CN115835585A - Graphene phase-change heat-conducting assembly structure and preparation method thereof - Google Patents
Graphene phase-change heat-conducting assembly structure and preparation method thereof Download PDFInfo
- Publication number
- CN115835585A CN115835585A CN202211481626.XA CN202211481626A CN115835585A CN 115835585 A CN115835585 A CN 115835585A CN 202211481626 A CN202211481626 A CN 202211481626A CN 115835585 A CN115835585 A CN 115835585A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- micro
- conducting
- graphene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a graphene phase change heat conduction assembly structure and a preparation method thereof, and relates to the technical field of heat dissipation equipment. This heat conduction subassembly mainly combines together phase transition technique and graphite alkene material, make intensity height, it is corrosion-resistant, the heat conductivity is high, light-weighted graphite alkene phase transition heat conduction subassembly, be provided with phase transition material's microtube in graphite alkene phase transition heat conduction subassembly, and use it in the equipment that needs quick heat dissipation, utilize above-mentioned phase transition technique and graphite alkene material splendid heat conductivity, and graphite alkene material ultralight, superstrong, corrosion-resistant, super tough characteristic, provide the best heat conduction effect for the product, make various products of using this material have extremely high thermal response speed, guarantee the performance stability of product, and can wide application in different environment in the scene, reduce the excessive waste or the loss of some necessary energy.
Description
Technical Field
The invention relates to the technical field of heat dissipation equipment, in particular to a graphene phase-change heat conduction assembly structure and a preparation method thereof.
Background
The common problem needs to be overcome for 3C products, LED lamps, battery modules and power generation and storage equipment of photovoltaic cells, namely the heat dissipation problem of the products. Along with the light weight and the convenience of electronic component products are required to be improved continuously, the product volume is smaller and smaller, the functions are more and more abundant, the number of integrated modules is more and more, and the requirement on the heat dissipation capacity of the product is more and more severe.
Common heat dissipation components include metal sheet heat dissipation, heat conduction silicon chip heat dissipation, alumina ceramics and the like, and generally, the heat in a product is absorbed by utilizing the rapid heat conduction performance of metals such as copper and aluminum or heat conduction silica gel and alumina materials, and the heat is dissipated to the ambient environment by utilizing the temperature difference.
For example, chinese patent publication No. CN105676977A discloses a copper-aluminum combined heat sink, in which an aluminum base is provided with a heat-conducting copper column, the other end of the heat-conducting copper column penetrates through the aluminum base, an aluminum heat sink integrated with the aluminum base is provided above the aluminum base, and the heat sink is centered on the heat-conducting copper column and tightly combined with the heat-conducting copper column.
The radiator is manufactured based on the heat-conducting property of copper and aluminum, and the whole radiating effect is excellent. However, the size of the heat dissipation assembly is limited to a certain extent due to the smaller volume of the product, and for the small-sized copper-aluminum heat dissipation assembly, the heat dissipation performance is weak, which results in poor heat dissipation effect of the product.
Disclosure of Invention
Aiming at the technical problems, the invention overcomes the defects of the prior art and provides a graphene phase-change heat-conducting component structure and a preparation method thereof.
In order to solve the technical problems, the invention provides a graphene phase-change heat-conducting component structure and a preparation method thereof.
The technical effects are as follows: the phase change heat dissipation and the matching of the graphene material are applied to various fields needing quick heat dissipation, the phase change technology and the excellent heat conductivity of the graphene material and the ultra-light, ultra-strong and ultra-tough characteristics of the graphene material are utilized to provide the best heat conduction effect for products, so that various products using the material have extremely high thermal response rate, the performance stability of the products is ensured, the phase change heat dissipation and the graphene material can be widely applied to different environments in scenes, and the excessive waste or loss of necessary energy is reduced.
The technical scheme of the invention is further defined as follows: a preparation method of a graphene phase-change heat-conducting component structure comprises the following steps:
s1, taking a certain amount of graphene powder, adding the graphene powder into a heat-conducting adhesive, and uniformly mixing to obtain an adhesive solution;
s2, adding the obtained glue solution into an injection molding machine, injecting the glue solution into a mold through the injection molding machine, cooling, molding and demolding to obtain a heat conduction assembly;
and S3, after the micro-pipeline is formed in the heat conducting assembly, injecting a phase change material into the micro-pipeline, sealing the micro-pipeline to obtain the graphene phase change heat conducting plate, and applying the graphene phase change heat conducting plate to a specified heat conducting device.
Further, the micro-pipe is formed in step S2 by reserving a micro-pipe forming portion in the mold, so that the demolded heat conducting plate forms a portion of the micro-pipe in advance.
In the foregoing method for manufacturing the graphene phase-change heat-conducting component structure, in the step S2, the micro-pipe is formed in a manner that after the heat-conducting plate is formed, post-forming of the micro-pipe is completed by machining or precision etching.
The invention also provides a graphene phase-change heat-conducting component structure which is prepared by the preparation method of any graphene phase-change heat-conducting component structure, the prepared heat-conducting component does not have any metal component, and a three-dimensional heat-radiating structure is formed in a micro-pipeline formed in the heat-conducting component in a post-processing mode, so that the volume and the weight of the heat-conducting component structure are greatly reduced.
The invention has the beneficial effects that:
(1) In the invention, phase change heat dissipation is the best known heat dissipation technology, and generally, materials matched with the phase change heat dissipation are all metal materials, such as metal copper, aluminum and the like; the graphene material is a known substance with the highest hardness, the heat conductivity of the graphene material is superior to that of a metal material, after the graphene material is combined with a phase change material, the volume required by a heat dissipation structure can be greatly reduced, and the heat dissipation efficiency of the graphene material and the phase change material is far higher than that of the metal material under the same volume, so that the heat dissipation component has the advantages that the heat dissipation component manufactured by combining the graphene material and the phase change material is lighter in weight, higher in strength, smaller in volume, thinner in thickness, and ultra-light, ultra-strong and ultra-tough, and can be the best solution for heat dissipation at present when being applied to heat dissipation of various electronic products and new energy equipment;
(2) In the invention, any metal component is not applied at all, only the combination of the graphene material and the phase change material is adopted, and the micro-pipeline formed by the post-manufacturing is easier to form a three-dimensional heat dissipation structure, so that the volume and the weight of the whole heat dissipation structure can be greatly reduced;
(3) In the invention, after the micro-pipeline is formed in the heat conducting plate, the composite phase change material can be conveniently injected into the heat conducting plate, and after the injection is finished, the opening of the micro-pipeline is sealed and bonded; phase change materials have the ability to change their physical state over a range of temperatures. Taking solid-liquid phase change as an example, when the material is heated to a melting temperature, the material generates phase change from a solid state to a liquid state, and in the melting process, the phase change material absorbs and stores a large amount of latent heat; when the phase-change material is cooled, the stored heat is radiated to the environment within a certain temperature range to carry out reverse phase change from liquid state to solid state; when the physical state changes, the temperature of the material is almost kept unchanged before the phase change is completed, a wide temperature platform is formed, and although the temperature is unchanged, the latent heat absorbed or released is quite large, so that the graphene heat conducting plate can achieve the effect of rapid heat conduction when being applied to the graphene heat conducting plate;
(4) In the invention, as the thermal conductivity of the phase change material is as high as 10000W/m.K, which is 100 times that of aluminum, and the thermal conductivity of the graphene material is as high as 5300W/m.K, the combination of the two can ensure that the heat dissipation part is thinner and lighter, and the product can be quickly cooled under the condition of reducing the volume;
(5) According to the invention, the phase change heat dissipation and the graphene material are matched with each other, and the phase change technology and the graphene material have excellent heat conductivity and the characteristics of ultralight weight, superstrong, corrosion resistance and ultratough graphene material are utilized to provide the optimal heat conduction effect for the product, so that various products using the material have extremely high thermal response rate, the performance stability of the product is ensured, and the phase change heat dissipation and graphene material can be widely applied to different environments in scenes to reduce excessive waste or loss of necessary energy.
