CN115702463A

CN115702463A - Circuit board and method for manufacturing the same

Info

Publication number: CN115702463A
Application number: CN202180043474.2A
Authority: CN
Inventors: 黄智勇
Original assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2021-05-24
Filing date: 2021-05-24
Publication date: 2023-02-14
Also published as: WO2022246609A1

Abstract

The application provides a circuit board, including circuit base plate, magnetizer, a plurality of first lead-through and a plurality of second lead-through, the circuit base plate includes first circuit layer and second circuit layer, and first circuit layer and second circuit layer set up respectively in the upper and lower both sides of magnetizer, and a plurality of first lead-through and a plurality of second lead-through set up respectively in the left and right sides of magnetizer. The first conductive lines, the first lines, the second conductive lines and the second lines which are adjacent to each magnetizer are sequentially and spirally connected in a progressive mode to form an induction coil. At least two magnetizers and at least two induction coils wound on the outer sides of the magnetizers form a transformer. The circuit board that this application provided sets up the transformer in the inside of circuit board, make full use of the space of circuit board itself, reduce the damage risk that the transformer exposes and bring simultaneously. In addition, the application also provides a manufacturing method of the circuit board.

Description

Circuit board and method for manufacturing the same

Technical Field

The present application relates to a circuit board and a method of manufacturing the same.

Background

Generally, a transformer mainly includes an induction coil and an iron core, and like other electronic components (e.g., a chip, a capacitor, a resistor, etc.), the transformer needs to be disposed outside a circuit board, which not only occupies space, but also is easily damaged due to being exposed outside the circuit board.

Disclosure of Invention

In order to overcome the defects in the prior art, the application provides a circuit board.

In addition, a manufacturing method of the circuit board is also needed to be provided.

A method of manufacturing a circuit board, comprising the steps of: providing a copper-clad substrate, wherein the copper-clad substrate comprises a first copper foil layer and a second copper foil layer, and the first copper foil layer and the second copper foil layer are arranged at a distance. The copper-clad substrate is provided with at least two containing holes, a plurality of first through holes and a plurality of second through holes, the first through holes and the second through holes are respectively arranged on two opposite sides of each containing hole, and the containing holes, the first through holes and the second through holes penetrate through the first copper foil layer and the second copper foil layer along the thickness direction of the copper-clad substrate. And a magnetizer is arranged in each accommodating hole. And electroplating on the first copper foil layer to form a first electroplated layer, electroplating on the second copper foil layer to form a second electroplated layer, wherein part of the first electroplated layer and/or part of the second electroplated layer are/is filled into the first through hole to form a first conducting wire, part of the second electroplated layer and/or part of the second electroplated layer are filled into the second through hole to form a second conducting wire, and the plurality of first conducting wires and the plurality of second conducting wires are respectively arranged on the left side and the right side of each magnetizer. Etching the first electroplated layer and the first copper foil layer to form a plurality of first circuits, etching the second electroplated layer and the second copper foil layer to form a plurality of second circuits, wherein the plurality of first circuits and the plurality of second circuits are respectively arranged at the upper side and the lower side of each magnetizer, and the plurality of first conductive lines, the plurality of first circuits, the plurality of second conductive lines and the plurality of second circuits adjacent to each magnetizer are sequentially and spirally connected in an advancing manner to form an induction coil. And the at least two magnetizers and the at least two induction coils wound on the outer sides of the magnetizers form a transformer to obtain the circuit board.

Further, the method also comprises the following steps: and arranging a first through hole unit and a second through hole unit on the copper-clad substrate, wherein the first through hole unit and the second through hole unit are respectively arranged on two sides of each accommodating hole. The first through hole unit comprises a first body space and a plurality of first through holes formed by extending from the first body space to the accommodating hole, and the second through hole unit comprises a second body space and a plurality of second through holes formed by extending from the second body space to the accommodating hole.

Further, the method also comprises the following steps: part of the first plating layer and/or part of the second plating layer are attached to the inner periphery of the first through-hole unit to form a first via, and part of the first via fills in the plurality of first through-holes to form the first via. A part of the first electroplating layer and/or a part of the second electroplating layer is attached to the inner periphery of the second through hole unit to form a second conduction part, a part of the second conduction part is filled in the second through hole to form the second conduction wire, and the first conduction part and the second conduction part are removed.

Further, the first conduction part and the second conduction part are removed in a machine tool milling mode.

Further, the step of disposing a magnetizer in each of the accommodating holes includes: a first peelable layer is arranged on the first copper foil layer, a through hole is arranged on the first peelable layer, the through hole corresponds to the containing hole, and a second peelable layer is arranged on the second copper foil layer. And providing a magnetizer, wherein the magnetizer enters the accommodating hole through the through hole, and a gap exists between the magnetizer and the inner periphery of the accommodating hole. Pressing the first peelable layer and the second peelable layer so that a dielectric layer is filled in the gap, and removing the first peelable layer and the second peelable layer.

Furthermore, the material of the dielectric layer is at least one of liquid crystal polymer, polytetrafluoroethylene and meltable polytetrafluoroethylene.

Further, the magnetizer is any one of a magnet or a metal bar.

Further, the number of turns of the plurality of induction coils is different.

The utility model provides a circuit board, includes circuit base plate, magnetizer, a plurality of first lead-through line and a plurality of second lead-through line, the circuit base plate includes first circuit layer and second circuit layer, first circuit layer reaches second circuit layer set up respectively in the upper and lower both sides of magnetizer, it is a plurality of first lead-through line and a plurality of the second lead-through line set up respectively in the left and right sides of magnetizer. The first conducting wires, the first lines, the second conducting wires and the second lines which are adjacent to each magnetizer are sequentially and spirally and progressively connected to form an induction coil. And the at least two magnetizers and the at least two induction coils wound on the outer sides of the magnetizers form a transformer.

Further, the magnetizer is a magnet.

The circuit board that this application provided is through setting up the transformer in the inside of circuit board, and the space of make full use of circuit board itself reduces the transformer simultaneously and exposes the damage risk that brings.

Drawings

Fig. 1 is a schematic cross-sectional view of a copper-clad substrate according to an embodiment of the present disclosure.

Fig. 2 is a schematic diagram of the copper-clad substrate shown in fig. 1 after the first through hole unit, the accommodating hole and the second through hole unit are arranged.

FIG. 3 is a schematic cross-sectional view of the copper-clad substrate shown in FIG. 2 taken along line III-III.

Fig. 4 is a schematic diagram of the copper-clad substrate shown in fig. 2 after the first/second peelable layers are provided.

Fig. 5 is a schematic view of the copper-clad substrate shown in fig. 4 after a magnetizer is disposed.

Fig. 6 is a schematic cross-sectional view of the copper-clad substrate shown in fig. 5 taken along line VI-VI.

Fig. 7 is a schematic diagram of the copper-clad substrate shown in fig. 5 after the dielectric layer is filled into the gap.

Fig. 8 is a schematic view of the copper-clad substrate shown in fig. 7 after the first/second peelable layers are removed.

Fig. 9 is a schematic cross-sectional view of the copper-clad substrate shown in fig. 8 taken along line VIII-VIII.

Fig. 10 is a view showing the copper-clad substrate shown in fig. 8 after the first and second plating layers are provided.

FIG. 11 is a schematic cross-sectional view of the copper-clad substrate shown in FIG. 10 taken along line XII-XII.

Fig. 12 is a schematic view of a wiring substrate obtained by etching the first/second plating layers of the copper-clad substrate shown in fig. 10.

Fig. 13 is a plan view of the wiring substrate shown in fig. 12.

Fig. 14 is a schematic view of the circuit substrate shown in fig. 12 with the first/second conductive portions removed.

FIG. 15 is a schematic cross-sectional view of the wiring substrate shown in FIG. 14 taken along line XV-XV.

Fig. 16 is a schematic diagram of a circuit board according to an embodiment of the present application.

Fig. 17 is a schematic cross-sectional view of the circuit board shown in fig. 16 taken along line XVII-XVII.

Fig. 18 is a top view of the circuit board shown in fig. 16.

Description of the main elements

Circuit board 100

Copper-clad substrate 10

First copper foil layer 11

First peelable layer 111

Second copper foil layer 12

Second peelable layer 121

Dielectric layer 13

First via unit 21

First body space 211

First via 212

Second through-hole unit 22

Second body space 221

Second via 222

Gap 223

Accommodation hole 23

Magnetizer 31

First plating layer 41

Second plating layer 42

First conduction part 43

First conducting line 431

Second conduction part 44

Second conductive line 441

First circuit layer 50

First line 51

Second wiring 52

First induction coil 61

Second induction coil 62

Circuit board 70

Primary side unit 71

Second circuit layer 80

Secondary side unit 81

Transformer 200

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

Referring to fig. 1 to 18, an embodiment of the present disclosure provides a method for manufacturing a circuit board 100, the method including:

s1, referring to fig. 1, a copper clad substrate 10 is provided, where the copper clad substrate 10 includes a first copper foil layer 11, a second copper foil layer 12 and a dielectric layer 13, and the dielectric layer 13 is disposed between the first copper foil layer 11 and the second copper foil layer 12. The medium layer 13 is in a flowable state.

In this embodiment, the material of the dielectric layer 13 is at least one of Liquid Crystal Polymer (LCP), polytetrafluoroethylene (PTFE) and fusible Polytetrafluoroethylene (PFA), and the dielectric layer 13 has fluidity under pressure or at high temperature.

2, referring to fig. 2 to 3, a first through hole unit 21, a containing hole 23 and a second through hole unit 22 are arranged on the copper-clad substrate 10, the first through hole unit 21, the containing hole 23 and the second through hole unit 22 are arranged mutually, and the containing hole 23 is arranged between the first through hole unit 21 and the second through hole unit 22. The first through hole unit 21, the accommodating hole 23, and the second through hole unit 22 all penetrate through the first copper foil layer 11, the dielectric layer 13, and the second copper foil layer 12. The first through hole unit 21 includes a first body space 211 and a plurality of first through holes 212, and a part of the first body space 211 extends toward the accommodating hole 23 to form the plurality of first through holes 212. The second through hole unit 22 includes a second body space 221 and a plurality of second through holes 222, and a portion of the second body space 221 extends toward the first through hole 212 to form the plurality of second through holes 222.

In this embodiment, in step S2, a plurality of the first through holes 212 are arranged side by side at an equal distance, and a plurality of the second through holes 222 are arranged side by side at an equal distance.

In the present embodiment, the first through hole unit 21, the second through hole unit 22, and the accommodation hole 23 are formed by laser cutting.

And S3, referring to the figures 4 to 9, arranging a magnetizer 31 in the accommodating hole 23.

In this embodiment, step S3 includes:

s30, referring to fig. 4, a first peelable layer 111 is disposed on the first copper foil layer 11, the first peelable layer 111 covers one side of the first through hole unit 21 and the second through hole unit 22, the first peelable layer 111 is provided with a through hole 112, and the through hole 112 corresponds to the accommodating hole 23. A second peelable layer 121 is disposed on the second copper foil layer 12. The second peelable layer 121 covers the other sides of the accommodating hole 23, the first through-hole unit 21, and the second through-hole unit 22.

S31, please refer to fig. 5 and 6, a magnetizer 31 is provided, the magnetizer 31 enters the containing hole 23 through the through hole 112, and a gap 223 exists between the magnetizer 31 and the inner circumference of the containing hole 23. The magnetizer 31 is a magnet. In other embodiments of the present application, the magnetizer 31 may also be a metal rod.

S32, referring to fig. 7, the first peelable layer 111 and the second peelable layer 121 are pressed, and the dielectric layer 13 is filled in the gap 223 because the dielectric layer 13 is in a flowable state.

S33, please refer to fig. 8 and 9, the first peelable layer 111 and the second peelable layer 121 are removed.

S4, referring to fig. 10 to 11, a first electroplated layer 41 is formed on the first copper foil layer 11, and a second electroplated layer 42 is formed on the second copper foil layer 12. A part of the first plating layer 41 and/or the second plating layer 42 is attached to the inner periphery of the first through-hole unit 21 to form a first via 43, and a part of the first via 43 is filled into the first through-hole 212 to form a first via 431. A part of the first plating layer 41 and/or the second plating layer 42 is attached to the inner circumference of the accommodation hole 23 to form a second conduction part 44, and a part of the second conduction part 44 is filled in the second through hole 222 to form a second conduction line 441.

S5, referring to fig. 12 and 13, etching the first copper foil layer 11 and the first plating layer 41 to form a plurality of first lines 51, etching the second copper foil layer 12 and the second plating layer 42 to form a plurality of second lines 52, and sequentially spirally connecting the plurality of first conductive lines 431, the plurality of first lines 51, the plurality of second conductive lines 441 and the plurality of second lines 52 surrounding the magnetizer 31 in an incremental manner to form a first induction coil 61, wherein the first induction coil 61 is wound around the outer side of the magnetizer 31.

S6, please refer to fig. 14 and 15, the first conduction part 43 and the second conduction part 44 are removed to obtain a primary side unit 71.

In the present embodiment, the first conduction part 43 and the second conduction part 44 are formed by milling with a machine tool.

S7, referring to fig. 16 to 18, a secondary unit 81 is obtained in the copper-clad substrate 10 according to a method similar to the steps S2 to S6, the secondary unit 81 has a second induction coil 62, and the number of turns of the second induction coil 62 is different from that of the first induction coil 61, so as to obtain the circuit board 100. The two magnetizers 31, the first induction coil 61 and the second induction coil 62 wound around the outer side of each magnetizer 31 form a transformer 200.

Compared with the prior art, the manufacturing method of the circuit board 100 provided by the present application has the following advantages:

the transformer 200 is disposed inside the circuit board 100, so that the risk of damage caused by the transformer 200 being exposed is reduced, and the space utilization rate can be improved.

Second, the first conductive line 431 and the second conductive line 441 are formed by electroplating, and the first wiring 51 and the second wiring 52 are formed by etching, so that the first induction coil 61 or the second induction coil 62 can be efficiently manufactured, and the cost can be reduced.

Referring to fig. 16 to 18, an embodiment of the present invention further provides a circuit board 100, where the circuit board 100 includes a circuit substrate 70, a magnetizer 31, a plurality of first conductive lines 431 and a plurality of second conductive lines 441, the circuit substrate 70 includes a first circuit layer 50 and a second circuit layer 80, the first circuit layer 50 and the second circuit layer 80 are respectively disposed on upper and lower sides of the magnetizer 31, the first circuit layer 50 includes a plurality of first circuits 51, and the second circuit layer 80 includes a plurality of second circuits 52. The first conductive lines 431 and the second conductive lines 441 are respectively disposed on the left and right sides of the magnetizer 31. The first conductive lines 431, the first lines 51, the second conductive lines 441 and the second lines 52 adjacent to each of the magnetic conductors 31 are sequentially and spirally connected in an incremental manner to form an induction coil (not shown). The two magnetizers 31 and the two induction coils wound on the outer sides of the magnetizers 31 form a transformer 200.

In other embodiments of the present application, the number of the magnetizers 31 may be two or more, and the number of the induction coils may be two or more.

The above description is only an optimized specific embodiment of the present application, but in practical application, the present application is not limited to this embodiment. Other modifications and variations to the technical concept of the present application should fall within the scope of the present application for those skilled in the art.

Claims

A method of manufacturing a circuit board, comprising the steps of:

providing a copper-clad substrate, wherein the copper-clad substrate comprises a dielectric layer, a first copper foil layer and a second copper foil layer which are respectively arranged on two opposite surfaces of the dielectric layer;

arranging accommodating holes, first through holes and second through holes on the copper-clad substrate, wherein a plurality of first through holes and a plurality of second through holes are respectively arranged on two opposite sides of each accommodating hole, and the accommodating holes, the first through holes and the second through holes penetrate through the first copper foil layer, the dielectric layer and the second copper foil layer along the thickness direction of the copper-clad substrate;

a magnetizer is arranged in each accommodating hole;

electroplating on the first copper foil layer to form a first electroplating layer, and electroplating on the second copper foil layer to form a second electroplating layer, wherein part of the first electroplating layer and/or part of the second electroplating layer are/is filled into the first through hole to form a first conducting wire, and part of the second electroplating layer and/or part of the second electroplating layer are/is filled into the second through hole to form a second conducting wire;

etching the first electroplated layer and the first copper foil layer to form a plurality of first lines, etching the second electroplated layer and the second copper foil layer to form a plurality of second lines, and sequentially connecting a plurality of first conductive lines, a plurality of first lines, a plurality of second conductive lines and a plurality of second lines which are arranged around each magnetizer to form an induction coil, thereby obtaining the circuit board, wherein at least two magnetizers and at least two induction coils which are wound outside the magnetizers form a transformer.
The manufacturing method according to claim 1, wherein a first via unit and a second via unit are provided on the copper-clad substrate, the first via unit and the second via unit being provided on both sides of each of the accommodating holes, respectively; the first through hole unit comprises a first body space and a plurality of first through holes formed by extending from the first body space to the accommodating hole, and the second through hole unit comprises a second body space and a plurality of second through holes formed by extending from the second body space to the accommodating hole.
The manufacturing method according to claim 2,

a part of the first plating layer and/or a part of the second plating layer is attached to the inner periphery of the first through hole unit to form a first via, and a part of the first via fills a plurality of the first through holes to form the first via; part of the first electroplating layer and/or part of the second electroplating layer is attached to the inner periphery of the second through hole unit to form a second conduction part, and part of the second conduction part is filled in the second through hole to form the second conduction wire;

after forming the first plating layer and the second plating layer, the method further comprises the steps of:

and removing the first conduction part and the second conduction part.
The method of manufacturing of claim 3, wherein the first and second vias are removed by machine milling.
The method of claim 1, wherein the step of disposing a magnetic conductor in each of the receiving holes comprises:

arranging a first strippable layer on the first copper foil layer, wherein the first strippable layer is provided with a through hole corresponding to the accommodating hole, and arranging a second strippable layer on the second copper foil layer;

enabling the magnetizer to enter the accommodating hole through the through hole, wherein a gap exists between the magnetizer and the inner periphery of the accommodating hole;

extruding the first peelable layer and the second peelable layer to fill the dielectric layer into the gap; and the number of the first and second groups,

removing the first peelable layer and the second peelable layer.
The method of claim 5, wherein the dielectric layer is made of at least one of a liquid crystal polymer, polytetrafluoroethylene, and meltable polytetrafluoroethylene.
The method of manufacturing of claim 5, wherein the magnetizer is one of a magnet or a metal rod.
The method of manufacturing according to claim 1, wherein a number of turns of the plurality of induction coils is different.
A circuit board is characterized by comprising a circuit substrate, a magnetizer, a plurality of first conduction lines and a plurality of second conduction lines, wherein the circuit substrate comprises a dielectric layer, and a first circuit layer and a second circuit layer which are respectively arranged on two opposite surfaces of the dielectric layer;

the first conductive lines, the first lines, the second conductive lines and the second lines which are arranged around each magnetizer are sequentially connected to form an induction coil;

and the at least two magnetizers and the at least two induction coils wound on the outer sides of the magnetizers form a transformer.
The circuit board of claim 9, wherein the magnetizer is a magnet.