CN115709205A - Blowing-out control system - Google Patents
Blowing-out control system Download PDFInfo
- Publication number
- CN115709205A CN115709205A CN202210416345.XA CN202210416345A CN115709205A CN 115709205 A CN115709205 A CN 115709205A CN 202210416345 A CN202210416345 A CN 202210416345A CN 115709205 A CN115709205 A CN 115709205A
- Authority
- CN
- China
- Prior art keywords
- gas
- door assembly
- air
- control system
- curtain unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A blow-down control system connected to a wafer carrier, comprising: the blowing-off module is arranged in the wafer bearing device and is connected with the control module. The blowing-clean module comprises an air curtain unit, a flow control unit and a sensing unit. The control module controls the blowing module to provide clean gas with corresponding gas flow into the gas curtain unit according to the displacement value of the door assembly.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a blowing control system for cleaning a wafer bearing device by controlling gas flow in a laminar or uniform gas flow mode when a wafer box is used for carrying a wafer.
Background
Among the current semiconductor manufacturing factory building, be provided with the equipment that multiple is used for transmitting the wafer box, and these equipment are the production of different manufacturers mostly, consequently, when the wafer box transmits in the equipment that different manufacturers produced, can take place when the door body of wafer box is opened, the inside of wafer box directly contacts or the state of intercommunication with external environment, according to this, the outside dirty or the particle of wafer box gets into the wafer box easily, leads to the wafer in the wafer box to receive the pollution.
Disclosure of Invention
According to the defects of the prior art, the main objective of the present invention is to provide a clean gas flow rate by controlling the gas curtain unit through the control module according to the displacement value of the door assembly of the wafer carrier device, so as to prevent the clean gas with the large gas flow rate from disturbing the wafer cassette, which may cause contamination in the environment or contamination of the semiconductor device in the wafer cassette due to the particles brought into the wafer cassette by the disturbed gas flow.
Another objective of the present invention is to control the flow rate and pressure of the cleaning gas entering the gas curtain unit to control the flow of the cleaning gas blown out from the gas curtain unit in a laminar flow state, so as to solve the technical problem that the turbulent flow of the cleaning gas brings the contamination into the wafer box and contaminates the semiconductor devices in the wafer box.
Another objective of the present invention is to adjust the gas flow of the clean gas fed into the gas curtain unit according to the displacement value of the door assembly, so as to solve the problem in the prior art that the gas curtain device provides the clean gas with the same gas flow regardless of the displacement of the door assembly of the wafer carrier device after opening the door body, which results in the waste of the clean gas and the increase of the use cost.
Another objective of the present invention is to utilize a sensor unit disposed on the wafer carrier to detect the displacement value of the door assembly, so as to adjust the flow rate of the cleaning gas supplied to the gas curtain unit according to the displacement value of the door assembly.
Still another object of the present invention is to provide a gas permeable plate of an air curtain device with a plurality of air holes, wherein the gas permeable plate can be made of stainless steel or ultra-high molecular weight polyethylene (UPE) to increase the pressure resistance of the gas permeable plate and improve the gas flow rate of the clean gas.
According to the above object, the present invention provides a blow-down control system, which is connected to a wafer carrier, the blow-down control system comprising: the wafer cleaning device comprises a cleaning module and a control module, wherein the cleaning module is arranged in the wafer bearing device, and the control module is electrically connected with the cleaning module. The blowing-clean module comprises an air curtain unit, a flow control unit and a sensing unit. The air curtain unit is aligned and arranged above the door assembly of the wafer bearing device; the flow control unit is connected with the air curtain unit; and the control module is electrically connected with the blowing module, and the control module controls the blowing module to provide gas flow with corresponding clean gas to enter the gas curtain unit according to the displacement value of the door assembly.
In a more preferred embodiment of the present invention, the air curtain unit comprises: the upper end and/or the side edge of the body are/is provided with at least one air inlet hole, and the air inlet holes are communicated with the blowing module through a pipeline, so that clean air of the air curtain unit enters the body through the pipeline and the air inlet; and at least one ventilation plate, which is arranged in the body and is provided with a plurality of air holes for discharging the clean gas outwards through the body through the plurality of air holes of the ventilation plate, so that an air flow wall is formed between the air curtain unit and the door assembly of the wafer bearing device.
In a preferred embodiment of the present invention, the material of the air permeable plate may be stainless steel, antistatic and corrosion resistant fiber or composite material, ceramic, resin, or ultra-high molecular weight polyethylene.
