and a cooling medium is injected into the accommodating space 4 to take away heat generated by an electronic device; the elastic member 3 is provided with one end connected to the second substrate 12 and the other end for connecting to an electronic device located in the recess 13. Through setting up recess 13 and elastic component 3, arrange the electron device in recess 13, recess 13 plays certain limiting displacement to the electron device to utilize elastic deformation of elastic component 3, the elastic component 3 of compression tightly presses the electron device in recess 13, makes the inner wall of electron device and recess 13 closely laminate, and then makes the better transmission of the heat that electron device work produced to first base plate 11, improves the radiating efficiency.

In some alternative embodiments, the first substrate 11 includes an inner surface 112 facing the second substrate 12 and a first surface 111 on one side of the first surface 111 in the second direction Y, and the groove 13 includes a first opening 131 in the first surface 111 and a second opening 132 in the inner surface 112, and the first direction X intersects with the second direction Y. That is, the groove 13 communicates with the outside in both the first direction X and the second direction Y, and the elastic member 3 can abut on the electronic device located in the groove 13 via the second opening 132. The electronic device can be inserted into the recess 13 through the first opening 131 when mounted. Meanwhile, after the electronic device is mounted into the recess 13, the lead terminals can connect the electronic device and the external circuit via the first openings 131. Alternatively, the first openings 131 of the recesses 13 on the plurality of first substrates 11 face in the same direction, and the lead terminals are located on the same side of the substrate 1, so that the plurality of electronic devices can be directly connected to the external circuit.

In these alternative embodiments, the recess 13 has a first opening 131 and a second opening 132 to facilitate the mounting of the electronic device into the recess 13, and the elastic member 3 abuts against the electronic device.

In some alternative embodiments, the heat dissipation device 10 further comprises a barrier layer 8, the barrier layer 8 is used for sealing the second opening 132, and the elastic member 3 is used for connecting with the electronic device through the barrier layer 8. The barrier layer 8 serves to separate the recess 13 from the receiving space 4. The barrier layer 8 may be sized to cover only the second opening 132 of the recess 13, or may completely cover the inner surface 112 of the first substrate 11 to better separate the accommodating space 4 and the recess 13. Optionally, the barrier layer 8 is made of a flexible material, and one end of the elastic member 3 away from the second substrate 12 abuts against the barrier layer 8, so as to tightly press the electronic device in the groove 13. Optionally, the barrier layer 8 is a water barrier layer.

In these alternative embodiments, after the electronic device is installed in the recess 13 and the heat dissipation medium is introduced into the accommodating space 4, the barrier layer 8 isolates the electronic device from the heat dissipation medium, thereby preventing the heat dissipation medium from damaging the electronic device. The elastic element 3 is connected to the electronic device via the barrier layer 8, which tightly presses the electronic device in the recess 13.

In some alternative embodiments, the heat dissipation device 10 further includes a heat conduction layer (not shown) disposed on the inner wall of the recess 13. Optionally, the heat conducting layer is heat conducting silicone grease, and the heat conducting silicone grease has high heat conductivity and is an insulating material. The heat conductive layer is provided on the inner wall of the recess 13, it being understood that the heat conductive layer is provided at least on the bottom wall of the recess 13, so that heat generated by the electronic device can be transferred from the bottom wall of the recess 13 to the first substrate 11. The shape of the recess 13 can be adapted to the electronic device, the heat conducting layer is arranged on the bottom wall and the side wall of the recess 13, and the heat dissipation layer is completely contacted with the electronic device.

In these alternative embodiments, the heat conducting layer is disposed between the electronic device and the groove 13, so as to reduce the contact thermal resistance, so that the heat generated by the electronic device can be transferred to the first substrate 11 more quickly, and the heat dissipation efficiency is improved.

In some alternative embodiments, as shown in fig. 3, the heat dissipation device 10 further includes a third substrate 14, the third substrate 14 is located on a side of the first substrate 11 facing away from the second substrate 12, a side of the third substrate 14 facing the first substrate 11 is provided with a groove 13, and a projection of the groove 13 of the first substrate 11 and a projection of the groove 13 of the third substrate 14 are misaligned along the first direction X. It should be understood that the same substrate as opposed to a different substrate 1 may be the first substrate 11, the second substrate 12, or the third substrate 14. The number of the substrates 1 may be plural, and the three substrates 1 arranged in any series are the third substrate 14, the first substrate 11, and the second substrate 12, respectively.

In these alternative embodiments, the projections of the grooves 13 of the first substrate 11 and the grooves 13 of the third substrate 14 along the first direction X are misaligned, in other words, the projections of the grooves 13 on two adjacent substrates 1 along the first direction X are misaligned, so that heat generated by the electronic devices located in the grooves 13 is not concentrated in a certain area, and the electronic devices between the adjacent substrates 1 have less mutual influence, which is more beneficial to heat dissipation.

In some alternative embodiments, the first substrate 11 is provided with a heat dissipation pillar 113, and the heat dissipation pillar 113 is connected to a surface of the first substrate 11 away from the groove 13. The heat-dissipating stud 113 extends along the first direction X, and the shape of the heat-dissipating stud 113 may be cylindrical, elliptic cylindrical, quadrangular prism, drop-shaped, or the like. In these alternative embodiments, the heat dissipation pillar 113 is connected to the surface of the first substrate 11 away from the groove 13, the heat generated by the electronic device is transferred from the bottom wall of the groove 13 to the first substrate 11, the heat is higher in the area of the first substrate 11 near the groove 13, and the heat dissipation pillar 113 is arranged to increase the contact area with the heat dissipation medium, thereby further improving the heat dissipation efficiency.

Referring to fig. 3 and 4, in some alternative embodiments, the heat dissipation device 10 further includes a medium inlet 6 and a medium outlet 7, and both the medium inlet 6 and the medium outlet 7 are communicated with the accommodating space 4.

The number of media inlets 6 and media outlets 7 may be the same as the number of receiving spaces 4, i.e. one media inlet 6 and one media outlet 7 per receiving space 4. In this embodiment, the electronic devices between two adjacent layers of the substrates 1 have their own heat dissipation media, and the electronic devices on different layers are independent from each other in heat dissipation, and are not affected by each other, so that the heat dissipation phase ratio is high.

Alternatively, the number of the medium inlets 6 and the number of the medium outlets 7 may be one, and at least one of the substrates 1 includes a through hole 17 disposed therethrough, and the through hole 17 communicates two adjacent accommodating spaces 4 along the first direction X.

In these alternative embodiments, the through holes 17 are formed in the substrate 1 to communicate with the adjacent accommodating spaces 4, so that the heat dissipation medium can sequentially flow through all the accommodating spaces 4 after entering through the medium inlet 6, and finally flows out from the medium outlet 7, thereby achieving a heat dissipation effect on all the electronic devices in the heat dissipation apparatus 10. And after the plurality of accommodating spaces 4 are communicated, only one medium inlet 6 and one medium outlet 7 are required to be arranged, so that the processing is convenient.

In some alternative embodiments, the plurality of base plates 1 comprises a first end plate 15 and a second end plate 16, and the media inlet 6 and the media outlet 7 are both provided in the first end plate 15, or both provided in the second end plate 16, or both provided in the first end plate 15 and the second end plate 16. The first end plate 15 and the second end plate 16 are the base plates 1 located at both ends in the first direction X among the plurality of base plates 1.

In these alternative embodiments, whether the medium inlet 6 and the medium outlet 7 are disposed on the first end plate 15, the second end plate 16, or the first end plate 15 and the second end plate 16, the heat dissipation medium entering from the medium inlet 6 needs to flow through the entire accommodating space 4 before flowing out from the medium outlet 7, so as to dissipate heat from all electronic devices in the heat dissipation apparatus 10.

In a second embodiment of the present application, an electronic device is provided, which includes an electronic device and the heat dissipation device 10 as in any one of the foregoing first embodiments, where the electronic device is disposed in the recess 13. The number of substrates 1 of the heat sink 10 is set according to the number of electronic devices.

The electronic device has the related structure of the heat dissipation device 10 of the first aspect of the invention, which can be seen in the heat dissipation device 10 provided in the above embodiments, and has all the advantages of the heat dissipation device 10, and for avoiding repetition, the details are not described herein again.

In some alternative embodiments, the surface of the electronic device facing the recess 13 is provided with a second heat conducting layer, and the second heat conducting layer connects the electronic device and the inner wall of the recess 13, so as to reduce the contact thermal resistance, and enable the heat generated by the electronic device to be transferred to the heat dissipation device 10 more quickly.

In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and its practical application, to thereby enable others skilled in the art to best utilize the application and its various modifications as are suited to the particular use contemplated. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered within the scope of the present application.

Claims (10)

1. A heat dissipating device for dissipating heat from an electronic device disposed in the heat dissipating device, comprising:

the electronic device comprises a plurality of substrates, a plurality of first substrates and a plurality of second substrates, wherein the substrates are arranged at intervals along a first direction, one of the two adjacent substrates is a first substrate, the other substrate is a second substrate, one side of the first substrate, which faces the second substrate, is provided with a groove, and the groove is used for accommodating the electronic device;

the sealing element is connected between two adjacent substrates and surrounds the two adjacent substrates to form an accommodating space, and the accommodating space is used for accommodating a heat dissipation medium;

the elastic piece is arranged in the accommodating space, one end of the elastic piece is used for being connected with the electronic device positioned in the groove, and the other end of the elastic piece is connected with the second substrate.

2. The heat dissipating device of claim 1, wherein the first substrate comprises an inner surface facing the second substrate and a first surface on a side of the first substrate in a second direction, and the recess comprises a first opening in the first surface and a second opening in the inner surface, and the first direction intersects the second direction.

3. The heat dissipating device of claim 2, further comprising:

a barrier layer to seal the second opening, the elastomer to connect with the electronic device through the barrier layer.

4. The heat dissipating device of claim 1, further comprising:

and the heat conduction layer is arranged on the inner wall of the groove.

5. The heat dissipation device of claim 1, further comprising a third substrate, wherein the third substrate is located on a side of the first substrate facing away from the second substrate, a groove is disposed on a side of the third substrate facing the first substrate, and a projection of the groove of the first substrate and a projection of the groove of the third substrate are offset along the first direction.

6. The heat dissipating device of claim 1, wherein the first substrate has a heat dissipating stud disposed thereon, the heat dissipating stud being connected to a surface of the first substrate remote from the recess.

7. The heat dissipating device of claim 1, wherein at least one substrate includes a through hole provided therethrough, the through hole communicating two of the accommodating spaces adjacent in the first direction.

8. The heat dissipating device of claim 1, further comprising a media inlet and a media outlet, both of which communicate with the receiving space.

9. The heat dissipating device of claim 8, wherein the plurality of base plates comprises a first end plate and a second end plate, and wherein the media inlet and the media outlet are both disposed on the first end plate, both disposed on the second end plate, or both disposed on the first end plate and the second end plate.

10. An electronic device comprising an electronic component and the heat dissipating device of any of claims 1 to 9, wherein the electronic component is disposed in the recess.

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