CN115725185A - Thermal interface material based on liquid metal bridging aluminum powder and preparation method thereof - Google Patents
Thermal interface material based on liquid metal bridging aluminum powder and preparation method thereof Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 84
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 79
- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 59
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 229920002545 silicone oil Polymers 0.000 claims abstract description 35
- 229910000846 In alloy Inorganic materials 0.000 claims abstract description 24
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 21
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 20
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000001257 hydrogen Substances 0.000 claims abstract description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 10
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 9
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 9
- 239000003112 inhibitor Substances 0.000 claims abstract description 7
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 23
- 239000006185 dispersion Substances 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 230000009969 flowable effect Effects 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000003921 oil Substances 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims 2
- 230000008023 solidification Effects 0.000 claims 2
- 238000003490 calendering Methods 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 abstract description 14
- 230000009286 beneficial effect Effects 0.000 abstract description 6
- 238000012546 transfer Methods 0.000 abstract description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 230000006835 compression Effects 0.000 abstract description 5
- 238000007906 compression Methods 0.000 abstract description 5
- 229910052733 gallium Inorganic materials 0.000 abstract description 5
- 239000000945 filler Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 8
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 2
- 229920005570 flexible polymer Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
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- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009775 high-speed stirring Methods 0.000 description 1
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- 238000012956 testing procedure Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
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Abstract
The invention relates to the technical field of thermal interface materials, in particular to a thermal interface material based on liquid metal bridging aluminum powder and a preparation method thereof. The thermal interface material based on the liquid metal bridging aluminum powder comprises the following raw material components: 8.54 parts of vinyl silicone oil, 1.44 parts of hydrogen-containing silicone oil, 0.003 part of catalyst, 0.01 part of inhibitor, 60-90 parts of spherical aluminum powder and 0.01-30 parts of gallium-indium alloy. According to the invention, gallium-based liquid metal is introduced into a polydimethylsiloxane/aluminum system, and a channel which is beneficial to phonon heat transfer is erected between spherical aluminum and spherical aluminum in a liquid bridge manner, so that the interface thermal resistance is reduced, and the heat conducting property of a thermal interface material is improved; meanwhile, the liquid metal is used as a connecting agent, so that the material has certain compression deformation capacity, and the flexibility of the thermal interface material is improved.
Description
Technical Field
The invention relates to the technical field of thermal interface materials, in particular to a thermal interface material based on liquid metal bridging aluminum powder and a preparation method thereof.
Background
With the ever-decreasing transistor size and increasing packaging density, thermal management has become a bottleneck in the development of next generation electronic devices. An important component of thermal management is Thermal Interface Materials (TIMs). Thermal interface materials connect two non-uniform solid surfaces together, replacing the original poor thermal conductor, air, on both surfaces, and facilitating the transfer of heat from one medium to the other. At present, the flexible polymer is widely used in the field of thermal interface materials due to the characteristics of low processing cost, easy processing, excellent mechanical property and the like. However, the flexible polymer has the defect of poor heat conductivity and cannot meet the heat dissipation of electronic components, so that scientific researchers add high-heat-conductivity fillers into the polymer, and the fillers are mutually contacted in a polymer matrix to form an effective heat-conducting path, so that the heat conductivity of the thermal interface material is improved. When seeking high heat conduction, scientists can realize high filling amount in polymers, such as filling fillers with different particle sizes in siloxane matrix proposed by Weiyu and the like, and filling gaps among large-size particles by using small-size particles under the condition of the same filler content, so that the fillers are more tightly stacked, the heat resistance among the fillers is reduced, and the heat conduction performance of a thermal interface material is improved. However, the high filling amount of the filler can cause the flexibility of the thermal interface material to be sacrificed, and the processability is also deteriorated, so that the high thermal conductivity and the good flexibility cannot be simultaneously combined, and a balance point needs to be found between the thermal conductivity and the flexibility to meet the requirements of the current electronic equipment.
The thermal interface material is one of the key materials for packaging the integrated circuit, is used for reducing the contact thermal resistance between an electronic device and a radiator, and directly influences the performance and the service life of the electronic device. As electronic device power density and package size continue to increase, thermal interface materials not only require high thermal conductivity, but also require superior compliance (high elongation at break and low elastic modulus) to reduce thermal contact resistance and mitigate stress induced warpage failures. However, thermal conductivity and compliance tend to be mutually constrained in thermal interface materials.
In order to improve the flexibility and strength of the thermal interface material (MAQ, WANG Z, LIANG T, et al. The unknown of the roll of filter surface energy in enhancing thermal conductivity and mechanical properties of the thermal interface materials [ J ]. The compositions Part A: applied Science and Manufacturing,2022, 157. HUQINGHUA et al (HU Q, BAI X, ZHANG C, et al. Oriented BN/Silicone Rubber Composite Thermal Interface Materials with High Out-of-Plane Thermal Conductivity and Flexibility [ J ]. Composites Part applied Science and Manufacturing,2021,152 (7428): 106681.) prepared a Silicone Rubber-based Thermal Interface material with High Out-of-Plane Thermal Conductivity and softness by combining shear orientation and layer-by-layer stacking methods, by utilizing the High temperature curing properties of Silicone Rubber to stack uncured highly horizontally oriented BN/Silicone Rubber films layer-by-layer, forming tight chemical bonds between the films during curing, thereby improving overall Flexibility. Although the flexibility is improved, the above work cannot be greatly broken through.
Therefore, in thermal interface materials, how to improve the flexibility while improving the thermal conductivity remains a significant challenge.
Disclosure of Invention
In order to overcome the technical problems, the invention provides a thermal interface material based on liquid metal bridging aluminum powder and a preparation method thereof, wherein gallium-based liquid metal is introduced into a polydimethylsiloxane/aluminum system, and a channel beneficial to phonon heat transfer is erected between spherical aluminum and spherical aluminum in a liquid bridge form, so that the interface thermal resistance is reduced, and the heat conducting performance of the thermal interface material is improved; meanwhile, the liquid metal is used as a connecting agent, so that the material has certain compression deformation capacity, and the flexibility of the thermal interface material is improved.
The invention provides a thermal interface material based on liquid metal bridging aluminum powder, which comprises the following raw material components: 8.54 parts of vinyl silicone oil, 1.44 parts of hydrogen-containing silicone oil, 0.003 part of catalyst, 0.01 part of inhibitor, 60-90 parts of spherical aluminum powder and 0.01-30 parts of gallium-indium alloy;
the spherical aluminum powder is dispersed in a polydimethylsiloxane polymer matrix, and the gallium-indium alloy forms metal liquid bridge connection between the spherical aluminum powder and the spherical aluminum powder.
Preferably, the mass average molecular weight of the vinyl silicone oil is 180000-20000, and the hydrogen group content is 0.1-0.12 mmol/g.
Preferably, the average molecular weight of the hydrogen-containing silicone oil is 8000-10000, and the vinyl content is 0.20-24 mmol/g.
Preferably, the vinyl silicone oil has a mass average molecular weight of 4000 to 5000 and a vinyl content of 0.32 to 0.34mmol/g.
Preferably, the average particle diameter of the spherical aluminum powder is 11 to 13 μm.
Preferably, the mass ratio of Ga to In the gallium-indium alloy is 3.
The invention also provides a preparation method of the thermal interface material based on the liquid metal bridging aluminum powder, which comprises the following steps:
mixing the vinyl silicone oil, the hydrogen-containing silicone oil and the inhibitor, and then placing the mixture into an ultrasonic cleaning machine for dispersion to obtain a silicone oil mixture;
placing the silicon oil mixture and the gallium-indium alloy in a high-speed mixer for vacuum stirring to obtain a dispersion liquid of the gallium-indium alloy and the silicon oil;
adding the spherical aluminum powder into the dispersion liquid, and carrying out vacuum stirring in a high-speed mixer to obtain a uniform flowable paste A;
dropwise adding the catalyst into the flowable paste A, and carrying out vacuum stirring in a high-speed mixer to obtain uniform flowable paste B;
and (3) rolling and curing the fluid paste B to obtain heat conducting gel, namely the thermal interface material based on the liquid metal bridging aluminum powder.
Preferably, the ultrasonic cleaner disperses for 30min.
Preferably, the conditions of vacuum stirring in the high-speed mixer are as follows: the vacuum degree is 30bar or below, the temperature is 25 ℃, and the rotating speed is 1500r/min;
preparing a dispersion liquid of the gallium-indium alloy and the silicone oil, and stirring for 5min;
in the preparation of the flowable pastes A and B, the stirring time is 2min.
Preferably, in the curing of the fluid paste B after rolling, the curing conditions are as follows: curing at 150 ℃ for 2h.
Compared with the prior art, the invention has the beneficial effects that:
according to the thermal interface material based on the liquid metal bridging aluminum powder, gallium-based liquid metal is introduced into a polydimethylsiloxane/aluminum system to serve as auxiliary filler, and a channel which is favorable for phonon heat transfer is erected between spherical aluminum and spherical aluminum in a liquid bridge mode, so that the interface thermal resistance is reduced, and the heat conducting performance of the thermal interface material is improved; meanwhile, the liquid metal is used as a connecting agent, so that the material has certain compression deformation capacity, and the flexibility of the thermal interface material is improved. The thermal interface material based on the liquid metal bridging aluminum powder has the thermal conductivity coefficient as high as 4.25W m -1 K -1 The fracture elongation is as high as 164.9%, the Young modulus is only 174kPa, the flexibility is excellent, the mechanical property of the high-power high-modulus thermal interface material is similar to that of a biological soft tissue, and the high-power high-modulus thermal interface material can be used as a thermal interface material for high-power and large-size chips (such as CoWoS wafer level packaging).
The preparation method of the thermal interface material based on the liquid metal bridging aluminum powder is simple in process and easy to realize.
Drawings
FIG. 1 is a schematic structural diagram of a thermal interface material based on a liquid metal bridging aluminum powder according to the present invention;
fig. 2 is an EDS image of a cross section of a thermal interface material based on a liquid metal bridging aluminum powder prepared in example 1 of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The following is a description of the preferred embodiments of the present invention, and it should be noted that, for those skilled in the art, various modifications and improvements can be made without departing from the principle of the embodiments of the present invention, and these modifications and improvements are also considered to be within the scope of the present invention.
The invention provides a thermal interface material based on liquid metal bridging aluminum powder, which comprises the following raw material components: 8.54 parts of vinyl silicone oil, 1.44 parts of hydrogen-containing silicone oil, 0.003 part of catalyst, 0.01 part of inhibitor, 60-90 parts of spherical aluminum powder and 0.01-30 parts of gallium-indium alloy;
the spherical aluminum powder is dispersed in a polydimethylsiloxane polymer matrix, and the gallium-indium alloy forms metal liquid bridge connection between the spherical aluminum powder and the spherical aluminum powder.
The structure of the thermal interface material based on the liquid metal bridging aluminum powder is shown in figure 1, gallium-based liquid metal is introduced as auxiliary filler, the liquidity of the liquid metal is exerted, and a channel beneficial to phonon heat transfer is erected between spherical aluminum powder and spherical aluminum powder in a liquid bridge mode, so that the interface thermal resistance is reduced, and the heat conducting performance of the thermal interface material is improved. Meanwhile, the liquid metal is used as a connecting agent, so that the material has certain compression deformation capacity, and the flexibility of the thermal interface material is improved.
Wherein the mass average molecular weight of the vinyl silicone oil is preferably 180000-20000, and the hydrogen radical content is preferably 0.1-0.12 mmol/g. The average molecular weight of the hydrogen-containing silicone oil is preferably 8000-10000, and the vinyl content is preferably 0.20-24 mmol/g. The vinyl silicone oil preferably has a mass average molecular weight of 4000 to 5000 and a vinyl content of 0.32 to 0.34mmol/g. The average particle diameter of the spherical aluminum powder is preferably 11 to 13 μm. The mass ratio of Ga to In the gallium-indium alloy is preferably 3.
The invention also provides a preparation method of the thermal interface material based on the liquid metal bridging aluminum powder, which comprises the following steps:
mixing the vinyl silicone oil, the hydrogen-containing silicone oil and the inhibitor, and then placing the mixture into an ultrasonic cleaning machine for dispersion to obtain a silicone oil mixture;
placing the silicon oil mixture and the gallium-indium alloy in a high-speed mixer for vacuum stirring to obtain a dispersion liquid of the gallium-indium alloy and the silicon oil;
adding the spherical aluminum powder into the dispersion liquid, and carrying out vacuum stirring in a high-speed mixer to obtain uniform flowable paste A;
dropwise adding the catalyst into the flowable paste A, and carrying out vacuum stirring in a high-speed mixer to obtain uniform flowable paste B;
and (3) rolling and curing the fluid paste B to obtain heat conducting gel, namely the thermal interface material based on the liquid metal bridging aluminum powder.
In the ultrasonic process, an oxide film of the Liquid Metal (LM) can be broken and dispersed into liquid drops with micron-sized diameters, capillary force is formed between the Liquid Metal (LM) and the aluminum powder in the high-speed stirring process, and the Liquid Metal (LM) bridges the aluminum powder distributed in the island.
Wherein, in the dispersion of the ultrasonic cleaner, the dispersion time is preferably 30min. The conditions of vacuum stirring in the high-speed mixer are preferably as follows: the vacuum degree is 30bar and below, the temperature is 25 ℃, and the rotating speed is 1500r/min; preparing a dispersion liquid of the gallium-indium alloy and the silicone oil, and stirring for 5min; in the preparation of the flowable pastes A and B, the stirring time is 2min. In the process of curing the fluid paste B after rolling, the curing conditions are preferably as follows: curing at 150 ℃ for 2h.
Example 1
The thermal interface material based on the liquid metal bridging aluminum powder is prepared by the following steps:
mixing vinyl silicone oil (selected from RH-100 and RH-500 of Zhejiang Runshe Silicones New Material Co., ltd in a mass ratio of 1: 169: weighing in a mass ratio of 1, placing in a container, and dispersing the mixture in an ultrasonic cleaning machine for 30min to obtain a silicone oil mixture;
placing 9.997g of the silicon oil mixture and 10g of gallium-indium alloy in a high-speed mixer, vacuumizing, and stirring at 1500r/min for 5min to obtain a dispersion liquid of the gallium-indium alloy and the silicon oil;
adding 80g of spherical aluminum powder into the dispersion liquid of the gallium-indium alloy and the silicone oil, mixing, and stirring in a high-speed mixer at 1500r/min in vacuum for 2min to obtain uniform fluid paste A;
dripping 0.003g of catalyst into the flowable paste A, and stirring in a high-speed mixer at 1500r/min in vacuum for 2min to obtain a uniform flowable paste B;
and (3) rolling the fluid paste B, and curing for 2h at 150 ℃ to obtain the heat-conducting gel, namely the thermal interface material based on the liquid metal bridging aluminum powder.
As shown in fig. 2, for the EDS image of the cross section of the thermal interface material based on the liquid metal bridging aluminum powder prepared in this embodiment, it can be seen from the figure that the Liquid Metal (LM) not only forms a bridge structure between the aluminum powders, but also forms a bridge structure between the PDMS, and the aluminum powders and the Liquid Metal (LM) are not agglomerated in the PDMS matrix, and are uniformly dispersed, which is beneficial to improving the thermal conductivity and flexibility of the thermal interface material.
Example 2
The preparation process of the thermal interface material based on the liquid metal bridging aluminum powder is different from that in the embodiment 1 in that: the mass of the gallium-indium alloy is 20g, and the mass of the spherical aluminum powder is 70g.
Example 3
The preparation process of the thermal interface material based on the liquid metal bridging aluminum powder is different from that of the thermal interface material in the example 1 in that: the mass of the gallium-indium alloy is 30g, and the mass of the spherical aluminum powder is 60g.
Comparative example 1
Mixing vinyl silicone oil (selected from RH-100 and RH-500 of Zhejiang Runshe Silicones New Material Co., ltd in a mass ratio of 1: 169: weighing in a mass ratio of 1, placing in a container, and dispersing the mixture in an ultrasonic cleaning machine for 30min to obtain a silicone oil mixture;
adding 90g of spherical aluminum powder into 9.997g of the silicone oil mixture, mixing, and stirring in a high-speed mixer at 1500r/min in vacuum for 2min to obtain uniform fluid paste A;
dripping 0.003g of catalyst into the fluid paste A, and stirring in a high-speed mixer at 1500r/min in vacuum for 2min to obtain uniform fluid paste B;
and (3) rolling the fluid paste B, and curing for 2 hours at 150 ℃ to obtain the thermal interface material.
The thermal interface materials based on the liquid metal bridging aluminum powder prepared in examples 1-3 and the thermal interface material prepared in comparative example 1 were subjected to a thermal conductivity test and a mechanical property test.
And (3) testing the heat conduction performance:
a standard test method for measuring heat conduction in a vertical direction by a steady state method is provided, wherein a test instrument is an LW-9389TIM resistance and conductivity measuring instrument, and the method comprises the following specific steps: the thermal resistance R of the thermal interface composite materials with three different thicknesses is respectively tested at the temperature of 80 ℃ and the pressure of 10psi Total And the relationship between the thickness and the BLT, and fitting the obtained data line shape, wherein the slope is the thermal conductivity coefficient kappa of the thermal interface material TIM The intercept with the y-axis is the contact thermal resistance R Contact ：
R Total ＝R Contact +BLT/κ TIM
And (3) testing mechanical properties:
the fracture energy of the thermal interface material was measured by using an Shimadzu universal electronic tester AGX-10 kNVD. Test conditions and parameters: the temperature was 25 ℃ and the drawing speed was 10mm/min. The testing procedure was to cut the thermal interface material into dumbbell-shaped samples 50mm long and 4mm wide.
The thermal conductivity, thermal contact resistance and fracture energy test results of the thermal interface materials of examples 1 to 3 and comparative example 1 obtained according to the above-described method test methods are shown in table 1.
TABLE 1 thermal conductivity, thermal contact resistance, and fracture energy test results for the thermal interface materials of examples 1-3, comparative example 1
Compared with the prior art, the invention has the beneficial effects that:
according to the thermal interface material based on the liquid metal bridging aluminum powder, gallium-based liquid metal is introduced into a polydimethylsiloxane/aluminum system and is used as an auxiliary filler, and a channel which is favorable for phonon heat transfer is erected between spherical aluminum and spherical aluminum in a liquid bridge mode, so that the interface thermal resistance is reduced, and the heat conducting performance of the thermal interface material is improved; meanwhile, the liquid metal is used as a connecting agent, so that the material has certain compression deformation capacity, and the flexibility of the thermal interface material is improved. The thermal interface material based on the liquid metal bridging aluminum powder has the thermal conductivity coefficient as high as 4.25W m -1 K -1 The breaking elongation is as high as 164.9%, the Young modulus is only 174kPa, the flexibility is excellent, the mechanical property is similar to that of a biological soft tissue, and the material can be used as a thermal interface material for high-power and large-size chips (such as CoWOS wafer level packaging).
The preparation method of the thermal interface material based on the liquid metal bridging aluminum powder has simple process and is easy to realize.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A thermal interface material based on liquid metal bridging aluminum powder is characterized by comprising the following raw material components: 8.54 parts of vinyl silicone oil, 1.44 parts of hydrogen-containing silicone oil, 0.003 part of catalyst, 0.01 part of inhibitor, 60-90 parts of spherical aluminum powder and 0.01-30 parts of gallium-indium alloy;
the spherical aluminum powder is dispersed in a polydimethylsiloxane polymer matrix, and the gallium-indium alloy forms metal liquid bridge connection between the spherical aluminum powder and the spherical aluminum powder.
2. The thermal interface material based on liquid metal bridging aluminum powder as claimed in claim 1, wherein the mass average molecular weight of the vinyl silicone oil is 180000-20000, and the hydrogen radical content is 0.1-0.12 mmol/g.
3. The thermal interface material based on liquid metal bridging aluminum powder as claimed in claim 1, wherein the hydrogen-containing silicone oil has an average molecular weight of 8000-10000 and a vinyl content of 0.20-24 mmol/g.
4. The thermal interface material based on liquid metal bridging aluminum powder as claimed in claim 1, wherein the mass average molecular weight of the vinyl silicone oil is 4000-5000, and the vinyl content is 0.32-0.34 mmol/g.
5. A thermal interface material based on liquid metal bridging aluminum powder as claimed in claim 1, wherein the average particle size of the spherical aluminum powder is 11-13 μm.
6. The thermal interface material based on liquid metal bridging aluminum powder as claimed In claim 1, wherein the mass ratio of Ga to In the gallium-indium alloy is 3.
7. A method for preparing a thermal interface material based on liquid metal bridging aluminum powder according to any one of claims 1 to 6, comprising the following steps:
mixing the vinyl silicone oil, the hydrogen-containing silicone oil and the inhibitor, and then placing the mixture into an ultrasonic cleaning machine for dispersion to obtain a silicone oil mixture;
placing the silicon oil mixture and the gallium-indium alloy in a high-speed mixer for vacuum stirring to obtain a dispersion liquid of the gallium-indium alloy and the silicon oil;
adding the spherical aluminum powder into the dispersion liquid, and carrying out vacuum stirring in a high-speed mixer to obtain uniform flowable paste A;
dropwise adding the catalyst into the fluid paste A, and carrying out vacuum stirring in a high-speed mixer to obtain uniform fluid paste B;
and (3) calendering and curing the fluid paste B to obtain heat-conducting gel, namely the thermal interface material based on the liquid metal bridging aluminum powder.
8. The method for preparing a thermal interface material based on liquid metal bridging aluminum powder as claimed in claim 7, wherein the dispersion time in the ultrasonic cleaning machine is 30min.
9. The method for preparing a thermal interface material based on liquid metal bridging aluminum powder as claimed in claim 7, wherein the conditions of vacuum stirring in a high-speed mixer are as follows: the vacuum degree is 30bar and below, the temperature is 25 ℃, and the rotating speed is 1500r/min;
preparing a dispersion liquid of the gallium-indium alloy and the silicone oil, and stirring for 5min;
in the preparation of the flowable pastes A and B, the stirring time is 2min.
10. The method for preparing a thermal interface material based on liquid metal bridging aluminum powder as claimed in claim 7, wherein in the solidification of the fluid paste B after rolling, the solidification conditions are as follows: curing at 150 ℃ for 2h.
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Cited By (2)
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| CN116891729A (en) * | 2023-07-13 | 2023-10-17 | 中国农业大学 | Liquid metal thermal interface material with elasticity and viscosity and preparation method thereof |
| CN116891729B (en) * | 2023-07-13 | 2024-04-02 | 中国农业大学 | Liquid metal thermal interface material with elasticity and viscosity and preparation method thereof |
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