CN115697860A - Component housing - Google Patents

Component housing Download PDF

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Publication number
CN115697860A
CN115697860A CN202180040231.3A CN202180040231A CN115697860A CN 115697860 A CN115697860 A CN 115697860A CN 202180040231 A CN202180040231 A CN 202180040231A CN 115697860 A CN115697860 A CN 115697860A
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CN
China
Prior art keywords
inner member
component
component housing
inclined surfaces
opposite
Prior art date
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Pending
Application number
CN202180040231.3A
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Chinese (zh)
Inventor
凑龙一郎
中西伦宏
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Publication date
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Publication of CN115697860A publication Critical patent/CN115697860A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

A component case that accommodates a plurality of components each having a first surface facing a first direction and a second surface facing a direction opposite to the first direction, the component case comprising a first member and a second member, the first member extending substantially orthogonally to the first direction and having: a plurality of first supporting surfaces, each supporting the first surface; and two inclined surfaces which are inclined with respect to the first direction and face in opposite directions to each other in one orthogonal direction orthogonal to the first direction, respectively, and which approach or separate from each other as going toward the first direction, the second member being adjacent to the first member in the opposite direction to the first direction and spreading substantially orthogonal to the first direction, and having: a plurality of second supporting surfaces respectively supporting the second surfaces; and two opposed faces which extend along and contact the two inclined faces, respectively.

Description

Component housing
Technical Field
The invention relates to a component housing.
Background
Conventionally, as a component case for housing a plurality of components such as semiconductor chips, a semiconductor chip tray having a structure for suppressing rattling of the components in the case and damage to the components due to the rattling has been known (patent document 1). In patent document 1, a component case is configured by combining a plurality of members.
Documents of the prior art
Patent literature
Patent document 1: japanese patent laid-open No. 2009-278019
Disclosure of Invention
Problems to be solved by the invention
As in patent document 1, when a component case is configured by combining a plurality of members, for example, with the miniaturization of components, there is a case where the backlash between the plurality of members needs to be reduced.
Accordingly, one of the problems of the present invention is to obtain a component case that can reduce the rattling between a plurality of members constituting the component case.
Means for solving the problems
The component case according to the present invention is a component case that accommodates a plurality of components each having a first surface facing a first direction and a second surface facing a direction opposite to the first direction, for example, and includes a first member and a second member, the first member extending substantially orthogonally to the first direction and including: a plurality of first supporting surfaces respectively supporting the first surfaces; and two inclined surfaces which are inclined with respect to the first direction and face in opposite directions to each other in one orthogonal direction orthogonal to the first direction, respectively, and which approach or separate from each other as going toward the first direction, the second member being adjacent to the first member in the opposite direction to the first direction and expanding substantially orthogonal to the first direction, and having: a plurality of second supporting surfaces which support the second surfaces, respectively; and two opposed faces which extend along the two inclined faces and are in contact, respectively.
The component case includes, for example, a third member that presses the second member in the first direction relative to the first member so that the inclined surfaces facing each other abut against the facing surfaces.
The component case includes, for example, a plurality of members each having an engagement portion that suppresses separation in the first direction as the third member.
In addition, in the component housing, for example, the second member has: a base provided with an opening and having the two opposing surfaces; and a plurality of protruding portions that protrude from edges of the opening in a direction substantially orthogonal to the first direction and that have the second support surface.
In the component case, for example, a thickness of the protruding portion in the first direction is equal to or less than a thickness of the base in the first direction.
In the component case, for example, the protruding portion has a plurality of portions having different thicknesses in the first direction.
In addition, in the component case, for example, the component has a shape elongated in a second direction orthogonal to the first direction.
In the component case, for example, a width of the component in a third direction orthogonal to the first direction and the second direction is 2[ mm ] or less.
In the component case, for example, the first member has, as the two inclined surfaces, two first inclined surfaces that are inclined with respect to the first direction and inclined with respect to a third direction orthogonal to the first direction and the second direction, respectively, and the second member has two first facing surfaces that extend along and contact the two first inclined surfaces, respectively.
In addition, in the component case, for example, the first member has, as the two inclined surfaces, two second inclined surfaces inclined with respect to the first direction and the second direction, respectively, and the second member has two second opposite surfaces extending along and contacting the two second inclined surfaces, respectively.
The component case includes, for example, a plurality of pairs of the two inclined surfaces and the two facing surfaces corresponding to the two inclined surfaces.
In addition, in the component case, for example, a value of the elastic modulus of the first member and a value of the elastic modulus of the second member are different from each other.
In addition, in the component case, for example, the elastic modulus of the second member is lower than that of the first member.
Effects of the invention
According to the present invention, for example, a component case in which the rattling between a plurality of members constituting the component case can be reduced can be obtained.
Drawings
Fig. 1 is an exemplary and schematic side view of a component housing of a first embodiment.
Fig. 2 is an exemplary and schematic top view of the first member of the first embodiment.
Fig. 3 is an exemplary and schematic top view of the first member and the second member of the first embodiment.
Fig. 4 is an exemplary and schematic cross-sectional view of the component housing at the IV-IV location of fig. 3.
Fig. 5 is an exemplary and schematic top view of the components housed in the slot of the first member of the first embodiment.
Fig. 6 is an exemplary and schematic exploded side view of the first member, components, and second member of the first embodiment.
Fig. 7 is an exemplary and schematic top view of the first member, components, and second member of the first embodiment.
Fig. 8 is a sectional view of the component case of the reference example at a position equivalent to that of fig. 4.
Fig. 9 is an exemplary and schematic cross-sectional view of the component housing at location IX-IX of fig. 3.
Fig. 10 is an exemplary and schematic cross-sectional view of the component case of the first modification at a position equivalent to that of fig. 9.
Fig. 11 is an exemplary and schematic cross-sectional view of a component case of a second modification at a position equivalent to that of fig. 4.
Fig. 12 is an exemplary and schematic cross-sectional view of a component case of a third modification at a position equivalent to that of fig. 4.
Detailed Description
Hereinafter, exemplary embodiments and modifications of the present invention are disclosed. The configurations of the embodiments and the modifications described below, and the operations and results (effects) of the configurations are examples. The present invention can be realized by other configurations than those disclosed in the following embodiments and modifications. Further, according to the present invention, at least one of various effects (including derivative effects) obtained by the structure can be obtained.
The embodiments and modifications described below have the same configuration. Therefore, according to the configurations of the respective embodiments and the modified examples, the same operation and effect can be obtained by the same configuration. In the following, the same reference numerals are given to the same structures, and redundant description may be omitted.
In the present specification, ordinal numbers are given as convenience for distinguishing members, portions and the like, and do not indicate the order of priority or sequence.
In each figure, the X direction is indicated by an arrow X, the Y direction is indicated by an arrow Y, and the Z direction is indicated by an arrow Z. The X direction, the Y direction, and the Z direction intersect each other and are orthogonal to each other. The Z direction can also be referred to as a thickness direction.
[ first embodiment ]
Fig. 1 is a side view of the component case 10 of the present embodiment as viewed in the X direction. The component case 10 includes a first inner member 11, a second inner member 12, a first outer member 13, and a second outer member 14.
The first inner member 11 and the second inner member 12 extend orthogonally to the Z direction, and have a flat shape that is thin in the Z direction. The second inner member 12 is disposed adjacent to the first inner member 11 in the direction opposite to the Z direction. The first inner member 11 overlaps the second inner member 12 in the Z direction.
The first outer member 13 and the second outer member 14 sandwich the first inner member 11 and the second inner member 12 in the Z direction. The first outer member 13 has an end wall 13a, two side walls 13b and two inward flanges 13c. The end wall 13a is disposed adjacent to the first inner member 11 in the direction opposite to the Z direction, extends so as to intersect the Z direction, and has a flat shape that is thin in the Z direction. The two side walls 13b project in the Z direction from both ends of the end wall 13a in the Y direction. The inward flanges 13c protrude from the Z-direction ends of the side walls 13b in the Y direction or the opposite direction to the Y direction so as to approach each other. The second outer member 14 is disposed adjacent to the second inner member 12 in the Z direction, extends so as to intersect the Z direction, and has a flat shape that is thin in the Z direction. The outward flange 14a located at both ends of the second outer member 14 in the Y direction is disposed adjacent to the inward flange 13c of the first outer member 13 in the opposite direction of the Z direction. With this structure, the first outer member 13 holds the first inner member 11, the second inner member 12, and the outward flange 14a in clasping fashion with the end wall 13a, the two side walls 13b, and the two inward flanges 13c. With this structure, the first inner member 11, the second inner member 12, the first outer member 13, and the second outer member 14 are integrated. In other words, the first and second outer members 13 and 14 hold the first and second inner members 11 and 12 in a stacked state adjacent to each other in the Z direction. In this way, in the present embodiment, the inward flange 13c and the outward flange 14a suppress the first outer member 13 and the second outer member 14 from being separated in the Z direction. The inward flange 13c and the outward flange 14a are examples of engagement portions. The subassembly of the first inner member 11, the second inner member 12, and the second outer member 14 stacked in the Z direction is moved relative to the first outer member 13 in the X direction, thereby obtaining the assembled state shown in fig. 1.
Fig. 2 is a plan view of the first inner member 11 viewed in a direction opposite to the Z direction. As shown in fig. 2, the first inner member 11 has a quadrangular shape including two sides along the X direction and two sides along the Y direction in a plan view. The first inner member 11 is provided with a plurality of recesses 11a that open in the Z direction. The recess 11a is provided with grooves 11a1 for accommodating the members 20. The plurality of grooves 11a1 are arranged in a matrix shape aligned in the X direction and aligned in the Y direction.
Fig. 3 is a plan view of the subassembly in which the first inner member 11 and the second inner member 12 are stacked adjacent to each other in the Z direction, as viewed in the direction opposite to the Z direction, with the second outer member 14 not being stacked. As shown in fig. 3, the second inner member 12 also has a quadrangular shape including two sides along the X direction and two sides along the Y direction in a plan view. The second inner member 12 is housed in the recess 11a of the first inner member 11. The first inner member 11 and the second inner member 12 are provided with a plurality of component holding portions 10a that respectively hold the components 20. The plurality of component holding portions 10a are arranged in a matrix shape arranged in the X direction and in the Y direction. The second inner member 12 has a plate-like base 12a extending orthogonally to the Z direction, and an opening 12a1 is provided in the base 12a so as to correspond to each component holding portion 10a. By observing the subassembly of the first inner member 11 and the second inner member 12, which does not overlap the second outer member 14, in the direction opposite to the Z direction, the presence or absence of the component 20 in each component holding portion 10a can be visually confirmed through the opening 12a1.
Fig. 4 is a cross-sectional view of the component housing 10 at the position IV-IV of fig. 3. As shown in fig. 4, the component 20 is accommodated in a groove 11a1 provided in the bottom surface of the recess 11a. The groove 11a1 can also be referred to as a housing portion of the member 20. The side surfaces of the groove 11a1 in the X direction and the Y direction function as positioning portions of the member 20 in the X direction and the Y direction.
The member 20 is a submount with a semiconductor laser chip as an example in the present embodiment, and includes a submount (submount) 21 and a semiconductor laser chip 22 as mounting substrates. The submount 21 has a bottom surface 21a and a top surface 21b. As an example, the subframe 21 has a length in the X direction of 2 to 5[ 2 ], [ mm ], and a width in the Y direction of 1 to 3[ 2 ], [ mm ]. The semiconductor laser chip 22 is mounted on the top surface 21b. For example, the semiconductor laser chip 22 has a width in the Y direction of 0.3 to 1[ mm ].
In the posture in which the component 20 is held by the component holding portion 10a, in other words, the posture in which the component 20 is accommodated in the component case 10, the bottom surface 21a faces in the opposite direction to the Z direction, and the top surface 21b faces in the Z direction. In the present embodiment, the bottom surface 21a and the top surface 21b are parallel to each other, intersect the Z direction, and extend perpendicularly to each other, as an example. The bottom surface 21a is an example of a first surface, the top surface 21b is an example of a second surface, and the opposite direction to the Z direction is an example of a first direction. In other words, the Z direction is an example of a direction opposite to the first direction. The bottom surface 21a and the top surface 21b may not be parallel.
Fig. 5 is a plan view of the member 20 accommodated in the groove 11a1 of the first inner member 11 viewed in a direction opposite to the Z direction. As shown in fig. 5, the component 20 has an external appearance of a rectangular shape elongated in the X direction in a plan view, and is held by the component holding portion 10a in an attitude elongated in the X direction. In addition, the semiconductor laser chip 22 extends in the X direction at the center position in the Y direction of the top surface 21b of the submount 21 in the posture of being held by the component holding portion 10a.
On the top surface 21b, a first electrode 21b1 and a second electrode 21b2 insulated from each other by a gap 21b3 are provided. The semiconductor laser chip 22 is mounted on the second electrode 21b2 by, for example, soldering or the like, and thus an electrode (not shown) provided on the back surface of the semiconductor laser chip 22 is electrically and mechanically connected to the second electrode 21b2. The electrode 22a1 provided on the front surface 22a of the semiconductor laser chip 22 and the first electrode 21b1 are electrically connected by a bonding wire 23.
The groove 11a1 has a first portion 11a2 extending in the X direction with a predetermined width and a second portion 11a3 extending in the Y direction with a predetermined width. The component 20 is housed in the first portion 11a2. The second portion 11a3 is a gap when the component 20 is taken out from the groove 11a1 by a hand of a robot, tweezers, or the like (none of which is shown).
Fig. 6 is an exploded side view of the first inner member 11, the component 20, and the second inner member 12 as viewed in the X direction. As shown in fig. 6, the second inner member 12 is placed on the first inner member 11 with the component 20 accommodated in the recess 11a, and the second inner member 12 is sandwiched between the first outer member 13 and the second outer member 14, thereby obtaining the state of fig. 4.
As is clear from fig. 4 and 6, the first inner member 11 is provided with two inclined surfaces 11b1 and 11b2 inclined with respect to the Z direction and the Y direction, respectively. The inclined surface 11b1 is a side surface at an end of the recess 11a in the Y direction opposite to the Y direction, and the inclined surface 11b2 is a side surface at an end of the recess 11a in the Y direction. The inclined surface 11b1 faces the Z direction and the Y direction, and the inclined surface 11b2 faces the opposite direction of the Z direction and the Y direction. The inclined surfaces 11b1, 11b2 are aligned in the Y direction and separated in the Y direction. The inclined surfaces 11b1 and 11b2 approach each other in the Y direction as they go in the opposite direction to the Z direction. The inclined surfaces 11b1 and 11b2 are flat surfaces extending in the X direction. The Y direction is an example of one orthogonal direction orthogonal to the first direction.
On the other hand, the second inner member 12 is provided with two inclined surfaces 12b1 and 12b2 inclined with respect to the Z direction and the Y direction, respectively. The inclined surface 12b1 is provided at the end of the base 12a in the direction opposite to the Y direction, and the inclined surface 12b2 is provided at the end of the base 12a in the Y direction. The inclined surface 12b1 faces in the opposite direction to the Z direction and in the opposite direction to the Y direction, and the inclined surface 12b2 faces in the opposite direction to the Z direction and in the Y direction. The inclined surfaces 12b1, 12b2 are aligned in the Y direction and separated in the Y direction. The inclined surfaces 12b1 and 12b2 approach each other in the Y direction as they go in the opposite direction to the Z direction. The inclined surfaces 12b1 and 12b2 are flat surfaces extending in the X direction.
As shown in fig. 4, in a state where the first inner member 11 and the second inner member 12 are overlapped in the Z direction, the inclined surface 11b1 and the inclined surface 12b1 are close to and face each other, and the inclined surface 11b2 and the inclined surface 12b2 are close to and face each other. Thereby, the first inner member 11 and the second inner member 12 are positioned in the Z direction, and also positioned in the Y direction.
The first outer member 13 and the second outer member 14 elastically press the first inner member 11 and the second inner member 12 in the Z direction. Thereby, the inclined surface 11b1 and the inclined surface 12b1 are pressed against each other, and the inclined surface 11b2 and the inclined surface 12b2 are pressed against each other. That is, the first outer member 13 and the second outer member 14 sandwich the first inner member 11 and the second inner member 12 in the Z direction, thereby suppressing the positional displacement of the first inner member 11 and the second inner member 12 in the Z direction and the Y direction. The first outer member 13 and the second outer member 14 are examples of two members constituting the third member.
Fig. 7 is a plan view of a subassembly of the first inner member 11, the component 20, and the second inner member 12, viewed in a direction opposite to the Z direction. As shown in fig. 7, two arms 12c1, 12c2 protrude from an edge 12a11 of an opening 12a1 provided in the second inner member 12 in a direction intersecting the Z direction and substantially orthogonal to the Z direction. One arm 12c1 projects in the Y direction from an edge 12a11 which is an end portion of the opening 12a1 in the Y direction opposite to the Y direction, and the other arm 12c2 projects in the Y direction opposite to the Y direction from an edge 12a12 which is an end portion of the opening 12a1 in the Y direction opposite to the Y direction. The two arms 12c1 and 12c2 are disposed so as to be separated from the semiconductor laser chip 22 and the bonding wire 23 and not to interfere with the semiconductor laser chip 22 and the bonding wire 23. The two arms 12C1 and 12C2 and the first portion 11a2 of the groove 11a1 are substantially point-symmetrical with respect to a center point C, which is an intersection of a center line Cx along the X direction and a center line Cy along the Y direction of the component 20 held by the component holding portion 10a, in a plan view of fig. 7. Therefore, even when the component 20 is stored in the first portion 11a2 in a posture inverted in the X direction or the Y direction with respect to the posture of fig. 7, the semiconductor laser chip 22 and the bonding wire 23 do not interfere with the arms 12c1 and 12c2. In other words, the component 20 can be housed in the first portion 11a2 in both the posture shown in fig. 7 and the posture inverted in the X direction or the Y direction with respect to the posture shown in fig. 7.
As shown in fig. 4, in a state where the component 20 is accommodated in the groove 11a1, in other words, in a state where the component 20 is held by the component holding portion 10a, the bottom surface 21a of the sub-holder 21 faces and contacts the bottom surface 11a4 of the groove 11a1, and the top surface 21b of the sub-holder 21 faces and contacts the back surfaces 12d of the arms 12c1, 12c2. In the case where the first inner member 11, the second inner member 12, and the component 20 are manufactured within the specified dimensional tolerance, the bottom surface 21a is configured to be in contact with the bottom surface 11a4, and the top surface 21b is configured to be in contact with the back surface 12 d. This can suppress the positional shift of the component 20 in the Z direction in the component holding portion 10a, and also suppress the positional shift in the other direction intersecting the Z direction by the friction caused by the contact between the bottom surface 21a and the bottom surface 11a4 and the friction caused by the contact between the top surface 21b and the back surface 12 d. The first inner member 11 is an example of a first member, and the second inner member 12 is an example of a second member. The arms 12c1 and 12c2 are examples of the protruding portions, the bottom surface 21a is an example of the first surface, the top surface 21b is an example of the second surface, the bottom surface 11a4 is an example of the first supporting surface, and the back surface 12d is an example of the second supporting surface.
Fig. 8 is a cross-sectional view of the component case 10R of the reference example in which the first inner member 11 and the second inner member 12 are provided with vertical surfaces 11c and 12g perpendicular to the Y direction and facing each other, respectively, for positioning in the Y direction, at a position equivalent to that in fig. 4. In the component case 10R, when the component 20 is stored in or removed from the component holding portion 10a, a gap g1 needs to be provided in the Y direction between the vertical surfaces 11c and 12g in order to smoothly bring the first inner member 11 and the second inner member 12 close to or away from each other in the Z direction. The gap g1 is also required to be provided as a dimensional tolerance when the first inner member 11 and the second inner member 12 are manufactured. Thus, the gap g1 is usually set to a degree of 0.2 to 0.5[ 2 ], [ 0.5 ]. On the other hand, in order to smoothly carry out the storage and the removal of the member 20 with respect to the groove 11a1, the clearance between the groove 11a1 and the member 20 is set to a degree of 0.2 to 0.5[ 2 ], [ 0 ] mm. Therefore, the Y-direction wobbling of the component 20 in the component case 10R and the second inner member 12 is usually 0.4 to 1[ mm ], and in such a case, the semiconductor laser chip 22 mounted on the top surface 21b of the sub-holder 21 interferes with the portions of the second inner member 12 such as the arms 12c1 and 12c2 positioned on the top surface 21b, and the possibility of damaging the semiconductor laser chip 22 increases.
In this regard, in the present embodiment, as described above, the two inclined surfaces 11b1, 11b2 face in opposite directions to each other in the Y direction and approach each other in the Y direction as going to the opposite direction in the Z direction, and in a state where the first inner member 11 and the second inner member 12 are overlapped in the Z direction, the inclined surface 12b1 extends along the inclined surface 11b1 and contacts, and the inclined surface 12b2 extends along the inclined surface 11b2 and contacts. As a result, the first inner member 11 and the second inner member 12 are positioned substantially without play in the Z direction and the Y direction. Note that the inclination with respect to the Z direction is equivalent to the inclination in the opposite direction (first direction) with respect to the Z direction. The Y direction is an example of the orthogonal direction and the third direction, the inclined surfaces 11b1 and 11b2 are an example of the first inclined surface, and the inclined surfaces 12b1 and 12b2 are an example of the facing surface and the first facing surface.
Further, since the rattling movement in the case where the vertical surfaces 11c and 12g are provided as in the above-described component case 10R is about 1[ mm ] at the maximum, the structure for reducing the rattling movement by the two inclined surfaces 11b1 and 11b2 is more effective in the case where the length (width) of the component 20 in the short side direction orthogonal to the Z direction, that is, the Y direction in the present embodiment is 2[ mm ] or less. When the width of the member 20 is 2[ 2 ] mm or less, the length (width) of the groove 11a1 in the Y direction, that is, the distance between the side surfaces on both sides in the Y direction is, for example, 3[ mm ] or less and is about 0.2 to 0.5[ mm ] greater than the width of the member 20.
In the present embodiment, the first inner member 11 and the second inner member 12 are each made of a synthetic resin material such as polycarbonate, ABS resin, polypropylene, or polystyrene. The first inner member 11 and the second inner member 12 may be made of different materials, and the second inner member 12 is preferably made of a material having a lower elastic modulus than the first inner member 11. Further, the arms 12c1 and 12c2 preferably have a portion thinner in thickness in the Z direction than the base 12 a. The thickness of the arms 12c1 and 12c2 along the Z direction may be different depending on the position in the Y direction. That is, the arms 12c1 and 12c2 have a plurality of portions having different thicknesses. In the present embodiment, for example, the thickness of the arms 12c1 and 12c2 in the Z direction gradually decreases, i.e., becomes thinner, from the root toward the tip. With such a configuration, it is possible to suppress an excessive force from the first inner member 11 and the second inner member 12 from acting on the component 20 by elastic deformation of the first inner member 11 and the second inner member 12, for example, by elastic deformation of the arms 12c1 and 12c2 of the second inner member 12 in the present embodiment. The magnitude of the force acting on the member 20 from the first inner member 11 and the second inner member 12 can be appropriately adjusted according to the specifications of the first inner member 11 and the second inner member 12, such as the shape, the size, and the material. The thickness along the Z direction is equivalent to the thickness along the opposite direction to the Z direction, and is an example of the thickness along the first direction. The first inner member 11 and the second inner member 12 may be made of the same material or may be made by injection molding. Further, the thickness of the arms 12c1, 12c2 may be reduced toward the front end.
Fig. 9 is a sectional view of the component housing 10 at the position IX-IX of fig. 3. As shown in fig. 9, the first inner member 11 is provided with two inclined surfaces 11b3 and 11b4 inclined with respect to the Z direction and the X direction, respectively. The inclined surface 11b3 is a side surface at an end of the recess 11a in the opposite direction to the X direction, and the inclined surface 11b4 is a side surface at an end of the recess 11a in the X direction. The inclined surface 11b3 faces the Z direction and the X direction, and the inclined surface 11b4 faces the opposite direction of the Z direction and the X direction. The inclined surfaces 11b3, 11b4 are aligned in the X direction and separated in the X direction. The inclined surfaces 11b3 and 11b4 approach each other in the X direction as they go in the opposite direction to the Z direction. The inclined surfaces 11b3 and 11b4 are flat surfaces extending in the Y direction. The X direction is an example of one orthogonal direction orthogonal to the first direction.
On the other hand, the second inner member 12 is provided with two inclined surfaces 12b3 and 12b4 inclined with respect to the Z direction and the X direction, respectively. The inclined surface 12b3 is provided at the end of the base 12a in the direction opposite to the X direction, and the inclined surface 12b4 is provided at the end of the base 12a in the X direction. The inclined surface 12b3 faces in the opposite direction to the Z direction and in the opposite direction to the X direction, and the inclined surface 12b4 faces in the opposite direction to the Z direction and in the X direction. The inclined surfaces 12b3, 12b4 are aligned in the X direction and separated in the X direction. The inclined surfaces 12b3 and 12b4 approach each other in the X direction as they go in the opposite direction to the Z direction. The inclined surfaces 12b3 and 12b4 are flat surfaces extending in the Y direction.
Thus, the two inclined surfaces 11b3, 11b4 face in opposite directions to each other in the X direction and approach each other in the X direction as going to the opposite direction in the Z direction, and in a state where the first inner member 11 and the second inner member 12 overlap in the Z direction, the inclined surface 12b3 extends along the inclined surface 11b3 and contacts, and the inclined surface 12b4 extends along the inclined surface 11b4 and contacts. Thereby, the first inner member 11 and the second inner member 12 are brought into contact substantially without a gap, and are positioned substantially without rattling in the Z direction and the X direction. The X direction is an example of the orthogonal direction and the second direction, the inclined surfaces 11b3 and 11b4 are examples of the second inclined surfaces, and the inclined surfaces 12b3 and 12b4 are examples of the facing surfaces and the second facing surfaces.
As described above, in the present embodiment, the first inner member 11 (first member) has the two inclined surfaces 11b1 and 11b2. These inclined surfaces 11b1 and 11b2 face in opposite directions to each other in the Y direction, are inclined with respect to the opposite direction (first direction) in the Z direction and the Y direction (orthogonal direction to the first direction) orthogonal to the opposite direction in the Z direction, and approach each other toward the opposite direction in the Z direction. The second inner member 12 (second member) has two inclined surfaces 12b1 and 12b2 (facing surfaces). These inclined surfaces 12b1, 12b2 extend along and contact the two inclined surfaces 11b1, 11b2, respectively.
According to such a configuration, for example, in a state where the inclined surfaces 11b1 and 11b2 and the corresponding inclined surfaces 12b1 and 12b2 are in contact with each other, the Z-direction and Y-direction play, that is, the first-direction and orthogonal-direction play of the first inner member 11 and the second inner member 12 can be suppressed.
In the present embodiment, the first outer member 13 and the second outer member 14 (third member) press the second inner member 12 in the direction opposite to the Z direction against the first inner member 11 so that the inclined surfaces 11b1 and 11b2 facing each other abut against the inclined surfaces 12b1 and 12b2.
According to such a configuration, for example, the state in which the first inner member 11 and the second inner member 12 are restrained from rattling due to the inclined surfaces 11b1 and 11b2 and the corresponding inclined surfaces 12b1 and 12b2 being in contact with each other can be maintained more easily or more reliably.
In the present embodiment, the arms 12c1 and 12c2 (protruding portions) have a thickness in the Z direction, that is, a portion thinner in the first direction than the thickness of the base 12a in the Z direction.
In the present embodiment, the arms 12c1 and 12c2 have a plurality of portions having different thicknesses in the Z direction.
In the present embodiment, the values of the elastic moduli are different between the first inner member 11 and the second inner member 12, and the elastic modulus of the second inner member 12 is lower than the elastic modulus of the first inner member 11, for example.
With such a configuration, for example, excessive force applied from the first inner member 11 and the arms 12c1 and 12c2 to the member 20 can be suppressed in accordance with the ease of elastic deformation of the arms 12c1 and 12c2.
In the present embodiment, the member 20 has a shape elongated in the X direction (second direction) orthogonal to the Z direction.
In the present embodiment, the first inner member 11 has two inclined surfaces 11b1 and 11b2 (first inclined surfaces) inclined with respect to the Z direction and the Y direction (third direction), and the second inner member 12 has two inclined surfaces 12b1 and 12b2 (first facing surfaces) extending along the two inclined surfaces 11b1 and 11b2, respectively, and contacting each other.
When the member 20 is elongated in the X direction, the width of the member 20 in the Y direction is shortened, and therefore, it is necessary to improve the positioning accuracy of the arms 12c1 and 12c2, the semiconductor laser chip 22, and the bonding wire 23 in the Y direction. In this regard, in the present embodiment, the inclined surfaces 11b1 and 11b2 and the corresponding inclined surfaces 12b1 and 12b2 contact each other, and thereby the wobbling in the Z direction and the Y direction of the first inner member 11 and the second inner member 12 can be suppressed. Therefore, according to such a configuration, even when the component 20 is elongated in the X direction and has a short width in the Y direction, for example, the wobbling of the first inner member 11 and the second inner member 12 in the Y direction can be more reliably suppressed, and the interference of the arms 12c1 and 12c2 with the semiconductor laser chip 22 and the bonding wire 23 can be more reliably avoided.
In the present embodiment, the first inner member 11 has two inclined surfaces 11b3 and 11b4 (second inclined surfaces) inclined with respect to the Z direction and the X direction (second direction), and the second inner member 12 has two inclined surfaces 12b3 and 12b4 (second opposing surfaces) extending along the two inclined surfaces 11b3 and 11b4, respectively, and contacting each other.
With such a configuration, for example, in a state where the inclined surfaces 11b3, 11b4 and the corresponding inclined surfaces 12b3, 12b4 are in contact with each other, the Z-direction and X-direction play of the first inner member 11 and the second inner member 12 can be suppressed.
In the present embodiment, the component case 10 includes a pair (pair) of the two inclined surfaces 11b1 and 11b2 and the two inclined surfaces 12b1 and 12b2 corresponding to the two inclined surfaces 11b1 and 11b2, and a pair of the two inclined surfaces 11b3 and 11b4 and the two inclined surfaces 12b3 and 12b4 corresponding to the two inclined surfaces 11b3 and 11b4. That is, the component case 10 includes a plurality of pairs of two inclined surfaces and two corresponding facing surfaces.
With such a configuration, for example, rattling in the first direction of the first inner member 11 and the second inner member 12 and rattling in a plurality of directions orthogonal to the first direction can be suppressed.
[ first modification ]
Fig. 10 is a sectional view of the component case 10A of the first modification at a position equivalent to that of fig. 9. The component case 10A of the present modification has the same configuration as the component case 10 of the first embodiment except for the portion shown in fig. 10. As is clear from comparison between fig. 10 and fig. 9, in the present modification, the inclined surfaces 11b3, 11b4, 12b3, and 12b4 are not provided. In this case, gaps g2 are formed between the second inner member 12 and the first inner member 11 at both ends in the X direction, respectively. Therefore, although the two gaps g2 are fluctuated in the X direction, the semiconductor laser chip 22 mounted on the top surface 21b of the submount 21 and the portions of the second inner member 12 such as the arms 12c1 and 12c2 positioned on the top surface 21b do not interfere with each other and the semiconductor laser chip 22 is not likely to be damaged because the Y direction and the direction are suppressed from being fluctuated by the inclined surfaces 11b1 and 11b2 and the corresponding inclined surfaces 12b1 and 12b 3. Further, as is clear from fig. 7, even if the component 20 and the second inner member 12 rattle in the X direction occurs, if the gap g2 in the X direction is about 0.4 to 1[ mm ], for example, the joining line 23 of the component 20 does not interfere with the portions of the second inner member 12 such as the arms 12c1 and 12c2 on the top surface 21b, and the joining line 23 is not likely to be broken. Therefore, if the rattling motions of the first inner member 11 and the second inner member 12 are within the above-described allowable range, such a configuration will not cause a problem. According to this modification, the component case 10A can be configured to be smaller in the X direction, corresponding to the absence of the inclined surfaces 11b3, 11b4, 12b3, and 12b4.
[ second modification ]
Fig. 11 is a sectional view of a component case 10B of a second modification at a position equivalent to that of fig. 4. The component case 10B of the present modification has the same configuration as the component case 10 of the first embodiment except for the portion shown in fig. 11. As shown in fig. 11, in the present modification, the thin portions 12e are provided at the root portions of the arms 12c1 and 12c2, respectively. By providing the thin portion 12e, the arms 12c1 and 12c2 are more easily elastically deformed than in the case where the thin portion 12e is not provided, and the force acting on the member 20 can be made smaller. By providing the thin portion 12e, the thickness of the arms 12c1, 12c2 in the Z direction changes. The thin portion 12e can also be referred to as an easily deformable portion.
[ third modification ]
Fig. 12 is a sectional view of a component case 10C of a third modification at a position equivalent to that of fig. 4. The component case 10C of the present modification includes a second inner member 12C in which the second inner member 12 and the second outer member 14 of the first embodiment are integrated. In this example, only the first outer member 13 functions as the third member. Fig. 12 shows only the end portion of the component case 10C in the direction opposite to the Y direction, but the end portion of the component case 10C in the Y direction also has a symmetrical shape in a mirror image relationship with the structure shown in fig. 12.
As shown in fig. 12, in the present modification, the second inner member 12C has outward flanges 12f located at both ends in the Y direction. The outward flange 12f is disposed adjacently in the opposite direction of the Z direction with respect to the inward flange 13c of the first outer member 13. With this structure, the first outer member 13 holds the first inner member 11 and the second inner member 12C in a clasping manner with the end wall 13a, the two side walls 13b, and the two inward flanges 13C (only one is shown in fig. 12). With this structure, the first inner member 11, the second inner member 12C, and the first outer member 13 are integrated. In other words, the first outer member 13 holds the first inner member 11 and the second inner member 12C in a state of being stacked adjacently in the Z direction. In the present modification, the first outer member 13 is relatively moved in the X direction with respect to the subassembly in which the first inner member 11 and the second inner member 12C are stacked in the Z direction, thereby obtaining the assembly state shown in fig. 12. Even with such a configuration, the same effects as those of the first embodiment can be obtained. In addition, according to this modification, the advantage that the number of components can be reduced can be obtained.
The embodiments and modifications of the present invention have been described above, but the embodiments and modifications are examples and are not intended to limit the scope of the present invention. The above-described embodiment and the modification can be implemented in other various ways, and various omissions, substitutions, combinations, and changes can be made without departing from the spirit of the invention. Further, specifications such as the structure and shape (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, and the like) can be appropriately changed and implemented.
For example, the component is not limited to the semiconductor laser element, and the present invention can be applied to an electronic component such as a semiconductor chip, and can also be applied to an electric component, an optical component, and other components in the same manner.
The positions and orientations of the inclined surface and the facing surface are not limited to the above-described embodiments and modifications, and various embodiments can be adopted.
The third member that integrates the first member and the second member is not limited to the sliding type components illustrated in the above embodiments, and may be a member of another form such as a screw or a clip. The third member may have three or more members, and each of these members may have an engagement portion of a different form from the flange.
Industrial applicability
The present invention can be used for a component case.
Description of the reference numerals
10. 10A-10C parts shell
10R parts case (reference example)
10a parts holding part
11. First inner member (first member)
11a recess
11a1 groove
11a2 first portion
11a3 second region
11a4 bottom surface (first supporting surface)
11b1, 11b2 inclined plane (first inclined plane)
Inclined plane (second inclined plane) of 1lb3, 11b4
11c vertical plane
12. 12C second inner member (second member)
12a base
12a1 opening
12a11, 12a12 edges
12b1, 12b2 inclined plane (first opposite plane)
12b3, 12b4 inclined plane (second opposite plane)
12c1, 12c2 arm (projection)
12d Back surface (second supporting surface)
12e thin wall part
12f outward flange
12g vertical plane
13. First outer member (third member)
13a end wall
13b side wall
13c inward flange (engaging part)
14. Second outer member (third member)
14a outward flange (engaging part)
20. Component part
21. Sub-support
21a bottom surface (first surface)
21b Top surface (second surface)
21b1 first electrode
21b2 second electrode
21b3 gap
22. Semiconductor laser chip
22a surface
22a1 electrode
23. Bonding wire
g1, g2 gap
Center point of C
Cx center line
Cy center line
X-direction (orthogonal direction, second direction)
Y direction (orthogonal direction, third direction)
The Z direction (the opposite direction to the first direction).

Claims (13)

1. A component housing which houses a plurality of components each having a first surface facing a first direction and a second surface facing a direction opposite to the first direction, wherein,
the component case includes a first member and a second member,
the first member extends substantially orthogonally to the first direction, and has: a plurality of first supporting surfaces respectively supporting the first surfaces; and two inclined surfaces which are inclined with respect to the first direction and face in opposite directions to each other in an orthogonal direction orthogonal to the first direction, respectively, and which approach or separate from each other as going toward the first direction,
the second member is adjacent to the first member in a direction opposite to the first direction and expands substantially orthogonally to the first direction, and has: a plurality of second supporting surfaces which support the second surfaces, respectively; and two opposed faces which extend along the two inclined faces and are in contact, respectively.
2. The component housing of claim 1,
the component case includes a third member that presses the second member in the first direction relative to the first member so that the inclined surfaces facing each other abut against the facing surfaces.
3. The component housing of claim 2,
the component case includes, as the third member, a plurality of members each having an engagement portion that suppresses separation in the first direction.
4. The component housing according to any one of claims 1 to 3,
the second member has: a base provided with an opening and having the two opposing surfaces; and a plurality of protruding portions that protrude from edges of the opening in a direction substantially orthogonal to the first direction and that have the second support surface.
5. The component housing of claim 4,
the thickness of the protruding portion along the first direction is equal to or less than the thickness of the base along the first direction.
6. The component housing of claim 4 or 5,
the protruding portion has a plurality of portions having different thicknesses along the first direction.
7. The component housing according to any one of claims 1 to 6,
the member has a shape elongated in a second direction orthogonal to the first direction.
8. The component housing of claim 7,
the width of the member in a third direction orthogonal to the first direction and the second direction is 2[ 2 ], [ mm ] or less.
9. The component housing of claim 7 or 8,
the first member has two first inclined faces inclined with respect to the first direction and a third direction orthogonal to the first direction and the second direction, respectively, as the two inclined faces,
the second member has two first opposing surfaces extending along and contacting the two first inclined surfaces, respectively.
10. The component casing according to any one of claims 7 to 9,
the first member has two second inclined faces inclined with respect to the first direction and the second direction respectively as the two inclined faces,
the second member has two second opposite surfaces extending along and contacting the two second inclined surfaces, respectively.
11. The component housing according to any one of claims 1 to 10,
the component case includes a plurality of pairs of the two inclined surfaces and the two opposing surfaces corresponding to the two inclined surfaces.
12. The component housing according to any one of claims 1 to 11,
the value of the elastic modulus of the first member and the value of the elastic modulus of the second member are different from each other.
13. The component housing of claim 11,
the second member has a lower elastic modulus than the first member.
CN202180040231.3A 2020-06-05 2021-06-04 Component housing Pending CN115697860A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-098797 2020-06-05
JP2020098797A JP2021191689A (en) 2020-06-05 2020-06-05 Component case
PCT/JP2021/021463 WO2021246530A1 (en) 2020-06-05 2021-06-04 Case for parts

Publications (1)

Publication Number Publication Date
CN115697860A true CN115697860A (en) 2023-02-03

Family

ID=78830291

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180040231.3A Pending CN115697860A (en) 2020-06-05 2021-06-04 Component housing

Country Status (3)

Country Link
JP (1) JP2021191689A (en)
CN (1) CN115697860A (en)
WO (1) WO2021246530A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5335771A (en) * 1990-09-25 1994-08-09 R. H. Murphy Company, Inc. Spacer trays for stacking storage trays with integrated circuits
JPH07148207A (en) * 1993-12-01 1995-06-13 Akio Saguchi Sealed container
US5418692A (en) * 1994-08-22 1995-05-23 Shinon Denkisangyo Kabushiki-Kaisha Tray for semiconductor devices
JP2009023699A (en) * 2007-07-20 2009-02-05 Seiko Epson Corp Transport tray
JP5678494B2 (en) * 2010-07-02 2015-03-04 富士通セミコンダクター株式会社 Electronic device storage container

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WO2021246530A1 (en) 2021-12-09

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