CN115763285A - Clamp and method for positioning failure point of packaging particles - Google Patents
Clamp and method for positioning failure point of packaging particles Download PDFInfo
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- CN115763285A CN115763285A CN202111031408.1A CN202111031408A CN115763285A CN 115763285 A CN115763285 A CN 115763285A CN 202111031408 A CN202111031408 A CN 202111031408A CN 115763285 A CN115763285 A CN 115763285A
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Abstract
The disclosure provides a clamp and a method for positioning failure points of packaged particles, and belongs to the technical field of integrated circuit packaging. The clamp includes a tray and a cover. Wherein the tray may have a plurality of adjustment members. The blocking cover can be provided with a plurality of positioning points which are uniformly arranged on the blocking cover. When the blocking cover is matched with the tray, the failure point of the packaged particles is matched with one positioning point on the blocking cover by moving the plurality of adjusting pieces. Therefore, the failure point to be analyzed can be positioned on the surface of the packaging particle on the premise of not damaging the surface of the packaging particle, and then the electrical failure analysis can be carried out on the failure point.
Description
Technical Field
The disclosure relates to the technical field of integrated circuit packaging, in particular to a clamp and a method for positioning failure points of packaged particles.
Background
In Failure Analysis of integrated circuit package particles, EFA (Electrical Failure Analysis) Electrical Analysis is generally used to determine the Failure point of the package in the package particles. However, the failure point to be analyzed cannot be located on the surface of the encapsulated particle without damaging the encapsulated particle, and thus the electrical failure analysis cannot be performed on the failure point.
The above information disclosed in this background section is only for enhancement of understanding of the background of the disclosure and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art.
Disclosure of Invention
The utility model aims to provide a fixture, the point of failure of location encapsulation granule that can be quick accurate.
In order to achieve the purpose, the technical scheme adopted by the disclosure is as follows:
according to a first aspect of the present disclosure, there is provided a jig for the location of points of failure of encapsulated particles, the jig comprising:
a tray having a plurality of adjustment members;
the accommodating groove is formed in the tray and used for accommodating the packaging particles;
the retaining cover is provided with a plurality of positioning points, and the positioning points are uniformly arranged on the retaining cover;
when the blocking cover is matched with the tray, the failure point of the packaged particles is matched with one positioning point on the blocking cover by moving the plurality of adjusting pieces.
In an exemplary embodiment of the present disclosure, the upper surface of the tray is engraved with two-dimensional coordinate axes under which the failure points of the encapsulated particles correspond to coordinates.
In an exemplary embodiment of the present disclosure, a clamping groove is further formed in the upper portion of the tray, the clamping groove is located inside the two-dimensional coordinate axis, and the blocking cover can be clamped into the clamping groove;
when the blocking cover is clamped into the clamping groove, each positioning point of the blocking cover has coordinates under the two-dimensional coordinate axis.
In an exemplary embodiment of the disclosure, the bottom of the accommodating groove is also engraved with uniformly distributed grid lines.
In an exemplary embodiment of the present disclosure, a plurality of the adjusting members are inserted through the side portion of the tray through-holes.
In an exemplary embodiment of the disclosure, the side portion of the tray includes four first side surfaces connected end to end in sequence, and the adjusting member is disposed through the first side surfaces.
In an exemplary embodiment of the present disclosure, the adjustment member is located on a central axis of the first side.
In an exemplary embodiment of the present disclosure, the adjusting member includes an adjusting rod and a supporting frame connected to a top end of the adjusting rod, and the supporting frame can push the encapsulated particles to move under the driving of the adjusting rod.
In an exemplary embodiment of the present disclosure, the through hole has an internal thread, the adjusting rod has an external thread, and a top end of the adjusting rod is rotatably connected to the supporting frame.
In an exemplary embodiment of the present disclosure, the adjusting rod is a bolt, and a top end of the adjusting rod is connected to the supporting frame through a bearing.
In an exemplary embodiment of the disclosure, the lower end of the supporting frame is movably connected to a groove arranged at the bottom of the accommodating groove.
In an exemplary embodiment of the present disclosure, the material of the tray and the shield cover is ceramic.
In an exemplary embodiment of the disclosure, each of the positioning points is engraved in the cover.
According to a second aspect of the present disclosure, there is provided a method for positioning a failure point of a packaged particle, which is applied to the above-mentioned jig, the method for positioning a failure point of a packaged particle includes:
placing the packaged particles in a containing groove, and determining the coordinates of failure points of the packaged particles;
covering a blocking cover on the packaged particles, and selecting a target positioning point from a plurality of positioning points on the blocking cover, wherein the target positioning point is closest to the coordinate of the failure point of the packaged particles;
and moving the packaging particles to enable the failure point of the packaging particles to be matched with the target positioning point.
In an exemplary embodiment of the present disclosure, the determining coordinates of the encapsulated particle failure point includes:
and determining the coordinates of the failure points of the packaged particles according to the two-dimensional coordinate axis carved on the upper surface of the tray.
In an exemplary embodiment of the present disclosure, the method for locating the failure point of the encapsulated particle further includes:
placing the packaged particles in the accommodating groove;
controlling the regulating member so that a supporting frame of the regulating member clamps the encapsulated particles;
matching the blocking cover with a clamping groove formed in the upper part of the tray, wherein the blocking cover covers the packaging particles;
and controlling the regulating piece to enable the failure point of the encapsulated particles to be matched with the target positioning point.
In an exemplary embodiment of the present disclosure, the method for locating the failure point of the encapsulated particle further includes:
and moving the encapsulated particles under X-ray so that the failure points of the encapsulated particles are matched with the target positioning points.
In one exemplary embodiment of the present disclosure, characterized in that,
after the failure point of the encapsulated particle is matched with the target positioning point, the failure point of the encapsulated particle is positioned on one side of the target positioning point.
In an exemplary embodiment of the present disclosure, the moving the encapsulated particle so that the failure point of the encapsulated particle matches the target location point further includes:
and placing the clamp on a laser etching machine workbench to form marks on the surfaces of the packaging particles.
In an exemplary embodiment of the present disclosure, the jig is placed on a laser etcher stage to perform a profile analysis on the mark on the surface of the encapsulated particle using a focused ion beam after the mark is formed on the surface of the encapsulated particle.
When the blocking cover is matched with the tray, the failure point of the packaged particles is matched with one positioning point on the blocking cover by moving the plurality of adjusting pieces. Therefore, the failure point to be analyzed can be positioned on the surface of the packaging particle on the premise of not damaging the surface of the packaging particle, and then the electrical failure analysis can be carried out on the failure point.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the description of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the description below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural view of a clamp according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural view of a fixture according to an embodiment of the present disclosure;
FIG. 3 isbase:Sub>A cross-sectional view of the structure of FIG. 1 at A-A;
fig. 4 is a schematic structural view of a shield cover according to an embodiment of the present disclosure.
The reference numerals of the main elements in the figures are explained as follows:
10. encapsulating the particles; 11. a tray; 12. adjusting a rod; 13. a support frame; 14. a card slot; 15. a bearing surface; 16. a blocking cover; 17. a groove; 18. a containing groove; 19. a point of failure; 20. and positioning points.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure.
The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the embodiments of the disclosure can be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the primary technical ideas of the disclosure.
When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.
The terms "a," "an," "the," and the like are used to denote the presence of one or more elements/components/parts; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc. The terms "first" and "second", etc. are used merely as labels, and are not limiting on the number of their objects.
In Failure Analysis of integrated circuit package particles, EFA (Electrical Failure Analysis) Electrical Analysis is generally used to determine the Failure point of the package in the package particles. However, the failure point to be analyzed cannot be located on the surface of the encapsulated particle without damaging the encapsulated particle, and thus the electrical failure analysis cannot be performed on the failure point.
The disclosed embodiments provide a fixture for locating a point of failure of a packaged particle. Referring to fig. 1 to 4, the jig may include a tray 11 and a blocking cover 16. Wherein the tray 11 may have a plurality of adjustment members. The shield cover 16 may have a plurality of positioning points 20, and the plurality of positioning points 20 are uniformly disposed on the shield cover 16. When the flap 16 is mated with the tray 11, the failure point 19 of the encapsulated particle 10 is matched to a locating point 20 on the flap 16 by moving the plurality of adjustment members. This allows the failure point 19 to be analyzed to be located on the surface of the encapsulated particle 10 without destroying the encapsulated particle 10, thereby allowing electrical failure analysis of the failure point 19.
The components of the clamp provided by the embodiments of the present disclosure are described in detail below with reference to the accompanying drawings:
in one embodiment of the present disclosure, the upper surface of the tray 11 may be engraved with two-dimensional coordinate axes, and any failure point 19 of the encapsulated particle 10 under the two-dimensional coordinate axes corresponds to a coordinate. The two-dimensional coordinate axis can be provided with a horizontal axis and a vertical axis, the horizontal axis and the vertical axis can be perpendicular to each other, and scales on the horizontal axis and the vertical axis can be uniformly distributed. For example, the horizontal axis of the two-dimensional coordinate axes can be divided into even 7-segment scale values, wherein each point in turn is (1,0), (2,0), (3,0), (4,0), (5,0), (6,0), or (7,0). Correspondingly, the vertical axis of the two-dimensional coordinate axes can also be divided into even 7-segment scale values, wherein each point in turn has coordinate values of (0,1), (0,2), (0,3), (0,4), (0,5), (0,6) and (0,7). In other embodiments of the present disclosure, when there are more failure points 19 of the encapsulated particle 10, the horizontal axis and the vertical axis of the two-dimensional coordinate axis may be divided into other numbers of segments of scale values, for example, the number may be 8 or 9, and the disclosure is not limited herein, and may be adjusted accordingly according to actual requirements.
Optionally, the upper portion of the tray 11 may be further provided with a card slot 14, the card slot 14 may be located inside the two-dimensional coordinate axis, and the blocking cover 16 may be capable of being snapped into the card slot 14. When the blocking cap 16 is snapped into the card slot 14, each positioning point 20 of the blocking cap 16 has a coordinate value in two dimensions. That is, one positioning point 20 can find the coordinates corresponding thereto in the two-dimensional coordinate axis. Thus, when the failure point 19 of the encapsulated particle 10 is located, when the encapsulated particle 10 is placed on the tray 11, the locating point 20 closest to the failure point 19 can be known through the encapsulation structure diagram of the encapsulated particle 10, and the locating point 20 has definite coordinates in a two-dimensional coordinate axis, and the locating of the failure point 19 of the encapsulated particle 10 can be completed only by moving the failure point 19 on the encapsulated particle 10 to the locating point 20.
Alternatively, each positioning point 20 may be carved on the cover 16 in a hollow state, so that the failure point 19 of the encapsulated particle 10 is more easily matched with the positioning point 20 on the cover 16.
Alternatively, the material of the cover 16 and the tray 11 may be ceramic, and when irradiated with X-rays, on the one hand, the specific distribution of the failure points 19 of the encapsulated particles 10 can be seen, facilitating the finding of the coordinates of the failure points 19. On the other hand, the distribution of the positioning points 20 on the shield cover 16 can be seen, so that the deviation between the failure point 19 and the positioning points 20 can be directly seen, and further, the failure point 19 can be more accurately moved to the positioning points 20.
Optionally, 12 positioning points 20 may be disposed on the blocking cover 16, and each positioning point 20 has a coordinate corresponding to a two-dimensional coordinate axis. For example, for convenience of marking, the positioning points 20 may be marked as Mark, and the coordinates of each positioning point 20 may be respectively marked as Mark1 (1,2), mark2 (2,2), mark3 (3,2), mark4 (4,2), mark5 (5,2), mark6 (6,2), mark7 (1,3), mark8 (2,3), mark9 (3,3), mark10 (4,3), mark11 (5,3), mark12 (6,3). This allows matching of the location points 20 on the flap 16 with coordinates on two-dimensional coordinate axes.
Optionally, grid lines may be engraved at the bottom of the accommodating groove 18. The grid lines may facilitate reading the coordinates of the two-dimensional coordinate axes.
In one embodiment of the present disclosure, a plurality of adjusting members may be inserted through the through holes in the side of the tray 11. Wherein, the lateral part of tray 11 can include four first sides of end to end connection in proper order, and the regulating part is worn to locate each first side. Namely: a first side may correspond to an adjustment member, the adjustment member may be located on a central axis of the first side,
optionally, the tray 11 may also be provided with protrusions, which may have a carrying surface 15, the carrying surface 15 being used to carry the encapsulated particles 10.
In other embodiments, a plurality of adjusting members may be disposed through a first side surface, so as to improve the clamping force of the clamp on the encapsulated particle 10, and improve the displacement accuracy of the adjusting members when moving the encapsulated particle 10, thereby improving the positioning accuracy of the failure point 19 of the encapsulated particle 10.
Optionally, each first side surface may be provided with a through hole, the through hole may be disposed on a central axis of the first side surface, and the adjusting member may be disposed through each first side surface via the through hole. It is noted that the number of through holes may be plural, wherein one through hole corresponds to one adjustment member.
In an embodiment of the present disclosure, the adjusting member may include an adjusting rod 12 and a supporting frame 13 connected to a top end of the adjusting rod 12, and the supporting frame 13 can drive the encapsulated particle 10 to move by being driven by the adjusting rod 12. After the coordinates of the failure point 19 on the encapsulated particle 10 are found, the adjusting rod 12 is moved, so that the support frame 13 drives the encapsulated particle 10 to move under the driving of the adjusting rod 12, the failure point 19 on the encapsulated particle 10 moves to the positioning point 20 which is closest to the failure point 19, and the positioning of the failure point 19 on the encapsulated particle 10 can be completed, so that the failure point 19 of the encapsulated particle 10 can be quickly positioned, the time cost is saved, and the working efficiency is improved.
Optionally, referring to fig. 3, a groove 17 is further formed at the bottom of the accommodating groove 18, and the supporting frame 13 can reciprocate in the groove 17. On the one hand, the recesses 17 have a guiding effect, so that the support 13 does not deviate from the direction during the displacement. On the other hand, when the adjustment lever 12 is a bolt, the freedom of the support frame is limited such that the support frame 13 can only maintain a linear motion without a rotational motion.
Optionally, the through hole may have an internal thread, the adjusting rod 12 may have an external thread, the external thread of the adjusting rod 12 may be matched with the internal thread of the through hole, and the top end of the adjusting rod 12 is rotatably connected with the supporting frame 13. When the adjusting rod 12 rotates relative to the supporting frame 13, since the external thread of the adjusting rod 12 can be matched with the internal thread of the through hole, the adjusting rod 12 can move towards the direction close to the through hole or move towards the direction far away from the through hole while rotating. When the adjusting rod 12 moves towards the direction close to the through hole, the adjusting rod 12 can drive the supporting frame 13 to clamp one side of the encapsulated particle 10.
Alternatively, the adjusting rod 12 mentioned in the present disclosure may be a bolt, the outer surface of which has an external thread, and the bolt may be matched with the internal thread of the through hole. The top end of the adjusting rod 12 can be connected with the supporting frame 13 through a bearing, when the adjusting rod 12 moves towards the direction close to the through hole, the supporting frame 13 can be kept in an immovable state due to the bearing, and then the supporting frame 13 can clamp or loosen the packaged particles 10.
In one embodiment of the present disclosure, the number of the adjusting members may be four, that is, the number of the adjusting rod 12 and the supporting bracket 13 is four. In order to locate the failure point 19 of the encapsulated particle 10, the encapsulated particle 10 is placed on the support surface 15 and clamped on its four sides by the adjusting means. The four adjustment bars 12 extend in directions perpendicular to the four sides of the encapsulated particle 10. The blocking cover 16 is then snapped into the snap groove 14, and by adjusting the moving direction of the four adjusting rods 12, a failure point 19 on the encapsulated particle 10 is matched with a positioning point 20 which is closest to the failure point 19, so that the positioning of the failure point 19 of the encapsulated particle 10 can be completed quickly, and the time cost is saved.
The embodiment of the present disclosure provides a method for positioning failure points of encapsulated particles, which is applied to the above-mentioned clamp, and the method for positioning failure points of encapsulated particles may include:
s110, placing a packaged particle 10 in a containing groove 18 of a clamp, and determining a failure point 19 coordinate of the packaged particle 10;
s120, covering the blocking cover 16 on the packaging particle 10, and selecting a target positioning point from a plurality of positioning points 20 on the blocking cover 16, wherein the target positioning point is closest to the coordinate of a failure point 19 of the packaging particle 10;
s130, moving the encapsulated particle 10, so that the failure point 19 of the encapsulated particle 10 matches with the target positioning point.
In the present disclosure, the failure point 19 of the encapsulated particle 10 can be quickly located by using the above-mentioned method for locating the failure point 19, so that the failure point 19 can be electrically analyzed.
Optionally, in step S110, determining coordinates of the failure point 19 of the encapsulated particle 10 may include; the coordinates of the failure point 19 of the encapsulated particle 10 are determined from the two dimensional coordinate axis inscribed on the upper surface of the tray 11. It is noted that the coordinates of the point of failure 19 of the encapsulated particle 10 after clamping of the encapsulated particle 10 can be directly obtained from a two-dimensional coordinate axis.
Optionally, in step S140, the adjustment member may be used to move the encapsulated particle 10, so that the failure point 19 of the encapsulated particle 10 moves to the vicinity of the positioning point 20, and then under the irradiation of the X-ray, since the material of the blocking cover 16 is ceramic, the X-ray may penetrate the blocking cover 16, so as to see the deviation between the failure point 19 of the encapsulated particle 10 below the blocking cover 16 and the target positioning point. At this point, the conditioning element may continue to be used to move encapsulated particle 10, thereby reducing the deviation of encapsulated particle 10 failure point 19 from the target setpoint. This enables the failure point 19 of the encapsulated particle 10 to be accurately moved to the target positioning point without damaging the surface of the encapsulated particle 10.
Optionally, after the failure point 19 of the encapsulated particle 10 is matched with the target positioning point on the blocking cover 16, the fixture may be placed under a laser etching machine, and laser can be etched on the surface of the encapsulated particle 10 through the target positioning point on the blocking cover 16, so that the focused ion beam can be used to perform the top profile analysis on the surface of the encapsulated particle 10. Due to the existence of the positioning point 20 on the blocking cover 16, the failure point 19 of the packaging particle 10 is not easy to be cut excessively during laser etching, so that the time cost of fixed-point profile analysis is saved, and the analysis efficiency is improved.
It is noted that after the failure point 19 of the encapsulated particle 10 is matched with the target anchor point, the failure point 19 of the encapsulated particle 10 is located at one side of the target anchor point.
In an embodiment of the present disclosure, the method for locating the failure point of the encapsulated particle may further include:
s210, placing the packaged particles 10 in a containing groove 18;
s220, controlling the adjusting piece to enable a supporting frame 13 of the adjusting piece to clamp the packaged particles 10;
s230, matching the blocking cover 16 with the clamping groove 14, and covering the blocking cover 16 on the packaged particles 10;
s240, the encapsulated particle 10 is moved so that the failure point 19 of the encapsulated particle 10 matches the target location point.
It should be noted that although the various steps of the methods of the present disclosure are depicted in the drawings in a particular order, this does not require or imply that these steps must be performed in this particular order, or that all of the depicted steps must be performed, to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions, etc., are all considered part of this disclosure.
It is to be understood that the disclosure is not limited in its application to the details of construction and the arrangements of the components set forth in the specification. The disclosure is capable of other embodiments and of being practiced and carried out in various ways. The foregoing variations and modifications are within the scope of the present disclosure. It should be understood that the disclosure disclosed and defined in this specification extends to all alternative combinations of two or more of the individual features mentioned or evident from the text and/or drawings. All of these different combinations constitute various alternative aspects of the present disclosure. The embodiments of this specification illustrate the best mode known for carrying out the disclosure and will enable those skilled in the art to utilize the disclosure.
Claims (20)
1. A fixture for use in encapsulating the location of a particle failure point, the fixture comprising:
a tray having a plurality of adjustment members;
the accommodating groove is formed in the tray and used for accommodating the packaging particles;
the retaining cover is provided with a plurality of positioning points, and the positioning points are uniformly arranged on the retaining cover;
when the blocking cover is matched with the tray, the plurality of adjusting pieces are moved to enable the failure point of the packaged particles to be matched with one positioning point on the blocking cover.
2. The fixture of claim 1, wherein the upper surface of the tray is inscribed with two-dimensional coordinate axes in which the failure point of the encapsulated particle is coordinated.
3. The clamp according to claim 2, wherein a clamping groove is further formed in the upper portion of the tray, the clamping groove is located on the inner side of the two-dimensional coordinate axis, and the blocking cover can be clamped into the clamping groove;
when the blocking cover is clamped into the clamping groove, each positioning point of the blocking cover has coordinates under the two-dimensional coordinate axis.
4. The fixture according to claim 3, wherein the bottom of the receiving groove is engraved with evenly distributed grid lines.
5. The clamp of claim 1, wherein a plurality of said adjustment members are provided through holes in the sides of said tray.
6. The clamp of claim 5, wherein the sides of the tray include four first sides connected end to end in sequence, the adjustment member being disposed through the first sides.
7. The clamp of claim 6, wherein the adjustment member is located on a central axis of the first side.
8. The clamp of claim 5, wherein the adjusting member comprises an adjusting rod and a supporting frame connected to the top end of the adjusting rod, and the supporting frame can drive the encapsulated particles to move under the driving of the adjusting rod.
9. The clamp of claim 8, wherein the through hole has an internal thread, the adjusting rod has an external thread, and the top end of the adjusting rod is rotatably connected with the supporting frame.
10. The clamp of claim 9, wherein the adjusting rod is a bolt, and the top end of the adjusting rod is connected with the supporting frame through a bearing.
11. The clamp of claim 10, wherein the bottom of the receiving slot is further formed with a groove, and the support frame is capable of reciprocating in the groove.
12. The fixture of claim 1, wherein the material of the tray and the flap is ceramic.
13. The fixture according to claim 1, wherein each of the positioning points is engraved in the cover.
14. A method for positioning a failure point of a packaged particle, which is applied to the jig of any one of claims 1 to 13, the method comprising:
placing the packaged particles in a containing groove, and determining the coordinates of failure points of the packaged particles;
covering a blocking cover on the packaging particles, and selecting a target positioning point from a plurality of positioning points on the blocking cover, wherein the target positioning point is closest to the coordinate of the failure point of the packaging particles;
and moving the packaging particles to enable the failure points of the packaging particles to be matched with the target positioning points.
15. The method of claim 14, wherein determining coordinates of the encapsulated particle failure point comprises:
and determining the coordinates of the failure points of the packaged particles according to the two-dimensional coordinate axis carved on the upper surface of the tray.
16. The method of claim 14, wherein the method of locating a failure point of encapsulated particles further comprises:
placing the packaged particles in the accommodating groove;
controlling the regulating member so that a supporting frame of the regulating member clamps the encapsulated particles;
matching the blocking cover with a clamping groove formed in the upper part of the tray, wherein the blocking cover covers the packaged particles;
and controlling the regulating piece to enable the failure point of the encapsulated particles to be matched with the target positioning point.
17. The method of claim 14, wherein the method further comprises:
and moving the encapsulated particles under X-ray so that the failure points of the encapsulated particles are matched with the target positioning points.
18. The method of claim 14, wherein the method further comprises the step of determining the failure point of the encapsulated particle,
after the failure point of the encapsulated particle is matched with the target positioning point, the failure point of the encapsulated particle is positioned on one side of the target positioning point.
19. The method of claim 14, wherein the moving the encapsulated particle so that the encapsulated particle failure point matches the target location point, further comprises:
and placing the clamp on a laser etching machine workbench to form marks on the surfaces of the packaging particles.
20. The method of claim 19, wherein the fixture is placed on a laser etcher table to perform profile analysis on the mark on the surface of the encapsulated particle by using a focused ion beam after the mark is formed on the surface of the encapsulated particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111031408.1A CN115763285A (en) | 2021-09-03 | 2021-09-03 | Clamp and method for positioning failure point of packaging particles |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111031408.1A CN115763285A (en) | 2021-09-03 | 2021-09-03 | Clamp and method for positioning failure point of packaging particles |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115931423A (en) * | 2023-03-14 | 2023-04-07 | 合肥晶合集成电路股份有限公司 | Slicing method and slicing device for failure point position of semiconductor chip |
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2021
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115931423A (en) * | 2023-03-14 | 2023-04-07 | 合肥晶合集成电路股份有限公司 | Slicing method and slicing device for failure point position of semiconductor chip |
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