CN115706104A - On-board optical interconnection device and communication equipment - Google Patents

On-board optical interconnection device and communication equipment Download PDF

Info

Publication number
CN115706104A
CN115706104A CN202110935458.6A CN202110935458A CN115706104A CN 115706104 A CN115706104 A CN 115706104A CN 202110935458 A CN202110935458 A CN 202110935458A CN 115706104 A CN115706104 A CN 115706104A
Authority
CN
China
Prior art keywords
board
rigid
board optical
optical
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110935458.6A
Other languages
Chinese (zh)
Inventor
李心白
陈俊龙
朱文学
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN202110935458.6A priority Critical patent/CN115706104A/en
Priority to PCT/CN2022/090963 priority patent/WO2023015972A1/en
Publication of CN115706104A publication Critical patent/CN115706104A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/25—Arrangements specific to fibre transmission

Abstract

The embodiment of the application provides an on-board optical interconnection device and communication equipment, a chip package assembly and a first on-board optical module are arranged on a carrier plate, the first on-board optical module adopts a mode of a rigid flexible plate and a first optical device, the first optical device is arranged on a first rigid portion of the rigid flexible plate, the first flexible portion is connected between a package substrate and the first rigid portion, a first wiring of the package substrate and a second wiring of the rigid flexible plate are connected to form a first link, and high-speed signal transmission between a service chip and the first optical device is achieved. According to the on-board optical interconnection device, the first wiring of the packaging substrate and the second wiring of the rigid flexible board are adopted to achieve high-speed signal interconnection between the service chip and the first on-board optical module, the number of fan-out signals from the packaging substrate to the carrier board is reduced to reduce the number of connecting ends of the packaging substrate, the area of the packaging substrate can be reduced, the wiring length of the packaging substrate can be shortened, the power consumption of a high-speed link is reduced, and the adoption of a low-power-consumption serial-parallel converter is allowed to achieve high-speed signal interconnection.

Description

On-board optical interconnection device and communication equipment
Technical Field
The embodiment of the application relates to the technical field of optical communication, in particular to an on-board optical interconnection device and communication equipment.
Background
In the technical field of optical communication, an optical module is used for connecting system side equipment (such as a switch and a router) and an optical fiber to realize interconversion of optical signals and electrical signals. As shown in fig. 1, the system-side device includes a carrier plate 110 and a package 120 disposed on the carrier plate 110, wherein the package 120 includes a package substrate (not shown) and a service chip 121 disposed on the package substrate, and the package substrate has package substrate wires (not shown) for connecting the service chip 121 and the carrier plate 110.
A serial-to-parallel converter (SerDes) is an input/output serial interface of a service chip, and the stronger the drive capability of the SerDes is, the more complex the circuit and algorithm is, the higher the power consumption of the corresponding high-speed link is. The Optical Internet Forum (OIF) defines various SerDes standards in terms of driving capability: long Range (LR), very Short Range (VSR), very short range (XSR), and the like. The driving capability of the LR, the driving capability of the VSR and the driving capability of the XSR are reduced from large to small, and the power consumption of the corresponding high-speed link is reduced from large to small.
As shown in fig. 1, in the conventional pluggable optical module scheme, a pluggable optical module 131 and an electrical interface 132 are respectively disposed at two ends of an optical daughter card 130, the optical daughter card 130 has optical daughter card wires (not shown) for connecting the pluggable optical module 131 and the electrical interface 132, and the pluggable optical module 131 is configured to couple with an optical fiber 140. The carrier board 110 has an electrical connector 111 and carrier board wires (not shown), and both ends of the carrier board wires are connected to the semiconductor package 120 and the electrical connector 111. The electrical interface 132 of the optical daughter card 130 is connected to the electrical connector 111 of the carrier board 110, the package substrate wiring, the carrier board wiring and the optical daughter card wiring, which are connected in sequence, form a high-speed link, and high-speed signal interconnection between the service chip 121 and the pluggable optical module 131 is realized through the high-speed link. With the increase of the capacity of the communication system, the power consumption of a high-speed link between a service chip and an optical module is increased. The drive capability of the existing SerDes is difficult to match the increase of the power consumption of the high-speed link, and the relay chip 133 needs to be added to compensate the power consumption of the high-speed link, so that the power consumption is increased.
In order to solve the power consumption problem, an On-board optical module solution as shown in fig. 2 is proposed in the industry, in which an optical module 134 is disposed On a carrier 110 and around a chip package 120, such optical module 134 is called an On-board optical (OBO) module or an On-board optical module, and high-speed signal interconnection between a service chip 121 and the OBO134 is realized through package substrate wiring (not shown) and carrier board wiring (not shown). Compared with a conventional pluggable optical module scheme, the carrier plate in the board optical module scheme realizes high-speed signal interconnection by adopting short-distance high-speed wiring, and the SerDes driving capability is reduced, so that the power consumption is reduced. For example, a bidirectional VSR SerDes is adopted for a conventional pluggable optical module, and a bidirectional XSR SerDes is adopted for a conventional OBO, thereby reducing power consumption.
However, when the package substrate of the service chip has a large size and a high single channel rate, even if the conventional OBO scheme is adopted, the large size of the package substrate of the service chip causes large power consumption of a high-speed link, which exceeds the XSR SerDes low power consumption driving capability, while the VSR SerDes or LR SerDes high power consumption driving capability is adopted.
Disclosure of Invention
The embodiment of the application provides an on-board optical interconnection device and communication equipment, and solves the problem that high-speed link power consumption is high when a packaging substrate of an existing service chip is large in size and high in single-channel rate.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:
in a first aspect, there is provided an on-board optical interconnect device comprising: the device comprises a carrier plate, a chip packaging assembly and a first on-board optical module. The chip packaging assembly comprises a service chip and a packaging substrate, wherein the service chip is installed and electrically connected to the packaging substrate, and the packaging substrate is installed and electrically connected to the support plate. The package substrate has a first wiring electrically connected to the service chip. The first on-board optical module includes a rigid-flex board and a first optical device for coupling with an optical fiber, the rigid-flex board includes a first rigid portion and a first flexible portion connected, the rigid-flex board has a second wiring extending over the first rigid portion and the first flexible portion, the first optical device is mounted on the first rigid portion and electrically connected with the second wiring, the first flexible portion is connected to the package substrate and the second wiring is electrically connected with the first wiring, and the first rigid portion is electrically connected with the carrier board. The first wiring and the second wiring are connected and constitute a first link between the service chip and the first optical device. The package substrate has a third wiring electrically connected to the service chip, the carrier plate has a fourth wiring, and the first rigid portion has a fifth wiring electrically connected to the first optical device. The third wiring, the fourth wiring and the fifth wiring are connected in sequence and form a second link between the service chip and the first optical device.
Wherein the first link may be used to transmit high speed signals. The second link may be used for power supply and transmission of low speed signals.
According to the on-board optical interconnection device provided by the embodiment of the application, the chip packaging assembly and the first on-board optical module are arranged on the carrier plate, the first on-board optical module adopts a mode of a rigid flexible plate and a first optical device, the first optical device is arranged on the first rigid part of the rigid flexible plate, the first flexible part is connected between the packaging substrate and the first rigid part, the first wiring of the packaging substrate and the second wiring of the rigid flexible plate are connected to form a first link, and high-speed signal transmission between the service chip and the first optical device is realized. And the third wiring of the packaging substrate, the fourth wiring of the carrier plate and the fifth wiring of the rigid-flexible plate are connected to form a second link, so that low-speed signal transmission and power supply between the service chip and the first optical device are realized. Compared with the conventional on-board optical module scheme, the on-board optical interconnection device has the advantages that the first wiring of the packaging substrate and the second wiring of the rigid board are adopted to realize high-speed signal interconnection between the service chip and the first on-board optical module, the number of fan-out signals from the packaging substrate to the carrier plate is reduced to reduce the number of connecting ends of the packaging substrate, so that the area of the packaging substrate can be reduced, the wiring length of the packaging substrate can be shortened, the power consumption of a high-speed link is reduced, and the high-speed signal interconnection is allowed to be realized by adopting the XSR SerDes with low power consumption.
With reference to the first aspect, in a first possible implementation manner of the first aspect, the number of the first on-board optical modules is multiple, and the multiple first on-board optical modules are arranged side by side on at least one side of the package substrate. A first link and a second link corresponding to the first optical device are arranged between the service chip and the first optical device of each first on-board optical module; the service chip and each first optical device are electrically connected through a first link and a second link corresponding to the first optical device. A plurality of first on-board optical modules are arranged on the periphery of the packaging substrate, so that the service chips and more first on-board optical modules establish low-power-consumption high-speed signal interconnection, and the requirement of a communication system for large capacity is met.
With reference to the first possible implementation manner of the first aspect, in a second possible implementation manner of the first aspect, the plurality of first on-board optical modules are arranged around the package substrate, and the plurality of first on-board optical modules are disposed adjacent to an edge of the package substrate, so that the same package substrate and more first on-board optical modules are connected, and more first links with low power consumption are established between the service chip and the first optical device. The first on-board optical module is arranged nearby relative to the package substrate, so that the length of a second wiring on the rigid flexible board can be shortened, and the power consumption of a high-speed link is effectively reduced.
With reference to the first possible implementation manner of the first aspect, in a third possible implementation manner of the first aspect, the plurality of first on-board optical modules arranged on one side of the package substrate are divided into an inner-ring on-board optical module and an outer-ring on-board optical module, the plurality of inner rings are arranged on the inner ring centered on the service chip at the first rigid portion of the board optical module, and the plurality of outer rings are arranged on the outer ring centered on the service chip at the first rigid portion of the board optical module. The first on-board optical modules are arranged in a multi-layer mode, and the size constraint of the first on-board optical modules is relaxed, so that the first on-board optical modules with larger width can be arranged at the edge of the packaging substrate more.
With reference to the third possible implementation manner of the first aspect, in a fourth possible implementation manner of the first aspect, the inner rings are sequentially arranged in a staggered manner in the board optical module and the outer rings are sequentially arranged in a staggered manner in the board optical module, and at least one outer ring is located between two adjacent inner rings and the first rigid portion of the board optical module at the first flexible portion of the board optical module. The inner ring on the board optical module and the outer ring on the board optical module are approximately distributed on the same plane, so that radiators are conveniently arranged on heating devices such as optical devices on the board optical module to realize heat dissipation.
With reference to the third possible implementation manner of the first aspect, in a fifth possible implementation manner of the first aspect, at least one outer ring is disposed over the board optical module at one inner ring in the first flexible portion of the board optical module. A plurality of on-board optical modules are arranged on each side of the package substrate.
With reference to the first aspect, in a sixth possible implementation manner of the first aspect, the on-board optical interconnection device further includes a second on-board optical module disposed adjacent to an edge of the package substrate, where the second on-board optical module is mounted and electrically connected to the carrier board, and at least one second on-board optical module is located between two adjacent first on-board optical modules. And a third link corresponding to the second on-board optical module is arranged between the service chip and each second on-board optical module, the third link sequentially passes through the packaging substrate and the carrier plate, and the service chip and each second on-board optical module are electrically connected through the third link corresponding to the second on-board optical module. The second on-board optical module is a conventional on-board optical module. The distance between the first flexible parts of the two adjacent first on-board optical modules can be increased, so that the first flexible parts are conveniently connected with the packaging substrate, the high-speed signal interconnection between the service chip and the first on-board optical module is realized through the first link, and the high-speed signal interconnection between the service chip and the second on-board optical module is realized through the third link.
With reference to the sixth possible implementation manner of the first aspect, in a seventh possible implementation manner of the first aspect, the number of the first on-board optical modules and the number of the second on-board optical modules are both multiple, the multiple second on-board optical modules are arranged on an inner ring taking a service chip as a center, and the first rigid portions of the multiple first on-board optical modules are arranged on an outer ring taking the service chip as a center. The first rigid part of the first on-board optical module is arranged on the outer ring, and the second on-board optical module is arranged on the inner ring, so that low-power-consumption high-speed signal transmission between the service chip and the two on-board optical modules is realized.
With reference to the seventh possible implementation manner of the first aspect, in an eighth possible implementation manner of the first aspect, the first on-board optical module and the second on-board optical module are sequentially arranged in a staggered manner, where the first flexible portion of at least one first on-board optical module is located between two adjacent second on-board optical modules. The first flexible part in the first on-board optical module and the packaging substrate are low in connection density, so that the first flexible part and the packaging substrate are convenient to connect and assemble, and the engineering realizability is improved.
With reference to the first aspect, in a ninth possible implementation manner of the first aspect, the board optical interconnection apparatus further includes one or more rigid adapter boards, where each rigid adapter board has a plurality of adapter wires, two ends of each adapter wire are a first connection point and a second connection point, the first connection point is located at a first end of the rigid adapter board, and the second connection point is located at a second end of the rigid adapter board. The first wiring of the package substrate and the second wiring of the rigid flexible board are respectively arranged corresponding to the switching wiring of the rigid switching board. The first end of the rigid interposer is mounted on the package substrate, and the first connection point of the patch wiring is electrically connected to the first wiring corresponding to the patch wiring. The first flexible portion is mounted on the second end of the rigid adapter plate, and the second connection point of the patch wiring is electrically connected with the second wiring corresponding to the patch wiring. The rigid adapter plate scheme can be used for configuring more first on-board optical modules, so that the service chip can establish low-power-consumption high-speed signal interconnection with the more first on-board optical modules.
