CN216212731U

CN216212731U - Magnetic element structure with directional heat transfer channel

Info

Publication number: CN216212731U
Application number: CN202122705456.6U
Authority: CN
Inventors: 侯博译; 全德宝; 杨海军; 卢增艺
Original assignee: Delta Electronics Shanghai Co Ltd
Current assignee: Delta Electronics Shanghai Co Ltd
Priority date: 2021-11-05
Filing date: 2021-11-05
Publication date: 2022-04-05
Anticipated expiration: 2031-11-05

Abstract

The utility model provides a magnetic element structure with a directional heat transfer channel. The magnetic element structure comprises an inductor, a heat-conducting insulating material and a heat-dissipating cold plate. The inductor comprises a first side and a second side which are opposite to each other, and the second side is provided with a tooth-shaped surface. The heat conducting and insulating material is located on the second side of the inductor and comprises a first surface and a second surface which are opposite to each other, wherein the first surface is in thermal contact with the toothed surface. The heat dissipation cold plate is provided with a heat dissipation surface which is thermally coupled to the second surface of the heat conduction insulating material to form a directional heat transfer channel which is formed by the second side of the inductor and points to the heat dissipation cold plate through the first surface and the second surface.

Description

Magnetic element structure with directional heat transfer channel

Technical Field

The utility model relates to the technical field of power electronics, in particular to a magnetic element structure with a directional heat transfer channel.

Background

With the rapid development of switching power supply technology in various application fields, more and more power supply products are developing towards Higher efficiency (high efficiency), Higher power density (high power density), Higher reliability (high reliability) and lower cost (low cost). In order to improve the power density, the volume and the weight of each part of the whole machine can be strictly controlled, wherein the design of a light and efficient heat dissipation structure is an important condition for realizing high power density and light weight.

Generally, for a power supply with larger power, especially for a magnetic element of a main power part in an On Board Charger (OBC) system, because the heat productivity of the magnetic element is larger, especially the Core Loss (Core Loss) may account for a larger proportion, obvious heat generation may be caused, meanwhile, because the magnetic element has a higher safety requirement on the outside, the whole magnetic element is generally covered with an insulating tape or a plastic shell as an insulating layer, this insulation treatment will significantly hinder the heat dissipation of the magnetic element, and to compensate for the heat dissipation performance, the heat dissipation area of the magnetic element is often required to be greatly increased, if a larger metal shell is additionally arranged on the shell of the whole machine to be close to the magnetic element and even wrapped around the magnetic element, this conventional approach tends to be bulky, heavy, and has significant impact on the layout of the device, and it has been difficult to meet the heat dissipation and weight requirements at higher and higher power densities.

The traditional heat dissipation and insulation processing mode aiming at magnetic elements, particularly inductors wraps a plurality of layers of high-temperature adhesive tapes or plastic shells outside the inductors, however, the wrapped insulating adhesive tapes or plastic shells are poor thermal conductors, the thermal resistance is high, the inductors and a machine shell can be shielded, the heat can be conducted to the outside only by penetrating through an insulating layer with higher thermal resistance, the surface of the whole magnetic element in each direction is required to conduct heat to the outside together, the temperature of the whole magnetic element is controlled accordingly, and the temperature difference between the internal inductor and the external heat dissipation structure is larger.

In addition, the cold plate of the machine shell can be generally made into a groove shape for providing a better heat dissipation effect, the bottom and the peripheral walls are comprehensively close to the outer surface of the inductor, glue is filled into the groove and the inductor is filled into the groove and then solidified during installation, and therefore the heat dissipation structure has the defects of large volume, heavy weight, complex installation process and high cost. Moreover, the traditional heat dissipation mode is difficult to meet the heat dissipation requirement along with the increasing power of the whole machine, and the temperature of the inductor cannot be stably controlled in a proper range.

Therefore, how to develop a magnetic element structure with a directional heat transfer channel, aiming at the problem of difficult insulation and heat dissipation of the inductor, a heat dissipation structure is constructed, which not only meets the requirement of safety regulation insulation, but also can efficiently dissipate heat, has light weight and small volume, and aiming at the position of a heat dissipation cold plate, a directional efficient directional heat transfer channel is constructed, so that the heat transfer capability in the direction is greatly improved, and simultaneously the insulation requirement of the inductor in the application environment is met, thus being a problem which is greatly faced in the field.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a magnetic element structure with a directional heat transfer channel, which aims at the problem that a magnetic element, particularly an inductor, is difficult to insulate and radiate, constructs a radiating structure which not only meets the requirement of safety regulation and insulation, but also can radiate heat efficiently, is light in weight and small in volume, and aims at the position of a radiating cold plate to construct a directional efficient directional heat transfer channel, so that the heat transfer capability in the direction is greatly improved, and the insulation requirement of the inductor in an application environment is met. The directional heat transfer channel is arranged by the stacking sequence of the inductor, the heat conducting insulating material and the heat dissipation cold plate to form a vertical stacking combined structure, so that the heat dissipation efficiency of the inductor is improved, the assembly manufacturing process is simplified, and the cost is reduced.

It is another object of the present invention to provide a magnetic element structure having directional heat transfer channels. By means of the configuration of the directional heat transfer channel, the problems of difficult insulation and heat dissipation of the inductor are solved at the same time. The heat conducting insulating material is arranged between the inductor and the heat dissipation cold plate, one side of the heat conducting insulating material is embedded into and closely attached to the tooth-shaped surface of the inductor or the gap between the tooth-shaped surface and the heat dissipation cold plate, the heat conducting insulating material is closely attached to and thermally contacted with the inductor, the other side of the heat conducting insulating material is closely attached to and thermally contacted with the heat dissipation surface of the heat dissipation cold plate, and therefore the magnetic element structure with the directional heat transfer channel can be achieved, the structure is simple, and the assembly is easy. The device constructed by the inductor and the heat-conducting insulating material can construct a directional efficient directional heat transfer channel aiming at the position of the heat dissipation cold plate, and the device and the heat dissipation cold plate can be directly thermally coupled through a thermal interface material, so that the assembly procedure is simplified, the heat transfer efficiency is improved, and the insulation requirement of the inductor in the application environment is met. Furthermore, the device of the inductor and the heat-conducting insulating material framework can be further matched with the heat-conducting glue, the heat-conducting column, the potting body, the insulating layer and the like for prefabrication and forming, so that the heat-radiating efficiency of the directional heat-conducting channel is further enhanced, the creepage distance at the edge of the heat-conducting insulating material is supplemented, the insulating performance of the inductor to the bottom surface or the side surface is ensured, and the influence of a heat-radiating cold plate is avoided.

To achieve the above objective, the present invention provides a magnetic element structure. The magnetic element structure comprises an inductor, a heat-conducting insulating material and a heat-dissipating cold plate. The inductor comprises a first side and a second side which are opposite to each other, and the second side is provided with a tooth-shaped surface. The heat conducting and insulating material is located on the second side of the inductor and comprises a first surface and a second surface which are opposite to each other, wherein the first surface is in thermal contact with the toothed surface. The heat dissipation cold plate is provided with a heat dissipation surface which is thermally coupled to the second surface of the heat conduction insulating material to form a directional heat transfer channel which is formed by the second side of the inductor and points to the heat dissipation cold plate through the first surface and the second surface.

In one embodiment, the tooth tops or tooth tops of the tooth-shaped surfaces are located on the same plane.

In one embodiment, the inductor includes a magnetic core and a coil wound on the magnetic core, and the second side of the inductor forms a tooth-shaped surface.

In an embodiment, the magnetic element structure further includes a heat-conducting pillar disposed in a hollow portion of the inductor.

In an embodiment, the magnetic element structure further includes a thermal conductive adhesive disposed between the first side and the second side of the inductor.

In one embodiment, the heat conductive adhesive fills the gap of the inductor and covers the outer periphery of the inductor to form a potting body, and the heat conductive adhesive outside the outer periphery of the inductor in the potting body forms an insulating portion.

In one embodiment, a projected area of the encapsulant on the heat dissipating surface of the heat dissipating cold plate is smaller than a projected area of the thermal conductive insulating material on the heat dissipating surface.

In an embodiment, the heat conductive adhesive fills the gap of the inductor and covers the outer periphery of the inductor to form a potting body, the insulating layer covers the outer periphery of the potting body, and the insulating layer has an extending portion located between the second surface of the heat conductive insulating material and the heat dissipation surface.

In an embodiment, a projected area of the encapsulant on the heat dissipating surface of the heat dissipating cold plate is not smaller than a projected area of the thermal conductive insulating material on the heat dissipating surface.

In one embodiment, the insulating layer is a plastic sleeve.

In one embodiment, an insulating layer is attached to the outer periphery of the inductor, and the insulating layer has an extending portion located between the tooth-shaped surface of the inductor and the first surface of the heat conducting insulating material.

In one embodiment, the insulating layer is an insulating tape.

In one embodiment, the thermal conductive adhesive further includes a thermal conductive filler mixed in the thermal conductive adhesive.

In one embodiment, the thermal conductivity of the thermal conductive adhesive is greater than 0.5W/m.K.

In an embodiment, the inductor includes a pair of outgoing line pins disposed on the first side.

In an embodiment, the inductor further includes a base disposed on the first side, wherein the pair of outgoing pins are led out through the base.

In one embodiment, the heat conductive and insulating material is alumina ceramic, aluminum nitride ceramic, boron nitride ceramic, heat conductive plastic, heat conductive silicone sheet with insulating layer, or high temperature insulating tape.

In one embodiment, the inductor is a circular flat wire vertically wound coil inductor, a circular wire inductor, a square iron core flat wire vertically wound coil inductor, or a square iron core circular wire inductor.

In an embodiment, the heat sink is a liquid-cooled heat sink, and further includes a liquid channel.

In one embodiment, the heat dissipation cold plate is an air-cooled heat dissipation plate and further comprises a heat dissipation fin.

In an embodiment, the inductor is a Power Factor Correction (PFC) inductor or an inverter inductor in a PFC circuit of an On-Board Charger (On-Board Charger) Power supply.

The magnetic element structure with the directional heat transfer channel has the advantages that the magnetic element structure with the directional heat transfer channel is provided, the heat dissipation structure which not only meets the requirement of safety regulation insulation, but also can dissipate heat efficiently, is light in weight and small in size is constructed aiming at the problem that the inductance is difficult to insulate and dissipate heat, and the directional efficient directional heat transfer channel is constructed aiming at the position of the heat dissipation cold plate, so that the heat transfer capability in the direction is greatly improved, and meanwhile, the insulation requirement of the inductance in an application environment is met.

Drawings

Figure 1 schematically illustrates a first embodiment of the utility model in the form of a magnetic element having a directional heat transfer channel.

Fig. 2 schematically shows an exploded view of a device constructed by an inductor and a thermally conductive insulating material according to a first embodiment of the present invention.

Fig. 3 is a sectional view schematically showing the structure of a magnetic element having a directional heat transfer channel according to a first embodiment of the present invention.

Fig. 4 schematically illustrates an exemplary configuration of a heat sink cold plate suitable for use in the magnetic element configuration of the present invention.

Fig. 5 schematically illustrates another exemplary configuration of a heat sink cold plate suitable for use in the magnetic element configuration of the present invention.

Fig. 6 is a sectional view schematically showing the structure of a magnetic element having a directional heat transfer channel according to a second embodiment of the present invention.

Fig. 7 is a sectional view schematically showing the structure of a magnetic element having a directional heat transfer channel according to a third embodiment of the present invention.

Fig. 8 is a sectional view schematically showing the structure of a magnetic element having a directional heat transfer channel according to a fourth embodiment of the present invention.

Fig. 9 is a sectional view schematically showing the structure of a magnetic element having a directional heat transfer channel according to a fifth embodiment of the present invention.

Fig. 10 is a sectional view schematically showing the structure of a magnetic element having a directional heat transfer channel according to a sixth embodiment of the present invention.

Fig. 11 is a schematic structural exploded view of a device constructed by an inductor and a thermally conductive insulating material according to a sixth embodiment of the present invention.

Fig. 12 is a perspective view schematically illustrating a device constructed by an inductor and a thermally conductive insulating material according to a sixth embodiment of the present invention.

Detailed Description

Some exemplary embodiments that embody features and advantages of the utility model will be described in detail in the description that follows. As will be realized, the utility model is capable of other and different modifications and its several details are capable of modifications in various obvious respects, all without departing from the utility model, and the description and drawings are to be regarded as illustrative in nature, and not as restrictive. For example, the following description of the present disclosure describes the placement of a first feature over or on a second feature, including embodiments in which the first and second features are placed in direct contact, and also includes embodiments in which additional features can be placed between the first and second features, such that the first and second features may not be in direct contact. In addition, repeated reference characters and/or designations may be used in various embodiments of the disclosure. These repetitions are for simplicity and clarity and are not intended to limit the relationship between the various embodiments and/or the appearance structures. Furthermore, spatially relative terms, such as "under", "below", "lower", "above", "upper" and the like, may be used herein for convenience in describing the relationship of one element or feature to another element(s) or feature(s) in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. Further, when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. In addition, it is to be understood that although the terms "first", "second", "third", etc. may be used in the claims to describe various elements, these elements should not be limited by these terms, and the elements described in the embodiments are denoted by different reference numerals. These terms are for the respective different components. For example: a first component may be termed a second component, and similarly, a second component may be termed a first component without departing from the scope of the embodiments. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Except in the operating/working examples, or unless explicitly stated otherwise, all numerical ranges, amounts, values and percentages disclosed herein (e.g., those percentages of angles, time durations, temperatures, operating conditions, ratios of amounts, and the like) are to be understood as modified in all embodiments by the term "about" or "substantially". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the present disclosure and attached claims are approximations that may vary as desired. For example, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges may be expressed herein as from one end point to the other end point or between the two end points. All ranges disclosed herein are inclusive of the endpoints unless otherwise specified.

Figure 1 schematically illustrates a first embodiment of the utility model in the form of a magnetic element having a directional heat transfer channel. Fig. 2 schematically shows an exploded view of a device constructed by an inductor and a thermally conductive insulating material according to a first embodiment of the present invention. Fig. 3 is a sectional view schematically showing the structure of a magnetic element having a directional heat transfer channel according to a first embodiment of the present invention. In the present embodiment, the magnetic element structure 1 has a directional heat transfer channel P, for example, pointing in the Z-axis direction. The magnetic element structure 1 is composed of an inductor 10, a heat conducting insulating material 20 and a heat dissipating cold plate 30. The inductor 10 of the magnetic element structure 1 is, for example, a Power Factor Correction (PFC) inductor or an inverter inductor in a PFC circuit of an On-Board Charger (On-Board Charger) Power supply, which is not limited in the present invention. The inductor 10 has only functional insulating capability or no insulating capability to the outside. The directional heat transfer channel P is formed by the inductor 10, the thermally conductive insulating material 20, and the heat sink cold plate 30 arranged along the Z-axis, for example. In the present embodiment, the inductor 10 at least includes a magnetic core 13 and a coil 14, and the coil 14 is wound on the magnetic core 13 to form a first side 11 and a second side 12 of the inductor 10 opposite to each other. In the present embodiment, the coil 14 is regularly wound around the core 14, such that the coil 14 forms a tooth-shaped surface 141 on the second side 12 of the inductor 10. Wherein the tooth top points 142 (or tooth top lands) of the toothed surfaces 141 lie on the same plane S. It should be noted that the toothed surface 141 has a larger heat transfer area than a flat surface, and the addendum points 142 (or addendum faces) are not strictly required to be located on the same plane S, but approximately on the same plane due to certain tolerances during winding of the coil. In the present embodiment, the inductor 10 is, for example, one selected from the group consisting of a circular flat wire inductor, a circular wire inductor, a square iron core flat wire inductor, and a square iron core circular wire inductor, and the flat wire vertical wire inductor has the best effect. In an embodiment, the inductor 10 formed in the annular flat wire vertical winding inductor further includes a hollow portion 15 for adding other structures for enhancing heat dissipation efficiency, which is not limited by the utility model. In the present embodiment, the thermal conductive and insulating material 20 is disposed between the inductor 10 and the heat sink cold plate 30, and the thermal conductive and insulating material 20 includes a first surface 21 and a second surface 22 opposite to each other. The first surface 21 is located on a side, for example, embedded and pressed against the tooth-shaped surface 141 or a gap therebetween, and closely attached and in thermal contact with the side surface and the top surface of the coil 14. In this embodiment, when the heat conductive insulating material 20 is assembled with the inductor 10, the first surface 21 of the heat conductive insulating material 20 is deformed to fit the tooth-shaped surface 141 of the coil 14 and the gap therebetween, which is not limited by the utility model. When the heat conductive insulating material 20 is made of a material with a high hardness, the first surface 21 may be closely attached to the toothed surface 141 of the coil 14. The other side of the second surface 22 is in close proximity and thermal contact with the cold sink plate 30. Thereby, the heat of the inductor 10 is efficiently conducted to the tooth-shaped surface 141 or the gap thereof through the wires of the coil 14, and is efficiently conducted to the heat-conducting insulating material 20 through the large thermal contact surface formed by the tooth-shaped surface 141 and the heat-conducting insulating material 20, and then is conducted to the heat-dissipating cold plate 30 on the other side, i.e. the directional heat-conducting channel P in the Z-axis direction is realized.

In the present embodiment, the inductor 10 includes a base 16 and a pair of outgoing pins 17, the base 16 and the outgoing pins 17 are disposed on the first side 11, and the outgoing pins 17 are led out through the base 16. It should be noted that the inductor 10 and the heat conducting and insulating material support 20 may be configured as a device 2 and then disposed on the heat dissipation cold plate 30. Of course, the utility model is not limited thereto. In addition, it should be noted that the thermal insulation material 20 is disposed between the inductor 10 and the heat sink cold plate 30, and besides the area and thickness of the thermal insulation material 20 are used to configure the directional heat transfer channel P, the requirement of the insulation distance between the inductor 10 and the heat sink cold plate 30 is further ensured. In one embodiment, the thermal conductive insulating material 20 may be made of an insulating material with a small thermal resistance, such as alumina ceramic (thermal conductivity of 16W/m · K), boron nitride ceramic (thermal conductivity of 33W/m · K), thermal conductive plastic, a thermal conductive silicone sheet with an insulating layer, or a high temperature adhesive tape.

In the present embodiment, the heat sink cold plate 30 is the heat transfer end point of the inductor 10, and the heat generated by the entire device 2 including the inductor 10 and the heat conductive insulating material 20 is transferred through the directional heat transfer channel P and finally discharged to the outside through the heat sink cold plate 30. Fig. 4 schematically illustrates an exemplary configuration of a heat sink cold plate suitable for use in the magnetic element configuration of the present invention. Figure 5 schematically illustrates another exemplary configuration of a heat sink cold plate suitable for use in the magnetic element configuration of the present invention. In an embodiment, the heat sink cold plate 30a is, for example, a liquid-cooled heat sink plate, as shown in fig. 4, the heat sink cold plate 30a further includes a liquid flow channel 31 configured to dissipate heat, which is conducted from the magnetic device structure 1 through the directional heat transfer channel P, to the outside for discharging. In another embodiment, the heat sink cold plate 30b is, for example, an air-cooled heat sink plate, as shown in fig. 5, the heat sink cold plate 30b further includes a heat sink fin 32 configured to dissipate heat conducted from the magnetic element structure 1 through the directional heat transfer channel P to the outside for emission. Of course, the present invention is not limited to the form of the heat-dissipating cold plate 30, and any heat-dissipating cold plate that meets various heat-dissipating conditions such as heat conduction, heat convection, and heat radiation is suitable for the carrier 2, so as to realize the magnetic element structure 1 with the directional heat-transferring channel P according to the present invention. Of course, the present invention is not limited thereto and will not be described in detail.

Fig. 6 is a sectional view schematically showing the structure of a magnetic element having a directional heat transfer channel according to a second embodiment of the present invention. In this embodiment, the magnetic element structure 1a is similar to the magnetic element structure 1 shown in fig. 1 to 5, and the same component numbers represent the same components, structures and functions, which are not described herein again. In this embodiment, the magnetic element structure 1a further includes a thermal conductive adhesive 40. The heat conductive adhesive 40 is filled in the hollow portion 15 (see fig. 3) of the inductor 10, for example, and is located between the first side 11 and the second side 12. In the present embodiment, the thermal conductive paste 40 is, for example, a thermal conductive material filled between the magnetic core 13 and the winding 14, and has a thermal conductivity >0.5W/m · K, which can help to better conduct the heat inside the inductor 10 to the toothed surface 141 of the inductor 10. In an embodiment, the heat conductive glue 40 includes, for example, a general heat conductive colloid, a heat conductive silicone grease, a phase change material, or a heat conductive glue, a heat conductive silicone grease, or the like mixed with a granular or powdery solid heat conductive material, and the internal air bubbles can be removed by evacuation or standing during the processing process to prevent the heat conductive glue from obstructing the heat transfer. Of course, the utility model is not limited thereto.

Fig. 7 is a sectional view schematically showing the structure of a magnetic element having a directional heat transfer channel according to a third embodiment of the present invention. In the present embodiment, the magnetic element structure 1b is similar to the magnetic element structure 1a shown in fig. 6, and the same component numbers represent the same components, structures and functions, which are not described herein again. In this embodiment, the heat conductive adhesive 40 of the magnetic element structure 1b fills the gap of the inductor 10 and covers the outer periphery of the inductor 10 to form a potting 4, and the heat conductive adhesive outside the outer periphery of the inductor in the potting 4 forms an insulating portion 41. In this embodiment, when the area of the inductor 10 is limited or insulation requirements are imposed on other side elements, the insulation portion 41 may be added. In this embodiment, the projection area of the encapsulant 4 on the heat dissipating surface 33 of the heat dissipating cold plate 30 is smaller than the projection area of the heat conducting insulating material 20 on the heat dissipating surface 33, so that the encapsulant 4 can be matched with the heat conducting insulating material 20 to supplement the creepage distance at the edge of the heat conducting insulating material 20 in the form of an edge-covered insulating portion 41, thereby ensuring the insulating property of the inductor 10 to the bottom surface or the side surface. Of course, the utility model is not so limited.

Fig. 8 is a sectional view schematically showing the structure of a magnetic element having a directional heat transfer channel according to a fourth embodiment of the present invention. In this embodiment, the magnetic element structure 1c is similar to the magnetic element structure 1b shown in fig. 7, and the same component numbers represent the same components, structures and functions, which are not described herein again. In this embodiment, the thermal conductive adhesive 40 of the magnetic device structure 1c fills the gap of the inductor 10 and covers the outer periphery of the inductor 10 to form a potting body 4, an insulating layer 50 covers the outer periphery of the potting body 4 and is mainly attached to the outer periphery of the inductor 10, and the insulating layer 50 has an extending portion 51, and the extending portion 51 is located between the toothed surface 141 of the inductor 10 and the first surface 21 of the thermal conductive insulating material 20. In the present embodiment, the insulating layer 50 is, for example, an insulating tape. Of course, the utility model is not limited thereto. In the present embodiment, the insulating layer 50 has a better insulating effect than the encapsulant 4, and can be coated after the encapsulant 4 is formed. In other words, the insulating layer 50, the potting body 4 and the heat conducting and insulating material 20 are structurally matched, so that the creepage distance at the edge of the heat conducting and insulating material 20 can be further supplemented in a form of edge covering of the insulating layer 50, and the insulating performance of the inductor 10 to the bottom surface or the side surface can be ensured. Of course, the utility model is not so limited.

Fig. 9 is a sectional view schematically showing the structure of a magnetic element having a directional heat transfer channel according to a fifth embodiment of the present invention. In the present embodiment, the magnetic element structure 1d is similar to the magnetic element structure 1c shown in fig. 8, and the same component numbers represent the same components, structures and functions, which are not described herein again. In the present embodiment, the magnetic element structure 1d further includes a heat conducting pillar 60, which is accommodated in the hollow portion 15 (see fig. 3) of the inductor 10 and extends from the base 16 along the Z-axis direction, i.e. parallel to the directional heat transfer channel P, so as to further enhance the directional heat transfer performance of the magnetic element structure 1 d. In this embodiment, the thermal conductive adhesive 40 of the magnetic element structure 1d is filled in the gap of the inductor 10 and covers the thermal conductive pillar 60 and the outer periphery of the inductor 10 to form a potting body 4, and the insulating layer 50 covers the outer periphery of the potting body 4. The heat-conducting pillar 60 is made of, for example, a metal material or a heat-conducting ceramic, and has a better heat-conducting performance in the Z-axis direction than the heat-conducting paste 40. Therefore, the directional heat transfer performance of the magnetic element structure 1d can be further enhanced by the arrangement of the heat conduction pillar 60. In other embodiments, the thermal conductive paste 40 and the insulating layer 50 can be omitted, and the thermal conductive pillar 60 is directly thermally coupled to the thermal conductive insulating material 20, so as to optimize the directional heat transfer performance of the magnetic element structure 1d and simplify the packaging of the magnetic element structure 1 d. Of course, the utility model is not limited thereto.

Fig. 10 is a sectional view schematically showing the structure of a magnetic element having a directional heat transfer channel according to a sixth embodiment of the present invention. Fig. 11 is a schematic structural exploded view of a device constructed by an inductor and a thermally conductive insulating material according to a sixth embodiment of the present invention. Fig. 12 is a perspective view schematically illustrating a device constructed by an inductor and a thermally conductive insulating material according to a sixth embodiment of the present invention. In this embodiment, the magnetic element structure 1e is similar to the magnetic element structure 1 shown in fig. 1 to 5, and the same component numbers represent the same components, structures and functions, which are not described herein again. In the present embodiment, the magnetic element structure 1e includes an inductor 10, a thermal conductive insulating material 20, a heat sink cold plate 30, a thermal conductive adhesive 40, and an insulating layer 50 a. The inductor 10 is, for example, a Power Factor Correction (PFC) inductor or an inverter inductor in a PFC circuit of an On-Board Charger (On-Board Charger) Power supply, and has a functional insulating capability or no insulating capability to the outside. In the present embodiment, the coil 14 of the inductor 10 is wound around the magnetic core 13 and fixed on the base 16, and the inductor 10 includes a first side 11 and a second side 12 opposite to each other. In addition, the coil 14 further forms a tooth-shaped surface 141 with a larger heat transfer area on the second side 12 of the inductor 10. Wherein the tooth top points 142 (or tooth top lands) of the toothed surfaces 141 lie approximately on the same plane S. In the present embodiment, the thermally conductive insulating material 20 is disposed between the inductor 10 and the heat sink cold plate 30 on the second side 12 of the inductor 10. The thermally conductive insulating material 20 includes a first surface 21 and a second surface 22 opposite to each other. The side of the first surface 21 is, for example, embedded and tightly attached to the tooth-shaped surface 141 or its gap, and closely attached to and in thermal contact with the top surface of the coil 14, and the side surface of the coil 14 closely attached to and in thermal contact with the heat conductive paste 40, while the local heat conductive paste 40 closely attached to and in thermal contact with the first surface 21. The other side of the second surface 22 is in close thermal contact with the heat sink surface 33 of the heat sink cold plate 30, thereby forming a directional heat transfer path P for the second side 12 of the inductor 10 to direct the first surface 21 and the second surface 22 toward the heat sink cold plate. Therefore, the heat of the inductor 10 is efficiently conducted to the toothed surface 141 through the wires of the coil 14, and is efficiently conducted to the heat-conducting insulating material 20 through the larger contact surface formed by the toothed surface 141 and the heat-conducting insulating material 20, and then is conducted to the heat-dissipating cold plate 30 on the other side, i.e., the directional heat-conducting channel P along the Z-axis direction is realized.

In the embodiment, the thermal conductive adhesive 40 fills the gap of the inductor 10 and covers the outer periphery of the inductor 10 to form the potting body 4, the first surface 21 of the thermal conductive insulating material 20 is connected to the toothed surface 141 of the inductor 10, and the insulating layer 50a covers the outer periphery of the potting body 4 and the thermal conductive insulating material 20. The insulating layer 50a has an extending portion 51, and the extending portion 51 is located between the second surface 22 of the thermal conductive insulating material 20 and the heat dissipating surface 33. The projection area of the potting body 4 on the heat dissipation surface 33 of the heat dissipation cold plate 30 is not smaller than the projection area of the heat conductive insulating material 20 on the heat dissipation surface 33. The heat of the inductor 40 can be efficiently transferred to the outer surface of the body of the inductor 10 through the potting adhesive 4 formed by the heat-conducting adhesive 40. In addition, the body of the inductor 10 is tightly attached to the heat conducting and insulating material 20, so that heat can be transferred out through the heat conducting and insulating material 20. The second surface 22 of the thermally conductive insulating material 20 is in thermal contact with the cold plate 30, thereby forming a directed heat transfer path from the inductor 10 to the cold plate 30, i.e., a directed heat transfer path P along the Z-axis. Due to the low thermal resistance of the directional heat transfer channel P, heat can be efficiently transferred from the inductor 10 to the heat-dissipating cold plate 30 through the potting body 4, the heat-conducting insulating material 20, and the like.

In the present embodiment, the insulating layer 50a is, for example, a plastic sleeve. The inductor 10, the thermally conductive insulating material 20, the thermally conductive adhesive 40 and the insulating layer 50a are further configured as a device 2a, for example. The device 2a may be pre-fabricated to form a unitary structural entity and thermally coupled to the heat dissipating surface 33 of the heat sink cold plate 30, for example, by a thermally conductive adhesive, a thermally conductive paste, or directly. The heat generated by the entire device 2a is transferred through the directional heat transfer channel P and then finally discharged to the outside through the heat-dissipating cold plate 30, thereby providing the inductor 10 with an optimized heat-dissipating efficiency. On the other hand, for example, the material and thickness of the insulating layer 50a of the plastic sleeve can both meet the requirement of solid insulating thickness, the extension portion 51 of the insulating layer 50a covers a part of the edge-covering length of the heat-conducting insulating material 20, which can further extend to reach the safety requirement, and the size can be adjusted according to the actual application scenario, so as to meet the insulating requirement of the inductor 10 in different application environments. Of course, the utility model is not so limited.

In addition, it should be noted that the entire device 2a constructed by the inductor 10, the heat conducting insulating material 20, the heat conducting glue 40 and the insulating layer 50a may construct a directional efficient directional heat transfer channel P at the position of the heat dissipation cold plate 30, and the device 2a and the heat dissipation cold plate may be thermally coupled through a thermal interface material or directly, thereby simplifying the assembly procedure, improving the heat transfer efficiency, and satisfying the insulation requirement of the inductor 10 in the application environment. In the embodiment, the inductor 10 and the heat conductive insulating material 20 are pre-disposed on the insulating layer 50a of the plastic sleeve, for example, and the tooth-shaped surface 141 of the inductor 10 is tightly attached to the heat conductive insulating material 20 and is accommodated in the insulating layer 50a of the plastic sleeve. Wherein the extension 51 of the insulating layer 50a wraps around the outer peripheral portion of the second surface 22 of the thermally conductive and insulating material 20. Then, the thermal conductive adhesive 40 is filled through the opening on the base 16, for example, to fill the gap of the inductor 10 and cover the outer periphery of the inductor 10 and a portion of the first surface 21 of the thermal conductive insulating material 20 to form the potting body 4, so as to form the whole device 2a, that is, to construct a directional and efficient directional heat transfer channel corresponding to the heat dissipation surface 33 of the heat dissipation cold plate 30, so as to effectively transfer the heat inside the inductor 10 to the toothed surface 141 of the inductor 10. Of course, the utility model is not limited to the architectural procedure of the device 2 a. In other embodiments, one of the thermal conductive paste 40 and the insulating layer 50a of the device 2a may be omitted. The present invention is not limited thereto and will not be described in detail.

In summary, embodiments of the present invention provide a magnetic element structure with a directional heat transfer channel, so as to construct a heat dissipation structure that not only meets the requirement of safety regulation for insulation, but also can dissipate heat efficiently, has light weight and small volume, and to construct a directional efficient directional heat transfer channel at the position of a heat dissipation cold plate, thereby greatly improving the heat transfer capability in this direction, and simultaneously meeting the insulation requirement of an inductor in an application environment. The directional heat transfer channel forms a vertical stack combined structure by stacking and arranging the inductor, the heat-conducting insulating material and the heat-dissipating cold plate, so that the heat-dissipating efficiency of the inductor is improved, the assembly and manufacturing process is simplified, and the cost is reduced. In addition, the heat-conducting insulating material is arranged between the inductor and the heat-radiating cold plate, one side of the heat-conducting insulating material is embedded into and closely attached to the tooth-shaped surface of the inductor or the gap between the tooth-shaped surface and the tooth-shaped surface, and is closely attached to and thermally contacted with the inductor, and the other side of the heat-conducting insulating material is closely attached to and thermally contacted with the heat-radiating surface of the heat-radiating cold plate, so that the magnetic element structure with the directional heat-conducting channel can be realized, the structure is simplified, and the assembly is easy. The device constructed by the inductor and the heat-conducting insulating material can construct a directional efficient directional heat transfer channel aiming at the position of the heat dissipation cold plate, and the device and the heat dissipation cold plate can be directly thermally coupled through a thermal interface material, so that the assembly procedure is simplified, the heat transfer efficiency is improved, and the insulation requirement of the inductor in the application environment is met. Furthermore, the device of the inductor and the heat-conducting insulating material framework can be further matched with the heat-conducting glue, the heat-conducting column, the potting body, the insulating layer and the like for prefabrication and forming, so that the heat-radiating efficiency of the directional heat-conducting channel is further enhanced, the creepage distance at the edge of the heat-conducting insulating material is supplemented, the insulating performance of the inductor to the bottom surface or the side surface is ensured, and the influence of a heat-radiating cold plate is avoided.

The utility model may be modified in various ways by anyone skilled in the art without however departing from the scope of the appended claims.

Claims

1. A magnetic element structure having a directional heat transfer channel, the magnetic element structure comprising:

an inductor comprising a first side and a second side opposite to each other, the second side having a tooth-shaped surface;

a thermally conductive insulating material on the second side of the inductor, the thermally conductive insulating material including a first surface and a second surface opposite to each other, wherein the first surface is in thermal contact with the tooth-shaped surface; and

and the heat dissipation cold plate is provided with a heat dissipation surface which is thermally coupled to the second surface of the heat conduction insulating material to form a directional heat transfer channel which points to the heat dissipation cold plate from the second side of the inductor through the first surface and the second surface.

2. The magnetic element structure with directional heat transfer channels of claim 1, wherein the tooth tops or tooth tops of the toothed surfaces are located on the same plane.

3. The magnetic element structure of claim 2, wherein the inductor comprises a core and a coil wound around the core, the second side of the inductor forming the tooth-shaped surface.

4. The magnetic element structure with directional heat transfer channels of claim 2, further comprising a heat conducting post received in a hollow portion of the inductor.

5. The magnetic element structure of claim 1, further comprising a thermally conductive adhesive between the first side and the second side of the inductor.

6. The structure of claim 5, wherein the thermal conductive paste fills the gaps of the inductor and covers the outer periphery of the inductor to form a potting, and the thermal conductive paste in the potting outside the outer periphery of the inductor forms an insulating portion.

7. The magnetic element structure with directional heat transfer channels of claim 6, wherein the projected area of the potting body on the heat dissipation surface of the heat dissipation cold plate is smaller than the projected area of the thermally conductive and insulating material on the heat dissipation surface.

8. The magnetic device structure of claim 5, wherein the thermal conductive paste fills the gap of the inductor and covers the outer periphery of the inductor to form a potting body, an insulating layer covers the outer periphery of the potting body, and the insulating layer has an extending portion between the second surface of the thermal conductive insulating material and the heat dissipating surface.

9. The magnetic element structure with directional heat transfer channels of claim 8, wherein the projected area of the potting body on the heat dissipation surface of the heat dissipation cold plate is not smaller than the projected area of the thermally conductive insulating material on the heat dissipation surface.

10. The magnetic element structure of claim 8, wherein the insulating layer is a plastic sleeve.

11. The magnetic element structure of claim 5, wherein an insulating layer is attached to the outer periphery of the inductor and has an extension portion between the tooth-shaped surface of the inductor and the first surface of the thermally conductive insulating material.

12. The magnetic element structure of claim 11, wherein the insulating layer is an insulating tape.

13. The magnetic element structure with directional heat transfer channels of claim 5, wherein the thermally conductive paste further comprises a thermally conductive filler material mixed in the thermally conductive paste.

14. The magnetic element structure with directional heat transfer channels of claim 5, wherein the thermal conductivity of the thermally conductive paste is greater than 0.5W/m-K.

15. The magnetic element structure having a directional heat transfer channel of claim 1, wherein the inductor comprises a pair of outlet leads disposed on the first side.

16. The magnetic element structure of claim 15, wherein the inductor further comprises a base disposed on the first side, wherein the pair of outlet pins exit through the base.

17. The magnetic element structure with directional heat transfer channels according to claim 1, wherein the thermally conductive and insulating material is alumina ceramic, aluminum nitride ceramic, boron nitride ceramic, thermally conductive plastic, thermally conductive silicone sheet with insulating layer, or high temperature tape.

18. The magnetic element structure with directional heat transfer channels of claim 1, wherein the inductor is a toroid edgewise coil inductor, a toroid circular inductor, a square core edgewise coil inductor, or a square core circular inductor.

19. The magnetic element structure of claim 1, wherein the heat sink cold plate is a liquid-cooled heat sink plate and further comprises a liquid flow channel.

20. The magnetic element structure with directional heat transfer channels of claim 1, wherein the heat sink cold plate is an air-cooled heat sink plate and further comprises a heat sink fin.

21. The magnetic element structure with directional heat transfer channels of claim 1, wherein the inductor is a power factor correction inductor or an inverter inductor in a power factor correction circuit of an onboard charger power supply.