CN115673155A - Semiconductor diode pin bending forming device - Google Patents
Semiconductor diode pin bending forming device Download PDFInfo
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- CN115673155A CN115673155A CN202211354001.7A CN202211354001A CN115673155A CN 115673155 A CN115673155 A CN 115673155A CN 202211354001 A CN202211354001 A CN 202211354001A CN 115673155 A CN115673155 A CN 115673155A
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Abstract
The application relates to a semiconductor diode pin bending and forming device which comprises a conveying mechanism, two baffle plates and two bending mechanisms; the conveying mechanism is used for conveying the diodes, the two abutting plates are used for abutting against the two pins of the diodes one by one, the two bending mechanisms are positioned on two sides of the conveying mechanism in the second direction, and the bending mechanisms are positioned between the conveying mechanism and the abutting plates; the bending mechanism comprises a support, a cutter, a bending plate and a driving part; when the bending mechanism is located at the cutting position, the upper end of the cutter is located above the movable end and below the accommodating groove, the bending plate rotates to drive the upper end of the cutter to be close to the baffle, and the cutter and the baffle jointly cut the end part of the diode; when the bending mechanism is located at the bending position, the movable end is located above the connecting end and above the accommodating groove, and the bending plate rotates to be close to the accommodating groove, so that the pins of the diode are bent. This application has the machining efficiency who improves the diode, shortens process time's effect.
Description
Technical Field
The application relates to the technical field of diode processing, in particular to a semiconductor diode pin bending and forming device.
Background
The diode is an electronic device made of semiconductor material, and has one-way conductivity, i.e. when a forward voltage is applied to the anode and cathode of the diode, the diode is conducted, when a reverse voltage is applied to the anode and cathode, the diode is cut off, and the conduction and cut-off of the diode are equivalent to the on-off of a switch, the pins of the diode, i.e. two copper leads of the diode, need to be bent into a right angle to reduce the assembly area of the diode, thereby reducing the appearance of the product and realizing the miniaturization and lightness of the product.
The conventional pin bending device firstly transmits a diode to a first station, cuts off two ends of the pin by using a cutting mechanism, transmits the diode to a second station, and bends two ends of the pin by using a bending mechanism, so that the pin bending forming efficiency is low, and much time is consumed when pins of a large batch of diodes are bent.
Disclosure of Invention
In order to improve pin shaping efficiency of bending, shorten process time, the application provides a semiconductor diode pin forming device that bends.
The application provides a semiconductor diode pin forming device that bends adopts following technical scheme:
a semiconductor diode pin bending and forming device comprises:
the diode mounting device comprises a conveying mechanism, a diode mounting mechanism and a diode mounting mechanism, wherein the conveying mechanism is provided with a plurality of limiting pieces which are spaced in a first direction and are provided with accommodating grooves for mounting diodes;
the two baffle plates are positioned on two sides of the conveying mechanism in a second direction and spaced from the conveying mechanism, the second direction is perpendicular to the first direction, and positioning notches are formed in the positions, opposite to the diode pins, of the baffle plates; and the number of the first and second groups,
the two bending mechanisms are positioned on two sides of the conveying mechanism in the second direction, and the bending mechanisms are positioned between the conveying mechanism and the baffle; the bending mechanism comprises a support, a cutter, a bending plate and a driving part; the lower end of the cutter is rotatably mounted on the support, the upper end of the cutter can rotate around the lower end of the cutter, the bending plate is provided with a connecting end and a movable end, the connecting end is rotatably mounted on the support and is positioned above the lower end of the cutter, the middle part of the bending plate is connected with the cutter in a sliding manner, and the middle part of the bending plate can slide along the extension direction of the cutter; the driving part drives the connecting end to rotate so as to enable the bending mechanism to have a cutting position and a bending position;
when the bending mechanism is located at the cutting position, the upper end of the cutter is located above the movable end and on one side of the accommodating groove, the bending plate rotates to drive the upper end of the cutter to be close to the baffle plate, and the cutter and the baffle plate jointly cut the end part of the diode; when the bending mechanism is located at the bending position, the movable end is located above the connecting end and located on one side of the containing groove, and the bending plate rotates to be close to the containing groove, so that the diode pins are bent.
By adopting the technical scheme, the diode is positioned in the containing groove on the limiting part, the conveying mechanism conveys the diode to the first direction, the pins at the two ends of the diode conveyed to the two ends are positioned in the positioning notches in the baffle plates, the conveying mechanism stops conveying, and the upper end of the cutter is positioned above the movable end and below the containing groove, so that the diode can conveniently pass through the cutter and the bending plate; the link of the board of bending of drive division drive rotates, drives the cutter upper end and is close to the baffle, and the cutter cuts the diode tip with the baffle jointly, and at the in-process of cutting, there is not the clearance between cutter and the baffle, cuts the diode similar to the scissors. The two bending mechanisms on the two sides of the conveying mechanism operate simultaneously, and redundant pins at the two ends of the diode can be cut off simultaneously.
The drive division continues the drive and bends the link rotation of board, and the expansion end of the board of bending rotates to the holding tank top, makes the board of bending be located the position of bending, and the board of bending continues to rotate, and the diode can be bent the operation of bending to the pin of diode tip in the board rotation process of bending under the limiting displacement of holding tank. And after the bending operation is finished, the bending plate and the cutter move to the cutting position, the conveying mechanism starts conveying at the moment, the next diode is conveyed to be abutted against the abutting baffle, and the operation is repeated.
The link of the board of bending of drive division drive rotates a week, can realize the cutting and bending to the diode, and simultaneously at this in-process, the position of diode is unchangeable, has avoided the processing position that needs change the diode many times, can improve the machining efficiency of diode, shortens process time.
Optionally, a first rotating shaft is fixed in the middle of the bending plate, a sliding block is rotatably mounted on the first rotating shaft, the cutter is provided with a sliding groove in sliding connection with the sliding block, and the extending direction of the sliding groove is the same as that of the cutter.
By adopting the technical scheme, the cutter can be driven to rotate back and forth by rotating the bending plate for one circle, the driving part drives the bending plate to rotate at a constant speed, the first rotating shaft is positioned at the upper end of the cutter when the bending plate and the cutter are positioned at the bending position, and the speed of moving the cutter from the bending position to the cutting position is lower, so that the diode can be bent at a low speed, and the damage to the pin of the diode is avoided; when the bending plate and the cutter are located at the cutting position, the first rotating shaft is located at the lower end of the cutter, so that the speed of the cutter moving from the cutting position to the bending position is high, the speed is high during cutting, and the cutting surface of the diode pin is smooth.
Optionally, when the bending mechanism is located at the bending position, a distance between the bending plate and the limiting member is equal to a diameter of the diode pin.
Through adopting above-mentioned technical scheme, the diode pin back of bending for the diode pin is located the holding tank and bends between the board, can make the diode pin bend the angle and be 90.
Optionally, the accommodating groove includes a first limiting groove and two second limiting grooves, the two second limiting grooves are located on two sides of the first limiting groove in the second direction, the first limiting groove is adapted to the diode body, and the second limiting grooves are adapted to the diode pin.
By adopting the technical scheme, the second limiting groove can limit the pins of the diode, when the pins of the diode are bent, the pins in the second limiting groove can be prevented from being bent, and only the pins outside the second limiting groove are bent, so that the bending shape of the pins of the diode can be controlled, and the bending quality of the diode is improved.
Optionally, the bottom wall of the first limiting groove is a semi-cylindrical shape matched with the diode body.
By adopting the technical scheme, the stability of the diode in the transmission process can be improved, and the probability of damaging the diode body is reduced.
Optionally, the two opposite side walls of the first limiting groove in the first direction are inclined outwards, so that the notch of the first limiting groove is gradually enlarged.
By adopting the technical scheme, the diode body is conveniently placed into the first limiting groove, and the diode body is prevented from being extruded and easily damaged.
Optionally, the second limiting groove is formed in two inner side walls opposite to each other in the first direction, the inner side wall located on the front side is inclined forward in the advancing direction of the second limiting groove, and the inner side wall located on the rear side is perpendicular to the plane where the first direction and the second direction are located.
By adopting the technical scheme, the diode pins are conveniently placed into the second limiting grooves, and the diode pins are prevented from being extruded and easily damaged. When the diode pin is bent, the inner side wall of the second limiting groove positioned on the rear side can resist the diode pin, the possibility that the diode slides out of the second limiting groove is reduced, and the diode pin can be bent smoothly.
Optionally, the conveying mechanism includes two chain wheels and a chain wound around the chain wheels, and the limiting member is fixed to a link plate of the chain.
By adopting the technical scheme, after the diode is cut and bent, when the diode is conveyed to the end part by the conveying mechanism, the diode can directly fall into the collecting device from the conveying mechanism, so that the operation of taking the diode off the conveying mechanism can be avoided, and the diode collecting efficiency is improved.
Optionally, the conveying mechanism, the baffle and the bracket are all mounted on the base.
By adopting the technical scheme, the integration level of the whole device can be improved.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the link of the board of bending of drive division drive rotates a week, can realize the cutting and bending to the diode, and simultaneously at this in-process, the position of diode is unchangeable, has avoided the processing position that needs change the diode many times, can improve the machining efficiency of diode, shortens process time.
2. The cutting knife is driven to rotate back and forth by the rotation of the bending plate, the driving part drives the bending plate to rotate at a constant speed, the first rotating shaft is positioned at the upper end of the cutting knife when the bending plate and the cutting knife are positioned at the bending position, the speed of the cutting knife moving from the bending position to the cutting position is low, the diode can be bent at a low speed, and the damage to the pin of the diode is avoided; when the bending plate and the cutter are located at the cutting position, the first rotating shaft is located at the lower end of the cutter, so that the speed of the cutter moving from the cutting position to the bending position is high, the speed is high during cutting, and the cutting surface of the diode pin is smooth.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor diode pin bending and forming device in embodiment 1 of the present application;
FIG. 2 is an enlarged schematic view at A in FIG. 1;
FIG. 3 is a schematic structural view of a semiconductor diode pin bending and forming device (with the baffle hidden) in FIG. 1;
FIG. 4 is an enlarged schematic view at B in FIG. 3;
FIG. 5 is a schematic view of a part of the semiconductor diode pin bending and forming device (the bending mechanism is located at the cutting position) in FIG. 1;
FIG. 6 is a schematic view of a part of the structure of the semiconductor diode pin bending and forming device (the position of the bending mechanism after cutting the diode pin) in FIG. 1;
fig. 7 is a schematic view of a part of the structure of the semiconductor diode pin bending and forming device (the bending mechanism is located at the bending position) in fig. 3;
fig. 8 is a schematic cross-sectional view of a limiting element and a diode in embodiment 2 of the present application, the cross-sectional view being perpendicular to a second direction.
Description of reference numerals: 1. a transport mechanism; 11. a sprocket; 12. a chain; 2. a baffle plate; 2a, positioning a notch; 3. a bending mechanism; 31. a support; 32. a cutter; 32a, a chute; 33. bending the plate; 33a, a connecting end; 33b, a movable end; 34. a second rotating shaft; 35. a slider; 4. a base; 5. a limiting member; 51. a first limit groove; 52. a second limit groove; 100. a diode; 101. a diode body; 102. and a diode pin.
Detailed Description
The present application is described in further detail below with reference to figures 1-8.
The embodiment of the application discloses a semiconductor diode pin bending and forming device.
Referring to fig. 1, the semiconductor diode pin bending and forming device includes a conveying mechanism 1, two baffle plates 2, two bending mechanisms 3 and a base 4.
The conveying mechanism 1, the baffle plate 2 and the bending mechanism 3 are all arranged on the base 4. The transfer mechanism 1 is provided with a plurality of stoppers 5 spaced in a first direction, which coincides with the transfer direction of the transfer mechanism 1. The conveying mechanism 1 may be a chain conveying or a belt conveying, in this embodiment, the conveying mechanism 1 includes two sprockets 11 and a chain 12 wound around the sprockets 11, and the limiting member 5 is fixed on a link plate of the chain 12.
Referring to fig. 2, the limiting member 5 has a receiving groove for mounting the diode 100, the diode 100 is disposed in the receiving groove, and the diode 100 extends along the second direction and is perpendicular to the first direction.
Because the pin diameter ratio of the diode 100 is smaller, in order to limit the diode 100, the accommodating groove includes a first limiting groove 51 and two second limiting grooves 52, the two second limiting grooves 52 are located at two sides of the first limiting groove 51 in the second direction, in an optional embodiment, the first limiting groove 51 may be a square groove, the first limiting groove 51 is adapted to the diode body 101, the second limiting groove 52 is adapted to the diode pin 102, and the side wall of the first limiting groove 51 opposite to the pin is provided with a yielding notch for the diode pin 102 to pass through.
The second limiting groove 52 can limit the diode pin 102, and when the diode pin 102 is bent, the pin in the second limiting groove 52 can be prevented from being bent, and only the pin outside the second limiting groove 52 is bent, so that the bending shape of the diode pin 102 can be controlled, and the bending quality of the diode 100 can be improved.
The two side walls of the second limiting groove 52 may be perpendicular to the surfaces of the first direction and the second direction, in an optional embodiment, the second limiting groove 52 is disposed in two opposite inner side walls in the first direction, the inner side wall located on the front side is inclined forward in the advancing direction of the second limiting groove 52, and the inner side wall located on the rear side is perpendicular to the surfaces of the first direction and the second direction, so that the notch of the second limiting groove 52 is gradually enlarged, the diode pin 102 is conveniently placed into the second limiting groove 52, and the diode pin 102 is prevented from being extruded and easily damaged. When the diode pin 102 is bent, the inner side wall of the second limiting groove 52 positioned at the rear side can resist the diode pin 102, so that the possibility that the diode 100 slides out of the second limiting groove 52 is reduced, and the diode pin 102 can be bent smoothly.
After the diode 100 is cut and bent, when the conveying mechanism 1 conveys the diode 100 to the end part, the diode 100 can directly fall from the conveying mechanism 1 to the collecting device, so that the operation of taking the diode 100 off the conveying mechanism 1 can be omitted, and the collecting efficiency of the diode 100 is improved.
The two baffle plates 2 are positioned on two sides of the conveying mechanism 1 in the second direction and are spaced from the conveying mechanism 1. The two bending mechanisms 3 are located on two sides of the conveying mechanism 1 in the second direction, the bending mechanisms 3 are located between the conveying mechanism 1 and the baffle plate 2, and a positioning notch 2a is formed in the position, opposite to the diode pin 102, of the baffle plate 2.
Specifically, referring to fig. 3 and 4, the bending mechanism 3 includes a bracket 31, a cutter 32, a bending plate 33, and a driving portion. The support 31 can be independently arranged, in the embodiment, the support 31 is fixed on the base 4, the lower end of the cutter 32 is rotatably arranged on the support 31, and the upper end of the cutter 32 can rotate around the lower end of the cutter 32. The bending plate 33 is provided with a connecting end 33a and a movable end 33b, the connecting end 33a is rotatably mounted on the support 31 and is located above the lower end of the cutter 32, the middle part of the bending plate 33 is slidably connected with the cutter 32, and the middle part of the bending plate 33 can slide along the extension direction of the cutter 32. The movable end 33b of the bending plate 33 rotates around the connecting end 33a to drive the upper end of the cutter 32 to rotate back and forth around the lower end.
In an optional embodiment, a first rotating shaft is fixed in the middle of the bending plate 33, a sliding block 35 is rotatably mounted on the first rotating shaft, the cutting knife 32 is provided with a sliding groove 32a slidably connected with the sliding block 35, and the extending direction of the sliding groove 32a is the same as the extending direction of the cutting knife 32. In other embodiments, the side of the cutting knife 32 facing the bending plate 33 may be provided with a slide rail on which the sliding block 35 slides.
It should be noted that the size of the chute 32a formed in the cutter 32 may be set according to actual conditions, the strength of the cutter 32 cannot be affected, and the size of the chute 32a should not be limited to that shown in the drawings. In order to ensure the strength of the cutting knife 32, a slide rail slidably connected to the slider 35 is preferably disposed on the cutting knife 32.
The driving section drives the connecting end 33a to rotate so that the bending mechanism 3 has a cutting position and a bending position. The connecting end 33a and the bracket 31 can be connected through a second rotating shaft 34, the driving part can be a rotating motor, and the rotating shaft of the rotating motor and the second rotating shaft 34 can be connected through a transmission belt or a gear transmission.
Referring to fig. 5, when bending mechanism 3 is located the cutting position, cutter 32 upper end is located expansion end 33b top, and is located holding tank one side, bends board 33 and rotates and drive cutter 32 upper end and be close to baffle 2, and at this moment, the cutting edge orientation of cutter 32 is to baffle 2, and on the second direction, there is not the clearance between cutter 32 and the baffle 2, and the cutter 32 upper end is close to the in-process of baffle 2, and cutter 32 upper end and baffle 2 are similar to the scissors, cuts diode 100 tip jointly. After the diode pin 102 is cut by the bending mechanism 3, the positions of the cutter 32 and the bending plate 33 are shown in fig. 6.
Referring to fig. 7, when the bending mechanism 3 is located at the bending position, the movable end 33b is located above the connecting end 33a and on one side of the accommodating groove, in the second direction, the distance between the bending plate 33 and the limiting member 5 is greater than or equal to the diameter of the pin, and the bending plate 33 rotates to approach the accommodating groove, so that the diode pin 102 can be bent. In an optional embodiment, when the bending mechanism 3 is located at the bending position, the distance between the bending plate 33 and the limiting member 5 is equal to the diameter of the diode pin 102, and after the diode pin 102 is bent, the diode pin 102 is located between the accommodating groove and the bending plate 33, so that the bending angle of the diode pin 102 is 90 °.
The implementation principle of the semiconductor diode pin bending and forming device in the embodiment of the application is as follows:
the diode 100 is placed in the accommodating groove of the limiting part 5, the conveying mechanism 1 conveys the diode 100 to the first direction, the pins at two ends of the diode 100 conveyed to the two ends are positioned in the positioning notches 2a in the baffle 2, the conveying mechanism 1 stops conveying, and at the moment, the upper end of the cutter 32 is positioned above the movable end 33b and below the accommodating groove, so that the diode 100 can pass through the upper parts of the cutter 32 and the bending plate 33 conveniently. The driving part drives the connecting end 33a of the bending plate 33 to rotate, the upper end of the cutter 32 is driven to be close to the baffle plate 2, and the cutter 32 and the baffle plate 2 jointly cut the end part of the diode 100. The two bending mechanisms 3 on the two sides of the conveying mechanism 1 operate simultaneously, and redundant pins at the two ends of the diode 100 can be cut off simultaneously.
The driving part continues to drive the connecting end 33a of the bending plate 33 to rotate, the movable end 33b of the bending plate 33 rotates to the position above the accommodating groove, the bending plate 33 is located at the bending position, the bending plate 33 continues to rotate, and the diode 100 can be bent by the pin at the end of the diode 100 in the rotation process of the bending plate 33 under the limiting effect of the accommodating groove. After the bending operation is completed, the bending plate 33 and the cutter 32 move to the cutting position, at this time, the conveying mechanism 1 starts conveying, the next diode 100 is conveyed to be abutted against the abutting plate 2, and the above operation is repeated.
The connecting end 33a of the driving part driving bending plate 33 rotates for a circle, so that the diode 100 can be cut and bent, meanwhile, in the process, the position of the diode 100 is unchanged, the processing position of the diode 100 which needs to be replaced for many times is avoided, the processing efficiency of the diode 100 can be improved, and the processing time is shortened.
The cutter 32 can be driven to rotate back and forth by the rotation of the bending plate 33, the driving portion drives the bending plate 33 to rotate at a constant speed, when the bending plate 33 and the cutter 32 are located at the bending position, the first rotating shaft is located at the upper end of the cutter 32, the speed of the cutter 32 moving from the bending position to the cutting position is low, the diode 100 can be bent at a low speed, and damage to the diode pins 102 is avoided. When the bending plate 33 and the cutter 32 are located at the cutting position, the first rotating shaft is located at the lower end of the cutter 32, so that the speed of the cutter 32 moving from the cutting position to the bending position is high, the speed is high during cutting, and the cutting surface of the diode pin 102 is smoother.
Example 2
Referring to fig. 8, embodiment 2 is different from embodiment 1 in that the bottom wall of the first limiting groove 51 is a semi-cylindrical shape matching with the diode body 101, which can improve the stability of the diode 100 during the transportation process and reduce the probability of damaging the diode body 101. The two opposite side walls of the first limiting groove 51 in the first direction are inclined outwards, so that the notch of the first limiting groove 51 is gradually enlarged, the diode body 101 is conveniently placed into the first limiting groove 51, and the diode body 101 is prevented from being extruded and easily damaged.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (9)
1. The utility model provides a semiconductor diode pin forming device that bends which characterized in that includes:
the diode mounting device comprises a conveying mechanism (1), wherein a plurality of limiting pieces (5) spaced in a first direction are arranged on the conveying mechanism (1), and each limiting piece (5) is provided with an accommodating groove for mounting a diode (100);
the two baffle plates (2) are positioned on two sides of the conveying mechanism (1) in a second direction and are spaced from the conveying mechanism (1), the second direction is perpendicular to the first direction, and positioning notches (2 a) are formed in the positions, opposite to the diode pins (102), of the baffle plates (2); and the number of the first and second groups,
the two bending mechanisms (3) are positioned on two sides of the conveying mechanism (1) in the second direction, and the bending mechanisms (3) are positioned between the conveying mechanism (1) and the baffle (2); the bending mechanism (3) comprises a support (31), a cutter (32), a bending plate (33) and a driving part; the lower end of the cutter (32) is rotatably mounted on the support (31), the upper end of the cutter (32) can rotate around the lower end of the cutter (32), the bending plate (33) is provided with a connecting end (33 a) and a movable end (33 b), the connecting end (33 a) is rotatably mounted on the support (31) and is positioned above the lower end of the cutter (32), the middle part of the bending plate (33) is slidably connected with the cutter (32), and the middle part of the bending plate (33) can slide along the extension direction of the cutter (32); the driving part drives the connecting end (33 a) to rotate so as to enable the bending mechanism (3) to have a cutting position and a bending position;
when the bending mechanism (3) is located at the cutting position, the upper end of the cutter (32) is located above the movable end (33 b) and located on one side of the accommodating groove, the bending plate (33) rotates to drive the upper end of the cutter (32) to be close to the baffle (2), and the cutter (32) and the baffle (2) jointly cut the end part of the diode (100); when the bending mechanism (3) is located at the bending position, the movable end (33 b) is located above the connecting end (33 a) and located on one side of the accommodating groove, and the bending plate (33) rotates to be close to the accommodating groove, so that the diode pin (102) is bent.
2. The semiconductor diode pin bending and forming device according to claim 1, wherein a first rotating shaft is fixed in the middle of the bending plate (33), a sliding block (35) is rotatably mounted on the first rotating shaft, the cutting knife (32) is provided with a sliding groove (32 a) in sliding connection with the sliding block (35), and the extending direction of the sliding groove (32 a) is the same as the extending direction of the cutting knife (32).
3. The semiconductor diode pin bending and forming device according to claim 1, wherein when the bending mechanism (3) is located at the bending position, the distance between the bending plate (33) and the limiting member (5) is equal to the diameter of the diode pin (102).
4. The semiconductor diode pin bending and forming device according to claim 1, wherein the accommodating groove comprises a first limiting groove (51) and two second limiting grooves (52), the two second limiting grooves (52) are located on two sides of the first limiting groove (51) in the second direction, the first limiting groove (51) is adapted to the diode body (101), and the second limiting groove (52) is adapted to the diode pin (102).
5. The semiconductor diode pin bending and forming device according to claim 4, wherein the bottom wall of the first limiting groove (51) is a semi-cylindrical shape adapted to the diode body (101).
6. The semiconductor diode pin bending and forming device according to claim 4, wherein two opposite side walls of the first limiting groove (51) in the first direction are inclined outwards, so that the notch of the first limiting groove (51) is gradually enlarged.
7. The semiconductor diode pin bending and forming device according to claim 4, wherein the second limiting groove (52) is formed in two inner side walls opposite to each other in the first direction, the inner side wall located on the front side is inclined forward in the advancing direction of the second limiting groove (52), and the inner side wall located on the rear side is perpendicular to the plane where the first direction and the second direction are located.
8. The semiconductor diode pin bending and forming device according to claim 1, wherein the conveying mechanism (1) comprises two chain wheels (11) and a chain (12) wound around the chain wheels (11), and the limiting member (5) is fixed on a link plate of the chain (12).
9. The semiconductor diode pin bending and forming device according to claim 1, further comprising a base (4), wherein the conveying mechanism (1), the baffle plate (2) and the bracket (31) are mounted on the base (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211354001.7A CN115673155A (en) | 2022-11-01 | 2022-11-01 | Semiconductor diode pin bending forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211354001.7A CN115673155A (en) | 2022-11-01 | 2022-11-01 | Semiconductor diode pin bending forming device |
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| Publication Number | Publication Date |
|---|---|
| CN115673155A true CN115673155A (en) | 2023-02-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211354001.7A Pending CN115673155A (en) | 2022-11-01 | 2022-11-01 | Semiconductor diode pin bending forming device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117102397A (en) * | 2023-10-11 | 2023-11-24 | 天津浩天瑞半导体有限公司 | Automatic cutting system for pins of hybrid anode diode |
-
2022
- 2022-11-01 CN CN202211354001.7A patent/CN115673155A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117102397A (en) * | 2023-10-11 | 2023-11-24 | 天津浩天瑞半导体有限公司 | Automatic cutting system for pins of hybrid anode diode |
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