With reference to the ninth possible implementation manner of the first aspect, in a tenth possible implementation manner of the first aspect, on the surface of the rigid interposer, a distance between two adjacent first connection points is smaller than a distance between two adjacent second connection points. The switching wiring of the rigid adapter plate gradually fans out the first wiring with high density and high power consumption on the packaging substrate into the second wiring with low density and low power consumption, and high-speed signal interconnection between the service chip and more first on-board optical modules is achieved.
With reference to the tenth possible implementation manner of the first aspect, in an eleventh possible implementation manner of the first aspect, the second end of the rigid interposer is arc-shaped or circular, the plurality of first on-board optical modules are circumferentially arranged, and the first flexible portions of the plurality of first on-board optical modules radially extend with the service chip as a center. The first flexible portion can be connected to the second end of the rigid adapter plate, which is arc-shaped or circular, so that the plurality of first flexible portions are converted into circumferential arrangement to adapt to the layout of the first on-board optical module surrounding the business chip.
With reference to the tenth possible implementation manner or the eleventh possible implementation manner of the first aspect, in a twelfth possible implementation manner of the first aspect, the second connection points are distributed on the same side of the rigid interposer, each first on-board optical module has a first flexible portion, and the first flexible portions are connected to the second connection points in a one-to-one correspondence manner. The scheme is convenient for the assembly between the first flexible part and the rigid adapter plate, and the electric connection between different adapter wirings and corresponding second wirings is realized.
With reference to the tenth possible implementation manner or the eleventh possible implementation manner of the first aspect, in a thirteenth possible implementation manner of the first aspect, the second connection points arranged in pairs are respectively disposed on two opposite sides of the rigid interposer, each first on-board optical module has first flexible portions arranged in pairs, and the first flexible portions arranged in pairs are connected to the second connection points arranged in pairs in a one-to-one correspondence manner. In the same space, more high-speed links are established between the service chip and the same first on-board optical module by configuring more first flexible parts.
With reference to any one of the first aspect to the thirteenth possible implementation manner of the first aspect, in a fourteenth possible implementation manner of the first aspect, a side of the first rigid portion facing the carrier board and the carrier board are connected by a low-speed connector. The rigid flexible board and the carrier board are connected through the low-speed connector, power supply and low-speed signal transmission of the first on-board optical module are achieved, and the optical module is simple in structure and convenient to assemble. The low-speed connector supports the first rigid part at a position with a certain height away from the carrier plate, the butt joint area of the low-speed connector is small, more circuit elements can be placed on the lower surface of the first rigid part, and the area of the first rigid part is fully utilized.
With reference to any one of the first aspect to the thirteenth possible implementation manner of the first aspect, in a fifteenth possible implementation manner of the first aspect, the rigid-flexible board further includes a second flexible portion electrically connected to the first rigid board, and the second flexible portion and the carrier board are connected by a low-speed connector. The first rigid part and the carrier plate are electrically connected through the second flexible part and the low-speed connector.
With reference to any one of the first aspect to the eighth possible implementation manner of the first aspect, in a sixteenth possible implementation manner of the first aspect, the first flexible portion and the package substrate are soldered to each other, so that the package substrate and the first flexible portion are mechanically connected, and the first wire and the second wire are electrically connected, and the assembly density is high when soldering connection is adopted.
With reference to any one of the first aspect to the eighth possible implementation manner of the first aspect, in a seventeenth possible implementation manner of the first aspect, the first flexible portion and the package substrate are connected by a flexible board connector. The flexible board connector comprises a plug and a socket which can be mutually plugged, the plug is inserted into the socket, the mechanical connection of the packaging substrate and the first flexible portion is achieved, the first wiring and the second wiring are electrically connected, the flexible board connector can be plugged and pulled, assembly and maintenance are convenient, and flexibility is good.
With reference to any one of the ninth possible implementation manner to the thirteenth possible implementation manner of the first aspect, in an eighteenth possible implementation manner of the first aspect, the first flexible portion and the rigid adapter plate are welded to each other; or the first flexible part and the rigid adapter plate are connected through a flexible plate connector. And realizing the electrical connection between the first wiring of the first flexible part and the switching wiring of the rigid adapter plate.
With reference to any one of the first aspect to the eighteenth possible implementation manner of the first aspect, in a nineteenth possible implementation manner of the first aspect, the first on-board optical module further includes a relay chip electrically connected to the first optical device, the relay chip is mounted at one end of the first rigid portion close to the first flexible portion, and the first optical device is mounted at one end of the first rigid portion far from the first flexible portion. The relay chip is used for recovering the signal received by the first optical device or the signal required to be transmitted. The relay chip and the first optical device are respectively arranged close to two ends of the first rigid part, so that the area size of the first rigid part can be reduced, and more first on-board optical modules can be conveniently arranged in parallel in the same space.
With reference to any one of the nineteenth possible implementation manner of the first aspect, in a twentieth possible implementation manner of the first aspect, a side of the first optical device facing away from the first flexible portion has a first optical interface, and the first optical interface is configured to be coupled with an optical fiber. The optical fiber may extend in a direction away from the package substrate when the optical fiber is mounted at the first optical interface.
With reference to any one of the first aspect to the twenty-first possible implementation manner of the first aspect, in a twenty-first possible implementation manner of the first aspect, the rigid-flexible plate is formed by co-pressing the first rigid portion and the first flexible portion. Alternatively, the rigid-flexible board is formed by connecting the first flexible part to the first rigid part. Both approaches enable the fabrication of a rigid flex with a second wire extending over the first flexible portion and the first rigid portion as part of the high speed link between the service chip and the first optical device.
With reference to any one of the first aspect to the twenty-first possible implementation manner of the first aspect, in a twenty-second possible implementation manner of the first aspect, the package substrate and the carrier are connected by solder balls. Or the packaging substrate is connected with the carrier plate through the low-speed connector, the low-speed connector meets the requirements of power supply and low-speed signal transmission, and the connector is favorable for improving the assembly reliability.
In a second aspect, a communication device is provided, which includes the on-board optical interconnection apparatus as described in the first aspect to the twenty-second possible implementation manner of the first aspect. The communication device provided by the embodiment of the application adopts the board optical interconnection device, so that all the beneficial effects brought by the technical scheme of the embodiment are also achieved.
Drawings
Fig. 1 is a schematic structural diagram of a conventional pluggable optical module;
fig. 2 is a schematic structural diagram of a conventional on-board optical module;
FIG. 3 is a schematic structural diagram of a first on-board optical interconnection device according to an embodiment of the present application;
FIG. 4 is a partial side view of the on-board optical interconnect of FIG. 3;
FIG. 5 is a diagram comparing bottom surfaces of package substrates of an on-board optical interconnect and a conventional on-board optical module solution provided in embodiments of the present application;
FIG. 6 is a schematic diagram of an alternative chip package and optical module interconnection scheme;
fig. 7 is a schematic structural diagram of a second on-board optical interconnection device according to an embodiment of the present application;
FIG. 8 is a schematic structural diagram of a third on-board optical interconnection device provided in the embodiments of the present application;
FIG. 9 is a schematic structural diagram of a fourth on-board optical interconnect device provided in the embodiments of the present application;
FIG. 10 is a schematic structural diagram of a fifth on-board optical interconnect device provided in an embodiment of the present application;
fig. 11 (a) and (b) are partial side views of fig. 9 when the board optical interconnection device is provided with different numbers of the first flexible portions.
Detailed Description
The on-board Optical interconnection apparatus provided in the following embodiments of the present application may be applied to a high-speed communication system and device with an Optical interface, and may be a network product, such as a router, a switch, a transmission network device, an Optical Line Terminal (OLT) in an access network, and may also be a wireless backhaul device, such as a baseband processing Unit (BBU), and so on.
Fig. 3 is a schematic structural diagram of an on-board optical interconnection device provided in an embodiment of the present application, and fig. 4 is a partial side view of the on-board optical interconnection device of fig. 3. Referring to fig. 3, the on-board optical interconnection device includes a carrier 10 and a chip package 20 disposed on the carrier 10. The chip package assembly 20 includes a business chip 21 (Payload IC) and a package substrate 22. The service chip 21 functions as a router, a switch, and a multi-core processor. Referring to fig. 4, the service chip 21 is disposed on the package substrate 22, the bottom of the package substrate 22 has a plurality of connection terminals (I/O terminals) 23, the plurality of terminals 211 of the service chip 21 and the plurality of connection terminals 23 of the package substrate 22 are connected by different wires (not shown) of the package substrate 22, and the package substrate wires may extend on the surface or inside of the package substrate 22 and may also penetrate through the package substrate 22. The chip package assembly 20 having different package substrate wirings is mounted on the carrier board 10, and the connection terminals 23 of the package substrate 22 are in contact with the connection points of the carrier board 10, thereby achieving the electrical connection between the service chip 21 and the carrier board 10.
For example, a Ball Grid Array (BGA) package may be used between the semiconductor package 20 and the carrier board 10, which is a form of a high-density semiconductor package. For another example, a high-speed connector may be used between the package component 20 and the carrier 10, and the high-speed connector includes a plug and a socket that can be plugged into each other, and the plug and the socket are electrically connected after being connected, and specifically, a high-speed socket connector (socket connector) or a high-speed buckle connector may be used. Both BGA packaging and high speed connectors are advantageous for protection and ease of use of the service chip 21. Both of these modes can provide a large number of connection terminals 23 for high-speed signal transmission in the same volume.
The on-board optical interconnection device further comprises an optical module for connecting the chip package assembly and the optical fiber. The optical module includes an optical device for coupling with an optical fiber. The optical device may include two parts, namely an optical transmitter and an optical receiver, which are respectively used for transmitting and receiving optical signals. The process of receiving signals by the service chip is as follows: optical signals sent by external equipment are transmitted on the optical fibers, the optical receiver converts the optical signals into electric signals after the optical signals enter the optical receiver, and the optical module transmits the electric signals to the service chip for processing. The process of sending out signals by the service chip is as follows: the service chip transmits the electrical signal to the optical module, converts the electrical signal into an optical signal through the optical transmitter, and sends the optical signal to external equipment through the optical fiber. It will be appreciated that the optical device may comprise only an optical transmitter or an optical receiver.
In the conventional on-board optical module scheme as shown in fig. 2, the high-speed link between the service chip 121 and the conventional OBO134 includes package substrate wiring, a connection terminal of the package substrate, carrier board wiring, and a connection terminal of the on-board optical module. The adjacent wiring of the package substrate should have a certain distance, and the adjacent connection end of the package substrate should have a certain distance. In a certain space, the number of wiring and connection terminals of the package substrate is limited.
In order to meet the requirement of large capacity of a communication system, a service chip is provided with a large number of terminalsFan-out signals of the service chips are increased, more long wires and connecting terminals are required to be arranged on the packaging substrate, and the packaging substrate is required to be made into a large size. When the size of a packaging substrate of the conventional service chip is large and the single-channel rate is high, the power consumption of a high-speed link is larger, and the power consumption exceeds the XSR low-power-consumption driving capability. Illustratively, the size of the package substrate is from about 65x65mm 2 Increase to about 85x85mm 2 To 100x100mm 2 The area of the service chip only occupies about half of the area of the packaging substrate, and the wiring power consumption (double-side dB) of the packaging substrate is increased by more than three times at a corresponding rate.