In a more preferred embodiment of the present invention, when the gas-permeable plate is made of stainless steel, the gas-permeable plate having a plurality of pores may be formed by sintering a metal.
In a preferred embodiment of the present invention, the plurality of air holes can be formed by mechanical drilling or laser drilling.
In a more preferred embodiment of the present invention, the air-permeable plate is a plurality of air-permeable plates, each air-permeable plate has a plurality of air holes and the air-permeable plates form at least one closed space in the body.
In a more preferred embodiment of the present invention, the flow rate of the cleaning gas blown out by the gas curtain unit is in the range of 0.1m/s to 2m/s (meters per second).
In a preferred embodiment of the present invention, the gas supply device is connected to the purge control system, wherein the gas supply device is used to provide a purge gas, and the purge gas may be a clean dry gas (CDA), an ultra clean dry gas (X-CDA), or an inert gas.
In a more preferred embodiment of the present invention, the gas flow rate of the cleaning gas supplied from the gas supply apparatus to the purge control system is in the range of 0 to 800LPM (liters per minute).
Drawings
FIG. 1 is a block diagram illustrating a blow-down control system in accordance with the disclosed technology.
FIG. 2 is a block diagram illustrating elements of a blow-down control system according to the disclosed technology.
Figure 3 is a side view of a wafer carrier with a controlled purging system in accordance with the disclosed technique.
FIG. 4 is a schematic diagram illustrating the structure of an air curtain unit in a blow-down module, according to the disclosed technology.
Detailed Description
So that the manner in which the objects, features and advantages of the invention are attained and can be understood by those skilled in the art, a more particular description of the invention, briefly summarized above, may be had by reference to the appended drawings, in which like reference characters refer to the same parts throughout the different views. The drawings referred to below are schematic representations relating to the features of the invention and are not necessarily drawn to scale. The description of the embodiments related to the present invention will not be repeated, except for those skilled in the art.
First, please refer to fig. 1. FIG. 1 is a block diagram of a blow-down control system according to the present disclosure. In fig. 1, a purge control system 1 is connected to a wafer carrier 500, wherein the purge control system 1 is at least composed of a control module 2 and a purge module 4, and the control module 2 is used to control the purge module 4 to inflate semiconductor devices (not shown) in a wafer cassette 300 disposed on the wafer carrier 500 for inflation/cleaning.
Please refer to fig. 2. FIG. 2 is a detailed block diagram of the blow-down control system disclosed in the present invention. In fig. 2, the purge module 4 of the purge control system 1 at least comprises a gas curtain unit 42, a sensing unit 44 and a flow control unit 46, wherein the flow control unit 46 is respectively connected to the gas curtain unit 42 and the control module 2, the sensing unit 44 is configured to detect a displacement value of a door assembly 502 disposed on the wafer carrier 500 and transmit a sensing signal corresponding to the displacement value of the door assembly 502 to the control module 2, and the control module 2 can regulate and control a flow rate or a pressure of a gas sent to the gas curtain unit 42 by the flow control unit 46 according to the sensing signal, so as to control a flow rate of the gas blown out toward the opening side of the wafer cassette 300 by the gas curtain unit 42 above the door assembly 502 of the wafer carrier 500. It should be noted that the gas flow rate control method of the present invention may, for example, write the respective gas flow rates into the control module 2 in a proportioning (recipe) manner, such as recipe a, recipe B, recipe C, …, and recipe Z, where each recipe corresponds to one gas flow rate and each gas flow rate value corresponds to the displacement value of the gate assembly 502. Therefore, when the sensing unit 44 detects that the displacement value of the door assembly 502 changes, the control module 2 controls the flow control unit 46 according to the displacement value of the door assembly 502 and the corresponding recipe, and enables the air curtain unit 42 to provide the gas flow corresponding to the recipe according to the recipe, so that the control module 2 in the present invention can control the gas flow provided to the air curtain unit 42 in a multi-stage control manner. For example, the gas flow rates corresponding to recipe a, recipe B, recipe C, … and recipe Z may be from small to large, and when the displacement value of the door assembly 502 is small (the displacement amount is small), the gas curtain unit 42 blows out the gas flow rate corresponding to recipe a; when the displacement value of the door assembly 502 becomes large (the displacement amount is large) to a certain range, the gas curtain unit 42 blows out the gas flow rate corresponding to recipe C, and the gas flow rate corresponding to recipe C is larger than that corresponding to recipe a. In the present invention, the displacement value is calculated based on the door assembly 502 not being opened. That is, when the displacement value of the door assembly 502 becomes gradually larger, the gas flow rate of the cleaning gas may be fixed at a preset flow rate when the displacement value of the door assembly 502 is within a certain change interval.
In addition, the calculation method of the displacement value of the door assembly 502 in the present invention is further explained, in the present invention, the displacement value is set as P when the door assembly 502 is not opened 0 When the door assembly 502 is opened from the non-opened position P 0 To move to the first location point P 1 At this time, the first displacement value of the door assembly 502 is P 1 -P 0 (ii) a When the door assembly 502 is moved from the first positioning point P 1 Move to the second positioning point P 2 Then the magnitude of the second displacement value of the gate component 502 is P 2 -P 0 。
More specifically, when the door assembly 502 is opened to the first positioning point P 1 At this time, the air curtain unit 42 blows out the first gas flow rate corresponding to recipe a. When the door assembly 502 is opened to the second positioning point P 2 When the door assembly 502 is opened to the third positioning point P, the air curtain unit 42 blows a second air flow corresponding to recipe B 3 In this case, the air curtain unit 42 blows out the third gas flow rate corresponding to recipe C, and so on. When the door assembly 502 is at the second positioning point P 2 Second shift value (P) 2 -P 0 ) Greater than door assembly 502 at first location P 1 First displacement value (P) of 1 -P 0 ) At this time, the second gas flow rate is larger than the first gas flow rate. In another embodiment, when the door assembly 502 is at the second positioning point P 2 Second shift value (P) 2 -P 0 ) Is smaller than door assembly 502 at first positioning point P 1 First displacement value (P) of 1 -P 0 ) At this time, the second gas flow rate is smaller than the first gas flow rate. Of course, the present invention is not limited to the multi-stage regulation manner, and in another embodiment, the gas flow rate may be continuously regulated without stage, that is, the opening of the opening side of the wafer box 300 is gradually changed when the displacement value of the door assembly 502 is gradually increasedWhen the flow rate is large, the flow rate of the clean gas is gradually increased. Conversely, when the displacement value of the door assembly 502 is gradually decreased, that is, the opening of the opening side of the wafer box 300 is gradually decreased, the gas flow rate of the cleaning gas is also gradually decreased. The invention can effectively save the use amount of the clean gas and reduce the use cost of the clean gas.
Please refer to fig. 3. Figure 3 is a side view of a wafer carrier with a blow-down control system. In fig. 3, the wafer carrier 500 has a tray 510 for carrying the wafer cassette 300, and the wafer carrier 500 further has a door assembly 502 and a door frame (not shown), wherein the door assembly 502 opens the door 302 of the wafer cassette 300 disposed on the tray 510, and moves the door 302 away from the wafer cassette 300 by a displacement value, such that the interior of the wafer cassette 300 is communicated with the external environment, and the wafer cassette 300 exposes an opening, so that an external robot or a worker can place a semiconductor device, such as a wafer (not shown) in the wafer cassette 300 or take out the semiconductor device (not shown) from the wafer cassette 300 according to the requirement through the opening.
Please continue to refer to fig. 3. The air curtain unit 42 of the purge control system 1 of the present invention is correspondingly disposed above the door assembly 502 of the wafer carrier 500, and a distance is provided between the door assembly 502, wherein the distance is such that when the air curtain unit 42 continuously and uniformly sprays the cleaning gas toward the door assembly 502, the cleaning gas forms a gas flow wall AF at the distance, and the gas flow wall AF is preferably a laminar gas flow, which can reduce the contamination from the outside or the particles brought into the wafer box 300 by the gas flow. In addition, the flow rate of the gas blown out by the gas curtain unit 42 varies depending on the magnitude of the displacement value of the door assembly 502. In addition, a sensing unit 46 may be disposed around the door assembly 502 (e.g., the upper end 5022 and/or the bottom 5024) or on a door frame (not shown), the sensing unit 46 is used to detect a change in displacement state (from closed to open) or a predetermined displacement value of the door assembly 502, and then transmit a sensing signal corresponding to the displacement value to the control module 2 (as shown in fig. 2), and the control module 2 adjusts the flow rate of the gas blown out by the gas curtain unit 42.
Therefore, the control module 2 (as shown in fig. 2) controls the gas supply equipment (not shown) to supply the cleaning gas with a gas flow rate corresponding to the displacement value into the gas curtain unit 42 of the purging module 4 according to the displacement value of the door assembly 502 of the wafer carrier 500 detected by the sensing unit 44, and the control module 2 can regulate the cleaning gas blown out from the gas curtain unit 42 according to the flow rate or pressure of the cleaning gas fed into the gas curtain unit 42, wherein the cleaning gas preferably flows in a laminar flow state. In addition, the change of the displacement value of the door assembly 502 does not need to be detected by the sensing unit 46, but in another embodiment, the opening time of the door assembly 502 can be directly calculated to determine the variation of the displacement value, and the invention is not limited to the method of detecting the displacement value of the door assembly 502.
Please refer to fig. 4. Fig. 4 is a schematic structural diagram showing an air curtain unit in the blow-down module. In fig. 4, the air curtain unit 42 is composed of a main body 420, a cover 420a, a vent plate 422 and air inlets 4202 and 4204, wherein the main body 420 has a rectangular outer shape, the vent plate 422 having a plurality of air holes 4222 is disposed in an inner space surrounded by the main body 420 and the cover 420a, and the shape of the vent plate 422 may be configured to match the main body 420 of the air curtain unit 42. The air permeable plate 422 forms an enclosed space in the air curtain unit 42, and the enclosed space can communicate with the air inlet holes 4202 and 4204. The pore size of the pores 4222 of the gas permeable plate 422 may range from 0.001 micrometers (μm) to 10 millimeters (mm), and more preferably from 0.001 micrometers (μm) to 1 micrometer (μm). The number and distribution of the air holes 4222 are not limited in this embodiment, and may be, for example, regular distribution or irregular distribution. The presence of these tiny air holes 4222 can make the air flow passing through the air-permeable plate 422 form uniform air flow and even laminar air flow. In a preferred embodiment of the present invention, the material of the air-permeable plate 422 having a plurality of air holes 4222 may be stainless steel, antistatic and corrosion resistant fiber material or composite material, such as but not limited to glass fiber, epoxy resin glass fiber, teflon (PTFE), ceramic, resin, or ultra-high molecular weight polyethylene (UPE), so that the original flow rate is increased from 0-400LPM (liters per minute) to 0-800LPM, and the gas pressure resistance is relatively increased, thereby preventing the air-permeable plate from bursting due to a large flow of gas.
In another preferred embodiment of the present invention, the number of the air permeable plates 422 disposed in the body 420 may be one, two or more, and the number of the air permeable plates 422 in the body 420 may be changed according to the user's requirement. For example, in an embodiment not shown, two air permeable plates are spaced apart and form two enclosed spaces within the air curtain unit 42. In another embodiment, not shown, two air permeable plates are stacked and form an enclosed space in the air curtain unit 42. In addition, the air intake holes 4202 and 4204 are disposed above and/or on the longer side of the rectangular main body 420, in another embodiment, the positions of the air intake holes 4202 and 4204 may be the shorter side of the rectangular main body 420, the air intake holes 4202 and 4204 may be disposed on the shorter side and the longer side, respectively, and the number of the air intake holes 4202 and 4204 is not limited. Further, the air intake ports 4202, 4204 provided in the body 420 are also connected to an air supply device (not shown) through the tube body 7. It should be noted that a gas supply device (not shown) is used to provide various clean gases, such as clean dry gas (CDA), ultra-clean dry gas (X-CDA) or inert gas, into the gas curtain unit 42 through the tube 7. In addition, in the embodiment of the present invention, when the material of the gas permeable plate 422 is stainless steel, the gas permeable plate 422 having the plurality of gas holes 4222 may be formed by sintering metal, that is, the stainless steel gas permeable plate 422 may be formed by sintering metal powder. The stainless steel gas-permeable plate 422 formed by sintering has many tiny gas holes 4222. In addition, the air hole 4222 may be formed by laser drilling or mechanical drilling. The air holes 4222 may be arranged regularly or irregularly, but not limited to.
Next, a purging step of the purging control system for one embodiment of the wafer carrier apparatus according to the present invention will be described with reference to an embodiment. For a purge step of one embodiment of the wafer carrier apparatus by the purge control system, please refer to fig. 2-4. First, the sensor unit detects a displacement value of a door assembly of the wafer carrier. In this step, when the door assembly 502 of the wafer carrier 500 is opened from the closed position, the sensor unit 44 disposed around the door assembly 502 (e.g., the top end 5022 and/or the bottom 5024) or on the door frame (not shown) detects a change in the state of the door assembly 502 of the wafer carrier 500, the moving distance of the door assembly 502 is defined as a first displacement value, the sensor unit 44 transmits a first signal corresponding to the detected first displacement value of the door assembly 502 of the wafer carrier 500 to the control module 2, the control module 2 controls the gas supply equipment (not shown) to provide the cleaning gas with a gas flow rate corresponding to the first displacement value into the purge module 4 according to the first signal, and the flow control unit 46 sends the cleaning gas with the corresponding gas flow rate into the gas curtain unit 42 according to the first displacement value of the door assembly 502, and blows the first gas flow rate from the gas curtain unit 42 toward the direction in which the wafer carrier 500 is provided with the door assembly 502, and performs the first inflation step on the wafer cassette 300.
In a preferred embodiment of the present invention, after the gas supply device (not shown) provides the cleaning gas (not shown) to enter the gas curtain unit 42 through the gas inlets 4202 and 4204, the passing fluid is homogenized or even fine particles are filtered through the plurality of gas holes 4222 of the gas permeable plate 422 in the gas curtain unit 42, so as to improve the cleanliness and uniformity of the gas blown out from the gas curtain unit 42, and the cleaning gas with the first gas flow can be uniformly blown out from the side of the body 420 opposite to the cover 420a and toward the door assembly 502 of the wafer carrier 500.
Then, when the moving distance of the door assembly 502 is the second displacement value, the sensing unit 44 transmits a second signal corresponding to the second displacement value to the control module 2, and the control module 2 adjusts the flow control unit 46 according to the second signal to provide the gas curtain unit 42 with the cleaning gas having the gas flow rate corresponding to the second signal, so that the gas curtain unit 42 blows the cleaning gas having the second gas flow rate toward the door assembly 502 of the wafer carrier 500. It should be noted that the gas flow rate of the cleaning gas provided by the flow control unit 46 varies with the displacement value of the door assembly 502, but the cleaning gas is continuously blown out toward the door assembly 502 of the wafer carrier 500 through the gas curtain unit 42, and the second filling step is performed on the wafer cassette 300. In the present invention, regardless of the displacement value of the door assembly 502, it is preferable that the clean gas blown out by the air curtain unit 42 flows in a laminar flow state, and the flow rate of the clean gas blown out by the air curtain unit 42 is in the range of 0.1m/s to 2m/s (meters per second).
As can be seen from the above, the displacement of the door 502 of the wafer carrier 500 is related to the flow of the gas blown from the gas curtain unit 42 (or the formed gas flow wall AF). In the present invention, the flow of the cleaning gas blown out from the gas curtain unit 42 can be controlled to be kept in a laminar state by controlling the flow rate and/or pressure of the cleaning gas fed into the gas curtain unit 42, and the flow of the cleaning gas blown out from the gas curtain unit 42 can be adjusted according to the displacement value of the door assembly 502, so as to avoid the problem of contamination caused by the generation of turbulent gas near the door assembly 502 of the wafer carrier 500 and the introduction of dirt or particles near the door assembly 502 into the wafer cassette 300.
In addition, because the material of the gas permeable plate 422 in the gas curtain unit 42 is stainless steel, antistatic corrosion-resistant fiber material or composite material, ceramic, resin, or ultra-high molecular weight polyethylene, the gas flow rate can be increased to 0-800LPM by using the characteristics of the material of the gas permeable plate 422, that is, the gas flow rate range provided by the gas supply equipment to the blow-down control system can be controlled between 0-800LPM, the gas pressure tolerance degree is higher, and the service life of the whole gas curtain unit 42 is longer.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; while the foregoing description will be apparent to those skilled in the relevant art and it is intended to cover in the appended claims all such modifications and changes as fall within the true spirit of the invention.
Claims (10)
1. A blow-down control system connected to a wafer carrier, the wafer carrier is used for carrying a wafer cassette, the blow-down control system comprises:
blow clean module, set up in the wafer bears the weight of the device, blow clean module includes:
the air curtain unit is arranged above the door assembly of the wafer bearing device;
the flow control unit is connected with the air curtain unit; and
and the control module is electrically connected with the blowing-out module and is used for controlling the gas curtain unit to blow out gas flow with corresponding clean gas according to the displacement value of the door assembly, wherein when the displacement value becomes larger, the gas flow is increased.
2. The purge control system of claim 1, wherein the purge module comprises a sensing unit disposed on the wafer carrier, the sensing unit being configured to detect a displacement state of the door assembly of the wafer carrier for the control module to determine the gas flow rate of the cleaning gas.
3. The blow-down control system of claim 1, wherein the air curtain unit comprises at least:
the air curtain unit comprises a body, wherein at least one air inlet is formed in the upper end and/or the side edge of the body, and the air inlet is communicated with a pipeline in the blowing-out module, so that the clean air of the air curtain unit enters the body through the pipeline and the air inlet; and
the ventilation plate is arranged in the body and provided with a plurality of air holes, and the clean air is discharged outwards from the body through the air holes of the ventilation plate, so that an air flow wall is formed between the air curtain unit and the door assembly of the wafer bearing device.
4. The blow-down control system of claim 3, wherein the material of the air-permeable plate having the air holes is stainless steel, antistatic and corrosion resistant fiber material or composite material, ceramic, resin, or ultra high molecular weight polyethylene.
5. The blow-down control system according to claim 4, wherein when the gas-permeable plate is the stainless steel plate, the gas-permeable plate having the pores is formed by metal sintering.
6. The blow-down control system of claim 4, wherein when the gas permeable plate is the stainless steel plate, the gas holes are formed by laser drilling or mechanical drilling.
7. The purge control system of claim 4, wherein said orifice has a pore size in the range of 0.001 μm to 10 mm.
8. The blow-down control system of claim 1, wherein the curtain unit blows a first flow of gas when the door assembly is moved to a first position, wherein the curtain unit blows a second flow of gas when the door assembly is moved to a second position,
wherein the second gas flow rate is greater than the first gas flow rate when a second displacement value of the door assembly at the second location point is greater than a first displacement value of the door assembly at the first location point, and the second gas flow rate is less than the first gas flow rate when the second displacement value of the door assembly at the second location point is less than the first displacement value of the door assembly at the first location point.
9. The blow-down control system of claim 1, wherein the flow rate of the clean gas blown out by the air curtain unit ranges from 0.1m/s to 2 m/s.
10. The purge control system of claim 1, further comprising a gas supply coupled to the purge control system, the gas supply configured to provide the purge gas, wherein the purge gas is pure dry gas, ultra-pure dry gas, or inert gas, and wherein the purge gas has a flow rate ranging from 0 liters/minute to 800 liters/minute.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2021109710434 | 2021-08-23 | ||
| CN202110971043 | 2021-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115709205A true CN115709205A (en) | 2023-02-24 |
Family
ID=85230493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210416345.XA Pending CN115709205A (en) | 2021-08-23 | 2022-04-20 | Blowing-out control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115709205A (en) |
-
2022
- 2022-04-20 CN CN202210416345.XA patent/CN115709205A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2003102476A1 (en) | Sheet-like electronic component clean transfer device and sheet-like electronic product manufacturing system | |
| JP6217977B2 (en) | Pod and purge system using the pod | |
| CN110854047B (en) | Process chamber and semiconductor processing equipment | |
| TW201533829A (en) | Apparatus, semiconductor wafer process system and method for manufacturing semiconductor wafer | |
| JP5452152B2 (en) | Inspection device | |
| JP2005117007A (en) | Substrate treatment unit, detecting method of substrate mounting state, and substrate treatment apparatus | |
| US5413527A (en) | Environmental control apparatus | |
| US20200266092A1 (en) | Apparatuses and methods for non-contact holding and measurement of thin substrates | |
| JP6623988B2 (en) | Container storage equipment | |
| CN115709205A (en) | Blowing-out control system | |
| JP7273674B2 (en) | Processing system, processing method and processing program | |
| TWI812114B (en) | Purge controlling system | |
| US20090183630A1 (en) | Apparatus and method for reducing particle contamination in a vacuum chamber | |
| TWI534875B (en) | Load lock chamber, substrate processing system and method for venting | |
| JP2001054746A (en) | Gas nozzle | |
| US6048011A (en) | Apparatus for contactless capturing and handling of spherical-shaped objects | |
| JP7462977B2 (en) | Purge Control System | |
| JP2006019726A (en) | Wafer transport system and in-system pressure adjustment method | |
| JPH11340301A (en) | Equipment and method for processing substrate | |
| KR101915464B1 (en) | Wafer Processing Apparatus Having Particle Sensor | |
| TW202343614A (en) | Air curtain device and ventilation assembly | |
| KR20070093696A (en) | Vacuum system for manufacturing semiconductor device equipment | |
| CN117086056A (en) | Air curtain device and ventilation assembly | |
| CN114695217A (en) | Interface tool | |
| JP4656296B2 (en) | Local cleaning device and clean room |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |