CN115692192A - Non-photosensitive adhesive graphical processing technology - Google Patents
Non-photosensitive adhesive graphical processing technology Download PDFInfo
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- CN115692192A CN115692192A CN202211463090.9A CN202211463090A CN115692192A CN 115692192 A CN115692192 A CN 115692192A CN 202211463090 A CN202211463090 A CN 202211463090A CN 115692192 A CN115692192 A CN 115692192A
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- photosensitive adhesive
- photosensitive
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Abstract
The invention discloses a non-photosensitive adhesive graphical processing technology, which comprises the following processing steps: s1, taking out a substrate, and coating a layer of non-photosensitive glue on the substrate to reach a set target thickness; s2, coating a layer of photosensitive glue on the non-photosensitive glue; s3, covering a mask plate on the photosensitive adhesive, wherein the mask plate is partially hollowed out, and the hollowed part is a product pattern processed in an imaging mode; s4, photoetching development is used; s5, taking down the mask, and completely etching the exposed bottom layer of non-photosensitive adhesive in a dry etching mode, and ensuring that the non-photosensitive adhesive in the upper layer of photosensitive adhesive protection area is not etched; and S6, removing the residual photosensitive glue on the upper layer of the non-photosensitive glue through a glue removing liquid without damaging the non-photosensitive glue on the lower layer, and finally obtaining the patterned non-photosensitive glue. The process realizes the graphical processing of the non-photosensitive adhesive, and the dimensional precision of the graph is far higher than that of the printing process.
Description
Technical Field
The invention relates to the field of semiconductor dry etching processes, in particular to a non-photosensitive adhesive patterning processing process.
Background
At present, the semiconductor industry is rapidly developing, the market demand for semiconductor devices is increasing, and the forms of semiconductors are also more diversified. Some of these components are semiconductor devices that are patterned after an organic paste is applied to a silicon substrate. Since the organic glue coated on the semiconductor device is non-photosensitive glue, the patterning process can not be directly carried out by the photoetching development mode, and the pattern size precision can not be achieved by the printing mode.
Therefore, how to realize high-precision patterning processing of the non-photosensitive adhesive is an important research direction which needs to be solved currently.
Disclosure of Invention
In order to solve the technical problem, the invention designs a non-photosensitive adhesive graphical processing technology.
The invention adopts the following technical scheme:
a non-photosensitive glue graphical processing technology comprises the following processing steps:
s1, taking out the substrate, and coating a layer of non-photosensitive glue on the substrate to reach a set target thickness;
s2, coating a layer of photosensitive glue on the non-photosensitive glue;
s3, covering a mask plate on the photosensitive adhesive, wherein the mask plate is partially hollowed out, and the hollowed part is a product pattern processed in an imaging mode;
s4, patterning the upper layer of photosensitive adhesive by using a photoetching machine for exposure, changing the quality of the irradiated area photosensitive adhesive after exposure, pouring a developing solution on the surface of the photosensitive adhesive, and enabling the developing solution to flow through the surface of the photosensitive adhesive in a low-speed spin coating mode, wherein the deteriorated photosensitive adhesive can react with the developing solution and be dissolved in the developing solution and taken away;
s5, taking down the mask, introducing gas into the cavity for ionization in a dry etching mode, accelerating downward movement of ionized ions under the action of an upper electric field and a lower electric field to completely etch the exposed bottom layer of non-photosensitive adhesive, and ensuring that the non-photosensitive adhesive in the upper layer of photosensitive adhesive protection area is not etched;
and S6, removing the residual photosensitive adhesive on the upper layer of the non-photosensitive adhesive through the photoresist removing liquid without damaging the non-photosensitive adhesive on the lower layer, finally obtaining the patterned non-photosensitive adhesive, and finishing the whole non-photosensitive adhesive patterning processing technology.
Preferably, the non-photosensitive glue is ferroelectric glue.
Preferably, in step S2, the thickness of the photosensitive paste is 2 to 3 times the thickness of the non-photosensitive paste.
Preferably, in step S1, the thickness of the non-photosensitive paste is controlled to be in the order of micrometers.
The invention has the beneficial effects that: the invention designs a non-photosensitive adhesive graphical processing technology, which realizes graphical processing of non-photosensitive adhesive, and the dimensional precision of a graph is far higher than that of a printing technology.
Drawings
FIG. 1 is a schematic view of a substrate according to the present invention;
FIG. 2 is a schematic view of a structure of FIG. 1 in which a non-photosensitive adhesive is applied to the substrate;
FIG. 3 is a schematic view of the non-photosensitive glue of FIG. 2 coated with a photosensitive glue;
FIG. 4 is a schematic diagram of a structure of a mask covering the photosensitive adhesive of FIG. 3;
FIG. 5 is a schematic illustration of a structure of FIG. 4 after lithographic development;
FIG. 6 is a schematic view of the structure of FIG. 5 with the mask removed;
FIG. 7 is a schematic view of a structure of FIG. 6 after dry etching;
FIG. 8 is a schematic view of a structure of FIG. 7 to remove residual photosensitive adhesive;
in the figure: 1. the method comprises the following steps of (1) a substrate, 2, non-photosensitive glue, 3, photosensitive glue, 4 and a mask.
Detailed Description
The technical scheme of the invention is further described in detail by the specific embodiments and the accompanying drawings:
example (b): as shown in the attached figure 1, the non-photosensitive adhesive graphical processing technology comprises the following processing steps:
s1, as shown in figure 1, taking out the substrate 1, and coating a layer of non-photosensitive glue 2 on the substrate to reach a set target thickness as shown in figure 2;
s2, coating a layer of photosensitive glue 3 on the non-photosensitive glue, as shown in figure 3;
s3, covering a mask plate 4 on the photosensitive adhesive, wherein the mask plate is partially hollowed out, and the hollowed-out part is a product pattern processed in a graphical mode, as shown in a figure 4;
s4, patterning the upper layer of photosensitive glue in a photoetching machine exposure mode, changing the quality of the irradiated area photosensitive glue after exposure, pouring a developing solution on the surface of the photosensitive glue, flowing the developing solution on the surface of the photosensitive glue in a low-speed spin coating mode, reacting the deteriorated photosensitive glue with the developing solution, dissolving the deteriorated photosensitive glue in the developing solution and taking away the deteriorated photosensitive glue, as shown in figure 5;
s5, taking down the mask, introducing gas into the cavity for ionization in a dry etching mode as shown in FIG. 6, accelerating downward movement of ionized ions under the action of an upper electric field and a lower electric field to completely etch the exposed bottom layer of non-photosensitive adhesive, and ensuring that the non-photosensitive adhesive in the upper layer of photosensitive adhesive protection area is not etched as shown in FIG. 7;
and S6, removing the residual photosensitive glue on the upper layer of the non-photosensitive glue through the glue removing liquid without damaging the non-photosensitive glue on the lower layer, and finally obtaining the patterned non-photosensitive glue, as shown in figure 8, thereby completing the whole non-photosensitive glue patterning processing technology.
The non-photosensitive glue is preferably a ferroelectric glue.
In step S2, the thickness of the photosensitive adhesive is 2-3 times of that of the non-photosensitive adhesive.
In step S1, the thickness of the non-photosensitive adhesive is controlled in micron order.
The invention designs a non-photosensitive glue graphical processing technology, which realizes graphical processing of non-photosensitive glue, and the dimensional precision of a graph is far higher than that of a printing technology, compared with the printing technology which is limited by the processing precision of a mask plate, the dimensional precision of the mask plate is in the micron level, and the highest correlation between the precision of the invention and the precision of a photoetching machine can be in the nanometer level.
The above-described embodiments are only preferred embodiments of the present invention, and are not intended to limit the present invention in any way, and other variations and modifications may be made without departing from the spirit of the invention as set forth in the claims.
Claims (4)
1. A non-photosensitive adhesive graphical processing technology is characterized by comprising the following processing steps:
s1, taking out a substrate, and coating a layer of non-photosensitive glue on the substrate to reach a set target thickness;
s2, coating a layer of photosensitive glue on the non-photosensitive glue;
s3, covering a mask plate on the photosensitive adhesive, wherein the mask plate is partially hollowed out, and the hollowed-out part is a product pattern processed in a graphical mode;
s4, patterning the upper layer of photosensitive adhesive by using a photoetching machine for exposure, changing the quality of the irradiated area photosensitive adhesive after exposure, pouring a developing solution on the surface of the photosensitive adhesive, and enabling the developing solution to flow through the surface of the photosensitive adhesive in a low-speed spin coating mode, wherein the deteriorated photosensitive adhesive can react with the developing solution and be dissolved in the developing solution and taken away;
s5, taking down the mask, introducing gas into the cavity for ionization in a dry etching mode, accelerating downward movement of ionized ions under the action of an upper electric field and a lower electric field to completely etch the exposed bottom layer of non-photosensitive adhesive, and ensuring that the non-photosensitive adhesive in the upper layer of photosensitive adhesive protection area is not etched;
and S6, removing the residual photosensitive adhesive on the upper layer of the non-photosensitive adhesive through the photoresist removing liquid without damaging the non-photosensitive adhesive on the lower layer, finally obtaining the patterned non-photosensitive adhesive, and finishing the whole non-photosensitive adhesive patterning processing technology.
2. The process of claim 1, wherein the non-photosensitive adhesive is a ferroelectric adhesive.
3. The process of claim 1, wherein in step S2, the thickness of the photosensitive adhesive is 2-3 times the thickness of the non-photosensitive adhesive.
4. The process of claim 1, wherein in step S1, the thickness of the non-photosensitive adhesive is controlled to be in the micrometer range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211463090.9A CN115692192A (en) | 2022-11-22 | 2022-11-22 | Non-photosensitive adhesive graphical processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211463090.9A CN115692192A (en) | 2022-11-22 | 2022-11-22 | Non-photosensitive adhesive graphical processing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115692192A true CN115692192A (en) | 2023-02-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211463090.9A Pending CN115692192A (en) | 2022-11-22 | 2022-11-22 | Non-photosensitive adhesive graphical processing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115692192A (en) |
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2022
- 2022-11-22 CN CN202211463090.9A patent/CN115692192A/en active Pending
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