CN111091764B

CN111091764B - Electronic device and manufacturing method thereof

Info

Publication number: CN111091764B
Application number: CN201811213140.1A
Authority: CN
Inventors: 李晋棠
Original assignee: GIO Optoelectronics Corp
Current assignee: GIO Optoelectronics Corp
Priority date: 2018-10-18
Filing date: 2018-10-18
Publication date: 2022-04-15
Anticipated expiration: 2038-10-18
Also published as: CN111091764A

Abstract

The invention discloses an electronic device and a manufacturing method thereof. The manufacturing method comprises the following steps: providing a component substrate, wherein the component substrate comprises a base material and a first conductive circuit; providing a connection substrate, wherein the connection substrate comprises a second conductive circuit; arranging a connecting piece on the connecting substrate or the side surface of the base material; the second conductive circuit of the connecting substrate faces the side surface, the connecting substrate is connected to the side surface by using the connecting piece, and the side surface, the connecting piece and the connecting substrate form a groove together; and arranging a conductive piece in the groove to enable the conductive piece to contact the first conductive circuit and the second conductive circuit respectively, wherein the first conductive circuit is electrically connected with the second conductive circuit through the conductive piece.

Description

Electronic device and manufacturing method thereof

Technical Field

The present disclosure relates to electronic devices, and particularly to an electronic device with a narrow bezel and a method for manufacturing the same.

Background

The light emitting diode is a light emitting element made of a semiconductor material, and the element has two electrode terminals, and a voltage is applied between the terminals, and a very small voltage is applied, so that residual energy can be excited and released in the form of light through the combination of electron holes. Unlike common incandescent lamp, LED is cold light emitting and has the advantages of low power consumption, long service life, no need of lamp warming time, fast reaction speed, etc. In addition, the module has small size, is vibration-resistant, suitable for mass production, and can be easily made into a tiny or array module according to the application requirements, so that the module can be widely applied to lighting equipment, indicators of information, communication, consumer electronics, backlight modules of display devices, and is one of the essential important elements in daily life. Among them, the structural design of the electronic device with narrow frame is always one of the targets continuously pursued in the industry.

Disclosure of Invention

The invention aims to provide an electronic device with a narrow frame characteristic and a manufacturing method thereof, so that the product has higher competitiveness.

To achieve the above objective, an electronic device according to the present invention includes a device substrate, a connection member and a conductive member. The element substrate comprises a base material and a first conductive circuit, the base material is provided with a first surface and a side surface, and the first conductive circuit is arranged on the first surface. The connection substrate comprises a second conductive circuit arranged facing the side surface; the connecting piece is arranged between the side face of the base material and the second conductive circuit, and the side face, the connecting piece and the connecting substrate form a groove together. The conductive piece is arranged in the groove and is respectively contacted with the first conductive circuit and the second conductive circuit, and the first conductive circuit is electrically connected with the second conductive circuit through the conductive piece.

To achieve the above object, a method for manufacturing an electronic device according to the present invention comprises: providing a component substrate, wherein the component substrate comprises a base material and a first conductive circuit, the base material is provided with a first surface and a side surface, the first conductive circuit is arranged on the first surface, and a connecting substrate is provided, wherein the connecting substrate comprises a second conductive circuit, a connecting piece is arranged on the connecting substrate or the side surface of the base material, the second conductive circuit of the connecting substrate faces the side surface, the connecting substrate is connected to the side surface by the connecting piece, and the side surface, the connecting piece and the connecting substrate form a groove together; and arranging a conductive piece in the groove to enable the conductive piece to contact the first conductive circuit and the second conductive circuit respectively, wherein the first conductive circuit is electrically connected with the second conductive circuit through the conductive piece.

In one embodiment, the connection substrate further includes a flexible substrate, and the second conductive traces are disposed on a surface of the flexible substrate facing the side surface.

In one embodiment, the flexible substrate comprises an organic polymer material having a glass transition temperature between 200 ℃ and 600 ℃.

In one embodiment, the thickness of the connection substrate is 10 micrometers or more and 200 micrometers or less.

In one embodiment, the electronic device further comprises a control chip and a conductive thin substrate. The conductive thin substrate is connected with one side of the connecting substrate far away from the conductive piece, and the control wafer is arranged on the conductive thin substrate and is electrically connected with the second conductive circuit through the conductive thin substrate.

In one embodiment, the electronic device further includes a driving circuit board connected to a side of the conductive thin substrate away from the connection substrate, the driving circuit board being electrically connected to the component substrate through the conductive thin substrate and the connection substrate.

In one embodiment, the electronic device further includes a control chip disposed on the connection substrate and electrically connected to the second conductive traces.

In one embodiment, the electronic device further includes a driving circuit board connected to a side of the connection substrate away from the conductive member, the driving circuit board being electrically connected to the component substrate through the connection substrate.

In one embodiment, the driving circuit board support is disposed on a second surface of the base opposite to the first surface, wherein the connection substrate has a bending portion, and the connection substrate is connected to the support by bending the connection substrate through the bending portion and facing the second surface side of the base.

In one embodiment, the connecting member is formed by curing a connecting material.

In one embodiment, the conductive member is formed by spraying a conductive material on the groove and curing.

In one embodiment, the method of manufacturing further comprises: providing a conductive thin substrate and a control chip, and arranging the control chip on the conductive thin substrate; and connecting the conductive thin substrate with one side of the connecting substrate far away from the conductive piece, wherein the control chip is electrically connected with the second conductive circuit through the conductive thin substrate.

In one embodiment, the method of manufacturing further comprises: and connecting the driving circuit board with one side of the conductive thin substrate far away from the connecting substrate, wherein the driving circuit board is electrically connected with the element substrate through the conductive thin substrate and the connecting substrate.

In one embodiment, the method of manufacturing further comprises: and the control chip is arranged on the connecting substrate, wherein the control chip is electrically connected with the second conductive circuit.

In one embodiment, the method of manufacturing further comprises: the driving circuit board is connected with one side of the connecting substrate far away from the conductive piece, wherein the driving circuit board is electrically connected with the element substrate through the connecting substrate.

In one embodiment, the method of manufacturing further comprises: arranging a support on a second surface of the substrate opposite to the first surface; and bending the connection substrate to form a bending part, and bending the connection substrate by the bending part to face the second surface side of the base material and connect with the support.

In summary, in the electronic device and the manufacturing method thereof of the present invention, the connecting substrate is connected to the side of the component substrate through the connecting member, and the conductive member is disposed on the side of the connecting substrate and in the groove formed by the connecting member and the connecting substrate, so that the component substrate can be electrically connected to the connecting substrate through the conductive member, and the module formed by the component substrate and the connecting substrate can be spliced to form a narrow frame.

Drawings

Fig. 1 is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment of the invention.

Fig. 2A to fig. 2D are schematic diagrams illustrating a manufacturing process of an electronic device according to an embodiment of the invention.

Fig. 3A to fig. 3E are schematic diagrams illustrating a manufacturing process of an electronic device according to another embodiment of the invention.

Fig. 4A to 4C are schematic views illustrating a manufacturing process of an electronic device according to another embodiment of the invention.

Detailed Description

An electronic device and a method of manufacturing the same according to a preferred embodiment of the present invention will be described below with reference to the accompanying drawings, in which like elements will be described with like reference numerals.

Fig. 1 is a schematic flow chart illustrating a method for manufacturing an electronic device according to an embodiment of the invention. The "electronic device" described in the following embodiments may be, for example, but not limited to, a Light Emitting Diode (LED) display device, a submillimeter light emitting diode (Mini LED) display device, a Micro LED (μ LED) display device, an LED lighting device, a Mini LED lighting device, or a Micro LED lighting device, or other planar electronic devices or display devices, and the invention is not limited thereto.

As shown in fig. 1, the method for manufacturing an electronic device may include at least the following steps: providing a component substrate, wherein the component substrate includes a base material and a first conductive trace, the base material has a first surface and a side surface, the first conductive trace is disposed on the first surface (step S01), providing a connection substrate, wherein the connection substrate includes a second conductive trace (step S02), a connecting member is disposed on the connection substrate or on the side surface of the base material (step S03), the second conductive trace of the connection substrate faces the side surface, the connection substrate is connected to the side surface by the connecting member, the side surface, the connecting member and the connection substrate form a groove together (step S04), and a conductive member is disposed in the groove, so that the conductive member contacts the first conductive trace and the second conductive trace respectively, wherein the first conductive trace is electrically connected to the second conductive trace through the conductive member (step S05).

Please refer to fig. 1 in conjunction with fig. 2A to 2D to describe the details of the steps S01 to S05. Fig. 2A to 2D are schematic diagrams of a manufacturing process of the electronic device 1 according to an embodiment of the invention.

As shown in fig. 2A, in step S01, a device substrate 11 is provided, wherein the device substrate 11 includes a base material 111 and at least one first conductive trace 112, and the base material 111 has a first surface S1, a second surface S2 and a side surface S3. Here, the first surface S1 (upper surface) and the second surface S2 (lower surface) are opposite surfaces of the substrate 111, and the side surface S3 connects the first surface S1 and the second surface S2, respectively, and the first conductive traces 112 may be disposed on the first surface S1 by a semiconductor thin film process or other suitable processes, for example. In some embodiments, the device substrate 11 may be a circuit substrate, and may be an Active Matrix (AM) circuit substrate or a Passive Matrix (PM) circuit substrate, on which a conductive line, a conductive film, an insulating film and a device (e.g., a thin film transistor, a light emitting device or a sensing device), or other films are disposed. Taking the active matrix circuit substrate as an example, the active matrix circuit substrate (the device substrate 11) may include a substrate 111 and a matrix circuit, the matrix circuit may include a plurality of scan lines, a plurality of data lines, a plurality of first conductive traces 112, a plurality of active devices (e.g., TFTs) and/or a plurality of light emitting semiconductor devices (e.g., LEDs, Mini LEDs or Micro LEDs) arranged in an array, the scan lines, the data lines, the first conductive traces 112, the active devices and/or the light emitting semiconductor devices arranged in an array are disposed on the first surface S1, and the first conductive traces 112 are respectively electrically connected to the corresponding light emitting semiconductor devices. When the electrical signal is transmitted to the active device and the first conductive trace 112, the corresponding light emitting semiconductor device can be controlled to emit light.

In practice, the substrate 111 can be a flexible substrate or a rigid substrate, and can be made of a transparent or opaque material. The light-transmitting material is, for example, glass, quartz, sapphire or the like, plastic, rubber, fiberglass or other polymer material, and preferably may be a Borosilicate glass substrate (Borosilicate glass substrate) or an organic polymer material. In some embodiments, the organic polymer material is, for example, but not limited to, Polyimide (PI), Polycarbonate (PC), or Polyethylene Terephthalate (PET).

Next, as shown in fig. 2B, in step S02, a connection substrate 12 is provided, wherein the connection substrate 12 includes at least one second conductive trace 122 and a flexible base material 121. Here, the connection substrate 12 is a thin substrate, a flexible substrate, or a rigid substrate, and is not limited thereto. In some embodiments, the connection substrate 12 is relatively thin, and the thickness d thereof may be, for example, 10 microns or more and 200 microns or less (10 μm. ltoreq. d. ltoreq.200 μm). The second conductive traces 122 are disposed on the flexible substrate 121. Here, the second conductive traces 122 may be formed on the flexible substrate 121 by a semiconductor thin film process or other suitable processes. In some embodiments, the connection substrate 12 may have a plurality of second conductive traces 122 corresponding to the plurality of first conductive traces 112 of the device substrate 11.

The flexible substrate 121 has flexibility and may include an organic polymer material, a Glass Transition Temperature (Tg) of the organic polymer material may be between 200 degrees celsius and 600 degrees celsius, and the characteristics of the flexible substrate 121 may not be damaged by such a high Tg in a subsequent process. The organic polymer material may be a thermoplastic material, such as Polyimide (PI), Polyethylene (PE), polyvinyl chloride (PVC), Polystyrene (PS), acrylic, fluorinated polymer (Fluoropolymer), polyester (polyester), or nylon (nylon). The material of the flexible substrate 121 of the present embodiment is Polyimide (PI) as an example.

It should be noted that the sequence of the steps S01 and S02 is not limited, and the steps S01 and S02 can be performed sequentially, or the step S02 and then the step S01 can be performed.

Next, as shown in fig. 2C, in step S03, the connector 13 is disposed on the connection board 12 or the side surface S3 of the base material 111. The connecting device 13 of the present embodiment is disposed on the second conductive trace 122 of the connecting substrate 12, for example, for subsequent connection (attach) between the device substrate 11 and the connecting substrate 12. Here, the connecting material is first disposed on the connecting substrate 12, and then the connecting member 13 is formed through a curing process. The connecting material may be an insulating adhesive, such as but not limited to an epoxy adhesive, a double-sided adhesive, a hot melt adhesive, a photo-curing adhesive, or a thermosetting adhesive, and may be disposed on the side surface S3 of the connecting substrate 12 or the substrate 111 by, for example but not limited to, coating or dispensing.

As shown in fig. 2C and 2D, in step S04, the second conductive trace 122 of the connecting substrate 12 faces the side surface S3 of the base material 111, the connecting substrate 12 is connected to the side surface S3 by the connector 13, and the side surface S3 of the base material 111, the connector 13 and the connecting substrate 12 form the groove U together (fig. 2D). Here, the connecting substrate 12 is connected to the side surface of the component substrate 11, and the connecting member 13 is located between the connecting substrate 12 and the component substrate 11, so that the connecting substrate 12 is connected to the side surface S3 of the component substrate 11 by the connecting member 13, thereby forming the groove U together for facilitating the installation of the subsequent conductive member 14.

Next, in step S05, the conductive elements 14 are disposed in the recesses U, so that the conductive elements 14 can contact the first conductive trace 112 and the second conductive trace 122, respectively, and the first conductive trace 112 can be electrically connected to the second conductive trace 122 through the conductive elements 14. Since the side surface S3 of the base material 111, the connecting member 13 and the connecting substrate 12 form the groove U together, the conductive material may be disposed in the groove U by spraying, for example, and cured to form the conductive member 14, and the conductive member 14 contacts the first conductive trace 112 and the second conductive trace 122, so that the component substrate 11 and the connecting substrate 12 are electrically connected through the conductive member 14. The conductive material may include copper paste, silver paste, solder paste, Anisotropic Conductive Paste (ACP), or other conductive materials suitable for conducting electricity, which is not limited in the disclosure. In this embodiment, besides the conductive element 14 filling the recess U, the conductive element 14 further extends to the first conductive trace 112 of the device substrate 11 and the side of the second conductive trace 122 of the connection substrate 12 to contact (cover) part of the first conductive trace 112 and the second conductive trace 122, so that the first conductive trace 112 can be electrically connected to the second conductive trace 122 through the conductive element 14.

As shown in fig. 2D, the electronic device 1 of the present embodiment includes a device substrate 11, a connection substrate 12, a connector 13, and a conductive member 14. The device substrate 11 includes a substrate 111 and at least one first conductive trace 112, the substrate 111 has a first surface S1, a second surface S2 and a side surface S3, and the first conductive trace 112 is disposed on the first surface S1; the connection substrate 12 includes a flexible substrate 121 and at least one second conductive trace 122, the second conductive trace 122 is disposed on the flexible substrate 121 facing the side surface S3 of the substrate 111; the connecting member 13 is disposed between the side surface S3 of the base material 111 and the second conductive trace 122, the connecting member 13 can respectively connect the device substrate 11 and the connecting substrate 12, and the side surface S3 of the base material 111, the connecting member 13 and the connecting substrate 12 can jointly form a groove U; the conductive elements 14 are disposed in the recess U and respectively contact the first conductive trace 112 and the second conductive trace 122, so that the first conductive trace 112 can be electrically connected to the second conductive trace 122 through the conductive elements 14, and the connection substrate 12 can be electrically connected to the device substrate 11 through the conductive elements 14.

In summary, the electronic device 1 of the present embodiment is connected to the side of the component substrate 11 through the connecting substrate 12 by the connecting member 13, and then the conductive member 14 is disposed in the groove U formed by the side surface S3 of the component substrate 11, the connecting member 13 and the connecting substrate 12, so that the component substrate 11 can be electrically connected to the connecting substrate 12 through the conductive member 14, and the module formed by the component substrate 11 and the connecting substrate 12 can be spliced to form a narrow frame, so that the electronic device 1 has the characteristic of a narrow frame, and further the competitiveness of the product can be improved.

Fig. 3A to fig. 3D are schematic diagrams of a manufacturing process of an electronic device 1a according to another embodiment of the invention.

As shown in fig. 3A, in the manufacturing process of the electronic device 1a, the element substrate 11 is also provided first (step S01), and then, the following two steps are performed without performing step S02: as shown in fig. 3B, a conductive thin substrate 16 and a control chip 15 are provided, and the control chip 15 is disposed on the conductive thin substrate 16; and connecting the thin conductive substrate 16 to one side of the connection substrate 12, wherein the control chip 15 is electrically connected to the second conductive trace 122 of the connection substrate 12 through the thin conductive substrate 16. In this embodiment, the control chip 15 is disposed on the thin conductive substrate 16 and then reversed, such that the control chip 15 is disposed downward relative to the second conductive traces 122, and the thin conductive substrate 16 is electrically connected to the connection substrate 12. Here, the conductive thin substrate 16 is, for example but not limited to, a conductive film (conductive film), and the control chip 15 may be disposed on the conductive thin substrate 16 by, for example, a Chip On Film (COF) technology, and then the conductive thin substrate 16 is connected to one side of the connection substrate 12, so that the control chip 15 can be electrically connected to the second conductive traces 122 of the connection substrate 12 through the conductive thin substrate 16. It should be noted that, after the step S01, the above two steps are performed before the step S02, so that the process of connecting the thin conductive substrate 16 and the connection substrate 12 is easier (if the thin conductive substrate 16 and the connection substrate 12 are connected after the connection substrate 12 is connected to the side surface S3 of the base material 111, the process is more difficult).

Thereafter, as shown in fig. 3C and 3D, step S03 and step S04 are performed again: the connecting member 13 is disposed on the connecting substrate 12, and the connecting substrate 12 is connected to the side surface S3 by the connecting member 13, such that the side surface S3 of the base material 111, the connecting member 13 and the connecting substrate 12 form a groove U together. Subsequently, step S05 is performed: the conductive member 14 is disposed in the groove U, so that the conductive member 14 can contact the first conductive trace 112 and the second conductive trace 122, respectively, and the first conductive trace 112 can be electrically connected to the second conductive trace 122 through the conductive member 14. In this embodiment, except for filling the conductive member 14 into the groove U, the conductive member 14 extends to the first conductive trace 112 of the component substrate 11 and the side of the second conductive trace 122 connected to the substrate 12, so that the first conductive trace 112 can be electrically connected to the second conductive trace 122 through the conductive member 14. In addition, since the control chip 15 is electrically connected to the second conductive trace 122 of the connection substrate 12 through the thin conductive substrate 16, and the second conductive trace 122 is electrically connected to the first conductive trace 112 through the conductive member 14, the control chip 15 can be electrically connected to the device substrate 11 through the thin conductive substrate 16 and the connection substrate 12, so that the control chip 15 can control the device substrate 11.

In addition, as shown in fig. 3D, the manufacturing method of the present embodiment further includes: the driving circuit board 17 is connected to the side of the conductive thin substrate 16 away from the connection substrate 12, wherein the driving circuit board 17 is electrically connected to the element substrate 11 through the conductive thin substrate 16 and the connection substrate 12. Here, the driving circuit board 17 may be a system circuit board of the electronic device 1b, such as but not limited to a printed circuit board. The driving circuit board 17 can be electrically connected to the device substrate 11 through the conductive thin substrate 16 and the connection substrate 12, so that the driving circuit board 17 can drive or control the device substrate 11. It should be noted that, the process of connecting the driving circuit board 17 to the thin conductive substrate 16 in the embodiment is performed after the step S05 of disposing the conductive members 14 in the grooves U, and in different embodiments, the process of connecting the driving circuit board 17 to the thin conductive substrate 16 may be performed after the step S04 of connecting the thin conductive substrate 16 to the connecting substrate 12, without limitation.

In order to make the electronic device 1a thinner, as shown in fig. 3E, the method for manufacturing an electronic device of the present embodiment further includes: disposing the support 18 on the second surface S2 of the substrate 111; and bending the connection substrate 12 to form a bent portion 123, and bending the connection substrate 12 by the bent portion 123 to face the second surface side of the base material 111 of the element substrate 11 and connect to the support 18. Here, the supporting member 18 is disposed on the second surface S2 of the substrate 111, and may be disposed corresponding to the connection substrate 12 to connect the substrate 111 and the connection substrate 12; in various embodiments, the supporting member 18 may also be disposed corresponding to the conductive thin substrate 16 or the driving circuit board 17 to connect the two, and is not limited. Since the connection substrate 12 of the present embodiment is a flexible substrate, the connection substrate 12 can be bent to form the bending portion 123, so as to bend a portion of the connection substrate 12 to the lower surface of the device substrate 11, and further connect the second conductive trace 122 of the connection substrate 12 with the supporting element 18. In order to connect and fix the relative positions of the connection substrate 12 and the device substrate 11, the upper and the two surfaces of the support 18 may include an adhesive material (not shown) to respectively adhere the base 111 and the connection substrate 12, or adhere the base 111 and the conductive thin substrate 16 or the driving circuit board 17, or the support 18 itself may be an adhesive material without limitation, so that the curved connection substrate 12 can be respectively connected to the side surface and the bottom surface of the device substrate 11, thereby reducing the overall thickness of the electronic device 1 a.

As shown in fig. 3E, the electronic device 1a of the present embodiment further includes a control chip 15, a conductive thin substrate 16, a driving circuit board 17 and a supporting member 18 in addition to the component substrate 11, the connection substrate 12, the connecting member 13 and the conductive member 14. The conductive thin substrate 16 is connected to the connecting substrate 12 at a side away from the conductive component 14, and the control chip 15 is disposed on the conductive thin substrate 16 and electrically connected to the second conductive trace 122 through the conductive thin substrate 16. In addition, the driving circuit board 17 is connected to the side of the thin conductive substrate 16 away from the connection substrate 12, and the driving circuit board 17 can be electrically connected to the device substrate 11 through the thin conductive substrate 16 and the connection substrate 12, so that the driving circuit board 17 and the control chip 15 can drive or control the device substrate 11 through the thin conductive substrate 16 and the connection substrate 12 to control the operation of the device substrate 11. In addition, the supporting member 18 is disposed on the second surface S2 of the base 111, and the connection substrate 12 can be connected to the lower surface of the device substrate 11 through the supporting member 18 by the bending portion 123 of the connection substrate 12.

Therefore, the electronic device 1a of the present embodiment is also connected to the side of the element substrate 11 through the connecting substrate 12 and the connecting member 13, so that the module formed by the element substrate 11 and the connecting substrate 12 can be spliced to form a narrow frame, and the electronic device 1a also has the characteristic of a narrow frame.

Fig. 4A to 4C are schematic diagrams of a manufacturing process of an electronic device 1b according to another embodiment of the invention.

As shown in fig. 4A, the method of manufacturing the electronic device 1b of the present embodiment is substantially the same as the method of manufacturing the electronic device 1a of the previous embodiment. The difference is that in the electronic device 1b of the present embodiment, a thin conductive substrate is not used, but the control chip 15 is directly disposed on the side of the connection substrate 12 away from the conductive member 14, and the control chip 15 is electrically connected to the second conductive trace 122 of the connection substrate 12, so that the control chip 15 can be electrically connected to the device substrate 11 through the connection substrate 12. The step of providing the control chip 15 on the connection substrate 12 may be performed after the above-described step S02 (providing a connection substrate). Next, as shown in fig. 4B, after the step of connecting the connection substrate 12 to the side surface S3 of the device substrate 11 by the connection element 13 (S04) and the step of electrically connecting the first conductive trace 112 and the second conductive trace 122 by the conductive element 14 (S05), the driving circuit board 17 is connected to one side of the connection substrate 12, and the driving circuit board 17 and the control chip 15 are electrically connected to the device substrate 11 through the connection substrate 12. Of course, the step of disposing the driver circuit board 17 may be performed before the step of connecting the connection substrate 12 to the element substrate 11 by the connector 13 (S04). Finally, as shown in fig. 4C, the connection substrate 12 is bent to form a bent portion 123, so that the connection substrate 12 can be connected to the lower surface of the component substrate 11 through the supporting member 18 by the bent portion 123, thereby obtaining the electronic device 1b of the present embodiment. Since the electronic device 1b does not use the conductive thin substrate, but the control chip 15 is directly disposed on the connection substrate 12, the cost of the conductive thin substrate can be saved, and the cost of the electronic device 1b can be reduced.

The foregoing is by way of example only and is not intended as limiting. Any equivalent modifications or variations that do not depart from the spirit and scope of the present invention are intended to be included within the scope of the appended claims.

Claims

1. An electronic device, comprising:

the component substrate comprises a base material and a first conducting circuit, wherein the base material is provided with a first surface and a side surface, and the first conducting circuit is arranged on the first surface;

a connection substrate including a second conductive trace disposed facing the side surface;

the connecting piece is arranged between the side face of the base material and the second conductive circuit, and the side face, the connecting piece and the connecting substrate form a groove together; and

and the conductive parts are arranged in the grooves and respectively contact the first conductive circuit and the second conductive circuit, and the first conductive circuit is electrically connected with the second conductive circuit through the conductive parts.

2. The electronic device according to claim 1, wherein the connection substrate further comprises a flexible substrate, and the second conductive traces are disposed on a surface of the flexible substrate facing the side surface.

3. The electronic device of claim 2, wherein the flexible substrate comprises an organic polymer material having a glass transition temperature of 200 ℃ to 600 ℃.

4. The electronic device according to claim 1, wherein a thickness of the connection substrate is 10 micrometers or more and 200 micrometers or less.

5. The electronic device of claim 1, wherein the conductive member is made of copper paste, silver paste, solder paste, or anisotropic conductive paste.

6. The electronic device of claim 1, further comprising:

a control chip; and

the conductive thin substrate is connected with one side of the connecting substrate, which is far away from the conductive piece, and the control wafer is arranged on the conductive thin substrate and is electrically connected with the second conductive circuit through the conductive thin substrate.

7. The electronic device of claim 6, further comprising:

and the driving circuit board is connected with one side of the conductive thin substrate, which is far away from the connecting substrate, and is electrically connected with the element substrate through the conductive thin substrate and the connecting substrate.

8. The electronic device of claim 1, further comprising:

and the control wafer is arranged on the connecting substrate and is electrically connected with the second conductive circuit.

9. The electronic device of claim 8, further comprising:

and the driving circuit board is connected with one side of the connecting substrate, which is far away from the conductive piece, and is electrically connected with the element substrate through the connecting substrate.

10. The electronic device of claim 1, further comprising:

and a support member disposed on a second surface of the base member opposite to the first surface, wherein the connection substrate has a bent portion, and the connection substrate is bent by the bent portion and faces the second surface side of the base member to be connected to the support member.

11. A method of manufacturing an electronic device, comprising:

providing a component substrate, wherein the component substrate comprises a base material and a first conductive circuit, the base material is provided with a first surface and a side surface, and the first conductive circuit is arranged on the first surface;

providing a connection substrate, wherein the connection substrate comprises a second conductive line;

arranging a connecting piece on the connecting substrate or the side surface of the base material;

the second conductive circuit of the connecting substrate faces the side surface, the connecting substrate is connected to the side surface by the connecting piece, and the side surface, the connecting piece and the connecting substrate form a groove together; and

and arranging a conductive piece in the groove to enable the conductive piece to respectively contact the first conductive circuit and the second conductive circuit, wherein the first conductive circuit is electrically connected with the second conductive circuit through the conductive piece.

12. The method according to claim 11, wherein the connection substrate further comprises a flexible substrate, the flexible substrate comprises an organic polymer material, and a glass transition temperature of the organic polymer material is between 200 ℃ and 600 ℃.

13. The manufacturing method according to claim 11, wherein a thickness of the connection substrate is 10 micrometers or more and 200 micrometers or less.

14. The method of manufacturing according to claim 11, wherein the link is cured from a link material.

15. The method as claimed in claim 11, wherein the conductive member is formed by spraying a conductive material onto the groove and curing the conductive material.

16. The method of manufacturing according to claim 11, further comprising:

providing a conductive thin substrate and a control wafer, and arranging the control wafer on the conductive thin substrate; and

and connecting the conductive thin substrate with one side of the connecting substrate far away from the conductive part, wherein the control wafer is electrically connected with the second conductive circuit through the conductive thin substrate.

17. The method of manufacturing of claim 16, further comprising:

and connecting a driving circuit board with one side of the conductive thin substrate far away from the connecting substrate, wherein the driving circuit board is electrically connected with the element substrate through the conductive thin substrate and the connecting substrate.

18. The method of manufacturing according to claim 11, further comprising:

and the control wafer is arranged on the connecting substrate, wherein the control wafer is electrically connected with the second conductive circuit.

19. The method of manufacturing of claim 18, further comprising:

and connecting a driving circuit board with one side of the connecting substrate far away from the conductive part, wherein the driving circuit board is electrically connected with the element substrate through the connecting substrate.

20. The method of manufacturing according to claim 11, further comprising:

disposing a support on a second surface of the substrate opposite the first surface; and

the connecting substrate is bent to form a bent portion, and the connecting substrate is bent by the bent portion to face the second surface side of the base material and is connected to the support.