CN115715060A - HDI board manufacturing method for improving through blind hole matching precision - Google Patents

HDI board manufacturing method for improving through blind hole matching precision Download PDF

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Publication number
CN115715060A
CN115715060A CN202211439134.4A CN202211439134A CN115715060A CN 115715060 A CN115715060 A CN 115715060A CN 202211439134 A CN202211439134 A CN 202211439134A CN 115715060 A CN115715060 A CN 115715060A
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rod
positioning
heat dissipation
improving
section
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CN202211439134.4A
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CN115715060B (en
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文颖
李斌
李宏宇
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Shenzhen Hailing Keda Technology Co ltd
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Shenzhen Hailing Keda Technology Co ltd
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Abstract

The invention provides a manufacturing method of an HDI board for improving the matching precision of through blind holes, which comprises the following steps: firstly, a first pin hole is arranged on the HDI board, and then the adjustable jig is adjusted according to the position of the first pin hole to enable the positioning pin hole to be right opposite to the first pin hole, so that the jig can be suitable for HDI boards of different specifications, and then each PCB daughter board is fixed and punched. The invention aims to provide a HDI board manufacturing method for improving through blind hole matching accuracy, and solves the problems of high cost and low efficiency caused by the fact that jigs of different specifications are needed when HDI boards of different specifications are manufactured.

Description

HDI board manufacturing method for improving through blind hole matching precision
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of an HDI board for improving through blind hole matching accuracy.
Background
In recent years, with the continuous update of numerous types of electronic devices, circuit board technology associated with the electronic devices has been rapidly developed, wherein HDI boards are widely used in various careful electronic devices because of their higher circuit density and their compact design. And the HDI board uses little blind buried via technique when the preparation, need beat when the preparation and establish the blind hole on the PCB board on top layer, simultaneously, still need beat again on the PCB board and establish buried via and through-hole, and need guarantee to keep matching between each hole when punching, otherwise can influence product quality and even lead to the product to scrap.
In the prior art, a chinese patent document with application number CN202111069475.2 discloses a method for manufacturing an HDI board for improving the matching precision of a through blind hole and an HDI board, wherein a first pin hole is cut in a product comprising a multi-layer sub-board; manufacturing a jig, and drilling a second pin hole on the jig; embedding a positioning pin, wherein the positioning pin penetrates through the first pin hole and the second pin hole and is fixed on the jig; pressing pins of the daughter boards of the product along the positioning pins in sequence, and performing hot-melt pressing; drilling holes on the pressed product, measuring the expansion and contraction values of the daughter boards, recording the average expansion and contraction values of the holes, and providing compensation reference for the subsequent manufacturing process by using the difference of the average expansion and contraction values of the holes. According to the method, the deviation of the sub-boards in the HDI board hot melting laminating process is reduced by using the jig for positioning, and the subsequent process is compensated by the expansion and contraction average value of each hole, so that the sub-boards of the HDI board can be well aligned, the matching precision of each hole is improved, and the production yield is improved.
However, when the method is used, the HDI boards with different specifications need to be manufactured with jigs with different specifications when being manufactured, which not only increases the cost, but also causes low manufacturing efficiency.
Therefore, a method for manufacturing the HDI board for improving the through-blind hole matching precision needs to be designed, and the problems of high cost and low efficiency caused by the fact that jigs of different specifications are needed when HDI boards of different specifications are manufactured are solved.
Disclosure of Invention
The invention provides a manufacturing method of an HDI board for improving the through-blind hole matching precision, and solves the problems of high cost and low efficiency caused by the fact that jigs of different specifications are needed when HDI boards of different specifications are prepared.
Therefore, the technical scheme is that the HDI board manufacturing method for improving the through blind hole matching accuracy comprises the following steps:
the method comprises the following steps: punching a positioning pin hole on an adjustable jig in advance, then punching a first pin hole on the HDI board, then adjusting the adjustable jig so as to adjust the position of the positioning pin hole to enable the positioning pin hole to be opposite to the first pin hole, and finally setting a positioning pin and fixing the positioning pin with the adjustable jig;
step two: sequentially penetrating each PCB through the positioning pins for installation and carrying out hot melting and laminating;
step three: and drilling a blind hole and a through hole on the HDI board by using a PCB drilling machine.
Preferably, the adjustable fixture comprises:
the device comprises a base plate, wherein two first support rods are arranged on the base plate in parallel, positioning sliding blocks are arranged on the first support rods in a sliding mode, and the positioning sliding blocks can be fixed with the first support rods;
the two second support rods are arranged in parallel, the second support rods are perpendicular to the first support rods and are connected with the first support rods through positioning sliding blocks, each second support rod comprises a first rod section and a second rod section, a connecting groove is formed between the first rod section and the second rod section, and the connecting groove is fixed with the first rod section and the second rod section through first bolts respectively; and the first rod section and the second rod section are respectively provided with a positioning pin hole in the vertical direction.
Preferably, first vaulting pole includes horizontal plate and vertical board, the horizontal plate level set up and constitute T font structure with vertical board, vertical board lower extreme with bottom plate fixed connection, and vertical board is gone up and has been seted up spacing spout along the horizontal direction, set up the joint groove of T font structure on the slider of location, first vaulting pole joint is at the joint inslot, and the second bolt passes location slider and spacing spout and fixes location slider and first vaulting pole.
Preferably, the connecting groove is of a U-shaped structure, a through groove is formed in the bottom face of the connecting groove along the length direction, and the connecting groove is buckled with the first rod section and the second rod section from bottom to top respectively.
Preferably, the bottom plate is further provided with a cushion block, the cushion block is located between the two first support rods, and the upper surfaces of the cushion blocks are flush with the upper surfaces of the second support rods.
Preferably, the first support rod is provided with scales along the length direction, and the first rod section and the second rod section are also provided with scales.
Preferably, the PCB panel drilling machine includes:
the electric driving cylinder is fixedly arranged on the workbench, an output shaft of the electric driving cylinder is vertically and upwards arranged, a top plate is fixedly arranged on the output shaft of the electric driving cylinder, and a machine head is arranged on the lower surface of the top plate;
the positioning device comprises a positioning pipe, a positioning slide block and a guide slide rod, wherein the positioning pipe is arranged on the periphery of the machine head, the axis of the positioning pipe is vertically arranged, the side wall of the positioning pipe is provided with a guide slide groove along the vertical direction, the guide slide block is arranged in the guide slide groove in a sliding manner, the upper surface of the guide slide block is vertically provided with the guide slide rod, the guide slide rod penetrates through the positioning pipe and is fixedly connected with the bottom wall of the top plate, and a first spring is fixedly arranged between the positioning pipe and the top plate;
the limiting rod is arranged on the side portion of the positioning tube and comprises a clamping section and a supporting section, the clamping section is fixedly connected with the supporting section, the upper end of the supporting section is hinged to the bottom of the driving electric cylinder, the clamping section is vertically arranged, a clamping groove is formed in the side wall, close to the positioning tube, of the clamping section, and a second spring is arranged between the clamping section and the driving electric cylinder;
the clamping blocks are arranged on the side walls of the positioning pipes and can be clamped in the clamping grooves;
the linkage rod is vertically arranged on the bottom wall of the top plate, the linkage rod can abut against the clamping section when moving downwards along with the top plate, and the lower end of the linkage rod is higher than the clamping block.
Preferably, the clamping groove is of a right-angled triangle structure, the bevel edge of the right-angled triangle structure is arranged obliquely upwards, and the clamping block is also of a right-angled triangle structure.
Preferably, still be provided with radiator unit on the workstation, radiator unit sets up the aircraft nose below, radiator unit includes:
the cooling device comprises a cover body, wherein the cover body is fixedly arranged on a workbench, a cooling cavity is arranged in the cover body, a cooling motor is fixedly arranged on the bottom wall of the cooling cavity, an output shaft of the cooling motor is vertically and upwards arranged, a first main shaft is coaxially and fixedly arranged on the output shaft of the cooling motor, a first crank is fixedly arranged on the first main shaft, a second main shaft is vertically arranged on the side part of the cooling motor, the second main shaft is connected with the first main shaft through a second crank, a third crank is arranged on the second main shaft, a fourth crank parallel to the second crank is arranged on the side part of the second crank, and two ends of the fourth crank are respectively hinged with the first crank and the third crank;
the third main shaft is arranged in the heat dissipation cavity in a rotating mode and parallel to the first main shaft, a first gear is fixedly arranged on the third main shaft, and a heat dissipation fan is fixedly arranged on the first main shaft above the first gear;
the second gear ring is sleeved outside the first gear, is engaged with the first gear and is fixedly connected with the fourth crank through a connecting crank, and the connecting crank is perpendicular to the fourth crank;
the heat dissipation filter screen is arranged below the second gear ring, the heat dissipation filter screen is inserted into the cover body from the outside of the cover body along the horizontal direction, the middle part of the heat dissipation filter screen is arranged to be a downward concave structure, the lower surface of the second gear ring is provided with a cleaning brush, and the cleaning brush can be abutted to the upper surface of the heat dissipation filter screen;
the heat dissipation filter screen comprises a separation plate, wherein the separation plate is arranged between a second gear ring and the heat dissipation motor, the separation plate is vertically arranged, a connecting crank penetrates through the separation plate, a bearing block used for clamping the heat dissipation filter screen is arranged on the separation plate, and the bearing block is arranged to be in U-shaped structure and U-shaped structure opening orientation.
Preferably, a guide clamping block is arranged on the first crank in a sliding mode along the length direction, and the connecting crank is connected with the guide clamping block in a sliding mode.
The working principle and the beneficial technical effects of the invention are as follows: when carrying out the HDI board preparation, beat the locating pin hole on adjustable tool in advance, beat on the HDI board and establish first pinhole, the adjustable tool of position adjustment according to first pinhole makes the locating pin hole just right with first pinhole afterwards to make the tool can be applicable to the HDI board of different specifications, fix the punching to each PCB daughter board afterwards, thereby need the tool of different specifications to lead to problem with high costs and inefficiency when solving the HDI board preparation of different specifications.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural diagram of an adjustable jig in the HDI board manufacturing method for improving the through blind hole matching accuracy in the embodiment of the present invention;
FIG. 2 isbase:Sub>A schematic cross-sectional view taken along line A-A of FIG. 1;
FIG. 3 is a schematic structural diagram of a PCB drilling machine in the HDI board manufacturing method for improving the through blind hole matching accuracy in the embodiment of the present invention;
FIG. 4 is a first schematic structural diagram of a heat dissipation assembly in the HDI board manufacturing method for improving the through blind hole matching accuracy according to the embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a second heat dissipation assembly in the HDI board manufacturing method for improving the through blind hole matching accuracy in the embodiment of the present invention.
The reference numbers in the drawings are as follows: 1. an adjustable jig; 101. a base plate; 102. a first stay bar; 103. positioning the sliding block; 104. a second stay bar; 105. a first pole segment; 106. a second pole segment; 107. connecting grooves; 108. a first bolt; 109. a positioning pin hole; 110. a horizontal plate; 111. a vertical plate; 112. a limiting chute; 113. connecting grooves; 114. a second bolt; 115. cushion blocks; 2. a PCB drilling machine; 201. a work table; 202. driving an electric cylinder; 203. a top plate; 204. a machine head; 205. a positioning tube; 206. a guide chute; 207. a guide slider; 208. a guide slide bar; 209. a first spring; 210. a limiting rod; 211. a clamping section; 212. a support section; 213. a clamping groove; 214. a second spring; 215. a clamping block; 216. a linkage rod; 3. a heat dissipating component; 301. a cover body; 302. a heat dissipation cavity; 303. a heat dissipation motor; 304. a first main shaft; 305. a first crank; 306. a second main shaft; 307. a second crank; 308. a third crank; 309. a fourth crank; 310. a third main shaft; 311. a first gear; 312. a heat dissipation fan; 313. a second gear ring; 314. a connecting crank; 315. a heat dissipation filter screen; 316. a cleaning brush; 317. a partition plate; 318. a bearing block; 319. and (4) a guide clamping block.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
The embodiment of the invention provides a manufacturing method of an HDI board for improving the matching precision of through blind holes, which comprises the following steps as shown in FIGS. 1-5:
the method comprises the following steps: drilling a positioning pin hole 109 on the adjustable jig 1 in advance, then drilling a first pin hole on the HDI board, then adjusting the adjustable jig 1 so as to adjust the position of the positioning pin hole 109 to enable the positioning pin hole 109 to be opposite to the first pin hole, and finally setting a positioning pin and fixing the positioning pin with the adjustable jig 1;
step two: sequentially penetrating each PCB through the positioning pins for installation and carrying out hot melting and laminating;
step three: and drilling the blind hole and the through hole on the HDI board by using a PCB drilling machine.
The working principle and the beneficial technical effects of the technical scheme are as follows: when carrying out the HDI board preparation, beat location pinhole 109 in advance on adjustable tool 1, beat on the HDI board and establish first pinhole, make location pinhole 109 just right with first pinhole according to the adjustable tool 1 of the position adjustment of first pinhole afterwards to make the tool be applicable to the HDI board of different specifications, fix later and punch to each PCB daughter board, thereby need the tool of different specifications to lead to problem with high costs and inefficiency during the HDI board preparation of solving different specifications.
In one embodiment, as shown in fig. 1 and 2, the adjustable fixture 1 includes:
the device comprises a base plate 101, wherein two first support rods 102 are arranged on the base plate 101 in parallel, a positioning sliding block 103 is arranged on each first support rod 102 in a sliding manner, and the positioning sliding block 103 can be fixed with the first support rods 102;
the second support rods 104 are arranged in parallel, the second support rods 104 are perpendicular to the first support rod 102 and are connected with the first support rod 102 through a positioning sliding block 103, the second support rods 104 comprise a first rod section 105 and a second rod section 106, a connecting groove 107 is arranged between the first rod section 105 and the second rod section 106, and the connecting groove 107 is fixed with the first rod section 105 and the second rod section 106 through a first bolt 108; the first rod segment 105 and the second rod segment 106 are respectively provided with a positioning pin hole 109 in the vertical direction.
The working principle and the beneficial technical effects of the technical scheme are as follows: when the adjustable jig 1 is used, the positioning pin holes 109 are arranged on the first rod section 105 and the second rod section 106 in advance, when the adjustable jig is used for different HDI plates, the positions of the positioning pin holes 109 need to be adjusted, and at the moment, the positioning slide blocks 103 are moved along the first support rods 102 so as to adjust the distance between the two positioning slide blocks 103, so that the adjustment of the distance between the two second support rods 104 is realized; the depth of insertion of the connecting slot 107 into the first and second rod sections 105, 106 is then adjusted lengthwise, thereby adjusting the distance between the two dowel holes 109 provided in the first and second rod sections 105, 106, respectively. Through the arrangement, the angle adjustment of the positioning pin hole 109 in the plane in the single direction is realized, so that the device can be suitable for HDI plates of various specifications to be used, and different jigs are required to be manufactured independently when the device is used for HDI plates of different specifications at each time.
In one embodiment, the first stay bar 102 includes a horizontal plate 110 and a vertical plate 111, the horizontal plate 110 is horizontally disposed and forms a T-shaped structure with the vertical plate 111, the lower end of the vertical plate 111 is fixedly connected with the bottom plate 101, a limit sliding groove 112 is formed in the vertical plate 111 along the horizontal direction, a connecting groove 113 of the T-shaped structure is formed in the positioning slider 103, the first stay bar 102 is clamped in the connecting groove 113, and a second bolt 114 passes through the positioning slider 103 and the limit sliding groove 112 to fix the positioning slider 103 and the first stay bar 102.
The working principle and the beneficial technical effects of the technical scheme are as follows: through setting up first vaulting pole 102 into T font structure, set up spacing spout 112 and second bolt 114 simultaneously, on the one hand can be better with carrying out the joint between first vaulting pole 102 and the location slider 103, also can fix convenient and fast ground when making things convenient for its gliding needs to the practicality and the stability of device have been promoted.
In one embodiment, the connecting groove 107 is a U-shaped structure, and a through groove is formed on a bottom surface of the connecting groove 107 along a length direction, and the connecting groove 107 is respectively fastened with the first rod section 105 and the second rod section 106 from bottom to top.
The working principle and the beneficial technical effects of the technical scheme are as follows: by providing the connecting slot 107 as a U-shaped structure which is engaged with the first and second rod sections 105 and 106 from bottom to top in use, and then fixed by the first bolt 108, the upper surfaces of the first and second rod sections 105 and 106 are kept flush, thereby further enhancing the fixing effect on the HDI plate.
In one embodiment, a spacer block 115 is further disposed on the bottom plate 101, the spacer block 115 is located between the two first support rods 102, and an upper surface of the spacer block 115 is flush with an upper surface of the second support rod 104.
The working principle and the beneficial technical effects of the technical scheme are as follows: through setting up cushion 115, cushion 115 upper surface and second vaulting pole 104 upper surface parallel and level simultaneously, second vaulting pole 104 supports HDI board bottom from both sides during the use, and cushion 115 then supports the HDI board from middle part to make bearing structure more stable, lead to the HDI board middle part to take place to buckle and warp the influence use because of the atress when avoiding drilling.
In one embodiment, the first stay 102 is provided with a scale along the length direction, and the first rod segment 105 and the second rod segment 106 are also provided with scales.
The working principle and the beneficial technical effects of the technical scheme are as follows: through set up the scale respectively on first vaulting pole 102, first pole section 105 and second pole section 106, carry out accurate control when making things convenient for adjustable tool 1 to adjust to further promote the matching precision.
In one embodiment, as shown in fig. 3, the PCB board drilling machine includes:
a driving electric cylinder 202 is fixedly arranged on the workbench 201, an output shaft of the driving electric cylinder 202 is vertically arranged upwards, a top plate 203 is fixedly arranged on the output shaft of the driving electric cylinder 202, and a machine head 204 is arranged on the lower surface of the top plate 203;
the positioning device comprises a positioning tube 205, the positioning tube 205 is arranged on the periphery of the machine head 204, the axis of the positioning tube 205 is vertically arranged, a guide sliding groove 206 is arranged on the side wall of the positioning tube 205 along the vertical direction, a guide sliding block 207 is arranged in the guide sliding groove 206 in a sliding manner, a guide sliding rod 208 is vertically arranged on the upper surface of the guide sliding block 207, the guide sliding rod 208 penetrates through the positioning tube 205 and is fixedly connected with the bottom wall of the top plate 203, and a first spring 209 is fixedly arranged between the positioning tube 205 and the top plate 203;
the limiting rod 210 is arranged on the side portion of the positioning tube 205, the limiting rod 210 comprises a clamping section 211 and a supporting section 212, the clamping section 211 is fixedly connected with the supporting section 212, the upper end of the supporting section 212 is hinged to the bottom of the driving electric cylinder 202, the clamping section 211 is vertically arranged, a clamping groove 213 is formed in the side wall, close to the positioning tube 205, of the clamping section 211, and a second spring 214 is arranged between the clamping section 211 and the driving electric cylinder 202;
the clamping block 215 is arranged on the side wall of the positioning tube 205, and the clamping block 215 can be clamped in the clamping groove 213;
the linkage rod 216 is vertically arranged on the bottom wall of the top plate 203, the linkage rod 216 can be abutted to the clamping section 211 when moving downwards along with the top plate 203, and the lower end of the linkage rod 216 is higher than the clamping block 215.
The working principle and the beneficial technical effects of the technical scheme are as follows: when the PCB drilling machine is used, the top plate 203 and the machine head 204 are pushed to move up and down along the vertical direction by the driving electric cylinder 202 arranged on the workbench 201, the machine head 204 comprises a drill bit and a driving motor and the like, when drilling is needed, the driving electric cylinder 202 drives the top plate 203 and the machine head 204 to move down, at the moment, the positioning tube 205 moves down together until the lower end of the positioning tube 205 is abutted to the upper surface of the PCB, at the moment, the clamping block 215 is clamped in the clamping groove 213 to support the positioning tube 205, then the top plate 203 continues to descend, the guide sliding rod 208 slides along the guide sliding groove 206 and drives the first spring 209 to compress until the drill bit is contacted with the PCB, and through the clamping block 215 supporting the positioning tube 205, the downward pressure of the positioning tube 205 can be kept stable in the process that the top plate 203 continues to descend, namely, the positioning pressure of the positioning tube 205 on the PCB is kept stable, and the phenomenon that the PCB deflects due to the pressure change of the positioning tube 205 in the drilling process to influence on the matching precision is avoided; when drilling to deepest, gangbar 216 and joint section 211 butt that descends along with roof 203, thereby promote gangbar 216 swing towards the direction motion of keeping away from registration arm 205, make joint piece 215 break away from with joint groove 213, roof 203 lifting drives registration arm 205 lifting through direction slider 207 and direction slide bar 208 afterwards, accomplish drilling, registration arm 205 is located the drill bit periphery and oppresses the location to the PCB board during whole drilling process, registration arm 205 can set up to rectangle or circular structure during specific use, so that the atress is more even.
In one embodiment, the locking groove 213 is configured as a right triangle, and the hypotenuse of the right triangle is disposed obliquely upward, and the locking block 215 is also configured as a right triangle.
The working principle and the beneficial technical effects of the technical scheme are as follows: by arranging the clamping groove 213 and the clamping block 215 into a right-angled triangle structure, when the positioning tube 205 tends to move downwards under the pressure of the first spring 209, the positioning tube can be supported by clamping the clamping groove 213 and the clamping block 215; when the positioning tube 205 moves downward, the upper surface of the locking groove 213 is inclined, so that it does not block the upward movement, and the positioning tube can be lifted up smoothly.
In one embodiment, as shown in fig. 4 and 5, a heat sink assembly 3 is further disposed on the working platform 201, the heat sink assembly 3 is disposed below the machine head 204, and the heat sink assembly 3 includes:
the cooling device comprises a cover body 301, the cover body 301 is fixedly arranged on the workbench 201, a cooling cavity 302 is arranged in the cover body 301, a cooling motor 303 is fixedly arranged on the bottom wall of the cooling cavity 302, the output shaft of the cooling motor 303 is vertically arranged upwards, a first spindle 304 is coaxially and fixedly arranged on the output shaft of the cooling motor 303, a first crank 305 is fixedly arranged on the first spindle 304, a second spindle 306 is vertically arranged on the side part of the cooling motor 303, the second spindle 306 is connected with the first spindle 304 through a second crank 307, a third crank 308 is arranged on the second spindle 306, a fourth crank 309 parallel to the second crank 307 is arranged on the side part of the second crank 307, and two ends of the fourth crank 309 are respectively hinged to the first crank 305 and the third crank 308;
a third spindle 310 is rotatably arranged in the heat dissipation cavity 302, the third spindle 310 is parallel to the first spindle 304, a first gear 311 is fixedly arranged on the third spindle 310, and a heat dissipation fan 312 is fixedly arranged on the first spindle 304 above the first gear 311;
a second gear ring 313, wherein the second gear ring 313 is sleeved outside the first gear 311, the second gear ring 313 is engaged with the first gear 311, the second gear ring 313 is fixedly connected with the fourth crank 309 through a connecting crank 314, and the connecting crank 314 is perpendicular to the fourth crank 309;
a heat dissipation filter screen 315 is arranged below the second gear ring 313, the heat dissipation filter screen 315 is inserted into the cover body 301 from the outside of the cover body 301 along the horizontal direction, the middle part of the heat dissipation filter screen 315 is provided with a downward concave structure, the lower surface of the second gear ring 313 is provided with a cleaning brush 316, and the cleaning brush 316 can be abutted against the upper surface of the heat dissipation filter screen 315;
division board 317, be provided with division board 317 between second ring gear 313 and the heat dissipation motor 303, the vertical setting of division board 317, connect crank 314 to pass division board 317, set up the bearing piece 318 that is used for joint heat dissipation filter screen 315 on the division board 317, bearing piece 318 sets up to U-shaped structure and U-shaped structure opening orientation heat dissipation filter screen 315.
The working principle and the beneficial technical effects of the technical scheme are as follows: when the heat dissipation assembly 3 is used, the heat dissipation motor 303 is started to drive the first spindle 304 to rotate, and further drive the first crank 305 to rotate, at this time, the first crank 305, the second crank 307, the third crank 308 and the fourth crank 309 are connected to form a parallelogram structure, when the first crank 305 rotates, the fourth crank 309 is driven to swing together, and the fourth crank 309 is always parallel to the second crank 307 in the swinging process, then the swinging of the fourth crank 309 is transmitted to the second gear ring 313 through the connecting crank 314 to drive the second gear ring 313 to swing, because the second gear ring 313 is always internally meshed with the first gear 311, the first gear 311 is driven to rotate when the second gear ring 313 swings, and further the heat dissipation fan 312 which is also arranged on the third spindle 310 is driven to rotate, so that the PCB is cooled and dissipated by wind in the drilling process, the deformation of the drilling part of the PCB is prevented from affecting the subsequent preparation, meanwhile, when the heat dissipation fan rotates, the air flow is driven, meanwhile, the powder generated in the drilling process is taken away by the heat dissipation fan 315, thereby most of the powder is filtered on the filter screen 315, and the filter screen 315 is cleaned, and the dust on the filter screen 316 is cleaned when the heat dissipation fan 316 is swung, and the filter screen 316 is cleaned, and the dust on the filter screen 316, and the filter screen 316 is cleaned.
In one embodiment, a guide latch 319 is slidably disposed on the first crank 305 along the length direction, and the connecting crank 314 is slidably connected to the guide latch 319.
The working principle and the beneficial technical effects of the technical scheme are as follows: through setting up direction fixture block 319, support the reinforcement to connecting crank 314 when not influencing the motion of connecting crank 314 to make whole device structure more stable, promoted the practicality of device.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. A HDI board manufacturing method for improving through blind hole matching precision is characterized by comprising the following steps:
the method comprises the following steps: drilling a positioning pin hole (109) on an adjustable jig (1) in advance, then drilling a first pin hole on the HDI board, then adjusting the adjustable jig (1) so as to adjust the position of the positioning pin hole (109) to enable the positioning pin hole (109) to be opposite to the first pin hole, and finally setting a positioning pin and fixing the positioning pin with the adjustable jig (1);
step two: sequentially penetrating the PCBs through the positioning pins for installation and hot melting and laminating;
step three: and drilling a blind hole and a through hole on the HDI board by using a PCB drilling machine.
2. The HDI board manufacturing method for improving the matching accuracy of the through blind hole is characterized in that the adjustable jig (1) comprises a base plate (101) and first supporting rods (102), two first supporting rods (102) are arranged on the base plate (101) in parallel, a positioning sliding block (103) is arranged on each first supporting rod (102) in a sliding mode, two second supporting rods (104) are arranged in parallel, each second supporting rod (104) is perpendicular to each first supporting rod (102) and is connected with the corresponding positioning sliding block (103), each second supporting rod (104) comprises a first rod section (105) and a second rod section (106), each first rod section (105) and each second rod section (106) are connected through a connecting groove (107) and are fixed with the corresponding connecting groove (107) through a first bolt (108), and each first rod section (105) and each second rod section (106) are provided with a positioning pin hole (109).
3. The HDI board manufacturing method for improving the matching accuracy of the through blind hole is characterized in that the first support rod (102) comprises a horizontal plate (110) and a vertical plate (111), the horizontal plate (110) is horizontally arranged and forms a T-shaped structure with the vertical plate (111), the lower end of the vertical plate (111) is fixedly connected with the bottom plate (101), a limiting sliding groove (112) is formed in the vertical plate (111) along the horizontal direction, a connecting groove (113) with the T-shaped structure is formed in the positioning sliding block (103), the first support rod (102) is clamped in the connecting groove (113), and the second bolt (114) penetrates through the positioning sliding block (103) and the limiting sliding groove (112) to fix the positioning sliding block (103) and the first support rod (102).
4. The HDI board manufacturing method for improving the matching accuracy of the through blind holes in claim 2, wherein the connecting groove (107) is provided with a U-shaped structure, a through groove is formed in the bottom surface of the connecting groove (107) along the length direction, and the connecting groove (107) is buckled with the first rod section (105) and the second rod section (106) from bottom to top respectively.
5. The HDI board manufacturing method for improving the matching accuracy of the through blind holes is characterized in that a cushion block (115) is further arranged on the base plate (101), the cushion block (115) is located between the two first support rods (102), and the upper surface of the cushion block (115) is flush with the upper surface of the second support rod (104).
6. A method for manufacturing an HDI board capable of improving the matching accuracy of a through blind hole according to claim 2, wherein the first supporting rod (102) is provided with a scale along the length direction, and the first rod section (105) and the second rod section (106) are also provided with scales.
7. The HDI board manufacturing method for improving the through blind hole matching accuracy according to claim 1, wherein the PCB board drilling machine comprises a workbench (201) and a positioning pipe (205), a driving electric cylinder (202) is arranged on the workbench (201), a top plate (203) and a machine head (204) are arranged on an output shaft of the driving electric cylinder (202), the positioning pipe (205) is arranged on the periphery of the machine head (204), a guide sliding groove (206) is arranged on a side wall of the positioning pipe (205), a guide sliding block (207) is arranged in the guide sliding groove (206) in a sliding manner, a guide sliding rod (208) connected with the top plate (203) is arranged on the guide sliding block (207), and a first spring (209) is fixedly arranged between the positioning pipe (205) and the top plate (203).
8. The HDI board manufacturing method for improving the through-blind hole matching accuracy according to claim 7, characterized in that a limiting rod (210) is arranged on the side portion of a positioning tube (205), the limiting rod (210) comprises a clamping section (211) and a supporting section (212), the clamping section (211) is fixedly connected with the supporting section (212), the upper end of the supporting section (212) is hinged to the bottom of a driving electric cylinder (202), a clamping groove (213) of a right-angled triangle structure is formed in a side wall, close to the positioning tube (205), of the clamping section (211), a second spring (214) is arranged between the clamping section (211) and the driving electric cylinder (202), a clamping block (215) is arranged on the side wall of the positioning tube (205), a linkage rod (216) is vertically arranged on the bottom wall of a top plate (203), and the linkage rod (216) can abut against the clamping section (211) when moving downwards along with the top plate (203).
9. The manufacturing method of the HDI board for improving the matching precision of the through blind hole is characterized in that a heat dissipation assembly (3) is arranged on a workbench (201), the heat dissipation assembly (3) comprises a cover body (301) and a heat dissipation motor (303), the cover body (301) is arranged on the workbench (201), a heat dissipation cavity (302) is arranged in the cover body (301), the heat dissipation motor (303) is arranged in the heat dissipation cavity (302), a first spindle (304) is arranged on the heat dissipation motor (303), a first crank (305) is arranged on the first spindle (304), a second spindle (306) and a third crank (308) are arranged on the side portion of the first spindle (304) in the same manner, the second spindle (306) is connected with the first spindle (304) through a second crank (307), the first crank (305) is connected with the third crank (309), a third spindle (310) is rotatably arranged in the heat dissipation cavity (302), the third spindle (310) is parallel to the first spindle (304), a first fixing gear (312) is arranged above the first fixing gear (311).
10. The HDI board manufacturing method for improving the through-blind hole matching accuracy according to claim 9, wherein a second gear ring (313) meshed with the first gear ring (311) is sleeved outside the first gear (311), the second gear ring (313) is connected with a fourth crank (309) through a connecting crank (314), a heat dissipation filter screen (315) is arranged below the second gear ring (313), the heat dissipation filter screen (315) is inserted into the cover body (301) along a horizontal direction, a cleaning brush (316) is arranged on the lower surface of the second gear ring (313), a separation plate (317) is arranged between the second gear ring (313) and the heat dissipation motor (303), a bearing block (318) used for clamping the heat dissipation filter screen (315) is arranged on the separation plate (317), the bearing block (318) is arranged to be of a U-shaped structure, and an opening of the U-shaped structure faces the heat dissipation filter screen (315).
CN202211439134.4A 2022-11-17 2022-11-17 HDI board manufacturing method for improving through blind hole matching precision Active CN115715060B (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04225298A (en) * 1990-12-26 1992-08-14 Risho Kogyo Co Ltd Manufacture of board for multilayer printed-circuit
US5927504A (en) * 1998-06-23 1999-07-27 Samsung Electronics Co., Ltd. Apparatus for carrying plural printed circuit boards for semiconductor module
CN206509557U (en) * 2017-01-19 2017-09-22 东莞市华拓电子有限公司 A kind of PCB multilayer board drilling machine automatic filings discharging device
KR102132918B1 (en) * 2019-04-15 2020-07-14 주식회사 디에이피 Pin jig
CN113923895A (en) * 2021-09-13 2022-01-11 惠州中京电子科技有限公司 HDI board manufacturing method for improving through blind hole matching precision and HDI board
CN215529439U (en) * 2021-07-22 2022-01-14 深圳市金锐显数码科技有限公司 Board splitting jig
CN114885520A (en) * 2022-06-24 2022-08-09 深圳市智联科迅科技有限公司 Flexible circuit board positioning jig and positioning method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04225298A (en) * 1990-12-26 1992-08-14 Risho Kogyo Co Ltd Manufacture of board for multilayer printed-circuit
US5927504A (en) * 1998-06-23 1999-07-27 Samsung Electronics Co., Ltd. Apparatus for carrying plural printed circuit boards for semiconductor module
CN206509557U (en) * 2017-01-19 2017-09-22 东莞市华拓电子有限公司 A kind of PCB multilayer board drilling machine automatic filings discharging device
KR102132918B1 (en) * 2019-04-15 2020-07-14 주식회사 디에이피 Pin jig
CN215529439U (en) * 2021-07-22 2022-01-14 深圳市金锐显数码科技有限公司 Board splitting jig
CN113923895A (en) * 2021-09-13 2022-01-11 惠州中京电子科技有限公司 HDI board manufacturing method for improving through blind hole matching precision and HDI board
CN114885520A (en) * 2022-06-24 2022-08-09 深圳市智联科迅科技有限公司 Flexible circuit board positioning jig and positioning method

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