CN115802802A - Display module, manufacturing method thereof and display device - Google Patents
Display module, manufacturing method thereof and display device Download PDFInfo
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- CN115802802A CN115802802A CN202211667938.XA CN202211667938A CN115802802A CN 115802802 A CN115802802 A CN 115802802A CN 202211667938 A CN202211667938 A CN 202211667938A CN 115802802 A CN115802802 A CN 115802802A
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Abstract
The invention discloses a display module, a manufacturing method thereof and a display device. The packaging structure comprises a first substrate, a circuit board and a packaging connecting part; a plurality of signal terminals are arranged on the first substrate; the circuit board is arranged opposite to the first substrate, and one side of the circuit board close to the first substrate is provided with a plurality of electrode pieces connected with the plurality of signal terminals; the packaging connecting part is arranged between the first substrate and the circuit board and surrounds the periphery of the circuit board, one end of the packaging connecting part is connected with the circuit board, the other end of the packaging connecting part is connected with the first substrate so as to form a surrounding area between the first substrate and the circuit board, and the signal terminals and the electrode pieces are positioned in the surrounding area; the material of the packaging connecting part is the same as that of the circuit board. The invention can effectively play a role in packaging the signal terminals and the electrode pieces, and improves the stability and the yield of the display module; compared with the existing chip packaging technology, the invention can simplify the process procedures and reduce the process cost.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module, a manufacturing method thereof and a display device.
Background
With the rapid development of new display technologies, the high integration of devices is becoming a new growth point for future display technologies. No matter the liquid crystal display module, the organic light emitting diode display module or the LED display module, a driving circuit control system or a signal transmission system and the like are integrated on a chip of a PCB or a COF and then bonded to a panel.
The chip package is an essential process in the chip manufacturing process. In the conventional packaging technology, a silicon-based chip is generally connected to a carrier plate such as a PCB or a silicon wafer and then molded, so that the process is more and the cost is higher.
Disclosure of Invention
The embodiment of the invention provides a display module, a manufacturing method thereof and a display device, which can simplify a packaging process and reduce process cost.
The embodiment of the invention provides a display module, which comprises:
a first substrate on which a plurality of signal terminals are provided;
the circuit board is arranged opposite to the first substrate, and one side of the circuit board close to the first substrate is provided with a plurality of electrode pieces connected with the signal terminals;
a package connecting portion disposed between the first substrate and the circuit board and surrounding the circuit board, wherein one end of the package connecting portion is connected to the circuit board, and the other end of the package connecting portion is connected to the first substrate, so as to form a surrounding area between the first substrate and the circuit board, and the signal terminals and the electrode elements are located in the surrounding area;
and the material of the packaging connecting part is the same as that of the circuit board.
In an embodiment of the invention, a material of the first substrate is the same as a material of the package connection portion.
In an embodiment of the invention, the material of the package connecting portion, the material of the circuit board, and the material of the first substrate all include glass.
In one embodiment of the present invention, the material of the first substrate includes a polymer organic material.
In an embodiment of the invention, the display module further includes a protection layer, and the protection layer covers the circuit board and the package connecting portion.
In an embodiment of the invention, the display module includes a functional region, a binding region adjacent to the functional region, and a second substrate disposed opposite to the first substrate and located in the functional region;
the first substrate is arranged in the functional area and extends to the binding area, the display module comprises at least one circuit board which is arranged in the binding area and opposite to the first substrate, and the at least one circuit board is arranged on one side of the first substrate close to the second substrate.
In an embodiment of the disclosure, the display module further includes a second substrate disposed opposite to the first substrate, and the display module includes at least one circuit board disposed on a side of the first substrate away from the second substrate.
According to the above object of the present invention, an embodiment of the present invention further provides a method for manufacturing a display module, which includes the following steps:
forming a plurality of signal terminals on a first substrate;
forming a plurality of electrode members on the circuit board;
arranging the side of the circuit board, on which the plurality of electrode elements are formed, opposite to the side of the first substrate, on which the plurality of signal terminals are formed, and connecting the plurality of signal terminals with the plurality of electrode elements;
the first substrate with form between the circuit board around in circuit board encapsulation connecting portion all around, just the one end of encapsulation connecting portion connect in the circuit board, the other end connect in the first substrate, in order to form one between the first substrate with the circuit board and enclose into the region, it is a plurality of signal terminal is a plurality of the electrode component is located enclose into the region, wherein, the material of encapsulation connecting portion with the material of circuit board is the same.
In an embodiment of the present invention, the step of forming a package connection portion located around the circuit board between the first substrate and the circuit board includes:
the material of the circuit board comprises glass, the periphery of the circuit board is subjected to laser treatment, so that the part, located on the periphery, of the circuit board forms the packaging connecting part, and one end, far away from the circuit board, of the packaging connecting part is connected to the first substrate;
and forming a protective layer for coating the circuit board and the packaging connecting part.
According to the above object of the present invention, a display device is further provided in an embodiment of the present invention, the display device includes a device main body and the display module, and the display module and the device main body are combined into a whole.
The invention has the beneficial effects that: according to the invention, the packaging connecting part is formed between the circuit board and the first substrate through the same material of the circuit board and is positioned at the periphery of the circuit board, so that a surrounding area is formed between the circuit board and the first substrate, and the signal terminal and the electrode piece are positioned in the surrounding area, thereby effectively playing a packaging effect on the signal terminal and the electrode piece and improving the stability and the yield of the display module; compared with the existing chip packaging technology, the invention can simplify the process procedures and reduce the process cost.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 is a schematic view of a connection structure between a circuit board and a first substrate according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a display module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a display module according to an embodiment of the present invention;
fig. 4 is another schematic structural diagram of a display module according to an embodiment of the invention;
FIG. 5 is a flowchart illustrating a method for fabricating a display module according to an embodiment of the present invention;
fig. 6 and 7 are schematic structural diagrams of a manufacturing process of the display module according to the embodiment of the invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present invention. Moreover, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Referring to fig. 1, the display module according to an embodiment of the present invention includes a first substrate 10, a circuit board 20, and a package connecting portion 22.
Further, a plurality of signal terminals 11 are provided on the first substrate 10; the circuit board 20 is arranged opposite to the first substrate 10, and one side of the circuit board 20 close to the first substrate 10 is provided with a plurality of electrode parts 21 connected with the plurality of signal terminals 11; the package connecting portion 22 is disposed between the first substrate 10 and the circuit board 20 and surrounds the periphery of the circuit board 20, one end of the package connecting portion 22 is connected to the circuit board 20, and the other end of the package connecting portion 22 is connected to the first substrate 10, so as to form a surrounding area 201 between the first substrate 10 and the circuit board 20, and the plurality of signal terminals 11 and the plurality of electrode elements 21 are located in the surrounding area 201.
The material of the package connecting portion 22 is the same as that of the circuit board 20.
In the implementation and application process, the package connection part 22 is formed between the circuit board 20 and the first substrate 10 by the same material of the circuit board 20, and the package connection part 22 is located around the circuit board 20, so as to form a surrounding area 201 between the circuit board 20 and the first substrate 10, and the signal terminal 11 and the electrode element 21 are both located in the surrounding area 201, thereby effectively playing a role of packaging the signal terminal 11 and the electrode element 21, and improving the stability and the yield of the display module; compared with the existing chip packaging technology, the invention can simplify the process procedures and reduce the process cost.
Specifically, with reference to fig. 1, the display module according to the embodiment of the present invention includes a first substrate 10 and a circuit board 20, wherein the circuit board 20 is disposed opposite to the first substrate 10; it is understood that the circuit board 20 may be bound and connected to the first substrate 10, wherein the first substrate 10 may be provided with a driving unit such as a driving circuit, a pixel circuit, etc., and the circuit board 20 is provided with an integrated circuit, and when the circuit board 20 is bound and connected to the first substrate 10, the integrated circuit may be used to transmit signals to the driving circuit, the pixel circuit, etc., on the first substrate 10.
The first substrate 10 is provided with a plurality of signal terminals 11, the circuit board 20 is provided with a plurality of electrode members 21, one surface of the first substrate 10 provided with the plurality of signal terminals 11 is arranged opposite to one surface of the circuit board 20 provided with the plurality of electrode members 21, and the plurality of signal terminals 11 are connected with the plurality of electrode members 21. For example, the plurality of signal terminals 11 may be connected to the plurality of electrode members 21 in a one-to-one correspondence, or in a one-to-many connection, or in a many-to-one connection, which is not limited herein.
Furthermore, the display module further includes a package connecting portion 22 located between the first substrate 10 and the circuit board 20 and surrounding the periphery of the circuit board 20, and one end of the package connecting portion 22 is connected to the circuit board 20, and the other end is connected to the first substrate 10, so as to form a surrounding area 201 between the first substrate 10 and the circuit board 20, and the connected signal terminals 11 and the plurality of electrode elements 21, and the integrated circuits on the circuit board 20 are all located in the surrounding area 201, that is, in the embodiment of the present invention, the package connecting portion 22 is formed between the first substrate 10 and the circuit board 20, so as to package the plurality of signal terminals 11 and the plurality of electrode elements 21.
In the embodiment of the present invention, the material of the package connecting portion 22 is the same as the material of the circuit board 20, that is, the package connecting portion 22 and the circuit board 20 are integrally formed, and one end of the package connecting portion 22 away from the circuit board 20 is connected to the first substrate 10.
It is understood that, in the enclosed area 201, except for the position where the signal terminal 11 and the electrode element 21 are connected, the surface of the first substrate 10 close to the circuit board 20 is spaced from the surface of the circuit board 20 close to the first substrate 10, and the enclosed area 201 may be an enclosed space formed by the circuit board 20, the first substrate 10 and the package connecting portion 22.
Furthermore, the material of the circuit board 20 and the material of the package connecting portion 22 both include glass, and the package connecting portion 22 can be obtained by solidifying the molten state of the circuit board 20, so that the package connecting portion 22 and the circuit board 20 are integrally formed and can be connected to the first substrate 10, and the cost of the glass material is low.
In an embodiment, the material of the first substrate 10 may also include glass, so that the material of the circuit board 20, the material of the package connecting portion 22, and the material of the first substrate 10 are the same, which may improve the adhesion between the package connecting portion 22 and the first substrate 10.
In another embodiment, the material of the first substrate 10 may further include a polymer organic material, and specifically may include polyimide or polyethylene terephthalate.
In addition, the display module further comprises a protective layer 30 covering the circuit board 20 and the packaging connecting part 22, so that the probability of damage caused by collision, extrusion or scratch of the circuit board 20 and other objects can be reduced.
Alternatively, the material of the protective layer 30 may include an epoxy resin material, and specifically may include polymethyl methacrylate or polycarbonate.
It should be noted that the number of the circuit boards 20 in the display module may be one or more, and may be selected according to actual requirements, which is not limited herein.
In an embodiment of the invention, referring to fig. 2, the display module may be an organic light emitting diode display module.
The display module includes a display area 101 and a binding area 102 adjacent to the display area 101, wherein the display module includes a thin film transistor array layer disposed on the first substrate 10 and located in the display area 101, an anode layer disposed on the thin film transistor array layer, an organic light emitting layer disposed on the anode layer, a cathode layer disposed on the organic light emitting layer, and a plurality of signal terminals 11 disposed on the first substrate 10 and located in the binding area 102.
The circuit board 20 is disposed on the first substrate 10 and located in the bonding region 102, a plurality of electrode elements 21 on the circuit board 20 are connected to the plurality of signal terminals 11 on the first substrate 10, the package connecting portion 22 is connected between the first substrate 10 and the circuit board 20 and surrounds the periphery of the circuit board 20 to form a surrounding region 201, and the plurality of connected signal terminals 11 and the plurality of connected electrode elements 21 are all located in the surrounding region 201.
Further, the circuit board 20 is provided with an integrated circuit connected to the plurality of electrode members 21, and the integrated circuit transmits an electric signal to devices such as a thin film transistor and a cathode in the thin film transistor array layer in the display region 101 through the electrode members 21 and the signal terminals 11.
In another embodiment of the present invention, referring to fig. 3, the display module can be a liquid crystal display module.
The display module includes a functional area 103 and a binding area 104 adjacent to the functional area 103. The first substrate 10 is disposed in the functional region 103 and extends to the bonding region 104, and the circuit board 20 is disposed opposite to the first substrate 10 and located in the bonding region 103.
In addition, the display module further includes a second substrate 40 disposed in the functional region 103 and opposite to the first substrate 10; it is understood that the first substrate 10 may be an array substrate on which a thin film transistor array layer, and a pixel electrode and/or a common electrode are disposed, the second substrate 40 may be a color film substrate on which a color block and a black matrix are disposed, and the display module further includes a liquid crystal layer disposed between the first substrate 10 and the second substrate 40; wherein, the edge of the first substrate 10 protrudes relative to the edge of the second substrate 40, and the protruding portion is located in the binding region 104, and the circuit board 20 is bound and connected to the protruding position of the first substrate 10.
In the present embodiment, the wiring board 20 is located on a side of the first substrate 10 close to the second substrate 40.
In another embodiment of the present invention, referring to fig. 4, the difference between the present embodiment and the previous embodiment is: the edges of the first substrate 10 and the second substrate 40 may be flush with each other, and the circuit board 20 is bound and connected to the side of the first substrate 10 away from the second substrate 40.
The signal terminals 11 are disposed on a side of the first substrate 10 away from the second substrate 40, and the electrode elements 21 on the circuit board 20 are connected to the signal terminals 11.
It should be noted that the signal terminals 11 may be electrically connected to the thin film transistor array layer on the side of the first substrate 10 close to the second substrate 40, and the pixel electrode and/or the common electrode through via holes penetrating through the first substrate 10, specifically, a trace may be provided, one end of the trace passes through the via holes to be connected to the signal terminals 11, and the other end of the trace may be electrically connected to the thin film transistor array layer, the pixel electrode and/or the common electrode through a wire replacement or directly, which is not limited herein.
In this embodiment, the edges of the first substrate 10 and the second substrate 20 are flush, and the display module with a narrow frame can be implemented without binding the circuit board 20 in a reserved area.
In other embodiments of the present invention, the display module may also be an LED light emitting panel, that is, the first substrate 10 is provided with a plurality of LED light elements, and the circuit board 20 transmits electrical signals to the plurality of LED light elements through the electrode elements 21 and the signal terminals 11; it is understood that the circuit board 20 is disposed on a side of the first substrate 10 where the light elements LED are disposed, and/or on a side of the first substrate 10 away from the plurality of LED light elements.
In the embodiment of the present invention, the package connection portion 22 is formed between the circuit board 20 and the first substrate 10 by using the same material of the circuit board 20, and the package connection portion 22 is located around the circuit board 20, so as to form a surrounding area 201 between the circuit board 20 and the first substrate 10, and the signal terminal 11 and the electrode element 21 are both located in the surrounding area 201, thereby effectively playing a role of packaging the signal terminal 11 and the electrode element 21, and improving the stability and yield of the display module; compared with the existing chip packaging technology, the invention can simplify the process procedures and reduce the process cost.
In addition, an embodiment of the present invention provides a method for manufacturing a display module according to the above embodiments, please refer to fig. 1, fig. 5, fig. 6, and fig. 7, where the method for manufacturing a display module includes the following steps:
s10, a plurality of signal terminals 11 are formed on the first substrate 10.
And S20, forming a plurality of electrode elements 21 on the circuit board 20.
And S30, arranging the side of the circuit board 20, on which the electrode elements 21 are formed, opposite to the side of the first substrate 10, on which the signal terminals 11 are formed, and connecting the signal terminals 11 with the electrode elements 21.
And S40, forming a packaging connecting part 22 surrounding the periphery of the circuit board 20 between the first substrate 10 and the circuit board 20, wherein one end of the packaging connecting part 22 is connected to the circuit board 20, the other end of the packaging connecting part 22 is connected to the first substrate 10, so as to form a surrounding area 201 between the first substrate 10 and the circuit board 20, and a plurality of signal terminals 11 and a plurality of electrode elements 21 are positioned in the surrounding area 201, wherein the material of the packaging connecting part 22 is the same as that of the circuit board 20.
Specifically, in step S10 and step S20, the material of the first substrate 10 and the wiring board 20 may be glass.
In step S30, the pair of the side of the wiring board 20 on which the plurality of electrode members 21 are formed and the side of the first substrate 10 on which the plurality of signal terminals 11 are formed are paired, and the plurality of electrode members 21 are provided in alignment with the plurality of signal terminals 11, so that the plurality of electrode members 21 are connected to the plurality of signal terminals 11.
In one embodiment, the signal terminals 11 may be coated with a conductive material, and then the electrode member 21 and the conductive material are connected on the side away from the first substrate 10, and the conductive material is cured to connect the electrode member 21 and the signal terminals 11. And the conductive material may include silver paste or copper paste, etc.
In one embodiment, a bonding metal may be formed on the signal terminal 11, and then the electrode member 21 and the signal terminal 11 may be connected together by a hot pressing or laser welding process.
Next, in step S40, a portion around the wiring board 20 may be heat-treated by using a pulsed laser, and the temperature is controlled by controlling the wavelength, power, time, and the like of the laser, so that the portion around the wiring board 20 is softened or melted and is soldered to the first substrate 10 to form the package connection portion 22 around the wiring board 20 and connected between the wiring board 20 and the first substrate 10.
The package connecting portion 22 forms a surrounding area 201 between the circuit board 20 and the first substrate 10, and the plurality of signal terminals 11 and the plurality of electrode elements 21 connected to each other, and the integrated circuit on the circuit board 20 are all located in the surrounding area 201, so as to provide a package protection effect for the plurality of signal terminals 11, the plurality of electrode elements 21, and the integrated circuit.
In the embodiment of the present invention, glass is used as a carrier substrate of the circuit board 20, and after the circuit board 20 and the first substrate 10 are bonded and connected, a portion around the circuit board 20 forms a package connection portion 22 by laser processing, so as to be soldered with the first substrate 10. Compared with the prior art that the silicon-based substrate is used as the bearing plate of the circuit board and then molded and packaged, the embodiment of the invention can reduce the manufacturing cost of the circuit board, has simple packaging process and saves the packaging time and the packaging cost.
Further, the protective layer 30 is formed on the circuit board 20, and the protective layer 30 covers the circuit board 20 and the package connecting portion 22, so that the probability of damage caused by collision, extrusion or scratch of the circuit board 20 and other objects can be reduced.
Alternatively, the material of the protective layer 30 may include an epoxy resin material, and specifically may include polymethyl methacrylate or polycarbonate.
In summary, in the embodiment of the present invention, the package connection portion 22 is formed between the circuit board 20 and the first substrate 10 by using the same material of the circuit board 20, and the package connection portion 22 is located around the circuit board 20, so as to form a surrounding area 201 between the circuit board 20 and the first substrate 10, and the signal terminal 11 and the electrode element 21 are both located in the surrounding area 201, thereby effectively playing a role of packaging the signal terminal 11 and the electrode element 21, and improving the stability and yield of the display module; compared with the existing chip packaging technology, the invention can simplify the process procedures and reduce the process cost.
In addition, the embodiment of the invention also provides a display device, which comprises a device main body and a display module, wherein the display module and the device main body are combined into a whole.
The device body may include a frame body and the like, and the display device may be an organic light emitting diode display, a liquid crystal display, or an LED light emitting panel.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display module, the manufacturing method thereof and the display device provided by the embodiment of the invention are described in detail, a specific example is applied in the description to explain the principle and the implementation mode of the invention, and the description of the embodiment is only used for helping to understand the technical scheme and the core idea of the invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A display module, comprising:
a first substrate on which a plurality of signal terminals are provided;
the circuit board is arranged opposite to the first substrate, and one side of the circuit board close to the first substrate is provided with a plurality of electrode pieces connected with the signal terminals;
a package connecting portion disposed between the first substrate and the circuit board and surrounding the circuit board, wherein one end of the package connecting portion is connected to the circuit board, and the other end of the package connecting portion is connected to the first substrate, so as to form a surrounding area between the first substrate and the circuit board, and the signal terminals and the electrode elements are located in the surrounding area;
and the material of the packaging connecting part is the same as that of the circuit board.
2. The display module of claim 1, wherein the material of the first substrate is the same as the material of the package connection portion.
3. The display module according to claim 1 or 2, wherein the material of the package connecting portion, the material of the circuit board, and the material of the first substrate all comprise glass.
4. The display module of claim 1, wherein the material of the first substrate comprises a polymer organic material.
5. The display module according to claim 1, further comprising a protective layer, wherein the protective layer covers the circuit board and the package connecting portion.
6. The display module according to claim 1, wherein the display module comprises a functional region, a binding region adjacent to the functional region, and a second substrate disposed opposite to the first substrate and within the functional region;
the first substrate is arranged in the functional area and extends to the binding area, the display module comprises at least one circuit board which is arranged in the binding area and opposite to the first substrate, and the at least one circuit board is arranged on one side of the first substrate close to the second substrate.
7. The display module of claim 1, further comprising a second substrate disposed opposite to the first substrate, wherein the display module comprises at least one of the circuit boards disposed on a side of the first substrate away from the second substrate.
8. A manufacturing method of a display module is characterized by comprising the following steps:
forming a plurality of signal terminals on a first substrate;
forming a plurality of electrode members on the circuit board;
arranging the side of the circuit board, on which the plurality of electrode elements are formed, opposite to the side of the first substrate, on which the plurality of signal terminals are formed, and connecting the plurality of signal terminals with the plurality of electrode elements;
the first substrate with form between the circuit board around in circuit board encapsulation connecting portion all around, just the one end of encapsulation connecting portion connect in the circuit board, the other end connect in the first substrate, in order to form one between the first substrate with the circuit board and enclose into the region, it is a plurality of signal terminal is a plurality of the electrode component is located enclose into the region, wherein, the material of encapsulation connecting portion with the material of circuit board is the same.
9. The method as claimed in claim 8, wherein the step of forming a package connecting portion between the first substrate and the circuit board around the periphery of the circuit board comprises:
the material of the circuit board comprises glass, the periphery of the circuit board is subjected to laser treatment, so that the part, located on the periphery, of the circuit board forms the packaging connecting part, and one end, far away from the circuit board, of the packaging connecting part is connected to the first substrate;
and forming a protective layer for coating the circuit board and the packaging connecting part.
10. A display device, comprising a device body and the display module set of any one of claims 1 to 7, wherein the display module set is integrated with the device body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211667938.XA CN115802802A (en) | 2022-12-23 | 2022-12-23 | Display module, manufacturing method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211667938.XA CN115802802A (en) | 2022-12-23 | 2022-12-23 | Display module, manufacturing method thereof and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115802802A true CN115802802A (en) | 2023-03-14 |
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ID=85427844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211667938.XA Pending CN115802802A (en) | 2022-12-23 | 2022-12-23 | Display module, manufacturing method thereof and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115802802A (en) |
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2022
- 2022-12-23 CN CN202211667938.XA patent/CN115802802A/en active Pending
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