CN115751763A

CN115751763A - Semiconductor refrigeration module and optical beauty instrument

Info

Publication number: CN115751763A
Application number: CN202211473227.9A
Authority: CN
Inventors: 周莹; 李兵
Original assignee: Shenzhen Jiayukang Medical Instrument Co ltd
Current assignee: Shenzhen Jiayukang Medical Instrument Co ltd
Priority date: 2022-10-17
Filing date: 2022-11-21
Publication date: 2023-03-07
Also published as: CN116817649A; CN218673284U; CN219071858U; CN219243958U

Abstract

The invention relates to a semiconductor refrigeration module and an optical beauty instrument, wherein the semiconductor refrigeration module comprises a semiconductor refrigeration sheet for refrigerating the optical beauty instrument, and the semiconductor refrigeration sheet comprises a middle galvanic couple layer, and hot surfaces and cold surfaces at two ends; the method is characterized in that: the semiconductor refrigeration module comprises a heat conduction structure and a heat radiating fin; the heat conducting structure comprises a VC temperature equalizing plate or an aluminum superconducting pipe; the heat conducting structure is respectively connected with the heat radiating fins and the hot surfaces of the semiconductor refrigerating fins in a rapid heat transfer mode, so that the hot surfaces can dissipate heat rapidly. The optical beauty instrument adopts the semiconductor refrigeration module to refrigerate the working surface of the beauty instrument, and the heat pipe is connected between the cold surface of the semiconductor refrigeration piece and the working surface, so that quick cold conduction can be realized.

Description

Semiconductor refrigeration module and optical beauty instrument

Technical Field

The invention relates to the field of beauty equipment, in particular to a semiconductor refrigeration module and an optical beauty instrument.

Background

The light source component generates light waves which are emitted from a light-emitting window of a working head part of the optical beauty instrument so as to carry out beauty treatment on the skin surface contacted (or not directly contacted) with the end face of the working head part, such as functions of depilation, skin tendering, speckle removal, inflammation diminishing, blood vessel softening, wrinkle removal, skin reddening, acne treatment, vascular lesion treatment, pigment lesion treatment and the like. Some portable or handheld optical beauty instruments on the market at present have poor heat dissipation effect inside the machine body, influence the work of the beauty instrument and fail to achieve the expected beauty effect; the internal structure of the machine body is complex, the refrigerating effect of the working surface is poor, skin burning is caused, and the user experience is poor.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: provides a semiconductor refrigeration module and an optical beauty instrument, which solves the problems of heat dissipation and working surface refrigeration of the existing optical beauty instrument.

In order to solve the technical problems, the invention adopts the following technical scheme:

a semiconductor refrigeration module comprises a semiconductor refrigeration piece, a heat insulation layer and a heat insulation layer, wherein the semiconductor refrigeration piece is used for refrigerating an optical beauty instrument and comprises a middle galvanic couple layer, and hot surfaces and cold surfaces at two ends; the method is characterized in that: the semiconductor refrigeration module comprises a heat conduction structure and a radiating fin; the heat conduction structure comprises a VC temperature equalizing plate or an aluminum superconducting pipe; the heat conducting structure is respectively connected with the heat radiating fins and the hot surfaces of the semiconductor refrigerating fins in a rapid heat transfer mode, so that the hot surfaces can dissipate heat rapidly.

Furthermore, two ends of the aluminum superconducting plate or the aluminum superconducting pipe are sealed, and working liquid is packaged inside the aluminum superconducting plate or the aluminum superconducting pipe; more than two thin bone-shaped microgrooves are formed on the inner wall of the aluminum superconducting plate or the aluminum superconducting pipe; and a microporous structure is formed in the aluminum superconducting plate or the aluminum superconducting pipe material.

Preferably, the heat conducting structure comprises a plurality of aluminum superconducting plates or aluminum superconducting pipes, the aluminum superconducting plates or the aluminum superconducting pipes are single pipes, and a single channel is formed inside the aluminum superconducting plates or the aluminum superconducting pipes; the aluminum superconducting plate or the aluminum superconducting pipe is bent in a plane or in a special-shaped 3D manner and is matched with the installation space; the heat conduction structure further comprises a heat conduction plate, the plurality of aluminum superconducting plates or aluminum superconducting pipes are combined with the heat conduction plate, and the plurality of aluminum superconducting plates or aluminum superconducting pipes are arranged to comprise at least two different directions or angles so as to reduce the effect of the antigravity direction, so that the heat conduction effect is poor.

In some embodiments, the heat conducting plate is provided with a plurality of slots, the aluminum superconducting plates or tubes are matched with the slots and are correspondingly arranged in the slots, and the wall surfaces are contacted with each other to realize rapid heat transfer; the aluminum superconducting plate or the aluminum superconducting pipe is welded or riveted with the slot to increase the contact area; the semiconductor refrigeration piece is arranged on the heat conducting plate: the hot surface of the semiconductor refrigeration sheet is attached to the outer wall of the heat conducting plate, so that the heat of the hot surface is directly conducted to the heat conducting plate; or the hot surface of the semiconductor refrigeration sheet is arranged on the outer wall of the heat conducting plate through the heat conducting piece, and the heat of the hot surface is quickly conducted to the heat conducting plate through the heat conducting piece; or the heat conducting plate is used as a hot surface, a hot end circuit of the semiconductor refrigerating sheet is arranged on the heat conducting plate, and the hot end circuit is welded and electrically connected with the PN galvanic couple particles of the galvanic couple layer; the plurality of aluminum superconducting plates or aluminum superconducting pipes use two different directions or angles on an XY plane, or have a certain angle of intersecting line form, or annular or staggered or circulating design.

In some embodiments, the heat sink comprises one or more sets of fins of thermally conductive material; the heat conducting plate is arranged in the groove on the radiating fin or at the top of the radiating fin, or the radiating fin and the heat conducting plate are arranged on the other heat conducting part; the heat conducting plate is a metal plate.

In some embodiments, the semiconductor chilling plate is disposed on the VC temperature-uniforming plate: the hot surface of the semiconductor refrigerating sheet is in contact with the VC temperature equalizing plate to quickly transfer heat; or the heat is quickly conducted between the hot surface and the temperature equalizing plate through the heat conducting piece; or the VC temperature equalizing plate is directly used as the hot surface of the semiconductor refrigerating sheet, and a hot end circuit of the semiconductor refrigerating sheet is arranged on the VC temperature equalizing plate and is welded and electrically connected with PN galvanic couple particles of the galvanic couple layer; the heat radiating fins are arranged on the VC temperature-equalizing plate to increase the heat radiating area of the VC; the heat sink is one or more groups of heat conducting material fins.

In some embodiments, the fan housing comprises an upper shell, a lower shell, and a middle surround bone; the VC temperature-equalizing plate is arranged on the surrounding bone or the surrounding bone is of a VC temperature-equalizing plate structure, and the inner wall of the surrounding bone is provided with a radiating fin structure so as to increase the radiating area; or the VC temperature-equalizing plate is arranged as an upper shell or a lower shell of the fan shell and is covered at the top opening or the bottom opening of the annular enclosure; the VC temperature-equalizing plate is an annular flat plate, and a central through hole of the annular flat plate forms a ventilation opening of the fan; the radiating fins and the fan are respectively positioned on two sides of the VC temperature-equalizing plate; the ventilation channel of the radiating fin is communicated with the central through hole and the ventilation channel of the fan; the radiating fins cover the central through hole, or the radiating fins are arranged along the annular edge of the VC temperature-equalizing plate.

In some embodiments, the fan housing comprises an upper shell, a lower shell, and a middle collarbone; the inner wall of the surrounding bone is provided with a radiating fin structure to increase the radiating area; the VC temperature-equalizing plate is arranged as an upper shell or a lower shell of the fan shell and is covered at the top opening or the bottom opening of the annular enclosure; the VC temperature-equalizing plate is an annular flat plate, and a central through hole of the annular flat plate forms a ventilation opening of the fan; the radiating fins and the fan are respectively positioned on two sides of the VC temperature-uniforming plate; the ventilation channel of the radiating fin is communicated with the central through hole and the ventilation channel of the fan; the radiating fins cover the central through hole, or the radiating fins are arranged along the annular edge of the VC temperature-equalizing plate; or the VC temperature-equalizing plate is arranged on the surrounding bone.

The invention provides an optical beauty instrument, which comprises a machine body provided with a plurality of ventilation openings, wherein a light source component, a power supply component and a control circuit board are arranged in the machine body; the light source component and the power supply component are electrically connected with the control circuit board; a plurality of ventilation openings of the machine body are used for air inlet and air outlet and form a ventilation channel with the space in the machine body; the front end of the machine body is a working surface; the semiconductor refrigeration module is further arranged in the machine body and used for refrigerating the working face.

In some embodiments, the semiconductor refrigeration module comprises a first cold conducting piece connected between the cold surface of the semiconductor refrigeration piece and the working surface; the first cold conducting piece is a copper pipe, an aluminum superconducting plate, a heat pipe or VC; the semiconductor refrigeration module also comprises a fan; the fan comprises a shell and rotating fan blades in the shell; the heat sink and the fan are located in the ventilation passage.

In some embodiments, the semiconductor refrigeration module comprises a second cold guide, which is arranged between the first cold guide and the working surface and is connected with the first cold guide in a rapid heat transfer manner; the second cold conducting piece is a copper pipe, an aluminum superconducting plate, a heat pipe or VC; the second cold guide piece is annular and is used for conducting cold to the periphery of the working surface in a contact manner; the first cold guide piece comprises a ring shape and is in adaptive contact with the second cold guide piece for cold guide, and two ends of the first cold guide piece extend from the ring shape and are connected with the cold surface of the semiconductor chilling plate in a rapid heat transfer mode; the light source assembly comprises a lamp tube and a reflection cup, the ventilation channel inside the reflection cup is communicated with the ventilation channel of the fan, and is communicated with the ventilation channel in the machine body to form a heat dissipation ventilation channel of the light source assembly, and the fan promotes the heat dissipation of the light source assembly.

In some embodiments, the light source assembly includes a lamp tube and a reflecting cup, the ventilation channel inside the reflecting cup is communicated with the ventilation channel of the fan and the ventilation channel inside the body to form a heat dissipation ventilation channel of the light source assembly, and the fan promotes the heat dissipation of the light source assembly; a radiator or a heat conducting piece is arranged on one side of the reflecting cup; the heat sink or the heat conducting member is located at the vent of the fan.

In some embodiments, a plurality of ventilation openings are formed on the housing of the fan, wherein one ventilation opening is provided with the heat conducting piece of the reflector cup, and the ventilation channel of the fan is communicated with the ventilation channel in the machine body to form a first ventilation channel for radiating heat of the heat conducting piece of the reflector cup and the VC temperature-equalizing plate; the other ventilation opening of the fan is communicated with the air channel in the reflecting cup, and the ventilation channel of the fan is communicated with the ventilation channel in the machine body to form a second ventilation channel which is used for radiating heat for the reflecting cup and the lamp tube.

In some embodiments, the optical cosmetic is a depilatory instrument, a photon skin rejuvenation instrument, an import export cosmetic instrument, or a radio frequency cosmetic instrument.

The invention has the beneficial effects that:

the semiconductor refrigeration module is respectively connected with the heat radiating fins and the hot surfaces of the semiconductor refrigeration fins in a quick heat transfer mode through the VC temperature equalizing plates or the aluminum superconducting pipes, so that the hot surfaces can radiate heat quickly.

The optical beauty instrument of the invention adopts the semiconductor refrigeration module to refrigerate the working surface, so that the refrigeration effect is better.

Furthermore, the semiconductor refrigeration module is used for heat dissipation of the light source component, and heat dissipation efficiency is effectively improved.

In other embodiments, the optical beauty instrument of the present invention uses the hot surface of the semiconductor cooling sheet disposed on the outer wall of the VC temperature-equalizing plate, or the VC temperature-equalizing plate is directly used as the hot surface of the semiconductor cooling sheet, and the VC temperature-equalizing plate is used in combination with the fan 18 to cool the working surface and radiate the light source assembly, so as to effectively improve the heat radiation efficiency in the instrument body and the cooling efficiency of the working surface, improve the beauty effect, improve the use experience, and have a simple internal structure.

The present invention is described in further detail below with reference to the attached drawing figures.

Drawings

Fig. 1 is a perspective view of an optical beauty instrument according to a first embodiment of the present invention.

Fig. 2 is a perspective view of the optical beauty instrument according to the first embodiment of the present invention with the upper case removed.

Fig. 3 is a schematic view of the internal structure of the optical beauty instrument according to the first embodiment of the present invention.

Fig. 4 is a schematic view of an air duct of the optical beauty instrument according to the first embodiment of the present invention.

Fig. 5 is a schematic view of another embodiment of the vent of the optical cosmetic instrument of the present invention.

Fig. 6 is a schematic view of an internal air duct of the optical beauty instrument in the embodiment shown in fig. 5.

Fig. 7 is an exploded view of the optical beauty instrument of the embodiment shown in fig. 1.

Fig. 8 is a schematic structural diagram of a semiconductor refrigeration module according to a first embodiment of the present invention.

Fig. 9 is a perspective view of a semiconductor refrigeration module according to a first embodiment of the present invention.

Fig. 10 is a partially exploded view of the semiconductor refrigeration module of the present invention.

Fig. 11 is a perspective view of the semiconductor refrigeration module of the present invention.

Fig. 12 is a partial exploded view of the semiconductor refrigeration module of the present invention.

Fig. 13 is a schematic view of a part of the semiconductor refrigeration module according to the present invention.

Fig. 14 is a schematic diagram of an alternative structure of the semiconductor refrigeration module according to the first embodiment of the present invention, wherein fig. 14 (a) and 14 (b) are respectively shown in different viewing angles.

Fig. 15 is a schematic structural diagram of an alternative embodiment of the semiconductor refrigeration module of the present invention, wherein fig. 15 (a) and 15 (b) are different embodiments, respectively.

Fig. 16 is a perspective view of an optical beauty instrument according to a second embodiment of the present invention.

Fig. 17 is a perspective view of the optical beauty instrument according to the second embodiment of the present invention with the upper case removed.

Fig. 18 is a schematic view of the internal structure of the optical beauty instrument of the second embodiment of the present invention.

Fig. 19 is an exploded view of an optical beauty instrument according to a second embodiment of the present invention.

Fig. 20-22 are schematic structural diagrams of a second embodiment of the semiconductor refrigeration module according to the invention.

Fig. 23 isbase:Sub>A schematic structural view of an aluminum superconducting plate or an aluminum superconducting tube of the semiconductor refrigeration module according to the embodiment of the present invention, in which fig. 23 (base:Sub>A) isbase:Sub>A perspective view ofbase:Sub>A single aluminum superconducting plate or aluminum superconducting tube, and fig. 23 (b) isbase:Sub>A sectional view of fig. 23 (base:Sub>A) taken alongbase:Sub>A-base:Sub>A.

Fig. 24-26 are schematic structural diagrams of a semiconductor refrigeration module according to a third embodiment of the invention.

Fig. 27 is a perspective view of the optical beauty instrument of the third embodiment of the present invention with the front case removed.

Fig. 28 is a perspective view of the optical beauty instrument according to the fourth embodiment of the present invention with the front case removed.

Detailed Description

It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict, and the present invention is further described in detail with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1-28, the present invention provides a semiconductor refrigeration module 1 and an optical beauty instrument, wherein the semiconductor refrigeration module 1 comprises a semiconductor refrigeration sheet 10 for refrigeration of the optical beauty instrument, the semiconductor refrigeration sheet 10 comprises a middle galvanic couple layer, and a hot surface 11' and a cold surface 13 at two ends; the semiconductor refrigeration module further comprises a heat conducting structure 19 and a heat radiating fin 16; the heat conducting structure 19 comprises a VC temperature equalizing plate 11 or an aluminum superconducting plate or an aluminum superconducting pipe 191; the heat conducting structure is connected with the heat sink 16 and the hot side 11' of the semiconductor chilling plate 10 in a rapid heat transfer manner, so that the hot side can dissipate heat rapidly.

Two ends of the aluminum superconducting plate or the aluminum superconducting tube 191 are sealed, and working liquid is packaged inside the aluminum superconducting plate or the aluminum superconducting tube; more than two fine bone-shaped microgrooves 1911 are formed on the inner wall; a microporous structure 1912 is formed within the aluminum superconducting plate or aluminum superconducting tube material.

Referring to fig. 1 to 19, an embodiment of the present invention relates to an optical beauty instrument 100, which includes a body provided with a plurality of ventilation openings 111, wherein the plurality of ventilation openings 111 can be disposed at different or the same position of a housing 110, and disposed in different forms, including but not limited to: the ventilation openings can be one or more than one in the form of honeycomb holes, slits, notches and the like formed on the shell 110, and the function of realizing that cold air or air of the environment enters the inside of the machine body from the ventilation openings, takes away heat inside the machine body and is discharged out of the machine body from the ventilation openings. The semiconductor refrigeration module 1, the light source assembly 2, the power supply assembly 3 and the control circuit board 4 are arranged in the machine body. The light source component 2 and the power supply component 3 are electrically connected with the control circuit board 4; the ventilation openings 111 of the fuselage are used for air inlet and outlet and form ventilation channels (such as the lines shown by the scissors in fig. 4-6) with the space in the fuselage to realize heat dissipation in the fuselage. The front end of the body is a working surface 113, the working surface 113 can be directly contacted with the skin, and the light generated by the light source component 2 is transmitted to the working surface 113 to be emitted out to carry out the beauty treatment on the skin.

Referring to fig. 8 to 14, the semiconductor refrigeration module 1 according to the embodiment of the present invention is mainly used for refrigerating the working surface 113 of the optical beauty instrument to achieve a cold compress effect on the skin. The semiconductor refrigeration module 1 comprises a semiconductor refrigeration piece 10, wherein the semiconductor refrigeration piece 10 comprises a middle galvanic couple layer 12, and a hot surface 11' and a cold surface 13 at two ends. The middle galvanic couple layer 12 is an internal circuit formed by arranging and electrically connecting PN galvanic couple particles according to a hot end circuit arranged on a hot surface and a cold end circuit arranged on a cold surface, and is controlled by an anode and a cathode electrically connected with the control circuit board 4 or an independent circuit to control the semiconductor refrigerating sheet to work. In particular embodiments, the cooling plate 10 (particularly the cold side 13) may be used directly as the work surface 113 or to cool the work surface 113. When the refrigeration sheet 10 is directly used as a working surface, the skilled person can set the adaptive shape, such as a transparent crystal or a ring shape, etc., according to the needs. When the cooling fins 10 are used to cool the working surface 113, the cooling surface 13 of the cooling fins 10 is in contact with the working surface 113, for example, is disposed around the working surface. Alternatively, the cold side 13 of the cooling plate 10 and the working surface 113 are in contact with the working surface 113 through a heat transfer element (or heat conducting member). The cold conducting piece (first cold conducting piece) 15 is a heat transfer structural piece, and can quickly transfer the heat of the working surface to the semiconductor refrigerating piece, so that the effect of refrigerating the working surface is realized. The heat transfer structure may be a thermally conductive material such as (without limitation) a thermally conductive element made of a metallic material such as (without limitation) a copper tube or plate, etc.; alternatively, the heat transfer structure may be a heat pipe (heat pipe) or a vapor chamber (vapor chamber) or other heat transfer component capable of transferring heat. The heat pipe (heat pipe) or vapor chamber (vapor chamber) or other heat transfer element connecting the semiconductor cooling plate (cold surface) and the working surface can be designed to have a shape adapted to the principle of rapid heat dissipation according to the shape of the semiconductor cooling plate 10, in particular according to the shape of the cold surface 13 and the shape of the working surface 113. The working surface 113 may be made of a transparent crystal or other light-transmitting material. The working surface 113 may also be annular, and the annular central through hole is transparent, and is not limited by material.

The heat pipe (heat pipe) or the vapor chamber (vapor chamber) utilizes the heat conduction principle and the rapid heat transfer property of the refrigeration medium to rapidly transfer the heat of the heat generating object out of the heat source through the heat pipe. The heat is transferred by evaporation and condensation of liquid in the totally-enclosed vacuum tube or the vacuum plate, the refrigeration effect is achieved by utilizing fluid principles such as capillary action and the like, and the heat pump has a series of advantages of high heat conductivity, excellent isothermality, heat flow density variability, heat flow direction reversibility and the like. The heat exchanger composed of the heat pipe (heat pipe) or the vapor chamber (vapor chamber) has the advantages of high heat transfer efficiency, compact structure, small fluid resistance loss and the like.

Referring to fig. 7-11 in combination, as a preferred embodiment, the cold side 13 and the working side 113 of the refrigeration sheet 10 rapidly transfer heat on the working side 113 or ambient heat of the working side to the refrigeration sheet 10 (the cold side 13) through the cold conducting member 15, i.e. the heat pipe, to dissipate the heat, and the heat is rapidly transferred to the refrigeration sheet. Depending on the shape of the working surface 113 and the desired cooling effect, the end of the heat transfer element (heat pipe) 15 in contact with the working surface 113 may be designed as a ring, and is in close contact with the periphery of the working surface to quickly absorb heat from the working surface 113 or the environment around the working surface 113; depending on the shape of the refrigeration plate 10 or the cold side 13, the end of the heat transfer element (heat pipe) 15 in contact with the refrigeration plate 10 can be designed as: the two ends of the metal pipe are bent from the ring shape and extend for a preset length to be placed on the cold surface 13 of the refrigerating sheet and tightly contacted with the cold surface 13.

The heat generated by the hot surface 11' of the semiconductor refrigerating sheet 10 is discharged out of the body through a ventilation channel in the body. Preferably, the semiconductor cooling plate 10 enhances the heat dissipation effect through a heat sink. The radiator comprises a VC temperature-uniforming plate 11 and radiating fins 16 arranged on the VC temperature-uniforming plate 11, wherein the hot surface 11' of the semiconductor refrigerating fin is arranged on the outer wall of the VC temperature-uniforming plate 11, or the VC temperature-uniforming plate 11 is directly used as the hot surface of the semiconductor refrigerating fin. The VC temperature equalization plate 11 is used for heat dissipation of the refrigeration sheet 10. The VC temperature-uniforming plate 11 is positioned in a ventilation channel of the machine body; the refrigeration piece 10 is arranged on the VC temperature-uniforming plate 11, and the hot surface 11' of the semiconductor refrigeration piece is attached to the outer wall of the VC temperature-uniforming plate, so that the heat of the hot surface is directly conducted to the VC temperature-uniforming plate 11; or the hot surface 11 'of the semiconductor refrigeration sheet is arranged on the outer wall of the VC temperature-uniforming plate through the heat-conducting piece, and the heat of the hot surface 11' is quickly conducted to the VC temperature-uniforming plate 11 through the heat-conducting piece; or a hot end circuit of the semiconductor refrigerating sheet is arranged on the VC temperature-uniforming plate 11 and is welded and electrically connected with PN galvanic couple particles of the galvanic couple layer 12. The VC temperature equalization plate 11 is a closed flat plate cavity formed by a bottom plate, a frame and a cover plate, and a capillary structure and a working fluid are arranged in the cavity. By way of non-limiting example, one end of the VC temperature-uniforming plate 11 forms an extension platform for arranging or mounting the semiconductor chilling plate 10, the area of the VC temperature-uniforming plate 11 is larger than that of the galvanic couple layer 12 and the cold surface 13, so that the hot surface 11' of the semiconductor chilling plate has the extended VC temperature-uniforming plate 11, and the heat dissipation area is increased.

The heat sink further comprises heat dissipation fins 16 arranged on the VC temperature equalization plate 11 to increase the heat dissipation area of VC. The heat sink 16 may be disposed on the upper surface or the lower surface or both surfaces of the VC temperature equalization plate 11 according to the heat dissipation requirement of the product. Preferably, the VC vapor chamber 11 is located behind the ventilation opening of the fuselage; the heat radiating fins on the VC temperature equalizing plate 11 face the ventilation opening 111 of the fuselage. The heat sink 16 is one or more groups of heat conductive material fins, and the position, number and arrangement of the heat sink can be set according to the internal space of the beauty instrument. Referring to fig. 10-15, on the surface of the VC temperature-uniforming plate 11, the heat dissipation fins 16 are a set of parallel linear heat dissipation fins arranged in a matrix; or, the VC temperature-uniforming plate 11 is a fan rib, the heat sink 16 is a set of curved heat sink fins on the inner wall of the spiral fan rib (fig. 15 (a)), and the air channel and the spiral direction of the fan rib are the same; alternatively, the heat sink 16 is a group of heat dissipating fins arranged in a circular matrix, and the heat dissipating fins may be arranged in a straight radiation direction or in a rotation direction at an angle (fig. 15 (b)).

The semiconductor refrigeration module 1 of the present invention further comprises a fan 18, and the fan 18 is located in the ventilation channel of the body and is used for enhancing the heat dissipation (refrigeration) efficiency. The fan 18 comprises a fan shell 180 and rotary fan blades 181 arranged in the cavity inside the shell, and the fan shell 180 is provided with a plurality of openings as a plurality of ventilation openings 182 of the fan 18; the plurality of ventilation openings 182 of the fan 18 are used for air intake and air outtake, and are communicated with the inner cavity of the fan housing 180 to form a ventilation channel of the fan 18, and communicated with a ventilation channel in the machine body. The VC temperature equalization plate 11 may be part of the fan housing 180 or mounted to the fan housing 180. The VC temperature equalization plate 11 and the heat sink 16 are cooled by the air channel of the fan 18, which promotes air flow to improve heat dissipation efficiency.

The VC temperature equalization plate 11 may be provided as part of the housing of the fan 18. The fan 18 housing includes an upper shell, a lower shell 184, and a central surround 183. The inner wall of the surrounding bone 183 can be provided with heat dissipation teeth to increase the heat dissipation area of the VC temperature equalization plate 11. As shown in fig. 12-14, the VC temperature-uniforming plate 11 is used as the upper shell (or lower shell) of the fan housing to cover the top (or bottom) of the ring-shaped enclosure; the VC temperature-uniforming plate 11 can be arranged as an annular flat plate, and a central through hole of the annular flat plate forms a ventilation opening of the fan 18; the heat dissipation fins 16 are a group of parallel heat dissipation fins covering the central through hole, and the air passages between the heat dissipation fins are communicated with the central through hole of the VC temperature equalization plate 11 and the internal cavity of the fan housing.

Referring to fig. 15 (b), the structure is different from that shown in fig. 12 to 14 in that the heat dissipation fins are arranged at the annular edge of the central through hole of the VC temperature equalization plate 1, radially arranged or all rotated by a certain angle.

Referring to fig. 15 (a), the VC temperature-uniforming plates 11 serve as the ribs outside the fan blades, the heat sink 16 may be disposed on the inner wall of the ribs, and the semiconductor cooling fins 10 may be disposed on the outer wall of the ribs.

The semiconductor refrigeration module is also used for radiating the light source component 2. The light source assembly 2 includes a lamp tube 20, a reflector 21 outside the lamp tube, and electrode pads 23 at two ends of the lamp tube, wherein the lamp tube 20 is preferably an IPL lamp tube and generates IPL photons. The air duct of light source subassembly 2 and the air duct intercommunication of fan 18, and with in the fuselage the air duct intercommunication forms the heat dissipation air duct of light source subassembly 2, promotes the heat dissipation of light source subassembly 2 by fan 18. The reflector may be provided with a heat conducting member 22 on one side, such as (but not limited to) the heat conducting member 22 being a set of heat conducting fins (made of heat conducting material), one end of the heat conducting member being connected to the outer wall of the reflector, and the other end of the heat conducting member extending to the ventilation opening 182 of the fan 18. A plurality of ventilation openings 182 are formed in the casing of the fan 18, specifically, on the periphery of the frame outside the fan blades, as shown in fig. 13, three ventilation openings 182 are formed in the periphery, one (first) ventilation opening is provided with the heat conducting member of the reflector cup, and the ventilation passage in the casing is communicated with the ventilation passage in the casing to form a first ventilation passage 101 (refer to the shear mark line in fig. 4) for dissipating heat to the heat conducting member 22 of the reflector cup and the VC temperature equalizing plate 11, at this time, external air or cold air enters from the casing ventilation opening 111 opposite to the heat dissipating fin 16 (including but not limited to a set of honeycomb holes and the slits of the casing), enters the fan 18 from the central through hole of the temperature equalizing plate 11 through the heat dissipating fin 16 and the VC temperature equalizing plate 11, and flows through the heat conducting member 22 of the reflector cup and the VC temperature equalizing plate 11 by rotating the fan blades, and takes heat of the reflector cup 21 and the VC temperature equalizing plate 11 out of the fan from the other (second) ventilation opening 182 on the periphery of the fan, and the ventilation passage in the casing (including but not limited to the heat dissipating heat conducting member and the heat dissipating heat radiating fins) out of the casing 22 and the heat radiating fin. The third air vent 182 on the fan rib is communicated with the air channel inside the lamp tube, and the air channel of the fan 18 is communicated with the air channel inside the body to form a second air channel 102 for dissipating heat to the reflector cup 21 and the lamp tube 20. At this time, external air or cold air enters from the ventilation opening 111 of the housing opposite to the heat sink 16, passes through the heat sink 16 and the VC temperature-uniforming plate 11, enters into the fan 18 from the central through hole of the temperature-uniforming plate 11, and is discharged out of the fan through another ventilation opening 182 on the fan surrounding rib by the rotating fan blades and enters into the reflective cup 21, so as to take away heat of the lamp tube 20 and the reflective cup inside the reflective lamp and discharge out of the lamp tube, and is discharged out of the housing through the ventilation opening 111 at the end of the housing through the ventilation channel inside the housing, thereby further promoting heat dissipation of the lamp tube 20 and the reflective cup 21.

The ventilation opening 111 on the beauty instrument body shell can be arranged at different positions and with different hole structures, for example, as shown in fig. 5-6, the ventilation openings are respectively arranged on the lower shell and the side surface of the body, the ventilation openings on the side surface are used as the outlets of the first ventilation channel 101 and the second ventilation channel 102, and the ventilation channel in the body is correspondingly communicated with the ventilation opening 111 on the side surface.

The optical beauty instrument 100 of the present invention employs the semiconductor refrigeration module 1 of each of the above embodiments to refrigerate the working surface 113 of the head of the body, and the fan of the semiconductor refrigeration module 1 can also be used as the heat radiation of the light source assembly 2. The optical beauty treatment device can be a depilating device, a photon skin tendering device, a leading-in and leading-out beauty treatment device, a radio frequency beauty treatment device and the like, and the semiconductor refrigeration module of the embodiment can be adopted.

The cosmetic apparatus 100 shown in fig. 1-7 is illustrated as a bar-type whole machine, and may be used as an IPL photon depilator. Referring to fig. 1-19, an embodiment of the invention relates to an optical beauty instrument 100, which includes a housing 110 having a plurality of ventilation openings 111. The housing 110 includes an upper shell 112 and a lower shell 118, which are fastened to each other and form a cavity inside the body. An upper bracket 114 and a lower bracket 115 are further arranged in the machine body and are respectively matched with the upper shell 112 and the lower shell 118, and a lamp holder bracket 24 is arranged in the front end of the machine body so as to install the semiconductor refrigeration module 1, the light source assembly 2, the power supply assembly 3 and the control circuit board 4.

The plurality of ventilation openings 111 may be disposed at different or the same positions of the housing 110 in different hole structures. The vent 110 is shown disposed on the lower shell 118 or side or end of the housing. The cavity in the interior of the machine body is formed with a ventilation channel. The cold air or air of the environment enters the inside of the machine body from the ventilation opening, takes away the heat inside the machine body, and is exhausted out of the machine body through the ventilation opening 111 at the same or different positions. A plurality of ventilation openings 111 of the fuselage are used for air intake and air outtake and form ventilation channels (as shown by the lines of the scissors in fig. 4-6) with the space in the fuselage to realize heat dissipation in the fuselage. The front end of the body is a working surface 113, the working surface 113 can be directly contacted with the skin, and the light generated by the light source component 2 is transmitted to the working surface 113 to be emitted out to carry out the beauty treatment on the skin.

The light source assembly 2 is installed at the front end of the body through a lamp holder support 24, and a light outlet channel and a light outlet window are formed in the lamp holder support 24 and used for transmitting light generated by the light source assembly. The working surface 113 is installed on the light-emitting window, the lamp tube 20 is installed on the rear portion of the lamp holder support by the reflection cup 21 and is located behind the light-emitting channel, and the light-emitting direction of the light source component is provided with the optical filter 25. The heat-conducting member 22 of the reflector cup projects rearwardly to the vent of the fan. The lamp holder support 24 can be provided with a ventilation channel as required, and the ventilation channel is communicated with the ventilation channel inside the reflection cup, so that air cooling and heat dissipation are facilitated.

A fan accommodating cavity is formed inside the buckled front end of an upper support 114 and a lower support 115 in the machine body, the semiconductor refrigeration module 1 is correspondingly installed, a window is formed at the front end of the lower support 115 and is opposite to and communicated with a vent 111 formed on a lower shell 118, and a radiating fin 16 on the VC temperature equalizing plate 11 is positioned at the window and is opposite to the vent 111 on the lower shell 118. The semiconductor refrigerating sheet 10 is arranged on the platform extending from the front end of the VC temperature-equalizing plate 11, the heat transfer element, namely the heat transfer element (heat pipe) 15 is supported by the lamp holder bracket, the front end (ring shape) is in contact connection with the working surface 113 in a rapid heat conduction way, and the rear end (end part of a parallel straight pipe) covers the cold surface of the semiconductor refrigerating sheet and can be in close contact with the cold surface in a rapid heat conduction way. The fan is arranged in the fan accommodating cavity, the ventilation opening 182 at the front end of the surrounding bone corresponds to the heat conducting piece 22 of the reflecting cup, and the ventilation opening at the rear end is communicated with a ventilation channel formed after the upper bracket and the lower bracket are buckled. The air duct of the fan is indicated with reference to the inlet and outlet air shown in fig. 8.

The power supply module accommodating cavity is formed inside the rear section where the upper bracket 114 and the lower bracket 115 are buckled inside the body, the power supply module 3 is generally a battery, such as a rechargeable battery or a capacitor battery, and the power supply module further comprises a charging seat 31 for connecting an external power supply to charge the battery or directly supply power to the beauty instrument. The charging base 31 is electrically connected with the control circuit board 4, is installed on the casing, and can be connected with a cable.

The inside of the power supply component accommodating cavity, the buckled upper support 114 and the lower support 115 is further limited with a ventilation channel 101/102, and the ventilation channel 101/102 is communicated with the ventilation channel of the fan, communicated with the ventilation channel in the reflecting cup and communicated with the ventilation opening (air inlet and air outlet) of the shell to form a ventilation channel in the machine body.

The upper bracket 114 is fastened with the upper casing 112 to form a cavity for mounting the control circuit board 4, and the control circuit board 4 is protected by the upper bracket 114 and the upper casing 112. The casing is also provided with a switch button 117 electrically connected with the control circuit board 4 and a switch circuit board 116 corresponding to the inside for controlling the switch and the like.

Referring to the embodiment shown in fig. 16 to 19, the semiconductor refrigeration module 1 of the foregoing embodiment is applied to an L-shaped beauty treatment apparatus, and functions and structures thereof are the same as or similar to those of the straight plate type of fig. 1 to 7, and the size, shape and position of the housing, the holder, the power supply module 3, the light source module 2, the semiconductor refrigeration module 1 and the control circuit board 4 are adaptively set in accordance with only the overall shape of the body. The L-shaped cosmetic instrument includes a handle 120 and a light head 130. The lamp head 130 is rotatably connected to the top of the handle 120 through the knob 150, the knob holder 140 and the rotary pressing plate 151 on the top of the handle, and the rotary connection structure of the lamp head 130 and the handle and the structure of the handle can adopt the prior art structure. The tail part of the handle is provided with a DC wire 31', the inside of the handle is provided with a handle bracket 160, and the power supply component 3 is installed. The cavity on the top side of the handle holder 160 is in communication with the interior of the lamp head 130, and the lamp head housing is rotatably mounted. The lamp cap housing comprises a front shell 131 and a front shell cover 132, and the lamp cap 130 is rotatably connected through the front shell cover 132 in cooperation with a knob 150, a knob base 140 and a rotary pressing plate 151. The inner lamp holder bracket 133 is mounted on the front shell cover 132 and matched with the front shell cover 132, the semiconductor refrigeration module 1 is mounted on one side, and the control circuit board 4 is mounted on the other side. The front end of the lamp head 130 is a working surface 113, which can be a transparent crystal or an annular working surface or a semiconductor refrigeration sheet of an annular transparent crystal cold surface, and all of the structures in the prior art. The front end of the inner part of the lamp cap 130 is provided with a lamp cap support 24, the structure is similar to that of the embodiment shown in fig. 1-7, the light source assembly 2 is installed, one side of the heat conducting piece 22 of the reflecting cup of the light source assembly 2 is provided with a heat pipe and heat sink assembly 26, the heat pipe and heat sink assembly extends out to the ventilation opening 182 of the fan 18, and the front shell 131 is provided with a ventilation opening which is opposite to the heat sink assembly 26. In this embodiment, the semiconductor refrigeration module 1 is adopted to refrigerate the working surface 113 and simultaneously dissipate heat from the light source assembly 2.

The semiconductor refrigerating sheet 10 is arranged on the VC temperature-equalizing plate 11, and the cold surface 13 of the refrigerating sheet is connected with the working surface 113 of the beauty instrument by the heat transfer element (heat pipe) 15, namely the heat transfer element, so as to quickly conduct cold, and form a cold compress effect or a cooling effect on the working surface. The VC temperature equalizing plate 11 is provided with radiating fins 16 to increase the radiating area. Furthermore, the VC temperature-uniforming plate 11 is combined with the fan, and is used for an upper shell or a lower shell or a surrounding frame of the fan by utilizing the phase change effect of evaporation and condensation of the VC temperature-uniforming plate, so that the heat dissipation efficiency and speed of the fan during rotation are improved to a greater extent; the radiating fins are added on the upper surface of the VC, so that the radiating area of the VC can be increased, the contact area between air and the radiating fins is effectively increased when air is sucked, and the radiating fins made of heat conducting materials are added on the lower surface (the inner wall of the surrounding bone) of the upper shell of the VC fan, so that the contact area between the air and the radiating fins can be increased to a greater extent, and the radiating effect is better. The UV upper surface or the UV lower surface or both surfaces can be provided with radiating fins according to the heat dissipation requirements of the product.

Referring to fig. 20 to 23, the second embodiment of the semiconductor refrigeration module 1 of the present invention is mainly used for refrigerating the working surface 113 (refer to the previous embodiments) of the optical beauty instrument to achieve the effect of cold compress on the skin. The semiconductor refrigeration module 1 includes a semiconductor refrigeration sheet 10, the semiconductor refrigeration sheet 10 (refer to the foregoing embodiment) includes a middle galvanic couple layer 12, and a hot surface 11' and a cold surface 13 at two ends, and in a specific embodiment, the refrigeration sheet 10 (specifically, the cold surface 13) may be directly used as the working surface 113, or used for refrigerating the working surface 113. When the refrigeration sheet 10 is directly used as a working surface, the skilled person can set the adaptive shape, such as a transparent crystal or a ring shape, etc., according to the needs. When the cooling fins 10 are used to cool the working surface 113, the cooling surface 13 of the cooling fins 10 is in contact with the working surface 113, for example, is disposed around the working surface. Alternatively, the cold side 13 of the refrigeration sheet 10 and the working side 113 are in contact with the working side 113 through a heat transfer element (or heat conducting member). The cold conducting piece 15 is a heat transfer structural piece, and can quickly transfer heat of the working face to the semiconductor refrigerating piece, so that the effect of refrigerating the working face is achieved. The heat transfer structure may be a heat conductive material such as (without limitation) a metal material such as (without limitation) copper/aluminum tubing or the like or other heat conductive material such as silicone/silicon wafer/elastic or soft heat conductive material; it can also be a heat pipe (heat pipe) or a VC (temperature equalizing plate or temperature equalizing pipe) or a super heat conducting pipe or a super heat conducting plate or other components for realizing heat transfer. The heat pipe (heat pipe) or vapor chamber (vapor chamber) is used to rapidly transfer the heat of the heat generating object out of the heat source through the heat pipe by utilizing the heat conduction principle and the rapid heat transfer property of the refrigeration medium. The super heat conducting pipe or the super heat conducting plate is preferably an aluminum super heat conducting pipe/aluminum super heat conducting plate. The (aluminum) superconductive heat pipe or (aluminum) superconductive plate, or ALVC superconductive pipe (plate), utilizes evaporation refrigeration and gas-liquid phase change to make heat quickly conducted. Referring to fig. 23, compared with a general heat pipe and a VC uniform temperature plate, an aluminum superconducting heat pipe/aluminum superconducting heat plate may form microgrooves or microporous channels on the surface of the superconducting heat pipe or the superconducting heat plate by an aluminum material forming process as a capillary structure inside the superconducting pipe or the superconducting plate. Copper powder can not be added into the aluminum superconducting pipe (plate), namely the ALVC aluminum superconducting pipe (plate), aluminum powder or aluminum-silicon powder and the like can be filled into the aluminum superconducting pipe (plate), an aluminum net can be added, and a refrigerant is filled into the aluminum superconducting pipe (plate) and then the aluminum superconducting pipe (plate) is sealed. The cold conducting member 15 is connected between the semiconductor cooling plate (cold surface) and the working surface, and the shape of the cold conducting member can be designed to be adapted according to the shape of the semiconductor cooling plate 10, particularly the shape of the cold surface 13 and the shape of the working surface 113, and the principle of rapid heat dissipation is adopted. In this embodiment, the cold conducting element 15 is a copper tube or an ALVC aluminum superconducting tube (plate) or a heat pipe or VC.

According to the shape of the working surface 113 and the expected cooling effect, the end of the cold conducting member 15 contacting with the working surface 113 can be designed into a ring shape, and directly and closely contacts with the periphery of the working surface, so as to rapidly absorb the heat of the working surface 113 or the environment around the working surface 113; alternatively, a cold guide member (second cold guide member) 15' is further provided on the working surface 113 and the cold guide member 15 to be in contact with each other for heat transfer. The cold conducting piece 15' is a copper pipe or an ALVC superconducting pipe (plate) or a heat pipe or a VC, can be arranged in a ring shape, and is attached to the periphery of the working surface 113 and the ring-shaped end of the cold conducting piece 15 so as to conduct heat quickly. Depending on the shape of the cooling plate 10 or the cooling surface 13, the end of the cold conducting piece 15 in contact with the cooling plate 10 may be designed as follows: the two ends of the metal pipe are bent from the ring shape and extend for a preset length to be placed on the cold surface 13 of the refrigerating sheet and tightly contacted with the cold surface 13.

The heat generated by the hot surface 11' of the semiconductor refrigerating sheet 10 is discharged out of the body through a ventilation channel in the body. Specifically, the semiconductor cooling fins 10 enhance the heat dissipation effect by the heat sink. The radiator comprises a heat conducting structure 19 and a radiating fin 16, is positioned in a ventilation channel of the optical beauty instrument body and is used for quickly radiating heat of the hot surface 11' of the semiconductor refrigeration piece 10. The heat conducting structure 19 comprises a heat conducting plate 190 and a plurality of aluminum VC/ALVC superconducting tubes 191, wherein each aluminum VC/ALVC superconducting tube 191 is a single tube. The hot side 11 'of the semiconductor chilling plate is arranged on the outer wall of the heat conducting plate 190, or the heat conducting plate 190 is directly used as the hot side 11' of the semiconductor chilling plate 10. The semiconductor refrigeration piece 10 is arranged on one side of the outer wall of the heat conduction plate 190, the plurality of open grooves 192 are arranged on the other side of the outer wall of the heat conduction plate 190, the plurality of open grooves 192 are matched with the plurality of aluminum VC/ALVC superconducting pipes 191, and the aluminum VC/ALVC superconducting pipes 191 are accommodated in the open grooves 192. The heat-conducting plate slots 192 are connected, e.g., riveted/welded, to the aluminum VC/ALVC superconducting tubes 191 to increase the contact area therebetween for rapid heat transfer.

With reference to fig. 23, the aluminum VC/ALVC superconducting tube 191 forms microgrooves, microteeth, or micropores on the inner wall surface of the aluminum VC/ALVC superconducting tube by an aluminum material processing and forming process, and forms a capillary action inside the aluminum VC/ALVC superconducting tube. As shown in fig. 23 (b), when the aluminum material is extruded to form the aluminum VC/ALVC superconducting pipe, a single channel 1910 is formed in the pipe, two or more fine bone-shaped microgrooves 1911 are formed on the inner wall of the pipe, a large number of micropore structures 1912 can be formed in the pipe wall of the aluminum VC/ALVC superconducting pipe, after the aluminum material is formed into a pipe shape, aluminum powder or aluminum silicon powder and the like can be filled into the pipe by pumping liquid into the pipe, an aluminum mesh can be added, and the sealed end is sintered after vacuum pumping, so that the aluminum VC/ALVC superconducting pipe with super thermal conductivity is obtained. Preferably, each aluminum VC/ALVC superconducting pipe is a single channel 1910, and has the advantages that: the plane bending or the special-shaped 3D bending can be realized, the shape can be changed according to the change of the product space form, and the longitudinal mode staggered combination of a plurality of aluminum VC/ALVC superconducting pipes can be realized to overcome the influence of the gravity direction. In the example shown in fig. 23 (a), the aluminum VC/ALVC superconducting tube 191 is bent into an L shape, accordingly, the slot 192 on the heat conducting plate 190 is also L-shaped, the aluminum VC/ALVC superconducting tube 191 is just embedded into the slot 192, the L-shaped heat conducting structure 19 is integrally formed, one end of the L-shape is placed on the hot surface 11' of the semiconductor chilling plate 10 to be in close contact with the heat for rapid heat transfer, and the other end of the L-shape is installed in the heat radiating fin 16. The heat generated by the hot side 11' of the semiconductor cooling plate 10 is rapidly transferred to the heat sink 16 by the heat conducting structure 19 for heat dissipation.

The refrigeration sheet 10 is arranged on one side of the heat conducting plate 190, and the hot surface 11' of the semiconductor refrigeration sheet is attached to the outer wall of the heat conducting plate 190, so that the heat of the hot surface is directly conducted to the heat conducting plate 190; or, the hot side 11 'of the semiconductor refrigeration sheet is installed on the outer wall of the heat conduction plate 190 through the heat conduction member, and the heat of the hot side 11' is rapidly conducted to the heat conduction plate 190 through the heat conduction member; or, the heat conducting plate 190 is provided with a hot end circuit of the semiconductor refrigerating sheet, and the hot end circuit is welded and electrically connected with the PN galvanic couple particles of the galvanic couple layer 12. The heat conductive plate 190 is a heat conductive element made of a heat conductive material such as (without limitation) a metal material such as (without limitation) copper/aluminum or other heat conductive materials such as silicone/silicon wafer/elastic or soft heat conductive material. Preferably, the thermally conductive plate 190 is made of a thermally conductive material such as a copper/aluminum plate.

The heat sink 16 is disposed on the heat conducting plate 190 to increase the heat dissipation area. Preferably, the heat sink 16 is located behind the air vent of the optical beauty instrument body; a vent 111 (see fig. 16, 27-28) facing the fuselage. The heat sink 16 is one or more groups of heat conductive material fins, and the position, number and arrangement of the heat sink can be set according to the internal space of the beauty instrument. One or more groups of radiating fins are integrally formed or welded or riveted or fixed by other fastening mechanisms to form an integral radiating fin 16; alternatively, one or more sets of fins of thermally conductive material are provided on the plate to form the fins 16 of unitary construction. The top surface of the heat sink 16 is formed with a groove 161, and one end of the heat conducting structure 19 is inserted into the groove 161, so that the heat can be rapidly transferred by riveting/welding to increase the contact area between the two.

In other embodiments, the heat conducting structure 19 may be directly disposed on the heat sink 16, or the heat conducting structure 19 may be attached to one side of the heat conducting plate of the heat sink 16 (see fig. 28).

Referring to fig. 24 to 26, the third embodiment of the semiconductor refrigeration module 1 is mainly used for refrigerating the working surface 113 (refer to the previous embodiments) of the optical beauty instrument to achieve the effect of cold compress on the skin. The semiconductor refrigeration module 1 comprises a semiconductor refrigeration piece 10, a first cold conduction piece 15, a second cold conduction piece 15', a heat dissipation piece 16 and a heat conduction structure 19. The first and second heat conduction members 15, 15' and the heat sink 16 have the same or similar structure as the second embodiment of the semiconductor refrigeration module 1, and the above embodiment is directly cited. The heat conducting structure 19 includes a heat conducting plate 190 and a plurality of aluminum VC/ALVC superconducting tubes 191, each aluminum VC/ALVC superconducting tube 191 is a single tube, preferably a single channel. The hot side 11 'of the semiconductor chilling plate is arranged on the outer wall of the heat conducting plate 190, or the heat conducting plate 190 is directly used as the hot side 11' of the semiconductor chilling plate 10. The semiconductor refrigeration piece 10 is arranged on one side of the outer wall of the heat conduction plate 190, the plurality of open grooves 192 are arranged on the other side of the outer wall of the heat conduction plate 190, the plurality of open grooves 192 are matched with the plurality of aluminum VC/ALVC superconducting pipes 191, and the aluminum VC/ALVC superconducting pipes 191 are accommodated in the open grooves 192. The heat-conducting plate slots 192 are connected, e.g., riveted/welded, to the aluminum VC/ALVC superconducting tubes 191 to increase the contact area between the two for rapid heat transfer. In this embodiment, the heat conducting plate 190 includes a circular (not limited to circular) area and a platform extending from one side, and the semiconductor chilling plate 10 is disposed on the platform. The circular area is provided with a plurality of slots 190 extending from the center of a circle to the edge of the circle, the slots 190 are evenly distributed in the circular area at intervals, one aluminum VC/ALVC superconducting pipe 191 is placed in each slot 190, and the slots 190 and the aluminum VC/ALVC superconducting pipes 191 can be provided with certain curvature or radian. In a non-limiting example, the plurality of aluminum VC/ALVC superconducting tubes 191 are installed to form a radial arrangement along a radius or approximately along the radius direction, so as to overcome the influence of the gravity direction. In other embodiments, the plurality of aluminum VC/ALVC superconducting tubes 191 may be arranged in a longitudinal mode staggered combination to overcome the influence of the direction of gravity. The heat conducting plate slot 190 is connected with the aluminum VC/ALVC superconducting pipe 191, and the contact area between the heat conducting plate slot 190 and the aluminum VC/ALVC superconducting pipe 191 can be increased through riveting/welding, so that heat transfer is accelerated.

As in the previous embodiment, the aluminum VC/ALVC superconducting tube 191 preferably uses a single channel, and microgrooves or microteeth or micropores are formed on the inner wall surface of the aluminum VC/ALVC superconducting tube by an aluminum material processing and forming process, and the inside of the tube is encapsulated with a cooling liquid, and aluminum powder or aluminum silicon powder, etc. may be filled in the tube, and an aluminum mesh may be added.

The refrigerating sheet 10 is arranged on the platform at one side of the heat conducting plate 190, and the hot surface 11' of the semiconductor refrigerating sheet is attached to the outer wall of the heat conducting plate 190, so that the heat of the hot surface is directly conducted to the heat conducting plate 190; or, the hot side 11 'of the semiconductor refrigeration sheet is installed on the outer wall of the heat conduction plate 190 through the heat conduction member, and the heat of the hot side 11' is rapidly conducted to the heat conduction plate 190 through the heat conduction member; or, the heat conducting plate 190 is provided with a hot end circuit of the semiconductor refrigerating sheet, and the hot end circuit is welded and electrically connected with the PN galvanic couple particles of the galvanic couple layer 12. Preferably, the thermally conductive plate 190 is made of a thermally conductive material such as a copper/aluminum plate.

The heat sink 16 is disposed on the heat conducting plate 190 to increase the heat dissipation area. By way of non-limiting example, the circular area of the heat conducting structure 19 may be placed directly on top of the heat sink 16 or may be fixed to the top of the heat sink 16 by welding or riveting for rapid heat transfer. The heat sink 16 extends from the platform on one side of the heat conducting plate 190, and the semiconductor chilling plate 10 is disposed on the platform.

Referring to fig. 27, the semiconductor refrigeration module 1 of the third embodiment is applied to an optical cosmetic apparatus, for example, an optical cosmetic apparatus having a shape shown in fig. 16 to 19, and other structural members of the optical cosmetic apparatus are the same as or similar to those of the embodiment shown in fig. 16 to 19, and are directly cited. The heat conducting structure 19 is arranged on a vent at the top of the fan 18, specifically, a circular area of the heat conducting plate 190 covers an opening at the top of the fan, the heat conducting plate is provided with an aluminum VC/ALVC superconducting pipe 191 facing the fan, the radiating fins 16 are positioned outside and facing the vent 111 at the side surface of the front shell 131, the heat conducting structure 19, the fan 18 and the radiating fins 16 are all positioned in a ventilation channel in the machine body, and the respective ventilation channels are communicated, cold air is input from the vent 111 of the machine body, and the heat is taken away in the ventilation channel in the machine body and then is exhausted to the outside of the machine body through the other vent 111.

The semiconductor refrigerating sheet 10 is arranged on the platform on one side of the heat conducting plate 190, and the cold surface of the refrigerating sheet 10 is connected with the working surface 113 of the beauty instrument by the cold conducting piece (copper/ALVC/heat pipe/VC) 15 (and the second cold conducting piece 15') to conduct cold rapidly, so that the cold compress effect or the cooling effect is formed on the working surface.

The optical beauty instrument shown in fig. 27 has the same operation principle as the previous embodiment, and is not described herein again.

The optical beauty instrument of the embodiment shown in fig. 28 is used for cooling the working surface 113 of the beauty instrument by using the semiconductor cooling module 1 of the third embodiment, and other structural components of the optical beauty instrument are the same as or similar to those of the embodiment shown in fig. 16 to 19, and are directly cited. The heat conducting structure 19 is L-shaped, and is mounted on a vent hole formed in the top of the fan 18 and covered by one end of the heat radiating fin 16, the heat conducting plate 190 is provided with an aluminum VC/ALVC superconducting pipe 191 facing inwards towards the fan, and the other end of the heat conducting plate 190 is provided with the semiconductor refrigerating sheet 10 which is located outside the vent hole formed in the top of the fan 18. The wind heat dissipation plate 16 is located at the ventilation opening 111 on the side of the front shell 131 facing the outside, the heat conducting structure 19, the fan 18 and the heat dissipation plate 16 are all located in the ventilation channel in the body, and the respective ventilation channels are communicated, cold air is input from the ventilation opening 111 in the body, and the cold air is discharged to the outside of the body from the other ventilation opening 111 after taking away heat in the ventilation channel in the body.

The semiconductor refrigerating sheet 10 is disposed on the platform on one side of the heat conducting plate 190, and the cold surface of the refrigerating sheet 10 is connected to the working surface 113 of the beauty instrument by the cold conducting member (copper/ALVC/heat pipe/VC) 15 (and the cold conducting member 15') to conduct cold rapidly, so as to form a cold compress effect or a cooling effect on the working surface. In this embodiment, the heat pipe and heat sink assembly 26 disposed on the heat conducting member 22 side of the reflective cup of the light source assembly 2 may be omitted. The groove 161 (fig. 22) formed on the heat sink 16 mounts one end of the heat conducting plate 190, and forms a ventilation channel at the same time, the ventilation channel is communicated with the air channel between the adjacent fins of the heat sink 16 and the air channel of the fan, and is communicated with the reflective cup of the light source assembly 2 and the ventilation channel inside the reflective cup, the heat conducting member 22 of the reflective cup of the light source assembly 2 is located at the ventilation opening of the fan 18 or in the ventilation channel inside the body, so as to realize the air cooling heat dissipation of the reflective cup 21 and the lamp tube 20. In this embodiment, the semiconductor refrigeration module 1 is adopted to refrigerate the working surface 113 and simultaneously realize heat dissipation of the light source assembly 2.

The heat conducting structure 19 of the above embodiment of the present invention employs a plurality of aluminum superconducting plates or single tubes of aluminum superconducting tubes 191 to combine with the heat conducting plate (copper plate) 190, which can effectively solve the problem of the gravity direction of the product, and the pipeline can be arranged in two or more different directions/angles in the XY plane or the XYZ three-dimensional direction. It is known that heat and steam flow from bottom to top, so that when the beauty instrument is used from bottom to top, the gravity effect of the heat-conducting structure is more obvious, and the heat-conducting effect in this state is deteriorated due to the effect of the antigravity direction, and an ideal heat-dissipating effect cannot be achieved.

In the above embodiments, "cold conduction" and "heat conduction", "heat transfer" or "heat transfer" are to be interpreted as having the same meaning, both heat transfer and are used interchangeably.

It should be understood that, in the foregoing embodiments, the terms of orientation such as "upper", "lower", "top", "bottom", "left", "right", "vertical", "horizontal", "transverse", "front", "back", etc. are used, and are not limited to absolute geographic orientations with respect to the relative positions of the components shown in the drawings.

Features of the above embodiments may be combined, changed or substituted to obtain different embodiments, which are all within the scope of the disclosure of the embodiments of the present application. Some common structures or the like in the above embodiments are described in some embodiments, but not in other embodiments, and these common structures or the like are also applicable to these embodiments, and all of them belong to the disclosure of the embodiments of the present application.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be a mechanical connection, and can also be an electrical connection or a connection capable of transmitting data; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other or mutually interacted. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims; the scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A semiconductor refrigeration module comprises a semiconductor refrigeration piece, a first cooling piece and a second cooling piece, wherein the semiconductor refrigeration piece is used for refrigerating an optical beauty instrument and comprises a middle galvanic couple layer, and a hot surface and a cold surface at two ends; the method is characterized in that: the semiconductor refrigeration module comprises a heat conduction structure and a heat radiating fin; the heat conduction structure comprises a VC temperature equalizing plate or an aluminum superconducting pipe; the heat conducting structure is respectively connected with the heat radiating fins and the hot surfaces of the semiconductor refrigerating fins in a rapid heat transfer mode, so that the hot surfaces can dissipate heat rapidly.

2. The semiconductor refrigeration module of claim 1 wherein:

two ends of the aluminum superconducting plate or the aluminum superconducting pipe are sealed, and working liquid is packaged inside the aluminum superconducting plate or the aluminum superconducting pipe;

more than two thin bone-shaped microgrooves are formed on the inner wall of the aluminum superconducting plate or the aluminum superconducting pipe;

and a microporous structure is formed in the aluminum superconducting plate or the aluminum superconducting pipe material.

3. The semiconductor refrigeration module of claim 2 wherein:

the heat conduction structure comprises a plurality of aluminum superconducting plates or aluminum superconducting pipes, the aluminum superconducting plates or the aluminum superconducting pipes are single pipes, and a single channel is formed inside the aluminum superconducting plates or the aluminum superconducting pipes;

the aluminum superconducting plate or the aluminum superconducting pipe is bent in a plane or in a special-shaped 3D manner and is matched with the installation space;

the heat conduction structure further comprises a heat conduction plate, the plurality of aluminum superconducting plates or aluminum superconducting pipes are combined with the heat conduction plate, and the plurality of aluminum superconducting plates or aluminum superconducting pipes are arranged to comprise at least two different directions or angles so as to reduce the effect of the antigravity direction, so that the heat conduction effect is poor.

4. The semiconductor refrigeration module of claim 3 wherein:

the heat conducting plate is provided with a plurality of open grooves, the aluminum superconducting plates or the aluminum superconducting pipes are matched with the open grooves and correspondingly arranged in the open grooves, and the wall surfaces are mutually contacted to realize rapid heat transfer;

the aluminum superconducting plate or the aluminum superconducting pipe is welded or riveted with the slot to increase the contact area;

the semiconductor refrigeration piece is arranged on the heat conducting plate: the hot surface of the semiconductor refrigeration sheet is attached to the outer wall of the heat conducting plate, so that the heat of the hot surface is directly conducted to the heat conducting plate; or the hot surface of the semiconductor refrigeration sheet is arranged on the outer wall of the heat conducting plate through the heat conducting piece, and the heat of the hot surface is quickly conducted to the heat conducting plate through the heat conducting piece; or the heat conducting plate is used as a hot surface, a hot end circuit of the semiconductor refrigerating sheet is arranged on the heat conducting plate, and the hot end circuit is welded and electrically connected with the PN galvanic couple particles of the galvanic couple layer;

the plurality of aluminum superconducting plates or aluminum superconducting pipes use two different directions or angles on an XY plane, or have a certain angle of intersecting line form, or annular or staggered or circulating design.

5. The semiconductor refrigeration module of claim 3 wherein:

the heat sink comprises one or more groups of fins of heat conductive material; the heat conducting plate is arranged in the groove on the radiating fin or at the top of the radiating fin, or the radiating fin and the heat conducting plate are arranged on the other heat conducting part;

the heat conducting plate is a metal plate.

6. The semiconductor refrigeration module of claim 1 wherein:

the semiconductor refrigeration piece is arranged on the VC temperature-uniforming plate: the hot surface of the semiconductor refrigerating sheet is in contact with the VC temperature equalizing plate to quickly transfer heat; or the heat is quickly conducted between the hot surface and the temperature equalizing plate through the heat conducting piece; or the VC temperature equalizing plate is directly used as the hot surface of the semiconductor refrigerating sheet, and a hot end circuit of the semiconductor refrigerating sheet is arranged on the VC temperature equalizing plate and is welded and electrically connected with PN galvanic couple particles of the galvanic couple layer;

the heat radiating fins are arranged on the VC temperature-uniforming plate to increase the VC heat radiating area; the heat sink is one or more groups of heat conducting material fins.

7. The semiconductor refrigeration module of any of claims 1-6, wherein:

the semiconductor refrigeration module comprises a cold guide piece, one end of the cold guide piece is connected with the cold surface of the semiconductor refrigeration piece in a rapid heat transfer mode, and the other end of the cold guide piece is used for being connected with the surface to be refrigerated in a rapid cold guide mode;

the cold conducting piece is a copper pipe, an aluminum superconducting plate, a heat pipe or VC;

the semiconductor refrigeration module also comprises a fan; the fan comprises a shell and rotating fan blades in the shell;

the heat conducting structure is covered on the air inlet of the fan or is used as a part of the fan shell.

8. The semiconductor refrigeration module of claim 7 wherein:

the fan shell comprises an upper shell, a lower shell and a middle surrounding bone;

the VC temperature-equalizing plate is arranged on the surrounding bone or the surrounding bone is of a VC temperature-equalizing plate structure, and the inner wall of the surrounding bone is provided with a radiating fin structure so as to increase the radiating area; alternatively, the first and second liquid crystal display panels may be,

the VC temperature-equalizing plate is arranged as an upper shell or a lower shell of the fan shell and is covered at the top opening or the bottom opening of the annular enclosure; the VC temperature-equalizing plate is an annular flat plate, and a central through hole of the annular flat plate forms a ventilation opening of the fan; the radiating fins and the fan are respectively positioned on two sides of the VC temperature-equalizing plate; the ventilation channel of the radiating fin is communicated with the central through hole and the ventilation channel of the fan; the radiating fins cover the central through hole, or the radiating fins are arranged along the annular edge of the VC temperature-equalizing plate.

9. An optical beauty instrument comprises a machine body provided with a plurality of ventilation openings, wherein a light source component, a power supply component and a control circuit board are arranged in the machine body; the light source component and the power supply component are electrically connected with the control circuit board; a plurality of ventilation openings of the machine body are used for air inlet and air outlet and form a ventilation channel with the space in the machine body; the front end of the machine body is a working surface; the method is characterized in that: the fuselage is also provided with a semiconductor refrigeration module of any one of claims 1~8 for refrigerating the working surface.

10. The optical cosmetic instrument of claim 9, wherein:

the semiconductor refrigeration module comprises a first cold guide piece connected between the cold surface of the semiconductor refrigeration piece and the working surface; the first cold conducting piece is a copper pipe, an aluminum superconducting plate, a heat pipe or VC;

the semiconductor refrigeration module also comprises a fan; the fan comprises a shell and rotating fan blades in the shell; the heat sink and the fan are located in the ventilation passage.

11. The optical cosmetic instrument of claim 10, wherein:

the semiconductor refrigeration module comprises a second cold guide piece, and the second cold guide piece is arranged between the first cold guide piece and the working surface and is connected with the first cold guide piece in a rapid heat transfer mode; the second cold conducting piece is a copper pipe, an aluminum superconducting plate, a heat pipe or VC;

the second cold guide piece is annular and is used for conducting cold to the periphery of the working surface in a contact manner; the first cold guide piece comprises a ring shape and is in adaptive contact with the second cold guide piece for cold guide, and two ends of the first cold guide piece extend from the ring shape and are connected with the cold surface of the semiconductor refrigeration piece in a rapid heat transfer mode;

the light source assembly comprises a lamp tube and a reflection cup, the ventilation channel inside the reflection cup is communicated with the ventilation channel of the fan, and is communicated with the ventilation channel in the machine body to form a heat dissipation ventilation channel of the light source assembly, and the fan promotes the heat dissipation of the light source assembly.

12. The optical cosmetic instrument according to any one of claims 9 to 11, wherein:

the optical beauty treatment is a depilation instrument, a photon skin tendering instrument, a leading-in and leading-out beauty treatment instrument or a radio frequency beauty treatment instrument.