CN115821027A - Method, device and equipment for eliminating residual stress based on laser ultrasound - Google Patents
Method, device and equipment for eliminating residual stress based on laser ultrasound Download PDFInfo
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Abstract
Embodiments of the present application provide methods, apparatus, devices and computer readable storage devices for laser ultrasound based residual stress relief. The method includes generating a three-dimensional topography model of a component based on three-dimensional model data of the component; determining a scan path and an excitation distance based on a three-dimensional topography model of the component; and adjusting the distance and the angle between a laser and a component in real time according to the scanning path and the excitation distance to enable the laser and the surface of the component to reach the excitation distance, adjusting the laser power density of the laser to emit laser to the component, exciting laser ultrasonic waves on the surface of the component, and removing residual stress in the component. In this way, an effective and fast elimination of residual stresses inside the component is achieved.
Description
Technical Field
Embodiments of the present application relate to the field of ultrasonic vibration, and in particular, to a method, an apparatus, a device, and a computer-readable storage device for laser ultrasound-based residual stress relief.
Background
The metal component is subjected to the processes of welding, casting, forging, machining and the like to cause internal lattice deformation, so that residual stress is inevitably generated, the ultimate strength and the fatigue strength of the component are greatly reduced, even cracks and brittle fracture are generated, and parts are deformed due to the relaxation of the residual stress in the process of processing and using, so that the size, the position precision and the whole performance of the component are greatly influenced.
Currently, methods for reducing residual stress mainly include annealing, mechanical treatment, shot blasting, ultrasound, explosion methods, etc., and although the above methods can all eliminate residual stress, the following defects still exist:
annealing: the creep phenomenon of low-temperature aging treatment is not obvious, the reduction amplitude of residual stress is small, and the precipitation phase is too thick along with the increase of temperature and the increase of heating time, so that the overaging phenomenon is generated, and the strength of the material is reduced;
mechanical treatment: for a simple structure, effective residual stress relaxation can be generated by applying plastic deformation through stretching as soon as possible after processing, but stretching is only limited to the geometric shape of a constant section so as to ensure uniform plastic deformation, and the method is not suitable for large-scale aviation components with complex shapes;
shot blasting: only the residual stress of the surface layer can be processed, and the cost consumption is higher;
ultrasonic: limited by energy density, effective only for a portion of the material; high-energy ultrasound requires loading and unloading probes before and after treatment, and water coupling treatment is required for parts with complex structures and small sizes, so that the efficiency is low;
explosion method: this is achieved by arranging an explosive charge on the surface of the component and then detonating, a too violent explosion may cause the initiation and propagation of a crack.
Therefore, how to effectively and quickly eliminate the residual stress inside the component is a problem that needs to be solved at present.
Disclosure of Invention
According to an embodiment of the present application, a laser ultrasound based residual stress relief scheme is provided.
In a first aspect of the present application, a method of laser ultrasound based residual stress relief is provided. The method comprises the following steps:
generating a three-dimensional topography model of a component based on three-dimensional model data of the component;
determining a scan path and an excitation distance based on a three-dimensional topography model of the component;
and adjusting the distance and the angle between a laser and the component in real time according to the scanning path and the excitation distance to enable the laser to be perpendicular to the surface of the component and reach the excitation distance, adjusting the laser power density of the laser to emit laser to the component, exciting laser ultrasonic waves on the surface of the component, and removing residual stress in the component.
Further, the determining a scan path based on the three-dimensional topographical model of the component comprises:
determining key points of the three-dimensional shape of the component based on the three-dimensional shape model of the component;
determining a scanning area through the key points of the three-dimensional morphology;
based on the scan region, a scan path is generated.
Further, the determining key points of the three-dimensional shape of the member based on the three-dimensional shape model of the member comprises:
and determining key points of the three-dimensional shape of the component according to the view angle of the three-dimensional shape model.
Further said generating a scan path based on said scan region comprises:
if the scanning area is smaller than the threshold value, the scanning path is generated by directly adopting a mode of approaching from the middle to the edge.
Further, the generating a scan path based on the scan region comprises:
if the scanning area is smaller than the threshold value, dispersing the scanning area into a scanning grid;
discretizing the scanning grid to obtain a series of scanning points;
and generating a scanning path based on the scanning points.
Further, still include:
if the scanning area is a non-rectangular area, dividing the center of the scanning area into a rectangular or square area, and filling the edge area with a triangular area.
Further, the adjusting the distance and angle between the laser and the member in real time according to the scanning path and the excitation distance so that the laser is perpendicular to the surface of the member and reaches the excitation distance comprises:
performing plane fitting on the three-dimensional point cloud in the scanning area to determine the normal direction of the area;
and adjusting the distance and the angle between the laser and the component in real time according to the normal direction, so that the laser is perpendicular to the surface of the component and reaches the excitation distance.
In a second aspect of the present application, a laser ultrasound based residual stress relief device is provided. The device includes industrial computer, arm and laser instrument:
the industrial personal computer is used for generating a three-dimensional shape model of the component based on three-dimensional model data of the component;
determining a scan path and an excitation distance based on a three-dimensional topography model of the component;
according to the scanning path and the excitation distance, the distance and the angle between a laser and a component are adjusted in real time through a mechanical arm, so that the laser is perpendicular to the surface of the component and reaches the excitation distance, and the laser power density of the laser is adjusted;
the laser is used for emitting laser to the component to excite laser ultrasonic waves on the surface of the component so as to remove residual stress in the component;
the mechanical arm is used for adjusting the distance and the angle between the laser and the component in real time.
In a third aspect of the present application, an electronic device is provided. The electronic device includes: a memory having a computer program stored thereon and a processor implementing the method as described above when executing the program.
In a fourth aspect of the present application, a computer-readable storage medium is provided, on which a computer program is stored which, when being executed by a processor, carries out the method as according to the first aspect of the present application.
According to the residual stress eliminating method based on the laser ultrasound, a three-dimensional shape model of a component is generated through three-dimensional model data based on the component; determining a scan path and an excitation distance based on a three-dimensional topography model of the component; and adjusting the distance and the angle between a laser and the component in real time according to the scanning path and the excitation distance to enable the laser to be perpendicular to the surface of the component and reach the excitation distance, adjusting the laser power density of the laser to emit laser to the component, exciting laser ultrasonic waves on the surface of the component, removing residual stress in the component, and effectively and quickly eliminating the residual stress in the component.
It should be understood that what is described in this summary section is not intended to limit key or critical features of the embodiments of the application, nor is it intended to limit the scope of the application. Other features of the present application will become apparent from the following description.
Drawings
The above and other features, advantages and aspects of various embodiments of the present application will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters designate like or similar elements, and wherein:
FIG. 1 shows a flow diagram of a method of laser ultrasound based residual stress relief according to an embodiment of the present application;
FIG. 2 illustrates a scan path planning method according to an embodiment of the present application;
FIG. 3 shows a schematic diagram of another scan path planning method according to an embodiment of the present application;
FIG. 4 illustrates a block diagram of a laser ultrasound based residual stress relief apparatus according to an embodiment of the present application;
fig. 5 shows a schematic structural diagram of a terminal device or a server suitable for implementing the embodiments of the present application.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are some, but not all embodiments of the present disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
In addition, the term "and/or" herein is only one kind of association relationship describing an associated object, and means that there may be three kinds of relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter associated objects are in an "or" relationship.
FIG. 1 shows a flow diagram of a method of laser ultrasound based residual stress relief in accordance with an embodiment of the present disclosure. The method comprises the following steps:
s110, three-dimensional model data of the component is obtained.
In some embodiments, three-dimensional model data of the component can be directly obtained through three-dimensional scanning, computer interface importing and/or shape parameter setting and the like; a two-dimensional image of a member may also be acquired by a binocular camera or the like, and the two-dimensional image may be converted into three-dimensional model data of the member. That is, the means is photographed using a binocular camera, resulting in a synchronized exposure image. And determining the third-dimensional depth information of the image through two-dimensional image pixel points of the image, and then fusing and splicing the three-dimensional appearance of the member according to the image to generate three-dimensional model data of the member.
The binocular camera is used for collecting images, so that the hardware cost is further reduced, and the binocular camera can be used as a common CMOS camera and is applicable indoors and outdoors.
In some embodiments, the three-dimensional model data includes a feature, position, size, bending, compression, shear, tension, torsion, and/or compound forces, etc. of the component.
In some embodiments, the member is typically a variety of acoustically transparent solid materials such as steel, aluminum alloys, copper alloys, titanium alloys, and/or superalloys.
And S120, generating a three-dimensional appearance model of the component based on the three-dimensional model data of the component.
In some embodiments, a three-dimensional topographical model of the component is generated by three-dimensional modeling software based on three-dimensional model data for the component.
S130, determining a scanning path and an excitation distance based on the three-dimensional shape model of the component.
In some embodiments, based on a three-dimensional topography of a component, keypoints of the three-dimensional topography are determined; the key points include edge points and/or geometric centers, etc.
Further, determining a scanning area according to the key points of the three-dimensional topography, and if the scanning area is smaller than a preset range, planning a scanning path by adopting a mode of approaching from the middle to the edge as shown in fig. 2, or planning the scanning path by adopting a sequential scanning mode as shown in fig. 3;
if the scanning area is larger than the preset range, the scanning area is firstly dispersed into a plurality of small scanning grids, then the small scanning grids are further dispersed into a series of scanning points, and the scanning path is planned through the scanning points.
The preset range can be set according to the actual application scene.
In some embodiments, the discrete scanning grid may be automatically divided according to the size of the scanning area. If the scanning area is a rectangular area, the scanning area can be directly divided into a square or rectangular area; if the scanning area is a non-rectangular area, the central area can be divided into square or rectangular areas, and the edge area is generally divided into triangles, i.e. the triangle area is used to fill up the edge area.
Alternatively, the movement between the scan grids may be by way of robotic arm movement.
In some embodiments, when planning the path of the multi-faceted component, to improve the efficiency of subsequent scans, the key points of the three-dimensional feature of the component may be determined according to the view angle of the three-dimensional feature model. Namely, respectively planning scanning paths according to different view angles, and after the component scanning of the same view angle is finished, then scanning the component of the next view (after one-side scanning is finished, then scanning the next side);
wherein the view angles include a front view, a rear view, a left view, a right view, a top view and/or a bottom view, etc., refer to the patent appearance 6 view; the path planning of each side can refer to the path planning method described above, and is not described herein again.
And S140, adjusting the distance and the angle between the laser and the component in real time according to the scanning path and the excitation distance to enable the laser and the surface of the component to reach the excitation distance, adjusting the laser power density of the laser to emit laser to the component, exciting laser ultrasonic waves on the surface of the component, and removing residual stress in the component.
In some embodiments, a plane fitting is performed on the three-dimensional point cloud in the scanning area, the normal direction of the area is determined, and the mechanical arm is adjusted to be perpendicular to the local plane of the scanning area of the component according to the transformation relation of the three-dimensional space postures of the component and the mechanical arm (the transformation relation can be obtained through space calibration of the mechanical arm), and the mechanical arm is connected with the laser, namely, the laser is adjusted to be perpendicular to the local plane of the scanning area of the component.
Meanwhile, according to the transformation relation, the posture of the mechanical arm is adjusted, and the preset excitation distance is achieved under the condition that the laser is perpendicular to the surface of the component, so that the scanning position is switched every time, and the aim of stabilizing the laser power is fulfilled.
It should be noted that, the laser is the most ideal state when it is perpendicular to the surface of the member, and the stress relief inside the member can be completed in the shortest time. However, in practical applications, for a member such as an engine that is not easily scanned vertically, the angle at which the laser beam is applied to the member may be adjusted according to the actual application scene so that the laser beam forms a spot that can be applied to the surface of the member.
Furthermore, parameters such as laser power density, laser energy and/or pulse frequency of the laser are adjusted to form laser ultrasound, so that the formation of shock waves is avoided, and sample impact damage or plastic deformation is avoided. And controlling a laser to emit laser to the component on the scanning path, exciting laser ultrasonic waves on the surface of the component, and enabling the distorted crystal lattices to recover to an equilibrium state through repeated loading and reflection during the process that the ultrasonic waves propagate in the component so as to achieve the purpose of removing residual stress in the component. The method is characterized in that pulse laser is focused on the surface of a component to generate laser ultrasound, the laser ultrasound is reflected for multiple times in the material, and is repeatedly loaded and unloaded to generate plastic deformation, so that residual stress is released.
The laser ultrasonic has the characteristics of higher time resolution and spatial resolution, rich waveform and wide frequency band ultrasonic wave, can perform non-contact remote control nondestructive stress detection and stress regulation and control on the stress concentration region in the actual workpiece, and is suitable for removing residual stress on the surface, the inside and the back of various sound-transmitting solid materials such as steel, aluminum alloy, copper alloy, titanium alloy, high-temperature alloy and the like.
According to the embodiment of the disclosure, the following technical effects are achieved:
the method fills the gap of residual stress treatment at the stress concentration position of the local position of the complex structure, and is suitable for scientific research and various engineering application occasions.
It should be noted that, for simplicity of description, the above-mentioned method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present application is not limited by the order of acts described, as some steps may occur in other orders or concurrently depending on the application. Further, those skilled in the art should also appreciate that the embodiments described in the specification are exemplary embodiments and that the acts and modules referred to are not necessarily required in this application.
The above is a description of method embodiments, and the embodiments of the present application are further described below by way of apparatus embodiments.
Fig. 4 shows a block diagram of a residual stress relief apparatus 400 based on laser ultrasound according to an embodiment of the present application as shown in fig. 4, the apparatus 400 including an industrial personal computer, a robot arm, and a laser:
the industrial personal computer 410 is used for generating a three-dimensional appearance model of the component based on three-dimensional model data of the component;
determining a scan path and an excitation distance based on a three-dimensional topography model of the component;
according to the scanning path and the excitation distance, the distance and the angle between a laser and a component are adjusted in real time through a mechanical arm, so that the laser and the surface of the component reach the excitation distance, and the laser power density of the laser is adjusted;
the laser 420 is used for emitting laser to the component to excite laser ultrasonic waves on the surface of the component so as to remove residual stress in the component;
the robotic arm 430 is coupled to the laser 420 for real-time adjustment of the distance and angle between the laser and the component.
Further, in practical application, in order to play better stress relief effect, residual stress relief device 400 based on laser supersound still includes system water machine and galvanometer:
the water generator is used for spraying water to the surface of the component to form a water film (water restraint layer) on the surface of the component so as to improve the laser ultrasonic intensity and the duration;
and the galvanometer is used for realizing small-area rapid scanning of the member by controlling the deflection angle of the laser beam.
It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working process of the described module may refer to the corresponding process in the foregoing method embodiment, and is not described herein again.
Fig. 5 shows a schematic structural diagram of a terminal device or a server suitable for implementing the embodiments of the present application.
As shown in fig. 5, the terminal device or the server includes a Central Processing Unit (CPU) 501 that can perform various appropriate actions and processes according to a program stored in a Read Only Memory (ROM) 502 or a program loaded from a storage section 508 into a Random Access Memory (RAM) 503. In the RAM 503, various programs and data necessary for the operation of the terminal device or the server are also stored. The CPU 701, the ROM 502, and the RAM 503 are connected to each other via a bus 504. An input/output (I/O) interface 505 is also connected to bus 504.
The following components are connected to the I/O interface 505: an input portion 506 including a keyboard, a mouse, and the like; an output portion 507 including a display such as a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), and the like, and a speaker; a storage portion 508 including a hard disk and the like; and a communication section 509 including a network interface card such as a LAN card, a modem, or the like. The communication section 509 performs communication processing via a network such as the internet. The driver 510 is also connected to the I/O interface 505 as necessary. A removable medium 511 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, or the like is mounted on the drive 510 as necessary, so that a computer program read out therefrom is mounted into the storage section 508 as necessary.
In particular, the above method flow steps may be implemented as a computer software program according to embodiments of the present application. For example, embodiments of the present application include a computer program product comprising a computer program embodied on a machine-readable medium, the computer program comprising program code for performing the method illustrated in the flow chart. In such an embodiment, the computer program may be downloaded and installed from a network through the communication section 509, and/or installed from the removable medium 511. The computer program executes the above-described functions defined in the system of the present application when executed by the Central Processing Unit (CPU) 701.
It should be noted that the computer readable medium shown in the present application may be a computer readable signal medium or a computer readable storage medium or any combination of the two. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples of the computer readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the present application, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In this application, however, a computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take many forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, fiber optic cable, RF, etc., or any suitable combination of the foregoing.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The units or modules described in the embodiments of the present application may be implemented by software or hardware. The described units or modules may also be provided in a processor. Wherein the designation of a unit or module does not in some way constitute a limitation of the unit or module itself.
As another aspect, the present application also provides a computer-readable storage medium, which may be included in the electronic device described in the above embodiments; or may be separate and not incorporated into the electronic device. The computer readable storage medium stores one or more programs that, when executed by one or more processors, perform the methods described herein.
The foregoing description is only exemplary of the preferred embodiments of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the application referred to in the present application is not limited to the embodiments with a particular combination of the above-mentioned features, but also encompasses other embodiments with any combination of the above-mentioned features or their equivalents without departing from the spirit of the application. For example, the above features and the technical features (but not limited to) having similar functions in the present application are mutually replaced to form the technical solution.
Claims (10)
1. A residual stress relieving method based on laser ultrasound is characterized by comprising the following steps:
generating a three-dimensional topography model of a component based on three-dimensional model data of the component;
determining a scan path and an excitation distance based on a three-dimensional topography model of the component;
and adjusting the distance and the angle between a laser and a component in real time according to the scanning path and the excitation distance to enable the laser and the surface of the component to reach the excitation distance, adjusting the laser power density of the laser to emit laser to the component, exciting laser ultrasonic waves on the surface of the component, and removing residual stress in the component.
2. The method of claim 1, wherein determining the scan path based on the three-dimensional topographical model of the component comprises:
determining key points of the three-dimensional shape of the component based on the three-dimensional shape model of the component;
determining a scanning area through the key points of the three-dimensional morphology;
based on the scan region, a scan path is generated.
3. The method of claim 2, wherein determining key points of the three-dimensional topography of the component based on the three-dimensional topography model of the component comprises:
and determining key points of the three-dimensional shape of the component according to the view angle of the three-dimensional shape model.
4. The method of claim 3, wherein generating a scan path based on the scan region comprises:
if the scanning area is smaller than the threshold value, the scanning path is generated by directly adopting a mode of approaching from the middle to the edge.
5. The method of claim 4, wherein generating a scan path based on the scan region comprises:
if the scanning area is smaller than the threshold value, dispersing the scanning area into a scanning grid;
discretizing the scanning grid to obtain a series of scanning points;
and generating a scanning path based on the scanning points.
6. The method of claim 5, further comprising:
if the scanning area is a non-rectangular area, dividing the center of the scanning area into a rectangular or square area, and filling the edge area with a triangular area.
7. The method of claim 6, wherein adjusting the distance and angle between the laser and the component in real time based on the scan path and the firing distance such that the laser reaches the firing distance from the surface of the component comprises:
performing plane fitting on the three-dimensional point cloud in the scanning area to determine the normal direction of the area;
and adjusting the distance and the angle between the laser and the component in real time according to the normal direction to enable the laser to be perpendicular to the surface of the component and reach the excitation distance.
8. The utility model provides a residual stress remove device based on laser supersound which characterized in that, includes industrial computer, arm and laser instrument:
the industrial personal computer is used for generating a three-dimensional shape model of the component based on three-dimensional model data of the component;
determining a scan path and an excitation distance based on a three-dimensional topography model of the component;
according to the scanning path and the excitation distance, the distance and the angle between a laser and a component are adjusted in real time through a mechanical arm, so that the laser and the surface of the component reach the excitation distance, and the laser power density of the laser is adjusted;
the laser is used for emitting laser to the component to excite laser ultrasonic waves on the surface of the component so as to remove residual stress in the component;
the mechanical arm is used for adjusting the distance and the angle between the laser and the component in real time.
9. An electronic device comprising a memory and a processor, the memory having stored thereon a computer program, wherein the processor, when executing the computer program, implements the method of any one of claims 1-7.
10. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the method according to any one of claims 1 to 7.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211312613.XA CN115821027A (en) | 2022-10-25 | 2022-10-25 | Method, device and equipment for eliminating residual stress based on laser ultrasound |
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| CN202211312613.XA CN115821027A (en) | 2022-10-25 | 2022-10-25 | Method, device and equipment for eliminating residual stress based on laser ultrasound |
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