CN115785648A - Resin composition and molded article - Google Patents
Resin composition and molded article Download PDFInfo
- Publication number
- CN115785648A CN115785648A CN202211546004.0A CN202211546004A CN115785648A CN 115785648 A CN115785648 A CN 115785648A CN 202211546004 A CN202211546004 A CN 202211546004A CN 115785648 A CN115785648 A CN 115785648A
- Authority
- CN
- China
- Prior art keywords
- component
- mass
- resin composition
- parts
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a resin composition and a molded article. The purpose of the present invention is to provide a resin composition having excellent light transmittance, mold releasability, and impact resistance. The resin composition of the present invention is characterized by containing: the rubber-modified polystyrene resin (a) is a polyphenylene ether resin or a combination of a polyphenylene ether resin and a homopolystyrene resin, (b) is a rubber-modified polystyrene resin, (c) is a hydrogenated block copolymer, and (d) is an amorphous alpha olefin copolymer, and the mass ratio of the component (a) to the component (c) is 95/5 to 30/70, the mass ratio of the component (b) to the component (c) is10 to 40 parts by mass, and the mass ratio of the component (d) to the total of the component (a), the component (b) and the component (c) is 99.5/0.5 to 96/4, based on 100 parts by mass of the total of the component (b), the component (c), and the component (c).
Description
The application is a divisional application, the application number of the original application is 201910461551.0, the application date is 2019, 5 months and 30 days, and the invention name is 'resin composition and molded product'.
Technical Field
The present invention relates to a resin composition and a molded article.
Background
Polyphenylene ether resins are known to have excellent light transmittance, mechanical properties, electrical properties, heat resistance, low water absorption, and dimensional stability, but have poor impact resistance.
Therefore, in order to improve the impact resistance of a polyphenylene ether resin, various resins are contained in the resin composition when used, and as a resin composition for improving the impact resistance, for example, a resin composition in which a polyphenylene ether resin is mixed with a rubber-modified polystyrene resin such as High Impact Polystyrene (HIPS) is known. However, such a resin composition has a problem that light transmittance is deteriorated although impact resistance is improved.
In order to solve such a problem, for example, patent document 1 describes that a resin composition having excellent light transmittance and impact resistance is obtained by using a rubber-modified polystyrene resin obtained by polymerizing a rubber polymer having an average particle diameter of a specific value or less with the contents of a polyphenylene ether resin, a rubber-modified polystyrene resin, and a hydrogenated block copolymer in the resin composition being in specific ranges.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2016-216630
Disclosure of Invention
Problems to be solved by the invention
However, many resin compositions containing polyphenylene ether resins are processed by injection molding, and there is a problem that the releasability of a molded article from a mold is poor.
In order to improve mold release properties, it is generally known to compound an amorphous α -olefin copolymer. However, when an amorphous α -olefin copolymer is blended, light transmittance is significantly reduced, and it is difficult to achieve both releasability and light transmittance.
Accordingly, an object of the present invention is to provide a resin composition having excellent light transmittance, releasability and impact resistance.
Means for solving the problems
The present inventors have conducted extensive studies to solve the above problems, and as a result, have found that a resin composition containing a polyphenylene ether resin can achieve high levels of compatibility among light transmittance, releasability, and impact resistance by containing an amorphous α -olefin copolymer to improve releasability and by setting the ratio and mass ratio of a rubber-modified polystyrene resin, a hydrogenated block copolymer, and an amorphous α -olefin copolymer in the resin composition to specific ranges to further achieve high light transmittance and impact resistance, thereby completing the present invention.
Namely, the present invention is as follows.
[1]
A resin composition characterized by containing, in a specific proportion,
the resin composition comprises: a polyphenylene ether resin or a combination of a polyphenylene ether resin and a homopolystyrene resin, (b) a rubber-modified polystyrenic resin, (c) a hydrogenated block copolymer, and (d) an amorphous α -olefin copolymer;
with respect to 100 parts by mass of the total of the component (a), the component (b) and the component (c),
the component (a) is 60 to 90 parts by mass,
5 to 30 parts by mass of the component (b),
The total of the component (b) and the component (c) is10 to 40 parts by mass,
0.10 to 1.50 parts by mass of the component (d);
the mass ratio of the component (b) to the component (c) is 95/5 to 30/70;
the mass ratio of the total of the component (b) and the component (c) to the component (d) is 99.5/0.5 to 96/4.
[2]
The resin composition according to [1], wherein the component (d) is an ethylene-propylene copolymer.
[3]
The resin composition according to [1] or [2], wherein the component (b) comprises a styrene-based polymer and a rubber-based polymer grafted with the styrene-based polymer, and the rubber-based polymer has an average particle diameter of 2.0 μm or less.
[4]
The resin composition according to any one of [1] to [3], wherein the content of the aromatic vinyl compound moiety in the component (c) is 50% by mass or more.
[5]
The resin composition according to any one of [1] to [4], further comprising (e) a condensed phosphate ester compound.
[6]
The resin composition as described in [5], wherein the component (e) is contained in an amount of 5 to 20 parts by mass based on 100 parts by mass of the total of the components (a), (b) and (c).
[7]
The resin composition as described in [5] or [6], wherein the content of the component (a), the component (b), the component (c), the component (d) and a component other than the component (e) is 5% by mass or less based on 100% by mass of the resin composition.
[8]
The resin composition according to any one of [1] to [7], wherein a transmittance of a 900nm laser beam after forming a molded article having a thickness of 2.5mm from the resin composition is 70% or more.
[9]
A molded article comprising the resin composition according to any one of [1] to [8 ].
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a resin composition having excellent light transmittance, mold releasability, and impact resistance can be provided.
Detailed Description
The following describes in detail a specific embodiment of the present invention (hereinafter referred to as "the present embodiment"). The following embodiments are examples for illustrating the present invention, and the present invention is not limited to the following embodiments. The present invention can be suitably modified and implemented within the scope of the gist thereof.
(resin composition)
The resin composition of the present embodiment comprises (a) a polyphenylene ether resin or a combination of a polyphenylene ether resin and a homopolystyrene resin, (b) a rubber-modified polystyrene resin, (c) a hydrogenated block copolymer, and (d) an amorphous α -olefin copolymer; the amount of the component (a) is 60 to 90 parts by mass, the amount of the component (b) is 5 to 30 parts by mass, the total amount of the component (b) and the component (c) is10 to 40 parts by mass, the amount of the component (d) is 0.10 to 1.50 parts by mass, the mass ratio of the component (b) to the component (c) is 95/5 to 30/70, and the mass ratio of the total amount of the component (b) and the component (c) to the component (d) is 99.5/0.5 to 96/4, based on 100 parts by mass of the total amount of the component (a), the component (b), and the component (c).
The resin composition of the present embodiment may further contain (e) a condensed phosphate compound and an additive.
- (a) polyphenylene ether resin, or a combination of a polyphenylene ether resin and a homopolystyrene resin-
(a) In the polyphenylene ether resin (in the present specification, it may be referred to as "PPE") or a combination of the polyphenylene ether resin and a homopolystyrene resin (in some cases, it may be referred to simply as "component (a)"), the PPE may be a homopolymer of a phenylene ether or a copolymer of a phenylene ether and another monomer.
The PPE mentioned above may be used alone in 1 kind or in combination of 2 or more kinds.
Examples of the PPE include homopolymers and/or copolymers having a repeating unit structure (a unit structure derived from a phenylene ether) represented by the following formula (1).
[ solution 1]
[ in the formula, R 1 、R 2 、R 3 And R 4 Each independently represents a hydrogen atom, a halogen atom, or a carbon atomA primary alkyl group of 1 to 7 or a secondary alkyl group having 1 to 7 carbon atoms, a phenyl group, a haloalkyl group, an aminoalkyl group, a hydrocarbonoxy group, and a halohydrocarbonoxy group having at least 2 carbon atoms separating the halogen and oxygen atoms.]
Examples of the component (a) include homopolymers such as poly (2,6-dimethyl-1,4-phenylene ether), poly (2-methyl-6-ethyl-1,4-phenylene ether), poly (2-methyl-6-phenyl-1,4-phenylene ether), poly (2,6-dichloro-1,4-phenylene ether); 5363 a copolymer of 2,6-dimethylphenol with another phenol (e.g., 2,3,6-trimethylphenol, 2-methyl-6-butylphenol), and the like. Of these, poly (2,6-dimethyl-1,4-phenylene ether), 2,6-dimethylphenol, and 2,3,6-trimethylphenol are preferred, and poly (2,6-dimethyl-1,4-phenylene ether) is more preferred.
The method for producing the PPE can be any conventionally known method. Examples of the method for producing the PPE include: a method for producing the catalyst by oxidative polymerization of 2,6-xylenol or the like using a complex of a cuprous salt and an amine as a catalyst; the methods described in JP-A-50-150798, JP-A-50-051197, JP-A-63-152628, and the like; and so on.
The reduced viscosity of the PPE (0.5 g/dL in chloroform, measured at 30 ℃ C., measured by Ubbelohde viscometer) is, for example, preferably 0.7dL/g or less, more preferably 0.6dL/g or less, and preferably 0.15dL/g or more, more preferably 0.2dL/g or more.
Further, the component (a) may further contain a homopolystyrene resin, and the inclusion of the homopolystyrene resin can improve the flowability of the resin composition.
The homopolystyrene resin may be used alone in 1 kind, or may be used in combination in 2 or more kinds.
The homopolystyrene resin that can be used in the component (a) is a homopolymer of a styrene-based compound. Examples of the styrene compound include, but are not limited to, styrene, α -methylstyrene, 2,4-dimethylstyrene, monochlorostyrene, p-methylstyrene, p-tert-butylstyrene, ethylstyrene, etc., and styrene is preferable among them. The homopolystyrene resin is not particularly limited as long as it is a resin obtained from the above-mentioned styrene compound, and homopolystyrene (hereinafter, sometimes referred to as "GPPS") is preferable.
(a) Among the components, it is preferable that the homopolystyrene resin is mixed in a range of not more than 400 parts by mass with respect to 100 parts by mass of the polyphenylene ether resin. The content of the homopolystyrene resin is more preferably 200 parts by mass or less, and still more preferably 100 parts by mass or less, with respect to 100 parts by mass of the polyphenylene ether resin.
- (b) rubber-modified polystyrene resin-
(b) The rubber-modified polystyrene resin (which may be abbreviated as "component (b)" in the present specification) is a resin (polymer) obtained by polymerizing a styrene compound and a compound copolymerizable with the styrene compound in the presence of a rubber polymer. (b) The rubber-modified polystyrene resin may be a resin in which a styrene-based polymer obtained by polymerizing a styrene-based compound and a compound copolymerizable with the styrene-based compound is grafted to a rubber-based polymer.
Examples of the styrenic compound used in the polymerization of the component (b) include styrene, α -methylstyrene, 2,4-dimethylstyrene, monochlorostyrene, p-methylstyrene, p-tert-butylstyrene, and ethylstyrene, and styrene is preferable.
Examples of the compound copolymerizable with the styrene compound used in the polymerization of the component (b) include methacrylates such as methyl methacrylate and ethyl methacrylate; unsaturated nitrile compounds such as acrylonitrile and methacrylonitrile; anhydrides such as maleic anhydride; and so on.
The amount of the compound copolymerizable with the styrene-based compound used in the polymerization of the component (b) is, for example, preferably 20% by mass or less, more preferably 15% by mass or less, based on 100% by mass of the total of the styrene-based compound and the compound copolymerizable with the styrene-based compound.
Examples of the rubbery polymer used in the polymerization of the component (b) include conjugated diene rubbers, copolymers of conjugated dienes and aromatic vinyl compounds, ethylene-propylene copolymer rubbers, and the like, and among them, polybutadiene, styrene-butadiene random copolymers, styrene-butadiene block copolymers, and rubber components obtained by partially or substantially completely hydrogenating these (for example, rubber components having a hydrogenation ratio of 50 to 100%) are preferable.
The amount of the rubber polymer used in the polymerization of the component (b) is preferably 25% by mass or less, more preferably 15% by mass or less, based on 100% by mass of the total of the styrene-based compound and the compound copolymerizable with the styrene-based compound, for example, in view of more excellent light transmittance of the resulting molded article.
From the viewpoint of light transmittance, the average particle diameter of the rubber-like polymer is preferably 2.0 μm or less, more preferably 1.5 μm or less, and still more preferably 1.3 μm or less.
The average particle diameter referred to herein is an average particle diameter based on the coulter counter method measured in DMF (dimethylformamide) solvent at 23 ℃.
- (c) hydrogenated block copolymer-
(c) The hydrogenated block copolymer (in this specification, may be abbreviated as "component (c)") is a thermoplastic elastomer having a block copolymer and a hydrogenated block copolymer obtained by hydrogenating at least a part of the block copolymer, and the block copolymer includes a polymer block a mainly composed of an aromatic vinyl compound and a polymer block B mainly composed of a conjugated diene compound.
The component (c) does not include a rubber-modified polystyrene resin containing an aromatic vinyl compound as a constituent component.
- -Polymer block A- - -
Examples of the aromatic vinyl compound constituting the polymer block a include styrene, α -methylstyrene, and vinyltoluene. Among them, styrene is preferable in view of light transmittance. The aromatic vinyl compound may be used alone in 1 kind, or may be used in combination in 2 or more kinds.
In the above-mentioned polymer block a, "mainly composed of an aromatic vinyl compound" means that the content of the aromatic vinyl compound moiety in the polymer block a before hydrogenation is 50 mass% or more with respect to the polymer block a (100 mass%). In view of light transmittance, the content is preferably 60% by mass or more, and more preferably 70% by mass or more.
The number average molecular weight (Mn (a)) of the polymer block a is preferably, for example, 15,000 or more, from the viewpoint of suppressing the fluctuation in impact resistance of the resin composition. When the polymer block a has a plurality of blocks, the number average molecular weight of the entire polymer block a is more preferably 15,000 or more.
The number average molecular weight (Mn (a)) of the polymer block a can be determined by the following formula using the number average molecular weight (Mn) of the block copolymer described below.
Mn(a)＝{Mn×a/(a+b)}/N
In the formula, mn (a) represents the number average molecular weight of the polymer block a, mn represents the number average molecular weight of a block copolymer composed of the polymer block a and the polymer block B, a represents the total content (mass%) of all the polymer blocks a in the block copolymer, B represents the total content (mass%) of all the polymer blocks B in the block copolymer, and N represents the total number of the polymer blocks a in the block copolymer. ]
Here, mn can be obtained by the following method using a gel permeation chromatography measuring apparatus. In addition, a can be determined by NMR, and b can be calculated from "100-a".
Polymer block B- -
Examples of the conjugated diene compound constituting the polymer block B include butadiene, isoprene, 1,3-pentadiene, and the like. Among them, butadiene, isoprene, or a combination thereof is preferable in view of impact resistance. The conjugated diene compound may be used alone in 1 kind or in combination of 2 or more kinds.
The phrase "mainly comprising a conjugated diene compound" in the polymer block B means that the content of the conjugated diene compound portion in the polymer block B before hydrogenation is 50 mass% or more with respect to the polymer block B (100 mass%). Further, from the viewpoint of impact resistance, it is more preferably 60% by mass or more, and still more preferably 70% by mass or more.
In the microstructure of the polymer block B before hydrogenation (bonding form of the conjugated diene compound), the total vinyl bonding amount (total of 1,2-vinyl bonding amount and 3,4-vinyl bonding amount of the conjugated diene) is preferably 5% or more, more preferably 10% or more, and further preferably 15% or more, with respect to the total bonding amount of the conjugated diene compound polymer (total of 1,2-vinyl bonding amount, 3,4-vinyl bonding amount, and 1,4-conjugated bonding amount of the conjugated diene), from the viewpoint of light transmittance, and the total vinyl bonding amount is preferably 80% or less, more preferably 50% or less, and further preferably 45% or less, from the viewpoint of mold release property.
The vinyl bond amount can be determined by, for example, a nuclear magnetic resonance apparatus (NMR).
Examples of the block structure of the hydrogenated block copolymer include ase:Sub>A structure having ase:Sub>A bonding form selected from the group consisting of A-B, A-B-A, A-B-A-B when the polymer block A is represented by "A" and the polymer block B is represented by "B". Among them, A-B-A, A-B-A-B is more preferable, and A-B-A is further preferable, from the viewpoint of impact resistance. The block structure of the hydrogenated block copolymer may be 1 type or 2 or more types.
The hydrogenated block copolymer is obtained by, for example, hydrogenating an aliphatic double bond in a block copolymer comprising a polymer block a and a polymer block B.
From the viewpoint of thermal stability, the hydrogenation ratio of the component (c) (hydrogenation ratio to the conjugated diene compound portion in the block copolymer) is preferably 50% or more, more preferably 80% or more, and still more preferably 95% or more.
The hydrogenation ratio is a value measured by a nuclear magnetic resonance apparatus (NMR).
The number average molecular weight (Mn) of the component (c) is preferably 50,000 or more, and preferably 400,000 or less, from the viewpoint of impact resistance and fluidity.
The number average molecular weight is a value obtained by measuring using a gel permeation chromatography measuring apparatus equipped with an ultraviolet spectrometer and converting into standard polystyrene.
The specific method of measuring the number average molecular weight is as follows.
The number average molecular weight was determined by measuring with an ultraviolet spectrometer (trade name: UV-41; manufactured by Showa Denko K.K.) using a gel permeation chromatography measuring apparatus (trade name: GPC SYSTEM; manufactured by Showa Denko K.K.) in terms of standard polystyrene.
The assay conditions were as follows, solvent: chloroform, temperature: 40 ℃, column: sample side (K-G, K-800RL, K-800R), reference side (K-805 L.times.2), flow rate 10 ml/min, measurement wavelength: 254nm, pressure 15-17 kg/cm 2 。
In this case, a low molecular weight component due to deactivation of the catalyst during polymerization may be detected, and in this case, the low molecular weight component is not included in the molecular weight calculation.
The molecular weight distribution (weight average molecular weight (Mw)/number average molecular weight (Mn)) of the above-mentioned component (c) is preferably 1.0 or more, and preferably 1.3 or less.
As long as the object of the present invention is not violated, the block copolymer may be a copolymer having different combinations, a copolymer having different types of aromatic vinyl compounds, a copolymer having different types of conjugated diene compounds, a copolymer having 1,2-vinyl bond amounts or a total amount of 1,2-vinyl bond amounts and 3,4-vinyl bond amounts, a copolymer having different contents of aromatic vinyl compound components, a copolymer having different hydrogenation ratios, or the like.
The content of the aromatic vinyl compound portion in the component (c) is preferably 50% by mass or more, more preferably 55% by mass or more, and further preferably 60% by mass or more with respect to the component (c) (100% by mass) in terms of light transmittance.
- (d) amorphous alpha-olefin copolymer-
Examples of the (d) amorphous α -olefin copolymer (which may be abbreviated as "component (d)" in the present embodiment) include an ethylene-propylene copolymer and an ethylene-butene copolymer, and an ethylene-propylene copolymer is particularly preferably used from the viewpoint of mold release properties.
When the component (d) is an ethylene-propylene copolymer, the component 3 may be further copolymerized within a range not affecting the performance.
The ratio of each component of ethylene and propylene in the ethylene-propylene copolymer is not particularly limited, and propylene is usually in the range of 5 to 50 mol%.
As the component (d), a commercially available product, for example, a product commercially available under the trade name of TAFMER from Mitsui chemical (K.K.) can be used.
- (e) condensed phosphate ester-based Compound-
The resin composition of the present embodiment includes (e) a condensed phosphate ester compound (in the present specification, it may be abbreviated as "component (e)") to improve flame retardancy.
The component (e) is preferably a component containing, as a main component, at least one selected from the group consisting of aromatic condensed phosphates represented by the following formulae (2) and (3).
The "main component" as used herein means that the content of at least one selected from the group consisting of aromatic condensed phosphoric acid esters represented by the following formulae (2) and (3) is 90% by mass or more, preferably 95% by mass or more, and more preferably 100% by mass, relative to 100% by mass of the component (e).
[ solution 2]
[ wherein Q 41 、Q 42 、Q 43 、Q 44 Each independently is an alkyl group having 1 to 6 carbon atoms; r 41 、R 42 Each independently is methyl; r 43 、R 44 Each independently is a hydrogen atom or a methyl group; x is an integer of 0 or more; p is a radical of formula 1 、p 2 、p 3 、p 4 Are respectively an integer of 0 to 3; q. q.s 1 、q 2 Are each an integer of 0 to 2.]
[ solution 3]
[ wherein Q 51 、Q 52 、Q 53 、Q 54 Each independently an alkyl group having 1 to 6 carbon atoms; r is 51 Is methyl; y is an integer of 0 or more; r is a radical of hydrogen 1 、r 2 、r 3 、r 4 Are respectively an integer of 0 to 3; s 1 Are each an integer of 0 to 2.]
The condensed phosphoric ester compounds represented by the above formulae (2) and (3) may each contain two or more molecules, and x and y in each molecule are preferably integers of 1 to 3.
Among them, among the above-mentioned components (e), R is preferable from the viewpoint of further reducing the volatility in molding the resin composition 43 、R 44 Is methyl, p 1 、p 2 、p 3 、p 4 、q 1 And q is 2 An aromatic condensed phosphoric ester represented by the formula (2) 0 and Q 41 、Q 42 、Q 43 、Q 44 、R 43 And R 44 Represents a methyl group, q 1 And q is 2 Is 0, p 1 、p 2 、p 3 And p 4 The total content of the aromatic condensed phosphoric acid ester represented by the formula (2) wherein x is an integer of 1 to 3 (particularly x is 1) is 50% by mass or more based on 100% by mass of the component (e).
Additives-
In the resin composition of the present embodiment, additives may be added within a range not to impair the effects of the present invention in order to further impart other characteristics. Examples of the additives include plasticizers, stabilizers such as antioxidants and ultraviolet absorbers, antistatic agents, dyes and pigments, and other resins.
The contents of component (a), component (b), component (c) and component (d)
In the resin composition of the present embodiment, the content of the component (a) is 60 to 90 parts by mass with respect to 100 parts by mass of the total of the components (a), (b), and (c) in terms of light transmittance. The content of the component (a) is preferably 65 to 85 parts by mass, more preferably 70 to 85 parts by mass. Specifically, when the content of the component (a) is 60 parts by mass or more, the light transmittance is excellent; by setting the content of the component (a) to 90 parts by mass or less, the impact resistance is excellent.
In the resin composition of the present embodiment, the total content of the component (b) and the component (c) is10 to 40 parts by mass with respect to 100 parts by mass of the total of the component (a), the component (b) and the component (c) in view of balance between impact resistance and light transmittance. The total content of the component (b) and the component (c) is preferably 15 to 35 parts by mass, more preferably 15 to 30 parts by mass. Specifically, by setting the total content of the component (b) and the component (c) to 10 parts by mass or more, the impact resistance is excellent; when the content of the component (b) and the component (c) is 40 parts by mass or less, the light transmittance is excellent.
The content of each of the component (b) and the component (c) is not limited as long as the total content of the component (b) and the component (c) is within the above range. The content of the component (b) is preferably 5 to 30 parts by mass, more preferably 10 to 25 parts by mass, based on 100 parts by mass of the total of the components (a), (b), and (c), from the viewpoint of impact resistance. Specifically, by setting the content of the component (b) to 5 parts by mass or more, the impact resistance is excellent; when the content of the component (b) is 30 parts by mass or less, the light transmittance is excellent.
In addition, the content of the component (c) is preferably 1 to 30 parts by mass, more preferably 5 to 20 parts by mass, based on 100 parts by mass of the total of the components (a), (b) and (c), from the viewpoint of impact resistance. Specifically, by setting the content of the component (c) to 1 part by mass or more, the impact resistance is excellent; when the content of the component (c) is 30 parts by mass or less, the light transmittance is excellent.
In the resin composition of the present embodiment, the content of the component (d) is 0.10 to 1.50 parts by mass relative to 100 parts by mass of the total of the components (a), (b) and (c) in terms of the balance between releasability and light transmittance. The content of the component (d) is preferably 0.20 to 1.30 parts by mass, more preferably 0.30 to 1.00 parts by mass. Specifically, by setting the content of the component (d) to 0.10 parts by mass or more, the releasability can be ensured; the light transmittance can be ensured by setting the content of the component (d) to 1.50 parts by mass or less.
In the resin composition of the present embodiment, as described above, the content of the component (a), the total content of the components (b) and (c), and the content of the component (d) are set to predetermined ranges, and the respective components are set to the following mass ratios, whereby a resin composition having a high level of light transmittance, mold releasability, and impact resistance can be obtained.
That is, the mass ratio of the component (b) to the component (c) (mass of the component (b)/mass of the component (c)) is 95/5 to 30/70, preferably 90/10 to 40/60, and more preferably 85/15 to 45/55. The light transmittance can be ensured by setting the mass ratio of the component (b) to the component (c) to 95/5 or less; by setting the mass ratio of the component (b) to the component (c) to 30/70 or more, the releasability and the impact resistance can be ensured.
From the viewpoint of the balance between light transmittance and mold releasability, the mass ratio of the total of the component (b) and the component (c) to the component (d) (the total of the mass of the component (b) and the mass of the component (c)/the mass of the component (d)) is 99.5/0.5 to 96/4, preferably 99.0/1.0 to 96.5/3.5, and more preferably 98.5/1.5 to 97.0/3.0. The mold release property can be ensured by setting the mass ratio of the total of the component (b) and the component (c) to the component (d) to 99.5/0.5 or less; by setting the ratio to 96/4 or more, light transmittance can be secured.
In the resin composition of the present embodiment, the content of the component (e) is, for example, preferably 5 to 20 parts by mass, more preferably 8 to 18 parts by mass, and still more preferably 8 to 15 parts by mass, based on 100 parts by mass of the total of the components (a), (b), and (c), from the viewpoint of imparting flame retardancy while maintaining high impact resistance.
In the resin composition of the present embodiment, the content of components other than the components (a), (b), (c), (d) and (e) is preferably 5% by mass or less, more preferably 1% by mass or less, further preferably 0.5% by mass or less, and further preferably 0.3% by mass or less, based on 100% by mass of the resin composition, so as not to impair the effects of the present invention.
(method for producing resin composition)
The resin composition of the present embodiment can be produced by, for example, melt-kneading the components (a), (b), (c), and (d) with a twin-screw extruder.
Examples of the twin-screw extruder include ZSK series manufactured by Coperion, TEM series manufactured by Toshiba machine, and TEX series manufactured by Nippon Steel works.
The melt kneading temperature, the screw rotation speed, and the like in the method for producing the resin composition of the present embodiment can be appropriately selected from the ranges of the melt kneading temperature of 100 to 370 ℃ and the screw rotation speed of 100 to 1200 rpm.
Examples of the raw material supply device for supplying the raw material to the twin-screw extruder include a single-screw feeder, a twin-screw feeder, a flat feeder, a rotary feeder, and the like, and among them, a weight-loss feeder is preferable in terms of small variation error in raw material supply.
In the case of adding a liquid raw material, the liquid raw material may be directly fed into the barrel system by using an addition pump or the like in the barrel portion of the extruder. The liquid adding pump is not particularly limited, and examples thereof include a gear pump and a flange pump, and the gear pump is preferable. In this case, from the viewpoint of reducing the load applied to the liquid adding pump and improving the operability of the raw material, it is preferable to reduce the viscosity of the liquid raw material by heating the part serving as the flow path of the liquid raw material, such as a tank for storing the liquid raw material, a pipe between the tank and the liquid adding pump, and a pipe between the pump and the extruder barrel, using a heater or the like.
(Properties of the resin composition)
From the aspect of impact resistance, the Charpy impact strength of the resin composition of the present embodiment is preferably 7kJ/m 2 More preferably 10kJ/m or more 2 The above.
The charpy impact strength can be measured by the method described in < charpy impact strength > of the "measurement method" described later.
The resin composition of the present embodiment preferably has a transmittance of not less than 70%, more preferably not less than 80% for a 900nm laser beam after being formed into a molded article having a thickness of 2.5 mm.
The transmittance of the 900nm laser beam after the molded article having a thickness of 2.5mm is measured by the method described in < light transmittance > of [ measurement method ] described later.
From the aspect of mold releasability, when the resin composition of the present embodiment is used to injection mold a cup-shaped molded article having an outer diameter of 50mm, a height of 50mm and a thickness of 3mm, the load (mold release force) required for the ejection of the molded article at the time of mold release is preferably 125kg or less, more preferably 120kg or less.
In the injection molding of the cup-shaped molded article, the load required for the ejection of the molded article during the mold release is a value measured by a method described in < mold release force > of [ measurement method ] described later.
(molded article)
The resin composition of the present embodiment can be molded to produce a molded article. The molded article includes at least the resin composition of the present embodiment.
As the molding method, for example, a known molding method such as injection molding, blow molding, extrusion molding, sheet molding, film molding, etc. can be used, and a method of molding using an injection molding machine is particularly preferable. Examples of the injection molding machine include "IS100GN" manufactured by TOSHIBA corporation.
The melting temperature, mold temperature, and the like in the method for molding a resin composition according to the present embodiment can be appropriately selected from the range of the melting temperature of 200 to 320 ℃ and the mold temperature of 30 to 100 ℃.
The molded article can be used as various molded articles and can be widely used in the fields of industrial parts, electric-electronic parts, office equipment housings, automobile parts, precision parts, and the like.
[ examples ]
The present invention will be described in detail below by way of specific examples and comparative examples, but the present invention is not limited to the following examples.
The raw materials used in the resin compositions of examples and comparative examples are as follows.
- (a) polyphenylene ether resin-
(a-1) Poly (2,6-dimethyl-1,4-phenylene ether) having a reduced viscosity (0.5 g/dL in chloroform, 30 ℃ C., ubbelohde viscometer) of 0.5dL/g
(a-2) polystyrene, manufactured by PS Japan "685"
- (b) rubber-modified polystyrene resin-
(b-1) rubber-modified polystyrene resin (HIPS) having an average particle diameter of the rubber polymer of 1.2 μm and a content of the rubber polymer of 10 mass%
(b-2) rubber-modified polystyrene resin (HIPS) having an average particle diameter of the rubber polymer of 1.6 μm and a content of the rubber polymer of 10 mass%
- (c) hydrogenated block copolymer-
( c-1) production of Asahi chemical "Tuftec H1081" (aromatic vinyl compound content: 60% by mass) (hydrogenated block copolymer )
( c-2) production of "Tuftec H1041" (aromatic vinyl compound content: 32% by mass) (hydrogenated block copolymer) )
- (d) amorphous alpha-olefin copolymer-
(d-1) Sanjing chemical production "TAFMER P0680J" (ethylene-propylene copolymer)
(d-2) Sanjing chemical manufacture "TAFMER DF610" (ethylene-butene copolymer)
- (e) condensed phosphate ester-based Compound-
"E890" manufactured by Daba chemical industries Ltd "
The methods for measuring physical properties in examples and comparative examples are as follows.
[ measurement method ]
< Charpy impact Strength >
The resin compositions obtained in examples and comparative examples were supplied to an injection molding machine ("IS 100 GN") set to 240 to 280 ℃, and injection molding was performed under conditions in which the mold temperature was 80 ℃, thereby producing test pieces having dimensions specified in ISO-179 standard.
Using the test piece, the notched Charpy impact strength (kJ/m) was determined in accordance with ISO-179 2 ). As a standard for evaluation, the impact resistance was evaluated to be more excellent as the measured value was larger.
< light transmittance >
The resin compositions obtained in examples and comparative examples were supplied to an injection molding machine ("IS 100 GN") set at 240 to 280 ℃, and injection molding was performed under conditions in which the mold temperature was 80 ℃, thereby producing flat test pieces of 90mm × 50mm × 2.5 mm.
The test piece was cut into a size of about 15 to 30mm in length and 35 to 70mm in width, and the cut piece was placed in an ultraviolet-visible near-infrared spectrophotometer (trade name "V-670", manufactured by Nippon spectral Co., ltd.) to measure the laser transmittance (%) at a wavelength of 900nm for a test piece having a thickness of 2.5 mm. As an evaluation criterion, the greater the measured value, the more excellent the light transmittance was evaluated.
< mold release force >
The resin compositions obtained in examples and comparative examples were supplied to an injection molding machine ("IS 100 GN") set at 280 ℃, and cup-shaped molded articles having an outer diameter of 50mm, a height of 50mm and a thickness of 3mm were injection-molded at a mold temperature of 80 ℃, and the load (kg) required for ejection at the time of mold release of the molded articles was measured and used as the mold release force. As a standard for evaluation, the smaller the measurement value, the more excellent the mold releasability was evaluated.
The following describes each example and each comparative example in detail.
[ example 1]
As an apparatus for producing the resin composition, a twin-screw extruder (trade name "ZSK-25WLE", manufactured by Coperion) was used. The number of barrels in the twin-screw extruder was 12, and from the upstream in the flow direction of the raw material, 1-position (upstream supply port) and 2-position supply ports were provided in the 1 st barrel (downstream supply port) and the 9 th barrel (downstream supply port), respectively, a liquid-adding pump was provided in the 7 th barrel, and a vacuum vent was provided in the 11 th barrel. The raw material is supplied to the downstream supply port by using an opening from the extruder side.
The components (a) to (e) were fed in a twin-screw extruder set as described above in the compositions shown in Table 1, and melt-kneaded at an extrusion temperature of 300 to 320 ℃, a screw rotation speed of 300rpm, and a discharge rate of 15 kg/hr to obtain pellets of the resin composition.
[ examples 2 to 15]
Components (a) to (e) were fed to a twin-screw extruder in the compositions shown in Table 1. Pellets of the resin composition were obtained in the same manner as in example 1 except for the conditions.
Comparative examples 1 to 12
The components (a) to (d) were fed to a twin-screw extruder in the compositions shown in Table 2. Pellets of the resin composition were obtained in the same manner as in example 1 except for the conditions.
The evaluation of the above items was performed on the molded articles obtained by molding the resin compositions prepared in examples and comparative examples, and the results are shown in tables 1 and 2.
Examples 1 to 15 were excellent in all of light transmittance, impact resistance and mold release properties, and the resin composition of the present embodiment molded a molded article excellent in light transmittance, impact resistance and mold release properties.
Industrial applicability
The resin composition of the present invention is industrially useful as a material for electric parts, OA equipment, batteries, and the like.
Claims (9)
1. A resin composition characterized by containing, in a specific proportion,
the resin composition comprises: a polyphenylene ether resin or a combination of a polyphenylene ether resin and a homopolystyrene resin, (b) a rubber-modified polystyrenic resin, (c) a hydrogenated block copolymer, and (d) an amorphous α -olefin copolymer;
based on 100 parts by mass of the total of the component (a), the component (b) and the component (c),
the component (a) is 60 to 90 parts by mass,
The component (b) is 10-25 parts by mass,
The total of the component (b) and the component (c) is10 to 40 parts by mass,
The component (d) is 0.30 to 1.50 parts by mass;
the mass ratio of the component (b) to the component (c) is 95/5 to 45/55;
the mass ratio of the total of the component (b) and the component (c) to the component (d) is 99.5/0.5 to 96/4.
