CN115775747A

CN115775747A - Laser type die bonder

Info

Publication number: CN115775747A
Application number: CN202111048971.XA
Authority: CN
Inventors: 石敦智; 黄良印; 刘黄颂凯; 施景翔
Original assignee: Gallant Micro Machining Co ltd
Current assignee: Gallant Micro Machining Co ltd
Priority date: 2021-09-08
Filing date: 2021-09-08
Publication date: 2023-03-10

Abstract

The invention discloses laser type die bonding equipment which comprises a fixed laser emitter, at least one photomask positioned on a light-emitting path of the fixed laser emitter, a bearing platform and a light-transmitting acquirer. The bearing table is used for bearing a substrate and can move relative to the fixed laser emitter so as to enable the substrate to be located on the light emitting path. The acquirer is used for acquiring a chip, enabling the chip to be adhered with a colloid, and further enabling the chip to be adhered to the substrate on the light emitting path through the colloid. When the chip is attached to the substrate on the light-emitting path by the colloid, the fixed laser emitter can emit a laser beam, and the laser beam passes through at least one photomask along the light-emitting path and the acquirer to be projected on the chip. Therefore, the laser type die bonding equipment effectively improves the operation and production efficiency by adopting the fixed laser emitter which cannot move.

Description

Laser type die bonder

Technical Field

The invention relates to die bonding equipment, in particular to laser die bonding equipment adopting a fixed laser emitter.

Background

The existing die bonder comprises a pre-bonding device and a die bonder positioned at the downstream of the pre-bonding device, wherein the pre-bonding device of the existing die bonder is used for arranging colloids and chips on a plurality of carriers one by one, and the die bonder of the existing die bonder is used for curing the plurality of colloids through an ambient temperature heating mode (such as baking). However, there is obviously room for improvement in the operation mechanism or production efficiency of the conventional die bonding equipment.

The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.

Disclosure of Invention

The embodiment of the invention provides laser type die bonding equipment which can effectively overcome the defects possibly generated by the existing production equipment.

The embodiment of the invention discloses laser type die bonding equipment, which comprises: the fixed laser emitter is positioned at a preset position and is limited with an optical outgoing path; at least one photomask, which is positioned on the light-emitting path of the fixed laser emitter; the bearing platform is used for bearing a substrate and can move relative to the fixed laser emitter so as to enable the substrate to be positioned on the light emitting path; and

the device comprises an acquirer, a light-transmitting unit and a light-transmitting unit, wherein the acquirer is used for acquiring a chip and adhering a colloid to the chip; the acquirer can be used for moving the chip adhered with the colloid so as to enable the chip to be adhered to the substrate on the light emitting path through the colloid; when the chip is attached to the substrate on the light-emitting path by the colloid, the fixed laser emitter can emit a laser beam, and the laser beam passes through at least one photomask along the light-emitting path and the acquirer to be projected on the chip.

Preferably, the number of the at least one photomask is multiple, and the multiple photomasks have different patterns, and the multiple photomasks enable one photomask to be selectively moved to the light-emitting path of the fixed laser emitter.

Preferably, when the chip is adhered to the substrate on the light-emitting path by the glue, the plurality of light covers can be sequentially moved to the light-emitting path, so that the laser beam emitted from the fixed laser emitter can pass through at least two light covers at different time points, and respectively pass through the extractor in different light shapes and be projected on the chip.

Preferably, the extractor has a head for extracting the chip, and the at least one mask is disposed within the extractor adjacent to the head.

Preferably, the picker has a head portion for picking up the chip, and the picker is formed with a slot adjacent to the head portion, and the at least one photo-mask is detachably inserted into the slot of the picker.

Preferably, the laser die bonder includes a substrate camera adjacent to the fixed laser emitter for capturing a position of the substrate on the carrier.

Preferably, the laser die bonder includes a chip corrector located upstream of the fixed laser emitter for correcting the position of the chip adhered with the adhesive.

Preferably, the extractor includes a chip heater for heating the chip by the extractor before the extractor attaches the chip to the substrate.

Preferably, the susceptor includes a substrate heater, so that the susceptor can heat the substrate by the substrate heater before the extractor attaches the chip to the substrate.

The embodiment of the invention also discloses laser type die bonding equipment, which comprises: the fixed laser emitter is positioned at a preset position and is limited with an optical path; at least one photomask, which is positioned on the light-emitting path of the fixed laser emitter; the bearing platform is used for bearing a substrate and can move relative to the fixed laser emitter so as to enable the substrate to be positioned on the light emitting path; a circulating workstation, which is provided with a plurality of stations on an annular path and comprises a plurality of acquirers moving along the annular path, and any acquirer is in a light-transmitting shape and can pass through the stations one by one along the annular path; wherein the plurality of sites comprise: a chip supply station for any of the acquirers moved thereto to acquire a chip; the adhesive station is used for adhering an adhesive to the chip acquired by any one of the acquirers moved to the adhesive station; the die bonding station is positioned corresponding to the fixed laser emitter and used for pressing the chip obtained by any one of the movable acquirers and enabling the chip to be attached to the substrate positioned on the light emitting path through the colloid; in the die bonding station, the fixed laser emitter can emit a laser beam, and the laser beam passes through at least one mask along the light-emitting path and passes through an extractor to be projected on the chip.

Preferably, the plurality of stations include a chip calibration station located between the glue station and the die bonding station, and the laser die bonding apparatus includes a chip calibrator located corresponding to the chip calibration station for calibrating a position of the chip moved to any one of the pickers of the chip calibration station.

Preferably, in the die bonding station, the plurality of masks can be sequentially moved to the light exit path, so that the laser beam emitted from the fixed laser emitter can pass through at least two masks at different time points, and respectively pass through the extractor in different light shapes and be projected onto the chip.

Preferably, the laser die bonder includes a substrate camera corresponding to the die bonding station for capturing the position of the substrate on the carrier.

Preferably, the laser die bonder includes a chip supply device corresponding to the chip supply station for any one of the pickers moving to the chip supply station to pick up a chip.

Preferably, the plurality of obtainers are capable of operating synchronously at a plurality of sites, respectively.

Preferably, the number of at least one reticle is equal to the number of a plurality of pickers, each having a head for picking up a chip, and each reticle is provided within one of the pickers and adjacent to the head.

Preferably, each of the extractors has a head portion for extracting the chip, and each of the extractors is formed with a slot adjacent to the head portion, and the at least one mask is detachably inserted into the slot of any one of the extractors.

Preferably, the extractor comprises a chip heater for heating the chip by the extractor before the extractor attaches the chip to the substrate.

Preferably, the susceptor includes a substrate heater for heating the substrate by the susceptor before the susceptor attaches the chip to the substrate.

In summary, in the laser die bonder disclosed in the embodiments of the present invention, the chip is pressed against the substrate by the acquirer, and the colloid between the chip and the substrate is cured by the fixed laser emitter, so that a curing manner of a heating environment temperature is improved, and operation and production efficiency of the laser die bonder are effectively improved.

Furthermore, the laser die bonder disclosed by the embodiment of the invention adopts the fixed laser emitter which cannot move, so that the alignment difficulty in the colloid curing process can be reduced, and the laser emitter with larger volume and higher power can be used, thereby further improving the operation and production efficiency of the laser die bonder.

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention.

Drawings

Fig. 1 is a schematic top view of a laser die bonder in accordance with a first embodiment of the present invention.

Fig. 2A is a subsequent operation diagram of fig. 1.

Fig. 2B is a schematic side view of a glue station of the laser die bonder.

FIG. 2C is a subsequent operation diagram of FIG. 2B.

Fig. 3 is a subsequent operation diagram of fig. 2A.

Fig. 4A is a subsequent operation diagram of fig. 3.

Fig. 4B is a schematic side view of the die bonding station of the laser die bonding apparatus.

FIG. 4C is a subsequent operation diagram of FIG. 4B.

FIG. 4D is a subsequent operation diagram of FIG. 4C.

Fig. 5 is a schematic side view of a die bonding station of a laser die bonding apparatus according to a second embodiment of the present invention.

Fig. 6 is a schematic side view of a die bonding station of a laser die bonding apparatus according to a third embodiment of the present invention.

Fig. 7 is a schematic side view of a die bonding station of a laser die bonding apparatus according to a fourth embodiment of the present invention.

Detailed Description

The following is a description of the embodiments of the laser die bonder according to the present disclosure with specific embodiments, and those skilled in the art can understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. It should be noted that the drawings of the present invention are merely schematic illustrations and are not drawn to actual dimensions. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. Additionally, the term "or" as used herein is intended to include any one or combination of the associated listed items, as the case may be.

[ first embodiment ]

Fig. 1 to 4D show a first embodiment of the present invention. As shown in fig. 1, the present embodiment discloses a laser die bonding apparatus 1000, wherein the laser die bonding apparatus 1000 includes a circulating workstation S and a plurality of devices D corresponding to the circulating workstation S. The circulating work station S is provided with a plurality of stations S 'on an annular path, and the circulating work station S includes a plurality of acquirers S1 moving along the annular path, and any one of the acquirers S1 is transparent and can pass through the plurality of stations S' one by one along the annular path.

In this embodiment, the circular path is circular, the number of the plurality of acquirers S1 is not less than (e.g., equal to) the number of the plurality of stations S ', and the plurality of acquirers S1 can operate synchronously at the plurality of stations S', so as to improve the overall operation performance of the laser die bonding apparatus 1000, but the invention is not limited thereto.

In more detail, each of the stations S 'is, for example, a working area, and a plurality of the stations S' have different but associated roles and area areas different from each other. In this embodiment, the plurality of stations S' sequentially include a chip supply station S100, a glue station S200, a chip calibration station S300, and a die bonding station S400 on the circular path (that is, the chip calibration station S300 is located between the glue station S200 and the die bonding station S400), but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the number and the sequence of the plurality of stations S' may be increased or decreased according to the requirement.

Furthermore, the plurality of devices D in this embodiment includes a chip supply device 100 corresponding to the chip supply station S100, a glue supply device 200 corresponding to the glue station S200, a chip corrector 300 corresponding to the chip correction station S300, and a die bonding device 400 corresponding to the die bonding station S400, but the invention is not limited thereto.

For example, in other embodiments not shown in the present invention, some of the plurality of stations S' (e.g., the chip calibration station S300) and their corresponding devices D (e.g., the chip calibrator 300) may be reduced according to design requirements; alternatively, the laser die bonder 1000 may further add a new station and a corresponding device according to design requirements.

In order to understand the specific operation of the laser die bonding apparatus 1000 in this embodiment, the functions and applications of each of the devices D and the corresponding stations S' are described below, and the operation flows of the plurality of acquirers S1 are the same, so the drawings of this embodiment only illustrate the operation of one acquirer S1, but the invention is not limited thereto.

As shown in fig. 1, the chip supply apparatus 100 can continuously supply chips C for any one of the acquirers S1 to acquire; that is, the chip supply apparatus 100 is used for any one of the acquirers S1 moving to the chip supply station S100 to acquire one chip C by its position corresponding to the chip supply station S100.

Further, as shown in fig. 2A to 2C, the glue supplier 200 is located downstream of the chip supply station S100, and the glue supplier 200 corresponds to the gluing station S200 by its position, so that any one of the acquirers S1 moving to the gluing station S200 can adhere a glue G to the chip C acquired by it (that is, the acquirer S1 is used to acquire one of the chips C and adhere it with a glue G). In more detail, the glue supplier 200 may be a container filled with glue in this embodiment, and the picker S1 can move the chip C picked up by the picker toward the glue supplier 200 to adhere the glue G.

As shown in fig. 3, the chip aligner 300 is located downstream of the glue supplier 200, and the chip aligner 300 is used to align the position of the chip C moved to any one of the pickers S1 of the chip aligning stations S300 by its position corresponding to the chip aligning station S300. The chip corrector 300 can be used to correct the position of the chip C (as shown in fig. 2C) adhered with the colloid G, thereby facilitating the subsequent die bonding operation to be performed accurately.

As shown in fig. 4A to 4D, the die bonder 400 includes a fixed laser emitter 1, a stage 2, a substrate camera 3 and a mask unit 4. Wherein the fixed laser transmitter 1 is, for example, a Laser Assisted Bonding (LAB) system, and the fixed laser transmitter 1 is located downstream of the chip aligner 300 (i.e., the chip aligner 300 is located upstream of the fixed laser transmitter 1). Further, the fixed laser transmitter 1 is located at a predetermined position and defines an optical path P. That is, the fixed laser transmitter 1 does not move away from the predetermined position in the present embodiment, and any moving laser transmitter is excluded.

The susceptor 2 is used to support at least one substrate B, and the susceptor 2 is used to support a plurality of substrates B in the drawings of the present embodiment, and for convenience of description, only the case where the susceptor 2 supports one substrate B will be described below. The carrier 2 is movable relative to the fixed laser transmitter 1, so that one substrate B is located on the light emitting path of the fixed laser transmitter 1. Furthermore, the position of the substrate camera 3 corresponds to the die bonding station S400, and is used to obtain the position of the substrate B on the carrier 2.

The mask unit 4 includes at least one mask 41 located on the light-emitting path P, and the number of the masks 41 included in the mask unit 4 is illustrated as a plurality in the embodiment, but the invention is not limited thereto. Wherein, a plurality of the masks 41 have different patterns, and a plurality of the masks 41 can selectively move one of the masks 41 to the light-emitting path P of the stationary laser transmitter 1.

The positions of the fixed laser emitter 1, the carrying table 2, the substrate camera 3, and the mask unit 4 correspond to the die bonding station S400, so that the die bonding station S400 can press the chip C obtained by any one of the acquirers S1 through the position of the fixed laser emitter 1, and the chip C is attached to the substrate B on the light emitting path P through the colloid G (that is, the acquirer S1 can move the chip C to which the colloid G is attached, so that the colloid G is attached to the substrate B on the light emitting path).

In the die bonding station S400, the fixed laser emitter 1 can emit a laser beam, and the laser beam passes through at least one of the masks 41 along the light emitting path P and passes through one of the extractors S1 to be projected onto the chip C. In other words, when the chip C is attached to the substrate B on the light emitting path P by the colloid G, the acquirer S1 presses the chip C against the substrate B, and the fixed laser emitter 1 can emit a laser beam which passes through at least one of the masks 41 along the light emitting path P and the acquirer S1 to be projected on the chip C.

Accordingly, the laser die bonder 1000 according to the embodiment presses the chip C against the substrate B through the acquirer S1, and cures the colloid G between the chip C and the substrate B through the fixed laser emitter 1 in cooperation with at least one mask 41, so as to replace a curing method of heating an ambient temperature, thereby effectively improving the operation and production efficiency of the laser die bonder 1000.

Further, the laser die bonder 1000 disclosed in this embodiment employs the fixed laser emitter 1 that does not move, so that the alignment difficulty during the curing process of the colloid G can be reduced, and the laser emitter with a large volume and high power can be used, thereby further improving the operation and production efficiency of the laser die bonder 1000.

In addition, in the die bonding station S400, the plurality of masks 41 can be sequentially moved to the light emitting path P, so that the laser beam emitted from the fixed laser emitter 1 can pass through at least two masks 41 at different time points, and respectively pass through the extractor S1 in different light shapes and be projected onto the chip C. In other words, when the chip C is attached to the substrate B on the light-emitting path P by the glue G, the plurality of light masks 41 can sequentially move to the light-emitting path P, so that the laser beam emitted from the fixed laser emitter 1 can pass through at least two light masks 41 at different time points, and respectively pass through the extractor S1 in different light shapes (e.g., at least two light shapes) and be projected onto the chip C.

Further, the light masks 41 are configured according to design requirements in the present embodiment and allow the laser beam to pass through to form a plurality of light shapes with different functions. For example, among at least two light shapes passing through the extractor S1 and projected on the chip C, a first light shape is used for focusing and curing an outer portion of the gel G, and a second light shape is used for focusing and curing an inner portion of the gel G, thereby enabling the gel G to be cured gradually and stably from the outside to the inside.

It should be noted that, in the embodiment, the laser type die bonding apparatus 1000 is described by matching the circulating workstation S with a plurality of corresponding devices D, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the laser die bonder 1000 may also include the fixed laser emitter 1, at least one mask 41, the stage 2 and the extractor S1; that is, the laser die bonder 1000 may be operated by at least one of the pickers S1 without the circulation station S.

[ example two ]

Fig. 5 shows a second embodiment of the present invention. Since this embodiment is similar to the first embodiment, the same parts of the two embodiments are not described again, and the differences between this embodiment and the first embodiment are roughly described as follows:

in this embodiment, the die bonder 400 does not include any mask 41, and the circulation station S preferably includes a plurality of masks S2 equal in number to the plurality of pickers S1. Wherein each of the plurality of pick-ups S1 has a head S11 for picking up the chip C, and each of the plurality of pick-ups S1 is formed with a slot S12 adjacent to the head S11, and any one of the plurality of photo-masks S2 is detachably inserted into the slot S12 of one of the plurality of pick-ups S1.

[ third example ]

Please refer to fig. 6, which illustrates a third embodiment of the present invention. Since this embodiment is similar to the first embodiment, the same parts of the two embodiments are not described again, and the differences between this embodiment and the first embodiment are roughly described as follows:

in this embodiment, the die bonder 400 does not include any mask 41, and the circulation station S preferably includes a plurality of masks S2 equal in number to the plurality of pickers S1. Each of the plurality of extractors S1 has a head S11 for extracting the chip C, and each of the plurality of reticles S2 is disposed in one of the plurality of extractors S1 and adjacent to the head S11.

[ example four ]

Please refer to fig. 7, which illustrates a fourth embodiment of the present invention. Since the present embodiment is similar to the first to third embodiments, the same parts of the embodiments are not repeated, and the differences between the present embodiment and the embodiments are roughly described as follows:

in this embodiment, any one of the acquirers S1 further includes a chip heater S13 adjacent to the head S11, and the chip heater S13 is annular and disposed outside the light emitting path P, so that the acquirer S1 can heat the chip C by the chip heater S13 before the acquirer S1 presses (or attaches) the chip C to the substrate 2.

Furthermore, the carrier 2 may also be provided with a substrate heater 21, so that the carrier 2 can heat the substrate B by the substrate heater 21 before the extractor S1 presses (or attaches) the chip C to the substrate 2.

Accordingly, the chip C and the substrate B may be heated to a default temperature through the chip heater S13 and the substrate heater 21, respectively, and then the acquirer S1 presses the chip C against the substrate 2, so that the chip C and the substrate 2 may be connected at the default temperature, thereby improving the connection efficiency, stability, and accuracy.

In addition, the laser die bonder 1000 is illustrated as being provided with the chip heater S13 and the substrate heater 21 simultaneously in the embodiment, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the laser die bonder 1000 may be provided with only one of the chip heater S13 and the substrate heater 21. The chip heater S13 may be disposed in the extractor S1 according to any one of the first and second embodiments.

[ technical effects of embodiments of the present invention ]

In summary, in the laser die bonder disclosed in the embodiment of the present invention, the chip is pressed against the substrate by the acquirer, and the adhesive between the chip and the substrate is cured by the fixed laser emitter, so that a curing manner of heating an ambient temperature is improved, and operation and production efficiency of the laser die bonder are effectively improved.

In addition, at least one of the photomasks used to be collocated with the fixed laser emitter of the laser die bonder disclosed in the embodiment of the invention can adopt a corresponding structure according to design requirements (for example, a plurality of photomasks enable one of the photomasks to selectively move to the light-emitting path, or at least one of the photomasks can be separately inserted into the slot of the acquirer, or at least one of the photomasks is internally arranged in the acquirer), so that the laser die bonder can have a wider application range.

The disclosure is only a preferred embodiment and is not intended to limit the scope of the invention, so that all equivalent variations made by using the disclosure of the present invention and drawings are included in the scope of the invention.

Claims

1. A laser type die bonding apparatus, comprising:

the fixed laser emitter is positioned at a preset position and is limited with an optical path;

at least one optical mask positioned on the light exit path of the stationary laser transmitter;

the bearing table is used for bearing a substrate and can move relative to the fixed laser emitter so as to enable the substrate to be positioned on the light emitting path; and

the device comprises an acquirer, a light-transmitting unit and a light-transmitting unit, wherein the acquirer is used for acquiring a chip and adhering a colloid to the chip; the acquirer can be used for moving the chip adhered with the colloid so as to enable the chip to be adhered to the substrate on the light emitting path through the colloid;

when the chip is attached to the substrate on the light emitting path by the colloid, the fixed laser emitter can emit a laser beam, and the laser beam passes through at least one light shield along the light emitting path and the acquirer to be projected on the chip.

2. The laser die bonder apparatus of claim 1, wherein at least one of the reticles is plural in number and has a different pattern, the plurality of reticles selectively moving one of the reticles into the light exit path of the stationary laser emitter.

3. The laser die bonder apparatus of claim 2, wherein when the die is attached to the substrate on the light emitting path by the adhesive, the plurality of photo-masks are sequentially moved to the light emitting path, so that the laser beam emitted from the fixed laser emitter can pass through at least two photo-masks at different time points, and pass through the extractor and project onto the die in different light shapes.

4. The laser die attach apparatus of claim 1 wherein said extractor has a head for extracting said die, and at least one of said reticles is disposed within said extractor adjacent to said head.

5. The laser die attach apparatus of claim 1 wherein the extractor has a head for extracting the die and is formed with a slot adjacent to the head, at least one of the reticles being detachably insertable into the slot of the extractor.

6. The laser die attach apparatus of claim 1, wherein the laser die attach apparatus comprises a substrate camera adjacent to the stationary laser transmitter for capturing the position of the substrate on the carrier.

7. The laser die bonder apparatus of claim 1, wherein said laser die bonder apparatus comprises a chip corrector located upstream of said stationary laser transmitter for correcting the position of said chip adhered with said glue.

8. The laser die attach apparatus of claim 1 wherein the extractor comprises a chip heater, wherein the extractor is capable of heating the chip by the chip heater before the extractor attaches the chip to the substrate.

9. The laser die attach apparatus of claim 1, wherein the susceptor comprises a substrate heater, such that the susceptor can heat the substrate by the substrate heater before the extractor attaches the chip to the substrate.

10. A laser type die bonding apparatus, comprising:

the bearing table is used for bearing a substrate and can move relative to the fixed laser emitter so as to enable the substrate to be positioned on the light emitting path;

a cyclical working station having a plurality of stations on an endless path, the cyclical working station comprising a plurality of obtainers movable along the endless path, and any one of the obtainers being light transmissive and capable of passing through the plurality of stations one by one along the endless path; wherein a plurality of said sites comprise:

a chip supply station for any of the acquirers moved thereto to acquire a chip;

the gluing station is used for enabling any one of the acquirers to adhere a glue to the chip acquired by the acquirer; and

the die bonding station corresponds to the fixed laser emitter in position and is used for enabling any one of the acquirers to press the chip acquired by the acquirer and enabling the chip to be attached to the substrate on the light emitting path through the colloid; in the die bonding station, the fixed laser emitter can emit a laser beam, and the laser beam passes through at least one mask along the light emitting path and passes through one acquirer to be projected on the chip.

11. The laser die attach apparatus of claim 10 wherein the plurality of stations comprises a die alignment station located between the glue station and the die attach station, and wherein the laser die attach apparatus comprises a die aligner positioned relative to the die alignment station for aligning the position of the die on any of the pickers moved to the die alignment station.

12. The laser die attach apparatus of claim 10 wherein the number of at least one of the reticles is plural and a plurality of the reticles have different patterns, the plural reticles selectively moving one of the reticles into the light exit path of the stationary laser emitter.

13. The laser die bonding apparatus according to claim 12, wherein in the die bonding station, a plurality of the reticles are sequentially movable to the light exit path, so that the laser beam emitted from the fixed laser emitter can pass through at least two of the reticles at different time points, and pass through the extractor and project onto the chip in different light shapes.

14. The laser die attach apparatus of claim 10, wherein the laser die attach apparatus comprises a substrate camera positioned corresponding to the die attach station for capturing the position of the substrate on the carrier.

15. The laser die bonding apparatus according to claim 10, wherein the laser die bonding apparatus comprises a chip supply device corresponding to the chip supply station in position for any of the acquirers moving to the chip supply station to acquire one of the chips.

16. The laser die bonding apparatus of claim 10, wherein a plurality of the acquirers are capable of operating synchronously at a plurality of the stations, respectively.

17. The laser die attach apparatus of claim 10 wherein the number of at least one of said reticles is equal to the number of said plurality of said extractors, each of said extractors having a head for extracting said chip, and each of said reticles being disposed within one of said extractors adjacent to said head.

18. The laser die attach apparatus of claim 10 wherein each of said plurality of extractors has a head portion for extracting said chip, and each of said plurality of extractors is formed with a slot adjacent to said head portion, at least one of said reticles being detachably insertable into said slot of any one of said plurality of extractors.

19. The laser die attach apparatus of claim 10 wherein the extractor comprises a chip heater, wherein the extractor is capable of heating the chip by the chip heater before the extractor attaches the chip to the substrate.

20. The laser die attach apparatus of claim 10 wherein the susceptor includes a substrate heater, whereby the susceptor heats the substrate prior to the extractor attaching the die to the substrate.