In order to solve the problem that the high-speed link power consumption is large when the package substrate of the existing service chip is large in size and the single channel rate is high, referring to fig. 3 and 4, an embodiment of the present application provides an on-board optical interconnection apparatus, including: a carrier 10, a chip package 20 and a first on-board optical module 30. The chip package assembly 20 includes a service chip 21 and a package substrate 22, the service chip 21 is mounted and electrically connected to the package substrate 22, and the package substrate 22 is mounted and electrically connected to the carrier 10. The package substrate 22 has a first wiring (not shown) electrically connected to the service chip 21. The first on-board optical module 30 includes a rigid flexible board 31 and a first optical device 32 for coupling with the optical fiber 60, the rigid flexible board 31 includes a first rigid portion 311 and a first flexible portion 312 connected to each other, the rigid flexible board 31 has a second wiring (not shown) extending over the first rigid portion 311 and the first flexible portion 312, the first optical device 32 is mounted on the first rigid portion 311 and electrically connected to the second wiring, the first flexible portion 312 is connected to the package substrate 22 and the second wiring and the first wiring are electrically connected, and the first rigid portion 311 is electrically connected to the carrier board 10. The first and second wires are connected and constitute a first link between the service chip 21 and the first optical device 32. The package substrate 22 has a third wiring (not shown) electrically connected to the service chip 21, the carrier board 10 has a fourth wiring (not shown), and the first rigid portion 311 has a fifth wiring (not shown) electrically connected to the first optical device 32. The third, fourth and fifth wirings are connected in sequence and constitute a second link between the service chip 21 and the first optical device 32.
Among them, the Rigid-flex Board (rig-flex) is a Circuit Board in which a Printed Circuit Board (PCB) and a Flexible Printed Circuit Board (FPC) are combined. The printed circuit board has certain rigidity, is convenient for installing some components, and can be wired to connect the components to realize the circuit function. The flexible circuit board can be twisted, bent and wired, and a three-dimensional line can be formed to extend to a predetermined position. The carrier board 10 and the first rigid part 311 may be a printed circuit board, and the first flexible part 312 is a flexible circuit board. The printed circuit board and the flexible circuit board are provided with wires with equal lengths, and the high-speed power consumption generated by the flexible circuit board wires is smaller than that generated by the printed circuit board wires.
Wherein the first link may be used to transmit high speed signals. The second link may be used for power supply and transmission of low speed signals. The high-speed signal and the low-speed signal are used as relative concepts, and the corresponding transmission rates have no absolute limits. Here, a signal with a transmission rate of less than 1Gbps is regarded as a low-speed signal, and a signal with a transmission rate of 1Gbps or more is regarded as a high-speed signal, with the transmission rate of 1Gbps being the limit. Illustratively, the transmission rate of the low-speed signal may be 5Mbps, 10Mbps, or the like. The transmission rate of the high speed signal may be 25Gbps, 56Gbps, 112Gbps, 224Gbps, etc.
According to the on-board optical interconnection device provided by the embodiment of the application, the chip package assembly 20 and the first on-board optical module 30 are arranged on the carrier board 10, the first on-board optical module 30 adopts a mode of the rigid flexible board 31 and the first optical device 32, the first optical device 32 is arranged on the first rigid portion 311 of the rigid flexible board 31, the first flexible portion 312 is connected between the package substrate 22 and the first rigid portion 311, the first wiring of the package substrate 22 and the second wiring of the rigid flexible board 31 are connected to form a first link, and high-speed signal transmission between the service chip 21 and the first optical device 32 is realized. The third wiring of the package substrate 22, the fourth wiring of the carrier board 10 and the fifth wiring of the rigid-flexible board 31 are connected to form a second link, so that low-speed signal transmission and power supply between the service chip 21 and the first optical device 32 are realized. Compared with the conventional on-board optical module scheme, the on-board optical interconnection device of the application adopts the first wiring of the package substrate 22 and the second wiring of the rigid-flexible board 31 to realize high-speed signal interconnection between the service chip 21 and the first on-board optical module 30, and reduces the number of fan-out signals of the package substrate 22 to the carrier board 10 to reduce the number of the connecting ends 23 of the package substrate 22, so that the area of the package substrate 22 can be reduced, the wiring length of the package substrate 22 can be shortened, the power consumption of a high-speed link is reduced, and the high-speed signal interconnection is allowed to be realized by adopting the XSR SerDes with low power consumption.
The following is a quantitative comparison analysis of a conventional on-board optical module scheme (referred to as a conventional OBO scheme for short) and an on-board optical interconnection apparatus (referred to as the present scheme for short) according to the embodiments of the present application, and it can be clearly seen that the high-speed power consumption of the present application is smaller, thereby allowing the implementation of high-speed signal interconnection using an XSR SerDes with low power consumption, and showing the superiority of the present application.
The package substrates of the conventional OBO scheme and the scheme of the present application are both BGA packages. In the conventional OBO scheme, the high-speed link between the service chip and the on-board optical module includes package substrate wiring, a connection terminal of the package substrate, carrier board wiring, and a connection terminal of the on-board optical module. In the present embodiment, a plurality of first on-board optical modules 30 are arranged around the chip package 20, and high-speed signal interconnection is realized by the respective first links.
Fig. 5 is a comparison diagram of the bottom surfaces of the package substrates of the on-board optical interconnection apparatus and the conventional on-board optical module solution provided in the embodiments of the present application. Two circles are drawn in fig. 5, the outer circle being the package substrate 22' size of the conventional OBO scheme and the inner circle being the package substrate 22 size of the present scheme. The connection 23' between the outer and inner rings comprises high speed signal and Ground (Ground) pins and the connection 23 in the inner ring comprises power signal, ground and other pins. Compared with the conventional OBO scheme, the scheme of the application omits a BGA solder ball (the connecting end 23' between the outer ring and the inner ring) corresponding to 512 paths of high-speed signals, and under the condition that the size of a service chip is unchanged, the size of the packaging substrate can be 100x100mm of the outer ring 2 Reduced to 80 × 80mm of the inner circle 2 The area is reduced by 36%.
For high-speed signal transmission with a frequency point of 56GHz, the conventional OBO scheme totals about 24dB high-speed power consumption, wherein the power consumption of the wiring of the packaging substrate and the power consumption of the wiring of the carrier plate totals about 17dB, and the power consumption of the connecting end of the packaging substrate and the power consumption of the connecting end of the OBO totals 7dB. The total high-speed power consumption of the scheme is about 12-15 dB, wherein the size of the packaging substrate can be reduced, so that the wiring of the packaging substrate can be shortened, and compared with the wiring power consumption of the packaging substrate in the conventional OBO scheme, the wiring power consumption of the packaging substrate in the scheme is reduced by about one third; the high-speed connecting end of the packaging substrate and the OBO side is omitted, and about 6dB high-speed power consumption is remarkably saved. The scheme of the application realizes smaller high-speed power consumption, and allows the XSR SerDes with low power consumption to realize high-speed signal interconnection.
In addition, the package substrate and the carrier board of the conventional OBO scheme are connected by a high-speed connector. The package substrate and the carrier plate are connected through the low-speed connector, high-speed signal interconnection is achieved through the first link, the area size of the package substrate can be reduced, the wiring length of the package substrate is shortened, the high-speed connecting end of the package substrate and the OBO side is omitted, high-speed power consumption can be saved, and low-power-consumption XSR SerDes is allowed to be used for achieving high-speed signal interconnection. The low-speed connector comprises a plug and a socket which can be mutually inserted, the plug and the socket are electrically connected after being connected, and the low-speed connector can meet the requirements of power supply and low-speed signal transmission.
Fig. 6 is a schematic diagram of another interconnection scheme for a chip package and an optical module. By taking the chip package assembly and the optical module interconnection scheme as shown in fig. 6 as a comparative example and comparing and analyzing the comparative example and the on-board optical interconnection device of the embodiment of the present application, it can be seen that the high-speed power consumption of the scheme of the present application is smaller, and the superiority of the scheme of the present application is demonstrated.
In the comparative example, the chip package assembly 120 includes a service chip 121 and a package substrate 122, the service chip 121 is mounted on the package substrate 122, and a ball grid array package is used between the package substrate 122 and the carrier board 110. The optical module 134 includes a first substrate 1341 and an optical device (not shown) disposed on the first substrate 1341, and a ball grid array package is employed between the first substrate 1341 and the carrier 110. The flexible cable 150 is disposed between the package substrate 122 and the first substrate 1341, and two end portions 151 of the flexible cable 150 may be connected to corresponding substrates through a connector or by soldering, so as to electrically connect the package substrate 122, the flexible cable 150 and the first substrate 1341, and further achieve high-speed signal transmission between the service chip 121 and the optical module 134 on the package substrate 122. When the end 151 of the flexible cable 150 is connected to the first substrate 1341 by a connector or soldering, the assembly process is time-consuming and troublesome, and a certain high-speed link power consumption is generated when high-speed signals are transmitted through the connector or soldering point.
In the present embodiment, referring to fig. 4, the rigid-flex plate 31 provided with the first optical device 32 is previously manufactured, the rigid-flex plate 31 has the second wiring extending over the first rigid portion 311 and the first flexible portion 312, and when the chip package 20 and the first on-board optical module 30 are connected, the one end 312a of the first flexible portion 312 is connected to the package substrate 22, and the first wiring of the package substrate 22 and the second wiring of the rigid-flex plate 31 are electrically connected to form the first link, so that high-speed signal transmission between the service chip 21 and the first optical device 32 can be realized. Compared with a comparative example, the scheme of the application reduces the connection steps of the first rigid part 311 and the first flexible part 312, the assembly process is more convenient and faster, the influence of a connector or a welding point on the transmission power consumption of high-speed signals is reduced, the power consumption of a high-speed link generated during the transmission of the high-speed signals is smaller, and the XSR SerDes with low power consumption is favorable for realizing the high-speed signal interconnection.
In the case of providing the package assembly 20 of the present application, referring to fig. 3 and 4, the service chip 21 needs to fan out more signals, and the area of the package substrate 22 is made larger than that of the service chip 21, so as to provide wiring and connection terminals on the package substrate 22. The service chip 21 may be disposed in the middle of the upper surface of the package substrate 22, so as to uniformly dispose the wiring and the connection terminals on the package substrate 22. In addition, a ring frame 24 may be disposed on the package substrate 22, the ring frame 24 is disposed around the service chip 21, and a heat sink (not shown) such as a heat conductive plate, a heat sink or a thermoelectric cooling device for dissipating heat from the service chip 21 is mounted on the ring frame 24.
There are different implementations in making rigid and flexible plates. The first rigid-flexible plate is realized by the following steps: the rigid flexible plate 31 is formed by press-mixing the first rigid portion 311 and the first flexible portion 312. The second rigid-flexible plate is realized by the following steps: the rigid flexible plate 31 is formed by molding the first rigid portion 311 first and then connecting the first flexible portion 312 to the first rigid portion 311. In either way, the rigid-flex board 31 can be fabricated with the second wire extending over the first flexible portion 312 and the first rigid portion 311 as part of the high speed link between the service chip 21 and the first optical device 32.
When the rigid flexible plate 31 of the first surface optical module 30 is provided, the first rigid portion 311 may be provided in a rectangular shape or another shape for mounting an optical device and other components. The first flexible portion 312 is used for connecting the first rigid portion 311 and the package substrate 22, and may be configured in a strip shape, a belt shape, or other shapes. The smaller the width dimension of the first flexible portion 312 and the first rigid portion 311 is, the more advantageous the more the first on-board optical modules 30 are arranged side by side on the package substrate 22. The smaller the length dimensions of the first flexible portion 312 and the first rigid portion 311 are, the shorter the length of the second wiring on the first flexible portion 312 and the first rigid portion 311 is, which is beneficial for reducing high-speed link power consumption, and therefore, the first rigid portion 311 of the first on-board optical module 30 may be disposed close to the package substrate 22 to shorten the second wiring length.
There are different implementations when the package substrate 22 and the carrier 10 are assembled. The first implementation is a BGA package: referring to fig. 4, the package substrate 22 and the carrier 10 are connected by solder balls. The second implementation is a connector: the package substrate and the carrier are connected by a low-speed connector (not shown), and the low-speed connector satisfies the requirements of power supply and transmission of low-speed signals, and is favorable for improving the reliability of assembly when the connector is adopted. Illustratively, the low-speed connector may be a low-speed socket connector or other type of low-speed connector.
There are several implementations when the first flexible portion is directly mounted to the package substrate. The first implementation manner of the connection between the first flexible portion and the package substrate is as follows: referring to fig. 3 and 4, the first flexible portion 312 and the package substrate 22 are bonded together by thermal compression bonding, laser welding, or the like. Illustratively, the first flexible portion 312 extends in a strip shape, and one end 312a of the first flexible portion 312, which is away from the first rigid portion 311, is soldered to the upper surface of the package substrate 22, so as to achieve mechanical connection between the package substrate 22 and the first flexible portion 312 and electrical connection between the first wire and the second wire, where the assembly density is high when soldering connection is adopted.
The second implementation manner of the connection between the first flexible portion and the package substrate is as follows: the first flexible portion and the package substrate are connected by a flexible board connector (not shown). Wherein, flexible board connector is including plug and the socket that can peg graft each other, and first flexible portion is located to one of them component in plug and the socket, and packaging substrate is located to another component, through inserting the plug and establish on the socket, realizes packaging substrate and the mechanical connection of first flexible portion to and the electricity of first wiring and second wiring is connected, and flexible board connector is pluggable, is convenient for assemble the maintenance, and the flexibility is good.
There are different implementations in achieving the electrical connection between the first rigid portion of the rigid-flex board and the carrier board. The first implementation mode of the electrical connection between the rigid-flexible board and the carrier board is as follows: referring to fig. 4, the side of the first rigid portion 311 facing the carrier plate 10 is connected to the carrier plate 10 by a low speed connector 33. The rigid flexible board 31 and the carrier board 10 are connected through the low-speed connector 33, so that power supply to the first on-board optical module 30 and low-speed signal transmission are realized, and the structure is simple and the assembly is convenient. It should be noted that the mating area of the high speed connector is larger than that of the low speed connector because the pin pitch of the high speed connector is larger and the high speed connector contains more parts. The conventional OBO and the carrier plate 10 are connected by a high-speed connector, the butt joint area of the high-speed connector is large, the bottom area of the conventional OBO is also large, and the high-speed connector basically occupies the bottom area of the conventional OBO. The first on-board optical module 30 of the embodiment of the present application is connected to the carrier board 10 by using the low-speed connector 33, and only needs to satisfy low-speed signal transmission and power supply, the area of the low-speed connector 33 is small, and the area of the first rigid portion 311 can be made small. Compared to the conventional OBO, the area of the first rigid portion 311 of the first on-board optical module 30 of the present application can be reduced by about 50%. In addition, the low-speed connector 33 supports the first rigid portion 311 at a position having a certain height from the carrier board 10, so that the mating area of the low-speed connector 33 is small, more circuit elements can be placed on the lower surface of the first rigid portion 311, and the area of the first rigid portion 311 is fully utilized.
The second implementation mode of the electrical connection between the rigid flexible board and the carrier board is as follows: the rigid-flexible board further comprises a second flexible portion (not shown) electrically connected to the first rigid board, and the second flexible portion and the carrier board are connected by a low-speed connector. The first rigid part and the carrier plate are electrically connected through the second flexible part and the low-speed connector. Wherein the second flexible portion is a flexible circuit board. Illustratively, the first flexible part and the second flexible part are respectively arranged at two ends of the first rigid part, and one end of the second flexible part far away from the first rigid part is connected with the carrier plate through a low-speed connector. The first flexible portion and the second flexible portion may also be provided on the first rigid portion in other ways.
In some embodiments, referring to fig. 4, the first on-board optical module 30 further includes a relay chip 34 electrically connected to the first optical device 32, the relay chip 34 is mounted at one end of the first rigid portion 311 close to the first flexible portion 312, and the first optical device 32 is mounted at one end of the first rigid portion 311 far from the first flexible portion 312. The relay chip 34 is used for recovering a Signal received by the first Optical device 32 or a Signal to be transmitted, and may specifically be a Clock and Data Recovery (CDR) chip or an Optical Digital Signal Processing (ODSP) chip. The relay chip 34 and the first optical device 32 are respectively disposed near two ends of the first rigid portion 311, so that the area size of the first rigid portion 311 can be reduced, and more first on-board optical modules 30 can be arranged side by side in the same space. The first optical device 32 is disposed at a position of the first rigid portion 311 away from the first flexible portion 312, which facilitates the arrangement and connection of the optical fiber 60 and the first optical device 32.
In some embodiments, the first on-board optical module 30 further includes an amplifying electric chip (not shown) electrically connected to the first optical device 32, and the amplifying electric chip is disposed on the first rigid portion 311. The amplifying electric chip is used for amplifying the signal passing through the relay chip 34, and specifically, an Amplifier (Driver) and a transimpedance Amplifier (TIA) may be used.
In some embodiments, to facilitate the arrangement of the different first light devices 32 and the optical fibers 60, referring to fig. 4, the side of the first light devices 32 facing away from the first flexible portion 312 has a first light interface 321, the first light interface 321 being for coupling with the optical fibers 60. The first optical interface 321 is disposed at a position opposite to the first flexible board of the first optical device 32, and when the optical fiber 60 is mounted at the first optical interface 321, the optical fiber 60 may extend in a direction away from the package substrate 22. With reference to fig. 3, when the plurality of first on-board optical modules 30 are disposed on the periphery of the package substrate 22, the plurality of optical fibers 60 in different orientations are connected to the first optical interfaces 321 of the corresponding first on-board optical modules 30, so as to realize different arrangements of the first on-board optical modules 30 and the optical fibers 60.
In some embodiments, in order to protect and dissipate heat of the devices on the first rigid portion 311, the first on-board optical module 30 further includes a housing (not shown), the housing covers the first optical device 32, the relay chip 34, and the like on the first rigid portion 311, and the housing may be made of a heat-conductive metal material.
In some embodiments, in order to reduce the high-speed link power consumption more, referring to fig. 3, the number of the first on-board optical modules 30 is plural, and the plural first on-board optical modules 30 are arranged side by side on at least one side of the package substrate 22. A first link and a second link corresponding to the first optical device 32 are arranged between the service chip 21 and the first optical device 32 of each first on-board optical module 30; the service chip 21 and each of the first optical devices 32 are electrically connected by a first link and a second link corresponding to the first optical device 32. A plurality of first on-board optical modules 30 are arranged on the periphery of the packaging substrate 22, so that the business chip 21 and more first on-board optical modules 30 establish high-speed signal interconnection with low power consumption, and the requirement of large capacity of a communication system is met. The package substrate 22 is generally rectangular, and a plurality of first on-board optical modules 30 may be arranged along one or more sides of the package substrate 22, such that more first on-board optical modules 30 may be arranged in the same plane.
For example, referring to fig. 7, when the board optical interconnection apparatus is applied to a router, the carrier board 10 is a router cluster network board, a plurality of chip package assemblies 20 are arranged on the carrier board 10, and a plurality of first on-board optical modules 30 are arranged on one side of each chip package assembly 20, so as to implement high-speed signal interconnection between each service chip 21 and the corresponding first on-board optical module 30. In addition, a high-speed link is also provided between the chip package assembly 20 and a backplane connector (not shown) to enable high-speed signal interconnection. In the embodiment shown in fig. 7, three chip packages 20 are arranged on the carrier board 10, and eight first on-board optical modules 30 are arranged on one side of each package substrate 22. In other embodiments, the number of the first on-board optical modules 30 arranged on one side of the package substrate 22 may be four or other.
When a plurality of first on-board optical modules 30 are arranged, referring to fig. 3, the plurality of first on-board optical modules 30 are arranged around the package substrate 22, so that the same package substrate 22 is connected with more first on-board optical modules 30, more first links with low power consumption are established between the service chip 21 and the first optical device 32, and more high-speed signal interconnections are realized. The plurality of first on-board optical modules 30 are arranged adjacent to the edge of the package substrate 22, that is, the first on-board optical modules 30 are arranged nearby relative to the package substrate 22, so that the length of the second wiring on the rigid flexible board 31 can be shortened, and the power consumption of a high-speed link can be effectively reduced.
For example, referring to fig. 3, the board optical interconnection apparatus is applied to a switch, the carrier board 10 is a single board of the switch, a chip package assembly 20 is disposed on the carrier board 10, a plurality of first on-board optical modules 30 are respectively disposed on four peripheries of the chip package assembly 20, and a first flexible portion 312 of each first on-board optical module 30 is connected to an edge of the package substrate 22, so as to implement high-speed signal interconnection between the service chip 21 and the first on-board optical module 30. In the embodiment shown in fig. 3, eight first on-board optical modules 30 are disposed on each side of the package substrate 22, and the number of the first on-board optical modules is set as required.
In some embodiments, referring to fig. 8, in order to arrange the first on-board optical module 30 having a larger width on one side of the package substrate 22, the plurality of first on-board optical modules 30 arranged on one side of the package substrate 22 are divided into an inner-circle on-board optical module 30a and an outer-circle on-board optical module 30b, the plurality of inner-circle on-board optical module 30a first rigid portion 311 is arranged on an inner circle centered on the service chip 21, and the plurality of outer-circle on-board optical module 30b first rigid portion 311 is arranged on an outer circle centered on the service chip 21. The inner and outer rings here may be rectangular or circular. The first flexible portion 312b of the outer ring on the board optical module 30b is made longer than the first flexible portion 312a of the inner ring on the board optical module 30a, the first rigid portion 311a of the outer ring on the board optical module 30b and the first rigid portion 311b of the inner ring on the board optical module 30a are distributed on positions with different distances from the edge of the package substrate 22, the connection between the different first flexible portions 312a and 312b and the package substrate 22 is realized by utilizing the flexibility and the flexibility of the first flexible portions, the multilayer arrangement of the first board optical modules 30 is realized, the size constraint of the first board optical modules 30 is widened, the first board optical modules 30 with larger width can be also distributed on the edge of the package substrate 22 more, and the business chip 21 also meets the low-power-consumption XSR SerDes driving capability.
There are different implementations when the first on-board optical modules are arranged in multiple layers. The first implementation manner of the multilayer arrangement of the on-board optical modules 30 is as follows: referring to fig. 8, the inner circles of the optical module 30a and the outer circles of the optical module 30b are sequentially arranged in a staggered manner, wherein at least one outer circle of the optical module 30b is located between the first flexible portion 312b of two adjacent inner circles of the optical module 30a and the first rigid portion 311a of the optical module 30 a. According to the scheme, the inner ring on the board optical module 30a and the outer ring on the board optical module 30b are approximately distributed on the same plane, so that radiators are conveniently arranged on heating devices such as optical devices on the board optical module to realize heat dissipation.
For example, referring to fig. 8, four inner-ring and four outer-ring plate optical modules 30a and 30b are disposed on each side of the package substrate 22, and eight first plate optical modules 30 are disposed on the same side of the package substrate 22, where the first flexible portion 312b of the outer-ring plate optical module 30b passes through a gap between the first rigid portions 311a of the adjacent inner rings and the plate optical module 30 a. The number of first on-board optical modules 30 arranged on the same side of the package substrate 22 is set as needed.
The second implementation mode of the multi-layer arrangement of the first on-board optical modules is as follows: and at least one outer ring is arranged above the board optical module in a manner of straddling one inner ring at the first flexible part of the board optical module. According to the scheme, a plurality of on-board optical modules can be arranged on each side of the packaging substrate. The first flexible part of the outer ring on the board optical module is made longer, so that the outer ring on the board optical module crosses over the radiator of the inner ring on the board optical module, and the heat dissipation of the first on-board optical module is realized.
For example, eight inner ring-on-board optical modules and eight outer ring-on-board optical modules are arranged on the same side of the package substrate, and the eight outer rings are arranged above the eight inner ring-on-board optical modules in a one-to-one correspondence manner in the first flexible portions of the board optical modules, that is, sixteen on-board optical modules are arranged on the same side of the package substrate. The number of the board optical modules arranged on the same side of the package substrate is set as required.
In other embodiments, more than three turns of the first on-board optical module 30 may be arranged around the package substrate 22, so as to implement high-speed signal interconnection between more first on-board optical modules 30 and the service chip 21.
In some embodiments, referring to fig. 9, in order to reduce the connection density of the first flexible portion 312 in the first on-board optical module 30 and the package substrate 22 to facilitate the connection of the first flexible portion 312 and the package substrate 22, the on-board optical interconnection apparatus further includes a second on-board optical module 40 disposed adjacent to an edge of the package substrate 22, the second on-board optical module 40 being mounted and electrically connected to the carrier board 10, wherein at least one second on-board optical module 40 is located between two adjacent first on-board optical modules 30. A third link (not shown) corresponding to the second on-board optical module 40 is provided between the service chip 21 and each second on-board optical module 40, the third link sequentially passes through the package substrate 22 and the carrier board 10, and the service chip 21 and each second on-board optical module 40 are electrically connected through the third link corresponding to the second on-board optical module 40. The second on-board optical module 40 is a conventional on-board optical module, and includes a printed circuit board (not shown) and a second optical device (not shown) disposed on the printed circuit board. Compared to the first rigid portion 311 of the first on-board optical module 30, the printed circuit board of the conventional on-board optical module has many wirings and connection terminals, and thus the area of the conventional on-board optical module is larger. The third link includes package substrate wiring, carrier board wiring, and printed circuit board wiring of the second on-board optical module 40, and the third link may be used for high-speed signal and low-speed signal transmission between the service chip 21 and the second optical device. The second on-board module 40 is disposed near the edge of the package substrate 22, so that the wiring length of the carrier board 10 can be shortened to reduce the power consumption of signal transmission. The second on-board optical module 40 is arranged between two adjacent first on-board optical modules 30, the area of the printed circuit board of the second on-board optical module 40 is larger than the area of the first rigid part 311 of the first on-board optical module 30, so that the distance between the first flexible parts 312 of the two adjacent first on-board optical modules 30 can be enlarged, the connection between the first flexible parts 312 and the package substrate 22 is facilitated, the high-speed signal interconnection between the service chip 21 and the first on-board optical module 30 is realized through the first link, and the high-speed signal interconnection between the service chip 21 and the second on-board optical module 40 is realized through the third link.
When the second on-board module 40 is disposed, the second on-board module 40 and the carrier board 10 may be connected by a BGA package or a high speed connector, and the package substrate 22 and the carrier board 10 may be connected by a BGA package or a high speed connector. When a high-speed connector is provided, a high-speed socket connector (receptacle connector) or other high-speed connector may be used. The side of the second optical device facing away from the package substrate 22 has a second optical interface 41 coupled to the optical fiber 60, so that different second optical fibers 60 corresponding to the on-board modules 40 are arranged around the package substrate 22 from different directions.
In some embodiments, when the number of the first on-board optical module 30 and the second on-board optical module 40 is plural, the plural second on-board optical modules 40 are arranged on an inner circle centering on the service chip 21, and the first rigid parts 311 of the plural first on-board optical modules 30 are arranged on an outer circle centering on the service chip 21. A first link and a second link corresponding to the first optical device 32 are arranged between the service chip 21 and the first optical device 32 of each first on-board optical module 30; the service chip 21 and each of the first optical devices 32 are electrically connected through a first link and a second link corresponding to the first optical device 32. The service chip 21 and each second on-board optical module 40 are electrically connected by a third link corresponding to the second on-board optical module 40. The inner and outer rings here may be rectangular or circular. The power consumption of the high-speed link between the service chip 21 and the first on-board optical module 30 is low, the first flexible portion 312 of the first on-board optical module 30 is set to be strip-shaped, the first rigid portion 311 of the first on-board optical module 30 is arranged at the outer circle, and the second on-board optical module 40 is arranged at the inner circle, so that low-power-consumption high-speed signal transmission between the service chip 21 and the two on-board optical modules is realized.
When the first on-board optical module and the second on-board optical module are arranged, referring to fig. 9, the first on-board optical module 30 and the second on-board optical module 40 are sequentially arranged in a staggered manner, wherein the first flexible portion 312 of at least one first on-board optical module 30 is located between two adjacent second on-board optical modules 40. When only the plurality of first on-board optical modules 30 are provided around the package substrate 22 shown in fig. 3, the connection density between the first flexible portion 312 and the package substrate 22 in the first on-board optical module 30 is high. When the first on-board optical module 30 and the second on-board optical module 40 are staggered around the package substrate 22 shown in fig. 9, the connection density of the first flexible portion 312 and the package substrate 22 in the first on-board optical module 30 is low, which facilitates the connection and assembly of the first flexible portion 312 and the package substrate 22, and improves the engineering realizability. According to the scheme, the first on-board optical module 30 and the second on-board optical module 40 are approximately distributed on the same plane, so that a radiator is conveniently arranged for heat generating devices such as optical devices on the on-board optical module to realize heat dissipation.
For example, referring to fig. 9, three first on-board optical modules 30 and four second on-board optical modules 40 are disposed on each side of the package substrate 22, the four second on-board optical modules 40 are disposed at intervals near the edge of the package substrate 22, and the first flexible portion 312 of the first on-board optical module 30 passes through the gap between the adjacent second on-board optical modules 40. One first on-board optical module 30 is disposed at each of four corners of the package substrate 22 and has a first flexible portion 312 connected to the corner of the package substrate 22. The number of first on-board optical modules 30 and the number of second on-board optical modules 40 are arranged on the same side of the package substrate 22 as needed.
In some embodiments, referring to fig. 10 and fig. 11 (a), in order to establish a high-speed signal interconnection between the service chip 21 and more first on-board optical modules 30, the on-board optical interconnection apparatus further includes one or more rigid interposer 50, where the rigid interposer 50 is a printed circuit board, the rigid interposer 50 has a plurality of interposer wires (not shown), two ends of the interposer wires are a first connection point 51 and a second connection point 52, the first connection point 51 is located at a first end 50a of the rigid interposer 50, and the second connection point 52 is located at a second end 50b of the rigid interposer 50. The first wiring of the package substrate 22 and the second wiring of the rigid flexible board 312 are provided corresponding to the via wiring of the rigid interposer 50, respectively. The first end 50a of the rigid interposer 50 is attached to the package substrate 22, and the first connection point 51 of the patch wiring is electrically connected to the first wiring corresponding to the patch wiring. The first flexible portion 312 is attached to the second end 50b of the rigid interposer 50, and the second connection point 52 of the patch wiring and the second wiring corresponding to the patch wiring are electrically connected. A rigid interposer 50 is disposed around the package substrate 22, and the first flexible portion 312 of the different first on-board optical module 30 is connected to the package substrate 22 through the rigid interposer 50, so that the first wiring of the package substrate 22, the via wiring of the rigid interposer 50, and the second wiring of the rigid-flex board 31 are sequentially connected to form a first link for high-speed signal interconnection between the service chip 21 and the first optical device 32. When the package substrate 22 and the first flexible portion 312 are directly connected, the perimeter of the package substrate 22 is limited, and it is difficult to arrange more first on-board optical modules 30 around the package substrate 22. Compared with the manner of directly connecting the package substrate 22 and the first flexible portion 312 as shown in fig. 3, a rigid interposer 50 is disposed between the package substrate 22 and the first on-board optical module 30 as shown in fig. 10 to implement high-speed interconnection, and this rigid interposer 50 scheme may configure more first on-board optical modules 30, so that the service chip 21 may establish low-power-consumption high-speed signal interconnection with more first on-board optical modules 30.
When the first connection point 51 of the rigid interposer 50 is provided, a plurality of the first connection points 51 are arranged at intervals at the first end 50a of the rigid interposer 50. Illustratively, the first connection points 51 may be arranged in an array to facilitate connection with the pads arranged in an array on the package substrate 22. The rigid interposer 50 is soldered to the upper surface of the package substrate 22 to electrically connect the first connection points 51 of the different relay wirings and the first wirings corresponding to the relay wirings.
When a rigid fishplate bar is provided, the inner ring of the rigid fishplate bar is used as the first end 50a and the outer ring is used as the second end 50b, the inner ring of the rigid fishplate bar is circular or square, and the outer ring is circular or square. In assembly, the inner ring region of the rigid interposer 50 is attached to the package substrate 22, and the first flexible portions 312 of the first on-board optical modules 30 are circumferentially arranged in the outer ring region of the rigid interposer 50.
When a plurality of rigid interposers 50 are provided, each rigid interposer 50 extends in an arc, the first end 50a of the rigid interposer 50 is attached to the package substrate 22, and the plurality of rigid interposers 50 are arranged in a circumferential direction so as to flexibly cover the package substrate 22 and reduce tolerance requirements of the rigid interposer 50 and the package substrate 22. Illustratively, in the embodiment shown in fig. 10, four rigid interposers 50 are disposed on the package substrate 22, and eight first flexible portions 312 are circumferentially disposed on the second end 50b of each rigid interposer 50. The number of rigid interposers 50 and the number of first compliant portions 312 on each rigid interposer 50 are provided as desired.
In some embodiments, when the first connection points 51 and the second connection points 52 are arranged, the distance between two adjacent first connection points 51 is smaller than the distance between two adjacent second connection points 52 on the surface of the rigid interposer 50. The density of the first connection points 51 between the rigid interposer 50 and the package substrate 22 is high, the density of the second connection points 52 between the first flexible portion 312 and the rigid interposer 50 is low, and the patch wiring of the rigid interposer 50 gradually fans out the high-density and high-power first wiring on the package substrate 22 into low-density and low-power second wiring, so that the service chip 21 and more first on-board optical modules 30 can establish high-speed signal interconnection. Referring to fig. 11 (a), the plurality of second connection points 52 may be disposed on the upper surface or the lower surface of the rigid interposer 50.
When the rigid interposer 50 and the first on-board optical module 30 are disposed, the second end 50b of the rigid interposer 50 is arc-shaped or circular, the plurality of first on-board optical modules 30 are circumferentially arranged, and the first flexible portions 312 of the plurality of first on-board optical modules 30 radially extend with the service chip 21 as a center. Referring to fig. 3, when a rigid interposer is not provided, a rectangular arrangement may be adopted for arranging more first on-board optical modules 30. Referring to fig. 10, after the rigid interposer 50 is disposed, the first flexible portions 312 may be connected to the second end 50b of the rigid interposer 50, which is arc-shaped or circular, so that the plurality of first flexible portions 312 are converted into a circumferential arrangement to adapt to the layout of the first on-board optical module 30 surrounding the service chip 21.
There are several implementations when assembling the first flexible portion and the rigid adapter plate. A first way of assembling the first flexible part and the rigid adapter plate is: referring to fig. 11 (a), the second connection points 52 are distributed on the same side of the rigid interposer 50, and each first on-board optical module 30 has a first flexible portion 312, and the first flexible portions 312 are connected to the second connection points 52 in a one-to-one correspondence. This arrangement facilitates assembly between the first flexible portion 312 and the rigid interposer 50, enabling electrical connection of different patch wirings and corresponding second wirings.
The second implementation manner of assembling the first flexible part and the rigid adapter plate is as follows: referring to fig. 11 (b), the second connection points 52 arranged in pairs are respectively disposed on two opposite sides of the rigid interposer 50, each first on-board optical module 30 has first flexible portions 312 arranged in pairs, and the first flexible portions 312 arranged in pairs are connected to the second connection points 52 arranged in pairs in a one-to-one correspondence. In the same space, by configuring more first flexible portions 312, more high-speed links are established between the service chip 21 and the same first on-board optical module 30.
Various implementations are possible when connecting the first flexible part and the rigid adapter plate: the first flexible portion 312 and the rigid adapter plate 50 are welded together; alternatively, the first flexible portion and the rigid adapter plate are connected by a flexible plate connector (not shown). The flexible board connector includes a plug and a socket that can be plugged into each other, one of the elements of the plug and the socket is provided on the first flexible portion 312, and the other element is provided on the rigid interposer 50, and by plugging the plug into the socket, electrical connection between the first wiring of the first flexible portion 312 and the patch wiring of the rigid interposer 50 is achieved.
The embodiment of the application provides communication equipment comprising the on-board optical interconnection device. The communication device provided by the embodiment of the application adopts the board optical interconnection device, so that all the beneficial effects brought by the technical scheme of the embodiment are also achieved. The communication device may be a network product, such as a router, a switch, a transport network device, an optical line terminal in an access network, or a wireless backhaul device, such as a baseband processing unit, etc.
Finally, it should be noted that: the above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (19)

1. An on-board optical interconnect device, comprising: the device comprises a carrier plate, a chip packaging assembly and a first on-board optical module;
the chip packaging assembly comprises a service chip and a packaging substrate, wherein the service chip is installed and electrically connected to the packaging substrate, and the packaging substrate is installed and electrically connected to the carrier plate; the packaging substrate is provided with a first wiring electrically connected with the service chip;
the first on-board optical module includes a rigid-flex board and a first optical device for coupling with an optical fiber, the rigid-flex board includes a first rigid portion and a first flexible portion that are connected, the rigid-flex board has a second wiring that extends over the first rigid portion and the first flexible portion, the first optical device is mounted on the first rigid portion and electrically connected to the second wiring, the first flexible portion is connected to the package substrate and the second wiring and the first wiring are electrically connected, and the first rigid portion is electrically connected to the carrier board;
the first wiring and the second wiring are connected and form a first link between the service chip and the first optical device;
the package substrate is provided with a third wiring electrically connected with the service chip, the carrier plate is provided with a fourth wiring, and the first rigid part is provided with a fifth wiring electrically connected with the first optical device; the third wire, the fourth wire and the fifth wire are connected in sequence to form a second link between the service chip and the first optical device.
2. The on-board optical interconnect device according to claim 1, wherein the first on-board optical modules are plural in number, and the plural first on-board optical modules are arranged side by side on at least one side of the package substrate;
the first link and the second link corresponding to the first optical device are arranged between the service chip and the first optical device of each first on-board optical module; the service chip and each first optical device are electrically connected through the first link and the second link corresponding to the first optical device.
3. The on-board optical interconnect device of claim 2, wherein a plurality of the first on-board optical modules are disposed around the package substrate, the plurality of the first on-board optical modules being disposed adjacent to an edge of the package substrate.
4. The on-board optical interconnect device according to claim 2, wherein the first on-board optical modules disposed on one side of the package substrate are divided into inner-ring on-board optical modules and outer-ring on-board optical modules, the inner rings are disposed on the inner ring centered on the traffic chip at the first rigid portion of the board optical modules, and the outer rings are disposed on the outer ring centered on the traffic chip at the first rigid portion of the board optical modules.
5. The on-board optical interconnect device according to claim 4, wherein said inner rings are sequentially staggered between board optical modules and said outer rings are sequentially staggered between board optical modules, wherein at least one of said outer rings is located between two adjacent inner rings between said first rigid portions of board optical modules at said first flexible portion of board optical modules;
or, at least one outer ring is arranged above the optical board module in a manner of straddling one inner ring on the first flexible part of the optical board module.
6. The on-board optical interconnect device of claim 1, further comprising: a second on-board optical module arranged adjacent to the edge of the package substrate, the second on-board optical module being mounted and electrically connected to the carrier, wherein at least one of the second on-board optical modules is located between two adjacent first on-board optical modules;
a third link corresponding to the second on-board optical module is arranged between the service chip and each second on-board optical module, the third link sequentially passes through the packaging substrate and the carrier plate, and the service chip and each second on-board optical module are electrically connected through the third link corresponding to the second on-board optical module.
7. The on-board optical interconnect device according to claim 6, wherein the first on-board optical module and the second on-board optical module are each plural in number, a plurality of the second on-board optical modules are arranged on an inner ring centered on the service chip, and the first rigid portions of the plurality of the first on-board optical modules are arranged on an outer ring centered on the service chip.
8. The on-board optical interconnect device according to claim 7, wherein the first on-board optical module and the second on-board optical module are sequentially arranged in a staggered manner, wherein the first flexible portion of at least one of the first on-board optical modules is located between two adjacent second on-board optical modules.
9. The on-board optical interconnect device of claim 1, further comprising one or more rigid interposer having a plurality of patch wires, the patch wires having first and second connection points at opposite ends thereof, the first connection point being located at a first end of the rigid interposer and the second connection point being located at a second end of the rigid interposer; the first wiring and the second wiring are respectively arranged corresponding to the switching wiring;
a first end of the rigid interposer is mounted on the package substrate, and a first connection point of the transfer wiring is electrically connected to the first wiring corresponding to the transfer wiring;
the first flexible portion is mounted on a second end of the rigid adapter plate, and a second connection point of the adapting wiring is electrically connected with the second wiring corresponding to the adapting wiring.
10. An on-board optical interconnect device according to claim 9 and wherein the spacing between adjacent ones of said first connection points is less than the spacing between adjacent ones of said second connection points on the surface of said rigid interposer.
11. The on-board optical interconnect device according to claim 10, wherein the second end of the rigid interposer is arc-shaped or circular, the first on-board optical modules are arranged along a circumferential direction, and the first flexible portions of the first on-board optical modules extend along a radial direction with the service chip as a center.
12. The on-board optical interconnect device according to claim 10 or 11, wherein the second connection points are distributed on the same side of the rigid interposer, and each of the first on-board optical modules has one of the first flexible portions, and the first flexible portions are connected to the second connection points in a one-to-one correspondence;
or the second connection points arranged in pairs are respectively arranged on two opposite sides of the rigid adapter plate, each first on-board optical module is provided with the first flexible parts arranged in pairs, and the first flexible parts arranged in pairs are connected to the second connection points arranged in pairs in a one-to-one correspondence manner.
13. The on-board optical interconnect device according to any one of claims 1 to 12, wherein the side of the first rigid portion facing the carrier board and the carrier board are connected by a low speed connector;
or, the rigid flexible board further comprises a second flexible part electrically connected with the first rigid board, and the second flexible part is connected with the carrier board through a low-speed connector.
14. The on-board optical interconnect device of any of claims 1-13, wherein the first flexible portion is soldered to the package substrate when the first flexible portion is mounted directly to the package substrate; or, the first flexible part and the packaging substrate are connected through a flexible board connector;
when the first flexible part is installed on the packaging substrate through a rigid adapter plate, the first flexible part and the rigid adapter plate are welded; or the first flexible part and the rigid adapter plate are connected through a flexible plate connector.
15. The on-board optical interconnect device according to any one of claims 1 to 14, wherein the first on-board optical module further comprises a relay chip electrically connected to the first optical device, the relay chip being mounted on an end of the first rigid portion close to the first flexible portion, and the first optical device being mounted on an end of the first rigid portion away from the first flexible portion.
16. The on-board optical interconnect device of claim 15, wherein a side of the first optical device facing away from the first flexible portion has a first optical interface for coupling with the optical fiber.
17. The on-board optical interconnect device according to any one of claims 1 to 16, wherein the rigid-flex board is formed by co-pressing the first rigid portion and the first flexible portion;
or, the rigid-flexible plate is formed by connecting the first flexible part to the first rigid part.
18. The on-board optical interconnect device of any one of claims 1 to 17, wherein the package substrate and the carrier board are connected by solder balls;
or, the package substrate and the carrier are connected through a low-speed connector.
19. A communication apparatus comprising the on-board optical interconnect device of any of claims 1-18.
CN202110935458.6A 2021-08-13 2021-08-13 On-board optical interconnection device and communication equipment Pending CN115706104A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202110935458.6A CN115706104A (en) 2021-08-13 2021-08-13 On-board optical interconnection device and communication equipment
PCT/CN2022/090963 WO2023015972A1 (en) 2021-08-13 2022-05-05 On-board optical internetworking apparatus and communication device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110935458.6A CN115706104A (en) 2021-08-13 2021-08-13 On-board optical interconnection device and communication equipment

Publications (1)

Publication Number Publication Date
CN115706104A true CN115706104A (en) 2023-02-17

Family

ID=85180298

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110935458.6A Pending CN115706104A (en) 2021-08-13 2021-08-13 On-board optical interconnection device and communication equipment

Country Status (2)

Country Link
CN (1) CN115706104A (en)
WO (1) WO2023015972A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3568156B2 (en) * 2000-03-01 2004-09-22 日本電信電話株式会社 Semiconductor device
KR20090078124A (en) * 2008-01-14 2009-07-17 한국광기술원 System package using flexible optical and electrical wires and its signal management method
CN106646777B (en) * 2016-12-14 2019-05-28 青岛海信宽带多媒体技术有限公司 A kind of optical module and its design method
JP7161113B2 (en) * 2017-12-14 2022-10-26 山一電機株式会社 High-speed signal connector, receptacle assembly including same, transceiver module assembly
CN209879081U (en) * 2019-07-05 2019-12-31 上海先方半导体有限公司 Optical interconnection module and system comprising same

Also Published As

Publication number Publication date
WO2023015972A1 (en) 2023-02-16

Similar Documents

Publication Publication Date Title
EP2626897B1 (en) Transmission line transition having vertical structure and single chip package using land grid array joining
US6599031B2 (en) Optical/electrical interconnects and package for high speed signaling
US9320170B2 (en) Communication module-cooling structure and communication device
EP2350845B1 (en) Variably configurable computer buses
CN103576253A (en) Side-edge mountable parallel optical communications module, optical communications system with same, and method
CN111929780B (en) ASIC package with photonic and vertical power delivery
WO2004008577A2 (en) Electromagnetic coupling connector for three-dimensional electronic circuits
CN114035287B (en) Optical module
US8041160B2 (en) Optical communications device having a mounting core and method
CN114035286B (en) Optical module
CN114035288B (en) Optical module
KR100883128B1 (en) Optical Hybrid Module
CN212086203U (en) Optical module
CN218767433U (en) Optical module
CN218125028U (en) Circuit board and optical module
CN218125029U (en) Circuit board and optical module
CN115706104A (en) On-board optical interconnection device and communication equipment
CN216248443U (en) Optical module
WO2021212868A1 (en) Optical module
CN115499391A (en) Switch, cabinet and data center
CN114371535B (en) Optical module
US9678289B1 (en) Thermal management of optical coupling systems
CN115220160A (en) Optical module
CN111384609A (en) Interconnection device for chip and backplane connector
CN217639670U (en) Optical network terminal

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication