CN115831822B - Infusion system of wafer cleaning equipment - Google Patents
Infusion system of wafer cleaning equipment Download PDFInfo
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- CN115831822B CN115831822B CN202211617079.3A CN202211617079A CN115831822B CN 115831822 B CN115831822 B CN 115831822B CN 202211617079 A CN202211617079 A CN 202211617079A CN 115831822 B CN115831822 B CN 115831822B
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- mixing device
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- 238000004140 cleaning Methods 0.000 title claims abstract description 34
- 238000001802 infusion Methods 0.000 title claims abstract description 14
- 238000002156 mixing Methods 0.000 claims abstract description 159
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 80
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 62
- 238000005554 pickling Methods 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims description 37
- 238000001816 cooling Methods 0.000 claims description 25
- 238000003860 storage Methods 0.000 claims description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 16
- 239000001301 oxygen Substances 0.000 claims description 16
- 229910052760 oxygen Inorganic materials 0.000 claims description 16
- 239000000110 cooling liquid Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000004321 preservation Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims 1
- 239000011259 mixed solution Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 description 11
- 239000002253 acid Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- 239000012809 cooling fluid Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses an infusion system of wafer cleaning equipment, which comprises a pickling tank, a sulfuric acid supply source, a hydrogen peroxide supply source, a first mixing device, a second mixing device and a feedback control board; the first mixing device and the second mixing device comprise a mixing pipeline, a plurality of sections of mixing screws arranged in the mixing pipeline and a heater wrapped outside the mixing pipeline. The invention realizes the full mixing of sulfuric acid and hydrogen peroxide in a sectional mixing mode, achieves the accurate control of temperature, ensures the full reaction of the mixed solution, ensures that the mixed solution entering the pickling tank meets the cleaning requirement, and improves the quality and the efficiency of wafer cleaning.
Description
Technical Field
The invention belongs to a wafer cleaning process in the field of wafer manufacturing processes, and relates to an infusion system of wafer cleaning equipment.
Background
In the semiconductor wafer cleaning process, the trough type cleaning equipment is special equipment for cleaning common chemicals, and the trough type cleaning equipment has different matching schemes of the wafer cleaning process according to different wafer products. In common cleaning processes such as stripping, photoresist stripping or organic cleaning and removal of some metal surface structures or metal residues, sulfuric acid (H is often used 2 SO 4 ) With hydrogen peroxide (H) 2 O 2 ) And the active SPM-peroxosulfuric acid mixed solution formed by mixing ultrapure water is prepared to be clear according to the specific relative concentrationAnd cleaning the wafer by using a mixed solution of SPM, DSP+ and other active SPM-peroxosulfuric acid formed by adding ozone water. The active SPM-peroxosulfuric acid mixed solution can generate corrosion action on various semiconductor materials such as silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), common metals and organic matters with loose molecular chain structures so as to achieve the functions of cleaning, etching and removing, so that the active SPM-peroxosulfuric acid mixed solution is commonly used in the semiconductor wafer cleaning process.
SPM pickling process of tank equipment adopts a method of correspondingly providing sulfuric acid (H 2 SO 4 ) With hydrogen peroxide (H) 2 O 2 ) And after the source pipeline of the ultrapure water is input into the corresponding pipeline, the ultrapure water is conveyed to the corresponding pickling tank for cleaning preparation action through the corresponding conveying pipeline, the circulating pump, the filter, the subsequent mixing-temporary storage tank and the subsequent output pipeline. However, the conveying process has the defects of uneven mixing, large temperature control error and insufficient reaction. These problems may cause a fatal defect in the SPM pickling process of the tank type equipment, so that the cleaning ability is lowered.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to provide the infusion system of the wafer cleaning equipment which is uniform in mixing, accurate in temperature control and sufficient in reaction, so that the defects in the prior art are overcome.
In order to solve the technical problems, the invention adopts the following technical scheme:
the utility model provides an infusion system of wafer cleaning equipment, includes pickling tank, sulfuric acid supply source, hydrogen peroxide solution supply source, its characterized in that: the device also comprises a first mixing device, a second mixing device and a feedback control board;
the first mixing device and the second mixing device comprise a mixing pipeline, a plurality of sections of mixing screws arranged in the mixing pipeline and a heater wrapped outside the mixing pipeline;
the two main input ports of the first mixing device are respectively communicated with a sulfuric acid supply source and a hydrogen peroxide supply source through a main sulfuric acid pipeline and a main hydrogen peroxide pipeline, one main input port of the second mixing device is communicated with one main output port of the first mixing device, two auxiliary input ports of the second mixing device are respectively communicated with the sulfuric acid supply source and the hydrogen peroxide supply source through a sulfuric acid adjusting pipeline and a hydrogen peroxide adjusting pipeline, and the main output port of the second mixing device is communicated with the pickling tank;
the main output port of the first mixing device and the main output port of the second mixing device are respectively provided with a thermometer and an oxygen concentration meter, and flow valves are respectively arranged on the main sulfuric acid pipeline, the main hydrogen peroxide pipeline, the sulfuric acid regulation pipeline and the hydrogen peroxide regulation pipeline;
the heater, the thermometer, the oxygen concentration meter and the flow valve are all electrically connected with the feedback control board.
In the specific embodiment of the invention, the device further comprises a third mixing device and a cooling circulation device, wherein the third mixing device comprises a mixing pipeline, a plurality of sections of mixing screws arranged in the mixing pipeline, a heater and a cooling channel which are wrapped outside the mixing pipeline, a main input port of the third mixing device is communicated with a main output port of the second mixing device, a main output port of the third mixing device is communicated with the pickling tank, the cooling channel is provided with a cooling liquid inlet and a cooling liquid outlet, the cooling liquid inlet and the cooling liquid outlet are respectively communicated with a liquid outlet end and a liquid inlet end of the cooling circulation device through the cooling pipeline, the cooling circulation device is electrically connected with the feedback control board, and a temperature measuring instrument and an oxygen concentration instrument which are electrically connected with the feedback control board are also arranged at the main output port of the third mixing device.
In the specific embodiment of the invention, the pickling tank further comprises an auxiliary heater electrically connected with the feedback control board, wherein a liquid inlet of the auxiliary heater is communicated with a main output port of the third mixing device, and a liquid outlet of the auxiliary heater is communicated with the pickling tank.
In a specific embodiment of the invention, the SPM storage tank is further provided with a main output port of the first mixing device, which is respectively communicated with a main input port of the second mixing device and a first liquid inlet of the SPM storage tank through a three-way valve, a main output port of the second mixing device, which is respectively communicated with a main input port of the third mixing device and a second liquid inlet of the SPM storage tank through a three-way valve, is respectively communicated with a liquid inlet of the auxiliary heater and a third liquid inlet of the SPM storage tank through a three-way valve, and a liquid outlet of the SPM storage tank and a liquid outlet of the auxiliary heater are respectively communicated to the pickling tank through a three-way valve.
In a specific embodiment of the present invention, four three-way valves are all electrically connected to the feedback control board.
In a specific embodiment of the invention, the first mixing device, the second mixing device and the third mixing device are respectively provided with a pressure gauge and a pressure relief valve which are communicated with the inside of the mixing pipeline, and the pressure gauge and the pressure relief valve are respectively electrically connected with the feedback control board.
In a specific embodiment of the present invention, the heater is a heating pipe wound around the mixing pipe, the first mixing device and the second mixing device further include a heat insulation layer wrapping the heating pipe, and the cooling channel in the third mixing device is located outside the heating pipe and further includes a heat insulation layer wrapping the cooling channel.
By adopting the technical scheme, the invention realizes the full mixing of sulfuric acid and hydrogen peroxide in a sectional mixing mode, achieves the accurate control of temperature, ensures the full reaction of the mixed solution, ensures that the mixed solution entering the pickling tank meets the cleaning requirement, and improves the quality and the efficiency of wafer cleaning.
Drawings
FIG. 1 is a schematic diagram of a system architecture of the present invention;
FIG. 2 is a schematic view of a first mixing device;
FIG. 3 is a schematic diagram of a second mixing device;
FIG. 4 is a schematic structural view of a third mixing device;
fig. 5 is a block diagram of the electrical connections of the feedback control of the present invention.
Detailed Description
As shown in fig. 1, the infusion system of the wafer cleaning apparatus of the present invention includes a pickling tank 100, a first mixing device 200, a second mixing device 300, a third mixing device 400, a cooling circulation device 500, an SPM storage tank 600, an auxiliary heater 700, and a feedback control board 90.
As shown in fig. 2 to 4, each of the first mixing device 200, the second mixing device 300, and the third mixing device 400 includes a mixing pipe 11, a multi-section mixing screw 12 provided in the mixing pipe 11, a heater 13 wrapped around the mixing pipe 11, and a heat insulating layer 14 located outside the heater 13. The heater 13 of the present embodiment is a heating tube wound around the mixing pipe 11.
As shown in fig. 1 and 2, the first mixing device 200 has two main input ports 14a at the inlet end and one main output port 14b at the outlet end, and the two input ports 14a of the first mixing device are respectively connected to the sulfuric acid supply source 71 and the hydrogen peroxide supply source 72 through the main sulfuric acid pipeline 101 and the main hydrogen peroxide pipeline 102. The main sulfuric acid pipeline 101 and the main hydrogen peroxide pipeline 102 are respectively provided with a flow valve 85.
As shown in fig. 1 in combination with fig. 3, the second mixing device 300 has a main input port 14a at the inlet end, two auxiliary input ports 14c, and a main output port 14b at the outlet end. The two auxiliary input ports 14c of the second mixing device 300 are respectively connected to the sulfuric acid supply source 71 and the hydrogen peroxide supply source 72 through a sulfuric acid adjusting pipe 201 and a sulfuric acid adjusting pipe 202. The main input port 14a of the second mixing device 300 communicates with the output port 14b of the first mixing device 100 via a main conduit. The flow valves 85 are also provided on the adjusting sulfuric acid pipe 201 and the adjusting sulfuric acid pipe 202.
As shown in fig. 1 in combination with fig. 4, the third mixing device 400 is provided with a cooling circulation passage 24 between the heating pipe 13 and the heat insulating layer 14. The third mixing device 300 has a main input port 14a at the inlet end and a main output port 14b at the outlet end. The cooling passage 24 is provided with a cooling liquid inlet 24a and a cooling liquid outlet 24b. The cooling fluid inlet 24a and the cooling fluid outlet 24b are respectively connected to the liquid outlet end and the liquid inlet end of the cooling circulation device 500 through cooling pipes.
The main output port 14b of the first mixing device 200 communicates with the main input port 14a of the second mixing device 300 and the first liquid inlet of the SPM storage tank 600, respectively, through the first three-way valve 81.
The main output port 14b of the second mixing device 300 is respectively connected to the main input port 14a of the third mixing device 300 and the second liquid inlet of the SPM storage tank 600 through the second three-way valve 82.
The main output port 14b of the third mixing device 400 communicates with the liquid inlet of the sub-heater 700 and the third liquid inlet of the SPM storage tank 600 through the third three-way valve 83, respectively.
The liquid outlet of the SPM holding tank 600 and the liquid outlet of the auxiliary heater 700 are communicated with the liquid inlet of the pickling tank 100 through the fourth three-way valve 84.
The feedback control board 90 is electrically connected to the circulation cooling device 500, and is used for controlling the circulation cooling device 500 to introduce circulation cooling liquid into the third mixing device 400, so as to cool the mixture with excessive temperature entering the third mixing device 400, and reduce the temperature of the mixture to a proper temperature.
Referring to fig. 5, the feedback control board 90 is electrically connected to the heater 13 of the first mixing device 200, the heater 13 of the second mixing device 300, the heater 13 of the third mixing device 400, and the auxiliary heater 700, and the feedback control board 90 can obtain the temperatures fed back by the three heaters 13 and the auxiliary heater 700, and can control the three heaters 13 and the auxiliary heater 700 to perform heating operation.
The main output port of the first mixing device 200, the main output port of the second mixing device 300, and the main output port of the third mixing device 400 are respectively provided with a thermometer 91 and an oxygen concentration meter 92 in the pickling tank 100. The first mixing device 200, the second mixing device 300 and the third mixing device 400 are each equipped with a pressure gauge 93 and a pressure release valve 94 communicating with the inside of the mixing pipe 11, and these temperature gauges 91, oxygen concentration meter 92, pressure gauge 93 and pressure release valve 94 are also electrically connected to the feedback control board 90.
The first, second, third, and fourth three-way valves 81, 82, 83, 84 and the four flow valves 85 are also electrically connected to the feedback control board 90.
The above is the transfusion system of the wafer cleaning device, which has the following working modes:
the sulfuric acid in the sulfuric acid supply source 71 and the hydrogen peroxide in the hydrogen peroxide supply source 72 are respectively conveyed into the mixing pipeline 11 of the first mixing device 100 according to a set proportion through the main sulfuric acid pipeline 101 and the main hydrogen peroxide pipeline 102, the sulfuric acid and the hydrogen peroxide collide with the spiral surface of the mixing screw 12 to rotate when entering, the sulfuric acid and the hydrogen peroxide are mutually permeated through the shearing force generated by rotation, and finally the sulfuric acid and the hydrogen peroxide are fully and uniformly mixed through the collision and rotation actions of the multi-section mixing screw. The heater in the first mixing device 200 heats the mixed liquid in the pipe during the mixing process, and the heater feeds back the heating temperature to the feedback control board 90 on the one hand and controls the heating temperature of the heater according to the feedback temperature on the other hand during the heating process.
The temperature and oxygen concentration of the mixed liquid flowing out of the first mixing device 200 are monitored by the temperature measuring instrument 91 and the oxygen concentration instrument 92 at the main output port of the first mixing device 200, respectively, and fed back to the feedback control board 90. If the temperature is lower than the required temperature, the feedback control board 90 continues to heat the inflowing mixed liquid using the heater of the second mixing device 300 while the second mixing device 200 further mixes the mixed liquid. If the oxygen concentration is lower than the required concentration, indicating insufficient reaction, the feedback control board 90 opens the flow valves on the sulfuric acid adjusting pipeline 201 and the sulfuric acid adjusting pipeline 202 to add sulfuric acid and hydrogen peroxide to the second mixing device 300 according to a set proportion so as to make the reaction sufficient.
The temperature detector at the main output of the second mixing device 300 further monitors and feeds back to the feedback control board 90 the temperature of the mixed liquor exiting the second mixing device 200. If the temperature is higher than the required temperature, the feedback control board 90 controls the circulation cooler to introduce the circulation cooling liquid into the cooling channel of the third mixing device 300 to cool the mixed liquid, and if the temperature is lower than the required temperature, the feedback control board 90 controls the heater in the third mixing device 300 to heat the mixed liquid.
The temperature detector at the main output port of the third mixing device 400 further monitors the temperature of the mixed liquid flowing out of the third mixing device 200 and feeds back to the feedback control board 90, and if the temperature is still lower than the required temperature, the mixed liquid is continuously heated by the auxiliary heater 700, so that the mixed liquid finally meets the required temperature.
The oxygen concentration meter 92 at the main output port of the second mixing device 300 and the oxygen concentration of the mixed liquid flowing out from the main output port 92 of the third mixing device 400 are monitored and fed back to the feedback control board 90, and if the oxygen concentration at any place is lower than the required concentration, the feedback control board 90 opens the flow valves on the sulfuric acid adjusting pipeline 201 and the sulfuric acid adjusting pipeline 202 to add the input sulfuric acid and the hydrogen peroxide to the second mixing device 300 according to the set proportion so as to make the reaction complete.
During the mixing process, the pressure gauge monitors the pressures in the first, second and third mixing devices 200, 300 and 400 and feeds back to the feedback control board 90. Once the gas pressure in a certain mixing device exceeds a set value, the feedback control board 90 controls the pressure relief valve on the corresponding mixing device to be opened for pressure relief, so that the safety of the system is ensured.
If the mixed liquid output by any mixing device is fully mixed and the temperature and the oxygen concentration meet the requirements, the mixed liquid can be directly conveyed to the SPM storage tank for heat preservation and storage through the switching of the first three-way valve 81, the second three-way valve 82 and the third three-way valve 83 of the corresponding mixing device.
It is also possible to decide whether to supply the mixed liquor from the SPM holding tank 600 to the pickling tank 100 or directly from the regulating pipe by switching the fourth three-way valve 84.
Through the above detailed description, the invention realizes the full mixing of sulfuric acid and hydrogen peroxide in a sectional mixing mode, achieves the accurate control of temperature and ensures the full reaction of the mixed solution, thereby ensuring that the mixed solution entering the pickling tank meets the cleaning requirement and improving the quality and efficiency of wafer cleaning.
Claims (7)
1. The utility model provides an infusion system of wafer cleaning equipment, includes pickling tank, sulfuric acid supply source, hydrogen peroxide solution supply source, its characterized in that: the device also comprises a first mixing device, a second mixing device, a feedback control board, a third mixing device and a cooling circulation device;
the first mixing device and the second mixing device comprise a mixing pipeline, a plurality of sections of mixing screws arranged in the mixing pipeline and a heater wrapped outside the mixing pipeline;
the two main input ports of the first mixing device are respectively communicated with a sulfuric acid supply source and a hydrogen peroxide supply source through a main sulfuric acid pipeline and a main hydrogen peroxide pipeline, one main input port of the second mixing device is communicated with one main output port of the first mixing device, two auxiliary input ports of the second mixing device are respectively communicated with the sulfuric acid supply source and the hydrogen peroxide supply source through a sulfuric acid adjusting pipeline and a hydrogen peroxide adjusting pipeline, and the main output port of the second mixing device is communicated with the pickling tank;
the main output port of the first mixing device and the main output port of the second mixing device are respectively provided with a thermometer and an oxygen concentration meter, and flow valves are respectively arranged on the main sulfuric acid pipeline, the main hydrogen peroxide pipeline, the sulfuric acid regulation pipeline and the hydrogen peroxide regulation pipeline;
the third mixing device comprises a mixing pipeline, a plurality of sections of mixing screws arranged in the mixing pipeline, a heater and a cooling channel, wherein the heater and the cooling channel are wrapped outside the mixing pipeline, a main input port of the third mixing device is communicated with a main output port of the second mixing device, the main output port of the third mixing device is communicated with the pickling tank, the cooling channel is provided with a cooling liquid inlet and a cooling liquid outlet, and the cooling liquid inlet and the cooling liquid outlet are respectively communicated with a liquid outlet end and a liquid inlet end of the cooling circulation device through the cooling pipeline;
the heater, the thermometer, the oxygen concentration meter, the cooling circulation device and the flow valve are all electrically connected with the feedback control board; and a main output port of the third mixing device is provided with a thermometer and an oxygen concentration meter which are electrically connected with the feedback control board.
2. The wafer cleaning apparatus infusion system of claim 1, wherein: the device also comprises an auxiliary heater electrically connected with the feedback control board, wherein the inlet end of the auxiliary heater is communicated with the main output port of the third mixing device, and the outlet end of the auxiliary heater is communicated with the pickling tank.
3. The wafer cleaning apparatus infusion system of claim 2, wherein: the novel SPM storage tank is characterized by further comprising an SPM storage tank, wherein the main output port of the first mixing device is respectively communicated with the main input port of the second mixing device and the first liquid inlet of the SPM storage tank through a three-way valve, the main output port of the second mixing device is respectively communicated with the main input port of the third mixing device and the second liquid inlet of the SPM storage tank through a three-way valve, the main output port of the third mixing device is respectively communicated with the inlet end of the auxiliary heater and the third liquid inlet of the SPM storage tank through a three-way valve, and the liquid outlet of the SPM storage tank and the outlet end of the auxiliary heater are respectively communicated to the pickling tank through a three-way valve.
4. The wafer cleaning apparatus infusion system of claim 3, wherein: the four three-way valves are electrically connected with the feedback control board.
5. The wafer cleaning apparatus infusion system of claim 3, wherein: the first mixing device, the second mixing device and the third mixing device are respectively provided with a pressure gauge and a pressure relief valve which are communicated with the inside of the mixing pipeline, and the pressure gauge and the pressure relief valve are respectively electrically connected with the feedback control board.
6. The wafer cleaning apparatus infusion system of claim 3, wherein: the heater is winding heating pipe on the mixing pipeline, first mixing arrangement with the second mixing arrangement is still including the parcel the heat preservation of heating pipe, cooling channel in the third mixing arrangement is located the heating pipe outward, still includes the heat preservation of parcel outside cooling channel.
7. The wafer cleaning apparatus infusion system of claim 3, wherein: and a temperature detector and an oxygen concentration meter which are electrically connected with the feedback control board are also arranged in the pickling tank.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211617079.3A CN115831822B (en) | 2022-12-15 | 2022-12-15 | Infusion system of wafer cleaning equipment |
| PCT/CN2023/106072 WO2024124894A1 (en) | 2022-12-15 | 2023-07-06 | Liquid conveying system of wafer cleaning apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211617079.3A CN115831822B (en) | 2022-12-15 | 2022-12-15 | Infusion system of wafer cleaning equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115831822A CN115831822A (en) | 2023-03-21 |
| CN115831822B true CN115831822B (en) | 2024-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211617079.3A Active CN115831822B (en) | 2022-12-15 | 2022-12-15 | Infusion system of wafer cleaning equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115831822B (en) |
| WO (1) | WO2024124894A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115831822B (en) * | 2022-12-15 | 2024-03-08 | 上海至纯洁净系统科技股份有限公司 | Infusion system of wafer cleaning equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05166780A (en) * | 1991-12-11 | 1993-07-02 | Sony Corp | Cleaning equipment |
| CN102755970A (en) * | 2012-07-16 | 2012-10-31 | 常州瑞择微电子科技有限公司 | On-line SPM generating system and control method thereof |
| KR20180051871A (en) * | 2016-11-09 | 2018-05-17 | 무진전자 주식회사 | A nozzle for fluid mix |
| CN109148339A (en) * | 2018-09-26 | 2019-01-04 | 广西桂芯半导体科技有限公司 | wafer cleaning device and cleaning method |
| CN111223756A (en) * | 2018-11-26 | 2020-06-02 | 长鑫存储技术有限公司 | Wafer cleaning method and semiconductor device manufacturing method |
| CN114054421A (en) * | 2021-11-04 | 2022-02-18 | 至微半导体(上海)有限公司 | Spray head mechanism for SPM cleaning process and using method thereof |
| CN114496849A (en) * | 2022-01-13 | 2022-05-13 | 上海至纯洁净系统科技股份有限公司 | Wafer sectional type flow field cleaning system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115938990B (en) * | 2022-12-15 | 2024-03-08 | 上海至纯洁净系统科技股份有限公司 | SPM solution mixed acid output control method |
| CN115831822B (en) * | 2022-12-15 | 2024-03-08 | 上海至纯洁净系统科技股份有限公司 | Infusion system of wafer cleaning equipment |
-
2022
- 2022-12-15 CN CN202211617079.3A patent/CN115831822B/en active Active
-
2023
- 2023-07-06 WO PCT/CN2023/106072 patent/WO2024124894A1/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05166780A (en) * | 1991-12-11 | 1993-07-02 | Sony Corp | Cleaning equipment |
| CN102755970A (en) * | 2012-07-16 | 2012-10-31 | 常州瑞择微电子科技有限公司 | On-line SPM generating system and control method thereof |
| KR20180051871A (en) * | 2016-11-09 | 2018-05-17 | 무진전자 주식회사 | A nozzle for fluid mix |
| CN109148339A (en) * | 2018-09-26 | 2019-01-04 | 广西桂芯半导体科技有限公司 | wafer cleaning device and cleaning method |
| CN111223756A (en) * | 2018-11-26 | 2020-06-02 | 长鑫存储技术有限公司 | Wafer cleaning method and semiconductor device manufacturing method |
| CN114054421A (en) * | 2021-11-04 | 2022-02-18 | 至微半导体(上海)有限公司 | Spray head mechanism for SPM cleaning process and using method thereof |
| CN114496849A (en) * | 2022-01-13 | 2022-05-13 | 上海至纯洁净系统科技股份有限公司 | Wafer sectional type flow field cleaning system |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024124894A1 (en) | 2024-06-20 |
| CN115831822A (en) | 2023-03-21 |
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