CN115793136A - Optical connector and manufacturing method - Google Patents
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- CN115793136A CN115793136A CN202111064765.8A CN202111064765A CN115793136A CN 115793136 A CN115793136 A CN 115793136A CN 202111064765 A CN202111064765 A CN 202111064765A CN 115793136 A CN115793136 A CN 115793136A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 144
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000012792 core layer Substances 0.000 claims abstract description 84
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 239000010410 layer Substances 0.000 claims description 46
- 238000005253 cladding Methods 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 26
- 229920002120 photoresistant polymer Polymers 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 22
- 238000004891 communication Methods 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 13
- 238000004528 spin coating Methods 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229920000548 poly(silane) polymer Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000002019 doping agent Substances 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000013307 optical fiber Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000005468 ion implantation Methods 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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Abstract
An optical connector includes an optical waveguide including a substrate and a core layer provided on the substrate, the core layer including at least a pair of an input interface and an output interface, and the input interface and the output interface being connected by an optical waveguide circuit. According to the technical scheme, the dependence on manual operation can be reduced, the connection stability and reliability are improved, the cost is reduced, and the industrialization is facilitated.
Description
Technical Field
The present disclosure relates to the field of optical communication technologies, and in particular, to an optical connector and a manufacturing method thereof.
Background
In testing the performance of an optical link, it is necessary to use optical fibers to connect the transmit interface with the receive interface. With the increase of the integration level of the optical modules, the number of ports of the optical modules is increased, and thus, the optical paths need to be interconnected by using the array optical fiber connector. At present, optical path interconnection and testing are mostly realized by converting an MT optical fiber connector into an LC optical fiber connector. However, the optical interconnection method has many disadvantages, such as high dependence of the optical interconnection process on manual operation, long time consumption, and poor stability and reliability of the optical interconnection.
Disclosure of Invention
The main purpose of the embodiments of the present application is to provide an optical connector and a manufacturing method thereof, which aim to reduce dependence on manual operation and interconnection time, and improve stability and reliability of optical path interconnection.
In a first aspect, an embodiment of the present application provides an optical connector, including an optical waveguide, where the optical waveguide includes a substrate and a core layer disposed on the substrate, the core layer includes at least one pair of an input interface and an output interface, and the input interface and the output interface are connected by an optical waveguide line.
In some embodiments, the core layer is disposed on a surface of the substrate.
In some embodiments, the material of the core layer comprises a polymer.
In some embodiments, the polymer comprises any one of polysilane and polyimide.
In some embodiments, the material of the substrate includes any one of glass, ceramic, and silicon.
In some embodiments, an upper surface of the core layer is provided with an upper cladding layer, a lower surface of the core layer is provided with a lower cladding layer, and the refractive index of the material of the upper cladding layer and the lower cladding layer is lower than the refractive index of the material of the core layer.
In some embodiments, the core layer is a light guiding layer formed of a doped material doped within the substrate.
In some embodiments, the substrate is a glass substrate and the dopant material is silver.
In some embodiments, the optical connector further comprises an outer sleeve, the outer sleeve comprises a sleeve body, and an accommodating cavity is arranged in the sleeve body and is used for embedding the optical waveguide.
In some embodiments, alignment holes are respectively disposed on the ferrule body and on opposite sides of the accommodating cavity, and the alignment holes are used for fixing the outer ferrule to an external optical communication device of the optical connector.
In a second aspect, an embodiment of the present application provides a method for manufacturing an optical connector, including:
preparing a core layer on a substrate, wherein the core layer comprises at least one pair of input interface and output interface, and the input interface and the output interface are connected through an optical waveguide circuit.
In some embodiments, the material of the core layer is a polymer, an upper surface of the core layer is provided with an upper cladding layer, and a lower surface of the core layer is provided with a lower cladding layer;
the preparation of the core layer on the substrate comprises:
spin-coating a first photoresist on the surface of the substrate to obtain the lower cladding;
spin-coating a second type of photoresist on the surface of the lower cladding, and processing the second type of photoresist through a developing and curing process to obtain the core layer; wherein the second type of photoresist has a lower refractive index than the second type of photoresist;
and spin-coating the first photoresist on the surface of the core layer to obtain the upper cladding layer.
In some embodiments, the substrate is a glass substrate and the doped material is silver; the setting of the core layer on the substrate includes:
and implanting the silver on the surface of the glass substrate by an ion implantation mode to obtain the core layer.
The optical connector provided by the embodiment of the application obtains the core layer on the substrate, and because the core layer comprises at least one pair of the input interface and the output interface, and the input interface and the output interface are connected through the optical waveguide circuit, when the optical connector is used for optical path interconnection, only the optical fiber of the optical communication equipment needs to be connected with the corresponding input interface and output interface, so that the dependence on manual operation can be reduced, the stability and the reliability of connection can be improved, and the optical waveguide circuit is adjusted in advance, so that the optical connection of any input interface and any output interface can be realized. In addition, the optical connector can be manufactured by adopting mature coating, ion implantation and other modes, has low cost and is beneficial to industrialization.
Drawings
Fig. 1 is a schematic structural diagram of an optical waveguide in an optical connector according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of an outer sleeve in an optical connector according to an embodiment of the present disclosure;
fig. 3 is a flowchart of a method for manufacturing an optical connector according to an embodiment of the present disclosure;
FIG. 4 is a flow chart of another method for making an optical connector according to embodiments of the present disclosure;
FIG. 5 is a schematic structural diagram of a substrate with a lower cladding layer formed on the surface thereof according to an embodiment of the present disclosure;
FIG. 6 is a schematic structural diagram illustrating a core layer formed on the surface of a lower cladding layer according to an embodiment of the present application;
FIG. 7 is a schematic structural diagram illustrating an example of an upper cladding layer formed on a surface of a core layer according to the present disclosure;
FIG. 8 is a schematic diagram of an assembled optical connector according to an embodiment of the present application;
fig. 9 is a flow chart of another method of making an optical connector according to an embodiment of the present application.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present application, the server provided in the present application is described in detail below with reference to the accompanying drawings.
Example embodiments will be described more fully hereinafter with reference to the accompanying drawings, but which may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, … … specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
The embodiments described herein may be described with reference to plan and/or cross-sectional views in idealized schematic representations of the present application. Accordingly, the example illustrations may be modified in accordance with manufacturing techniques and/or tolerances. Accordingly, the embodiments are not limited to the embodiments shown in the drawings, but include modifications of configurations formed based on a manufacturing process. Thus, the regions illustrated in the figures have schematic properties, and the shapes of the regions shown in the figures illustrate specific shapes of regions of elements, but are not intended to be limiting.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present application and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
In order to solve the problems of strong dependence, poor connection reliability and poor stability when the input interface and the output interface of the existing optical communication equipment are directly connected by using optical fibers for testing, embodiments of the present application provide an optical connector, which can be used for realizing optical path interconnection, reducing dependence on manual operation, and improving reliability and stability of optical path interconnection.
Fig. 1 is a schematic structural diagram of an optical connector according to an embodiment of the present disclosure. Referring to fig. 1, the optical connector includes an optical waveguide 1 including a substrate 11 and a core layer 12 provided on the substrate 11, the core layer 12 including at least a pair of an input interface 121 and an output interface 122, and the input interface 121 and the output interface 122 being connected by an optical waveguide line 123. The optical connector shown in fig. 1 includes four pairs of input interfaces 121 and output interfaces 122, and the corresponding input interfaces 121 and output interfaces 122 are connected with four optical waveguide lines 123. In practical applications, the input interface 121 may be connected to any one of the output interfaces 122 in the core layer 12. Each pair of input interface 121 and output interface 122 corresponds to a channel for optical communication.
In some embodiments, the material of the substrate 11 includes any one of glass, ceramic, and silicon. The core layer 12 is disposed on the surface of the substrate 11, that is, the core layer 12 is added on the surface of the substrate 11.
In some embodiments, the material of the core layer 12 comprises a polymer or other material having an optical index of refraction within a predetermined range. The core layer 12 is formed on the surface of the substrate 11 by coating, developing and curing the polymer.
In some embodiments, the polymer comprises any one of polysilane and polyimide. It should be noted that in practical applications, the polymer can be selected according to the requirement of the actual refractive index, which improves the flexibility of the optical connector design.
In some embodiments, as shown in fig. 1 and 7, an upper cladding layer 13 is disposed on the upper surface of the core layer 12, and a lower cladding layer 14 is disposed on the lower surface of the core layer 12, specifically, the lower cladding layer 14, the core layer 12, and the upper cladding layer 13 are sequentially included on the surface of the substrate 11 from bottom to top, where the upper cladding layer 13 and the lower cladding layer 14 are used to protect the core layer 12.
In some embodiments, the refractive index of the materials of the upper cladding layer 13 and the lower cladding layer 14 is lower than that of the material of the core layer 12, so that the optical signal is totally reflected at the interface between the core layer 12 and the upper cladding layer 13 and the lower cladding layer 14, and the loss of the optical signal is reduced.
In other embodiments, the core layer 12 is a light guiding layer formed by doping material doped in the substrate 11, that is, the doping material is implanted on the surface of the substrate 11, and the core layer 12 is not a layer added on the surface of the substrate 11. Such as by ion implantation of the waveguide material onto the surface of the substrate 11.
In some embodiments, the substrate 11 is a glass substrate or other material suitable for creating a core layer by doping. The doped material is silver or other light conducting material.
In some embodiments, the optical connector further comprises an outer sleeve. As shown in fig. 2, the outer sleeve 2 includes a sleeve body 21, and a receiving cavity 22 is provided in the sleeve body 21, and the receiving cavity 22 is used for embedding the optical waveguide 1.
Understandably, the inner diameter of the receiving cavity 22 is sized to match the outer diameter of the optical waveguide 1, e.g., the inner diameter of the receiving cavity 22 is sized to be equal to or slightly larger than the outer diameter of the optical waveguide 1. In use, the optical waveguide 1 is embedded in the receiving cavity 22.
As shown in fig. 2 and 7, the ferrule body 21 is provided with alignment holes 23 on opposite sides of the accommodating chamber 22, the alignment holes 23 are used for fixing the ferrule 2 to an external optical communication device of an optical connector, and the alignment holes 23 also help to position the input interface 121 and the output interface 122 in the optical waveguide 1 opposite to the input and output interfaces of the external optical communication device.
In the optical connector provided by this embodiment, a core layer is obtained on a substrate, and the core layer includes at least a pair of input interfaces and output interfaces, and the input interfaces and the output interfaces are connected by optical waveguide lines, so that when the optical connector is used for optical path interconnection, only optical fibers need to be connected with the corresponding input interfaces and output interfaces, which can reduce dependence on manual operation and improve stability and reliability of connection, and optical connection between any input interface and any output interface can be realized by adjusting the optical waveguide lines in advance, thereby being suitable for different input interfaces and output interfaces of different optical communication devices. In addition, the optical connector can be manufactured by adopting mature deposition, ion implantation and other modes, has low cost and is beneficial to industrialization.
In a second aspect, embodiments of the present application provide a method for fabricating an optical connector. Fig. 3 is a flowchart of a method for manufacturing an optical connector according to an embodiment of the present disclosure.
As shown in fig. 1, 3 and 7, the method of fabricating the optical connector includes:
step S301, preparing a core layer on a substrate, where the core layer includes at least one pair of an input interface and an output interface, and the input interface and the output interface are connected by an optical waveguide circuit.
A core layer 12 is formed on the surface of the substrate 11, and the core layer 12 is a dielectric layer for transmitting an optical signal. A plurality of pairs of input interfaces 121 and output interfaces 122 may be provided in the core layer 12, the input interfaces 121 and the output interfaces 122 being connected by optical waveguide lines 123. In practical applications, the core layer 12 is provided with a plurality of optical waveguide circuits 123, and both ends of each optical waveguide circuit 123 are respectively connected with one input interface 121 and one output interface 122.
Two specific structures of the optical connector are mentioned above, one of which is that the core layer 12 is provided on the surface of the substrate 11; second, the core layer 12 is provided in the substrate 11. The following description will be made taking an example in which the core layer 12 is provided on the surface of the substrate 11, that is, the material of the core layer is a polymer, the upper cladding layer 13 is provided on the upper surface of the core layer 12, and the lower cladding layer 14 is provided on the lower surface of the core layer 12.
Fig. 4 is a flowchart of another method for manufacturing an optical connector according to an embodiment of the present disclosure. As shown in fig. 1, 2, 4 and 7, the method for manufacturing an optical connector includes:
step S401, spin-coating a first photoresist on the surface of the substrate to obtain a lower cladding.
In step S401, the substrate 11 is first cleaned by ultrasonic waves, at least the upper surface of the substrate 11 (the upper surface is a relative concept, i.e. the surface where the lower cladding layer needs to be manufactured) is cleaned, and then a layer of photoresist of the first type is uniformly coated on the upper surface of the substrate 11 by a spin coating process, so as to obtain the lower cladding layer 14, as shown in fig. 5. Wherein the first type of photoresist is a polymer.
Step S402, spin-coating a second type of photoresist on the surface of the lower cladding, and processing the second type of photoresist through developing and curing processes to obtain a core layer.
In step S402, after the lower cladding layer 14 is cured, a layer of photoresist of the second type is uniformly coated on the surface of the lower cladding layer 14 by a spin coating process, an optical waveguide circuit is obtained by development, and the optical waveguide circuit is cured to obtain the core layer 12, as shown in fig. 6, the core layer includes three input ports 121, three output ports 122 and three optical waveguide circuits 123, and two ends of the optical waveguide circuit 123 are respectively connected to one input port 121 and one output port 122. In this embodiment, the first type of photoresist and the second type of photoresist both use polymers, but the refractive index of the second type of photoresist is lower than that of the second type of photoresist.
Step S403, spin-coating the first type of photoresist on the surface of the core layer to obtain an upper cladding layer.
In step S403, a layer of first photoresist is uniformly coated on the surface of the core layer 12 again by a spin coating process, and the upper cladding layer 13 is obtained after the first photoresist is cured, so as to obtain the optical waveguide 1. As shown in fig. 7, the upper cladding layer 13 covers the core layer 12, and the upper cladding layer 13 and the lower cladding layer 14 surround the core layer 12.
In order to reduce the production cost in the manufacture of the optical waveguide, a plurality of optical waveguides can be simultaneously manufactured on the substrate 11, that is, a plurality of optical waveguides 1 are connected by the substrate 11, and therefore, the substrate 11 needs to be cut and peeled off in use to obtain the individual optical waveguides 1.
Step S404, manufacturing an outer sleeve.
In step S404, a housing chamber 22 is formed in the ferrule body 21, the size of the housing chamber 22 matches the outer diameter of the optical waveguide 1, and the housing chamber 22 has an opening, i.e., the housing chamber 22 is close to the side of the ferrule body 21. Then, one aligning hole 23 is provided at each of opposite sides of the accommodating chamber 22. The alignment hole 23 penetrates the sleeve body 21 in one direction of the sleeve body 21. As shown in fig. 2, the structure of the outer sleeve is shown.
In steps S401 to S403, an optical waveguide is obtained, and in step S404, an outer sleeve is obtained. Although in this embodiment, the optical waveguide is fabricated first, and then the outer sleeve is fabricated. However, in actual operation, the outer sleeve may be manufactured first, and then the optical waveguide may be manufactured, that is, the sequence of step S404 and the sequence from step S401 to step S403 may be reversed.
Step S405, the optical waveguide and the outer sleeve are assembled to obtain the optical connector.
In step S405, the optical waveguide 1 is embedded and fixed in the accommodation chamber 22 of the outer sleeve 2, and an optical connector is obtained. The optical connector is then fixed to the optical communication device by the fixing member through the aligning holes 23 to test the optical communication device. As shown in fig. 8.
Another method of making an optical connector is described below. In the optical connector, the core layer 12 is formed in the substrate 11, that is, a glass substrate, and silver is injected into the substrate to obtain an optical waveguide.
Fig. 9 is a flow chart of another method of making an optical connector according to an embodiment of the present application. As shown in fig. 9, the method of manufacturing an optical connector includes:
step S901, silver is implanted into the surface of the glass substrate by an ion implantation method to obtain a core layer.
In step S901, a glass substrate is obtained, and then silver is implanted into the glass substrate by ion implantation, so that a core layer is obtained inside the glass substrate, thereby obtaining an optical waveguide.
Step S902, an outer sleeve is manufactured.
The manufacturing method of the outer sleeve is the same as the step S404 in the previous embodiment, and is not repeated herein.
Step S903, the optical waveguide and the outer sleeve are assembled to obtain an optical connector.
In step S903, the optical waveguide 1 is fitted into the accommodation chamber 22 of the outer sleeve 2 and fixed, and an optical connector is obtained. The optical connector is then fixed to the optical communication device by the fixing member through the aligning holes 23 to test the optical communication device, as shown in fig. 8.
In the method for manufacturing an optical connector according to this embodiment, the core layer is provided on the substrate, and the core layer includes at least one pair of input interface and output interface, and the input interface and the output interface are connected by the optical waveguide line, so that when the optical connector is used for optical path interconnection, only the optical fiber needs to be connected to the corresponding input interface and output interface, which can reduce dependence on manual operation, improve connection stability and reliability, and realize optical connection between any input interface and any output interface by adjusting the optical waveguide line in advance, thereby being suitable for different optical communication devices. In addition, the optical connector can be manufactured by adopting mature deposition, ion implantation and other modes, has low cost and is beneficial to industrialization.
It will be understood by those of ordinary skill in the art that all or some of the steps of the methods, systems, functional modules/units in the devices, as claimed above, may be implemented as software, firmware, hardware, and suitable combinations thereof. In a hardware implementation, the division between functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be performed by several physical components in cooperation. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those skilled in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as is well known to those skilled in the art.
Example embodiments have been applied herein, and although specific terms are employed, they are used and should be interpreted in a generic and descriptive sense only and not for purposes of limitation. In some instances, features, characteristics and/or elements described in connection with a particular embodiment may be used alone or in combination with features, characteristics and/or elements described in connection with other embodiments, unless expressly stated otherwise, as would be apparent to one skilled in the art. It will therefore be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the application as set forth in the appended claims.
Claims (13)
1. An optical connector comprising an optical waveguide including a substrate and a core layer provided on the substrate, characterized in that the core layer includes at least a pair of an input interface and an output interface, and the input interface and the output interface are connected by an optical waveguide circuit.
2. The optical connector according to claim 1, wherein the core layer is provided on a surface of the substrate.
3. An optical connector according to claim 2, wherein the material of the core layer comprises a polymer.
4. The optical connector of claim 3, wherein the polymer comprises any one of polysilane and polyimide.
5. The optical connector of claim 4, wherein the material of the substrate comprises any one of glass, ceramic, and silicon.
6. The optical connector according to claim 2, wherein an upper surface of the core layer is provided with an upper cladding layer, a lower surface of the core layer is provided with a lower cladding layer, and a refractive index of a material of the upper cladding layer and the lower cladding layer is lower than a refractive index of a material of the core layer.
7. The optical connector of claim 1, wherein the core layer is a light guiding layer formed of a doping material doped in the substrate.
8. The optical connector of claim 7, wherein the substrate is a glass substrate and the dopant material is silver.
9. The optical connector according to any one of claims 1 to 8, further comprising an outer sleeve, wherein the outer sleeve comprises a sleeve body, and a receiving cavity is arranged in the sleeve body and is used for embedding the optical waveguide.
10. The optical connector according to claim 9, wherein alignment holes for fixing the outer ferrule to an external optical communication device of the optical connector are provided on the ferrule body on opposite sides of the accommodating chamber, respectively.
11. A method of making an optical connector, comprising:
preparing a core layer on a substrate, wherein the core layer comprises at least one pair of input interface and output interface, and the input interface and the output interface are connected through an optical waveguide circuit.
12. The method of claim 11, wherein the material of the core layer is a polymer, an upper surface of the core layer is provided with an upper cladding layer, and a lower surface of the core layer is provided with a lower cladding layer;
the preparing a core layer on a substrate includes:
spin-coating a first type of photoresist on the surface of the substrate to obtain the lower cladding;
spin-coating a second type of photoresist on the surface of the lower cladding, and processing the second type of photoresist through a developing and curing process to obtain the core layer; wherein the refractive index of the second type of photoresist is lower than the second type of photoresist;
and spin-coating the first photoresist on the surface of the core layer to obtain the upper cladding layer.
13. The method of claim 11, wherein the substrate is a glass substrate;
the setting of the core layer on the substrate includes:
and injecting silver into the surface of the glass substrate in an ion injection mode to obtain the core layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111064765.8A CN115793136A (en) | 2021-09-10 | 2021-09-10 | Optical connector and manufacturing method |
| PCT/CN2022/117174 WO2023036104A1 (en) | 2021-09-10 | 2022-09-06 | Optical connector and manufacturing method |
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| CN202111064765.8A CN115793136A (en) | 2021-09-10 | 2021-09-10 | Optical connector and manufacturing method |
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| CN115793136A true CN115793136A (en) | 2023-03-14 |
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| KR100757233B1 (en) * | 2006-06-08 | 2007-09-10 | 한국전자통신연구원 | Optical waveguide platform and method of manufacturing the same |
| CN101762845A (en) * | 2010-01-27 | 2010-06-30 | 苏州新海宜通信科技股份有限公司 | Planar optical waveguide splitter chip and method for manufacturing same |
| CN201654270U (en) * | 2010-04-19 | 2010-11-24 | 江苏俊知传感技术有限公司 | Planar light-wave circuit splitter applied to multi-net blending |
| CN103630969B (en) * | 2013-05-21 | 2017-05-31 | 杭州天野通信设备有限公司 | It is a kind of to can customize integrated optical power shunt of splitting ratio and preparation method thereof |
| CN110646881B (en) * | 2019-09-18 | 2022-02-11 | 东南大学 | Three-dimensional optical waveguide transition access device and preparation method thereof |
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