CN115732119A - Metal conductive silver paste and preparation method and application thereof - Google Patents
Metal conductive silver paste and preparation method and application thereof Download PDFInfo
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- CN115732119A CN115732119A CN202211440228.3A CN202211440228A CN115732119A CN 115732119 A CN115732119 A CN 115732119A CN 202211440228 A CN202211440228 A CN 202211440228A CN 115732119 A CN115732119 A CN 115732119A
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- Prior art keywords
- silver
- paste
- conductive
- conductive paste
- acid
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 349
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 86
- 239000002184 metal Substances 0.000 title claims abstract description 86
- 238000002360 preparation method Methods 0.000 title abstract description 16
- 229910052709 silver Inorganic materials 0.000 claims abstract description 261
- 239000004332 silver Substances 0.000 claims abstract description 261
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 50
- 239000003381 stabilizer Substances 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 43
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 42
- 239000002904 solvent Substances 0.000 claims description 26
- -1 tetrafluoroborate Chemical compound 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 15
- 229920000178 Acrylic resin Polymers 0.000 claims description 14
- 239000004925 Acrylic resin Substances 0.000 claims description 14
- 229920001225 polyester resin Polymers 0.000 claims description 14
- 239000004645 polyester resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 238000002156 mixing Methods 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 10
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 10
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 9
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 9
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 claims description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 6
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 6
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 claims description 6
- 235000021314 Palmitic acid Nutrition 0.000 claims description 5
- 235000010323 ascorbic acid Nutrition 0.000 claims description 5
- 239000011668 ascorbic acid Substances 0.000 claims description 5
- 229960005070 ascorbic acid Drugs 0.000 claims description 5
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 5
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 5
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 5
- 229910001923 silver oxide Inorganic materials 0.000 claims description 5
- LMEWRZSPCQHBOB-UHFFFAOYSA-M silver;2-hydroxypropanoate Chemical compound [Ag+].CC(O)C([O-])=O LMEWRZSPCQHBOB-UHFFFAOYSA-M 0.000 claims description 5
- ORYURPRSXLUCSS-UHFFFAOYSA-M silver;octadecanoate Chemical compound [Ag+].CCCCCCCCCCCCCCCCCC([O-])=O ORYURPRSXLUCSS-UHFFFAOYSA-M 0.000 claims description 5
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 3
- PAAZPARNPHGIKF-UHFFFAOYSA-N 1,2-dibromoethane Chemical compound BrCCBr PAAZPARNPHGIKF-UHFFFAOYSA-N 0.000 claims description 3
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 claims description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 3
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 3
- JKFYKCYQEWQPTM-UHFFFAOYSA-N 2-azaniumyl-2-(4-fluorophenyl)acetate Chemical compound OC(=O)C(N)C1=CC=C(F)C=C1 JKFYKCYQEWQPTM-UHFFFAOYSA-N 0.000 claims description 3
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 claims description 3
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 claims description 3
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 3
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 claims description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 3
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 3
- 239000005642 Oleic acid Substances 0.000 claims description 3
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 3
- 229910021612 Silver iodide Inorganic materials 0.000 claims description 3
- 229920002472 Starch Polymers 0.000 claims description 3
- 235000021355 Stearic acid Nutrition 0.000 claims description 3
- NOICVUZFTAVDNM-UHFFFAOYSA-N acetamide;pyrrolidin-2-one Chemical compound CC(N)=O.O=C1CCCN1 NOICVUZFTAVDNM-UHFFFAOYSA-N 0.000 claims description 3
- 235000011054 acetic acid Nutrition 0.000 claims description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 3
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 235000019253 formic acid Nutrition 0.000 claims description 3
- 239000008103 glucose Substances 0.000 claims description 3
- 150000004676 glycans Chemical class 0.000 claims description 3
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 3
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 3
- 239000004310 lactic acid Substances 0.000 claims description 3
- 235000014655 lactic acid Nutrition 0.000 claims description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 3
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 3
- 235000021313 oleic acid Nutrition 0.000 claims description 3
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229920001282 polysaccharide Polymers 0.000 claims description 3
- 239000005017 polysaccharide Substances 0.000 claims description 3
- 229910052700 potassium Inorganic materials 0.000 claims description 3
- 239000011591 potassium Substances 0.000 claims description 3
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 claims description 3
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 claims description 3
- 229940071536 silver acetate Drugs 0.000 claims description 3
- ADZWSOLPGZMUMY-UHFFFAOYSA-M silver bromide Chemical compound [Ag]Br ADZWSOLPGZMUMY-UHFFFAOYSA-M 0.000 claims description 3
- 229910001958 silver carbonate Inorganic materials 0.000 claims description 3
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 claims description 3
- 229940045105 silver iodide Drugs 0.000 claims description 3
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 3
- 229910000161 silver phosphate Inorganic materials 0.000 claims description 3
- FJOLTQXXWSRAIX-UHFFFAOYSA-K silver phosphate Chemical compound [Ag+].[Ag+].[Ag+].[O-]P([O-])([O-])=O FJOLTQXXWSRAIX-UHFFFAOYSA-K 0.000 claims description 3
- 229940019931 silver phosphate Drugs 0.000 claims description 3
- 229910000367 silver sulfate Inorganic materials 0.000 claims description 3
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 claims description 3
- 239000012279 sodium borohydride Substances 0.000 claims description 3
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 3
- 239000008107 starch Substances 0.000 claims description 3
- 235000019698 starch Nutrition 0.000 claims description 3
- 239000008117 stearic acid Substances 0.000 claims description 3
- 229940116411 terpineol Drugs 0.000 claims description 3
- NBOMNTLFRHMDEZ-UHFFFAOYSA-N thiosalicylic acid Chemical compound OC(=O)C1=CC=CC=C1S NBOMNTLFRHMDEZ-UHFFFAOYSA-N 0.000 claims description 3
- 150000001356 alkyl thiols Chemical class 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 2
- 229910021529 ammonia Inorganic materials 0.000 claims 1
- 230000032683 aging Effects 0.000 abstract description 18
- 230000001681 protective effect Effects 0.000 abstract description 4
- 230000009471 action Effects 0.000 abstract description 3
- 239000010956 nickel silver Substances 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000003973 paint Substances 0.000 description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 230000003679 aging effect Effects 0.000 description 3
- 229960004643 cupric oxide Drugs 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000001384 succinic acid Substances 0.000 description 2
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- XTDYIOOONNVFMA-UHFFFAOYSA-N dimethyl pentanedioate Chemical compound COC(=O)CCCC(=O)OC XTDYIOOONNVFMA-UHFFFAOYSA-N 0.000 description 1
- FBOUIAKEJMZPQG-BLXFFLACSA-N diniconazole-M Chemical compound C1=NC=NN1/C([C@H](O)C(C)(C)C)=C/C1=CC=C(Cl)C=C1Cl FBOUIAKEJMZPQG-BLXFFLACSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Conductive Materials (AREA)
Abstract
The invention provides a metal conductive silver paste and a preparation method and application thereof. The metal conductive silver paste comprises the following components: the silver conductive paste comprises silver conductive paste, a silver source, a reducing agent and a stabilizing agent; wherein the valence of silver in the silver source is zero or + 1. According to the invention, on the basis of the traditional silver-coated cheap metal conductive paste, the silver source is added, and a new silver protective film can be formed on the surface of the cheap metal under the action of the reducing agent, so that the requirement of later-stage aging is met under the condition of ensuring the silver conductivity, the problem that the leaked cheap metal cannot be coated is solved, and the conductivity and the aging performance of the paste are greatly improved.
Description
Technical Field
The invention relates to the technical field of conductive paste, in particular to metal conductive silver paste and a preparation method and application thereof.
Background
With the development of electronic technology, more and more devices appear, and more wire connection requirements are put forward. The light weight, flexibility, high stability and high conductivity are all trends of future development. Silver, which is the most frequently used conductive metal in the current precision circuit, is frequently used in the precision circuit links of various electrical appliances, instruments, devices, etc., such as membrane switch silver paste, touch edge silver paste, keyboard silver paste, etc. And with the popularization of the products, the dosage of the silver is only increased.
According to the existing silver paste, most of silver content is 35-70% according to the requirements on the resistance performance of different products, and almost all metal powder can use silver powder, so that the cost is high on the premise that the resistance performance meets the requirements. Most of the international silver value is more than 4000 yuan/kg, the material cost of the most basic silver paste formula reaches more than 1500 yuan, and even in the formula with high silver content, the cost is directly more than 3000 yuan. Meanwhile, the overall cost of the slurry fluctuates, the change along with the international silver price is large, and in order to reduce the cost, the silver-clad copper conductive slurry is used to replace the silver conductive slurry in the mainstream at present. However, the silver-coated copper conductive paste has two problems which are not solved, firstly, the silver is not completely coated, copper leakage occurs, and the resistance is influenced; secondly, in the later aging process, the exposed copper is easily oxidized, so that a non-conductive copper oxide substance is generated, and the overall conductivity is influenced.
Based on the defects of the current silver conductive paste, improvement on the defects is needed.
Disclosure of Invention
In view of the above, the invention provides a metal conductive silver paste, and a preparation method and an application thereof, so as to solve the technical problem that diniconazole is difficult to dissolve in water in the prior art.
In a first aspect, the invention provides a metal conductive silver paste, which comprises the following components: the silver conductive paste comprises silver conductive paste, a silver source, a reducing agent and a stabilizing agent;
wherein the valence of silver in the silver source is zero or + 1.
Preferably, the silver source of the metal conductive silver paste includes at least one of nano silver particles, nano silver wires, nano silver clusters, silver oxide, silver nitrate, silver sulfate, silver carbonate, silver acetate, silver lactate, silver bromide, silver iodide, silver phosphate, and silver stearate.
Preferably, the reducing agent comprises at least one of formaldehyde, acetaldehyde, sodium hydroxide, potassium hydroxide, oxalic acid, sodium borohydride, potassium borohydride, copper, iron, polysaccharide, starch, glucose, hydrogen peroxide, ascorbic acid, ethylene glycol, hydrazine hydrate, and 1-methyl-3-butylamidine tetrafluoroborate.
Preferably, the stabilizer of the metal conductive silver paste includes at least one of a mercapto compound, an amino compound, a carboxyl compound, a hydroxyl compound, and a polymer compound.
Preferably, the metal conductive silver paste includes at least one of ethylene glycol, polyethylene glycol, glycerol, thioglycolic acid, mercaptopropionic acid, mercaptobenzoic acid, alkyl thiol, thioanthrenol, ammonia water, ethylamine, propylenediamine, ethylenediamine, butylamine, long-chain aminoalkane, formic acid, acetic acid, succinic acid, lactic acid, stearic acid, oleic acid, palmitic acid, carboxyalkane, polyethylene, polyvinylpyrrolidone, pyrrolidone acetamide, and dimethylformamide.
Preferably, the metal conductive silver paste comprises at least one of a copper-on-silver conductive paste and a nickel-on-silver conductive paste.
Preferably, the conductive silver paste with copper covered with silver comprises copper covered with silver powder, resin and solvent;
and/or the silver-coated nickel conductive paste comprises silver-coated nickel powder, resin and a solvent;
and/or the silver-coated iron conductive paste comprises silver-coated iron powder, resin and a solvent;
and/or the resin comprises at least one of epoxy resin, polyester resin and acrylic resin;
and/or the solvent comprises at least one of DBE, ethylene glycol ethyl ether acetate, ethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate, diethylene glycol butyl ether and terpineol;
and/or the mass ratio of the silver-coated copper powder or the silver-coated nickel powder, the resin and the solvent is (30-50): 5-15): 40-60.
Preferably, the mass of the silver source of the metal conductive silver paste is 3-15% of that of the silver conductive paste;
the mass of the reducing agent is 1-5% of that of the silver conductive paste;
the mass of the stabilizer is 0.2-1% of that of the silver conductive paste.
In a second aspect, the invention also provides a preparation method of the metal conductive silver paste, which comprises the steps of mixing the silver conductive paste, a silver source, a reducing agent and a stabilizing agent, and stirring to obtain the metal conductive silver paste.
In a third aspect, the invention further provides application of the metal conductive silver paste in a precise circuit.
Compared with the prior art, the metal conductive silver paste provided by the invention has the following beneficial effects:
the metal conductive silver paste comprises silver conductive paste, a silver source, a reducing agent and a stabilizing agent, wherein the silver source is added on the basis of the traditional silver-coated cheap metal conductive paste, and a new silver protective film can be formed on the surface of the cheap metal under the action of the reducing agent, so that the requirement of later-stage aging is met under the condition of ensuring the conductivity of silver, the problem that the leaked cheap metal cannot be coated is solved, and the conductivity and the aging performance of the paste are greatly improved.
Detailed Description
In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The invention provides a metal conductive silver paste which comprises the following components: the silver conductive paste comprises silver conductive paste, a silver source, a reducing agent and a stabilizing agent;
wherein the valence of silver in the silver source is zero or + 1.
It should be noted that the metal conductive silver paste of the present application includes a silver conductive paste, a silver source, a reducing agent and a stabilizer, wherein the silver conductive paste is a traditional silver-coated inexpensive metal conductive paste, and mainly includes silver powder, silver-coated inexpensive metal powder, epoxy resin, a curing agent, a rheological agent, a solvent and other very conventional formulation combinations and proportions, and the silver-coated inexpensive metal conductive paste is not a key point of the present application, and is not described in detail herein. Specifically, the silver-coated inexpensive metal conductive paste may be: silver-coated copper conductive paste, silver-coated nickel conductive paste and the like; according to the method, a silver source, a reducing agent and a stabilizing agent are added into the traditional silver-coated cheap metal conductive slurry; the silver valence in the silver source is zero valence or +1 valence; under the action of a reducing agent, copper leakage/copper oxide on the surface of the traditional silver-coated cheap metal conductive paste (specifically, the silver-coated copper conductive paste is described) can be reduced to a clean copper surface without ligand protection on the surface, and a silver source is reduced to generate free silver ions at the same time. The existing coating technology makes cheap metal difficult to use under a relatively severe aging condition, excessively exposed cheap metal seriously influences the conductivity and the aging property of the silver in a later period, and the metal conductive silver paste can form a new silver protective film on the surface of the cheap metal with high efficiency by a method of adding a silver source on the basis of the traditional silver-coated cheap metal conductive paste, so that the requirement of later-period aging is met simultaneously under the condition of ensuring the conductivity of the silver, the problem that the leaked cheap metal cannot be coated is solved, and the conductivity and the aging property of the paste are greatly improved.
The metal conductive silver paste has the function of providing a silver material for coating the silver-coated cheap metal defects, and can be a silver source with a zero valence state or a silver source with a high valence state (namely a silver source with a +1 valence state). The reducing agent has two functions, one is capable of reducing high valence state cheap metal on the cheap surface of the silver package, such as cupric oxide, cuprous oxide, nickel oxide and the like, and the other is capable of reducing high valence state silver source to low valence state silver source capable of conducting electricity efficiently. The role of the stabilizer is to stabilize and disperse the silver source, which has not been reduced, because both low-valence and high-valence silver sources, if stability or dispersibility is a problem, have a great influence on the conductivity and aging properties of the final paste.
In some embodiments, the silver source is the core of the conductive silver paste of the present application, and the key point for coating the bare silver with the inexpensive metal is based on a conventional stable silver source, for example, the silver source includes at least one of nano silver particles (particle size < 5 nm), nano silver wires (diameter 5-20 nm), nano silver clusters (particle size < 5 nm), nano silver clusters, silver oxide, silver nitrate, silver sulfate, silver carbonate, silver acetate, silver lactate, silver bromide, silver iodide, silver phosphate, and silver stearate.
In some embodiments, the reducing agent is used to reduce oxidized inexpensive metals and/or reduce higher valence silver sources on the surface of silver-coated inexpensive metals, typically based on conventional stable reducing agents; specifically, the reducing agent comprises at least one of formaldehyde, acetaldehyde, sodium hydroxide, potassium hydroxide, oxalic acid, sodium borohydride, potassium borohydride, copper, iron, polysaccharide, starch, glucose, hydrogen peroxide, ascorbic acid, ethylene glycol, hydrazine hydrate, and 1-methyl-3-butylamidine tetrafluoroborate.
In some embodiments, the stabilizer is used to stabilize and disperse the silver source, including both higher and lower valence silver sources; the stabilizer includes at least one of a mercapto compound, an amino compound, a carboxyl compound, a hydroxyl compound and a polymer compound, and specific compounds are listed below, but the compound for stabilizing silver is too bulky and bulky, and cannot be exemplified here; specifically, the stabilizer comprises at least one of ethylene glycol, polyethylene glycol, glycerol, thioglycolic acid, mercaptopropionic acid, mercaptobenzoic acid, alkyl mercaptan, thioanthrenol, ammonia water, ethylamine, propylene diamine, ethylene diamine, butylamine, long-chain aminoalkane, formic acid, acetic acid, succinic acid, lactic acid, stearic acid, oleic acid, palmitic acid, carboxyalkane, polyethylene, polyvinylpyrrolidone, pyrrolidone acetamide, and dimethylformamide.
According to the metal conductive silver paste, the silver source, the reducing agent and the stabilizing agent, the powder of the silver-coated cheap metal can be utilized very efficiently, and the exposed cheap metal can be coated very easily, so that the aging performance is not influenced; in the aspect of the selection of the silver source, two silver sources of a low valence state and a high valence state are innovatively provided, so that the silver source is easier to deposit on the surface of thermodynamically unstable cheap metal, and thus thermodynamically stable coating is realized.
In some embodiments, the silver conductive paste comprises at least one of a copper-on-silver conductive paste, a nickel-on-silver conductive paste, and an iron-on-silver conductive paste.
In some embodiments, the silver-coated copper conductive paste includes silver-coated copper powder, a resin, and a solvent.
In some embodiments, the silver-coated nickel conductive paste includes silver-coated nickel powder, a resin, and a solvent.
In some embodiments, the resin comprises at least one of an epoxy resin, a polyester resin, and an acrylic resin.
In some embodiments, the solvent comprises at least one of DBE, ethylene glycol ethyl ether acetate, ethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate, diethylene glycol butyl ether, terpineol.
In some embodiments, the mass ratio of the silver-coated copper powder, the resin and the solvent is (30-50): (5-15): (40-60).
In some embodiments, the weight ratio of the silver-coated nickel powder, the resin, and the solvent is (30-50): (5-15): (40-60).
In some embodiments, the mass of the silver source is 3-15% of the silver conductive paste;
in some embodiments, the reducing agent is 1-5% by mass of the silver conductive paste;
in some embodiments, the mass of the stabilizer is 0.2 to 1% of the silver conductive paste.
Specifically, the silver-coated copper powder and the silver-coated nickel powder related in the application are prepared by adopting a conventional technology or directly purchased in the market.
DBE solvent (DBE named DuPont) is a mixture of three dibasic esters, commonly called methyl nylon acid ester, and is prepared from dimethyl succinate (CH) 3 OOC(CH 2 ) 2 COOCH 3 Dimethyl glutarate CH 3 OOC(CH 2 ) 3 COOCH 3 And adipic acid dimethyl ester CH 3 OOC(CH 2 ) 4 COOCH 3 A combination of three good environment solvents.
Based on the same inventive concept, the embodiment of the application also provides a preparation method of the metal conductive silver paste, and the metal conductive silver paste is obtained by mixing and stirring the silver conductive paste, the silver source, the reducing agent and the stabilizing agent.
Based on the same inventive concept, the application of the metal conductive silver paste in the precise circuit in the embodiment of the present application is, specifically, the metal conductive silver paste of the present application can be applied to precise circuit links of various electrical appliances, instruments, devices, and the like, for example, a membrane switch silver paste, a touch edge silver paste, a keyboard silver paste, and the like.
The following further describes the metal conductive silver paste of the present application, its preparation method and application by specific examples. This section further illustrates the present disclosure in connection with specific examples, which should not be construed as limiting the invention. The technical means employed in the examples are conventional means well known to those skilled in the art, unless otherwise specified. Reagents, methods and apparatus employed in the present invention are conventional in the art unless otherwise indicated. The polyester resin used in the following examples was Toyo saturated polyester resin GK-680, and the acrylic resin used was German Rohm acrylic resin.
Example 1
The embodiment of the application provides a metal conductive silver paste, which comprises the following components: the silver conductive paste comprises silver conductive paste, a silver source, a reducing agent and a stabilizing agent;
wherein the silver conductive paste comprises: 40 parts by weight of silver-coated copper powder (the mass fraction of silver in the silver-coated copper powder is 20%), 5 parts by weight of polyester resin, 5 parts by weight of acrylic resin and 50 parts by weight of DBE solvent;
the silver source is nano silver clusters (the average grain diameter is 3 nm), the reducing agent is ethylene glycol, the stabilizing agent is succinic acid, the mass of the nano silver clusters is 10% of the mass of the silver conductive paste, the amount of the ethylene glycol is 2% of the mass of the silver conductive paste, and the mass of the succinic acid is 0.8% of the mass of the silver conductive paste.
The preparation method of the metal conductive silver paste comprises the following steps: and mixing the silver conductive paste, the silver source, the reducing agent and the stabilizing agent, and uniformly stirring to obtain the metal conductive silver paste.
Example 2
The embodiment of the application provides a metal conductive silver paste, and compared with the silver source in embodiment 1, the silver source adopts high-valence silver, and more silver sources and a reducing agent with stronger reducibility are added, and the metal conductive silver paste specifically comprises the following components: the silver conductive paste comprises silver conductive paste, a silver source, a reducing agent and a stabilizing agent;
wherein, the silver conductive paste comprises: 40 parts by weight of silver-coated copper powder (the mass fraction of silver in the silver-coated copper powder is 20%), 5 parts by weight of polyester resin, 5 parts by weight of acrylic resin and 50 parts by weight of DBE solvent;
the silver source is silver oxide, the reducing agent is acetaldehyde, the stabilizing agent is polyvinylpyrrolidone, the mass of the silver oxide is 15% of that of the silver conductive paste, the mass of the acetaldehyde is 5% of that of the silver conductive paste, and the mass of the polyvinylpyrrolidone is 1% of that of the silver conductive paste.
The preparation method of the metal conductive silver paste comprises the following steps: and mixing the silver conductive paste, a silver source, a reducing agent and a stabilizing agent, and uniformly stirring to obtain the metal conductive silver paste.
Example 3
Compared with the embodiment 1, the embodiment of the application provides the metal conductive silver paste, the silver source adopts a mixed silver source, the silver source with better stability is selected, and the use of a stabilizer is reduced; the paint specifically comprises the following components: the silver conductive paste comprises silver conductive paste, a silver source, a reducing agent and a stabilizing agent;
wherein the silver conductive paste comprises: 40 parts by weight of silver-coated copper powder (the mass fraction of silver in the silver-coated copper powder is 20%), 5 parts by weight of polyester resin, 5 parts by weight of acrylic resin and 50 parts by weight of DBE solvent;
the silver source is a mixture of nano silver wires (with the average diameter of 15 nm) and silver lactate; the reducing agent is ethylene glycol, and the stabilizing agent is palmitic acid; the mass of the nano silver wire is 5 percent of the mass of the silver conductive paste, the mass of the silver lactate is 5 percent of the mass of the silver conductive paste, the mass of the ethylene glycol is 2 percent of the mass of the silver conductive paste, and the mass of the palmitic acid is 0.4 percent of the mass of the silver conductive paste.
The preparation method of the metal conductive silver paste comprises the following steps: and mixing the silver conductive paste, the silver source, the reducing agent and the stabilizing agent, and uniformly stirring to obtain the metal conductive silver paste.
Example 4
Compared with the embodiment 1, the embodiment provides the metal conductive silver paste, wherein the silver source adopts a mixed silver source, a reducing agent with lower reducibility is selected, and a stabilizing agent with lower stability is selected; the paint specifically comprises the following components: the silver conductive paste comprises silver conductive paste, a silver source, a reducing agent and a stabilizing agent;
wherein, the silver conductive paste comprises: 40 parts by weight of silver-coated copper powder (the mass fraction of silver in the silver-coated copper powder is 20%), 5 parts by weight of polyester resin, 5 parts by weight of acrylic resin and 50 parts by weight of DBE solvent;
the silver source is a mixture of nano silver particles (with an average particle size of 3 nm) and silver stearate; the reducing agent is ascorbic acid, and the stabilizing agent is dimethylformamide; the mass of the nano silver particles is 3 percent of the mass of the silver conductive paste, the mass of the silver stearate is 4 percent of the mass of the silver conductive paste, the mass of the ascorbic acid is 1.5 percent of the mass of the silver conductive paste, and the mass of the dimethylformamide is 0.6 percent of the mass of the silver conductive paste.
The preparation method of the metal conductive silver paste comprises the following steps: and mixing the silver conductive paste, a silver source, a reducing agent and a stabilizing agent, and uniformly stirring to obtain the metal conductive silver paste.
Example 5
Compared with the embodiment 1, the silver source adopts the nickel-in-silver powder; the composition specifically comprises the following components: the silver conductive paste comprises silver conductive paste, a silver source, a reducing agent and a stabilizing agent;
wherein, the silver conductive paste comprises: 40 parts by weight of silver-coated nickel powder (the mass fraction of silver in the silver-coated nickel powder is 20%), 5 parts by weight of polyester resin, 5 parts by weight of acrylic resin and 50 parts by weight of DBE solvent;
the silver source is nano silver clusters (the average particle size is 3 nm), the reducing agent is ethylene glycol, the stabilizing agent is succinic acid, the mass of the nano silver clusters is 10% of the mass of the silver conductive paste, the amount of the ethylene glycol is 2% of the mass of the silver conductive paste, and the mass of the succinic acid is 0.8% of the mass of the silver conductive paste.
The preparation method of the metal conductive silver paste comprises the following steps: and mixing the silver conductive paste, the silver source, the reducing agent and the stabilizing agent, and uniformly stirring to obtain the metal conductive silver paste.
Comparative example 1
Compared with the conductive silver paste provided by the embodiment 1, the conductive silver paste is not added with a silver source, a reducing agent and a stabilizing agent; the paint specifically comprises the following components: 40 parts of silver-coated nickel powder (the mass fraction of silver in the silver-coated nickel powder is 20%), 5 parts of polyester resin, 5 parts of acrylic resin and 50 parts of DBE solvent.
The preparation method of the conductive silver paste comprises the following steps: and mixing the silver-coated nickel powder, the polyester resin, the acrylic resin and the DBE solvent, and uniformly stirring to obtain the conductive silver paste.
Comparative example 2
Compared with the conductive silver paste provided by the embodiment 1, only a silver source is added, and a reducing agent and a stabilizing agent are not added; the paint specifically comprises the following components: a silver conductive paste and a silver source;
wherein the silver conductive paste comprises: 40 parts by weight of silver-coated copper powder (the mass fraction of silver in the silver-coated copper powder is 20%), 5 parts by weight of polyester resin, 5 parts by weight of acrylic resin and 50 parts by weight of DBE solvent;
the silver source is nano silver clusters (the average particle size is 3 nm), and the mass of the nano silver clusters is 10% of that of the silver conductive paste.
The preparation method of the metal conductive silver paste comprises the following steps: and mixing the silver conductive paste and the silver source, and uniformly stirring to obtain the metal conductive silver paste.
Comparative example 3
Compared with the conductive silver paste provided by the embodiment 1, only the silver source and the reducing agent are added, and the stabilizing agent is not added; the paint specifically comprises the following components: silver conductive paste, a silver source and a reducing agent;
wherein, the silver conductive paste comprises: 40 parts by weight of silver-coated copper powder (the mass fraction of silver in the silver-coated copper powder is 20%), 5 parts by weight of polyester resin, 5 parts by weight of acrylic resin and 50 parts by weight of DBE solvent;
the silver source is nano silver clusters (the average grain diameter is 3 nm), the reducing agent is ethylene glycol, the mass of the nano silver clusters is 10% of the mass of the silver conductive paste, and the amount of the ethylene glycol is 2% of the mass of the silver conductive paste.
The preparation method of the metal conductive silver paste comprises the following steps: and mixing the silver conductive paste, a silver source and a reducing agent, and uniformly stirring to obtain the metal conductive silver paste.
Performance test
Uniformly stirring and mixing the metal conductive silver paste obtained in the examples 1-5 and the conductive silver paste obtained in the comparative examples 1-3 by a dispersion machine until the fineness is less than 15 micrometers, coating the mixture on a base material, curing the mixture for 30min at 150 ℃, and testing the resistivity; the resistivity was then aged for 240h at 85 ℃ RH% (i.e. 85% relative humidity) and tested, the results are shown in Table 1.
Table 1-resistivity of conductive silver paste after curing and after aging in different examples
As can be seen from table 1, in example 1, by adding the silver source, the reducing agent and the stabilizer, almost all exposed copper can be protected by the metal conductive silver paste after curing, and there is no risk of exposing copper during continuous aging, and the resistivity is unchanged after aging; compared with the embodiments 1-2, in the embodiment 2, after more silver sources and strong reducing agents are added, the metal conductive silver paste has lower resistance, the surface of the silver-coated copper powder is wrapped more compactly, and meanwhile, in the aging process, the silver is further reduced, so that the resistance is further reduced; compared with the examples 1 and 3, more stable silver sources are selected, and under the condition of nano silver wires, more silver-coated copper powder is protected by lapping, and meanwhile, in the aging process, the resistivity can be further reduced due to the stability of the silver sources; compared with the examples 1 and 4, the addition of a small amount of high-efficiency silver source and reducing agent and stabilizer with higher matching property can realize high-efficiency silver-coated copper surface coating, and the resistivity is reduced more obviously after aging, which shows that more silver sources are effectively deposited on the copper surface instead of the silver surface; comparing examples 1 and 5, the effect of coating different cheap metal powders is still maintained, and since the resistivity of nickel is greater than that of copper, there is a certain loss of initial resistivity, but the effect is not changed after aging.
In the comparative example 1, no silver source and protective measures are added, and the bare copper can be oxidized during aging, so that the overall conductivity is greatly influenced; as can be seen from the comparative example 2, the conductivity efficiency can be improved to a certain extent only by adding the silver source, but because no reducing agent or stabilizing agent exists, more silver exists only and does not cover the surface of copper, so that most of conductivity is still lost in the aging process; it can be seen from comparative example 3 that silver can still be efficiently reduced without the addition of a stabilizer, and similarly, due to insufficient stability, more silver is reduced mechanically to the silver surface rather than copper, thereby significantly compromising the aging performance.
The invention is not to be considered as limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.
Claims (10)
1. The metal conductive silver paste is characterized by comprising the following components: the silver conductive paste comprises silver conductive paste, a silver source, a reducing agent and a stabilizing agent;
wherein the valence of silver in the silver source is zero or + 1.
2. The metallic conductive silver paste of claim 1, wherein said silver source comprises at least one of nano-silver particles, nano-silver wires, nano-silver clusters, silver oxide, silver nitrate, silver sulfate, silver carbonate, silver acetate, silver lactate, silver bromide, silver iodide, silver phosphate, and silver stearate.
3. The metal conductive silver paste of claim 1, wherein the reducing agent comprises at least one of formaldehyde, acetaldehyde, sodium hydroxide, potassium hydroxide, oxalic acid, sodium borohydride, potassium borohydride, copper, iron, polysaccharides, starch, glucose, hydrogen peroxide, ascorbic acid, ethylene glycol, hydrazine hydrate, 1-methyl-3-butylamidine tetrafluoroborate.
4. The metal conductive silver paste of claim 1, wherein the stabilizer comprises at least one of a mercapto compound, an amino compound, a carboxyl compound, a hydroxyl compound, and a polymer compound.
5. The metal conductive silver paste of claim 4, wherein said stabilizer comprises at least one of ethylene glycol, polyethylene glycol, glycerol, thioglycolic acid, mercaptopropionic acid, mercaptobenzoic acid, alkyl thiols, thioanthrenol, ammonia, ethylamine, propylenediamine, ethylenediamine, butylamine, long chain aminoalkanes, formic acid, acetic acid, succinic acid, lactic acid, stearic acid, oleic acid, palmitic acid, carboxyalkanes, polyethylene, polyvinylpyrrolidone, pyrrolidone acetamide, dimethylformamide.
6. The metal conductive silver paste of claim 4, wherein the silver conductive paste comprises at least one of a copper-on-silver conductive paste and a nickel-on-silver conductive paste.
7. The metallic conductive silver paste of claim 6, wherein the silver-clad copper conductive paste comprises silver-clad copper powder, a resin, and a solvent;
and/or the silver-coated nickel conductive paste comprises silver-coated nickel powder, resin and a solvent;
and/or the resin comprises at least one of epoxy resin, polyester resin and acrylic resin;
and/or the solvent comprises at least one of DBE, ethylene glycol ethyl ether acetate, ethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate, diethylene glycol butyl ether and terpineol;
and/or the mass ratio of the silver-coated copper powder or the silver-coated nickel powder, the resin and the solvent is (30-50) to (5-15) to (40-60).
8. The metal conductive silver paste of any one of claims 1 to 7, wherein the mass of the silver source is 3 to 15% of the mass of the silver conductive paste;
the mass of the reducing agent is 1-5% of that of the silver conductive paste;
the mass of the stabilizer is 0.2-1% of that of the silver conductive paste.
9. The method for preparing the metal conductive silver paste according to any one of claims 1 to 8, wherein the metal conductive silver paste is obtained by mixing and stirring the silver conductive paste, the silver source, the reducing agent and the stabilizing agent.
10. Use of the metal conductive silver paste according to any one of claims 1-8 in a precision circuit.
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CN116060610A (en) * | 2023-03-07 | 2023-05-05 | 东方电气集团科学技术研究院有限公司 | Silver-coated copper powder and preparation method and application thereof |
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CN111304640A (en) * | 2020-03-10 | 2020-06-19 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | Silver-coated copper powder, preparation method thereof and electronic paste |
CN114914011A (en) * | 2022-06-14 | 2022-08-16 | 苏州思尔维纳米科技有限公司 | Repairing silver-coated copper powder and preparation method thereof, and electronic paste and preparation method thereof |
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CN107737949A (en) * | 2017-10-23 | 2018-02-27 | 重庆云天化瀚恩新材料开发有限公司 | A kind of silver-coated copper powder and preparation method thereof |
CN111304640A (en) * | 2020-03-10 | 2020-06-19 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | Silver-coated copper powder, preparation method thereof and electronic paste |
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