Drawings
FIG. 1 is a schematic structural view of a housing;
FIG. 2 is a schematic diagram of the distribution of micro-tubes in a heat dissipation assembly;
FIG. 3 is a schematic view of the lamp housing;
FIG. 4 is a schematic structural view of a heat dissipating part with constant-speed spiral-shaped micro-pipes;
FIG. 5 is a schematic structural view of heat dissipation portions of micro-pipes distributed equidistantly;
FIG. 6 is a block diagram of a heat dissipation module;
fig. 7 is a schematic distribution diagram of micro-pipes in a heat dissipation module.
Wherein: 1. a housing; 11. a controller; 12. a control circuit; 13. a main circuit; 2. a heat dissipating component; 21. a heat radiation fan; 22. a heat dissipation channel; 23. a heat dissipating fin; 24. a heat dissipation side plate; 25. a heat dissipation top plate; 3. a lamp housing; 31. a lamp tube; 32. a handle; 33. a mounting seat; 4. a heat dissipating section; 41. a heat dissipating fin; 5. a circuit board; 51. a housing; 6. a heat dissipation module; 61. a heat dissipation seat plate; 62. a heat dissipation inner plate; 63. a heat-conducting fan; 64. a heat dissipating through hole; 65. a heat-dissipating side hole; 66. a heat conductive fin; 7. a micro-pipe; 71. closing the plate; 72. sealing the cover; 73. a straight line segment; 74. an arc segment; 75. a pipe.
Detailed Description
The purpose, technical scheme and advantages of the present invention will be more apparent, and the following detailed description will be provided in conjunction with the accompanying drawings and the detailed description. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the one element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The preparation method of the graphene phase change heat conduction assembly structure provided by the embodiment includes the following steps when the graphene phase change heat conduction assembly is prepared:
s1, taking a certain amount of graphene powder, adding the graphene powder into a heat-conducting adhesive, and uniformly mixing to obtain an adhesive solution;
s2, adding the obtained glue solution into an injection molding machine, injecting the glue solution into a mold through the injection molding machine, cooling, molding and demolding to obtain a heat conduction assembly;
and S3, after the micro-pipeline is formed in the heat conducting assembly, injecting a phase change material into the micro-pipeline, sealing the micro-pipeline to obtain the graphene phase change heat conducting plate, and applying the graphene phase change heat conducting plate to a specified heat conducting device.
In step S2, the microchannel may be integrally molded or may be formed by machining.
When the micro-pipe is integrally formed, a micro-pipe forming part can be reserved in the die, so that the demoulded heat conducting plate forms a part of the micro-pipe in advance.
When the micro-pipeline is formed by machining, the post-forming of the micro-pipeline can be completed by machining or precise etching after the heat conducting plate is formed.
The invention also provides a graphene phase-change heat-conducting component structure which is mainly prepared by the preparation method of any graphene phase-change heat-conducting component structure.
The invention is characterized in that no metal component is applied, the micro-pipeline formed by post-manufacturing is easier to form a three-dimensional heat dissipation structure, the volume and the weight of the whole heat dissipation structure can be greatly reduced, and the heat dissipation effect is better.
The heat-conducting performance of the phase-change material and the heat-conducting component is an important index for evaluating the performance of the phase-change material and the heat-conducting component. The thermal conductivity of the heat conducting plate in S2 and the graphene phase change heat conducting plate in S3 are measured by a thermal constant analyzer.
The test mode is that the heat conducting plate and the graphene phase-change heat conducting plate are respectively manufactured into two groups of round sheets with the same size, the diameter of each round sheet is 30mm, the thickness of each round sheet is 10mm, the round sheets are measured through a thermal constant analyzer, each group is tested twice, the average value is obtained, and the measurement results are shown in tables 1 and 2.
TABLE 1 thermal conductivity of Heat-conducting plates
Table 2 heat conductivity coefficient of graphene phase change heat conducting plate
Tables 1 and 2 show that the heat conductivity coefficient of the heat-conducting plate made of the graphene material is 866W/m.K, and after the micro-pipeline is added and the composite phase-change material is injected, the heat conductivity coefficient of the formed graphene phase-change heat-conducting plate is greatly improved to 1301W/m.K, the heat conductivity of the graphene phase-change heat-conducting plate is far stronger than that of common copper heat-radiating equipment, the weight of the graphene phase-change heat-conducting plate is far smaller than that of metal heat-radiating equipment, the convenience is greatly improved, and the superiority of the heat-conducting assembly is demonstrated.
Meanwhile, in tests, the heat conducting performance of the heat conducting plate is the best when the graphene powder accounts for 10-15% of the weight of all the substances.
The graphene phase change heat conduction plate prepared by the invention can be applied to various fields of automobile batteries, electronic products, radars and the like, and the graphene phase change heat conduction plate is mainly applied to 3C products, LED lamps, frequency converters or inverters to obtain a plurality of embodiments.
In embodiment 1, in this embodiment, the heat conducting assembly is mainly used for heat dissipation and temperature reduction of the frequency converter.
The inverter is a power control device for controlling an ac motor by changing the frequency of the operating power supply of the motor. The environmental working temperature of a common frequency converter is generally required to be-10-50 ℃, if the working temperature of the frequency converter can be reduced, the service life of the frequency converter can be prolonged, and the performance can be more stable. The heat generation of the frequency converter is mainly caused by internal loss, wherein the main part of the heat generation is the main circuit 13.
As shown in fig. 1, a main circuit 13 of the frequency converter is installed in a housing 1 in a clamping manner, a heat dissipation assembly 2 is arranged at the bottom of the housing 1, and the main circuit 13 is installed by being attached to the top of the heat dissipation assembly 2. The whole radiating component 2 is in the shape of a rectangular box, the top of the radiating component is a radiating top plate 25, two parallel radiating side plates 24 are arranged on two sides of the radiating component, and a radiating channel 22 is formed between the radiating side plates 24 and the radiating top plate 25.
As shown in fig. 1 and fig. 2, a heat dissipation fan 21 is fixedly installed at a front portion of the heat dissipation channel 22, and a plurality of parallel heat dissipation fins 23 are further disposed in the heat dissipation channel 22. Since the position of the inverter where the amount of heat generation is the largest is the middle main circuit 13, the heat radiation top plate 25 attached to the main circuit 13 receives the largest heat conduction pressure.
After the heat is absorbed by the heat dissipation top plate 25, the heat is conducted to the heat dissipation side plate 24 and the heat dissipation fins 23 in the heat dissipation channel 22, the heat dissipation side plate 24 directly forms heat exchange with the outside, and the heat dissipation fins 23 in the middle position realize rapid heat exchange through airflow formed by the heat dissipation fan 21 in the heat dissipation channel 22, so that the effect of rapid cooling is achieved.
Similarly, since the heat-dissipating top plate 25 is subjected to the maximum heat-conducting pressure, a corresponding heat-dissipating structure is required in the heat-dissipating top plate 25 to improve the heat-conducting effect. As shown in fig. 2, in the present embodiment, the entire heat dissipation top plate 25 is made of graphene material mixed with heat conducting glue, a plurality of parallel microchannels 7 are formed in the heat dissipation top plate 25, and heat conducting portions made of phase change materials are injected into the microchannels 7.
The heat conducting part is made of phase change material, because the heat conductivity of the phase change material is as high as 10000W/m.K, which is 100 times of that of metal aluminum, and a great amount of latent heat can be absorbed or released by utilizing the transformation of the physical property of the material. Therefore, the heat conducting portion can absorb heat of the main circuit 13 at the top position, and then release the heat at the bottom position, so that the heat can be dissipated through the fins and the heat dissipating passage 22.
The cross section of each micro-pipeline 7 is circular or rectangular, the diameter or the width of each micro-pipeline 7 is 2-10 mm according to the different thicknesses of the heat dissipation top plate 25, the distance between every two adjacent micro-pipelines 7 is 15-30 mm corresponding to the diameter or the width of each micro-pipeline 7, the shortest distance between the top position of each micro-pipeline 7 and the top surface of the heat dissipation top plate 25 is 2mm, and the shortest distance between the bottom position of each micro-pipeline 7 and the bottom surface of the heat dissipation top plate 25 is 1mm.
Since the thermal conductivity of the graphene material is weaker than that of the phase change material, the more the phase change material is injected into the heat dissipation top plate 25, the stronger the heat dissipation capability of the heat dissipation top plate 25 as a whole is, while the strength is ensured. Therefore, the diameter or width of the microchannel 7 needs to be adjusted according to the thickness of the heat dissipation top plate 25. And the circular shape is the shape with the largest contact surface, so that the cross section of the micro-pipe 7 is set to be circular to achieve the best heat dissipation effect.
The shortest distance between the top position of micro-pipeline 7 and the top surface of heat dissipation roof 25 sets up to 2mm, can guarantee the support nature of heat dissipation top surface to main circuit 13 and other parts, and the shortest distance sets up to 1mm between the bottom position of micro-pipeline 7 and the bottom surface of heat dissipation roof 25, can reduce the distance between phase change material and the heat dissipation channel 22 for heat-conduction promotes heat dispersion.
In the micro-pipe 7, the volume of the phase-change material accounts for 50-70% of the volume of the micro-pipe 7. Because the heat conduction of the phase-change material utilizes the structural change or the phase state change of the material per se to automatically release or absorb energy to the environment, the volume of the phase-change material is changed in the heat conduction process. The volume of the phase-change material is controlled in a certain degree of the volume of the micro-pipeline 7, so that the heat conduction effect can be ensured, the phenomenon that the phase change causes large pressure on the micro-pipeline 7 is avoided, and the overall heat conduction efficiency and the service life of the heat dissipation top plate 25 are ensured.
As shown in fig. 1 and 2, a sealing plate 71 is provided on the side surface of the heat dissipating top plate 25 at the position of the opening of the microchannel 7, and the sealing plate 71 is made of graphene material mixed with heat conductive adhesive and is adhered and fixed to the side surface of the heat dissipating top plate 25. The side surface of the closing plate 71 is formed with a sealing protrusion, the shape and size of the sealing protrusion are fitted with the shape of the opening of the micro-pipe 7, and the sealing protrusion is embedded in the opening of the micro-pipe 7 during connection.
The heat dissipation fins 23 and the heat dissipation side plates 24 in the present application may be made of a metal material or a graphene material. When the heat dissipation fins 23 are made of graphene materials, the best heat dissipation effect can be provided, and when the heat dissipation fins 23 are made of metal materials, the good heat dissipation effect can be guaranteed, and meanwhile, the production cost is reduced.
The specific implementation process comprises the following steps: the main circuit 13 is connected to the top surface of the heat dissipation top plate 25 to work, after heat is generated, the heat is conducted to the heat dissipation top plate 25, the heat dissipation top plate 25 made of graphene materials can conduct the heat to the phase change materials in the micro-pipeline 7 quickly, the phase change materials at the top absorb the heat, the phase change materials at the bottom conduct the bottom surface of the heat dissipation top plate 25, and finally heat dissipation is achieved through heat exchange between the heat dissipation fins 23 and the heat dissipation fan 21 and the outside.
As shown in fig. 3, the LED lamp includes a plurality of lamps 31 distributed around a central line, and the lamps 31 are installed in a lamp housing 3 having a disk shape. The handle 32 is fixed on the two sides of the lamp housing 3, so that a user can conveniently grab the whole LED lamp.
The reason that the LED lamp generates heat is that the added electric energy cannot be completely converted into light energy, partial electric energy is converted into heat energy, and the electro-optic conversion efficiency is 20-30%. The place with the largest heat productivity of the LED lamp mainly comprises two points, namely an LED chip and an LED lamp tube 31.
As shown in fig. 3 and 4, the LED chip is located at the bottom of the LED tube 31, so that the amount of heat generated from the center of the entire LED is the largest. The heat generated by the LED chip and the LED can rapidly raise the temperature of the middle position, and the LED lamp tube 31 and the LED chip can be rapidly shortened when the LED lamp tube is in a high-temperature working state for a long time.
Therefore, in the present embodiment, the heat dissipation portion 4 is disposed in the middle of the LED lamp, so as to increase the heat dissipation efficiency of the center of the LED lamp. As shown in fig. 3 and 4, since the LED lamp of the present embodiment has a disk shape as a whole, the heat dissipation portion 4 has a corresponding cylindrical shape. The entire heat dissipation portion 4 is injection-molded from a graphene material mixed with a heat conductive adhesive. Micro-pipes 7 are formed in the heat dissipation part 4, and the micro-pipes 7 are distributed in parallel to the horizontal plane and have two distribution modes.
As shown in fig. 3 and 4, the bottom of the heat dissipation portion 4 is provided with heat dissipation fins 41, and the heat dissipation fins 41 are provided with a plurality of fins around the centerline of the bottom of the heat dissipation portion 4, which are mainly used to increase the heat dissipation area of the bottom of the heat dissipation portion 4 and improve the efficiency of heat conduction. The heat dissipation fins 41 in this embodiment may be made of a metal material or a graphene material. The bottom of the heat dissipation fin 41 is connected with the mounting seat 33, and the whole LED lamp can be mounted at a designated position through the mounting seat 33.
In the first distribution mode, as shown in fig. 4, the microchannels 7 are distributed in an archimedean spiral shape as a whole, the microchannels 7 are integrally formed in the heat dissipating unit 4, the outermost end thereof extends to the outside of the heat dissipating unit 4 to form an opening, the opening is sealed by fitting a cover 72 made of graphene material, and the microchannels 7 are filled with a phase change material. The micro-pipes 7 in the shape of the constant-speed spiral can be uniformly distributed in the heat dissipation part 4, so that the overall heat dissipation effect of the heat dissipation part 4 is uniform.
In a second distribution mode, as shown in fig. 5, the microchannels 7 include a plurality of microchannels 7, the inner diameters of the microchannels 7 are different, but all the microchannels 7 are coaxially and equidistantly distributed, and each microchannel 7 is filled with a phase change material. A through pipe 75 communicated with all the micro-pipes 7 is arranged in the heat dissipation part 4 in the distribution manner, the through pipe 75 extends from the circle center position of the heat dissipation part 4 to the edge position of the heat dissipation part 4, and the tail end of the through pipe 75 is embedded and sealed by a sealing cover 72 made of graphene material.
In this embodiment, the volume of the phase change material injected into the micro-pipe 7 accounts for 50 to 70% of the total volume of the micro-pipe 7, the thickness of the heat dissipation portion 4 is 4 to 10mm, the diameter or width of the micro-pipe 7 is 1 to 7mm, the shortest distance between the top of the micro-pipe 7 and the top surface of the heat dissipation portion 4 is 2mm, and the shortest distance between the bottom of the micro-pipe 7 and the bottom surface of the heat dissipation portion 4 is 1mm.
In the specific implementation process, when the LED lamp is used, the lamp tube 31 and the LED chip are electrified to generate heat, and the heat is concentrated in the middle of the lamp. Through the heat dissipation part 4 arranged at the bottom of the middle position, heat can be quickly conducted to the phase change material in the micro-pipeline 7, through phase change, the heat is conducted to the bottom of the heat dissipation part 4, and the heat can be quickly dissipated to the surrounding environment through the heat dissipation fins 41 connected to the bottom, so that quick heat dissipation is realized.
As shown in fig. 6, the photovoltaic inverter is an inverter that converts the variable dc voltage generated by the solar panel into ac power with commercial frequency, and is used for feeding back a commercial power transmission system or for an off-grid power grid.
The good heat dissipation of the photovoltaic inverter is an important condition for ensuring the high-reliability operation of the photovoltaic inverter, and in the photovoltaic inverter, the position with the largest heat generation amount is also the circuit board 5 which mainly works, so the heat dissipation structure of the position of the circuit board 5 of the photovoltaic inverter is also optimized in the embodiment.
As shown in fig. 6 and 7, the photovoltaic inverter as a whole includes a housing 51 having a block shape, the circuit board 5 is embedded and fixed in a cavity formed in the housing 51, and three sides of the housing 51 are disposed around the circuit board 5 to surround the front side, the left side, and the right side of the circuit board 5, respectively. The bottom of the shell 51 is provided with a heat dissipation module 6, the main body of the heat dissipation module 6 is a heat dissipation seat plate 61 arranged at the bottom of the circuit board 5, and the shape of the heat dissipation seat plate 61 is the same as that of a cavity formed in the shell 51.
As shown in fig. 6 and 7, the bottom of the heat dissipation seat plate 61 is connected with a plurality of parallel heat conduction fins arranged at equal intervals. The rear of the heat dissipation seat plate 61 is provided with a heat dissipation inner plate 62, the heat dissipation inner plate 62 is perpendicular to the heat dissipation seat plate 61, and the heat dissipation inner plate 62 is fixedly attached to the rear side face of the circuit board 5. The rear of the heat dissipation inner plate 62 is connected with a heat conduction fan 63, and the heat conduction fan 63 is provided with a plurality of groups, which can drive the air flow in the shell 51 to circulate.
The heat dissipation inner plate 62 is provided with a heat dissipation through hole 64 at the middle position, and the heat dissipation through hole 64 communicates the heat conduction fan 63 and the cavity formed inside the outer shell 51. The right side of the heat dissipation module 6 is provided with a through hole, when the heat conduction fan 63 works, the air flow with high temperature in the housing 51 is sent out of the outside by the heat conduction fan 63 through the heat dissipation through hole 64, and the air flow with low outside temperature enters the housing 51 through various gaps and through holes. As shown in the figure, the side walls of the casing 51 on the left and right sides of the heat conducting fan 63 are provided with heat dissipating side holes 65, which are also for facilitating the circulation of air flow and the exchange of temperature.
As shown in fig. 7, the entire heat radiation seat plate 61 is formed by injection molding of a graphene material mixed with a heat conductive adhesive. The heat dissipation seat plate 61 is internally paved to form a micro-pipeline 7, and the phase-change material is injected into the micro-pipeline 7. The bottom of the heat dissipation seat plate 61 is provided with heat conduction fins 66, and the heat conduction fins 66 are provided with a plurality of blocks in parallel. In this embodiment, the distribution of the micro-pipes 7 is in the shape of a serpentine spring, and the micro-pipes 7 are uniformly distributed in the whole heat dissipation seat plate 61. The microchannel 7 includes a semicircular arc segment 74 and a linear segment 73.
As shown in fig. 7, the cross section of the micro duct 7 is circular or rectangular, the diameter or width thereof is 7mm, and the thickness of the whole heat dissipation seat plate 61 is 4-10 mm. The shortest distance between the top of the micro-pipeline 7 and the top surface of the heat dissipation seat plate 61 is 2mm, and the shortest distance between the bottom of the micro-pipeline 7 and the bottom surface of the heat dissipation seat plate 61 is 1mm. In the micro-pipe 7, the distance between adjacent straight line segments 73 is 20-30 mm.
The more densely the micro-pipes 7 are distributed in the heat dissipation base plate 61, the higher the content of the phase change material is, and the stronger the heat conduction capability of the whole heat dissipation base plate 61 is. The volume of the phase change material in the microchannel 7 accounts for 50-70% of the volume of the microchannel 7. One section of the microchannel 7 extends to the side position of the heat dissipation seat plate 61, and the side of the heat dissipation seat plate 61 is penetrated to form an opening, and phase change material can be injected from the opening position. The opening is sealed by fitting a cover 72 made of graphene material.
In this embodiment, the heat dissipation inner plate 62 has the same structure as the heat dissipation seat plate 61. The heat conducting fins at the bottom of the heat radiating seat plate 61 can be made of graphene materials, so that the optimal heat conducting effect is achieved; the heat dissipation structure can also be made of metal materials, so that the cost is reduced while a better heat dissipation effect is achieved.
The specific implementation process comprises the following steps: after the circuit board 5 is energized to generate heat, the generated heat is conducted and absorbed through the heat dissipation seat plate 61 at the bottom and absorbed through the heat dissipation inner plate 62 at the side position. The phase change material in the heat dissipation seat plate 61 and the heat dissipation inner plate 62 can absorb heat quickly, and the heat is transferred to the outside through the heat conduction fins at the bottom or the heat conduction fan 63 at the rear. In addition, the air generated by the heat-conducting fan 63 circulates, and an air flow is formed among the opening of the heat dissipation module 6, the cavity formed in the housing 51, the heat dissipation through hole 64, and the heat dissipation side hole 65, so that the air flow with a high temperature in the housing 51 is delivered to the outside, and the heat dissipation performance is further improved.
In addition to the above embodiments, the present invention may have other embodiments. All technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope of the claims of the present invention.
Claims (4)
1. A preparation method of a graphene phase-change heat-conducting component structure is characterized by comprising the following steps:
s1, taking a certain amount of graphene powder, adding the graphene powder into a heat-conducting adhesive, and uniformly mixing to obtain an adhesive solution;
s2, adding the obtained glue solution into an injection molding machine, injecting the glue solution into a mold through the injection molding machine, cooling, molding and demolding to obtain a heat conduction assembly;
and S3, after the micro-pipeline is formed in the heat conducting assembly, injecting a phase change material into the micro-pipeline, sealing the micro-pipeline to obtain the graphene phase change heat conducting plate, and applying the graphene phase change heat conducting plate to a specified heat conducting device.
2. The method for preparing the graphene phase-change heat-conducting component structure according to claim 1, wherein the method comprises the following steps: and S2, the micro-pipeline is formed in a manner that a micro-pipeline forming part is reserved in the die, so that the demoulded heat conducting plate forms a part of the micro-pipeline in advance.
3. The method for preparing the graphene phase-change heat-conducting component structure according to claim 1, wherein the method comprises the following steps: and the micro-pipeline in the S2 is formed in a mode that after the heat conducting plate is formed, post-forming of the micro-pipeline is completed through machining or precise etching.
4. A graphene phase-change heat-conducting component structure is characterized in that the graphene phase-change heat-conducting component structure is prepared by the preparation method of the graphene phase-change heat-conducting component structure according to any one of claims 1 to 5, the prepared heat-conducting component does not have any metal component, and a three-dimensional heat dissipation structure is formed in a micro pipeline formed in the heat-conducting component in a post-processing mode, so that the volume and the weight of the heat-conducting component structure are greatly reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211481626.XA CN115835585A (en) | 2022-11-24 | 2022-11-24 | Graphene phase-change heat-conducting assembly structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211481626.XA CN115835585A (en) | 2022-11-24 | 2022-11-24 | Graphene phase-change heat-conducting assembly structure and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115835585A true CN115835585A (en) | 2023-03-21 |
Family
ID=85531046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211481626.XA Pending CN115835585A (en) | 2022-11-24 | 2022-11-24 | Graphene phase-change heat-conducting assembly structure and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115835585A (en) |
-
2022
- 2022-11-24 CN CN202211481626.XA patent/CN115835585A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108390123B (en) | Power battery package thermal management system and car | |
| CN207651636U (en) | A kind of automobile power cell packet heat management system and automobile | |
| CN205825287U (en) | A kind of novel energy-conserving semiconductor-air regulation module | |
| CN208090582U (en) | Car light and vehicle | |
| CN207572501U (en) | Radiating subassembly and battery modules | |
| CN207588737U (en) | A kind of multiple electricity generation system of automobile and its automobile | |
| CN206595367U (en) | Heat management device and battery modules | |
| CN210668620U (en) | New energy automobile driving system | |
| CN115835585A (en) | Graphene phase-change heat-conducting assembly structure and preparation method thereof | |
| CN210014477U (en) | Radiator, air condensing units and air conditioner | |
| CN210014476U (en) | Radiator, air condensing units and air conditioner | |
| CN210014475U (en) | Radiator, air condensing units and air conditioner | |
| CN218632215U (en) | Battery package, thermal management system and vehicle | |
| CN206758609U (en) | Battery heat-conductive assembly and there is its battery bag | |
| CN113446883B (en) | Double-fluid loop staggered wave type micro-channel radiator based on elastic turbulence | |
| CN219918878U (en) | Graphene phase-change heat conduction assembly applied to photovoltaic inverter | |
| CN108807730B (en) | Layered electric automobile battery pack | |
| CN112770596B (en) | Integrated heat pipe heat dissipation water channel structure applied to double-motor controller | |
| CN210399239U (en) | Heat radiation component, radiator, air condensing units and air conditioner | |
| CN208547276U (en) | A kind of superconductive temperature equalizing radiator | |
| CN219809876U (en) | Graphene phase-change heat conduction assembly applied to LED lamp | |
| CN220023401U (en) | Graphene phase-change heat conduction assembly applied to electric appliance frequency converter | |
| CN110764598A (en) | Radiator, circuit board assembly and computing device | |
| CN220292410U (en) | Multi-medium composite heat dissipation double-sided cold plate | |
| CN212412129U (en) | Battery module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |