JP2020002340A - Resin composition and molded article - Google Patents

Abstract

To provide a resin composition excellent in light permeability, mold release property, and impact resistance.SOLUTION: The resin composition containing (a) a polyphenylene ether resin or a combination of the polyphenylene ether resin and a homopolystyrene resin, (b) a rubber modified polystyrene resin, (c) a hydrogenated block copolymer, and (d) a non-crystalline α-olefin copolymer, in which the (a) component is 60 to 90 pts.mass, (b) component is 5 to 30 pts.mass, total of the (b) component and the (c) component is 10 to 40 pts.mass, the (d) component is 0.10 to 1.50 pts.mass, based on total 100 pts.mass of the (a) component, the (b) component and the (c) component, a mass ratio of the (b) component and the (c) component is 95/5 to 30/70, and a mass ratio of total of the (b) component and the (c) component, and the (d) component is 99.5/0.5 to 96/4.SELECTED DRAWING: None

Description

  The present invention relates to a resin composition and a molded product.

  It is known that polyphenylene ether-based resins are excellent in light transmittance, mechanical properties, electrical properties, heat resistance, low water absorption, and dimensional stability, but are inferior in impact resistance.

  Therefore, polyphenylene ether-based resin is used by containing various resins to improve its impact resistance, as a resin composition having improved impact resistance, for example, polyphenylene ether-based resin Thus, a resin composition containing a rubber-modified polystyrene resin such as high impact polystyrene (HIPS) is known. However, such a resin composition has a problem that although the impact resistance is improved, the light transmittance is deteriorated.

  For such a problem, for example, Patent Document 1 discloses that the content of the polyphenylene ether-based resin, the rubber-modified polystyrene-based resin, and the hydrogenated block copolymer in the resin composition is set to a specific range, It is described that a resin composition having excellent light transmittance and impact resistance can be obtained by using a rubber-modified polystyrene resin polymerized using a rubbery polymer having a specific value or less.

JP-A-2006-216630A

However, a resin composition containing a polyphenylene ether-based resin is often processed by injection molding. However, poor separation of a molded product from a mold often poses a problem.
It is generally known to incorporate a non-crystalline α-olefin copolymer in order to improve the releasability. However, when an amorphous α-olefin copolymer is blended, light transmittance is extremely reduced, and it is difficult to achieve both mold release and light transmittance.

  Therefore, an object of the present invention is to provide a resin composition having excellent light transmittance, mold release properties, and impact resistance.

  As a result of intensive studies to solve the above-mentioned problems, a resin composition containing a polyphenylene ether-based resin contains a non-crystalline α-olefin copolymer to improve releasability, and furthermore, has a high light transmission. In order to obtain the properties and impact resistance, the rubber-modified polystyrene resin in the resin composition, the hydrogenated block copolymer, and the ratio and mass ratio of the amorphous α-olefin copolymer in a specific range. It has been found that light transmittance, releasability, and impact resistance can be at the same time at a high level, and the present invention has been completed.

  That is, the present invention is as follows.

[1]
(A) a polyphenylene ether-based resin, or a combination of a polyphenylene ether-based resin and a homopolystyrene resin, (b) a rubber-modified polystyrene-based resin, (c) a hydrogenated block copolymer, and (d) a non-crystalline α Including an olefin copolymer,
With respect to a total of 100 parts by mass of the component (a), the component (b), and the component (c),
60-90 parts by mass of the component (a),
5 to 30 parts by mass of the component (b),
The total of the component (b) and the component (c) is 10 to 40 parts by mass,
The component (d) is 0.10 to 1.50 parts by mass,
The mass ratio between the component (b) and the component (c) is 95/5 to 30/70,
A resin composition, wherein the mass ratio of the sum of the component (b) and the component (c) to the component (d) is 99.5 / 0.5 to 96/4.
[2]
The resin composition according to [1], wherein the component (d) is an ethylene-propylene copolymer.
[3]
(1) or (1) wherein the component (b) contains a styrene-based polymer and a rubbery polymer grafted with the styrene-based polymer, and the rubbery polymer has an average particle diameter of 2.0 μm or less; The resin composition according to [2].
[4]
The resin composition according to any one of [1] to [3], wherein the content of the aromatic vinyl compound portion in the component (c) is 50% by mass or more.
[5]
The resin composition according to any one of [1] to [4], further comprising (e) a condensed phosphoric ester compound.
[6]
The resin composition according to [5], wherein the resin composition contains 5 to 20 parts by mass of the component (e) with respect to a total of 100 parts by mass of the component (a), the component (b), and the component (c).
[7]
The content of the components other than the component (a), the component (b), the component (c), the component (d), and the component (e) is 5% by mass or less based on 100% by mass of the resin composition. The resin composition according to [5] or [6].
[8]
The resin composition according to any one of [1] to [7], wherein a transmittance of 900 nm laser light when formed into a molded product having a thickness of 2.5 mm is 70% or more.
[9]
A molded article characterized by containing the resin composition according to any one of [1] to [8].

  ADVANTAGE OF THE INVENTION According to this invention, the resin composition excellent in light transmittance, mold release property, and impact resistance can be provided.

  Hereinafter, a mode for carrying out the present invention (hereinafter, referred to as “the present embodiment”) will be described in detail. The following embodiment is an exemplification for explaining the present invention, and the present invention is not limited to the following embodiment. Further, the present invention can be appropriately modified and implemented within the scope of the gist.

(Resin composition)
The resin composition of the present embodiment comprises (a) a polyphenylene ether-based resin, or a combination of a polyphenylene ether-based resin and a homopolystyrene resin, (b) a rubber-modified polystyrene-based resin, and (c) a hydrogenated block copolymer. And (d) an amorphous α-olefin copolymer, and the component (a) is contained in the component (a), the component (b), and the component (c) in a total amount of 100 parts by mass. 60 to 90 parts by mass, the component (b) is 5 to 30 parts by mass, the total of the component (b) and the component (c) is 10 to 40 parts by mass, and the component (d) is 0.10 to 1. 50 parts by mass, the mass ratio between the component (b) and the component (c) is 95/5 to 30/70, and the sum of the component (b) and the component (c) and the component (d) )) Component is 99.5 / 0.5 to 96/4.
Further, the resin composition of the present embodiment may further contain (e) a condensed phosphoric ester compound and an additive.

-(A) Polyphenylene ether resin or a combination of polyphenylene ether resin and homopolystyrene resin-
(A) A polyphenylene ether-based resin (hereinafter, sometimes referred to as “PPE”), or a combination of a polyphenylene ether-based resin and a homopolystyrene resin (may be simply referred to as “component (a)”). ), The PPE may be a homopolymer of phenylene ether (homopolymer) or a copolymer of phenylene ether and another monomer.
The above PPE may be used alone or in combination of two or more.

［式中、Ｒ¹、Ｒ²、Ｒ³、及びＲ⁴は、それぞれ独立して、水素原子、ハロゲン原子、炭素数１〜７の第１級のアルキル基、又は炭素数１〜７の第２級のアルキル基、フェニル基、ハロアルキル基、アミノアルキル基、炭化水素オキシ基、及び少なくとも２個の炭素原子がハロゲン原子と酸素原子とを隔てているハロ炭化水素オキシ基からなる群より選ばれる一価の基を表す。］ Examples of the PPE include a homopolymer and / or a copolymer having a repeating unit structure (unit structure derived from phenylene ether) represented by the following formula (1).

[Wherein, R ¹ , R ² , R ³ , and R ⁴ each independently represent a hydrogen atom, a halogen atom, a primary alkyl group having 1 to 7 carbon atoms, or a primary alkyl group having 1 to 7 carbon atoms. Selected from the group consisting of secondary alkyl groups, phenyl groups, haloalkyl groups, aminoalkyl groups, hydrocarbonoxy groups, and halohydrocarbonoxy groups in which at least two carbon atoms separate a halogen atom from an oxygen atom. Represents a monovalent group. ]

  Examples of the component (a) include poly (2,6-dimethyl-1,4-phenylene ether), poly (2-methyl-6-ethyl-1,4-phenylene ether), and poly (2-methyl- Homopolymers such as 6-phenyl-1,4-phenylene ether) and poly (2,6-dichloro-1,4-phenylene ether); 2,6-dimethylphenol and other phenols (for example, 2,3 , 6-trimethylphenol and 2-methyl-6-butylphenol). Among them, poly (2,6-dimethyl-1,4-phenylene ether), 2,6-dimethylphenol and 2,3,6-trimethylphenol are preferable, and poly (2,6-dimethyl-1,4-phenylene ether) is preferable. Is more preferred.

  A conventionally known method can be applied to the method for producing the PPE. As a method for producing the PPE, for example, a method of producing by oxidation polymerization of 2,6-xylenol or the like using a complex of a cuprous salt and an amine as a catalyst, JP-A-50-150798, Examples thereof include the methods described in JP-A-50-051197 and JP-A-63-152628.

  The reduced viscosity of the PPE (0.5 g / dL chloroform solution, measured at 30 ° C., measured with an Ubbelohde viscometer) is, for example, preferably 0.7 dL / g or less, and 0.6 dL / g or less. More preferably, it is preferably 0.15 dL / g or more, more preferably 0.2 dL / g or more.

In addition, the component (a) can further contain a homopolystyrene resin, and by containing the homopolystyrene resin, the fluidity of the resin composition can be improved.
The homopolystyrene resin may be used alone or in combination of two or more.

  The homopolystyrene resin that can be used as the component (a) is a homopolymer of a styrene compound. Examples of the styrene-based compound include, but are not limited to, styrene, α-methylstyrene, 2,4-dimethylstyrene, monochlorostyrene, p-methylstyrene, p-tert-butylstyrene, and ethylstyrene. Among them, styrene is preferred. The homopolystyrene resin is not particularly limited as long as it is a resin obtained from the above-mentioned styrene-based compound, and homopolystyrene (hereinafter sometimes referred to as “GPPS”) is preferable.

  The component (a) is preferably a mixture of a homopolystyrene resin in an amount not exceeding 400 parts by mass with respect to 100 parts by mass of the polyphenylene ether-based resin. More preferably, the content of the homopolystyrene resin is at most 200 parts by mass, more preferably at most 100 parts by mass, per 100 parts by mass of the polyphenylene ether-based resin.

-(B) Rubber-modified polystyrene resin-
(B) A rubber-modified polystyrene-based resin (in this specification, sometimes simply referred to as “component (b)”) refers to a styrene-based compound and a compound copolymerizable with the styrene-based compound. It is a resin (polymer) obtained by polymerization in the presence of a polymer. (B) The rubber-modified polystyrene-based resin may be a rubber-based polymer obtained by grafting a styrene-based polymer obtained by polymerizing a styrene-based compound and a compound copolymerizable with the styrene-based compound.

  Examples of the styrene-based compound used for polymerizing the component (b) include styrene, α-methylstyrene, 2,4-dimethylstyrene, monochlorostyrene, p-methylstyrene, p-tert-butylstyrene, Ethyl styrene and the like can be mentioned, among which styrene is preferable.

  Examples of the compound copolymerizable with the styrene compound used when polymerizing the component (b) include methacrylic esters such as methyl methacrylate and ethyl methacrylate; and unsaturated nitrile compounds such as acrylonitrile and methacrylonitrile. And acid anhydrides such as maleic anhydride.

  The amount of the compound copolymerizable with the styrene compound when the component (b) is polymerized is, for example, based on 100% by mass of the total of the styrene compound and the compound copolymerizable with the styrene compound. , 20% by mass or less, more preferably 15% by mass or less.

  Examples of the rubbery polymer used when polymerizing the component (b) include a conjugated diene rubber, a copolymer of a conjugated diene and an aromatic vinyl compound, and an ethylene-propylene copolymer rubber. Among them, polybutadiene, styrene-butadiene random copolymer, styrene-butadiene block copolymer, and a rubber component obtained by partially or almost completely hydrogenating them (for example, the hydrogenation rate is 50 to 100%) Rubber component) is preferred.

  The amount of the rubbery polymer used in the polymerization of the component (b) is, for example, the above-mentioned styrene-based compound and the copolymerizable with the styrene-based compound from the viewpoint that the resulting molded article has more excellent permeability. It is preferably at most 25% by mass, more preferably at most 15% by mass, based on 100% by mass of the total of the compounds.

The average particle size of the rubbery polymer is preferably 2.0 μm or less, more preferably 1.5 μm or less, and even more preferably 1.3 μm or less, from the viewpoint of light transmittance.
Here, the average particle diameter means an average particle diameter measured by a Coulter counter method in a DMF (dimethylformamide) solvent at 23 ° C.

-(C) hydrogenated block copolymer-
(C) A hydrogenated block copolymer (in this specification, sometimes simply referred to as “component (c)”) refers to a polymer block A mainly composed of an aromatic vinyl compound and a conjugated diene compound. A thermoplastic elastomer having a block copolymer containing a main polymer block B and a hydrogenated block copolymer in which at least a part thereof is hydrogenated.
The component (c) does not include a rubber-modified polystyrene resin containing an aromatic vinyl compound as a component.

--- Polymer block A ---
Examples of the aromatic vinyl compound constituting the polymer block A include styrene, α-methylstyrene, and vinyl toluene. Among them, styrene is preferred from the viewpoint of light transmittance. As the aromatic vinyl compound, only one kind may be used alone, or two or more kinds may be used in combination.

  In the polymer block A, “mainly composed of an aromatic vinyl compound” means that the content of the aromatic vinyl compound portion in the polymer block A before hydrogenation is based on the polymer block A (100% by mass). , 50% by mass or more. And from a light transmittance viewpoint, it is preferable that it is 60 mass% or more, and it is more preferable that it is 70 mass% or more.

The number average molecular weight (Mn (a)) of the polymer block A is preferably, for example, 15,000 or more from the viewpoint of suppressing variation in impact resistance of the resin composition. When there are a plurality of the polymer blocks A, it is more preferable that all the polymer blocks A have a number average molecular weight of 15,000 or more.
The number average molecular weight (Mn (a)) of the polymer block A can be determined by the following equation using the number average molecular weight (Mn) of the following block copolymer.
Mn (a) = {Mn × a / (a + b)} / N
[Wherein, Mn (a) is the number average molecular weight of the polymer block A, Mn is the number average molecular weight of the block copolymer composed of the polymer block A and the polymer block B, and a is the total number of the block copolymer. The total content (% by mass) of the polymer blocks A, b is the total content (% by mass) of all the polymer blocks B in the block copolymer, and N is the total number of the polymer blocks A in the block copolymer. Represent. ]
Here, Mn can be determined by a method using the following gel permeation chromatography measurement device. A can be measured by NMR, and b can be calculated by "100-a".

--- Polymer block B ---
Examples of the conjugated diene compound that constitutes the polymer block B include butadiene, isoprene, and 1,3-pentadiene. Among them, butadiene, isoprene, or a combination thereof is preferable from the viewpoint of impact resistance. One of the above conjugated diene compounds may be used alone, or two or more thereof may be used in combination.

  In the polymer block B, “mainly containing a conjugated diene compound” means that the content of the conjugated diene compound in the polymer block B before hydrogenation is 50% based on the polymer block B (100% by mass). It means that it is at least mass%. And from a viewpoint of impact resistance, it is more preferable that it is 60 mass% or more, and it is more preferable that it is 70 mass% or more.

In the microstructure (bonding form of the conjugated diene compound) of the polymer block B before the hydrogenation, the total vinyl bond amount (the sum of the 1,2-vinyl bond amount and the 3,4-vinyl bond amount of the conjugated diene) is , The total bond amount of the conjugated diene compound polymer (total of 1,2-vinyl bond amount, 3,4-vinyl bond amount and 1,4-conjugate bond amount of the conjugated diene) from the viewpoint of light transmittance. It is preferably at least 5%, more preferably at least 10%, even more preferably at least 15%, and from the viewpoint of releasability, preferably at most 80%, and at most 50%. Is more preferably not more than 45%, further preferably not more than 45%.
The vinyl bond amount can be determined by, for example, a nuclear magnetic resonance apparatus (NMR).

  As the block structure of the hydrogenated block copolymer, for example, when the polymer block A is represented by “A” and the polymer block B is represented by “B”, AB, ABA, AB -AB, and a structure having a bonding form selected from -AB. Above all, from the viewpoint of impact resistance, ABA and ABAB are more preferred, and ABA is still more preferred. The block structure of the hydrogenated block copolymer may be only one type or two or more types.

  The hydrogenated block copolymer is obtained, for example, by subjecting an aliphatic double bond in a block copolymer containing a polymer block A and a polymer block B to hydrogenation treatment.

The hydrogenation rate (hydrogenation rate with respect to the conjugated diene compound portion in the block copolymer) of the component (c) is preferably 50% or more, and more preferably 80% or more, from the viewpoint of thermal stability. More preferably, it is even more preferably 95% or more.
In addition, the said hydrogenation rate means the value measured with the nuclear magnetic resonance apparatus (NMR).

The number average molecular weight (Mn) of the component (c) is preferably 50,000 or more, and more preferably 400,000 or less, from the viewpoint of impact resistance and fluidity.
In addition, the said number average molecular weight is a value measured by using a gel permeation chromatography measuring device equipped with an ultraviolet spectrometer and converted into standard polystyrene.

A specific method for measuring the number average molecular weight is shown below.
Using a gel permeation chromatography measurement device (trade name "GPC SYSTEM21", manufactured by Showa Denko KK), an ultraviolet spectroscopic detector (trade name "UV-41", manufactured by Showa Denko KK) was used to measure standard polystyrene. The number average molecular weight is determined by conversion.
Measurement conditions were as follows: solvent: chloroform, temperature: 40 ° C., column: sample side (KG, K-800RL, K-800R), reference side (K-805L × 2), flow rate 10 ml / min, measurement wavelength: 254 nm, pressure: 15 to 17 kg / cm ² ).
At this time, a low molecular weight component due to catalyst deactivation during polymerization may be detected. In such a case, the low molecular weight component is not included in the molecular weight calculation.

  The molecular weight distribution (weight average molecular weight (Mw) / number average molecular weight (Mn)) of the component (c) is preferably 1.0 or more, and more preferably 1.3 or less.

  As long as the block copolymer described above does not deviate from the gist of the present invention, one having a different bonding type, one having a different aromatic vinyl compound type, one having a different conjugated diene compound type, one having a 1,2-vinyl bond amount, , 2-vinyl bond amount and 3,4-vinyl bond amount are different from each other, aromatic vinyl compound component content is different, hydrogenation rate is different, and so on. May be used.

  The content of the aromatic vinyl compound portion in the component (c) is preferably 50% by mass or more based on the component (c) (100% by mass) from the viewpoint of light transmittance. It is more preferably at least 60 mass%, more preferably at least 60 mass%.

-(D) Amorphous α-olefin copolymer-
Examples of the (d) non-crystalline α-olefin copolymer (sometimes simply referred to as “(d) component” in the present specification) in the present embodiment include, for example, ethylene-propylene copolymer, ethylene-butene Copolymers and the like can be mentioned, but it is particularly preferable to use an ethylene-propylene copolymer from the viewpoint of releasability.

When the component (d) is an ethylene-propylene copolymer, the third component may be further copolymerized within a range that does not affect the performance.
The component ratio of each of ethylene and propylene in the ethylene-propylene copolymer is not particularly limited, but the propylene content is generally in the range of 5 to 50 mol%.

  As the component (d), a commercially available component can be used. For example, it is commercially available from Mitsui Chemicals, Inc. under the trade name of Tuffmer.

-(E) Condensed phosphate ester compound-
The resin composition of the present embodiment contains (e) a condensed phosphoric ester-based compound (in this specification, may be simply referred to as “component (e)”), thereby improving flame retardancy.

［式中、Ｑ⁴¹、Ｑ⁴²、Ｑ⁴³、Ｑ⁴⁴は、各々独立して、炭素原子数１〜６のアルキル基であり；Ｒ⁴¹、Ｒ⁴²は、各々独立して、メチル基であり；Ｒ⁴³、Ｒ⁴⁴は、各々独立して、水素原子又はメチル基であり；ｘは０以上の整数であり；ｐ₁、ｐ₂、ｐ₃、ｐ₄は、それぞれ、０〜３の整数であり；ｑ₁、ｑ₂は、それぞれ、０〜２の整数である］

［式中、Ｑ⁵¹、Ｑ⁵²、Ｑ⁵³、Ｑ⁵⁴は、各々独立して、炭素原子数１〜６のアルキル基であり；Ｒ⁵¹は、メチル基であり；ｙは０以上の整数であり；ｒ₁、ｒ₂、ｒ₃、ｒ₄は、それぞれ、０〜３の整数であり；ｓ₁は、それぞれ、０〜２の整数である］ The component (e) is preferably, for example, one containing, as a main component, at least one selected from the group consisting of aromatic condensed phosphates represented by the following formulas (2) and (3).
The term “main component” as used herein means that at least one content selected from the group consisting of the condensed aromatic phosphates represented by the following formula (2) and the following formula (3) is a component (e): The content is 90% by mass or more, preferably 95% by mass or more, more preferably 100% by mass, based on the mass%.

Wherein Q ⁴¹ , Q ⁴² , Q ⁴³ , and Q ⁴⁴ are each independently an alkyl group having 1 to 6 carbon atoms; R ⁴¹ and R ⁴² are each independently a methyl group R ⁴³ and R ⁴⁴ are each independently a hydrogen atom or a methyl group; x is an integer of 0 or more; p ₁ , p ₂ , p ₃ , and p ₄ are each an integer of 0 to 3; And q ₁ and q ₂ are each an integer of 0 to 2].

Wherein Q ⁵¹ , Q ⁵² , Q ⁵³ , and Q ⁵⁴ are each independently an alkyl group having 1 to 6 carbon atoms; R ⁵¹ is a methyl group; and y is an integer of 0 or more. And r ₁ , r ₂ , r ₃ , and r ₄ are each an integer of 0 to 3; s ₁ is each an integer of 0 to 2]

  In addition, the condensed phosphoric ester compound represented by the above formula (2) and the above formula (3) may each include a plurality of types of molecules, and for each molecule, x and y are integers of 1 to 3, respectively. It is preferable that

Above all, in the component (e), R ⁴³ and R ⁴⁴ are methyl groups, and p ¹ , p ² , p ³ , p ⁴ , and the like, from the viewpoint of further reducing the volatility of the resin composition during molding. an aromatic condensed phosphate ester represented by the formula (2) wherein q ¹ and q ² are 0, and Q ⁴¹ , Q ⁴² , Q ⁴³ , Q ⁴⁴ , R ⁴³ and R ⁴⁴ represent a methyl group; q ¹ and q ² are 0, p ¹ , p ² , p ³ , and p ⁴ are integers of 1 to ³ , and x is an integer of 1 to 3 (particularly, x is 1). It is preferable that the total content of the condensed aromatic phosphate represented by 2) is 50% by mass or more based on 100% by mass of the component (e).

-Additive-
Additives may be added to the resin composition of the present embodiment in order not to impair the effects of the present invention in order to impart further properties. Examples of the additives include stabilizers such as plasticizers, antioxidants, and ultraviolet absorbers, antistatic agents, dyes and pigments, and other resins.

-Content of component (a), component (b), component (c), component (d)-
In the resin composition of the present embodiment, the content of the component (a) is, from the viewpoint of light transmittance, a total of 100 parts by mass of the component (a), the component (b), and the component (c). 60 to 90 parts by mass. Further, the content of the component (a) is preferably from 65 to 85 parts by mass, and more preferably from 70 to 85 parts by mass. Specifically, when the content of the component (a) is 60 parts by mass or more, the light transmittance is excellent, and when the content of the component (a) is 90 parts by mass or less, the impact resistance is excellent. .

  In the resin composition of the present embodiment, the total content of the component (b) and the component (c) is determined from the viewpoints of impact resistance and light transmittance balance, from the components (a), (b), and (c). It is 10 to 40 parts by mass based on 100 parts by mass of the total of the components. Further, the total content of the component (b) and the component (c) is preferably 15 to 35 parts by mass, and more preferably 15 to 30 parts by mass. Specifically, when the total content of the components (b) and (c) is 10 parts by mass or more, the impact resistance is excellent, and the content of the components (b) and (c) is 40 parts by mass. By being below, it is excellent in light transmittance.

The content of each of the components (b) and (c) is not limited as long as the total content of the components (b) and (c) falls within the above range. Among them, the content of the component (b) is 5 to 30 parts by mass based on 100 parts by mass of the components (a), (b), and (c) in total from the viewpoint of impact resistance. Preferably, it is 10 to 25 parts by mass. Specifically, when the content of the component (b) is 5 parts by mass or more, the impact resistance is excellent, and when the content of the component (b) is 30 parts by mass or less, the light transmittance is excellent. .
The content of the component (c) is from 1 to 30 parts by mass based on 100 parts by mass of the components (a), (b), and (c) in total from the viewpoint of impact resistance. And more preferably 5 to 20 parts by mass. Specifically, when the content of the component (c) is 1 part by mass or more, the impact resistance is excellent, and when the content of the component (c) is 30 parts by mass or less, the light transmittance is excellent. .

  In the resin composition of the present embodiment, the content of the component (d) is 100 parts by mass in total from the components (a), (b), and (c) from the viewpoint of the releasability and light transmittance balance. 0.10 to 1.50 parts by mass. Further, the content of the component (d) is preferably from 0.20 to 1.30 parts by mass, and more preferably from 0.30 to 1.00 parts by mass. Specifically, when the content of the component (d) is 0.10 parts by mass or more, releasability can be ensured, and the content of the component (d) is 1.50 parts by mass or less. Thereby, light transmittance can be ensured.

  In the resin composition of the present embodiment, as described above, the content of the component (a), the total content of the components (b) and (c), and the content of the component (d) are within predetermined ranges. By doing so, and by setting each component to the following mass ratio, it is possible to obtain a resin composition having a high level of light transmittance, releasability, and impact resistance.

That is, the mass ratio of the component (b) to the component (c) (the mass of the component (b) / the mass of the component (c)) is 95/5 to 30/70, and 90/10 to 40 / It is preferably 60, and more preferably 85/15 to 45/55. When the mass ratio between the component (b) and the component (c) is 95/5 or less, light transmittance can be ensured, and the mass ratio between the component (b) and the component (c) is 30 /. When it is 70 or more, release properties and impact resistance can be ensured.
The mass ratio of the sum of the components (b) and (c) and the component (d) (the sum of the mass of the component (b) and the mass of the component (c) / the mass of the component (d)) is From the viewpoint of the balance between light transmittance and mold releasability, the ratio is 99.5 / 0.5 to 96/4, preferably 99.0 / 1.0 to 96.5 / 3.5, and 98. More preferably, the ratio is 5 / 1.5 to 97.0 / 3.0. When the mass ratio of the sum of the component (b) and the component (c) to the component (d) is 99.5 / 0.5 or less, releasability can be ensured, and the ratio is 96 / 0.5. When the number is 4 or more, light transmittance can be secured.

  In the resin composition of the present embodiment, the content of the component (e) is, for example, component (a), component (b), and component (b) from the viewpoint of imparting flame retardancy while maintaining high impact resistance. The amount is preferably 5 to 20 parts by mass, more preferably 8 to 18 parts by mass, even more preferably 8 to 15 parts by mass, based on 100 parts by mass of the component (c) in total.

  In the resin composition of the present embodiment, components other than the component (a), the component (b), the component (c), the component (d), and the component (e) are also set so as not to impair the effects of the present invention. Is preferably 5% by mass or less, more preferably 1% by mass or less, even more preferably 0.5% by mass or less, with respect to 100% by mass of the resin composition. It is even more preferred that the content be not more than mass%.

(Method for producing resin composition)
The resin composition of the present embodiment can be produced, for example, by melt-kneading the components (a), (b), (c), and (d) using a twin-screw extruder. it can.
Examples of the twin-screw extruder include ZSK series manufactured by Coperion, TEM series manufactured by Toshiba Machine Co., Ltd., and TEX series manufactured by Japan Steel Works, Ltd.

  In the method for producing the resin composition of the present embodiment, suitable conditions can be appropriately selected for the melt-kneading temperature, the screw rotation speed, and the like from the melt-kneading temperature of 100 to 370C and the screw rotation speed of 100 to 1200 rpm.

  As the raw material supply device for supplying the raw material to the twin-screw extruder, for example, a single screw feeder, a twin-screw feeder, a table feeder, a rotary feeder, and the like, among which, from the viewpoint that the fluctuation error of the raw material supply is small. And a loss-in-weight feeder are preferred.

