CN115831550A - Heat radiation structure and electronic equipment - Google Patents
Heat radiation structure and electronic equipment Download PDFInfo
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- CN115831550A CN115831550A CN202211362569.3A CN202211362569A CN115831550A CN 115831550 A CN115831550 A CN 115831550A CN 202211362569 A CN202211362569 A CN 202211362569A CN 115831550 A CN115831550 A CN 115831550A
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- 230000005855 radiation Effects 0.000 title abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 102
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 description 121
- 239000003292 glue Substances 0.000 description 21
- 238000010586 diagram Methods 0.000 description 12
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- 239000012528 membrane Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 210000004779 membrane envelope Anatomy 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 150000004706 metal oxides Chemical group 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
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Abstract
The application provides a heat radiation structure and electronic equipment. The heat dissipation structure may include a circuit board, a magnetic device, a heat sink, and a heat conductive medium, and the magnetic device may be located between the circuit board and the heat sink. The magnetic device can comprise a magnetic core and a film-covered wire, wherein the magnetic core comprises a stopping part and a central magnetic column which are fixedly connected, the film-covered wire is wound on the central magnetic column, and the film-covered wire is electrically connected with the circuit board. In the heat dissipation structure, at least part of the side surface of the stopping part can be provided with the heat conduction film, so that the temperature uniformity of the magnetic device can be effectively improved, and the problem of local high temperature of the magnetic device is solved. In addition, the heat conducting medium can be arranged between the magnetic device and the radiator, and the heat conducting medium is in heat conduction contact with at least part of the magnetic device and the radiator, so that heat generated by the magnetic device can be conducted to the heat conducting medium and then transmitted to the radiator for heat dissipation, the heat dissipation efficiency of the heat dissipation structure can be effectively improved, and the performance of the electronic equipment provided with the heat dissipation structure can be improved.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation structure and electronic equipment.
Background
With the development of electronic technology, the density of power devices in electronic equipment is continuously increased, and the layout of the power devices on a circuit board is more and more compact, so that the heat flux density on the circuit board is also more and more increased. If no good heat dissipation measure is available, the application scenario of the power device is limited, and the performance of the product performance of the electronic equipment is also limited.
Magnetic devices such as inductors and transformers are taken as examples, and are important devices for realizing power conversion. These magnetic devices may generally include a magnetic core and a copper wire wound around the magnetic core. In order to insulate the copper wire, an insulating film is often added to the copper wire, and the entire thickness of the copper wire coated on the magnetic core is large, so that the heat dissipation path from the magnetic core to the heat sink is long. Further, since the magnetic material has a low thermal conductivity, the heat generated in the magnetic core is hardly diffused outward. Therefore, in a windless scene, the temperature difference between the inner layer copper wire and the outer layer copper wire of the magnetic device is large, and the heat dissipation at the magnetic core is often the bottleneck of the heat dissipation of the magnetic devices.
Disclosure of Invention
The application provides a heat radiation structure and electronic equipment to make improvement heat radiation structure's radiating efficiency, thereby promote electronic equipment's performance.
In a first aspect, the present application provides a heat dissipation structure that may include a circuit board, a magnetic device, a heat sink, and a heat conducting medium, the magnetic device may be located between the circuit board and the heat sink. The magnetic device can comprise a magnetic core and a film-covered wire, wherein the magnetic core comprises a stopping part and a central magnetic column which are fixedly connected, the film-covered wire is wound on the central magnetic column, and the film-covered wire is electrically connected with the circuit board. In the heat dissipation structure, at least a portion of a side surface of the stopper portion may be provided with a heat conductive film. The temperature uniformity of the magnetic device can be effectively improved by arranging the heat conducting film on the side surface of the stopping part, so that the problem of local high temperature of the magnetic device can be solved, and the risk of overtemperature of the magnetic core is reduced. In addition, the heat conducting medium can be arranged between the magnetic device and the radiator, and the heat conducting medium is in heat conducting contact with at least part of the magnetic device and the radiator, so that heat generated by the magnetic device can be conducted to the heat conducting medium and then transferred to the radiator for heat radiation, and the heat radiation efficiency of the heat radiation structure can be effectively improved.
In addition to the heat conducting film being disposed on the side surface of the stopper portion, in one possible implementation manner of the present application, the heat conducting film may be disposed on the surface of the central magnetic pillar, and the film covered wire is in heat conducting contact with the heat conducting film. Therefore, the heat generated by the film-covered wire and the central magnetic column can be conducted to the heat-conducting film, and the temperature uniformity of the magnetic device can be further improved.
In addition, when the heat-conducting film is arranged between the central magnetic column and the film-covered wire, the film-covered wire and the heat-conducting film can be wound on the central magnetic column alternatively. The heat dissipation structure can be beneficial to increasing the contact area of the film covered wire and the heat conduction film, so that the temperature uniformity of the central magnetic column can be improved, and the heat dissipation efficiency of the heat dissipation structure can be effectively improved.
In the present application, the specific type of the heat transfer medium is not limited, and may be exemplified by a heat transfer paste. The heat-conducting glue is filled between the magnetic device and the radiator, so that at least part of the heat-conducting film can be coated by the heat-conducting glue, and heat conduction between the heat-conducting film and the heat-conducting glue is facilitated. It can be understood that, because the heat-conducting film that the magnetic core set up can promote its temperature uniformity nature, can be when improving heat radiation structure's radiating efficiency like this, still the effectual quantity that reduces the heat-conducting glue to heat radiation structure's cost can be reduced.
The heat-conducting glue can coat at least part of the heat-conducting film, and can also coat at least part of the magnetic core and at least part of the film-covered wire, so that the temperature uniformity of the magnetic device can be improved.
In one possible implementation manner of the present application, the heat conducting film may be further disposed on a side surface of the stopper portion facing the heat sink. The area of the heat conduction membrane that can effectual increase set up on the magnetic core like this to reach the purpose that promotes the temperature uniformity of magnetic core.
The present application does not limit the specific type of the heat conductive film, and an exemplary heat conductive film may be a metal thin film with a good heat conductive property, such as a copper foil. Alternatively, the non-metallic film may be a graphite film or the like having a good heat conductivity.
In a second aspect, the present application further provides a heat dissipation structure, which may include a circuit board, a magnetic device, a heat sink, and a heat conductive medium, wherein the magnetic device may be located between the circuit board and the heat sink. The magnetic device can comprise a magnetic core and a film-covered wire, wherein the magnetic core comprises a stopping part and a central magnetic column which are fixedly connected, the film-covered wire is wound on the central magnetic column, and the film-covered wire is electrically connected with the circuit board. In the heat dissipation structure, at least a portion of the surface of the central magnetic pillar may be provided with a heat conductive film. The surface of the central magnetic column is provided with the heat conducting film, so that the temperature uniformity of the magnetic device can be effectively improved, the problem of local high temperature of the magnetic device can be solved, and the risk of overtemperature of the magnetic core is reduced. In addition, the heat conducting medium can be arranged between the magnetic device and the radiator, and at least part of the heat conducting medium and the magnetic device are in heat conduction contact with the radiator, so that heat generated by the magnetic device can be transferred to the heat conducting medium and then transferred to the radiator for heat dissipation, and the heat dissipation efficiency of the heat dissipation structure can be effectively improved.
In addition, when the heat conducting film is arranged between the central magnetic column and the film wrapping line, the film wrapping line and the heat conducting film can be wound on the central magnetic column alternatively. The heat dissipation structure can be beneficial to increasing the contact area of the film covered wire and the heat conduction film, so that the temperature uniformity of the central magnetic column can be improved, and the heat dissipation efficiency of the heat dissipation structure can be effectively improved.
In a third aspect, the present application further provides a heat dissipation structure, which may include a circuit board, a magnetic device, a heat sink, and a heat conducting medium, where the magnetic device may be located between the circuit board and the heat sink. The magnetic device can comprise a magnetic core and a film-covered wire, wherein the magnetic core comprises a stopping part and a central magnetic column which are fixedly connected, the film-covered wire is wound on the central magnetic column, and the film-covered wire is electrically connected with the circuit board. In the heat dissipation structure, a heat conduction film is arranged between the film-covered wire and the central magnetic column, and the film-covered wire and the heat conduction film are wound on the central magnetic column alternately. Through coiling membrane envelope and heat conduction membrane in center magnetism post in turn, can make the area of contact of heat conduction membrane and membrane envelope great, its temperature uniformity that can effectual improvement magnetic device to can solve the problem of the local high temperature of magnetic device, with the risk that reduces the magnetic core overtemperature. In addition, the heat conducting medium can be arranged between the magnetic device and the radiator, and the heat conducting medium is in heat conducting contact with at least part of the magnetic device and the radiator, so that heat generated by the magnetic device can be conducted to the heat conducting medium and then transferred to the radiator for heat dissipation, and the heat dissipation efficiency of the heat dissipation structure can be effectively improved.
In a fourth aspect, the present application further provides an electronic device, which may include a housing and the heat dissipation structure as in the first aspect, where the heat dissipation structure may be disposed in the housing. The heat dissipation structure of the electronic equipment has good heat dissipation performance, so that the performance of the electronic equipment can be improved, and the product competitiveness of the electronic equipment can be favorably improved.
Drawings
Fig. 1 is a schematic layout structure of a magnetic device provided in the present application;
fig. 2 is a schematic view of a heat dissipation structure of a conventional magnetic device provided in the present application;
fig. 3 is a schematic diagram of a heat dissipation structure of another conventional magnetic device provided in the present application;
fig. 4 is a schematic structural diagram of a heat dissipation structure according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a portion of the magnetic device of FIG. 4;
fig. 6 is a cross-sectional view of a heat dissipation structure according to another embodiment of the present application;
fig. 7 is a cross-sectional view of a heat dissipation structure according to another embodiment of the present application;
FIG. 8 is a schematic diagram of a portion of the magnetic device of FIG. 7;
fig. 9 is a cross-sectional view of a heat dissipation structure according to another embodiment of the present application;
fig. 10 is a partial structural schematic diagram of the magnetic device of fig. 9.
Reference numerals:
1-a magnetic device; 101-a magnetic core; 1011-a stop; 1012-central magnetic column; 1013-heat conducting film; 102-film covered wire;
103-a heat conducting medium; 103 a-a thermal pad; 103 b-heat conducting glue; 104-magnetic air gap;
2-a circuit board; and 3, a radiator.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings. Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather mean "one or more but not all embodiments" unless specifically stated otherwise. Furthermore, the terms "first," "second," and the like, as used herein, are used for descriptive purposes only and are not intended to indicate or imply relative importance nor order to be construed.
For the convenience of understanding the heat dissipation structure provided in the embodiments of the present application, an application scenario thereof is first described below. The heat dissipation structure can be applied to magnetic devices such as inductors and transformers for realizing power conversion, but not limited to. Magnetic devices may generally include a magnetic core and a film-covered wire wound around the magnetic core. The film-covered wire can be a cable with a copper wire in the middle and an insulating film wrapped outside.
Referring to fig. 1, fig. 1 is a schematic layout structure diagram of a magnetic device according to an embodiment of the present disclosure. The magnetic device 1 may be generally disposed on the circuit board 2 and electrically connected to the circuit board 2. The circuit board 2 may be a Printed Circuit Board (PCB) as an example, so that it can stably bear the magnetic device 1. As the power density of electronic devices increases, the layout on the circuit board 2 becomes more compact, which results in a higher heat flow density of the circuit board 2. And good heat dissipation measures are beneficial to realizing the functions of the magnetic device 1, so that the performance of the electronic equipment can be effectively improved, and the competitiveness of products is improved.
There are also solutions for heat dissipation of the magnetic device 1. Referring to fig. 2, fig. 2 is a schematic view of a heat dissipation structure of a conventional magnetic device 1 according to an embodiment of the present disclosure. In this heat dissipation structure, the magnetic device 1 may be located between the circuit board 2 and the heat sink 3, and the magnetic device 1 is attached to the heat sink 3 through the thermal pad 103 a. The thermal pad 103a can absorb assembly tolerance in addition to having a good thermal conductivity. The heat dissipation scheme has the advantages of simple process and low cost. However, since the magnetic core 101 and the film-covered wire 102 of the magnetic device 1 have low thermal conductivity, the temperature difference of the magnetic device 1 is large in the direction from the circuit board 2 to the heat sink 3, which is mainly reflected in the temperature of the portion of the magnetic device 1 close to the circuit board 2, and is larger than the temperature of the portion of the magnetic device 1 close to the heat sink 3, so that the heat dissipation capability is poor due to the single-sided heat dissipation.
In order to reduce the temperature difference of the magnetic device 1, reference may be made to fig. 3, where fig. 3 is a schematic diagram of a heat dissipation structure of another conventional magnetic device 1 according to an embodiment of the present application. In the heat dissipation structure, the temperature uniformity of the magnetic device 1 is improved by filling the heat conducting glue 103b in the gaps between the film-covered wire 102 and the magnetic core 101 of the magnetic device 1 and between the magnetic device 1 and the heat sink 3, and the thermal resistance between the magnetic device 1 and the heat sink 3 can be effectively reduced, so that the heat dissipation requirement of the magnetic device 1 is met. However, the thermal conductivity of the thermal conductive adhesive 103b is not high, and in an application scenario with high heat consumption, the temperature difference of the magnetic device 1 is still large, and the circuit board 2 is still prone to over-temperature.
The application provides a heat radiation structure aims at solving above-mentioned problem to through the mode that increases the heat conduction membrane in the magnetic device, improve the holistic temperature uniformity of magnetic device, thereby make the radiating efficiency of magnetic device promote, it is favorable to promoting the product property ability of the electronic equipment who uses this heat radiation structure. The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a heat dissipation structure according to an embodiment of the present application. The heat dissipation structure may include a circuit board 2, a magnetic device 1, and a heat sink 3, wherein the circuit board 2 may be a PCB, the magnetic device 1 is electrically connected to the circuit board 2, and the magnetic device 1 is located between the circuit board 2 and the heat sink 3. The magnetic device 1 may include a magnetic core 101 and a film-covered wire 102, and in this application, the magnetic core 101 refers to a structure formed of a magnetic material, and exemplarily, one of magnetic metal oxide structures that may be formed by sintering various iron oxide mixtures.
Referring to fig. 5, fig. 5 is a partial structural schematic diagram of the magnetic device 1 in fig. 4. In the present application, the magnetic core 101 may include a stopping portion 1011 and a central magnetic pillar 1012, and the stopping portion 1011 is fixedly connected to the central magnetic pillar 1012. In the present application, the shapes and the sizes of the stopper portion 1011 and the central magnetic pillar 1012 are not limited, and the shapes thereof may be the same or different, and the sizes thereof may be the same or different, and are not specifically limited in the present application. For example, the stopper 1011 may be a cylindrical structure, and the central magnetic pillar 1012 may also be a cylindrical structure, and the cross-sectional circular radius of the stopper 1011 is greater than that of the central magnetic pillar 1012. In addition, the cross-sectional shape of the magnetic core 101 in a direction perpendicular to the stopper 1011 and the central magnetic pillar 1012 may be, but is not limited to, a T-shape. The stopper 1011 and the central magnetic pillar 1012 may have a regular cross section such as a cylindrical shape, or may have an irregular cross section, and they are not specifically limited in this application.
In one possible embodiment, the magnetic core 101 may be an integrally formed structure, that is, the central pillar 1012 and the stopping portion 1011 are formed by a single process, which may make the structure of the magnetic core 101 more stable and simplify the forming process of the magnetic core 101. In other possible embodiments, the central magnetic pillar 1012 and the stopping portion 1011 may also be two separately formed structures, and then fixed and connected by sintering or the like.
The covered film wire 102 can be wound around the central magnetic pillar 1012, and the stopping portion 1011 of the magnetic core 101 can act as a limiting stopper for the covered film wire 102, so as to limit the installation position of the covered film wire 102 on the magnetic core 101, and prevent the covered film wire 102 from falling off from the magnetic core 101. In the present application, in order to make the stopper portion 1011 have a limiting effect on the film covered wire 102, the cross-sectional area of the stopper portion 1011 may be made larger than that of the central magnetic pillar 1012. In addition, each magnetic core 101 may be wound with one or at least two film covered wires 102, which may be configured according to a specific application scenario and are not limited herein.
It is understood that after the film covered wires 102 are wound around the magnetic core 101, two wire ends of each film covered wire 102 may serve as interfaces of the power device for electrical connection with the circuit board 2. In addition, the two wire ends of each film covered wire 102 are connected with the circuit board 2, so that the power device can be fixedly connected with the circuit board 2, an additional structure does not need to be arranged for the fixed connection between the power device and the circuit board 2, and the whole structure of the heat dissipation structure can be simplified.
In the present application, in order to improve the temperature uniformity of the heat dissipation structure, a heat conductive film 1013 may be provided on the surface of the magnetic core 101. Here, the thermal conductive film 1013 may be in direct contact with the surface of the magnetic core 101, or a thermal conductive material may be filled between the thermal conductive film 1013 and the surface of the magnetic core 101, so that the thermal conductive film 1013 is in indirect contact with the surface of the magnetic core 101.
While the thermal conductive film 1013 is specifically disposed on the magnetic core 101, with continued reference to fig. 4 and 5, in the embodiment shown in fig. 4 and 5, the thermal conductive film 1013 may be disposed on the stopping portion 1011 of the magnetic core 101, and may be disposed on at least a portion of a side surface of the stopping portion 1011. The side surface of the stopper 1011 is the surface of the stopper 1011 away from the central magnetic column 1012. The thermal conductive film 1013 is disposed on the side of the stopping portion 1011, so that the thermal conductive film 1013 can be disposed conveniently.
In the present application, the specific material of the heat conductive film 1013 is not limited, and the heat conductive film may be a metal film with good heat conductivity, such as a copper foil, or a non-metal film with good heat conductivity, such as a graphite film. In addition, in one possible embodiment of the present application, the thermal conductive film 1013 may be disposed on the whole side of the stopping portion 1011, so as to improve the temperature uniformity of the magnetic device 1. In some other possible embodiments of the present application, the thermal conductive film 1013 may be disposed locally on the side of the stopping portion 1011, and for example, the continuous sheet-like thermal conductive film 1013 may be disposed on a partial area on the side of the stopping portion 1011 in the direction from the heat sink 3 to the circuit board 2; alternatively, the thermal conductive film 1013 may be provided in a stripe structure, and the stripe thermal conductive film 1013 may extend in the direction from the heat sink 3 to the circuit board 2, and in addition, the thermal conductive film 1013 may be provided in a plurality of strips, and the plurality of strips of thermal conductive films 1013 are arranged side by side at intervals. By partially disposing the heat conduction film 1013 on the side of the stopping portion 1011, the requirement of the magnetic device 1 for uniform temperature can be met, and the usage amount of the heat conduction film 1013 can be reduced, thereby reducing the cost of the heat dissipation structure.
With continued reference to fig. 4 and 5, in the present application, the thermal conductive film 1013 may be disposed on the top surface of the stopping portion 1011, in addition to the side surface of the stopping portion 1011. The top surface of the stopper 1011 may be the surface of the stopper 1011 facing the heat sink 3. When the thermal conductive film 1013 is specifically disposed on the top surface of the stopping portion 1011, in a possible embodiment of the present application, the thermal conductive film 1013 may be disposed on the entire top surface of the stopping portion 1011, so as to effectively improve the temperature equalization performance of the magnetic core 101. In other possible embodiments of the present application, a thermal conductive film 1013 may be disposed on a part of the top surface of the stopping portion 1011, in which case, the thermal conductive film 1013 may be in a shape of a sheet or a strip, and the like, and is not specifically limited in the present application, so as to achieve the purpose of improving the temperature uniformity of the magnetic core 101, and at the same time, reduce the usage amount of the thermal conductive film 1013, thereby reducing the cost of the heat dissipation structure.
It is understood that, in the present application, the types of the thermal conductive films 1013 provided on the side surfaces and the top surface of the stopper portion 1011 may be the same or different. The thermal conductive films 1013 provided on the side surfaces and the top surface of the stopper 1011 may or may not be connected, and are not particularly limited in the present application.
In order to enable the heat generated at the magnetic core 101 to be conducted to the heat sink 3, a heat conducting medium 103 may be further disposed in the heat dissipation structure, the heat conducting medium 103 may be disposed between the magnetic device 1 and the heat sink 3, and the heat conducting medium 103 is in heat conducting contact with at least a portion of the magnetic device 1 and the heat sink 3. The present application does not limit the specific type of the heat transfer medium 103 as long as it has a good heat transfer property. For example, in the heat dissipation structure provided in the embodiment shown in fig. 4 of the present application, the heat conducting medium 103 may be a heat conducting glue 103b, and the heat conducting glue 103b may be filled in a gap between the magnetic device 1 and the heat sink 3, so that the heat conducting glue 103b can achieve the adhesion of the whole magnetic device 1 and the surface of the heat sink 3 while covering at least part of the magnetic core 101, at least part of the heat conducting film 1013, and at least part of the film-covered wire 102.
With the heat dissipation structure provided in this embodiment of the present application, heat generated by the magnetic device 1 can be conducted to the heat conducting glue 103b through the heat conducting film 1013, and then conducted to the heat sink 3 through the heat conducting glue 103b for heat dissipation. Because the heat conducting film 1013 has a good heat conducting property, the heat conducting efficiency of the magnetic device 1 can be effectively improved by using the heat dissipation structure. In addition, the heat conducting glue 103b filled between the magnetic device 1 and the heat sink 3 can effectively reduce the thermal resistance between the magnetic device 1 and the heat sink 3, which can meet the heat dissipation requirement of the magnetic device 1.
It is understood that, in the present application, the filling amount of the thermal conductive adhesive 103b in the heat dissipation structure is not limited, and may be specifically adjusted according to the structure of the magnetic device 1, the heat dissipation requirement of the magnetic device 1, the space between the magnetic device 1 and the heat sink 3, and the like. It is sufficient that the heat generated by the magnetic device 1 can be transferred to the heat sink 3 to be dissipated after being conducted to the heat conductive adhesive 103b. In addition, the thermal conductive film 1013 on the magnetic core 101 can improve the temperature uniformity of the magnetic core 101, so as to effectively reduce the amount of the thermal conductive adhesive 103b, thereby reducing the cost of the heat dissipation structure.
In one possible embodiment of the present application, the heat conducting medium 103 may also be a heat conducting pad 103a, and in a specific implementation, reference may be made to fig. 6, and fig. 6 is a schematic structural diagram of a heat dissipation structure provided in another embodiment of the present application. The thermal pad 103a may be disposed between the magnetic device 1 and the heat sink 3, and at least a portion of the magnetic device 1 and the heat sink 3 are attached to the thermal pad 103 a. In this embodiment, the thermal conductive film 1013 disposed on the stopping portion 1011 of the magnetic core 101, especially the thermal conductive film 1013 disposed on the side of the stopping portion 1011, may be in thermal conductive contact with the thermal conductive pad 103a, so that the heat generated by the magnetic device 1 can be conducted to the thermal conductive pad 103a through the thermal conductive film 1013, and then conducted to the heat sink 3 through the thermal conductive pad 103a for heat dissipation, thereby improving the heat dissipation efficiency of the magnetic device 1.
As can be known from the description of the above embodiments, the heat conducting film 1013 with good heat conducting property is disposed on the surface of the magnetic core 101, so that the temperature uniformity of the magnetic device 1 can be effectively improved, and the heat dissipation of the magnetic device 1 can be facilitated. In this way, the thermal conductive film 1013 may be provided at other parts of the magnetic core 101 in addition to the stopper 1011 of the magnetic core 101. Referring to fig. 7 and 8, fig. 7 is a cross-sectional view of a heat dissipation structure provided in another possible embodiment of the present application, and fig. 8 is a partial structural schematic diagram of the magnetic device 1 in fig. 7. In this embodiment, the thermal conductive film 1013 may be disposed on at least a portion of a surface of the central magnetic pillar 1012. The material of the heat conductive film 1013 may be, but is not limited to, a metal film with good heat conductivity, such as a copper foil, or a non-metal film with good heat conductivity, such as a graphite film. It is noted that, in order to enable the magnetic device 1 to work normally, when the heat conducting film 1013 is a metal thin film, the heat conducting film 1013 is disposed to avoid the magnetic air gap 104 of the magnetic device 1.
In the embodiment shown in fig. 7 and 8, the heat conductive film 1013 may be provided on the entire surface of the central magnetic pillar 1012 to improve the temperature uniformity of the magnetic device 1. In other possible embodiments of the present application, the thermal conductive film 1013 may be disposed locally on the surface of the central magnetic pillar 1012, and for example, a continuous strip-shaped thermal conductive film 1013 may be disposed on a partial region of the surface of the central magnetic pillar 1012 in the axial direction of the central magnetic pillar 1012, and the strip-shaped thermal conductive film 1013 may be disposed along the circumferential direction of the central magnetic pillar 1012.
It is understood that, when the heat dissipation structure shown in fig. 7 and 8 is specifically configured, the heat conduction film 1013 may be formed on the surface of the central magnetic pillar 1012, and then the film-covered wire 102 may be wound around the central magnetic pillar 1012. At this time, the film-covered wire 102 may also be in heat conductive contact with the heat conductive film 1013, so that heat generated at the film-covered wire 102 may also be conducted to the heat conductive film 1013.
With continued reference to fig. 7, a heat conducting medium 103 may also be disposed between the magnetic device 1 and the heat sink 3, and the heat conducting medium 103 may be a heat conducting glue 103b as an example. The specific arrangement manner of the thermal conductive adhesive 103b can refer to the embodiment shown in fig. 4, for example, the thermal conductive adhesive 103b is in thermal contact with at least a portion of the magnetic device 1 and the heat sink 3, and details are not repeated here. In addition, the heat conducting medium 103 may also be a heat conducting pad 103a, which may be specifically configured with reference to the embodiment shown in fig. 6, and will not be described herein again.
By adopting the heat dissipation structure provided by the embodiment shown in fig. 7 and 8, the temperature uniformity at the central magnetic column 1012 can be effectively improved, and the heat generated by the magnetic device 1 can be conducted to the heat conducting glue 103b through the heat conducting film 1013, and further conducted to the heat sink 3 through the heat conducting glue 103b for heat dissipation, so that the heat dissipation efficiency of the heat dissipation structure can be effectively improved. And because the heat conducting film 1013 is arranged on the central magnetic column 1012, the temperature uniformity of the magnetic core 101 can be improved, so that the usage amount of the heat conducting glue 103b can be effectively reduced, and the cost of the heat radiation structure can be reduced. In addition, the heat dissipation structure provided by the embodiment can be used for reducing the local high temperature of the magnetic device 1, for example, the temperature of the side, close to the circuit board 2, of the magnetic device 1, so that the risk of over-temperature at the circuit board 2 can be reduced.
It is understood that in some possible embodiments of the present application, the thermal conductive film 1013 may be further disposed on the surfaces of the stopping portion 1011 and the central magnetic pillar 1012 of the magnetic core 101. The heat conductive film 1013 on the surface of the stopping portion 1011 can be disposed as shown in fig. 4, and the heat conductive film 1013 on the surface of the central magnetic pillar 1012 can be disposed as shown in fig. 7, which is not described herein again. By providing the thermal conductive film 1013 on the stopping portion 1011 and the central magnetic pillar 1012 of the magnetic core 101, the temperature uniformity of the magnetic core 101 can be effectively improved, thereby being beneficial to improving the heat dissipation efficiency of the whole magnetic device 1.
It is also contemplated that the film-covered wires 102 may generally comprise metal wires, and that the metal wires in the film-covered wires 102 may act as channels for current to flow during operation of the magnetic device 1, which may generate a significant amount of heat. Accordingly, the heat generated by the film covered wire 102 can be quickly dissipated, thereby improving the heat dissipation efficiency of the magnetic device 1. In specific implementation, reference may be made to fig. 9 and fig. 10, where fig. 9 is a cross-sectional view of a heat dissipation structure provided in another possible embodiment of the present application, and fig. 10 is a schematic partial structure diagram of the magnetic device 1 in fig. 9. In this embodiment, the film-covered wire 102 and the heat-conducting film 1013 are wound around the central magnetic pillar 1012 in a staggered manner, and the specific implementation manner may be various, for example, one turn of the heat-conducting film 1013 may be wound around the central magnetic pillar 1012, and then one turn of the film-covered wire 102 may be wound, wherein the heat-conducting film 1013 may be located between the film-covered wire 102 and the central magnetic pillar 1012, and then the above-mentioned winding sequence is repeated until the winding of the heat-conducting film 1013 and the film-covered wire 102 is completed on the entire central magnetic pillar 1012. In other possible embodiments of the present application, the winding of the thermal conductive film 1013 may be performed after the winding of the film-covered wire 102 on the central magnetic pillar 1012, and the winding sequence of the film-covered wire 102 and the thermal conductive film 1013 is not limited in the present application.
With continued reference to fig. 9, a heat conducting medium 103 may also be disposed between the magnetic device 1 and the heat sink 3, and the heat conducting medium 103 may be a heat conducting glue 103b for example. The specific arrangement manner of the heat conductive adhesive 103b may refer to the embodiment shown in fig. 4, for example, the heat conductive adhesive 103b is in heat conductive contact with at least a portion of the magnetic device 1 and the heat sink 3, and is not described herein again. In addition, the heat conducting medium 103 may also be a heat conducting pad 103a, which may be specifically configured with reference to the embodiment shown in fig. 6, and is not described herein again.
With the heat dissipation structure provided by the embodiment shown in fig. 9 and 10, both the central magnetic pillar 1012 and the film envelope 102 can be in contact with the thermal conductive film 1013. In addition, since the heat conducting film 1013 and the film covered wire 102 are wound around the central magnetic pillar 1012 in a staggered manner, the contact area between the film covered wire 102 and the heat conducting film 1013 can be effectively increased. Thus, while the temperature uniformity of the central magnetic pillar 1012 can be effectively improved, the heat generated by the central magnetic pillar 1012 and the film-covered wire 102 can be conducted to the heat-conducting glue 103b through the heat-conducting film 1013, and then conducted to the heat sink 3 through the heat-conducting glue 103b for heat dissipation, so that the heat dissipation efficiency of the heat dissipation structure can be effectively improved. And because the heat conducting film 1013 is arranged on the central magnetic column 1012, the temperature uniformity of the magnetic core 101 can be improved, so that the usage amount of the heat conducting glue 103b can be effectively reduced, and the cost of the heat radiation structure can be reduced. In addition, the heat dissipation structure provided by the embodiment can be used for reducing the local high temperature of the magnetic device 1, for example, the temperature of the side, close to the circuit board 2, of the magnetic device 1, so that the risk of over-temperature at the circuit board 2 can be reduced.
In some possible embodiments of the present application, the film-covered wire 102 and the thermal film 1013 are wound around the central magnetic pillar 1012 in a staggered manner, and the thermal film 1013 may be further disposed on the surface of the stopper 1011 and/or the central magnetic pillar 1012 of the magnetic core 101. The heat conductive film 1013 on the surface of the stopping portion 1011 can be disposed as shown in fig. 4, and the heat conductive film 1013 on the surface of the central magnetic pillar 1012 can be disposed as shown in fig. 7, which is not described herein again. Thus, the temperature uniformity of the magnetic core 101 can be effectively improved, and the heat dissipation efficiency of the whole magnetic device 1 can be improved. In addition, the temperature uniformity of the magnetic core 101 is improved, and the risk of overtemperature of the magnetic core 101 can be effectively reduced, so that the working reliability of the magnetic device 1 is improved. The over-temperature of the magnetic core 101 is a phenomenon in which the temperature is out of control after the magnetic core 101 is magnetically saturated at a high temperature.
The heat dissipation module provided by the above embodiment of the present application can be applied to various possible electronic devices, and the present application does not limit the specific types of the electronic devices, for example, the heat dissipation module may be a power supply device such as a charging pile or an inverter, a communication device such as a server or a memory, or other electronic devices such as a vehicle and a home appliance. The electronic device may include a housing, in addition to the heat dissipation structure, and the heat dissipation structure may be disposed in the housing. The heat dissipation structure of the electronic equipment has good heat dissipation performance, and the power density of the heat dissipation structure is high, so that the performance of the electronic equipment can be improved. In addition, by adopting the heat dissipation structure provided by the above embodiment of the present application, the number of devices provided on the circuit board 2 per unit area can be increased, which is beneficial to realizing the miniaturized design of the heat dissipation structure, thereby realizing the miniaturized design of the electronic device.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (11)
1. A heat dissipation structure, comprising a circuit board, a magnetic device, a heat sink, and a heat conductive medium, the magnetic device being located between the circuit board and the heat sink, wherein:
the magnetic device comprises a magnetic core and a film-covered wire, the magnetic core comprises a stopping part and a central magnetic column, the stopping part is fixedly connected with the central magnetic column, the film-covered wire is wound around the central magnetic column, and the film-covered wire is electrically connected with the circuit board;
at least part of the side surface of the stopping part is provided with a heat conducting film, wherein the side surface is the surface of the stopping part, which is far away from the central magnetic column;
the heat conducting medium is arranged between the magnetic device and the radiator, and the heat conducting medium is in heat conducting contact with at least part of the magnetic device and the radiator.
2. The heat dissipating structure of claim 1, wherein at least a portion of a surface of the central magnetic pillar is provided with the thermal conductive film, the film envelope being in thermal conductive contact with the thermal conductive film.
3. The heat dissipation structure of claim 1 or 2, wherein the heat conductive film is disposed between the film-covered wire and the central magnetic pillar, and the film-covered wire and the heat conductive film are wound around the central magnetic pillar in a staggered manner.
4. The heat dissipating structure of any one of claims 1 to 3, wherein the heat conducting medium is a heat conducting paste that coats at least a part of the heat conducting film.
5. The heat dissipating structure of claim 4, wherein the thermally conductive adhesive encapsulates at least a portion of the magnetic core and at least a portion of the film-covered wire.
6. The heat dissipating structure of any one of claims 1 to 5, wherein a surface of the stopper portion facing the heat sink is provided with the heat conductive film.
7. The heat dissipating structure of any one of claims 1 to 6, wherein the thermally conductive film is a copper foil or a graphite film.
8. A heat dissipation structure, comprising a circuit board, a magnetic device, a heat sink, and a heat conductive medium, the magnetic device being located between the circuit board and the heat sink, wherein:
the magnetic device comprises a magnetic core and a film wrapping wire, the magnetic core comprises a stopping part and a central magnetic column, the stopping part is fixedly connected with the central magnetic column, and at least part of the surface of the central magnetic column is provided with the heat conducting film; the film wrapping line is wound on the central magnetic column and is in heat conduction contact with the heat conduction film;
the heat conducting medium is arranged between the magnetic device and the radiator, and the heat conducting medium is in heat conducting contact with at least part of the magnetic device and the radiator.
9. The heat dissipating structure of claim 8, wherein the heat conducting film is disposed between the film-covered wire and the central magnetic pillar, and the film-covered wire and the heat conducting film are wound around the central magnetic pillar in an interleaving manner.
10. A heat dissipation structure, comprising a circuit board, a magnetic device, a heat sink, and a heat conductive medium, the magnetic device being located between the circuit board and the heat sink, wherein:
the magnetic device comprises a magnetic core and a film wrapping wire, the magnetic core comprises a stopping part and a central magnetic column, the stopping part is fixedly connected with the central magnetic column, a heat conducting film is arranged between the film wrapping wire and the central magnetic column, and the film wrapping wire and the heat conducting film are wound on the central magnetic column in a staggered mode;
the heat conducting medium is arranged between the magnetic device and the radiator, and the heat conducting medium is in heat conducting contact with at least part of the magnetic device and the radiator.
11. An electronic device comprising a housing and the heat dissipation structure of any one of claims 1-10, wherein the heat dissipation structure is disposed in the housing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211362569.3A CN115831550A (en) | 2022-11-02 | 2022-11-02 | Heat radiation structure and electronic equipment |
| PCT/CN2023/105697 WO2024093335A1 (en) | 2022-11-02 | 2023-07-04 | Heat dissipation structure and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211362569.3A CN115831550A (en) | 2022-11-02 | 2022-11-02 | Heat radiation structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115831550A true CN115831550A (en) | 2023-03-21 |
Family
ID=85526237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211362569.3A Pending CN115831550A (en) | 2022-11-02 | 2022-11-02 | Heat radiation structure and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115831550A (en) |
| WO (1) | WO2024093335A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024093335A1 (en) * | 2022-11-02 | 2024-05-10 | 华为数字能源技术有限公司 | Heat dissipation structure and electronic apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411209B (en) * | 2018-11-07 | 2024-06-21 | 深圳振华富电子有限公司 | Chip inductor |
| CN110660563A (en) * | 2019-10-12 | 2020-01-07 | 台达电子企业管理（上海）有限公司 | Magnetic assembly and power module |
| CN213988539U (en) * | 2020-12-30 | 2021-08-17 | 成都金之川电子有限公司 | High-efficient heat dissipation magnetic core |
| CN115831550A (en) * | 2022-11-02 | 2023-03-21 | 华为数字能源技术有限公司 | Heat radiation structure and electronic equipment |
-
2022
- 2022-11-02 CN CN202211362569.3A patent/CN115831550A/en active Pending
-
2023
- 2023-07-04 WO PCT/CN2023/105697 patent/WO2024093335A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024093335A1 (en) * | 2022-11-02 | 2024-05-10 | 华为数字能源技术有限公司 | Heat dissipation structure and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024093335A1 (en) | 2024-05-10 |
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