2. The resin composition according to claim 1, wherein the component (d) is an ethylene-propylene copolymer.
3. The resin composition according to claim 1 or 2, wherein the component (b) comprises a styrene-based polymer and a rubber-based polymer grafted with the styrene-based polymer, and the average particle diameter of the rubber-based polymer is 2.0 μm or less.
4. The resin composition according to claim 1 or 2, wherein the content of the aromatic vinyl compound moiety in the component (c) is 50% by mass or more.
5. The resin composition according to claim 1 or 2, wherein the resin composition further comprises (e) a condensed phosphate ester-based compound.
6. The resin composition according to claim 5, wherein the component (e) is contained in an amount of 5 to 20 parts by mass based on 100 parts by mass of the total of the components (a), (b) and (c).
7. The resin composition according to claim 5, wherein the content of the component (a), the component (b), the component (c), the component (d) and the component (e) is 5% by mass or less based on 100% by mass of the resin composition.
8. The resin composition according to claim 1 or 2, wherein the resin composition has a 900nm laser transmittance of 70% or more after being molded into a molded article having a thickness of 2.5 mm.
9. A molded article comprising the resin composition according to any one of claims 1 to 8.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-120064 | 2018-06-25 | ||
| JP2018120064 | 2018-06-25 | ||
| CN201910461551.0A CN110628201A (en) | 2018-06-25 | 2019-05-30 | Resin composition and molded article |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910461551.0A Division CN110628201A (en) | 2018-06-25 | 2019-05-30 | Resin composition and molded article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115785648A true CN115785648A (en) | 2023-03-14 |
Family
ID=68968425
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211546004.0A Pending CN115785648A (en) | 2018-06-25 | 2019-05-30 | Resin composition and molded article |
| CN201910461551.0A Pending CN110628201A (en) | 2018-06-25 | 2019-05-30 | Resin composition and molded article |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910461551.0A Pending CN110628201A (en) | 2018-06-25 | 2019-05-30 | Resin composition and molded article |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2020002340A (en) |
| CN (2) | CN115785648A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114716805A (en) * | 2021-01-07 | 2022-07-08 | 旭化成株式会社 | Resin composition, connection structure for solar power generation module, and junction box for solar power generation module |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4341879A (en) * | 1980-03-17 | 1982-07-27 | Mitsubishi Gas Chemical Company, Inc. | Polyphenylene ether resin composition having improved heat stability and impact strength |
| CN1249163C (en) * | 2001-09-14 | 2006-04-05 | 旭化成化学株式会社 | Polyphenylene ether composition |
| CN1860179B (en) * | 2003-09-30 | 2010-11-10 | 旭化成化学株式会社 | Process for producing polyphenylene ether resin composition |
| JP5315036B2 (en) * | 2008-12-15 | 2013-10-16 | 旭化成ケミカルズ株式会社 | Resin composition and molded body using the same |
| CN102516743B (en) * | 2011-12-09 | 2014-03-05 | 上海锦湖日丽塑料有限公司 | Automotive resin composition and its preparation method |
| JP6480261B2 (en) * | 2015-05-21 | 2019-03-06 | 旭化成株式会社 | Resin composition |
| JP7053138B2 (en) * | 2016-10-05 | 2022-04-12 | 旭化成株式会社 | Laminated molded body |
-
2019
- 2019-04-02 JP JP2019070728A patent/JP2020002340A/en active Pending
- 2019-05-30 CN CN202211546004.0A patent/CN115785648A/en active Pending
- 2019-05-30 CN CN201910461551.0A patent/CN110628201A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020002340A (en) | 2020-01-09 |
| CN110628201A (en) | 2019-12-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106867245B (en) | Thermoplastic resin composition, molded article, and method for producing molded article | |
| CN108884313B (en) | Resin composition, method for producing resin composition, and molded article | |
| EP3097150A1 (en) | Poly(phenylene ether) composition and article | |
| CN112239592B (en) | Polyphenylene ether resin composition | |
| CN115785648A (en) | Resin composition and molded article | |
| US20170096556A1 (en) | Resin composition and molded article | |
| CN108084691B (en) | Resin composition | |
| JP6480261B2 (en) | Resin composition | |
| JP2020015796A (en) | Resin composition and molded article | |
| US7358292B2 (en) | Relay block | |
| CN107022184B (en) | Molded article for piping | |
| JP2020037663A (en) | Flame-retardant resin composition | |
| CN109912957A (en) | Resin combination, the manufacturing method of resin combination and formed body | |
| JP5942081B2 (en) | Formed body by vacuum forming or blow molding | |
| JP7126369B2 (en) | resin composition | |
| JP7490465B2 (en) | Polyphenylene ether resin composition | |
| JP6059053B2 (en) | Method for producing resin composition | |
| CN117285812A (en) | Resin composition and molded article | |
| JP2022001624A (en) | Polyphenylene ether-based resin composition | |
| JP2023062615A (en) | Part for communication device | |
| JP6181478B2 (en) | Resin composition | |
| JP2023001874A (en) | Polyphenylene ether-based resin composition | |
| JP2009227886A (en) | Thermoplastic resin composition | |
| JP2017101188A (en) | Polyphenylene ether-based resin composition, sheet molding, and food container | |
| JP2004007967A (en) | Relay block |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |