CN115799843A - W-band digital active antenna array - Google Patents
W-band digital active antenna array Download PDFInfo
- Publication number
- CN115799843A CN115799843A CN202210749484.4A CN202210749484A CN115799843A CN 115799843 A CN115799843 A CN 115799843A CN 202210749484 A CN202210749484 A CN 202210749484A CN 115799843 A CN115799843 A CN 115799843A
- Authority
- CN
- China
- Prior art keywords
- millimeter wave
- array
- chip
- bottom plate
- antenna array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention relates to a W-band digital active antenna array, which comprises a millimeter wave sub-array plate, a bottom plate and a signal processing unit, wherein the millimeter wave sub-array plate is arranged on the bottom plate; the millimeter wave sub-array plate comprises a multichannel patch antenna array and an active circuit, wherein the active circuit comprises a W-band TR chip and an up-down frequency conversion chip; the bottom plate comprises a low-frequency connector, a secondary power supply, a corresponding local oscillator and a corresponding intermediate-frequency interface; the radio frequency input signal is input through an interface of a bottom plate, transited to a millimeter wave sub-array plate, enters a frequency conversion chip to realize up-down frequency conversion, and finally passes through a TR chip and an antenna array to realize W-band signal receiving and transmitting; the low frequency interface of the bottom plate is connected with the signal processing unit, and the control and power supply signals generated by the signal processing unit are connected into the millimeter wave sub-array plate after passing through the bottom plate. The invention designs a miniaturized W-band digital active array. Meanwhile, the design concept of an expandable active subarray is adopted, and the requirements on the number of array channels in different scenes are met through the combination of millimeter wave subarrays with different numbers.
Description
Technical Field
The invention relates to the technical field of antennas and microwaves, in particular to a W-band digital active antenna array.
Background
The W wave band is one of millimeter wave atmospheric windows, the frequency of the W wave band is between microwave and light, the W wave band has the advantages of microwave and infrared, and the W wave band has wide application prospect in many fields. To achieve higher power aperture and more flexible beam characteristics, active phased array bodies are preferred as antenna systems that meet the demands in such electronic systems. The aperture size occupied by a single antenna element is typically limited to between half and one wavelength of the operating frequency based on array antenna scanning grating lobe-free design constraints, according to antenna beam scanning range requirements. This makes it necessary to integrate each array antenna element and its connected active transmit/receive channels in the range of about half a wavelength, which poses a major challenge to the implementation of millimeter wave active arrays. Traditionally, active millimeter wave arrays mostly adopt discrete device designs, including filters, power dividers, mixers, ADCs, DACs and other discrete components, and the system design is complex, the circuit scale is large, the higher the frequency band is, the higher the requirement on the integration level of an active circuit is. For electromagnetic waves in the E/W band, because of their short wavelength (e.g., about 4-5mm in the E band and 3mm or less in the W band), it is difficult to realize the conversion or digitization in such a narrow space. Therefore, the current research is carried out on the basis of a large-volume active array prototype, and the distance between the engineering application and the commercialization is wide. (such as Zhang Hui, microwave millimeter wave array imaging Key technology research, southeast university, 2016; pongy shadow, W-band patch antenna and array research thereof, china university of science and technology, 2020).
The wavelength of the W-band electromagnetic wave is shorter, the size of the antenna array is smaller, and the area of a corresponding active transceiving channel is limited, so that the W-band electromagnetic wave is difficult to realize regeneration and digitization. There is therefore a need to design an antenna array that is capable of both active telephony and digitization.
Disclosure of Invention
In order to solve the prior technical problem, the invention provides a W-band digital active antenna array.
The invention specifically comprises the following contents: a W-band digital active antenna array comprises a millimeter wave sub-array plate, a bottom plate and a signal processing unit; the millimeter wave sub-array plate comprises a multi-channel patch antenna array and an active circuit, wherein the active circuit comprises a W-band TR chip and an up-down frequency conversion chip; the bottom plate comprises a low-frequency connector, a secondary power supply, a corresponding local oscillator and a corresponding intermediate-frequency interface;
the radio frequency input signal is input through an interface of a bottom plate, transited to a millimeter wave sub-array plate, enters a frequency conversion chip to realize up-down frequency conversion, and finally passes through a TR chip and an antenna array to realize W-band signal receiving and transmitting; the low-frequency interface of the bottom plate is connected with the signal processing unit, and the control and power supply signals generated by the signal processing unit are accessed to the millimeter wave sub-array plate after passing through the bottom plate.
Furthermore, a groove is formed in the bottom plate, the millimeter wave array plate is embedded into the groove, the upper surface of the millimeter wave array plate protrudes out of the upper surface of the bottom plate, the signal processing unit is arranged in the digital plate, the bottom plate and the digital plate are interconnected through a flexible flat cable, and the flexible flat cable transmits digital control signals and supplies power.
Furthermore, the millimeter wave sub-array plate comprises a series feed patch antenna array, the antennas are all placed along the edge, and the occupied width of the subsequent active circuit does not exceed the width of the antenna array.
Furthermore, the bottom plate adopts FR4 panel, and millimeter wave array board is the LTCC material, and millimeter wave array board passes through in conducting resin or the large tracts of land soldering tin adhesion embedding recess.
Furthermore, the W-band chip integrates the functions of analog frequency mixing, filtering, digital phase shifting and attenuation, and supports a pulse signal mode and a frequency modulation continuous wave signal.
Furthermore, the W-band TR chip supports a master-slave working mode, and the millimeter wave front end can support single front end synchronization and multi-front end synchronization functions;
when the single front end works, the millimeter wave transmitting chip is set as a master chip, and the other millimeter wave chips are set as slave chips;
when multiple front ends work, the transmitting chip of one millimeter wave front end is set as a master chip, and all the other millimeter wave transceiving chips are set as slave chips; the system clock is generated by the master chip, is sent to the signal processing unit to complete shunting, and is respectively sent to each slave chip, a time sequence logic device and a local oscillation source in the signal processing unit to be used as the system clock; the system local oscillator is generated by a main chip, is sent to an external local oscillator source through a radio frequency cable to complete amplification, filtering and power division, and is transmitted to each millimeter wave transceiver chip to achieve local oscillator synchronization.
Furthermore, when a large-scale phased array system is formed by multiple front ends, a clock signal output by the signal processing unit can be used as a reference clock and sent to an external local oscillation source, and multiple paths of coherent local oscillation signals are generated and sent to multiple millimeter wave front ends.
Furthermore, each millimeter wave sub-array has the same circuit form, different numbers of sub-arrays can be flexibly combined to form array surfaces of different scales, and synchronization of clocks, local oscillators and data of the whole system is guaranteed through a synchronization circuit among the sub-arrays.
Furthermore, a plurality of signal processing units can work in a cascade mode, and final signal processing is completed in the upper computer.
The W-band digital active antenna array is based on a highly integrated domestic W-band chip (comprising a transceiver chip and a frequency conversion chip), and a miniaturized W-band digital active array is designed. Meanwhile, the design concept of an expandable active subarray is adopted, the requirements on the number of array channels in different scenes can be met through the combination of millimeter wave subarrays with different numbers, the MIMO or phased array working mode can be realized, and the flexibility and the universality of the system can be obviously improved.
Drawings
The following further explains embodiments of the present invention with reference to the drawings.
FIG. 1 is a schematic diagram of the W-band active digital array according to the present invention;
FIG. 2 is a schematic diagram of a W-band millimeter wave sub-array plate;
FIG. 3 is a schematic diagram of a millimeter wave TR chip;
FIG. 4 is a schematic diagram of a millimeter wave frequency conversion chip;
FIG. 5 is a schematic view of the installation of the bottom plate and the millimeter wave sub-array plate;
FIG. 6 is a schematic diagram of the expansion of a plurality of millimeter wave subarrays;
fig. 7 is a schematic diagram of cascade connection of a plurality of boards.
Detailed Description
Referring to fig. 1, the invention provides a 16-channel W-band active digital array, which comprises a millimeter wave sub-array board, a backplane and a signal processing unit. The thickness of the millimeter wave sub-array plate is 1.6mm, and the millimeter wave sub-array plate is made of LTCC (low temperature co-fired ceramic) materials, so that the flatness is guaranteed. The bottom plate is made of FR4 plates, a groove with the depth of 1.2mm is formed in the bottom plate, the millimeter wave array plate is embedded into the groove and is adhered through conductive adhesive or large-area soldering tin, the upper surface of the millimeter wave array plate protrudes out of the upper surface of the bottom plate, the upper surfaces of the two plates have the height difference of about 0.2mm, and the signal processing unit is located on the digital plate; the bottom plate and the digital plate are interconnected through a flexible flat cable, and the flexible flat cable transmits digital control signals and supplies power. One signal processing unit can support up to 10 millimeter wave sub-arrays.
Referring to fig. 2, the millimeter wave sub-array board includes a series-fed patch antenna array and an active millimeter wave circuit portion, and there are 16 antenna units for transceiving multiplexing. In order to facilitate the expandability of the subarray, the antennas are all arranged along the edge. The width occupied by the subsequent active channel circuit does not exceed the width of the antenna array. The active circuit mainly comprises two domestic 8-channel W-band TR chips and a W-band frequency conversion chip.
Referring to fig. 3 and 4, the w-band chip integrates functions of analog mixing, filtering, digital phase shifting, attenuation and the like (realized by adding a phase shifting module in a chip on the market), and can support a pulse signal mode and a frequency modulated continuous wave signal, and the maximum signal bandwidth of the w-band chip is 4GHz. And the working modes of time-sharing transceiving and single transmitting/single receiving are compatible. The W-band transceiver chip supports a master-slave working mode, can realize multi-chip cascade work and has expandability.
Referring to fig. 5, the millimeter wave sub-array board is embedded in the groove of the bottom plate and adhered by using large-area solder or conductive adhesive. The radio frequency signal and the control and power supply signal on the millimeter wave sub-array plate are interconnected with the bottom plate in a gold wire/gold belt bonding mode. In order to facilitate expandability of the subarray, the antennas are all arranged along the edge. The width occupied by the subsequent active channel circuit does not exceed the width of the antenna array.
The bottom plate comprises a low-frequency connector, a power supply device and a corresponding local oscillator and intermediate frequency interface (SMP), wherein the intermediate frequency and the local oscillator signals are input from the outside and are respectively 5-6GHz and 10.5-12GHz; radio frequency input signals are input through an SMP interface on a bottom plate, are transited to a millimeter wave sub-array plate through a gold wire bonding mode after passing through a microstrip line on the bottom plate, finally enter a frequency conversion chip to realize up-down frequency conversion, and finally pass through a TR chip and an antenna array to realize W-band signal receiving and transmitting. The bottom plate comprises a low-frequency and power supply interface which is connected with the signal processing unit through a flexible flat cable. After the control and power supply signals generated by the signal processing unit pass through the bottom plate, the millimeter wave sub-array plate is accessed in a gold wire/gold belt bonding mode.
Referring to fig. 6, a plurality of millimeter wave sub-array plates can be combined into a larger-scale antenna array, and the expandability is realized. The circuit form of each millimeter wave sub-array is the same, the sub-arrays with different numbers can be flexibly combined to form array planes with different scales, and the synchronization of clocks, local oscillators and data of the whole system is ensured through a synchronization circuit among the sub-arrays. The millimeter wave front end provided by the invention can support single front end synchronization and multi-front end synchronization functions. The millimeter wave transceiver chip can be set to a master mode and a slave mode. When the single front end works, the millimeter wave transmitting chip is set as a master chip, and the other millimeter wave chips are set as slave chips; when the multiple front ends work, the transmitting chip of one millimeter wave front end is set as a master chip, and all the other millimeter wave transceiving chips are set as slave chips. The system clock is generated by the master chip, sent to the signal processing unit to complete shunting, and respectively sent to each slave chip, a time sequence logic device and a local oscillation source in the signal processing unit to serve as the system clock. The system local oscillator is generated by a main chip, is sent to an external local oscillator source through a radio frequency cable to complete amplification, filtering and power division, and is transmitted to each millimeter wave transceiver chip so as to achieve the purpose of local oscillator synchronization. Meanwhile, when a larger-scale phased array system is formed by multiple front ends, the clock signal output by the signal processing unit can be used as a reference clock and sent to an external local oscillation source to generate multiple paths of coherent local oscillation signals and send the signals to multiple millimeter wave front ends, and the purpose of coherent local oscillation of the larger-scale phased array system is achieved.
Referring to fig. 7, the signal processing unit provided by the invention comprises sequential devices such as an FPGA, an ARM, an SFP + photoelectric conversion module, a DDR, a FLASH, and the like, and a plurality of boards can be connected to a PC through an SFP + optical port or a gigabit ethernet port, so that the cascade operation of a plurality of large-scale arrays is realized, and the expandability of the digital array is further enhanced. According to different applications, the W-band digital active arrays with different scales can be realized through the digital sub-array combination with different scales, and meanwhile, the whole system can be flexibly configured into an MIMO mode or a phased array mode. And a plurality of signal processing platforms can also work in a cascading way, so that the expandability of the millimeter wave array is further improved.
The invention relates to a W-band digital active antenna array, which is based on a highly integrated domestic W-band chip (comprising a transceiver chip and a frequency conversion chip), designs a miniaturized W-band digital active array and consists of a millimeter wave sub-array plate, a bottom plate and a signal processing unit. Based on a domestic W-band chip, the millimeter wave sub-array has the characteristics of miniaturization and high integration level, and the size of an active receiving and transmitting circuit is equivalent to that of an antenna array. The W-band digital active array can realize digital transceiving of a subarray level, the signal bandwidth can reach 4GHz maximally, and various working modes such as pulse transceiving, single transmitting and the like are supported. The millimeter wave sub-arrays and the signal processing unit can be freely combined to form millimeter wave arrays with different scales. Meanwhile, the purpose of synchronizing the data, the clock and the local oscillator of the whole system is achieved through the arrangement of the master chip and the slave chip. Through the signal processing unit, the digital active array can be configured into an MIMO working mode and a phased array working mode, has higher flexibility and universality, and has important application value in various fields such as foreign matter detection, security inspection imaging, automobile/helicopter collision avoidance and the like.
In the above description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The foregoing description is that of the preferred embodiment of the invention only, and the invention can be practiced in many ways other than as described herein, so that the invention is not limited to the specific implementations disclosed above. And that those skilled in the art may, using the methods and techniques disclosed above, make numerous possible variations and modifications to the disclosed embodiments, or modify equivalents thereof, without departing from the scope of the claimed embodiments. Any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present invention are within the scope of the technical solution of the present invention.
Claims (9)
1. A W-band digital active antenna array, characterized by: the device comprises a millimeter wave sub-array plate, a bottom plate and a signal processing unit; the millimeter wave sub-array plate comprises a multichannel patch antenna array and an active circuit, wherein the active circuit comprises a W-band TR chip and an up-down frequency conversion chip; the bottom plate comprises a low-frequency connector, a secondary power supply and corresponding local oscillation and intermediate frequency interfaces;
the radio frequency input signal is input through an interface of a bottom plate, transited to a millimeter wave sub-array plate, enters a frequency conversion chip to realize up-down frequency conversion, and finally passes through a TR chip and an antenna array to realize W-band signal receiving and transmitting; the low frequency interface of the bottom plate is connected with the signal processing unit, and the control and power supply signals generated by the signal processing unit are connected into the millimeter wave sub-array plate after passing through the bottom plate.
2. The W-band digital active antenna array of claim 1, wherein: the bottom plate is provided with a groove, the millimeter wave array plate is embedded into the groove, the upper surface of the millimeter wave array plate protrudes out of the upper surface of the bottom plate, the signal processing unit is arranged in the digital plate, the bottom plate and the digital plate are interconnected through a flexible flat cable, and the flexible flat cable transmits digital control signals and supplies power.
3. The W-band digital active antenna array of claim 1, wherein: the millimeter wave sub-array plate comprises a series feed patch antenna array, the antennas are all placed along the edge, and the occupied width of the subsequent active circuit does not exceed the width of the antenna array.
4. The W-band digital active antenna array of claim 1, wherein: the bottom plate adopts FR4 panel, and millimeter wave array board is the LTCC material, and millimeter wave array board passes through in conducting resin or the large tracts of land soldering tin adhesion embedding recess.
5. The W-band digital active antenna array of claim 1, wherein: the W-band chip integrates analog frequency mixing, filtering, digital phase shifting and attenuation functions, and supports a pulse signal mode and a frequency modulation continuous wave signal.
6. The W-band digital active antenna array of claim 1, wherein: the W-band TR chip supports a master-slave working mode, and the millimeter wave front end can support single-front-end synchronization and multi-front-end synchronization functions;
when the single front end works, the millimeter wave transmitting chip is set as a master chip, and the other millimeter wave chips are set as slave chips;
when the multiple front ends work, the transmitting chip of one millimeter wave front end is set as a master chip, and all the other millimeter wave transceiver chips are set as slave chips; the system clock is generated by the master chip, is sent to the signal processing unit to complete shunting, and is respectively sent to each slave chip, a time sequence logic device and a local oscillation source in the signal processing unit to be used as the system clock; the system local oscillator is generated by a main chip, is sent to an external local oscillator source through a radio frequency cable to complete amplification, filtering and power division, and is transmitted to each millimeter wave transceiver chip to achieve local oscillator synchronization.
7. The W-band digital active antenna array of claim 6, wherein: when a large-scale phased array system is formed by multiple front ends, a clock signal output by the signal processing unit can be used as a reference clock and sent to an external local oscillation source to generate multiple paths of coherent local oscillation signals and send the signals to multiple millimeter wave front ends.
8. The W-band digital active antenna array of claim 1, wherein: the circuit form of each millimeter wave sub-array is the same, the sub-arrays with different numbers can be flexibly combined to form array planes with different scales, and the synchronization of clocks, local oscillators and data of the whole system is ensured through a synchronization circuit among the sub-arrays.
9. The W-band digital active antenna array of claim 1, wherein: the signal processing units can work in a cascade mode, and final signal processing is completed in the upper computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210749484.4A CN115799843A (en) | 2022-06-28 | 2022-06-28 | W-band digital active antenna array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210749484.4A CN115799843A (en) | 2022-06-28 | 2022-06-28 | W-band digital active antenna array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115799843A true CN115799843A (en) | 2023-03-14 |
Family
ID=85431244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210749484.4A Pending CN115799843A (en) | 2022-06-28 | 2022-06-28 | W-band digital active antenna array |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115799843A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116526138A (en) * | 2023-07-04 | 2023-08-01 | 成都恪赛科技有限公司 | Phased array antenna with transmit-receive filtering design |
-
2022
- 2022-06-28 CN CN202210749484.4A patent/CN115799843A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116526138A (en) * | 2023-07-04 | 2023-08-01 | 成都恪赛科技有限公司 | Phased array antenna with transmit-receive filtering design |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108449107B (en) | Multi-beam tile type TR component | |
| CN106953658B (en) | High integration active phased array transmitting-receiving subassembly | |
| CN110739537A (en) | High-density high-integration millimeter wave tile-type phase-controlled antenna T component | |
| CN110741273B (en) | Antenna array | |
| US11029188B2 (en) | Radar fill level measurement device comprising radar chips on different planes of a circuit board | |
| EP3979518A1 (en) | Filter antenna and base station device | |
| CN114430106B (en) | Subarray subassembly and phased array antenna of phased array antenna | |
| US11067428B2 (en) | Radar fill level measurement device comprising a high-frequency amplifier | |
| CN113948879B (en) | Modular phased array antenna apparatus | |
| CN115799843A (en) | W-band digital active antenna array | |
| JP2005094440A (en) | Antenna system and radar system | |
| WO2020248725A1 (en) | Millimeter wave transceiver | |
| US20210005981A1 (en) | Array antenna | |
| CN218412928U (en) | Millimeter wave receiving and transmitting front end of improved active human body security inspection imaging system | |
| WO2019168484A3 (en) | Structure of a tile receiver/transmitter module with high power output | |
| CN114280588A (en) | Microwave photon multi-band array radar implementation method and system | |
| CN115225114B (en) | Omnidirectional electric scanning radio frequency assembly of missile-borne frequency hopping communication system | |
| CN113328265A (en) | Extensible E-band digital active array | |
| CN115575899A (en) | Phased array radar system design method based on antenna and radio frequency transceiving integration | |
| CN114740430A (en) | Radar and vehicle | |
| AU2009201717A1 (en) | A module for transforming between a RF signal and a digital multiplexed optical signal | |
| CN113451776A (en) | High-integration-level digital phased array system | |
| CN112596116A (en) | Miniaturized millimeter wave terahertz system based on multifunctional chip | |
| CN114285428B (en) | Adjustable hair button array data receiving device and method | |
| CN116520319A (en) | Millimeter wave array, millimeter wave imaging equipment and security inspection system based on radar chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |