CN115773836A

CN115773836A - Residual stress eliminating and detecting method based on laser ultrasound

Info

Publication number: CN115773836A
Application number: CN202211339507.0A
Authority: CN
Inventors: 张勇; 张宏超
Original assignee: Beijing Semboo Science And Technology Co ltd
Current assignee: Beijing Semboo Science And Technology Co ltd
Priority date: 2022-10-25
Filing date: 2022-10-25
Publication date: 2023-03-10

Abstract

The embodiment of the application provides a residual stress eliminating and detecting method, a residual stress eliminating and detecting device, residual stress eliminating and detecting equipment and a computer readable storage medium based on laser ultrasound. The method comprises the steps of removing residual stress in the component by means of laser ultrasound; and detecting the residual stress in the component, and if the residual stress in the component exceeds a threshold value, removing the residual stress in the component again in a laser ultrasonic mode until the residual stress in the component is less than or equal to the threshold value. In this way, effective and rapid elimination of residual stresses within the component and accurate detection of residual stresses within the component are achieved.

Description

Residual stress eliminating and detecting method based on laser ultrasound

Technical Field

Embodiments of the present disclosure relate to the field of laser ultrasound, and in particular, to a method, an apparatus, a device, and a computer-readable storage medium for residual stress removal and detection based on laser ultrasound.

Background

The metal component is subjected to the processes of welding, casting, forging, machining and the like to cause internal lattice deformation, so that residual stress is inevitably generated, the ultimate strength and the fatigue strength of the component are greatly reduced, even cracks and brittle fracture are generated, and parts are deformed due to the relaxation of the residual stress in the process of processing and using, so that the size, the position precision and the whole performance of the component are greatly influenced.

Currently, methods for reducing residual stress mainly include annealing, mechanical treatment, shot blasting, ultrasound, explosion methods, etc., and although the methods can all eliminate residual stress, they have many drawbacks. For example, shot blasting can only treat surface residual stress and is costly; the ultrasound is limited by energy density, can only be effective on partial materials, and the like, and has no corresponding residual stress detection method.

Therefore, how to effectively and quickly eliminate the residual stress inside the component and detect the residual stress of the component is a problem that needs to be solved at present.

Disclosure of Invention

According to an embodiment of the application, a laser ultrasound based residual stress relief and detection scheme is provided.

In a first aspect of the present application, a method for residual stress relief and detection based on laser ultrasound is provided. The method comprises the following steps:

removing residual stress in the component in a laser ultrasonic mode;

and detecting the residual stress in the component, and if the residual stress in the component exceeds a threshold value, removing the residual stress in the component again in a laser ultrasonic mode until the residual stress in the component is less than or equal to the threshold value.

Further, the removing residual stress in the component by means of laser ultrasound comprises:

acquiring three-dimensional model data of a component;

generating a three-dimensional topography model of the component based on the three-dimensional model data of the component;

determining a scan path and an excitation distance based on a three-dimensional topography model of the component;

and adjusting the distance and the angle between a laser and a component in real time according to the scanning path and the excitation distance to enable the laser and the surface of the component to reach the excitation distance, adjusting the laser power density of the laser to emit laser to the component, exciting laser ultrasonic waves on the surface of the component, and removing residual stress in the component.

Further, the determining a scan path based on the three-dimensional topographical model of the member comprises:

determining key points of the three-dimensional shape of the component based on the three-dimensional shape model of the component;

determining a scanning area through the key points of the three-dimensional morphology;

based on the scan region, a scan path is generated.

Further, the determining key points of the three-dimensional shape of the member based on the three-dimensional shape model of the member comprises:

and determining key points of the three-dimensional shape of the component according to the view angle of the three-dimensional shape model.

Further, the generating a scan path based on the scan region comprises:

if the scanning area is smaller than the threshold value, dispersing the scanning area into a scanning grid;

discretizing the scanning grid to obtain a series of scanning points;

and generating a scanning path based on the scanning points.

Further, the detecting residual stress within the component includes:

adjusting the distance and the angle between a laser and a component in real time according to the scanning path and the excitation distance to enable the laser and the surface of the component to reach the excitation distance, controlling the laser to emit laser to the component, and generating a multi-frequency narrow-band ultrasonic surface wave on the surface of the component;

acquiring the multi-frequency narrowband ultrasonic surface wave, and scanning along the scanning path to obtain the surface wave depth and the surface wave speed;

and calculating the distribution of residual stress in the component according to the scanning path, the penetration depth of the multi-frequency narrow-band ultrasonic surface wave, the speed of the multi-frequency narrow-band ultrasonic surface wave and the acoustoelastic principle, and determining whether the residual stress in the component is eliminated.

Further, the multi-frequency narrowband ultrasonic surface wave is a dual-frequency narrowband ultrasonic surface wave, and can be generated by:

modulating the laser by a double-period optical mask to form two gratings which are periodically distributed;

and adjusting the widths of the two periodically distributed gratings to obtain high-low dual-frequency narrow-band ultrasonic surface waves.

In a second aspect of the present application, a laser ultrasound based residual stress relief and detection apparatus is provided. The device comprises:

industrial computer, arm, laser instrument and laser modulation module:

the industrial personal computer is used for generating a three-dimensional appearance model of the component based on three-dimensional model data of the component;

according to the scanning path and the excitation distance, the distance and the angle between a laser and a component are adjusted in real time through a mechanical arm, so that the laser and the surface of the component reach the excitation distance, and the laser power density of the laser is adjusted;

the industrial personal computer further comprises a calculation module, wherein the calculation module is used for calculating residual stress distribution in the component according to the scanning path, the penetration depth of the multi-frequency narrowband ultrasonic surface wave, the speed of the multi-frequency narrowband ultrasonic surface wave and the acoustic elastic principle, and determining whether residual stress in the component is eliminated;

the laser is used for emitting laser to the component to excite laser ultrasonic waves on the surface of the component so as to remove residual stress in the component;

the laser modulation module is used for modulating the laser to generate narrowband ultrasonic surface waves with various frequencies;

the mechanical arm is used for adjusting the distance and the angle between the laser and the component in real time.

In a third aspect of the present application, an electronic device is provided. The electronic device includes: a memory having a computer program stored thereon and a processor implementing the method as described above when executing the program.

In a fourth aspect of the present application, a computer-readable storage medium is provided, on which a computer program is stored which, when being executed by a processor, carries out the method as according to the first aspect of the present application.

According to the method for eliminating and detecting the residual stress based on the laser ultrasound, the residual stress in the component is removed in a laser ultrasound mode; and detecting the residual stress in the component, and if the residual stress in the component exceeds a threshold value, removing the residual stress in the component again in a laser ultrasonic mode until the residual stress in the component is less than or equal to the threshold value, so that the effective and rapid elimination of the residual stress in the component and the accurate detection of the residual stress in the component are realized.

It should be understood that what is described in this summary section is not intended to limit key or critical features of the embodiments of the application, nor is it intended to limit the scope of the application. Other features of the present application will become apparent from the following description.

Drawings

The above and other features, advantages and aspects of various embodiments of the present application will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters denote like or similar elements, and wherein:

FIG. 1 shows a flow diagram of a method of laser ultrasound based residual stress relief according to an embodiment of the present application;

FIG. 2 illustrates a scan path planning method according to an embodiment of the present application;

FIG. 3 shows a schematic diagram of another scan path planning method according to an embodiment of the present application;

FIG. 4 is a flow chart of detecting residual stress within the component according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of generating a dual-frequency narrowband ultrasound surface wave according to an embodiment of the present application;

FIG. 6 is a block diagram of a laser ultrasound based residual stress relief and detection apparatus according to an embodiment of the present application;

fig. 7 is a schematic structural diagram of a terminal device or a server suitable for implementing the embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions in the embodiments of the present disclosure will be described clearly and completely with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are some, but not all embodiments of the present disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

In addition, the term "and/or" herein is only one kind of association relationship describing the association object, and means that there may be three kinds of relationships, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter associated objects are in an "or" relationship.

FIG. 1 shows a flow diagram of a laser ultrasound based residual stress relief and detection method according to an embodiment of the present disclosure. The method comprises the following steps:

and S110, removing residual stress in the component in a laser ultrasonic mode.

In some embodiments, three-dimensional model data of the component can be directly obtained through three-dimensional scanning, computer interface importing and/or shape parameter setting and the like; a two-dimensional image of a member may also be acquired by a binocular camera or the like, and the two-dimensional image may be converted into three-dimensional model data of the member. That is, the means is photographed using a binocular camera, resulting in a synchronized exposure image. And determining the third-dimensional depth information of the image through two-dimensional image pixel points of the image, and then fusing and splicing the three-dimensional appearance of the member according to the image to generate three-dimensional model data of the member.

The binocular camera is used for collecting images, so that the hardware cost is further reduced, and the binocular camera can be used as a common CMOS camera and is applicable indoors and outdoors.

In some embodiments, the three-dimensional model data includes a feature, position, size, bending, compression, shear, tension, torsion, and/or compound forces, etc. of the component.

In some embodiments, the member is typically a variety of acoustically transparent solid materials such as steel, aluminum alloys, copper alloys, titanium alloys, and/or superalloys.

In some embodiments, a three-dimensional topographical model of the component is generated by three-dimensional modeling software based on three-dimensional model data for the component.

S130, determining a scanning path and an excitation distance based on the three-dimensional shape model of the component.

In some embodiments, based on a three-dimensional topography of a component, keypoints of the three-dimensional topography are determined; the key points include edge points and/or geometric centers, etc.

Further, determining a scanning area according to the key points of the three-dimensional topography, and if the scanning area is smaller than a preset range, planning a scanning path by adopting a mode of approaching from the middle to the edge as shown in fig. 2, or planning the scanning path by adopting a sequential scanning mode as shown in fig. 3;

if the scanning area is larger than the preset range, the scanning area is firstly dispersed into a plurality of small scanning grids, then the small scanning grids are further dispersed into a series of scanning points, and the scanning path is planned through the scanning points.

The preset range can be set according to the actual application scene.

In some embodiments, the discrete scanning grid may be automatically divided according to the size of the scanning area. If the scanning area is a rectangular area, the scanning area can be directly divided into square or rectangular areas; if the scanning area is a non-rectangular area, the central area can be divided into square or rectangular areas, and the edge area is generally divided into triangles, i.e. the triangle area is used to fill up the edge area.

Alternatively, the movement between the scanning grids may be by way of robotic arm movement.

In some embodiments, when planning the path of the multi-faceted component, to improve the efficiency of subsequent scans, the key points of the three-dimensional feature of the component may be determined according to the view angle of the three-dimensional feature model. Namely, respectively planning scanning paths according to different view angles, and after the component scanning of the same view angle is finished, then scanning the component of the next view (after one-side scanning is finished, then scanning the next side);

wherein the view angles include a front view, a rear view, a left view, a right view, a top view and/or a bottom view, etc., refer to the patent appearance 6 view; the path planning of each side can refer to the path planning method described above, and is not described herein again.

In some embodiments, a plane fitting is performed on the three-dimensional point cloud in the scanning area, the normal direction of the area is determined, and the mechanical arm is adjusted to be perpendicular to the local plane of the scanning area of the component according to the transformation relation of the three-dimensional space postures of the component and the mechanical arm (the transformation relation can be obtained through space calibration of the mechanical arm), and the mechanical arm is connected with the laser, namely, the laser is adjusted to be perpendicular to the local plane of the scanning area of the component.

Meanwhile, according to the transformation relation, the posture of the mechanical arm is adjusted, and the preset excitation distance is achieved under the condition that the laser is perpendicular to the surface of the component, so that the scanning position is switched every time, and the aim of stabilizing the laser power is fulfilled.

It should be noted that, the laser is the most ideal state when it is perpendicular to the surface of the member, and the stress relief inside the member can be completed in the shortest time. However, in practical applications, for a member that is not easily scanned vertically, such as the inside of an engine, the angle at which the laser beam is applied to the member may be adjusted according to the practical application scenario so that the laser beam forms a spot that can be applied to the surface of the member.

Furthermore, parameters such as laser power density, laser energy and/or pulse frequency of the laser are adjusted to form laser ultrasound, so that shock waves are prevented from being formed, and sample impact damage or plastic deformation is avoided. And controlling a laser to emit laser to the component on the scanning path, exciting laser ultrasonic waves on the surface of the component, and enabling the distorted crystal lattices to recover to an equilibrium state through repeated loading and reflection during the process that the ultrasonic waves propagate in the component so as to achieve the purpose of removing residual stress in the component. The method is characterized in that pulsed laser is focused on the surface of a component to generate laser ultrasound, the laser ultrasound is reflected for multiple times in the material, and is repeatedly loaded and unloaded to generate plastic deformation, so that the residual stress is released.

The laser ultrasonic wave has the characteristics of higher time resolution and spatial resolution, rich waveform and wide frequency band ultrasonic wave, can carry out non-contact remote control nondestructive stress detection and stress regulation of a stress concentration area in an actual workpiece, and is suitable for removing residual stress on the surface, the inside and the back of various sound-transmitting solid materials such as steel, aluminum alloy, copper alloy, titanium alloy, high-temperature alloy and the like.

And S120, detecting the residual stress in the component, and if the residual stress in the component exceeds a threshold value, removing the residual stress in the component again in a laser ultrasonic mode until the residual stress in the component is less than or equal to the threshold value.

In some embodiments, in order to ensure that the stresses inside the component reach a preset criterion (threshold), it is necessary to detect residual stresses inside the component; the preset standard can be set according to the material of the component and/or the application environment

In some embodiments, the residual stress of the component may be detected by means of a conventional ultrasonic surface wave.

In some embodiments, in application scenarios such as component surface roughness, plating, coating and the like, the measurement of the residual stress position of the component is prone to error in a conventional ultrasonic surface wave manner. Therefore, under the above scenario, the measurement of the residual stress inside the component can be performed as follows, with reference to fig. 4:

s410, adjusting the distance and the angle between a laser and a component in real time according to the scanning path and the excitation distance to enable the laser and the surface of the component to reach the excitation distance, controlling the laser to emit laser to the component, and generating the multi-frequency narrow-band ultrasonic surface wave on the surface of the component.

In some embodiments, the step of adjusting the distance and the angle between the laser and the component may refer to the corresponding step in step S110, which is not repeated herein.

In some embodiments, the lasers are tuned to simultaneously generate different depths of surface acoustic waves at the surface of the component, see FIG. 5, where λ 0 is a high frequency narrowband laser surface acoustic wave and λ 1 is a low frequency narrowband laser surface acoustic wave.

And S420, acquiring the multi-frequency narrowband ultrasonic surface wave, and scanning along the scanning path to obtain the surface wave depth and the surface wave speed.

In some embodiments, ultrasonic surface waves λ 0 and λ 1 are acquired in the direction of laser movement on the scan path, i.e., surface wave depth and surface wave velocity are obtained.

And S430, calculating residual stress distribution in the component according to the scanning path, the penetration depth of the multi-frequency narrow-band ultrasonic surface wave, the speed of the multi-frequency narrow-band ultrasonic surface wave and the acoustoelastic principle, and determining whether residual stress in the component is eliminated.

In the present disclosure, the relationship of the wave velocity, wavelength, and frequency of a surface wave is defined by the following formula:

c＝λf

wherein c is the ultrasonic surface wave velocity (m/s);

λ ultrasonic surface wave wavelength (nm);

f is the ultrasonic surface wave frequency (MHz).

The formula of the incident depth of the surface wave is:

h＝2aλ

wherein h is an incident depth (mm) of the ultrasonic surface wave;

alpha is a correction coefficient.

Further, in combination with the principle of acoustic elasticity, the calculation formula of the residual stress is as follows:

σ - σ 0= K (t-t 0) or Δ σ = K Δ t

Where Δ σ is a variation amount of the residual stress (stress difference), σ = σ - σ 0;

Δ t is the variation of the propagation time (acoustic time difference), t = t-to;

and K is a stress coefficient, is related to the material of the workpiece to be detected and the distance between the probes, and can be obtained by calibrating through a tensile test.

In some embodiments, for example, the surface of the workpiece to be detected simultaneously excites the laser ultrasonic surface waves with the wavelengths λ 0 and λ 1, respectively, and h1 and h2 are incident depths of the laser ultrasonic surface waves, respectively. According to the acoustoelastic theory, the residual stresses sigma 1 and sigma 2 in the workpiece h1 and h2 can be respectively detected. And performing difference-by-difference processing on the residual stress of the laser ultrasonic surface waves h1 and h2 with two frequencies to obtain the residual stress of two gradient depths of h1 and h2-h1, namely sigma 1 and sigma 2-sigma 1, and so on, and the residual stress distribution of other double-frequency narrow-band ultrasonic surface waves with different penetration depths.

Further, when it is detected that the residual stress in the component exceeds the threshold value, step 110 is repeated until the residual stress in the component is less than or equal to the threshold value.

According to the embodiment of the disclosure, the following technical effects are achieved:

the method fills the gap of residual stress treatment of the stress concentration position of the local position of the complex structure, and is suitable for scientific research and various engineering application occasions. The method realizes effective and rapid elimination of the residual stress in the component and accurate detection of the residual stress in the component.

It should be noted that, for simplicity of description, the above-mentioned method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present application is not limited by the order of acts described, as some steps may occur in other orders or concurrently depending on the application. Further, those skilled in the art should also appreciate that the embodiments described in the specification are all alternative embodiments and that the acts and modules referred to are not necessarily required for the application.

The above is a description of method embodiments, and the embodiments of the present application are further described below by way of apparatus embodiments.

Fig. 6 shows a block diagram of a residual stress relieving and detecting apparatus 600 based on laser ultrasound according to an embodiment of the present application as shown in fig. 6, the apparatus 600 includes an industrial personal computer, a mechanical arm, a laser, and a laser modulation module:

the industrial personal computer 610 is used for generating a three-dimensional appearance model of the component based on three-dimensional model data of the component;

the laser 620 is used for emitting laser to the component to excite laser ultrasonic waves on the surface of the component so as to remove residual stress in the component;

the laser modulation module 630 is configured to modulate the laser to generate narrowband ultrasonic surface waves with multiple frequencies;

the mechanical arm 640 is used for adjusting the distance and angle between the laser and the component in real time.

Further, in practical application, in order to achieve a better stress relief effect, the residual stress relief device 600 based on laser ultrasound further includes a water generator and a vibrating mirror:

the water generator is used for spraying water to the surface of the component to form a water film (water restraint layer) on the surface of the component so as to improve the laser ultrasonic intensity and the duration;

and the galvanometer is used for realizing small-area rapid scanning of the member by controlling the deflection angle of the laser beam.

It can be clearly understood by those skilled in the art that, for convenience and simplicity of description, the specific working process of the described module may refer to the corresponding process in the foregoing method embodiment, and details are not described herein again.

Fig. 7 shows a schematic structural diagram of a terminal device or a server suitable for implementing the embodiment of the present application.

As shown in fig. 7, the terminal device or the server includes a Central Processing Unit (CPU) 701, which can perform various appropriate actions and processes in accordance with a program stored in a Read Only Memory (ROM) 702 or a program loaded from a storage section 708 into a Random Access Memory (RAM) 703. In the RAM 703, various programs and data necessary for the operation of the terminal device or the server are also stored. The CPU 701, ROM 702, and RAM 703 are connected to each other via a bus 704. An input/output (I/O) interface 705 is also connected to bus 704.

The following components are connected to the I/O interface 705: an input portion 706 including a keyboard, a mouse, and the like; an output section 707 including a display such as a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), and the like, and a speaker; a storage section 708 including a hard disk and the like; and a communication section 709 including a network interface card such as a LAN card, a modem, or the like. The communication section 709 performs communication processing via a network such as the internet. A drive 710 is also connected to the I/O interface 705 as needed. A removable medium 711 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, or the like is mounted on the drive 710 as necessary, so that the computer program read out therefrom is mounted in the storage section 708 as necessary.

In particular, the above method flow steps may be implemented as a computer software program according to embodiments of the present application. For example, embodiments of the present application include a computer program product comprising a computer program embodied on a machine-readable medium, the computer program comprising program code for performing the method illustrated in the flow chart. In such an embodiment, the computer program can be downloaded and installed from a network through the communication section 709, and/or installed from the removable medium 711. The computer program performs the above-described functions defined in the system of the present application when executed by the Central Processing Unit (CPU) 701.

It should be noted that the computer readable medium shown in the present application may be a computer readable signal medium or a computer readable storage medium or any combination of the two. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples of the computer readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the present application, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In this application, however, a computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, fiber optic cable, RF, etc., or any suitable combination of the foregoing.

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

The units or modules described in the embodiments of the present application may be implemented by software or hardware. The described units or modules may also be provided in a processor. Wherein the designation of a unit or module does not in some way constitute a limitation of the unit or module itself.

As another aspect, the present application also provides a computer-readable storage medium, which may be included in the electronic device described in the above embodiments; or may be separate and not incorporated into the electronic device. The computer readable storage medium stores one or more programs that, when executed by one or more processors, perform the methods described herein.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the application referred to in the present application is not limited to the embodiments with a particular combination of the above-mentioned features, but also encompasses other embodiments with any combination of the above-mentioned features or their equivalents without departing from the spirit of the application. For example, the above features may be replaced with (but not limited to) features having similar functions as those described in this application.

Claims

1. A residual stress eliminating and detecting method based on laser ultrasound is characterized by comprising the following steps:

removing residual stress in the component in a laser ultrasonic mode;

2. The method of claim 1, wherein the removing residual stresses within the component by means of laser ultrasound comprises:

acquiring three-dimensional model data of a component;

3. The method of claim 2, wherein determining the scan path based on the three-dimensional topographical model of the component comprises:

based on the scan area, a scan path is generated.

4. The method of claim 3, wherein determining key points of the three-dimensional topography of the component based on the three-dimensional topography model of the component comprises:

5. The method of claim 4, wherein generating a scan path based on the scan region comprises:

discretizing the scanning grid to obtain a series of scanning points;

and generating a scanning path based on the scanning point.

6. The method of claim 5, wherein the detecting the residual stress within the component comprises:

and calculating the residual stress distribution in the component according to the scanning path, the penetration depth of the multi-frequency narrowband ultrasonic surface wave, the speed of the multi-frequency narrowband ultrasonic surface wave and the acoustic elasticity principle, and determining whether the residual stress in the component is eliminated.

7. The method of claim 6, wherein the multi-frequency narrowband ultrasonic surface wave is a dual-frequency narrowband ultrasonic surface wave generated by:

8. The utility model provides a residual stress eliminates and detection device based on laser supersound which characterized in that, includes industrial computer, arm, laser instrument and laser modulation module:

the industrial personal computer further comprises a calculation module, a processing module and a control module, wherein the calculation module is used for calculating residual stress distribution in the component through the scanning path, the penetration depth of the multi-frequency narrow-band ultrasonic surface wave, the speed of the multi-frequency narrow-band ultrasonic surface wave and the acoustoelastic principle, and determining whether residual stress in the component is eliminated or not;

9. An electronic device comprising a memory and a processor, the memory having stored thereon a computer program, wherein the processor, when executing the computer program, implements the method of any one of claims 1-7.

10. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the method according to any one of claims 1 to 7.