CN115673970A - Ceramic array packaging device pin deoxidation tool and deoxidation method - Google Patents
Ceramic array packaging device pin deoxidation tool and deoxidation method Download PDFInfo
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- CN115673970A CN115673970A CN202211190722.9A CN202211190722A CN115673970A CN 115673970 A CN115673970 A CN 115673970A CN 202211190722 A CN202211190722 A CN 202211190722A CN 115673970 A CN115673970 A CN 115673970A
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Abstract
The invention provides a deoxidation tool and a deoxidation method for pins of a ceramic array packaging device, wherein the deoxidation tool comprises a limiting base, a first protective cover plate and a drainage cover plate; the limiting base is provided with a clamping groove for limiting the ceramic array packaging device; the first protective cover plate is positioned above the limiting base and is provided with a first array of micropores which allow and match pins of the ceramic array packaging device to pass through; the drainage apron is located first protective cover top, has seted up the micropore processing groove of corresponding first array on the drainage apron, the processing groove forms the grit in first protective cover top and flows in and out the passageway. The deoxidation tool is designed to protect the non-oxidation area of the ceramic array packaging device, and then abrasive particle flow is used for deoxidation treatment of the welding ends to be treated of the pins of the ceramic array packaging device, so that the deoxidation treatment of the pins of the ceramic array packaging device can be realized on the premise of not causing any damage to the ceramic array packaging device, and the weldability of the packaging device is improved.
Description
Technical Field
The invention relates to the technical field of ceramic array packaging devices, in particular to a pin deoxidation tool and a pin deoxidation method for a ceramic array packaging device.
Background
With the development of IC packaging technology towards high density, thin, high performance and low cost, the array packaging form becomes the mainstream technology in the current electronic industry. Ceramic Ball grid/Column grid array package (CGA) is widely used in recent years in highly reliable products represented by aerospace due to its high interconnection density, excellent thermal and electrical properties as a surface mount package form with high density area array arrangement.
Although ceramic array package devices have many application technology advantages, there are some problems in practical engineering applications, such as oxidation of the solder ball/solder post end face. Because the solder ball/solder column of the ceramic array packaging device is made of lead-tin alloy, the pin is easy to oxidize after long-time storage, so that the solderability of the pin of the device is poor, and the welding reliability is difficult to ensure. In addition, the device spans a relatively long period from manufacturing to engineering applications, which is also a significant cause of oxidation of the device leads. Common deoxidation methods include: 1. mechanical grinding method. And removing the surface oxidation of the pin by adopting a manual grinding or mechanical grinding method for the pin of the device. The method has extremely high requirement on the level of workers, and improper operation influences the coplanarity of the pins and damages the pins. 2. And (4) replanting the solder balls or the columns, namely removing the original solder balls/columns of the device, reprinting the solder paste, and performing reflow soldering after replanting the solder balls/columns. The method is time consuming and costly to operate. 3. And removing the acidic solvent, such as reacting with the oxide after activating the soldering flux to achieve the purpose of removing the oxide. Flux activity directly affects the effectiveness of oxide removal.
Disclosure of Invention
Based on the technical problems in the background art, the invention provides a deoxidation tool and a deoxidation method for pins of a ceramic array packaging device.
The invention provides a ceramic array packaging device pin deoxidation tool which comprises a limiting base, a first protection cover plate and a drainage cover plate, wherein the first protection cover plate is arranged on the limiting base;
the limiting base is provided with a clamping groove for limiting the ceramic array packaging device;
the first protective cover plate is positioned above the limiting base and is provided with a first array of micropores which allow and match pins of the ceramic array packaging device to pass through;
the drainage apron is located first protective cover top, has seted up the micropore processing groove of corresponding first array on the drainage apron, the processing groove forms the grit in first protective cover top and flows in and out the passageway.
In the deoxidation tool, the ceramic array packaging device is limited through a limiting base; only the welding end to be processed is ensured to leak out of the pin of the ceramic array packaging device relative to the first protective cover plate through the first protective cover plate, and other non-processing areas of the ceramic array packaging device are protected; contain the abrasive flow through the drainage apron and get into the abrasive flow is flowed into and is gone out the passageway, gets into first protective cover top region promptly to the realization is to ceramic array package device pin and is carried out the deoxidation to the pending welding end that first protective cover leaked relatively.
Preferably, the bottom and/or the side of the clamping groove on the limiting base are/is provided with threaded holes for installing positioning bolts.
And installing a positioning bolt through the threaded hole, and positioning the ceramic array packaging device by using the positioning bolt.
Preferably, the device also comprises a regulating gasket;
the adjusting gasket is positioned between the limiting base and the first protective cover plate, and is provided with a middle through opening allowing the pins of the ceramic array packaging device to pass through.
The adjusting gasket is used for adjusting the leakage height of the pins of the ceramic array packaging device relative to the adjusting gasket.
Preferably, the first protective cover plate is made of elastic material, and the diameter of the first array micropores is smaller than that of the pins;
preferably, the difference between the diameter of the first array of wells and the diameter of the pins is preferably a negative tolerance of the diameter of the pins.
The first protective cover plate is used for ensuring that the pins of the ceramic array packaging device only leak out of the welding ends to be processed relative to the first protective cover plate.
When the first protective cover plate is made of elastic materials and the diameter of the first array of micropores is smaller than that of the pins, the pins of the ceramic array packaging device can still pass through the first array of micropores and form interference fit with the first array of micropores.
Preferably, the device further comprises a second protective cover plate;
the second protective cover plate is positioned between the first protective cover plate and the drainage cover plate, a second array of micropores allowing pins of the ceramic array packaging device to pass through are also formed in the second protective cover plate, the diameter of the second micropore array is larger than that of the pins, and the abrasive particle flow inlet and outlet channel is positioned above the second protective cover plate;
preferably, the difference between the diameter of the second array of wells and the diameter of the pins is a positive tolerance for the diameter of the pins.
The protection can be formed to elastic first protection shield to the second protection apron, avoids the grit stream to cause the damage to first protection shield to second micropore array diameter is greater than the pin diameter, ensures that the pending weld end that ceramic array encapsulation device pin spills relative first protection shield spills on the second protection apron.
Preferably, the abrasive particle flow inlet and outlet channels on the drainage cover plate are single channels or multiple channels.
The drainage cover plate is used for accommodating abrasive flow entering the abrasive flow inlet and outlet channel, so that the to-be-processed welding end of the pin of the ceramic array packaging device, which is leaked relative to the first protective cover plate, is subjected to deoxidation.
The invention also provides a method for deoxidizing the pins of the ceramic array packaging device, which comprises the following steps:
s1, placing a ceramic array packaging device on the deoxidation chemical equipment, wherein after the ceramic array packaging device is placed on a limiting base and positioned, pins of the ceramic array packaging device penetrate through a first protective cover plate and leak out of a welding end to be processed relative to the first protective cover plate;
s2, enabling the abrasive particle flow to enter an abrasive particle flow inlet and outlet channel on the drainage cover plate, and carrying out deoxidation on the welding end to be treated by adopting the abrasive particle flow.
Preferably, the ceramic array package device pin is at least one of a solder ball or a solder column, and the material of the pin is preferably at least one of 90Pb10Sn, 80Pb20Sn or 63Sn37 Pb.
Preferably, the abrasive particle flow is circulated in a unidirectional circulation or a bidirectional circulation manner;
preferably, the abrasive particle diameter of the abrasive particle flow is 0.5-100 μm, and the abrasive extrusion force is 0.1-10MPa.
Preferably, after the welding end to be processed is deoxidized by using the abrasive particle flow, the method further includes: removing residual abrasive and excess by using an anti-static brush or non-woven fabric, and cleaning the pins by using alcohol or isopropanol;
preferably, the deoxidation process employs electrostatic protection.
Compared with the prior art, the invention has the following beneficial effects:
(1) By designing the deoxidation tool, a non-processing area (other areas except for the welding end to be processed) of the ceramic array packaging device is protected, the whole deoxidation process is only performed on the welding end to be processed of the pin, and any force, heat, static damage and the like to the ceramic array packaging device cannot be caused.
(2) The adoption of the abrasive flow process realizes the deoxidation treatment of the oxidation pins of the ceramic array packaging device, has good processing uniformity, does not influence the coplanarity of the pins of the device, improves the weldability of the pins of the device, and realizes that the welding yield of the ceramic array packaging device is improved to more than 99.8 percent.
(3) Compared with the traditional mechanical grinding mode, the method not only can deoxidize the end face of the leaked pin (solder ball/solder column), but also can deoxidize the ring surface or curved surface of the leaked pin (solder ball/solder column), has good processing uniformity and repeatability, and improves the efficiency by more than 50%; compared with methods such as ball replanting/column replanting, the processing uniformity and repeatability are good, multiple thermal damages to devices are avoided, and the efficiency is improved by more than 2 times; in a word, compared with the traditional mechanical mode or the methods of re-planting balls/columns and the like, the method does not cause multiple thermal damage to devices, and has good processing uniformity and repeatability; one or more devices can be processed at one time, the processing time is short, and the efficiency is high.
(4) The method is not only used for pin deoxidation, but also suitable for pin (solder ball/solder column) leveling of the ceramic array packaging device, and improves coplanarity; compared with the traditional mechanical grinding, the coplanarity is less than or equal to 150 mu m, and the coplanarity is less than or equal to 50 mu m or even lower by adopting the method.
Drawings
Fig. 1 is a schematic structural diagram of a ceramic array package device deoxidation tool in embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of a CCGA device according to embodiment 1 of the present invention.
Detailed Description
Hereinafter, the technical solution of the present invention will be described in detail by specific examples, but these examples should be explicitly proposed for illustration, but should not be construed as limiting the scope of the present invention.
Example 1
Referring to fig. 1, the embodiment provides a pin deoxidation tool for a ceramic array package device, which includes a limiting base 1, an adjusting gasket 2, a first protective cover plate 3, a second protective cover plate 4, a drainage cover plate 5, a positioning bolt 6 and a fastening screw 7;
the limiting base 1 is provided with a clamping groove 11 for limiting the ceramic array packaging device 8, the limiting base 1 is further provided with arc-shaped grooves 12 at two ends of the clamping groove 11, the ceramic array packaging device 8 can be conveniently taken out, threaded holes 13 are uniformly designed at the bottom and two sides of the clamping groove 11 and used for installing positioning bolts 6, and the positioning bolts 6 are used for positioning the ceramic array packaging device 8 in the X direction, the Y direction and the Z direction;
the adjusting gasket 2 is positioned above the limiting base 1, a middle through hole allowing a pin of the ceramic array packaging device 8 to pass through is formed in the adjusting gasket 2, and the thickness of the adjusting gasket is designed according to the length of the pin of different ceramic array packaging devices 8 so as to adjust the leakage height of the pin array of the ceramic array packaging device 8 relative to the adjusting gasket 2;
the first protective cover 3 is made of elastic materials and is positioned above the adjusting gasket 2, the first protective cover 3 is provided with a first array of micropores 31 which allow and match pins of the ceramic array packaging device 8 to pass through, the diameter of the first array of micropores 31 is smaller than that of the pins, the difference between the diameters of the first array of micropores 31 and the second array of micropores is the negative tolerance of the diameters of the pins, the first protective cover 3 can ensure that the pins of the ceramic array packaging device only leak out of the welding ends to be processed relative to the first protective cover 3, and abrasive flow is prevented from flowing into a non-processing area of the ceramic array packaging device 8;
the second protective cover plate 4 is positioned above the first protective cover plate 3, the second protective cover plate 4 is also provided with a second array micropore 41 allowing the pin array of the ceramic array packaging device 8 to pass through, the diameter of the second array micropore 41 is larger than that of the pin, the difference between the diameters of the second array micropore 41 and the pin is the positive tolerance of the pin diameter, the second protective cover plate 4 can protect the first protective cover plate 3, and the leakage of the welding end to be processed, leaked from the ceramic array packaging device 8 relative to the first protective cover plate 3, is ensured;
the drainage cover plate 5 is positioned above the second protection cover plate 4, a processing groove corresponding to the second array of micropores 41 is formed in the drainage cover plate 5, an abrasive material flow inlet and outlet channel is formed between the processing groove and the second protection cover plate 4, an opening communicated with the abrasive material flow inlet and outlet channel is formed in the side surface of the drainage cover plate 5, and the abrasive material flow inlet and outlet channel is a single channel;
this implementation in the deoxidation frock, all be equipped with corresponding screw thread mouth on limit base 1, adjusting shim 2, first protective cover plate 3, second protective cover plate 4 and the drainage apron 5 to fastening screw 7 installation to fix limit base 1, adjusting shim 2, first protective cover plate 3, second protective cover plate 4 and drainage apron 5.
The embodiment also provides a method for deoxidizing pins of a ceramic array packaging device, which comprises the following steps:
(1) Referring to fig. 2, the ceramic array package device 8 is specifically a ceramic column grid array package device CCGA1152, which has an array of 81 solder columns (i.e. pins) 34 × 34 thereon, the size of the solder columns is 0.51mm × 2.21mm, and the material is 80Pb20Sn;
(2) Mounting a CCGA1152 device 8 on the deoxidation chemical equipment, positioning the CCGA1152 device 8 on the limiting base 1, and then leaking the welding ends to be processed of the array of welding columns 81 relative to the second protective cover plate 4 after the array of welding columns 81 passes through the adjusting gasket 2, the first protective cover plate 3 and the second protective cover plate 4;
(3) Introducing abrasive flow into the abrasive flow inlet and outlet channel from the opening on the drainage cover plate 5, and carrying out deoxidation treatment on the to-be-treated welding end of the CCGA1152 device 8 by adopting the abrasive flow, wherein the grain diameter of the abrasive is 5-10 mu m, the extrusion force of the abrasive is 6-7MPa, and the abrasive circulates in a single cycle;
(4) And removing residual abrasive and excess by using an anti-static brush, and cleaning the array of the welding columns 81 of the CCGA1152 device 8 by using isopropanol to finish the deoxidation of the pins of the ceramic array packaging device.
Example 2
The embodiment provides a ceramic array packaging device pin deoxidation tool, except that 34 processing grooves corresponding to each row of micropores in a second array micropore 41 are formed on a drainage cover plate 5 of the deoxidation tool, 34 abrasive material flow inlet and outlet channels are formed between the processing grooves and a second protection cover plate 4, each abrasive material flow inlet and outlet channel corresponds to one row of pins, and other structural arrangements are the same as those of the deoxidation tool described in embodiment 1.
The embodiment also provides a method for removing oxidation of the pins of the ceramic array packaging device, which is the same as the embodiment 1 except that abrasive flow is introduced into the 34 abrasive flow inlet and outlet channels, and the extrusion force of the abrasive is 5-6 MPa.
Example 3
The embodiment provides a pin deoxidation tool for a ceramic array packaging device, and the structural design of the pin deoxidation tool is completely the same as that of the pin deoxidation tool in embodiment 1.
The embodiment also provides a method for deoxidizing a pin of a ceramic array packaging device, which comprises the following steps:
(1) The ceramic array package device 8 is specifically a ceramic ball grid array package device CBGA400, on which a 20 × 20 array of solder balls (i.e., pins) is provided, the size of the solder balls is 0.76mm, and the material is 90Pb10Sn;
(2) Installing a CBGA400 device on the deoxidation chemical equipment, placing the CBGA400 device on a limiting base 1, positioning, and then enabling a solder ball array to pass through a regulating gasket 2, a first protective cover plate 3 and a second protective cover plate 4, and then only leaking a welding end (about a half solder ball) to be processed of the solder ball array relative to the second protective cover plate 4;
(3) Introducing abrasive flow into the abrasive flow inlet and outlet channel from the opening on the drainage cover plate 5, and performing deoxidation treatment on the welding end to be treated of the CBGA400 device by using the abrasive flow, wherein the grain diameter of the abrasive is 5-8 mu m, the extrusion force of the abrasive is 4-5MPa, and the abrasive flows in a single circulation manner;
(4) And removing residual abrasive and redundant substances by using an anti-static brush, and cleaning a solder ball array of the CBGA400 device by using isopropanol to finish the deoxidation of the pins of the ceramic array packaging device.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. A ceramic array packaging device pin deoxidation tool is characterized by comprising a limiting base (1), a first protective cover plate (3) and a drainage cover plate (5);
a clamping groove for limiting the ceramic array packaging device is formed in the limiting base (1);
the first protective cover plate (3) is positioned above the limiting base (1) and is provided with a first array of micropores which allow and match pins of the ceramic array packaging device to pass through;
drainage apron (5) are located first protective cover (3) top, offer the micropore's of corresponding first array processing groove on drainage apron (5), the processing groove forms the abrasive flow and advances the discharge passage in first protective cover (3) top.
2. The ceramic array package device pin deoxidation tool set forth in claim 1 wherein the bottom and/or side of the slot on the limiting base (1) is provided with a threaded hole for mounting a positioning bolt.
3. The ceramic array package device pin deoxidation tool set forth in claim 1 or 2 further comprising a conditioning pad (2);
the adjusting gasket (2) is positioned between the limiting base (1) and the first protective cover plate (3), and a middle through hole allowing the pins of the ceramic array packaging device to pass through is formed in the adjusting gasket.
4. The tooling for removing oxidation on the pins of the ceramic array packaged device according to any one of claims 1-3, wherein the first protective cover plate (3) is made of elastic material, and the diameter of the first array micropores is smaller than that of the pins;
preferably, the difference between the diameter of the micro holes of the first array and the diameter of the pins is a negative tolerance of the diameter of the pins.
5. The ceramic array package device pin deoxidation tool set forth in claim 4 further comprises a second protective cover plate (4);
the second protection cover plate (4) is positioned between the first protection cover plate (3) and the drainage cover plate (5), a second array of micropores allowing pins of the ceramic array packaging device to pass through are formed in the second protection cover plate, the diameter of the second micropore array is larger than that of the pins, and the abrasive particle flow inlet and outlet channel is positioned above the second protection cover plate;
preferably, the difference between the diameter of the second array of wells and the diameter of the pins is a positive tolerance for the diameter of the pins.
6. The ceramic array package device pin de-oxidation tooling of any one of claims 1-5, wherein the abrasive particle flow in and out channel is single-channel or multi-channel.
7. A method for deoxidizing pins of a ceramic array packaging device is characterized by comprising the following steps:
s1, placing a ceramic array packaging device on the deoxidation chemical equipment according to any one of claims 1 to 6, wherein after the ceramic array packaging device is placed on a limiting base (1) and positioned, pins of the ceramic array packaging device penetrate through a first protective cover plate (3) and leak out of a welding end to be processed relative to the first protective cover plate (3);
s2, introducing the abrasive flow into an abrasive flow inlet-outlet channel on the drainage cover plate (5), and deoxidizing the welding end to be treated by adopting the abrasive flow.
8. The method for removing oxidation from a lead of a ceramic array package device according to claim 7, wherein the lead of the ceramic array package device is at least one of a solder ball or a solder column, and the material of the lead is preferably at least one of 90Pb10Sn, 80Pb20Sn or 63Sn37 Pb.
9. The method for deoxidation of pins of ceramic array package devices according to claim 7 or 8, wherein the abrasive flow is circulated in a unidirectional circulation or a bidirectional circulation;
preferably, the abrasive particle diameter of the abrasive particle flow is 0.5-100 μm, and the abrasive extrusion force is 0.1-10MPa.
10. The method for deoxidizing pin of ceramic array package device as recited in any one of claims 7 to 9, further comprising, after deoxidizing said solder terminal to be processed with a stream of abrasive particles: removing residual abrasive and excess by using an anti-static brush or non-woven fabric, and cleaning the pins by using alcohol or isopropanol;
preferably, the deoxidation process employs electrostatic protection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211190722.9A CN115673970A (en) | 2022-09-28 | 2022-09-28 | Ceramic array packaging device pin deoxidation tool and deoxidation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211190722.9A CN115673970A (en) | 2022-09-28 | 2022-09-28 | Ceramic array packaging device pin deoxidation tool and deoxidation method |
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| Publication Number | Publication Date |
|---|---|
| CN115673970A true CN115673970A (en) | 2023-02-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211190722.9A Pending CN115673970A (en) | 2022-09-28 | 2022-09-28 | Ceramic array packaging device pin deoxidation tool and deoxidation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115673970A (en) |
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- 2022-09-28 CN CN202211190722.9A patent/CN115673970A/en active Pending
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