  When adding a liquid raw material, the liquid raw material can be added by directly feeding the liquid raw material into the cylinder system using a liquid addition pump or the like in the cylinder portion of the extruder. The liquid pump is not particularly limited, and examples thereof include a gear pump and a flange pump, and a gear pump is preferable. At this time, from the viewpoint of reducing the load applied to the liquid addition pump and improving the operability of the raw material, a tank for storing the liquid material, a pipe between the tank and the liquid addition pump, and a connection between the pump and the extruder cylinder. It is preferable to reduce the viscosity of the liquid raw material by heating a portion that becomes a flow path of the liquid raw material such as a pipe using a heater or the like.

(Physical properties of resin composition)
The resin composition of the present embodiment, from the viewpoint of impact resistance, it is preferable that the Charpy impact strength of 7 kJ / m ² or more, more preferably 10 kJ / m ² or more.
The Charpy impact strength can be measured by the method described in <Charpy impact strength> of [Measurement method] described later.

The resin composition of the present embodiment preferably has a transmittance of 900 nm laser light of 70% or more, more preferably 80% or more when formed into a molded product having a thickness of 2.5 mm.
In addition, the transmittance | permeability of 900 nm laser light at the time of making the said molded article with a thickness of 2.5 mm means the value measured by the method of <light transmittance> of [measurement method] mentioned later.

From the viewpoint of mold release properties, the resin composition of the present embodiment is necessary for projecting at the time of mold release when molding a cup-shaped molded product having an outer diameter of 50 mm, a height of 50 mm, and a thickness of 3 mm. The load (release force) is preferably 125 kg or less, more preferably 120 kg or less.
In addition, when the molded article in the cup shape is injection-molded, the load required for protrusion when releasing the molded article is a value measured by a method described in <Measuring Method><ReleaseForce>. Say.

(Molding)
A molded article can be obtained by molding the resin composition of the present embodiment. The molded article contains at least the resin composition of the present embodiment.
As a molding method, for example, a known molding method such as injection molding, hollow molding, extrusion molding, sheet molding, and film molding can be used, and a method of molding using an injection molding machine is particularly preferable. Examples of the injection molding machine include "IS100GN" manufactured by TOSHIBA.

  Suitable conditions for the melting temperature, the mold temperature, and the like in the molding method of the resin composition of the present embodiment can be appropriately selected from the range of a melting temperature of 200 to 320 ° C and a mold temperature of 30 to 100 ° C.

  The molded article can be used as various molded articles, and can be used in a wide range of fields such as industrial parts, electric / electronic parts, office equipment housing, automobile parts, precision parts and the like.

  Hereinafter, the present invention will be described in detail with reference to specific examples and comparative examples, but the present invention is not limited to the following examples.

  The raw materials used for the resin compositions of Examples and Comparative Examples are shown below.

-(A) Polyphenylene ether resin-
(A-1) Reduced viscosity (0.5 g / dL chloroform solution, measured at 30 ° C., measured with an Ubbelohde type viscosity tube) 0.5 dL / g poly (2,6-dimethyl-1,4-phenylene ether)
(A-2) Polystyrene, manufactured by PS Japan, "685"

-(B) Rubber-modified polystyrene resin-
(B-1) Rubber-modified polystyrene resin (HIPS) having an average particle size of the rubbery polymer of 1.2 μm and a content of the rubbery polymer of 10% by mass.
(B-2) Rubber-modified polystyrene resin (HIPS) having an average particle diameter of 1.6 μm and a rubber polymer content of 10% by mass.

-(C) hydrogenated block copolymer-
(C-1) Asahi Kasei Corporation, “Toughtec H1081” (aromatic vinyl compound content: 60% by mass) (hydrogenated block copolymer)
(C-2) "ToughTech H1041" (aromatic vinyl compound content: 32% by mass) manufactured by Asahi Kasei (hydrogenated block copolymer)

-(D) Amorphous α-olefin copolymer-
(D-1) Mitsui Chemicals, "Tuffmer P0680J" (ethylene-propylene copolymer)
(D-2) "Tuffmer DF610" (ethylene-butene copolymer) manufactured by Mitsui Chemicals

-(E) Condensed phosphate ester compound-
"E890" manufactured by Daihachi Chemical Industry Co., Ltd.

  The methods for measuring physical properties in Examples and Comparative Examples are shown below.

〔Measuring method〕
<Charpy impact strength>
The resin compositions obtained in Examples and Comparative Examples were supplied to an injection molding machine (manufactured by Toshiba Machine Co., Ltd., “IS100GN”) set at 240 to 280 ° C., and injection-molded at a mold temperature of 80 ° C. Specimens having the dimensions specified by the ISO-179 standard were manufactured.
Using the test piece, Charpy impact strength (kJ / m ² ) was measured with a notch according to ISO-179. As evaluation criteria, the larger the measured value, the better the impact resistance.

<Light transmittance>
The resin compositions obtained in Examples and Comparative Examples were supplied to an injection molding machine (manufactured by Toshiba Machine Co., Ltd., “IS100GN”) set at 240 to 280 ° C., and injection-molded at a mold temperature of 80 ° C. , 90 mm × 50 mm × 2.5 mm flat plate test pieces were manufactured.
The test piece was cut into a size of about 15 to 30 mm in length and about 35 mm to 70 mm in width, set on an ultraviolet-visible-near-infrared spectrophotometer (trade name “V-670”, manufactured by JASCO Corporation), and the thickness of the test piece was set. The laser light transmittance (%) at a wavelength of 900 nm with respect to 2.5 mm was measured. As evaluation criteria, the larger the measured value, the better the light transmittance.

<Release force>
The resin compositions obtained in the examples and the comparative examples were supplied to an injection molding machine ("IS100GN", manufactured by Toshiba Machine Co., Ltd.) set at 280 ° C, and under the conditions of a mold temperature of 80 ° C, an outer diameter of 50 mm, and a height of 50 mm. Injection molding of a cup-shaped molded product having a thickness of 50 mm and a thickness of 3 mm was performed, and the load (kg) required for protrusion when the molded product was released was measured as a release force. As evaluation criteria, it was evaluated that the smaller the measured value, the better the releasability.

  Hereinafter, each example and each comparative example will be described in detail.

[Example 1]
A twin-screw extruder (trade name “ZSK-25WLE”, manufactured by Coperion Co., Ltd.) was used as a resin composition manufacturing apparatus. In the twin-screw extruder, the number of barrels is 12 blocks, and in the flow direction of the raw material, one supply port is provided at each of the first barrel (upstream supply port) and the ninth barrel (downstream supply port) from the upstream. , A liquid addition pump was provided at the seventh barrel, and a vacuum vent was provided at the eleventh barrel. The method of supplying the raw material to the downstream supply port was a method of supplying the raw material from the extruder side open port using a forced side feeder.
The components (a) to (e) are supplied to the twin-screw extruder set as described above with the composition shown in Table 1, and the conditions are as follows: extrusion temperature 300 to 320 ° C., screw rotation speed 300 rpm, and discharge rate 15 kg / hour. To obtain a resin composition pellet.

[Examples 2 to 15]
The components (a) to (e) were supplied to a twin-screw extruder with the compositions shown in Table 1. The other conditions were the same as in Example 1 to obtain pellets of the resin composition.

[Comparative Examples 1 to 12]
The components (a) to (d) were supplied to a twin-screw extruder with the compositions shown in Table 2. Other conditions were the same as in Example 1 to obtain pellets of the resin composition.

  Tables 1 and 2 show the evaluation results of the above items for the molded articles obtained by molding the resin compositions prepared in Examples and Comparative Examples.

  Examples 1 to 15 are all excellent in light transmittance, impact resistance, and release properties, and the resin composition according to the present embodiment is a molded article excellent in light transmittance, impact resistance, and release properties. Could be molded.

  INDUSTRIAL APPLICABILITY The resin composition of the present invention has industrial applicability as a material for use in electric parts, OA equipment, batteries, and the like.

Claims (9)

(A) a polyphenylene ether-based resin, or a combination of a polyphenylene ether-based resin and a homopolystyrene resin, (b) a rubber-modified polystyrene-based resin, (c) a hydrogenated block copolymer, and (d) a non-crystalline α Including an olefin copolymer,
With respect to a total of 100 parts by mass of the component (a), the component (b), and the component (c),
60-90 parts by mass of the component (a),
5 to 30 parts by mass of the component (b),
The total of the component (b) and the component (c) is 10 to 40 parts by mass,
The component (d) is 0.10 to 1.50 parts by mass,
The mass ratio between the component (b) and the component (c) is 95/5 to 30/70,
A resin composition, wherein the mass ratio of the sum of the component (b) and the component (c) to the component (d) is 99.5 / 0.5 to 96/4.   The resin composition according to claim 1, wherein the component (d) is an ethylene-propylene copolymer.   The component (b) contains a styrene-based polymer and a rubbery polymer to which the styrene-based polymer is grafted, and the rubber polymer has an average particle size of 2.0 μm or less. 3. The resin composition according to 2.   The resin composition according to any one of claims 1 to 3, wherein the content of the aromatic vinyl compound portion in the component (c) is 50% by mass or more.   The resin composition according to any one of claims 1 to 4, further comprising (e) a condensed phosphate ester compound.   The resin composition according to claim 5, wherein the resin composition contains 5 to 20 parts by mass of the component (e) based on 100 parts by mass in total of the component (a), the component (b), and the component (c).   The content of the components other than the component (a), the component (b), the component (c), the component (d), and the component (e) is 5% by mass or less based on 100% by mass of the resin composition. The resin composition according to claim 5, wherein   The resin composition according to any one of claims 1 to 7, wherein a transmittance of 900 nm laser light when the molded article has a thickness of 2.5 mm is 70% or more.   A molded article comprising the resin composition according to claim 1.