CN220371765U - Semiconductor cleaning liquid supply system and semiconductor device - Google Patents
Semiconductor cleaning liquid supply system and semiconductor device Download PDFInfo
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- CN220371765U CN220371765U CN202321812084.XU CN202321812084U CN220371765U CN 220371765 U CN220371765 U CN 220371765U CN 202321812084 U CN202321812084 U CN 202321812084U CN 220371765 U CN220371765 U CN 220371765U
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- semiconductor
- cleaning
- cooling
- supply system
- heater
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 141
- 238000004140 cleaning Methods 0.000 title claims abstract description 130
- 239000007788 liquid Substances 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 claims abstract description 103
- 239000002699 waste material Substances 0.000 claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims description 55
- 238000012545 processing Methods 0.000 claims description 8
- 150000004767 nitrides Chemical class 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 238000003860 storage Methods 0.000 description 8
- 239000012530 fluid Substances 0.000 description 6
- 238000011084 recovery Methods 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a semiconductor cleaning solution supply system and semiconductor equipment, wherein the semiconductor cleaning solution supply system comprises: a first pipe, a heater and a second pipe; the first pipeline is arranged in the semiconductor process device and used for inputting cleaning liquid, and the first pipeline can exchange heat with liquid with the temperature in the semiconductor process device in a second set temperature range; the heater is communicated with the first pipeline and is used for heating the cleaning liquid input by the first pipeline; the second pipeline is communicated between the heater and the semiconductor cleaning device and is used for supplying the cleaning liquid heated by the heater to the semiconductor cleaning device. The heat energy which cannot be utilized in the semiconductor process device can be fully utilized, the problem of heat energy waste is solved, and the degree of dependence on the reliability of the heater is reduced.
Description
Technical Field
The present application relates to the field of semiconductors, and more particularly, to a semiconductor cleaning solution supply system and a semiconductor device.
Background
In semiconductor manufacturing processes, cleaning is performed after almost every process, and wet cleaning is generally used in the cleaning process. In the wet cleaning process, cleaning liquid needs to be provided for the cleaning device, and the cleaning liquid discharged from the cleaning liquid storage tank is often provided for the cleaning device after being heated to a certain temperature by the heater. When unheated cleaning liquid is directly used, the damage of the microcircuit structure on the surface of the wafer or the inside of the wafer caused by the hot and cold effect caused by the too low temperature of the cleaning liquid in the cleaning process is prevented, so that the overall yield is affected. Referring to fig. 1, the current supply system of cleaning liquid has the problem of heat energy waste and relies too much on the reliability of the heater.
Disclosure of Invention
The present utility model has been made in order to solve at least one of the above problems. According to a first aspect of the present application, there is provided a semiconductor cleaning liquid supply system, comprising: a first pipe, a heater and a second pipe; the first pipeline is arranged in the semiconductor process device and used for inputting cleaning liquid, and the first pipeline can exchange heat with liquid of the semiconductor process device; the heater is communicated with the first pipeline and is used for heating the cleaning liquid input by the first pipeline; the second pipeline is communicated between the heater and the semiconductor cleaning device and is used for supplying the cleaning liquid heated by the heater to the semiconductor cleaning device.
In one embodiment of the present application, the first conduit is a first cooling conduit within the semiconductor process apparatus for cooling a process zone within the semiconductor process apparatus.
In one embodiment of the present application, the first conduit is a second cooling conduit within the semiconductor process device, the second cooling conduit being configured to cool a waste liquid within the semiconductor process device.
In one embodiment of the present application, the first conduit includes a first cooling conduit and a second cooling conduit; the first cooling pipeline is used for cooling a process area in the semiconductor process device, and the second cooling pipeline is used for cooling waste liquid in the semiconductor process device.
In one embodiment of the present application, the second cooling line communicates with the cleaning liquid supply port, and the first cooling line communicates between the second cooling line and the heater.
In one embodiment of the present application, the cleaning fluid is ultrapure water for semiconductors.
In one embodiment of the present application, the first pipeline is used for inputting the cleaning solution with the temperature in a first set temperature range; the liquid temperature of the semiconductor process device is in a second set temperature range; wherein the maximum value of the first set temperature range is smaller than the minimum value of the second set temperature range.
In one embodiment of the present application, the heater is configured to heat the cleaning fluid input from the first pipeline to a third set temperature range; the minimum value of the third set temperature range is larger than the maximum value of the first set temperature range, and the maximum value of the third set temperature range is smaller than the minimum value of the second set temperature range.
In one embodiment of the present application, the semiconductor cleaning device is an H-QDR device.
In one embodiment of the present application, the semiconductor process device is an SPM process device, a CR process device, or an HPO process device.
According to a second aspect of the present application, there is also provided a semiconductor device including: semiconductor process apparatus, semiconductor cleaning apparatus, and any one of the semiconductor cleaning liquid supply systems.
In one embodiment of the present application, the semiconductor device is a wet cleaning device, a photoresist removal device, or a nitride removal device.
According to the semiconductor cleaning solution supply system and the semiconductor device, the first pipeline is arranged in the semiconductor process device, heat exchange can be conducted between the first pipeline and liquid with high temperature in the semiconductor process device, and then the cleaning solution input by the first pipeline is heated by the heater and then supplied to the semiconductor cleaning device through the second pipeline. Compared with the prior art that cleaning liquid in the cleaning liquid storage tank is directly input into the heater for heating, the cleaning liquid in the cleaning liquid storage tank flows into the semiconductor process device firstly, is heated by liquid with higher temperature in the semiconductor process device through heat exchange, and flows into the heater, so that heat energy which cannot be utilized in the semiconductor process device can be fully utilized, and the problem of heat energy waste is relieved; and when the heater is in emergency stop, the cleaning liquid can be still heated through heat exchange in the semiconductor process device, so that the temperature difference between the temperature at which the cleaning liquid is actually supplied to the cleaning device and the target temperature can be effectively reduced, the damage to a semiconductor product caused by the too low temperature of the cleaning liquid is reduced, the dependence on the reliability of the heater is reduced, and the product yield is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort to a person skilled in the art.
FIG. 1 is a schematic diagram of a prior art semiconductor cleaning solution supply system;
FIG. 2 is a schematic diagram of a semiconductor cleaning solution supply system according to an embodiment of the present utility model;
reference numerals:
10-semiconductor process unit 20-heater 30-semiconductor cleaning unit.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, exemplary embodiments according to the present utility model will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present utility model and not all embodiments of the present utility model, and it should be understood that the present utility model is not limited by the example embodiments described herein. Based on the embodiments of the utility model described in the present application, all other embodiments that a person skilled in the art would have without inventive effort shall fall within the scope of the utility model.
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present utility model. It will be apparent, however, to one skilled in the art that the utility model may be practiced without one or more of these details. In other instances, well-known features have not been described in detail in order to avoid obscuring the utility model.
It should be understood that the present utility model may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.
In order to provide a thorough understanding of the present utility model, detailed structures will be presented in the following description in order to illustrate the technical solutions presented by the present utility model. Alternative embodiments of the utility model are described in detail below, however, the utility model may have other implementations in addition to these detailed descriptions.
Some embodiments of the present utility model are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
An embodiment of the present application provides a semiconductor cleaning liquid supply system, referring to fig. 2, the semiconductor cleaning liquid supply system includes: a first pipe, a heater 20, and a second pipe; the first pipeline is arranged in the semiconductor process device 10, is used for inputting cleaning liquid, and can exchange heat with liquid with the temperature in the semiconductor process device 10 in a second set temperature range; the heater 20 is communicated with the first pipeline, and the heater 20 is used for heating the cleaning liquid input by the first pipeline; the second line is communicated between the heater 20 and the semiconductor cleaning device 30, and is used for supplying the cleaning liquid heated by the heater 20 to the semiconductor cleaning device 30.
In the above-described embodiment, the first pipe is provided in the semiconductor process apparatus 10, and the first pipe is capable of exchanging heat with the liquid having a relatively high temperature in the semiconductor process apparatus 10, and then the cleaning liquid supplied from the first pipe is heated by the heater 20, and then the cleaning liquid is supplied to the semiconductor cleaning apparatus 30 through the second pipe. Compared with the conventional method shown in fig. 1, in which cleaning solution in the cleaning solution storage tank is directly input into the heater 20 for heating, the cleaning solution in the application flows into the semiconductor process device 10 first, is heated by the liquid with higher temperature in the semiconductor process device 10 through heat exchange, and then flows into the heater 20, so that heat energy which cannot be utilized in the semiconductor process device 10 can be fully utilized, waste heat energy can be fully utilized, and the problem of heat energy waste is relieved; and when the heater 20 is in emergency stop, the cleaning liquid can still be heated through heat exchange in the semiconductor process device 10, so that the temperature difference between the temperature at which the cleaning liquid is actually supplied to the cleaning device and the target temperature can be effectively reduced, the damage to the semiconductor product caused by the too low temperature of the cleaning liquid is reduced, the dependence on the reliability of the heater 20 is reduced, and the product yield is improved. The following describes each of the above structures in detail with reference to the accompanying drawings.
When the first conduit is provided, referring to fig. 2, the first conduit is provided within the semiconductor process apparatus 10 and is used to input a cleaning solution. That is, the input port of the first pipeline is connected to the liquid outlet of the cleaning liquid storage tank, so that the cleaning liquid in the cleaning liquid storage tank directly flows into the first pipeline. Since the cleaning liquid directly discharged from the cleaning liquid storage tank is not heated, the temperature thereof is low, and the temperature of the cleaning liquid input from the first pipe may be a first set temperature range, for example. The cleaning liquid may be ultrapure water for semiconductors, but may be other types of cleaning liquids. The first set temperature range may be one value or one interval. The cleaning fluid in the first conduit is capable of exchanging heat with the relatively high temperature fluid in the semiconductor process device 10. For example, the liquid temperature of the semiconductor process apparatus may be in the second set temperature range, and in a more preferred manner, the maximum value of the first set temperature range is less than the minimum value of the second set temperature range, so that the liquid with a higher temperature in the semiconductor process apparatus 10 can heat the cleaning liquid in the first pipeline through heat exchange. The second set temperature range may be one value or one interval.
In determining the semiconductor process device 10, the semiconductor process device 10 may be an SPM process device, a CR process device, or an HPO process device, for example. It should be understood that the semiconductor processing apparatus 10 is not limited to the manner shown above, but may be other types of semiconductor processing apparatus 10. Each semiconductor processing assembly 10 typically includes a process zone where the temperature of the liquid is relatively high and is cooled by a cooling device that is required to control the temperature of the process zone during processing. When the semiconductor process apparatus 10 is an SPM process apparatus, the liquid used in the process field is SPM (mixed liquid of sulfuric acid and hydrogen peroxide), which is applied to the BCN process, and belongs to a cleaning before the furnace tube is fed. When the semiconductor processing apparatus 10 is a CR processing apparatus, the liquid used in the process field is CR (photoresist etchant). When the semiconductor process apparatus 10 is an HPO process apparatus, the liquid used in the process field is HPO (nitride etchant).
Each semiconductor process unit 10 also typically includes a waste recovery zone for recovering waste generated in the process zone, but typically requires cooling the waste to below 60 c in order to prevent damage to the mill waste pipes, so cooling means such as, but not limited to, cooling tanks are also typically provided in the waste zone.
By way of example, the first conduit may be a first cooling conduit within the semiconductor process apparatus 10 for cooling a process zone within the semiconductor process apparatus 10. Instead of the original cooling means for controlling the temperature of the process field in the semiconductor process apparatus 10, there is no need to additionally provide cooling means for the process field in the semiconductor process apparatus 10.
The first line may also be, for example, a second cooling line within the semiconductor process device 10 for cooling the waste liquid within the semiconductor process device 10. The original cooling device for cooling the waste liquid in the semiconductor process device 10 is replaced, so that the cooling device is not required to be additionally arranged in the semiconductor process device 10 aiming at the waste liquid recovery area.
For example, referring to fig. 2, the first conduit may include a first cooling conduit and a second cooling conduit; wherein the first cooling line is used to cool a process zone within the semiconductor process device 10 and the second cooling line is used to cool a waste liquid within the semiconductor process device 10. Instead of the original cooling device for cooling the waste liquid and the cooling device for controlling the temperature of the process area in the semiconductor process device 10, the cooling device is not required to be additionally arranged in the semiconductor process device 10 for the waste liquid recovery area, and the cooling device is not required to be additionally arranged in the semiconductor process device 10 for the process area.
For example, referring to fig. 2, a second cooling line may be communicated with the cleaning liquid supply port, and a first cooling line may be communicated between the second cooling line and the heater 20. The second cooling pipeline is arranged in the waste liquid recovery area and is used for cooling the waste liquid, and the temperature of the waste liquid is usually lower than that of liquid in the process area, so that the cleaning liquid flows through the waste liquid recovery area with lower temperature, the waste liquid heats the cleaning liquid and then flows into the process area with higher temperature, and the liquid in the process area heats the cleaning liquid, so that the cleaning liquid can be gradually heated, the temperature difference of heat exchange is reduced, and meanwhile, the cooling of the waste liquid and the cooling of the process area are not mutually interfered.
With continued reference to fig. 2, a heater 20 is in communication with the first conduit, the heater 20 being configured to heat the cleaning fluid input by the first conduit. For example, the heater 20 may heat the cleaning liquid input from the first pipe to a third set temperature range. Wherein the minimum value of the third set temperature range may be made larger than the maximum value of the first set temperature range, and the maximum value of the third set temperature range may be made smaller than the minimum value of the second set temperature range. The third set temperature range may be one value or one interval. For example, the second set temperature range may be 120 ℃, 160 ℃, etc., and the third set temperature range may be 60 ℃. The first set temperature range may be 20 ℃ of normal temperature, or the like.
Referring to fig. 2, a second pipe is communicated between the heater 20 and the semiconductor cleaning device 30, and the second pipe is used to supply the cleaning liquid heated by the heater 20 to the semiconductor cleaning device 30. The semiconductor cleaning device 30 may be supplied with the cleaning liquid having a temperature in the third set temperature range.
In determining the semiconductor cleaning device 30, the semiconductor cleaning device 30 may be, for example, but not limited to, an H-QDR device, which is a rapid drain flushing tank device that employs hot water as a cleaning fluid.
In the various embodiments shown above, the first pipe is provided in the semiconductor process apparatus 10, and the first pipe is capable of exchanging heat with the liquid having a relatively high temperature in the semiconductor process apparatus 10, and then the cleaning liquid supplied from the first pipe is heated by the heater 20, and then the cleaning liquid is supplied to the semiconductor cleaning apparatus 30 through the second pipe. Compared with the conventional method shown in fig. 1, in which cleaning solution in the cleaning solution storage tank is directly input into the heater 20 for heating, the cleaning solution in the application flows into the semiconductor process device 10 first, is heated by the liquid with higher temperature in the semiconductor process device 10 through heat exchange, and then flows into the heater 20, so that heat energy which cannot be utilized in the semiconductor process device 10 can be fully utilized, waste heat energy can be fully utilized, and the problem of heat energy waste is alleviated. Experiments prove that the heat energy loss can be reduced by 9% by adopting the supply system shown in the embodiment of the application. And when the heater 20 is in emergency stop, the cleaning liquid can still be heated through heat exchange in the semiconductor process device 10, so that the temperature difference between the temperature at which the cleaning liquid is actually supplied to the cleaning device and the target temperature can be effectively reduced, the damage to the semiconductor product caused by the too low temperature of the cleaning liquid is reduced, the dependence on the reliability of the heater 20 is reduced, and the product yield is improved.
In addition, the embodiment of the application further provides a semiconductor device, referring to fig. 2, the semiconductor device includes: semiconductor processing apparatus 10, semiconductor cleaning apparatus 30, and any of the semiconductor cleaning liquid supply systems described above. When the semiconductor device is provided, the semiconductor device may be a semiconductor device such as, but not limited to, a wet cleaning device, a photoresist removing device, or a nitride removing device. Regarding the arrangement of the above-described respective structures, reference may be made to the above description of the semiconductor cleaning liquid supply system, and the description thereof will not be repeated here.
The present utility model has been illustrated by the above-described embodiments, but it should be understood that the above-described embodiments are for purposes of illustration and description only and are not intended to limit the utility model to the embodiments described. In addition, it will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that many variations and modifications are possible in light of the teachings of the utility model, which variations and modifications are within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (11)
1. A semiconductor cleaning solution supply system, comprising:
the first pipeline is arranged in the semiconductor process device and used for inputting cleaning liquid, and the first pipeline exchanges heat with the liquid of the semiconductor process device;
the heater is communicated with the first pipeline and used for heating the cleaning liquid input by the first pipeline;
and a second pipeline communicated between the heater and the semiconductor cleaning device and used for supplying the cleaning liquid heated by the heater to the semiconductor cleaning device.
2. The semiconductor cleaning solution supply system of claim 1, wherein the first conduit is a first cooling conduit within the semiconductor process apparatus for cooling a process zone within the semiconductor process apparatus.
3. The semiconductor cleaning solution supply system of claim 1, wherein the first conduit is a second cooling conduit within the semiconductor process apparatus, the second cooling conduit being configured to cool a waste liquid within the semiconductor process apparatus.
4. The semiconductor cleaning solution supply system of claim 1, wherein the first conduit comprises a first cooling conduit and a second cooling conduit;
the first cooling pipeline is used for cooling a process area in the semiconductor process device, and the second cooling pipeline is used for cooling waste liquid in the semiconductor process device.
5. The semiconductor cleaning solution supply system of claim 4, wherein the second cooling line communicates with the cleaning solution supply port, and the first cooling line communicates between the second cooling line and the heater.
6. The semiconductor cleaning solution supply system as set forth in claim 1, wherein said first line is for supplying a cleaning solution having a temperature in a first set temperature range; the liquid temperature of the semiconductor process device is in a second set temperature range; wherein the maximum value of the first set temperature range is smaller than the minimum value of the second set temperature range.
7. The semiconductor cleaning solution supply system as set forth in claim 6, wherein said heater is adapted to heat the cleaning solution supplied from said first conduit to a third set temperature range;
the minimum value of the third set temperature range is larger than the maximum value of the first set temperature range, and the maximum value of the third set temperature range is smaller than the minimum value of the second set temperature range.
8. The semiconductor cleaning solution supply system of claim 1, wherein the semiconductor cleaning device is an H-QDR device.
9. The semiconductor cleaning solution supply system of claim 1, wherein the semiconductor process device is an SPM process device, a CR process device, or an HPO process device.
10. A semiconductor device, characterized by comprising:
a semiconductor processing device;
a semiconductor cleaning device;
the semiconductor cleaning liquid supply system as claimed in any one of claims 1 to 9.
11. The semiconductor device according to claim 10, wherein the semiconductor device is a wet cleaning device, a photoresist removal device, or a nitride removal device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321812084.XU CN220371765U (en) | 2023-07-11 | 2023-07-11 | Semiconductor cleaning liquid supply system and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321812084.XU CN220371765U (en) | 2023-07-11 | 2023-07-11 | Semiconductor cleaning liquid supply system and semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220371765U true CN220371765U (en) | 2024-01-23 |
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ID=89566213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321812084.XU Active CN220371765U (en) | 2023-07-11 | 2023-07-11 | Semiconductor cleaning liquid supply system and semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220371765U (en) |
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2023
- 2023-07-11 CN CN202321812084.XU patent/CN220371765U/en active Active
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